JP2516330Y2 - Chip circuit component mounting device template - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a template in which an accommodating concave portion for accommodating the chip-shaped circuit component is provided in an apparatus for mounting the chip-shaped circuit component on a circuit board.

[0002]

2. Description of the Related Art Conventionally, when a chip-shaped circuit component is mounted at a predetermined position on a circuit board, it has been carried out as follows using an automatic mounting device. That is, the chip-shaped circuit components that are stored in bulk in a plurality of containers are taken out one by one into a plurality of guide tubes that are piped to a distributor, and then stored in a storage recess formed at a predetermined position of the template. Send each and collect in there.
The storage recess is arranged in accordance with the position where each chip-shaped circuit component is mounted on the circuit board. Then, by the component moving means having the suction unit, the chip-shaped circuit component stored in the storage recess is moved and mounted on the circuit board while maintaining the relative position when stored.
As a result, each of the chip-shaped circuit components is mounted at a predetermined position on the circuit board. On the circuit board, apply adhesive in advance to the position where the chip-shaped circuit component should be mounted,
Soldering is performed in a state where the mounted circuit components are temporarily fixed with this adhesive.

The chip-shaped circuit component is conveyed by the distributor through a flexible guide tube. In this case, in the conventional apparatus, the template 6 is stored as shown in FIG. Suction hole 63 at the bottom of the recess 61
Is opened and the vacuum chamber 41 of the vacuum case 4 applied to the lower surface side of the template 6 is maintained at a negative pressure, so that the guide tube 21 receives the storage recess 61 and the suction hole 6
3 and a vacuum chamber 41 on the lower surface of the template 6 to form a flow of air that escapes to the exhaust duct 5, whereby the chip-shaped circuit component a is forcibly conveyed from the guide tube 21 to the storage recess 61, and the chip-shaped circuit component a is further formed. As shown by the chain double-dashed line from the standing state of the circuit component a as shown by the solid line,
Rolling over is performed.

[0004]

However, the suction holes 63 formed on the bottom surface of the storage recesses 61 allow light to pass from the bottom to the top of the template 6 so that the chip-shaped circuit parts a are stored in the storage recesses 61. Since it also serves as a light transmission hole for inspecting whether or not it is housed, there is some restriction on the position where the hole is formed. That is, the suction hole 63 is placed at a position most suitable for overturning the chip-shaped circuit component a received in the storage recess 61 from the standing state shown by the solid line in FIG. 3 to the sideways state shown by the chain double-dashed line. I can't open it. Therefore, the chip-shaped circuit component a is securely stored in the recessed portion 6
Could not be overturned in 1. If the chip-shaped circuit component remains upright in the recessed portion of the template, the suction head cannot reliably suck it, and even if it can suck it, it cannot be correctly mounted on the circuit board. An object of the present invention is to provide a chip-shaped circuit component distribution device that can store a chip-shaped circuit component in a correct posture in a storage recess of a template.

[0005]

[Means for Solving the Problems] In order to achieve the above-mentioned object, the present invention accommodates a chip-shaped circuit component on a circuit board at a position where the chip-shaped circuit component is to be mounted. , 61 ... are base boards 60
Is a template disposed on the storage recess 6
Suction holes for attracting air toward the bottom of 1, 61 ...
63 is provided, and the upper edge of the storage recesses 61, 61 ...
If the height is such that it contacts the lower surface of the distributor 2.
In addition, the suction holes 63 of the storage recesses 61, 61 ... Are provided.
Provided is a chip-shaped circuit component mounting device template in which a through hole 65 is formed on the wall surface on the side opposite to the scraped surface.

[0006]

In the chip-shaped circuit component mounting device template according to the present invention, the through hole 65 is formed in the wall of the storage recess 61.
Therefore, the chip-shaped circuit component a received in the storage recess 61 is flown to the other in the storage recess 61 by the flow of air sucked from the through hole 65. For this reason, the chip-shaped circuit component a accommodated in the accommodation recess 61 becomes easier to overturn compared to the case where air is sucked only from the suction hole 63 at the bottom of the accommodation recess 61. Especially the storage recess
The upper edges of the 61, 61 ... are on the lower surface of the distributor 2.
The height is such that the contact recesses 61, 61
The side opposite to the side where the suction holes 63 for sucking the air are provided.
Since the through hole 65 is formed in the wall surface of the
In 1, 61 ...
To the suction holes 63 at the bottom of the storage recesses 61, 61 ...
In addition to the flow of air, the wall at one end of the storage recesses 61, 61 ...
Air flows from the through hole 65 on the surface to the suction hole 63 on the bottom side.
It Therefore, it stands in the storage recesses 61, 61 ...
The air flow is formed in the direction to roll over the chip-shaped circuit component a.
The chip-shaped circuit component a is surely rolled over.

