JPH0651033Y2 - Chip electronic component distributor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a device for mounting a chip-shaped electronic component housed in a container at a predetermined position on a circuit board, and the chip-shaped electronic component discharged from the container side. Relates to a distributor (guider) that guides and conveys to the storage recesses respectively provided at predetermined positions of the template.

[Prior Art] Conventionally, when a chip-shaped electronic component is mounted at a predetermined position on a circuit board, it has been carried out as follows using an automatic mounter equipped with a distributor. That is, the chip-shaped electronic components that are stored in bulk in a plurality of containers are taken out one by one into a plurality of guide tubes that are piped to the distributor, and then stored in a storage recess formed at a predetermined position of the template. Send each and collect in there. The storage recess is arranged in accordance with the position where each chip-shaped electronic component is mounted on the circuit board, and the suction recess corresponding to the arrangement of the storage recess is held while keeping the relative position when stored in the circuit board. The chip-shaped electronic component is moved and mounted on the circuit board by the component moving means having the suction head protruding from the lower surface of the unit. As a result, each of the chip-shaped electronic components is mounted at a predetermined position on the circuit board. An adhesive is applied in advance to the position where the chip-shaped electronic component is to be mounted on the circuit board, and the mounted electronic component is soldered while the electronic component is temporarily fixed.

The chip-shaped electronic component is carried by the distributor through a flexible guide tube, but the electronic component needs to be received from the guide tube into the storage recess of the template in a certain posture. is there. More specifically, it is necessary for the chip-shaped electronic component to be received in a state in which the chip-shaped electronic component has fallen along the longitudinal direction of the storage concave portion. Otherwise, the chip-shaped electronic components cannot be mounted on the circuit board reliably and accurately.

[Problems to be Solved by the Invention] However, in practice, some chip-shaped electronic components often stand in the storage recess of the template or remain in an inclined state.

Particularly in recent years, in this type of device, prismatic chip-shaped electronic components are simultaneously distributed together with cylindrical chip-shaped electronic components. Since this prismatic chip-shaped electronic component exhibits a stable state in various postures as compared with the cylindrical chip-shaped electronic component, it stands in the storage recess of the template more than the cylindrical chip-shaped electronic component, or Is often left in an oblique position.

An object of the present invention is to solve the above-mentioned conventional problems and to receive a chip-shaped electronic component in a state in which the chip-shaped electronic component is surely tilted in a storage recess of the template, and yet to have a small influence on other parts of the device. To provide a state electronic component distributor.

[Means for Solving the Problems] That is, according to the present invention, in order to achieve the above object, the container 1,
1 is a chip-shaped electronic component distributor that guides and conveys the chip-shaped electronic components discharged from the container 1 to the storage recesses 61, 61 ... Provided at predetermined positions of the template 6, and the chips discharged from the container 1. Frame 23 fixed below the sending portion 11 for sending out the electronic components, a movable frame 22 arranged in parallel thereunder, to which the template 6 is detachably attached, and movable from the fixed frame 23. A plurality of flexible filaments 31, 31 ... Connecting the two frames so as to suspend the frame 22, and the template 6 placed under the movable frame 22 together with the movable frame 22.
A chip including a vibrator 24 for vibrating the device, and flexible guide tubes 21, 21 ... Piped between the fixed frame 23 and the movable frame 22 for guiding and carrying the chip-shaped electronic component. Provide electronic component distributor.

[Operation] In the chip-shaped electronic component distributor according to the present invention, the vibration applied from the vibrator 24 to the movable frame 22 is transmitted to the template 6 via the movable frame 22. As a result, the chip-shaped electronic component housed in the housing recess 61 of the template 6 can be surely tilted.

Particularly, in the chip-shaped electronic component distributor according to the present invention, since the movable frame 22 is suspended by the plurality of flexible linear members 31, 31, ...
The vibration given to the is not transmitted to the fixed frame 23 side,
It is transmitted only to the template 6 via the movable frame 22. As a result, sufficient vibration is applied to the template 6 while the fixed frame 23 is completely fixed, without affecting the fixed frame 23 side, and the chip-shaped electronic component housed in the housing recess 61 is surely secured. Can be defeated.

