JP5405266B2 - Electronic component conveyor - Google Patents

Electronic component conveyor Download PDF

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JP5405266B2
JP5405266B2 JP2009246891A JP2009246891A JP5405266B2 JP 5405266 B2 JP5405266 B2 JP 5405266B2 JP 2009246891 A JP2009246891 A JP 2009246891A JP 2009246891 A JP2009246891 A JP 2009246891A JP 5405266 B2 JP5405266 B2 JP 5405266B2
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electronic component
means
transport
conveying
matrix
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JP2011093628A (en
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仁 斎藤
剛 佐藤
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シャープ株式会社
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Description

  The present invention relates to an electronic component transport apparatus, and more particularly to an electronic component transport apparatus capable of transporting a plurality of electronic components such as LED chips attached to a sheet in a matrix while separating them into individual electronic components. It is.

  In recent years, from the viewpoint of protecting the global environment, LED chips that do not contain harmful substances and are suitable for miniaturization and longer life have been widely recognized as power-saving lighting components and are used in many fields. And with the widespread use of LED chips, there is an increasing demand for cost reduction.

  In the characteristic inspection such as the luminous flux and chromaticity of the LED, it is necessary to divide the matrix-like LED chip attached to the UV sheet into individual LED chips. Here, conventionally, electronic parts such as LED chips are separated into a plurality of electronic parts attached to a sheet and supplied to a parts feeder (P / F) which is an individual parts conveyance table. In (P / F), the front and back surfaces and orientations of the electronic components are aligned to be constant, and are conveyed in a line in a linear feeder (L / F) (see, for example, Patent Document 1).

  FIG. 8 is a conceptual diagram for explaining a conventional electronic component conveying apparatus. As shown in FIG. 8, the electronic component transport apparatus 100 includes a parts feeder 101 and a linear feeder 102. In the electronic component transport apparatus 100, the plurality of matrix-like LED chips 2 a attached to the UV sheet 6 are separated into pieces and put into the parts feeder 101. Then, the direction of the electrodes is aligned in a predetermined direction by the vibration frequency matched to the package size of each LED chip 2 and the back surface pattern recognition. Thereafter, the LED chip 2 is supplied to the linear feeder 102 and conveyed to a target location.

  In addition to this, there is known an electronic component supply device that aligns electronic components in a certain direction by curving a linear feeder and blowing air to the curved portion (see, for example, Patent Document 2).

JP 2007-153578 A (released on June 21, 2007) Japanese Patent Laid-Open No. 7-157055 (released on June 20, 1995)

  However, the parts feeder 101 and the linear feeder 102 included in the electronic component transport apparatus 100 as described above are very expensive and require a long manufacturing period. When the package size and shape of the LED chip 2 are changed, it is necessary to newly manufacture the parts feeder 101 and the linear feeder 102 in accordance with the changed package size and shape. For this reason, the increase in the manufacturing cost of the electronic component conveying apparatus 100 is caused, and the cost reduction of the LED chip 2 is hindered.

  Further, in the electronic component transport apparatus 100, the LED chips 2 that are randomly separated and then randomly inserted into the parts feeder 101 are aligned in a predetermined direction by vibration. For this reason, in the electronic component transport apparatus 100, the LED chips 2 may collide with each other at the time of loading and vibration, and the LED chip 2 may be damaged by the impact.

  Furthermore, in the electronic component transport apparatus 100, the electronic component substrate generated when the LED chips 2 are bonded to each other (see 2c in FIG. 8) or lost due to the resin protruding from these impacts, or when the LED chips 2 are separated into individual pieces. The LED chip 2 may not be properly supplied to the linear feeder 102 due to the burr (see 2d in FIG. 8). In addition, when the LED chip 2 enters the linear feeder 102 obliquely (see 2e in FIG. 8), the LED chip 2e cannot be stably conveyed, which may cause clogging and stop operation. Have.