[0007]

Embodiments of the present invention will now be specifically described with reference to the drawings. FIG. 2 shows an outline of the entire mounting device for chip-shaped circuit parts to which the present invention is applied. That is, a plurality of containers 1 in which chip-shaped circuit components are stored in a bulk form are arranged, and a delivery section 11 which is an escapement is connected to the containers 1 via tubes 10.
Further, the distributor 2 is provided under the sending unit 11.
Is arranged.

[0008] The distributor 2 has an upper frame 23 which is fixed under the delivery section 11, disposed parallel to the lower, and a lower frame 22 in which the template 6 on the lower surface side is detachably attached Have these
The upper frame 23 and the lower frame 22 are connected to each other at their four corners by four columns having flexibility and equal lengths. A vibrator 24 that gives vibration to the lower frame 22 is connected, so that the lower frame 22 is horizontally vibrated. It is desirable that the vibrations be applied independently in two directions orthogonal to each other. Further, between the upper frame 23 and the lower frame 22, flexible guide tubes 21, 21 ... Which guide and convey the chip-shaped circuit component are arranged. The guide tubes 21, 21 ... Are arranged so as to connect the component discharge port of the delivery section 11 and the through holes 25 (see FIG. 1) formed at the respective positions of the lower frame 22. The through hole 25 is opened in accordance with the position where the chip-shaped circuit component is to be mounted on the circuit board, and the position of the through hole 25 corresponds to the storage recess 61 of the template 6.

As shown in FIG. 1, below the lower frame 22, a template 6 having a storage recess 61 corresponding to the mounting position of the chip-shaped circuit component on the circuit board is inserted and fixed. It At this time, the through hole 25 of the lower frame 22 communicating with the lower end of the front guide tube 21 is arranged above each storage recess 61 of the template 6. In the template 6 shown in FIG. 1, a container-shaped member having an upward opening is fixed on a base board 60, and a storage recess 61 is formed therein. Then, the storage recess 61
Has a suction hole 63 at the bottom. In the illustrated case, the bottom surface of the storage recess 61 has a slope such that one end side becomes lower, and the suction holes 63 are opened with the bottom surface being biased toward the lower side. On the other hand, the through hole 25 of the lower frame 22 is
The bottom surface of the storage recess 61 is arranged so as to be biased toward the end on the higher side. The storage recess 61 may be formed by directly providing a recess in the base board 60 without using the above-mentioned container.

A through hole 6 is formed in one side wall of the storage recess 61.
5 is formed. In the embodiment of FIG. 1, this through hole 65
The flow of the air passing through the storage recess 61 from the bottom to the bottom of the base board 60 through the suction hole 63 on the bottom thereof effectively acts to collapse the chip-shaped circuit component a dropped from the guide tube 21 side. A through hole 65 is provided in the side wall near the through hole 25. When the template 6 is inserted under the lower frame 22, the vacuum case 4 is placed under the template 6, and the container 1 to the guide tube 21,
From the storage recess 61 through the suction hole 63 to the base board 6
0 through the lower surface, and further through the decompression chamber 41, the intake duct 5
A stream of air is drawn from the. At the same time,
From the through hole 65 in the side wall of the storage recess 61 to the storage recess 61.
Through the suction holes 63 to the lower surface of the base board 60, and a flow of the air taken into the intake duct 5 side together with the air is formed. Due to these air flows, the chip-shaped circuit component a stored in the storage recess 61 is sucked by one end of the storage recess 61, and is overturned from the standing state.

As shown in FIG. 2, component transfer means is provided for moving and mounting the chip-shaped circuit components stored in the storage recess 61 of the template 6 onto the circuit board 9, and this component transfer is carried out. As a means, it is usually connected to a suction pump (not shown) via a duct 81, and
A suction unit 8 of the type that sucks and holds the circuit component from 1 is used. For example, suction heads (not shown) are provided on the lower surface of the suction unit 8 at positions corresponding to the storage recesses 61, 61 ... Adsorbs and holds chip circuit components. The circuit board 9 is transported by a transporting means such as the conveyor 7, is positioned immediately below the suction unit 8, is stopped, and is then transported.

