JPH0719199Y2 - Chip-shaped electronic component mounting device template - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a template in which an accommodating recess for receiving the chip-shaped electronic component is arranged in an apparatus for mounting the chip-shaped electronic component on a substrate.

[Prior Art] Conventionally, when a chip-shaped electronic component is mounted at a predetermined position on a circuit board, it has been performed as follows using an automatic mounting device. That is, the chip-shaped electronic components stored in bulk in a plurality of containers are taken out one by one into a plurality of guide tubes arranged in a distributor, and are respectively stored in storage recesses formed at predetermined positions of the template. Send and receive there. The storage recess is arranged in accordance with the position where each chip-shaped electronic component is mounted on the circuit board. Then, by the component moving means having the suction unit, the chip-shaped electronic component stored in the storage recess is moved and mounted on the circuit board while holding the relative position when stored. As a result, each of the chip-shaped electronic components is mounted at a predetermined position on the circuit board.

An adhesive is applied in advance to the position where the chip-shaped electronic component is to be mounted on the circuit board, and the mounted electronic component is soldered while the electronic component is temporarily fixed.

The chip-shaped electronic component is conveyed by the distributor through a flexible guide tube. In this case, in the conventional device, as shown in FIG. A suction hole 63 is opened in the bottom, and the vacuum chamber 41 of the vacuum case 4 applied to the lower surface side of the template 6 is maintained at a negative pressure, so that the guide tube 21 receives the storage recess 61, the suction hole 63, and the template 6.
A flow of air passing through the vacuum chamber 41 on the lower surface of the device to the exhaust duct 5 is formed, whereby the chip-shaped electronic component a is forcibly conveyed from the guide tube 21 to the storage recess 61, and the chip-shaped electronic component a is further transferred. Overturning is performed from a standing state shown by a solid line as shown by a chain double-dashed line.

[Problems to be Solved by the Invention] However, the suction hole 63 formed in the bottom surface of the storage recess 61.
Is also used as a light transmission hole for transmitting light from the bottom to the top of the template 6 and inspecting whether or not the chip-shaped electronic component a is stored in each storage recess 61. Subject to some restrictions. That is, the suction hole 63 is located at a position most suitable for overturning the chip-shaped electronic component a received in the storage recess 61 from the standing state shown by the solid line in FIG. 3 to the sideways state shown by the chain double-dashed line. Can not be opened. For this reason, the chip-shaped electronic component a could not be surely rolled over in the storage recess 61.

If the chip-shaped electronic component remains upright in the storage recess of the template, the suction head cannot surely perform suction, and even if suction is possible, it cannot be correctly mounted on the circuit board.

SUMMARY OF THE INVENTION An object of the present invention is to provide a chip-shaped electronic component dispenser capable of surely accommodating a chip-shaped electronic component in a storage recess of a template in a correct posture.

[Means for Solving the Problems] That is, the present invention, in order to achieve the above-mentioned object, according to the position where a chip-shaped electronic component is to be mounted on a substrate,
The template is a template in which storage recesses 61, 61 ... For receiving the chip-shaped electronic parts are arranged on the base board 60, and suction holes 63 are opened on the bottom surface of the storage recesses 61, 61. In addition to the suction holes 63 on the bottom surface of 61, 61 ...
Provided is a template for a chip-shaped electronic component mounting device, which is characterized in that suction holes 64, 64 'communicating from one end face of one end of the base plate 60 to the lower face of the base board 60 are formed.

[Operation] In the chip-shaped electronic component mounting device template according to the present invention, not only the suction holes 63 on the bottom surface of the storage recess 61 but also the end surface at one end of the storage recess 61 can be used for the base board
Since the suction holes 64, 64 ′ communicating with the lower surface of the 60 are opened, the chip-shaped electronic component a received in the storage recess 61 is laterally moved by the flow of air sucked from the suction holes 64, 64 of the end face. Is sucked in and drawn toward the end of the storage recess 61. For this reason, the chip-shaped electronic component a housed in the housing recess 61 becomes easier to overturn compared to the case where air is sucked only from the suction hole 63 at the bottom of the housing recess 61.

[Embodiment] Next, an embodiment of the present invention will be specifically described with reference to the drawings.