  The present invention has been made in view of the above-described conventional problems, and an object of the present invention is to divide a plurality of matrix-shaped electronic components attached to a sheet into individual electronic components and stably convey them. It is to realize an electronic component conveying apparatus capable of performing the above.

  In order to solve the above-described problems, an electronic component transport apparatus according to the present invention is an electronic component transport apparatus that transports a plurality of matrix-shaped electronic components attached to a sheet while being separated into individual pieces. A first conveying means for conveying an electronic component; a peeling means for peeling the sheet from the matrix-shaped electronic component; and the matrix-like shape provided on the downstream side of the first conveying means and from which the sheet has been peeled off First separating means for separating the electronic components into a plurality of rows of electronic components, second conveying means for carrying the rows of electronic components in the direction in which the electronic components are arranged, and the first And a second separation means for separating the row-shaped electronic components into individual electronic components, wherein the first separation means conveys the matrix-shaped electronic components. The first sloping in the direction The matrix-shaped electronic component having a slope and having the sheet peeled off is slid on the first inclined surface for each row aligned in a direction perpendicular to the transport direction. It is characterized by moving to a conveying means.

  According to the above invention, the sheet is peeled from the plurality of matrix-shaped electronic components by the peeling means, and the matrix-shaped electronic components are separated into the column-shaped electronic components by the first separating means. Here, the first separation means has a first inclined surface, and the matrix-shaped electronic component slides on the first inclined surface for each row arranged in a direction perpendicular to the transport direction. Thereby, the matrix-shaped electronic components are separated into the row-shaped electronic components without changing the front and back sides and the orientation of each electronic component.

  Therefore, unlike the conventional electronic component conveyance device, the matrix-shaped electronic components can be conveyed while being separated into pieces without using the parts feeder and the linear feeder. For this reason, the manufacturing cost of an electronic component conveyance apparatus can be reduced, and it can contribute to the cost reduction of an electronic component by this.

  According to the above invention, the plurality of electronic components are put into the electronic component conveying device in a state of being stuck on the sheet in a matrix shape, and are separated into pieces with the respective electronic components aligned in a predetermined direction. For this reason, electronic components that are randomly put into parts feeders in separate parts feeders, such as a conventional electronic component transport device that aligns them in a predetermined direction by vibration, when they are put in and at vibration, They don't collide with each other. Thereby, it can prevent damaging an electronic component by the impact which electronic components collide with.

  Further, according to the above invention, the transportation means of the transportation means caused by the bonding or chipping of the electronic parts due to the resin protruding by these impacts, or the burrs of the electronic part substrate generated when the electronic parts are separated. Since clogging can be prevented, the electronic component can be stably transported to an arbitrary transport destination.

  As described above, according to the above-described invention, it is possible to realize an electronic component transport apparatus capable of stably transporting a plurality of matrix electronic components attached to a sheet into individual electronic components. it can.

  Moreover, in the electronic component transport apparatus of the present invention, the second separating means has a second inclined surface inclined in the transport direction of the row-shaped electronic components, and the row-shaped electronic components are individually It is preferable to slide on the second inclined surface for each electronic component.

  According to the above invention, the row-shaped electronic components can be separated into the individual electronic components by sliding the second inclined surface for each individual electronic component.

  In the electronic component conveying apparatus of the present invention, the peeling means is a plate disposed on the first conveying means so as to be inserted into an adhesive surface between the sheet and the matrix-shaped electronic component. It is preferable.

  According to the above invention, the peeling means for automatically peeling the sheet from the matrix-shaped electronic component can be created at a low cost.

  In the electronic component conveying apparatus of the present invention, the first or second conveying means may be a plurality of rollers or a belt conveyor.

  Moreover, in the electronic component conveying apparatus of the present invention, it is preferable that the electronic component conveying apparatus further includes a suction unit that sucks the sheet peeled from the matrix-shaped electronic component.

  According to the said invention, the sheet | seat peeled from the matrix-shaped electronic component can be discharged | emitted from a specific position. As a result, it is possible to prevent the electronic component transport apparatus from being stopped due to the rolled-in sheet.