Distributor 2 and conveyor 7
In between, the light source 10 and the light receiver 12 are opposed to each other with the position where the template 6 passes being sandwiched therebetween. This is because the light from the light source 10 arranged under the template 6 is received by the light receiver 12 above the template 6 through the suction hole 63 formed in the bottom of the storage recess 61 of the template 6. , The chip-shaped circuit component a in the storage recess 61
It is for detecting whether or not is stored.

[0013] To explain the mount operation of the circuit component by the device is first inserted under the template 6 lower frame 22, in this state, the chip-like circuit component discharged from the container 1 is escape at sending unit 11 Are sent to the respective guide tubes 21, 21 ... Of the distributor 2 one by one. The chip-shaped circuit components thus sent to the guide tubes 21, 21 ... Are forcedly conveyed downward by the air sucked from the vacuum case 4 side and received in the storage recess 61 of the template 6 as shown in FIG. . At this time, the vibrator 24 vibrates the lower frame 22. Due to this vibration and the flow of the air, the chip-shaped circuit component received in the storage recess 61 of the template 6 is tilted in the storage recess 61 and arranged in a predetermined posture.

Next, when the suction by the vacuum case 4 is released, the air on the upper and lower surfaces of the template 6 flows through the air vent holes 65 formed in the template 6, and both sides quickly return to atmospheric pressure. Thereafter, drawn template 6 from the bottom of the lower frame 22, as shown in Figure 2, between the light source 10 and the receiver 12, the light at the bottom of the suction holes 63 of the housing recess 61 of the template 6 The presence or absence of so-called out-of-stock items due to transmission is inspected. afterwards,
The template 6 moves directly below the suction unit 8. Then, the suction unit 8 is placed on the template 6, and its suction head is inserted into each of the storage recesses 61 to suction-hold the chip-shaped circuit components therein. Adsorption unit 8
Rises, and the chip-shaped circuit component adsorbed and held by this rises from the storage recess 61 of the template 6. At the same time, the template 6 retreats from under the suction unit 8 and returns to under the distributor 2. Then, the suction unit 8 descends and moves onto the stopped circuit board 9, and the sucked and held chip-shaped circuit component is brought into contact with the circuit board 9 to release the suction state.

Circuit board 9 on which chip-shaped circuit components are to be mounted
An adhesive is applied in advance to each position on the substrate, and the chip-shaped circuit component is bonded by the adhesive when the suction state of the suction head is released, and the mounting of the chip-shaped circuit component on the circuit board is completed. After that, the circuit board 9 is sent to the next step by the conveyor 7, and the chip-shaped circuit components are soldered to the electrodes formed on the circuit board 9.

[0016]

As described above, according to the present invention, due to the negative pressure state on the lower surface side of the template 6, the suction hole 63 is provided not only from the bottom surface of the storage recess.
Since air is also sucked from the wall surface side of the storage recess 61 on the opposite side, the chip-shaped circuit component a stored in a state of standing in the storage recess 61 is surely laid sideways in that state to have a constant posture. You can

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional side view of essential parts of a template according to an embodiment of the present invention.

FIG. 2 is a schematic perspective view showing a chip-shaped circuit component mounting device.

FIG. 3 is a vertical sectional side view of a main part of a template showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Container 2 Distributor 6 Template 11 Delivery part 21 Guide tube 60 Base board 61 Template storage recess 63 Suction hole at the bottom of storage recess 65 Through hole on the wall of storage recess a Chip-shaped circuit component

Claims (1)

(57) [Scope of utility model registration request] 1. A base board (60) having accommodating recesses (61), (61), ... For accommodating the chip-shaped circuit component (a) at a position where the chip-shaped circuit component is to be mounted on a circuit board. A template disposed on the bottom of the storage recesses (61), (61) ...
Is provided with a suction hole (63) for sucking air, and the storage recess
(61), (61) ... The upper edge is the distributor
The height is such that it abuts the lower surface of (2), and the suction holes (63) of the storage recesses (61), (61) ...
A template for a chip-shaped circuit component mounting device, characterized in that a through hole (65) is formed on the wall surface on the side opposite to that provided .