JPH0567097U - Chip circuit component supply device - Google Patents

Abstract

(57) [Summary] (Correction) [Purpose] A disk-shaped slider and disk-shaped shutter for a chip-shaped circuit component supply device that can reliably perform the shutter function even if foreign matter enters the contact surface. [Structure] A chip-shaped electronic component a supplied from a container 10 stored in a bulk shape through a component discharge pipe 49 is accommodated in a component accommodating through hole 64 of a disc-shaped slider 54, and relative to the disc-shaped shutter 100. Depending on the rotation angle, the components are distributed through the through holes 101. The disk-shaped slider 54 has a component-accommodating through-hole 64 formed by a cylindrical member 150 that projects and is fixed downwards. Therefore, the sliding contact area with the disk-shaped shutter 100 is reduced, the contact resistance is reduced, and foreign matter is reduced. Ensures mutual rotation even if is mixed in the contact surface. Further, an air nozzle 200 for blowing compressed air to the contact surface is provided to remove foreign matter that has entered the contact surface.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an improvement of a chip-shaped circuit component supply device that takes out the chip-shaped electronic circuit components in a line from a container in which they are stored in a bulk shape into a component discharge pipe and feeds them one by one to a component transport path.

[0002]

[Prior Art]

 Conventionally, when a chip-shaped circuit component is mounted at a predetermined position on a circuit board, it has been performed as follows using an automatic mounting device. That is, the chip-shaped circuit components that are stored in bulk in multiple containers are taken out one by one into the multiple guide tubes that are piped to the distributor, and then stored in the storage recesses that are formed at the prescribed positions of the template. Send each and collect in there. The storage recess is arranged in accordance with the position where each chip-shaped circuit component is mounted on the circuit board. Corresponding to the placement of the storage recess while maintaining the relative position when stored in the circuit board. The chip-shaped circuit component is moved to and mounted on the circuit board by the component moving means having the suction head protruding from the lower surface of the suction unit. As a result, the chip-shaped circuit components are mounted at predetermined positions on the circuit board. An adhesive is applied in advance to the position where the chip-shaped circuit component is to be mounted on the circuit board, and the mounted electronic component is temporarily fixed with this adhesive and then soldered.

By the way, a component supply device used in such a device has a funnel-shaped gradient on the bottom surface, a container in which chip-shaped circuit components are stored in a bulk shape, and a through hole in the center of the bottom of the container. And a part discharge pipe whose upper end is slidably inserted into the container. The upper end of the component discharge pipe is opened obliquely. Further, the container is slidably fitted in a concave portion of a guide member fixed to the frame, whereby the container is guided slidably up and down. Further, a vertical drive mechanism is connected to an arm protruding from the upper end of the container via a bracket or the like, and the container is vertically reciprocally driven by the power transmitted from the motor via the transmission mechanism.

In this way, by driving the container up and down, the upper end of the component discharge pipe relatively reciprocates up and down in the container. Then, when the upper end of the component discharge pipe rises from the bottom of the container, the chip-like components are destroyed, and when the upper end of the component discharge pipe falls, chip-like circuit components enter the component discharge pipe one by one through the opening. .. In this way, the chip-shaped circuit components that have entered the component discharge pipes are lined up in a line and sequentially fed downward.

Thereafter, as shown in FIG. 8, the chip-shaped circuit components a sent in a line in the component discharge pipe 2 protruding from the bottom of the hopper 1 are provided with product holding pins 3 provided at the lower end thereof. By this function, the rotating disk slider 4 is housed in the through holes 5, 5, ... For accommodating the parts, which are concentrically formed in the vicinity of the outer circumference of the rotating disk slider 4. A disk-shaped shutter 6 is also rotatably provided below the disk slider 4. The disk shutter 6 is formed with through holes 5, 5 ... For storing the parts of the disk slider 4 and through holes 7, 7 ... The chip-shaped circuit component a is supplied to the distribution pipes 8, 8 ...