  Moreover, in the electronic component conveying apparatus of the present invention, it is preferable that the first conveying unit is a plurality of rollers, and any one of the plurality of rollers is provided with the adsorbing unit.

  According to the above invention, since the suction means is incorporated in the first transport means, the electronic component transport device can be reduced in size.

  In the electronic component conveying apparatus of the present invention, it is preferable that the first conveying means is a belt conveyor, and the suction means is provided on the belt conveyor.

  According to the above invention, since the suction means is incorporated in the first transport means, the electronic component transport device can be reduced in size.

  In the electronic component transport apparatus of the present invention, it is preferable that the first transport unit and the second transport unit have a transport direction that is approximately 90 degrees different.

  According to the said invention, a row-shaped electronic component can be easily conveyed in the direction where the said electronic component is located in a line, maintaining a row-shaped arrangement | positioning.

  Moreover, in the electronic component transport apparatus of the present invention, the row of electronic components that have slid on the first inclined surface are replaced with the other row of electronic components that are placed on the second transport means. It is preferable to stop the first conveying means intermittently so as not to contact.

  According to the invention, it is possible to reliably prevent the columnar electronic components from colliding with each other and to separate the matrix electronic components into the columnar electronic components.

  In the electronic component conveying apparatus of the present invention, it is preferable that the first conveying means or the second conveying means can be exchanged according to the size of the electronic component to be conveyed.

  According to the above invention, even if there is a change in the size of the electronic component to be transferred, the size can be easily adjusted to the changed size by exchanging the first transfer means and the second transfer means. it can. Thereby, the manufacturing cost accompanying the design change of an electronic component conveying apparatus can be reduced.

  Moreover, in the electronic component conveying apparatus of the present invention, it is preferable that the first inclined surface can be replaced according to the size of the electronic component to be slid.

  According to the said invention, even if it is a case where there is a size change of the electronic component which slides a 1st inclined surface, it can match | combine to the size after a change easily. Thereby, the manufacturing cost accompanying the design change of an electronic component conveying apparatus can be reduced.

  Moreover, in the electronic component conveying apparatus of the present invention, the second conveying means is intermittently stopped so that the individual electronic components that have slid on the second inclined surface do not contact other preceding electronic components. It is preferable.

  According to the above invention, it is possible to reliably prevent the electronic components from colliding with each other and to separate the row-shaped electronic components into individual electronic components.

  Moreover, in the electronic component conveying apparatus of the present invention, it is preferable that the second inclined surface can be exchanged according to the size of the electronic component to be slid.

  According to the said invention, even if it is a case where there is a size change of the electronic component which slides a 2nd inclined surface, it can match | combine to the size after a change easily. Thereby, the manufacturing cost accompanying the design change of an electronic component conveying apparatus can be reduced.

  Moreover, in the electronic component transport apparatus of the present invention, the second separation unit has a mounting surface having a transport speed higher than that of the second transport unit, and the row of electronic components is divided into individual electronic components. Moreover, the structure mounted in the above-mentioned mounting surface may be sufficient.

  According to the above invention, since the transport speed of the mounting surface of the second separation unit is higher than the transport speed of the second transport unit, the interval between the columnar electronic components is widened. Thereby, the row-shaped electronic components can be separated into individual electronic components.

  In the electronic component transport apparatus according to the present invention, the second separating means includes a transport arm, and the row-shaped electronic components are mounted on the transport arm for each individual electronic component. May be.

  According to the said invention, the 2nd isolation | separation means which can isolate | separate a row-shaped electronic component into each electronic component can be implement | achieved.

  Moreover, in the component conveying apparatus of this invention, it is electronic that the said peeling means and a said 1st separation means consist of one member.

  According to the said invention, the structure of an electronic component conveying apparatus can be simplified and manufacturing cost can be reduced.