[Embodiment] Next, an embodiment of the present invention will be specifically described with reference to the drawings.

FIG. 3 shows an outline of the entire mounting device for a chip-shaped electronic component to which the present invention is applied. That is, a plurality of containers 1 in which chip-shaped electronic components are stored in bulk are arranged,
A delivery section 11 which is an escapement is connected to this through a tube 10 (see FIG. 1). Further, the distributor 2 according to the present invention is arranged below the sending section 11.

As shown in FIG. 1, this distributor 2
It has a fixed frame 23 fixed below the delivery section 11, and a movable frame 22 arranged in parallel therebelow and on which the template 6 is removably attached, the fixed frame 23 and the movable frame. Are connected to each other at their four corners by four linear members 31, 31 ... Having the same flexibility.

FIG. 2 shows a state in which the linear members 31 are connected to the corners of the movable frame 22, and thus the connection structure of the linear members 31 will be described in detail. That is, the movable frame 22
A cylindrical joint 32 is erected on the top corner of the
It is fixed to the movable frame 22. Further, the lower end of the linear member 31 is fitted to this upper end and is fixed by the braze 15.

As the linear member 31, for example, a piano wire of about φ3 or a wire of the same size is suitable. In addition, the joint 32 is formed by the linear body 31.
The diameter is sufficiently thicker than, for example, stainless steel of about φ15,
A column made of steel or the like is used. Therefore, this fitting 32
Has much higher rigidity than the linear body 31, and the bending of the joint 32 can be ignored with respect to the bending of the linear body 31.

Such a connection structure of the linear members 31 is exactly the same on the fixed frame 23 side, and the upper ends of the linear members 31 are fixed to the joints 32 provided upright at the corners of the lower surface of the fixed frame 23. The fixed frame 23 and the movable frame formed by such linear bodies 31, 31 ...
The connection with the movable frame 22 is made in a well-balanced manner at a few corners and the center of the movable frame 22, and generally, the four corners of the movable frame 22 are connected. The means for fixing both ends of the linear member 31 to the joint 32 may be welding, screwing, or the like.

As shown in FIGS. 1 and 3, a vibrator 24 for vibrating the movable frame 22 is connected to the movable frame 22, which horizontally vibrates the movable frame 22. Vibration is orthogonal to each other 2
It is desirable to be given in each direction.

Further, a flexible guide tube 2 that guides and conveys the chip-shaped electronic component between the fixed frame 23 and the movable frame 22.
1, 21 ... are piped. These guide tubes 21, 21 ...
Is laid so as to connect the component discharge port of the delivery section 11 and a through hole (not shown) of the pattern base 25 (see FIG. 3) attached to the lower surface of the movable frame 22. And
The through hole of this pattern base 25 is opened in accordance with the position where the chip-shaped electronic component is to be mounted on the wiring board, and the position of this through hole corresponds to the storage recess 61 of the template 6. In FIG. 2, reference numeral 28 is a joint for connecting the guide tube 21 to the movable frame 22.

Below the pattern base 25, the template 6 provided with the storage recess 61 is inserted and fixed in accordance with the mounting position of the chip-shaped electronic component on the circuit board. This state is shown in FIG. 2. At this time, the through holes of the pattern base 25 communicating with the lower end of the front guide tube 21 are arranged above the respective storage recesses 61 of the template 6.

Furthermore, when the template 6 is inserted under the pattern base 3, the vacuum case 4 is applied below it,
From the container 1 to the guide tube 21, the storage recess 61 and the decompression chamber 41
A flow of air sucked from the intake duct 5 is formed via (see FIG. 2). Reference numerals 42 and 62 are sealing members that seal between the vacuum case 4 and the template 6 and between the template 6 and the pattern base 25.

As shown in FIG. 3, a component transfer means for moving and mounting the chip-shaped electronic components stored in the storage recess 61 of the template 6 onto the circuit board 9 is provided. Is usually connected via a duct 81 to a suction pump (not shown), and a suction unit 8 of the type that sucks and holds electronic components from the storage recess 61 is used. For example, on the lower surface of the suction unit 8, the template 6
Suction heads (not shown) are provided so as to correspond to the positions of the upper storage recesses 61, 61 ..., respectively, and the tip-shaped electronic component is suctioned and held at the tip end portion thereof maintained at a negative pressure.

