JP2001002242A - Electronic parts aligning and feeding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic parts aligning and feeding device in which durability is improved without applying mechanical stress to electronic parts. SOLUTION: An electronic parts aligning and feeding device 1 for aligning and conveying electronic parts, separating the aligned and conveyed electronic parts, and then feeding them to a next process is provided with a conveying passage 11 for aligning and conveying the electronic parts, air supplying means 8, 9 for supplying air from the upstream of the conveying passage 11 and then moving the electronic parts downstream by air pressure, an air shutting means 13 provided downstream of the air supplying means 8, 9 and for jetting out air approximately perpendicularly to the conveying direction of the electronic parts and shutting the conveyance of the electronic parts to be aligned and conveyed by stratums of the air flow by air jetting, a suction means 12 provided among the air supplying means 8, 9 and the air shutting means 13 and for sucking the electronic parts and stopping the electronic parts to be aligned and conveyed, and a passage confirming sensor 14 provided downstream of the suction means 12 and for detecting passage of the electronic parts.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component aligning and feeding device for aligning and transporting electronic components and separating the electronic components to be aligned and transporting the separated electronic components to a next process. The present invention relates to an electronic component alignment and supply device that does not apply mechanical stress to components.

[0002]

2. Description of the Related Art Chips (electronic parts) such as resistors are stored in a state where they are filled one by one at regular intervals in a tape for automatic mounting on a printed circuit board. The chips are transferred one by one on the circumference of the index table at equal intervals in order to perform a chip appearance inspection, a defect inspection, a polarity inspection, and the like as a pre-step of taping the chips. Therefore, it is necessary to transport chips in a separated state one by one before transfer to the index table. Therefore, the chips are aligned and transported by the electronic component alignment and supply device, and the chips are separated one by one.

[0003] A conventional electronic component aligning and feeding device is provided with a conveying section by a vibrating feeder and a chip separating section downstream of the conveying section. First, the manufactured chips are put into a parts feeder from a hopper. The parts feeder moves the chips in the circumferential direction, and conveys the chips in a line to a conveying path on the outer peripheral portion. Then, the parts feeder sends out the chips to the transport path of the vibration feeder. The vibrating feeder conveys the chips in a state of being aligned in a row by a conveying force due to vibration. At this time, each chip is transported in a state of being in contact with the preceding and following chips. Further, chips arranged in a line are separated one by one by a separation unit and transferred to an index table.

FIG. 7 is a sectional side view of a separating portion of a conventional electronic component aligning and feeding device. As shown in FIG. 7A, the separation unit 20 raises the needle 22 and interrupts the conveyance of the rows of chips C arranged in a line. After that, as shown in FIG. 7B, the separation unit 20 raises the wire pad 21 to remove the chips C, C,.
The chip C is pushed up and stopped. Then, the separation unit 20 lowers the needle 22 and removes the chips C, C,...
It is separated by the suction force of 4, 24 and sent out to the index table. At this time, the separation unit 20 detects the separation of the chip C by the separation sensor 23 and controls the timing at which the needle 22 and the wire pad 21 move up and down.

[0005]

A conventional electronic component aligning and feeding apparatus transports electronic components such as chips by a transport force generated by the vibration of a vibrating feeder, so that the electronic components are constantly vibrated. Further, in the separation section 20, the wire pad 21 presses the lower part of the chip C (electronic component), or the tip of the chip C (electronic component) presses the needle 22. For this reason, the conventional electronic component aligning and supplying device has given a mechanical stress to the electronic component. In particular, there is a case where the electronic component having a physically fragile structure is damaged by the vibration of the vibration feeder. Further, since the conventional electronic component aligning and feeding device always vibrates and transports the electronic components, a failure or the like is apt to occur, and there are also problems such as noise.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a silent electronic component aligning and supplying device in which the durability of the device itself is improved without applying mechanical stress to the electronic component.

[0007]

According to the present invention, there is provided an electronic component aligning and feeding apparatus according to the present invention, which aligns and transports electronic components, separates the electronic components to be aligned and transported, and supplies the separated electronic components to a next process. In the component aligning and supplying device, a transport path for aligning and transporting the electronic components, and an air transport unit that creates an air flow from upstream to downstream in the transport path and moves the electronic components by the air flow. It is characterized by. According to this electronic component aligning and supplying device, an air flow is created on the transport path from upstream to downstream in the transport direction, and the electronic components arranged by the transport force due to the air flow are moved. Do not give any stress.