That is, as shown by the solid line in the figure, when the positions of the through holes 5, 5 for storing the components of the disk slider 4 and the through holes 7, 7 for passing the components of the disk shutter 6 are displaced, The chip-shaped circuit component a is stored in the component storage through holes 5, 5, ... Of the disk slider 4. On the other hand, the disk shutter 6 rotates in the direction of the arrow (that is, the relative rotational position between the disk slider 4 and the disk shutter 6 changes), and the disk slider 4 through holes 5, 5 ... When the positions of the through holes 7, 7 ... for passing the parts of the shutter 6 coincide with each other (shown by broken lines in the figure), the chip-shaped circuit component a passes through the through holes 7, 7 for passing the parts of the disk shutter 6. It will be conveyed and supplied into the distribution pipes 8, 8 ...

[0007]

In the above conventional technique, the disk slider 4 and the disk shutter 6 are rotatably provided so that the bottom surface and the top surface are in surface contact while sliding on each other. If foreign matter is mixed into the contact surface, or if foreign matter is accumulated and accumulates too much, rotation between the disk slider 4 and the disk shutter 6 becomes impossible, so that the shutter function is not performed and the parts are not operated. Frequently, supply was hindered.

This is because the disk slider 4 and the disk shutter 6 are in surface contact with each other, and when foreign matter is mixed in during this, the contact resistance between them becomes large, and eventually the rotation becomes impossible. This is because. On the other hand, it is conceivable to mount the disk slider 4 in a state of being floated from the surface of the disk shutter 6, but this causes a problem such as an insertion error of the chip-shaped circuit component a and is practically difficult to employ.

In view of the above-mentioned problems in the prior art, the present invention has an improved chip-shaped circuit that allows reliable component distribution without foreign matter entering the contact surface and impairing the function of the disk shutter. An object is to provide a component supply device.

[0010]

[Means for Solving the Problems]

 The above object is, according to the present invention, a chip-shaped circuit component supply device, in which a container in which chip-shaped circuit components are stored in a bulk form, and a component discharge pipe having an upper end inserted into the container. A component transport path disposed under the component discharge pipe, a slider and a shutter disposed between a lower end of the component discharge pipe and an upper end of the component transport path, and the slider is a rotating disk. It is a disk-shaped plate that has a plurality of through holes for accommodating parts around the center of rotation and the shutter also rotates, and the slider has holes around the center of rotation. A plurality of through holes for passing parts having the same diameter as the through holes of the slider are formed at a position corresponding to the disk-shaped slider, and the disk-shaped slider is positioned below the part discharge pipe and the disk-shaped shutter is provided. Slidably arranged on the front Along with the rotation of the disk-shaped slider, chip-shaped circuit components are sequentially supplied from the component discharge pipe into the through holes for storing the components, and the relative rotational position between the disk-shaped slider and the disc-shaped shutter described above is used. In the case of supplying the chip-shaped circuit component housed in the component storing hole to the component conveying path through the component passing hole, the sliding contact area of the lower side of the disk slider is This is achieved by a chip-like circuit component supply device characterized in that the area is smaller than the projected area of the disk-shaped slider in a plane.

Further, according to the present invention, in the above chip-shaped circuit component supply device, further, an air nozzle for blowing compressed air to a contact surface between the bottom surface of the disk-shaped slider and the top surface of the shutter is provided. A provided chip-shaped circuit component supply device has been proposed.

[0012]

[Action]

 That is, according to the above-mentioned chip-shaped circuit component supply device of the present invention, for example, a cylindrical member longer than the thickness dimension of the plate body is inserted and fixed in the hole formed in the disk-shaped slider plate by protruding downward. To form a through hole for housing the component by the inner hole of the cylindrical member, or to form a concave portion on the bottom surface of the disk-shaped slider plate in the vicinity of the through hole for passing the component. The sliding contact area with the shutter below the slider can be reduced. The contact surface resistance of both is made smaller than this, and it is possible to prevent the rotation from being impossible due to foreign matter mixed in the contact surface. Further, since the slider and the through hole of the shutter are in contact with each other, the chip-shaped circuit components to be distributed are not erroneously distributed.

Further, by providing an air nozzle for spraying compressed air on the contact surface between the disk-shaped slider and the shutter, it is possible to remove foreign matter entering the contact surface by the compressed air sprayed. Become.

[0014]

【Example】

 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 5 shows an outline of the entire mounting device for chip-shaped circuit parts to which the present invention is applied. That is, a plurality of containers 10 each containing a chip-shaped circuit component in a bulk form are arranged, and a delivery section 12 as an escapement is connected to the containers 10 via a tube 11. Further, a distributor 20 is arranged below the sending unit 12.