  In the electronic component conveying apparatus of the present invention, it is preferable that the electronic component conveying apparatus further includes a sheet conveying unit that conveys the sheet peeled from the matrix-shaped electronic component while adsorbing the sheet.

  According to the said invention, it can convey to arbitrary conveyance destinations, without dropping the peeled sheet | seat.

  As described above, the electronic component transport apparatus according to the present invention includes the first transport unit that transports the matrix-shaped electronic component, the peeling unit that strips the sheet from the matrix-shaped electronic component, and the first A first separating means for separating the matrix-shaped electronic component from which the sheet has been peeled off, into the plurality of rows of electronic components, and the row of electronic components, A second transport unit that transports the electronic components in the direction in which the electronic components are arranged; and a second separation unit that is provided downstream of the second transport unit and separates the row of electronic components into individual electronic components. The first separating means has a first inclined surface that is inclined in the conveying direction of the matrix-shaped electronic component, and the matrix-shaped electronic component from which the sheet has been peeled is the conveying direction. Are aligned in a direction perpendicular to For each column, it is configured to move to the second conveying means by sliding the first inclined surface.

  Therefore, there is an effect that it is possible to realize an electronic component conveying apparatus that can divide a plurality of matrix electronic components attached to a sheet into individual electronic components and stably convey them.

It is a perspective view which shows the electronic component conveying apparatus which concerns on Embodiment 1. FIG. It is a perspective view which shows the electronic component conveying apparatus which concerns on Embodiment 1. FIG. It is a perspective view which shows the adsorption | suction roller with which the electronic component conveying apparatus which concerns on Embodiment 1 is provided. It is a top view which shows the rotation stage with which the electronic component measuring apparatus connected to the electronic component conveying apparatus which concerns on Embodiment 1 is provided. It is a perspective view which shows the sheet conveyance means with which the electronic component conveying apparatus which concerns on Embodiment 1 is provided. It is a perspective view which shows the separation conveyance mechanism with which the electronic component conveyance apparatus which concerns on Embodiment 2 is provided. It is a perspective view which shows the separation conveyance arm mechanism with which the electronic component conveyance apparatus which concerns on Embodiment 3 is provided. It is a figure for demonstrating the conventional electronic component conveying apparatus.

Embodiment 1
The first embodiment relating to the electronic component conveying apparatus of the present invention will be described below with reference to FIGS. In the present embodiment, a case will be described in which a plurality of LED chips affixed to a UV sheet in a matrix are conveyed while being singulated using the electronic component conveying apparatus of the present invention.

(Configuration of electronic component transport device 1)
FIG. 1 is a perspective view showing a part of an electronic component transport apparatus 1 according to the present embodiment. In FIG. 1, among members constituting the electronic component transport apparatus 1, a first transport means 10, a peeling plate (peeling means) 20, a first separation plate (first separation means) 30, and a second The conveying means 40 is shown. In addition, a sensor 7 a is disposed above the connection portion between the first separation plate 30 and the second transport means 40.

  The 1st conveyance means 10 mounts the some LED chip (electronic component) 2 stuck on UV sheet | seat (sheet) 6, and conveys it in the direction of arrow D1. Here, a plurality of LED chips 2 are affixed in a matrix on the UV sheet 6, and these LED chips 2 are hereinafter referred to as a matrix-shaped LED chip (matrix-shaped electronic component) 2a. The first transport unit 10 has a configuration in which a plurality of rollers 11 and an adsorption roller 12 are arranged in parallel, and the adsorption roller 12 is arranged on the downstream side of the roller 11. The suction roller 12 has a vacuum function, and can thereby suck the UV sheet 6. A detailed description of the suction roller 12 will be described later. The member which comprises the 1st conveying means 10 is not specifically limited, A belt conveyor etc. can be used suitably besides a roller.