Further, in the electronic component aligning and supplying device, the air transport means is constituted by air supply means for supplying air from upstream of the transport path and moving the electronic component downstream by air pressure. I do. According to this electronic component aligning and supplying device, the electronic components arranged on the transport path are moved by the pneumatic transport force, so that no mechanical stress is applied to the electronic components.

An electronic component aligning and supplying apparatus according to the present invention, which solves the above problems, aligns and transports electronic components, and separates the electronic components to be aligned and transported and supplies the separated electronic components to a next process. Air blowing means for blowing air in a direction perpendicular to the direction of transport of the electronic components, and air blocking means for blocking the transport of the aligned and transported electronic components by a layer of air flow by the air blowing, and upstream of the air blocking means. Suction means provided on a side of the electronic component, for sucking the electronic component and stopping the electronic component to be aligned and transported, wherein the suction device is configured to suck the electronic component to be aligned and transported, the transport of which is interrupted by the air shutoff device. After the suction in step (1), the blowing of air by the air shutoff means is stopped, and the electronic components downstream of the electronic components conveyed in a line are separated. According to this electronic component aligning and supplying apparatus, in order to separate the electronic components, suction is used to stop the electronic components to be aligned and transported, and an air flow layer is used to shut off the transport of the electronic components to be aligned and transported. It does not apply mechanical stress to electronic components.

In the electronic component aligning / supplying device, air supply means provided upstream of the air blocking means and the suction means for supplying air in a downstream direction and moving the electronic component downstream by air pressure. It is characterized by having. According to this electronic component aligning and supplying device, the electronic components are conveyed downstream by pneumatic pressure, so that no mechanical stress is applied to the electronic components.

[0011] Further, the invention is characterized in that a passage confirmation sensor is provided downstream of the suction means and detects passage of the electronic component. According to the electronic component aligning and supplying device, the separation of the electronic component can be reliably detected by the passage confirmation sensor, and the operation timing of the air shutoff unit and the suction unit can be accurately controlled.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic component aligning and supplying apparatus according to the present invention will be described in detail with reference to the drawings. 1 is a perspective view of the electronic component aligning and supplying device, FIG. 2 is a plan view of the electronic component aligning and supplying device of FIG. 1, FIG. 3 is a front view of the electronic component aligning and supplying device of FIG. 1, and FIG. (B) is a partially enlarged view near the conveyance path, FIG. 4 is a side view of the electronic component aligning and feeding device of FIG. 1,
5A and 5B are side cross-sectional views of a separation unit of the electronic component aligning and feeding device of FIG. 1, wherein FIG. 5A shows a state of being shut off by an air shutter, FIG. FIG. 6 is a flowchart showing the operation of the separation unit of the electronic component aligning and feeding device shown in FIG.

The electronic component aligning and supplying apparatus according to the present embodiment conveys chips sent in a line from a parts feeder and separates and supplies chips one by one to an index table. In this embodiment, a chip is used as an electronic component, and the chip is not particularly limited, such as a resistor and a transistor. In the present embodiment, the width direction is a direction perpendicular to the chip conveyance direction (in plan view).

First, referring to FIG. 1, a schematic configuration of an electronic component aligning and supplying device 1 and peripheral devices thereof will be described. The electronic component alignment and supply device 1 is disposed between the parts feeder PF and the index table IT. The parts feeder PF receives a large amount of chips from the hopper H via the belt conveyor BC, and moves the chips in a line by a guide. Then, the parts feeder PF transports the chips in a line to a transport path on the outer peripheral portion, and supplies the chips to the electronic component alignment and supply device 1. Electronic component alignment supply device 1
Consists of an aligning / conveying unit 2 and a separating unit 3. The aligning and transporting unit 2 calls in the chips conveyed in a line by an air flow, and arranges the chips in a line in contact with the front and rear chips to convey the chips. The separation unit 3 separates chips from the chip row one by one and supplies the chips to the index table IT. The index table IT is provided with a plurality of places on the circumference where chips are to be mounted at equal intervals, and the chips are sequentially mounted while rotating stepwise. By the way, every time the step is rotated, a chip appearance inspection, a defect inspection, a polarity inspection and the like are performed. Then, the chips that pass each inspection are taped. The next step in claims 1 to 5 is a step using the index table IT in the present embodiment. Further, the air conveying means in claims 1 and 2 is means for setting the power source for conveying the electronic components to air flowing from upstream to downstream of the conveying path, and in this embodiment, is constituted by an air supply means. .