FIG. 4 shows an outline of the entire mounting device for a chip-shaped electronic component to which the present invention is applied. That is, a plurality of containers 1 in which chip-shaped electronic components are stored in bulk are arranged,
A delivery unit 11 which is an escapement is connected to this via a tube 10. Further, the distributor 2 is arranged below the sending unit 11.

As shown in FIG. 2, this distributor 2 is arranged in parallel with a fixed frame 23 fixed below the delivery section 11, and a movable frame to which the template 6 is detachably attached on the lower surface side. 22. The fixed frame 23 and the movable frame 22 are connected to each other at their four corners by four flexible linear members 31 having the same length.

A vibrator 24 that gives vibration to the movable frame 22 is connected, so that the movable frame 22 is horizontally vibrated. It is desirable that the vibrations be applied independently in two directions orthogonal to each other.

Further, a flexible guide tube 2 that guides and conveys the chip-shaped electronic component between the fixed frame 23 and the movable frame 22.
1, 21 ... are piped. These guide tubes 21, 21 ...
Is laid so as to connect the component discharge port of the delivery section 11 and the through hole 25 (see FIGS. 1 and 2) formed at each position of the movable frame 22. The through-hole 25 is formed at the position where the chip-shaped electronic component is to be mounted on the wiring board, and the position of the through-hole 25 corresponds to the storage recess 61 of the template 6.

As shown in FIGS. 1 and 2, the movable frame 22
A template 6 provided with a storage recess 61 in accordance with the mounting position of the chip-shaped electronic component on the circuit board is inserted and fixed underneath. At this time, the through holes 25 of the movable frame 22 communicating with the lower end of the front guide tube 21 are arranged above the respective storage recesses 61 of the template 6.

In the template 6 shown in FIGS. 1 and 2, a container-shaped member having an upper opening is fixed on the base board 60, and a storage recess 61 is formed therein. Then, a suction hole 63 is opened at the bottom of the storage recess 61. In the case of the drawing, the bottom surface of the storage recess 61 has a slope such that one end side becomes lower, and the suction holes 63 are opened with the bottom surface biased toward the lower side. On the other hand, the through hole 25 of the movable frame 22
Are arranged such that the bottom surface of the storage recess 61 is biased toward the end on the higher side. The storage recess 61 may be formed by directly providing a recess in the base board 60 without using the container as described above.

Another suction hole 64 is formed in the end wall of the storage recess 61 which stands up from the lower side. In the embodiment of FIG. 1, a partition 66 is formed on the base board 60 so that the air from the suction hole 64 escapes under the base board 60, and between the partition 66 and the storage recess 61. A through hole 65 is opened.

When the template 6 is inserted under the movable frame 22, the vacuum case 4 is applied under the movable frame 22, and the flow of air sucked from the intake duct 5 from the container 1 through the guide tube 21, the storage recess 61 and the decompression chamber 41. Is formed. This air flow escapes from the suction hole 63 at the bottom of the storage recess 61 to the lower surface of the base board 60, and also from the suction hole 64 at the end surface of the storage recess 61 through the through hole 65 of the base board 60.
Take two flow paths leading to the bottom surface of the. Due to the flow of these air, the chip-shaped electronic component a stored in the storage recess 61 is formed.
Is sucked into one end of the storage recess 61 and is laid over from the standing state.

In the embodiment of FIG. 2, the elbow-shaped suction hole 64 ′ formed in one end wall of the storage recess 61 is a through hole of the base board 60.
It is connected with 65 '. In this embodiment, as compared with the embodiment shown in FIG. 1, air can be reliably sucked through the suction holes 64 'and the through holes 65'.

As shown in FIG. 4, a component transfer means for moving and mounting the chip-shaped electronic components stored in the storage recess 61 of the template 6 onto the circuit board 9 is provided. Is usually connected via a duct 81 to a suction pump (not shown), and a suction unit 8 of the type that sucks and holds electronic components from the storage recess 61 is used. For example, on the lower surface of the suction unit 8, the template 6
Suction heads (not shown) are provided so as to correspond to the positions of the upper storage recesses 61, 61, ...

The circuit board 9 is carried by a carrying means such as the conveyor 7, is positioned immediately below the suction unit 8, is stopped, and is then sent.

A light source 10 and a light receiver 12 are vertically opposed between the distributor 2 and the conveyor 7 with a position where the template 6 passes being interposed therebetween. This is because the light from the light source 10 arranged under the template 6 is received by the light receiver 12 on the template 6 through the suction hole 63 opened at the bottom of the storage recess 61 of the template 6. , Storage recess
This is for detecting that the chip-shaped electronic component a is not stored in 61.