  The peeling plate 20 is a plate-like member disposed on the suction roller 12 in parallel with the axial direction of the suction roller 12. The peeling plate 20 is supported by a support member (not shown) at a position where it can be inserted into the bonding surface between the matrix-like LED chip 2a and the UV sheet 6. For this reason, when the matrix LED chip 2a attached to the UV sheet 6 is transported to the release plate 20 by the first transport means 10, the release plate is interposed between the UV sheet 6 and the matrix LED chip 2a. 20 is inserted. Thereby, the UV sheet 6 can be peeled from the matrix-like LED chip 2a.

  The first separation plate 30 is a plate-like member formed integrally with the peeling plate 20 so as to have a predetermined inclination angle with respect to the peeling plate 20 on the downstream side of the first transport means 10. The first separation plate 30 has a first inclined surface 30 a inclined downward with respect to the peeling plate 20, and the peeling plate 20 and the first separation plate 30 are in contact with each other on opposite sides. It is arranged. For this reason, the matrix-shaped LED chips 2a that have been transported to the first separation plate 30 have the first inclined surface in the direction of the arrow D2 in order for each column perpendicular to the transport direction, ie, the direction of the arrow D1. Sliding down in the direction of Thereby, the matrix-shaped LED chip 2a can be separated into a column-shaped LED chip (column-shaped electronic component) 2b.

  The second transport means 40 is arranged so that the transport direction differs from the first transport means 10 by approximately 90 degrees, and the row-shaped LED chips 2b are placed in the direction of the arrow D3. Transport. The second transport unit 40 is not particularly limited as in the first transport unit 10, and a roller or a belt conveyor can be suitably used.

  The sensor 7a detects whether or not the row-shaped LED chips 2b are present on the second transport means 40 in the portion facing the first separation plate 30. The sensor 7a is not particularly limited, and an infrared sensor or the like can be used.

  FIG. 2 is a perspective view showing a part of the electronic component transport apparatus 1 according to the present embodiment. FIG. 2 shows a second transport unit 40, a second separation plate (second separation unit) 50, and a third transport unit 60 among members constituting the electronic component transport apparatus 1. Yes. In addition, a sensor 7b is disposed above the connecting portion between the second separation plate 50 and the third transport means 60.

  The second separation plate 50 is a plate-like member disposed on the downstream side of the second transport unit 40 so as to have a predetermined inclination angle. The second separation plate 50 has a second inclined surface 50 a that is inclined downward with respect to the mounting surface of the second conveying means 40. For this reason, the row of LED chips 2b that have been transported to the second separation plate 50 sequentially slides down the second inclined surface 50a for each LED chip 2. Thereby, the line-shaped LED chip 2 a can be separated into individual LED chips 2.

  The 3rd conveyance means 60 mounts LED chip 2, and conveys it in the direction of arrow D4. A roller or a belt conveyor can be used suitably for the 3rd conveyance means 60 similarly to the 1st conveyance means 10 and the 2nd conveyance means 40. FIG.

  The sensor 7b detects whether or not the LED chip 2 is present at the end of the third transport means 60 on the second separation plate 50 side. As the sensor 7b, an infrared sensor or the like can be used similarly to the sensor 7a.

  FIG. 3 is a perspective view showing the suction roller 12 provided in the electronic component transport apparatus 1 shown in FIG. As shown in FIG. 3, the suction roller 12 has a plurality of suction ports 12 a formed in the axial direction. For example, the suction roller 12 is controlled so that the vacuum function is turned on when the suction port 12a is at the position P1, and the vacuum function is turned off when the suction port 12a rotates in the direction of the arrow D5 and reaches the position P2. Is done. For this reason, the suction roller 12 repeats the operation of sucking the UV sheet 6 peeled off from the matrix-like LED chip 2a at the position P1, while releasing the UV sheet 6 at the position P2.

  According to the electronic component conveying apparatus 1 configured as described above, a plurality of matrix-like LED chips 2 a attached to the UV sheet 6 can be conveyed while being separated into individual pieces.