Next, with reference to FIGS. 2 to 4, the configuration of the aligning and conveying unit 2 will be described in detail. The aligning and transporting unit 2 transports the chips C sent from the parts feeder PF in a state where the chips C arranged in a line and the preceding and following chips C are in contact with each other (see FIG. 1). The alignment transport section 2 mainly includes a main body 4, air supply plates 5, 5, a cover 6, air supply ports 8, 8, and air passages 9, 9.

The main body 4 comprises a rectangular parallelepiped part 4b and steps 4c, 4c above it (see FIG. 3). In addition, the main body 4
In a plan view, a cutout 4d having a shape along the outer peripheral shape of the parts feeder PF is formed (see FIGS. 1 and 2). The rectangular parallelepiped portion 4b extends from an end of the parts feeder PF to a lower portion of the index table IT (see FIG. 2). The rectangular parallelepiped portion 4b has the lower surface fixed to the first pedestal 7a of the pedestal 7, and the central portion of the upper surface becomes the transport path 11 for the chips C along the transport direction. By the way, the pedestal 7 is the first
A second pedestal 7c is fixed below the pedestal 7a via support members 7b,... And supports the electronic component alignment and supply device 1. The step portions 4c have stepped portions 4e formed in a single step toward the central axis CA. Also,
The step portions 4c, 4c form the transport path 11 by the inner side surfaces 4f, 4f rising vertically from the upper surface 4g of the rectangular parallelepiped portion 4b. The rising of the inner side surfaces 4f, 4f is slightly higher than the height of the chip C. In addition, the main body 4 is arranged at the center of the lower part of the aligning and conveying unit 2. Also,
Each member of the separation unit 3 is incorporated on the downstream side of the main body 4, and details thereof will be described later.

Further, the main body 4 defines the width of the conveying path 11 in the width direction between the inner side surfaces 4f of the steps 4c. Then, the chip C is formed by the inner side surfaces 4f, 4f.
Is restricted in the width direction. The length of the transport path 11 in the width direction is 0.1 to 0.2 m from the standard nominal size of the chip C.
The length is about m longer. Therefore, when the width of the chip C changes, the width of the transport path 11 also needs to be changed. Therefore, the interval between the inner side surfaces 4f, 4f of the steps 4c, 4c of the main body 4 is determined by the width of the chip C. Further, since the standard nominal size of the chip C has a slight error depending on the manufacturer, the fine adjustment can be made in the width direction by about 0.1 to 0.3 mm between the inner side surfaces 4f. In order to make fine adjustment in the width direction, the main body 4 has a divided structure of a first member 4h and a second member 4i along the transport direction. This first member 4h
The second member 4i is fixed with bolts (not shown) to enable fine adjustment in the width direction. The transport path in claims 1 and 2 is the transport path 11 in the present embodiment.
The upper surface 4g of the rectangular parallelepiped portion 4b of the main body 4 and the step portion 4
c, 4c. Incidentally, the transport path 11 is connected to the transport path of the parts feeder PF (see FIG. 1).

The air supply plates 5 and 5 have a rectangular parallelepiped shape, and the lower surface is fixed to the first pedestal 7a of the pedestal 7. The air supply plates 5, 5 are fixed to the outer surface of the main body 4 by a plurality of bolts 15,. Therefore,
The main body 4 and the air supply plates 5, 5 can be easily disassembled. The heights of the air supply plates 5 and 5 are substantially the same as the height of the main body 4 (see FIG. 3). Also,
The air supply plates 5 and 5 have air supply ports 8 and 8 on the outer surface.
Are respectively attached. Further, the air supply plate 5,
Air passages 9, 9 connected to the air supply ports 8, 8 are formed in the inside of the air supply port 5, respectively. The air passages 9 will be described later in detail.