The distributor 20 has a fixed base 23 fixed below the delivery part 12, and a movable base 22 arranged in parallel therebelow and on which the template 60 is detachably attached. The fixed base 23 and the movable base 22 are connected to each other at their four corners by four linear bodies 24, 24 ... Which have flexibility and are equal in length.

A vibrator 30 that vibrates the movable base 22 is connected to the movable base 22, which vibrates the movable base 22 in parallel. It is desirable that the vibrations be independently applied in two directions orthogonal to each other. Due to the connection structure using the linear bodies 24, 24 ... As described above, the horizontal vibration applied from the vibrator 30 to the movable base 22 does not reach the fixed base 23.

Further, between the fixed base 23 and the movable base 22, flexible guide tubes 21, 21 ... Which guide and convey the chip-shaped circuit component are arranged. The guide tubes 21, 21, ... Are connected to connect the component discharge port of the delivery unit 12 and the through hole (not shown) of the movable base 22. The through hole of the movable base 22 is opened in accordance with the position where the chip-shaped circuit component is to be mounted on the wiring board. The position of this through hole corresponds to the storage recess 61 of the template 60. ing.

Under the movable base 22, a template 60 having a storage recess 61 is inserted and fixed in accordance with the mounting position of the chip-shaped circuit component on the circuit board. At this time, the through holes of the movable base 22 communicating with the lower end of the proposed tube 21 are arranged above the respective storage recesses 61 of the template 60.

Further, when the template 60 is inserted under the movable base 22, the vacuum case 40 is put under the template 60, and the air sucked from the container 1 through the guide tube 21 and the storage recess 61 through the intake duct 50. Flow is formed.

A component transfer means for moving and mounting the chip-shaped circuit components stored in the storage recess 61 of the template 60 onto the circuit board 90 is provided. As this component transfer means, a normal duct is used. A suction unit 80 is used which is connected to a suction pump (not shown) via 81 and sucks and holds the electronic component from the storage recess 61. For example, suction heads (not shown) are projectingly provided on the lower surface of the suction unit 80 at positions corresponding to the storage recesses 61, 61 ... On the template 60, and a tip-shaped tip is maintained at a negative pressure. Adsorbs and holds circuit components. The circuit board 90 is transferred by a transfer means such as the conveyor 70, positioned once under the suction unit 80, stopped, and then transferred.

A component supply device according to an embodiment of the present invention used in such a chip-shaped circuit component mounting device is shown in FIG. This component supply device has a funnel-shaped gradient on the bottom surface, and is provided with a plurality of containers 10 in which chip-shaped circuit components a, a ... Are accommodated in a bulk shape, one of which is shown in FIG.

In this embodiment, the container 10 has a funnel-shaped bottom surface and constitutes a bottom wall of the container 10 and a base member 38 fitted around the base member 38 so as to cover the peripheral wall of the container 10. The base member 38 is formed of a cylindrical tubular member 39 to be formed, and a through hole is formed in the central portion where the bottom surface of the base member 38 is the lowest. Further, the upper end of the component discharge pipe 49 is slidably fitted into the through hole of the base member 39, and the upper end of the pipe 49 is inserted into the container 1. In the illustrated case, the component discharge pipe 49 is inserted so as to substantially coincide with the central axis of the container 1, and the upper end thereof is opened obliquely.

A slide member 37 protruding from the center of the bottom surface of the base member 39 is slidably fitted in a recess of a guide member 36 fixed to a guide base (not shown). An arm (not shown) is attached to the upper portion of the tubular member 39 (not shown), and the vertical drive mechanism is connected to the arm via a bracket (not shown). As a result, the container 10 is guided by the guide member 36 to reciprocate up and down.

At the lower end of the component discharge pipe 49, there is provided an escalation mechanism for releasing the chip-shaped circuit components a one by one to the component conveying paths 11, 11 ... Which communicate with the guide pipes 21, 21 ... Of the distributor 20. That is, a disk-shaped slider 54 is arranged below the lower end of the component discharge pipe 49, and the disk slider 54 rotates around its center as indicated by an arrow. A disc-shaped shutter 100 is rotatably provided on the frame 35 below the disc slider 54. Reference numeral 51 in the figure is a component passage hole formed in the frame 35.