The circuit board 9 is carried by a carrying means such as the conveyor 7, is positioned immediately below the suction unit 8, is stopped, and is then sent.

The mounting operation of the electronic component by this device will be described below. First, the template 6 is inserted under the pattern base 3, and in this state, the chip-shaped electronic component discharged from the container 1 is released by the delivery section 11, One is sent to each of the guide tubes 21, 21 ... Of the distributor 2.
The chip-shaped electronic components sent to the guide tubes 21, 21 ... In this way are forcibly conveyed downward by the air sucked from the vacuum case 4 side, and the storage recess of the template 6 is stored.
Collected in 61. At this time, the template 6 in which the vibrator 24 is held under the movable frame 22 together with the movable frame 22
Vibrate. Due to the vibration and the flow of the air, the chip-shaped electronic component received in the storage recess 61 of the template 6 is tilted in the storage recess 61 and arranged in a predetermined posture.

Then, the template 6 is pulled out from below the pattern base 3 and moved to directly below the suction unit 8. Then, the suction unit 8 is mounted, and the suction heads of the suction units 8 respectively
It is inserted into 61 and sucks and holds the chip-shaped electronic component therein. The suction unit 8 rises, and the chip-shaped electronic component sucked and held by the suction unit 8 is pulled up from the storage recess 61 of the template 6. At the same time, the template 6 retreats from under the suction unit 8 and returns to under the distributor 2. Then, the suction unit 8 moves down and moves onto the stopped circuit board 9, and the chip-shaped electronic component sucked and held is brought into contact with the circuit board 9 to release the suction state.

An adhesive is previously applied to each position on the circuit board 9 on which the chip-shaped electronic component is to be mounted, and the chip-shaped electronic component is bonded by the adhesive when the suction state of the suction head is released. Mounting on the circuit board is completed. After that, the circuit board 9 is sent to the next step by the conveyor 7, and the chip-shaped electronic components are soldered to the electrodes formed on the circuit board 9.

[Advantage of the Invention] As described above, according to the present invention, by vibrating the template through the movable base of the distributor, the chip-shaped electronic component housed in the housing recess of the template is tilted, and its posture is changed. It can be arranged surely. Especially, since the fixed base side of the distributor is not affected by the vibration, it is possible to give sufficient vibration only to the movable base side to which the template is attached, thereby more reliably adjusting the attitude of the chip-shaped electronic component. You can

[Brief description of drawings]

FIG. 1 is a side view of an essential part of a mounting device for a chip-shaped electronic component equipped with a distributor, which is an embodiment of the present invention.
FIG. 2 is a partial cross-sectional side view of the distributor, and FIG. 3 is a schematic perspective view showing the chip-shaped electronic component mounting apparatus. 1 ... Container, 2 ... Distributor, 6 ... Template, 11 ... Delivery section, 21 ... Guide tube, 22 ... Movable frame, 23 ... Fixed frame, 24 ... Vibrator, 31 ... Striatum , 32 …… fittings, 61 …… template recess

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Yutaka Nagai Yutaka Nagai 6-16-20 Ueno Taito-ku, Tokyo Within Taiyo Denki Co., Ltd. (56) Reference JP-A-1-295500 (JP, A) JP A 62-259728 (JP, A)

Claims (1)

[Scope of utility model registration request] 1. A chip-shaped electronic component distributor which guides and conveys chip-shaped electronic components discharged from containers 1, 1 ... into storage recesses 61, 61 ... respectively provided at predetermined positions of a template 6. , A fixed frame 23 fixed below the sending portion 11 for sending out the chip-shaped electronic components discharged from the container 1, and a movable frame 22 arranged in parallel below the fixed frame 23 and on which the template 6 is detachably attached. And a plurality of flexible linear members 31, 31 ... Connecting the two frames so as to suspend the movable frame 22 from the fixed frame 23, and the movable frame 22 and the template 6 applied under the same. Give vibrator 24
And a flexible guide tube 21, 21 ... Which is arranged between the fixed frame 23 and the movable frame 22 and which guides and conveys the chip-shaped electronic component, the chip-shaped electronic component distributor.