The covers 6 and 6 are substantially L-shaped (as viewed from the front) and are plate-like (see FIG. 3). Further, the covers 6 and 6 are formed with a cutout 6c having a shape along the outer peripheral shape of the parts feeder PF in plan view (see FIGS. 1 and 2). The covers 6, 6 are provided with horizontal parts 6 a, 6 a and horizontal parts 6 a, 6
The vertical part 6b extends vertically downward from the inner front end of a (see FIG. 3). The vertical portion 6b has a shape that engages with the steps 4e, 4e of the steps 4c, 4c of the main body 4. The length extending below the vertical portion 6b is set so that the distance between the lower surface of the vertical portion 6b and the upper surface 4g of the main body 4 is slightly longer than the height of the chip C. The covers 6, 6 regulate the upward movement of the chips C moving on the transport path 11 by the vertical portions 6 b, 6 b to prevent the chips C from jumping out of the transport path 11. Further, the vertical part 6
b, 6b form an air passage together with the upper surface 4g of the rectangular parallelepiped portion 4b of the main body 4 and the inner side surfaces 4f, 4f of the steps 4c, 4c. In addition, the covers 6 and 6 are provided with the steps 4 c and 4 c of the main body 4.
4c are respectively arranged on the upper surface (see FIG. 3), and are respectively fixed by four screws 10,. Therefore, the main body 4 and the covers 6, 6 can be easily disassembled.

Note that the type of the chip C is changed and the chip C
Of the main body 4 and the vertical portions 6b, 6 having the shapes of the steps 4c, 4c corresponding to the external dimensions even if the external dimensions of the main body 4 change.
By replacing the cover 6 with the cover 6 having the shape b, the length of the conveying path 11 in the width direction can be changed.

The air supply ports 8 are connected to a pump (not shown) through tubes (not shown) to supply air to the air passages 9. The air supply ports 8, 8 are in the form of metal tubes, and are fixed to the outer surfaces of the air supply plates 5, 5 by nuts 8a, 8a, respectively. The supplied air pressure is 0.05 to 0.3 kg / cm ² .

The air passages 9, 9 are passages through which the air supplied from the air supply ports 8, 8 flows, and discharges the air onto the transport path 11. The air passage 9 includes an introduction passage 9a, a main passage 9
b, upstream discharge channel 9c, downstream discharge channel 9d, upstream discharge port 9
e, a downstream discharge port 9f, a separation discharge path 9g, and a separation discharge port 9h (see FIG. 2). The introduction path 9a is formed in the air supply plate 5, opens on the outer surface of the air supply plate 5, and is connected to the main passage 9b. The air supply port 8 is fixedly provided at a position where the introduction path 9a opens. The main passage 9b is formed in the air supply plate 5,
Extends in the transport direction. The upstream discharge passage 9c is formed in the main body 4, and is connected from the upstream end of the main passage 9b to the upstream discharge port 9e. In order to change the flow direction of the air discharged to the transport path 11 from the upstream side to the downstream side in the transport direction, the upstream discharge path 9
c is formed to be inclined downstream (as viewed in plan) from the outside toward the inside (in plan view) (see FIG. 2). 9d downstream discharge path
Is formed in the main body 4 and is connected to the downstream discharge port 9f from the downstream side of the main passage 9b. In addition, in order to change the flow direction of the air discharged to the transport path 11 from the upstream side to the downstream side in the transport direction, the downstream discharge path 9d is formed to be inclined downstream (in plan view) from the outside to the inside. (See FIG. 2). The upstream discharge port 9 e opens on the inner side surface 4 f of the main body 4 and discharges air onto the transport path 11. The upstream discharge port 9e is connected to the conveyance path 1
1, and discharges air supplied from the air supply port 8 from upstream to downstream of the carry-out path 11. Incidentally, the air pressure generated by the air discharged from the upstream discharge port 9 e mainly serves as a conveying force in the alignment conveying section 2. Downstream outlet 9f
Opens on the inner side surface 4f of the main body 4 to discharge air onto the transport path 11. The downstream discharge port 9f is located on the downstream side of the transport path 11, and supplies the air supplied from the air supply port 8 to the discharge path 11
Discharge in the downstream direction. The separation discharge path 9g is formed in the main body 4, and is connected to the separation discharge port 9h from the downstream end of the main passage 9b. In order to change the flow direction of the air discharged to the transport path 11 from the upstream side to the downstream side in the transport direction, the separation discharge path 9g is formed so as to be inclined toward the downstream side as viewed from the outside to the inside (in plan view). (See FIG. 2). The separation outlet 9 h is opened on the inner side face 4 f of the main body 4,
Discharge air up. The separation outlet 9h is connected to the transport path 11
, And discharges air supplied from the air supply port 8 in the downstream direction of the carry-out path 11. Incidentally, the air pressure due to the air discharged from the separation outlet 9h mainly serves as a conveying force in the separation unit 3. In the present embodiment, the air supply means in the second embodiment comprises air supply ports 8, 8, air passages 9, 9, tubes (not shown), and pumps (not shown).