As shown in FIG. 1, a plurality of through holes 64, 64 for accommodating a plurality of parts each having a size in which only one chip-shaped part a is vertically inserted around the rotation center of the slider 54 have a constant angle. It is opened every time. In the case of the illustrated embodiment, as is apparent from the figure, ten through holes 64, 64 ... Are provided at 36 ° intervals. In this embodiment, as shown in FIG. 3, the plurality of through holes 64, 64 ... Are holes 541, 541 ... Formed on the plate surface of the disk-shaped slider 54 by cylindrical members 150, 150. It is inserted and fixed in and is formed by its inner diameter. Further, as is clear from FIG. 1, the length of the cylindrical member 150 forming the through hole 64 is longer than the plate thickness of the disc-shaped slider 54. Reference numeral 150 projects from the lower surface of the disk-shaped slider 54. Also, FIG. 2 shows a state in which these are assembled vertically.

On the other hand, a disk-shaped shutter 100 is arranged parallel to the lower side of the disk-shaped slider 54, and the disk-shaped shutter 100 is located at the same position as the through holes 64, 64, ... In addition, the same number of through holes 101, 101 having the same diameter are formed. And, below this, the component transport paths 11, 11 ... Through which the chip-shaped circuit components a are escaped one by one through the component passage holes (reference numeral 51 in FIG. 4) of the frame (reference numeral 35 in FIG. 4) not shown. It is arranged.

The operation of the above-described configuration will be described. Depending on the relative rotational positions of the disk-shaped slider 54 and the disk-shaped shutter 100, the chip-shaped circuit parts a are transferred one by one to the part-conveying path 11 ahead of them. 11 ... is supplied. That is, as shown by the solid line in the figure, when the positions of the through holes 64, 64 ... for storing the parts of the disk-shaped slider 54 and the through holes 101, 101 ... for the parts of the disk-shaped shutter 100 are shifted, The chip-shaped circuit component a is accommodated in the component accommodating through holes 64, 64 ... Of the disk-shaped slider 54. On the other hand, the disk-shaped shutter 54 rotates in the direction of the arrow, that is, the relative rotational position between the disk-shaped slider 54 and the disk-shaped shutter 100 changes, and as a result, the respective component storage through holes 64, 64 ,. When the positions of the through holes 101, 101 ... For passing the parts coincide (shown by broken lines in the figure), the chip-shaped circuit parts a, a ... Pass through the through holes 101, 101. The parts are conveyed and supplied into the parts conveying paths 11, 11 ...

By the way, according to the above-mentioned structure of the disk-shaped slider 54, the portion that is in sliding contact with the lower disk-shaped shutter 100 forms the above-mentioned component storage through holes 64, 64 ... Only the bottom surface of each of the cylindrical members 150, 150 ..., In the conventional structure, the contact area between the disk-shaped slider 54 and the contact area between the two is significantly reduced as compared with the contact area which is almost equal to the plane projected area. Will be possible. By thus reducing the contact area between the disk-shaped slider 54 and the disk-shaped shutter 100, it is possible to reduce the contact resistance due to foreign matter. Therefore, the contact between the disk-shaped slider 54 and the disk-shaped shutter 100 can be reduced. It becomes possible to secure the rotation function of.

Further, in FIG. 1, an air nozzle 200 for blowing compressed air toward the contact surface of the disk-shaped slider 54 and the disk-shaped shutter 100 is provided on the side of the contact surface. In this way, by blowing the compressed air from the air nozzle 200 toward the contact surface, it is possible to blow out foreign matter such as dust or dust that has entered this contact surface, and prevent foreign matter from entering. In addition, it is possible to prevent problems such as foreign matter entering from the contact surface adhering to the supplied chip-shaped circuit component and entering the component supply hole.

Next, FIGS. 6 and 7 show another embodiment of the present invention. As is apparent from these drawings, according to this other embodiment, the disk slider 54 and In order to reduce the contact area between the disk-shaped shutter 100 and the disk-shaped shutter 100, a recess is formed on the lower surface, which is the contact surface side of the disk-shaped slider 54, around the component storage through holes 64, 64 ... .. Specifically, the disk-shaped slider 54 is composed of upper and lower two disk-shaped plate members 54 and 54 ', cut out to the outer peripheral portion of the lower disk-shaped plate member 54', and these are combined to form a disk-shaped slider. 54 is formed.