(Flow of electronic component conveyance by the electronic component conveyance device 1)
Next, a flow of conveying a plurality of matrix-like LED chips 2a attached to the UV sheet 6 while being separated into pieces using the electronic component conveying apparatus 1 will be described with reference to FIGS.

  First, as shown in FIG. 1, the matrix-shaped LED chip 2 a attached to the UV sheet 6 is placed on the first transport unit 10 and transported to the peeling plate 20 in the direction of the arrow D <b> 1. At this time, the peeling plate 20 is inserted between the UV sheet 6 and the LED chip 2a. Thereby, the UV sheet 6 can be automatically peeled from the matrix-like LED chip 2a. Further, the peeled UV sheet 6 is sucked by the suction roller 12 and is discharged from below the separation plate 30 through a gap between the peeling plate 20 and the suction roller 12.

  Note that before the UV sheet 6 is peeled from the matrix LED chip 2a, it is preferable that the matrix LED chip 2a is irradiated with UV from the UV sheet 6 side. Thereby, since the adhesive force of the UV sheet 6 with respect to the matrix-like LED chip 2a can be weakened, the UV sheet 6 can be easily peeled from the matrix-like LED chip 2a. The timing of UV irradiation may be before the matrix-shaped LED chip 2 a attached to the UV sheet 6 is placed on the first transport means 10. In addition, after the placement, UV irradiation may be performed from the gap of the first conveyance unit 10 or the like in the conveyance process by the first conveyance unit 10.

  Next, the matrix-like LED chip 2 a from which the UV sheet 6 has been peeled is conveyed to the first separation plate 30. The matrix-like LED chips 2a conveyed to the first separation plate 30 sequentially slide on the first inclined surface 30a in the direction of the arrow D2 for each row aligned in a direction perpendicular to the conveyance direction. . Thereby, the matrix-shaped LED chip 2a can be separated into the row-shaped LED chips 2b. The row of LED chips 2 b that have slid along the first inclined surface 30 a are placed on the second transport means 40 connected to the downstream side of the first separation plate 30. As described above, the second transport unit 40 is disposed so that the transport direction differs from the first transport unit 10 by approximately 90 degrees. For this reason, the row-shaped LED chips 2 b are conveyed in a direction perpendicular to the sliding direction, that is, in a direction parallel to the longitudinal direction of the separation plate 30. Thereby, the row-shaped LED chip 2b can be conveyed in the direction in which the LED chips are arranged while maintaining the row-like arrangement.

  Here, when the matrix-like LED chips 2a transported to the first separation plate 30 slide on the first inclined surface 30a for each row of LED chips 2b in succession, the first inclined surface 30a first. And may collide with another row of LED chips 2b placed on the second conveying means 40. Therefore, in the electronic component transport apparatus 1, the sensor 7a detects whether or not the row-shaped LED chips 2b are present on the second transport unit 40 facing the first separation plate 30. When the row-shaped LED chips 2b are detected, the electronic component transport apparatus 1 stops the transport by the first transport means 10. On the other hand, when the row-shaped LED chips 2b are not detected, the electronic component transport apparatus 1 resumes transport by the first transport means 10. In this way, by intermittently stopping the first conveying means 10, the matrix LED chips 2a are separated into the column LED chips 2b without causing the column LED chips 2b to collide with each other. be able to.

  Next, as shown in FIG. 2, the LED chips 2b in a row are placed on the second transport means 40 and transported to the second separation plate 50 in the direction of the arrow D3. The row of LED chips 2b conveyed to the second separation plate 50 slides sequentially on the second inclined surface 50a for each LED chip 2. Thereby, the LED chip 2b in a row can be separated into individual LED chips 2. The individual LED chips 2 that have slid along the second inclined surface 50 a are placed on the third transport means 60 disposed on the downstream side of the second separation plate 50.