Next, the operation of the aligning and conveying section 2 will be described with reference to FIGS. The parts feeder PF is
The chips C are transported in a line, and the chips C are sent out to the alignment transport section 2 of the electronic component alignment and supply device 1. The aligning / conveying unit 2 always discharges air from the upstream discharge ports 9e, 9e, the downstream discharge ports 9f, 9f and the separation discharge ports 9h, 9h.
Air is flowing from upstream to downstream. For this reason, the aligning and transporting unit 2 is configured such that the upstream outlets 9 e and 9
The upstream side of e is set in a substantially vacuum state, and the chips C sent from the parts feeder PF are sucked and guided to the transport path 11.
Then, the alignment transport unit 2 moves the chips C in the downstream direction of the transport path 11 by air pressure. At this time, chip C
Since the chips are constantly pressed in the downstream direction by air pressure, the chips C are aligned and conveyed in a row in contact with the adjacent chips C on the downstream side. The width direction of the chip C is regulated by the inner surface 4f of the step portion 4c of the main body 4, and the upper part is regulated by the vertical portions 6b, 6b of the covers 6, 6, so that the one-row alignment is ensured.

According to the aligning and transporting unit 2 of the electronic component aligning and feeding device 1, the chips C are transported by air pressure.
No mechanical stress is applied to the chip C due to vibration. In addition, since the device itself is not affected by the vibration, the durability is improved.

Next, referring to FIG. 2 to FIG.
Will be described in detail. The separation unit 3 separates the chips C that are aligned and conveyed in a state where the main members are incorporated in the downstream part of the alignment and conveyance unit 2 and are in contact with the alignment and conveyance unit 2 one by one, and sends them to the index table IT. Separation unit 3
Is mainly composed of air supply ports 8, 8, air passages 9, 9, vacuum 12, air shutter 13, transmission type sensor 14, and control unit (not shown). The transfer of the chips C to the index table IT utilizes the suction force of the index table suction means 16.

Since the air supply ports 8, 8 and the air passages 9, 9 have been described with reference to the configuration of the aligning / conveying section 2, detailed description will be omitted. In the present embodiment, the air supply means in claims 4 and 5 comprises air supply ports 8, 8, air passages 9, 9, tubes (not shown), and pumps (not shown). By the way, in the separation unit 3, mainly
The air discharged from the separation outlets 9h, 9h acts.

The vacuum 12 mainly includes the suction passage 1
2a, an air suction port 12b, a nut 12c, a tip suction port 12d, a tube 12e, and a suction pump (not shown). The suction passage 12a is provided in the main body 4,
Is a through hole penetrating from the upper surface to the lower surface. Suction passage 12
“a” is a passage connecting the air suction port 12b and the chip suction port 12d, and suction air flows. The air suction port 12b is connected to a suction pump (not shown) via a tube 12e, and sucks air. The air suction port 12b is in the form of a metal tube, and is fixed to the lower surface of the main body 4 by a nut 12c. The tip suction port 12d is opened in the upper surface 4g of the main body 4, and is connected to the suction passage 12a. The tip suction port 12d is
It is opened on the central axis CA of the transport path 11 between the separation outlets 9h, 9h and the air outlet 13d of the air shutter 13 in the transport direction and in the width direction. Vacuum 12
Sucks the lower surface of the chips C conveyed in the conveyance path 11 from the chip suction port 12d to stop the movement of the chip C row. Therefore, the suction pressure of the vacuum 12 is set to a value at which the suction force exceeds the conveying force due to the air pressure from the air supply ports 8, 8 and the air passages 9, 9, and the like. The suction means in claims 3 to 5 is the vacuum 12 in the present embodiment.

The air shutter 13 mainly includes an air passage 13a, an air supply port 13b, a nut 13c, an air outlet 13d, a tube 13e, and a pump (not shown). The air passage 13 a is a through hole provided in the main body 4 and penetrating from the upper surface to the lower surface of the main body 4. Air passage 13a
Is a passage connecting the air supply port 13b and the air ejection port 13d, and the supply air flows. The air supply port 13b is connected to a pump (not shown) via a tube 13e to supply air. The air supply port 13b has a metal tube shape,
It is fixed to the lower surface of the main body 4 by a nut 13c. The air ejection port 13d opens in the upper surface 4g of the main body 4 and is connected to the air passage 13a. The air ejection port 13d is provided between the chip suction port 12d of the vacuum 12 and the transmission sensor 14 in the transport direction and on the center axis CA of the transport path 11 in the width direction. In order to separate the chips C one by one from the row of chips C, the air ejection port 13d and the chip suction port 1
The interval of 2d may be in a range larger than (the length in the transport direction of the chip C × 1) and smaller than (the length in the transport direction of the chip C × 2). X 1.5). The air shutter 13 ejects air upward from the air ejection port 13d in the direction perpendicular to the transport direction to form a layer of airflow on the transport path 11. Then, the air shutter 13 blocks the transport of the array of chips C transported along the transport path 11 by the layer of the airflow. Although the direction in which the air is ejected is perpendicular to the transport direction, it is sufficient that an air flow layer capable of blocking the transport of the chips C can be formed, and the direction does not have to be strictly perpendicular. By the way, the ejection pressure of the vacuum 13 is 1-3 kg / cm
^{Assume 2} . The air blocking means in claims 3 to 5 is the air shutter 13 in the present embodiment.