It goes without saying that the same effects as those of the above-described embodiment of the present invention can be obtained by the other embodiments as well, and the air nozzle can be used together.

[0032]

[Effect of the device]

 As is apparent from the above description, according to the present invention, even if a foreign matter enters the contact surface between the disk-shaped slider and the disk-shaped slider, the disk shutter does not become unrotatable and the shutter function is not impaired. , Even if foreign matter enters the contact surface, it is blown off by compressed air to eliminate it, and it is possible to provide an improved chip-shaped circuit component supply device that can perform a reliable and good chip-shaped component distribution function. It has the excellent effect of becoming.

[Brief description of drawings]

FIG. 1 is a partial cross-sectional perspective view showing a detailed structure of a disk-shaped slider and a disk-shaped shutter that are essential parts of the present invention.

FIG. 2 is a perspective view showing an entire assembly structure of the disk-shaped slider and the disk-shaped shutter.

FIG. 3 is a developed perspective view illustrating a method of assembling the disc-shaped slider and the disc-shaped shutter.

FIG. 4 is a partial cross-sectional perspective view showing a structure of a chip-shaped circuit component supply device that employs the disk-shaped slider and the disk-shaped shutter.

FIG. 5 is a schematic perspective view of a chip-shaped circuit component mounting device to which the chip-shaped circuit component supply device is applied.

FIG. 6 is an overall perspective view showing a structure of a disk-shaped slider and a disk-shaped shutter according to another embodiment of the present invention.

FIG. 7 is a developed perspective view for explaining an assembling method of the other embodiment.

FIG. 8 is a partial cross-sectional perspective view illustrating the structures of a disk-shaped slider and a disk-shaped shutter in a conventional chip-shaped circuit component supply device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Container 11 Component conveyance path 49 Component discharge pipe 54 Disc slider 64 Component storage hole 100 Disc shutter 101 Component passage hole 150 Cylindrical member 200 Air nozzle

Claims (5)

[Reference number] 0030781-01 [Claims for utility model registration] 1. A chip-shaped circuit component supply device, wherein a container in which chip-shaped circuit components are stored in a bulk shape, a component discharge pipe having an upper end inserted into the container, and a bottom of the component discharge pipe And a slider disposed between the lower end of the component discharge pipe and the upper end of the component transport path, wherein the slider is a rotating disk-shaped plate body, A plurality of through holes for storing parts are formed around the rotation center, and the shutter is also a disk-shaped plate that rotates, and at a position corresponding to the through hole of the slider around the rotation center.
A plurality of through holes for passing parts having the same diameter as the through holes of the slider are opened, and the disk-shaped slider is located under the parts discharge pipe and slidably arranged on the disk-shaped shutter. With the rotation of the disk-shaped slider, chip-shaped circuit components are sequentially supplied from the component discharge pipe to the through holes for storing the components, and the relative rotation between the disk-shaped slider and the disk-shaped shutter is performed. Depending on the position, the chip-shaped circuit component housed in the through hole for storing the component is supplied to the component conveying path through the through hole for passing the component. Is smaller than the plane projected area of the disk-shaped slider. 2. In the above-mentioned claim 1, the same number of convex portions as the through holes for storing the components are formed on the bottom surface of the disk-shaped slider, and the through holes for storing the components penetrate the convex portions. A chip-shaped circuit component supply device characterized by being formed as follows. 3. The disk-shaped slider component storage hole according to claim 2, wherein a cylindrical member having a length longer than a thickness of the plate is projected downward into a hole formed in the slider plate. A chip-shaped circuit component supply device, which is inserted and fixed and is formed by an inner hole of the cylindrical member. 4. The chip shape according to claim 2, wherein a concave portion is formed on the bottom surface of the disk-shaped slider in the vicinity of the through hole for passing the component, and the concave portion is formed between the concave portions. Circuit component supply device. 5. The chip-shaped circuit component supply device according to claim 1, wherein an air nozzle for blowing compressed air is provided on a contact surface between a bottom surface of the disk-shaped slider and an upper surface of the shutter.