Explaining the mounting operation of electronic parts by this device,
First, the template 6 is inserted under the movable frame 22,
In this state, the chip-shaped electronic components discharged from the container 1 are escaped by the delivery unit 11 and delivered to the guide tubes 21, 21, ... Of the distributor 2 one by one. The chip-shaped electronic components thus sent to the guide tubes 21, 21 ... Are forcedly conveyed downward by the air sucked from the vacuum case 4 side, and are received in the storage recess 61 of the template 6 as shown in FIG. It At this time, the vibrator 24 vibrates the movable frame 22. Due to this vibration and the flow of the air, the storage recess of the template 6
The chip-shaped electronic component received in 61 is laid down in the storage recess 61 and arranged in a predetermined posture.

Next, when the suction by the vacuum case 4 is released, the air on the upper and lower surfaces of the template 6 flows through the air vent holes 65 formed in the template 6, and both sides quickly return to atmospheric pressure. Then, the template 6 is pulled out from under the movable frame 22, and as shown in FIG.
Between the light source 10 and the light receiver 12, the presence or absence of a so-called defective item due to the transmission of light through the suction hole 63 at the bottom of the storage recess 61 of the template 6 is inspected.

After that, the template 6 moves directly below the suction unit 8. Then, the suction unit 8 is placed on the template 6, and the suction head is inserted into each of the storage recesses 61 to suck and hold the chip-shaped electronic components therein. The suction unit 8 rises, and the chip-shaped electronic component sucked and held by the suction unit 8 is pulled up from the storage recess 61 of the template 6. At the same time, the template 6 retreats from under the suction unit 8 and returns to under the distributor 2. Then, the suction unit 8 moves down and moves onto the stopped circuit board 9, and the chip-shaped electronic component sucked and held is brought into contact with the circuit board 9 to release the suction state.

An adhesive is previously applied to each position on the circuit board 9 on which the chip-shaped electronic component is to be mounted, and the chip-shaped electronic component is bonded by the adhesive when the suction state of the suction head is released. Mounting on the circuit board is completed. After that, the circuit board 9 is sent to the next step by the conveyor 7, and the chip-shaped electronic components are soldered to the electrodes formed on the circuit board 9.

[Advantages of the Invention] As described above, according to the present invention, due to the negative pressure state on the lower surface side of the template 6, air is sucked not only from the bottom surface of the storage recess 61 but also from the end surface of the storage recess 61. Therefore, the chip-shaped electronic component a accommodated in the accommodating recess 61 can be surely laid sideways therein to have a certain posture.

[Brief description of drawings]

FIG. 1 is a vertical sectional side view of an essential part of a template according to an embodiment of the present invention, FIG. 2 is a vertical sectional side view of an essential part of a template according to another embodiment, and FIG. FIG. 4 is a schematic perspective view showing the same chip-shaped electronic component mounting device, which is a vertical cross-sectional side view of essential parts. 1 ... Container, 2 ... Distributor, 6 ... Template, 11 ... Delivery unit, 21 ... Guide tube, 60 ... Base board, 61 ... Template storage recess, 63 ... Suction bottom of storage recess Hole, 64, 64 '... suction hole on the end face of the storage recess, 65 ... base board through hole, a ... chip-shaped electronic component

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Yutaka Nagai 6-16-20 Ueno, Taito-ku, Tokyo Within Taiyo Electric Co., Ltd. (72) Kikuji Fukai 6-16-20 Ueno, Taito-ku, Tokyo In Taiyo Denki Co., Ltd. (56) Reference JP-A 1-278098 (JP, A)

Claims (1)

[Scope of utility model registration request] 1. Storage recesses (61), (61), for receiving the chip-shaped electronic parts are arranged on a base board (60) in conformity with a position where a chip-shaped electronic component is to be mounted on a substrate. The template is provided with suction holes (63) at the bottoms of the storage recesses (61), (61), and the suction holes (63) at the bottom of the storage recesses (61), (61). In addition, suction holes (64), (64 ') leading from the end surface at one end of the storage recesses (61), (61) ... to the lower surface of the base board (60).
A template for a chip-shaped electronic component mounting device, wherein the template is formed.