The transmission sensor 14 mainly includes a light emitting side optical fiber 14a, a light receiving side optical fiber 14b, a light emitting element (not shown), a light receiving element (not shown), and a detection circuit (not shown). The light emitting side optical fiber 14a is provided with a light emitting element at one end, and emits light from the other end 14c.
The light emitting side optical fiber 14a is connected to the transport path 11 from the other end 14c.
Is mounted so as to emit light upward from below. In order to attach the light-emitting side optical fiber 14a, the main body 4 is formed with a through hole 4a penetrating from the upper surface to the lower surface (see FIG. 5). The light emitting side optical fiber 14a is inserted into the through hole 4a, the other end 14c is disposed at a position slightly lower than the upper surface of the main body 4, is attached to the main body 4, and nuts 14e, 14e are attached to the second pedestal 7c. It is fixed in. The light receiving side optical fiber 14b is provided with a light receiving element at one end, and receives light emitted from the light emitting side optical fiber 14a at the other end 14d. Therefore, the light receiving side optical fiber 14b is disposed with the other end 14d facing downward with respect to the other end 14c, and is supported by the support member 14f.
The light emitting element always emits light and is, for example, an element such as a light emitting diode. The light receiving element generates a voltage when receiving light, and is, for example, an element such as a photodiode or a phototransistor. The detection circuit is connected to the light receiving element and measures a time during which the voltage is not generated (that is, a time during which the light receiving side optical fiber 14b is not receiving light). If the time during which no light is received is within the predetermined time range, it is determined that one chip C has passed between the light emitting side optical fiber 14a and the light receiving side optical fiber 14b. This predetermined time range is
A range calculated from the transport direction length of the chip C and the transport speed of the electronic component aligning and feeding device 1 and having a margin of about 10% with respect to the time during which one chip C is transported by the transport direction length of the chip C. It is. Note that the passage confirmation sensor in claim 5 is the transmission sensor 14 in the present embodiment.

The control unit (not shown) controls the operation of the separation unit 3 and separates the chips C one by one. For this purpose, the control unit fetches information such as the operation status of the index table IT and confirmation of the passage of the chip C of the transmission sensor 14.
Then, the control section determines the start / stop of suction of the vacuum 12 and the start / stop of air ejection of the air shutter 13, and determines the timing of the vacuum 12 and the air shutter 13.
To instruct.

Incidentally, the index table suction means 16 mainly includes a suction passage 16a and an air suction port 16a.
b, nut 16c, tip suction port 16d, tube 16
e) and a suction pump (not shown). Suction passage 16
a is a through hole provided in the main body 4 and penetrating from the upper surface to the lower surface of the main body 4. The suction passage 16a is provided with the air suction port 16
It becomes a passage connecting b and the tip suction port 16d, and suction air flows. The air suction port 16b is connected to a suction pump (not shown) via a tube 16e, and sucks air. The air suction port 16b is in the form of a metal tube and has a nut 16c.
Thus, it is fixed to the lower surface of the main body 4. Tip suction port 16
d is opened to the upper surface 4g of the main body 4 and connected to the suction passage 16a. The tip suction port 16d is opened on the center axis CA of the transport path 11 downstream of the transmission sensor 14 in the transport direction and in the width direction, and is located below the outer peripheral portion of the index table IT. The index table suction means 16 suctions the lower surface of the chip C conveyed in the conveyance path 11 from the chip suction port 16d, and
The chip C is transferred to T.

Next, the operation of the separating unit 3 will be described with reference to FIGS.
First, the appearance inspection, the defect inspection, the polarity inspection, and the like are completed in the index table IT. Then, the index table IT rotates one step, and preparation for mounting the next chip C on the index table IT is completed (S1). Incidentally, the information on the completion of the preparation is transmitted to the control unit.

Then, the control unit instructs the vacuum 12 to start suction. Then, the vacuum 12 is replaced with the chip C
Is started (S2). By the way, vacuum 12
Before the start of suction, the air ejection from the air shutter 13 is continuously performed, and the transport of the chip C row is interrupted by the layer of the air flow (see FIG. 5A).

After the start of suction by the vacuum 12, the air shutter 13 stops blowing air in response to an instruction from the control unit (S3). Then, the most downstream chip C1 of the row of chips C, which has been blocked from being conveyed by the air shutter 13, starts moving downstream and is separated from the upstream row of chips C (S
4). That is, the air ejection port 13d and the tip suction port 12
Since the interval d is set to (the length in the transport direction of the chip C × 1.5), when the transport of the array of chips C is interrupted by the air shutter 13, the vacuum 12 moves from the most downstream position of the array of chips C. The second chip C2 is sucked (FIG. 5
(A)). Therefore, when the layer of the air flow by the air shutter 13 is lost, the chip C2 on the upstream side from the chip C2
Since the row is stopped by the vacuum 12, the lowermost chip C1
Only moves in the downstream direction (see FIG. 5B).

The separated chip C 1 moves downstream and passes through the transmission sensor 14. At this time, the transmission sensor 14 confirms that the chip C1 has passed (S5). Then, the passage confirmation information of the transmission sensor 14 through the chip C1 is transmitted to the control unit. Incidentally, in the state shown in FIG. 5A, that is, when the chip C is not moving between the light emitting side optical fiber 14a and the light receiving side optical fiber 14b of the transmission type sensor 14, the transmission type sensor 14 Is received by the light receiving element. Then, when the chip C1 is separated and is in the state shown in FIG. 5B, that is, when the chip C1 is moving between the light-emitting side optical fiber 14a and the light-receiving side optical fiber 14b of the transmission type sensor 14, the transmission type sensor is not used. Sensor 1
In No. 4, light from the light emitting element cannot be received by the light receiving element. Further, when the chip C1 moves to the downstream side and is in the state shown in FIG. 5C, that is, after the chip C1 completes the movement between the light emitting side optical fiber 14a and the light receiving side optical fiber 14b of the transmission type sensor 14. The transmission sensor 14 receives the light of the light emitting element again by the light receiving element. And the transmission type sensor 14
Measures the time during which light cannot be received by the light receiving side optical fiber 14b, and determines whether the time during which light cannot be received is within the above-described predetermined time range. If it is within the predetermined time range, it is determined that the chip C1 has passed.

When receiving the information of confirming passage of the chip C1, the control unit instructs the air shutter 13 to eject air.
Then, as shown in FIG.
Initiates air ejection and forms a layer of airflow (S
6).

After instructing the air shutter 13 to eject air, the control unit instructs the vacuum 12 to stop suction. Then, the vacuum 12 stops the suction and opens the chip C2 (S7). As a result, as shown in FIG.
Again, the conveyance of the row of chips C is interrupted by the layer of the airflow of the vacuum 13.

By the way, the separated chip C1 whose passage has been confirmed moves to the downstream side, is finally sucked by the index table suction means 16, and is placed on the index table IT (S8).

Then, the control unit confirms whether or not the supply of the chip C to the index table IT has been completed (S9). Then, when the supply is completed, the process is terminated, and when the supply is not completed, the process returns to step S8.

Incidentally, in the separation section 3, air is always discharged from the separation outlets 9h, 9h, and the air flows downstream on the transport path 11. Therefore, in the separation unit 3, the chips C are transported downstream by air pressure.

According to the separating section 3 of the electronic component aligning and feeding device 1, the chips C are separated in order to separate the chips C one by one.
Is carried out by air pressure, and the transportation of the chip C row is cut off by suction to stop the transportation of the air flow layer and the chip C row.
No mechanical stress is applied to the chip C.

As described above, the present invention is not limited to the above-described embodiment, but can be embodied in various forms. For example, although the air conveying means is constituted by the air supply means, a structure may be employed in which electronic components are moved by suction force from the downstream side of the conveying path and conveying force by negative pressure. Further, although the passage confirmation sensor is configured by a transmission type sensor using an optical fiber, it can be configured by various sensors such as a sensor using ultrasonic waves or infrared rays. In addition, although the air flow layer is formed in the vertical direction by the air shutter as the air blocking means, the air flow layer may be any direction such as a horizontal direction or a direction perpendicular to the electronic component transport direction.

[0043]

According to the electronic component aligning and feeding apparatus according to the first aspect of the present invention, since the power source for transporting the electronic component is the air flowing from the upstream to the downstream of the transport path, the conventional method for supplying the electronic component to the vibration by the vibration is used. No mechanical stress. Furthermore, since the device itself is not affected by the vibration, the durability of the electronic component alignment and supply device is improved, and the noise is reduced.

According to the electronic component aligning and feeding device according to the second aspect of the present invention, since the power source for transporting the electronic component is the air pressure from the upstream side of the transport path, the mechanical force to the electronic component due to the conventional vibration is obtained. Do not stress.

According to the electronic component aligning and feeding apparatus according to the third aspect of the present invention, the electronic components are aligned and conveyed by sucking off the layer of the air flow and stopping the electronic components to be conveyed. Since the downstream electronic component is separated from the electronic component, the electronic component does not have mechanical contact with other members. Therefore, no mechanical stress is applied to the electronic component.

According to the electronic component aligning and supplying apparatus of the fourth aspect, since the power source for transporting the electronic components is pneumatic, no mechanical stress is applied to the electronic components.

According to the electronic component aligning / supplying device according to the fifth aspect of the present invention, the passage of the electronic component can be detected with high accuracy by the passage confirmation sensor. Can be controlled with high precision.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component alignment and supply device according to an embodiment.

FIG. 2 is a plan view of the electronic component alignment and supply device of FIG. 1;

FIG. 3 is a front view of the electronic component aligning and feeding device of FIG. 1;
(A) is an overall view, and (b) is a partially enlarged view near a conveyance path.

FIG. 4 is a side view of the electronic component aligning and feeding device of FIG. 1;

5A and 5B are side cross-sectional views of a separation unit of the electronic component aligning and feeding device of FIG. 1, wherein FIG.
(C) is after passage confirmation by the transmission type sensor, and (c) is after passage confirmation by the transmission type sensor.

FIG. 6 is an operation flowchart of a separating unit of the electronic component aligning and feeding device of FIG. 1;

FIGS. 7A and 7B are side sectional views of a separation unit of the conventional electronic component aligning and feeding device, wherein FIG. 7A shows a state when a chip row is interrupted by a needle, and FIG. 7B shows a state when a chip is separated by a wire pad and a needle.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Electronic component alignment supply apparatus 2 ... Alignment conveyance part 3 ... Separation part 4 ... Main body 5 ... Air supply plate 6 ... Cover 8 ... Air supply port (air supply means) 9 ... air passage (air supply means) 11 ... conveyance path 12 ... vacuum (suction means) 13 ... air shutter (air cutoff means) 14 ... transmission type sensor (passage confirmation sensor) C: Chip IT: Index table PF: Parts feeder

Claims (5)

[Claims] 1. An electronic component aligning and feeding device for aligning and transporting electronic components and separating and feeding the electronic components to be aligned and transported to a next process, wherein: a transport path for aligning and transporting the electronic components; Air supply means for creating an air flow from upstream to downstream and moving the electronic component by the air flow. 2. The electronic device according to claim 1, wherein said air conveying means comprises air supplying means for supplying air from upstream of said conveying path and moving said electronic component downstream by air pressure. Parts alignment supply device. 3. An electronic component aligning and feeding device for aligning and transporting electronic components and separating and feeding the electronic components to be aligned and transported to a next step, wherein air is blown in a direction perpendicular to a transport direction of the electronic components. An air shutoff means for blowing off the electronic components to be aligned and conveyed by a layer of the air flow by the air jet; and an air shutoff means provided upstream of the air shutoff means for sucking the electronic components and carrying the aligned and conveyed electronic components. Suction means for stopping the electronic components to be stopped.After suctioning the aligned and conveyed electronic components, the conveyance of which is interrupted by the air shutoff means, by the suction means, stopping the blowing of air by the air shutoff means. An electronic component aligning and feeding device for separating an electronic component downstream of the electronic component to be aligned and conveyed. 4. An air supply means provided upstream of the air shutoff means and the suction means, for supplying air downstream and moving the electronic component downstream by air pressure. 3. The electronic component alignment and supply device according to 3. 5. The electronic component aligning and supplying device according to claim 3, further comprising a passage confirmation sensor provided downstream of the suction unit and configured to detect passage of the electronic component.