  Here, when the row of LED chips 2b conveyed to the second separation plate 50 continuously slide on the second inclined surface 50a for each individual LED chip 2, the first inclined surface 50a is first moved. There is a possibility of sliding and colliding with another LED chip 2 placed on the third transport means 60. Therefore, in the electronic component transport apparatus 1, the sensor 7b detects whether or not the LED chip 2 is present on the end of the third transport means 60 on the second separation plate 50 side. When the LED chip 2 is detected, the electronic component transport apparatus 1 stops the transport by the second transport unit 40. On the other hand, when the LED chip 2 is not detected, the electronic component transport apparatus 1 resumes transport by the second transport unit 40. Thus, by intermittently stopping the second conveying means 40, the LED chips 2b in a row can be separated into individual LED chips 2 without causing the LED chips 2 to collide with each other.

  The individual LED chips 2 separated in this way are sent to an electronic component measuring device or the like to be subjected to characteristic inspection such as light flux and chromaticity of the LED by the third transport means 60, for example. Be transported.

  FIG. 4 is a top view showing the rotation stage 71 provided in the electronic component measuring apparatus 70 connected to the electronic component conveying apparatus 1 according to the present embodiment. As shown in FIG. 4, the rotary stage 71 provided in the electronic component measuring apparatus 70 has a plurality of mounting tables 71a, and the LED chip 2 transported by the third transporting unit 60 is the same as the mounting table 71a. Placed on one. Then, when the LED chip 2 is placed, the rotary stage 71 rotates in the direction of the arrow D6 so that the rotation stops at a position where the other adjacent placing table 71a and the third transport means 60 face each other. It is controlled. For this reason, the LED chips 2 that have been transported to the rotary stage 71 by the third transport means 60 are sequentially placed on the mounting table 71a, and sequentially move in the direction of the arrow D6 as the rotary stage 71 rotates. When the LED chip 2 stops at the measurement positions P3 to P5, a predetermined measurement inspection is performed on the LED chip 2, and the quality of the LED chip 2 is determined. Then, the LED chip 2 on which various measurement inspections have been performed finally moves to the payout position P6 and is removed from the rotary stage 71. Thus, by connecting the electronic component transport apparatus 1 to the electronic component measuring apparatus 70, the matrix-like LED chip 2a can be separated into pieces and the characteristic inspection of the LED chip 2a can be continuously performed. Thereby, the manufacturing process of LED chip 2 can be shortened.

  In the present embodiment, the number of measurement positions is not particularly limited, and can be changed as appropriate according to the number of measurement items.

(Configuration of sheet conveying means 80)
In the above description, the configuration in which the peeled UV sheet 6 is sucked by the suction roller 12 and discharged from below the separation plate 30 has been described. However, the electronic component conveying apparatus according to the present invention is not limited to this, and may further include a sheet conveying unit that conveys the peeled UV sheet 6.

  FIG. 5 is a perspective view showing the sheet conveying means 80 provided in the electronic component conveying apparatus 1 according to the present embodiment. As shown in FIG. 5, the sheet conveying means 80 is a belt conveyor in which a plurality of rollers 81 and an adsorption roller 82 are arranged in parallel, and the conveying surface 83 is moved by these. The sheet conveying means 80 is disposed below the separation plate 30 so that the peeled UV sheet 6 discharged from below the separation plate 30 can be placed on the conveyance surface 83.

  The suction roller 82 has a vacuum function similarly to the suction roller 12 shown in FIG. 3, and a plurality of suction ports 82a are formed in the axial direction. In the sheet conveying unit 80, the suction rollers 82 are arranged at regular intervals with a plurality of rollers interposed therebetween.

  In addition, a plurality of openings 83 a are formed in the transport surface 83 in a direction perpendicular to the direction in which the transport surface 83 moves, that is, in the axial direction of the roller 81 and the suction roller 82. Here, the openings 83 a are formed on the conveyance surface 83 at regular intervals so as to communicate with the suction port 82 a on the suction roller 82. For this reason, when the vacuum function of the suction roller 82 is ON, the UV sheet 6 placed on the transport surface 83 can be sucked through the opening 83a.

  Thus, according to the sheet conveyance means 80, it can convey, adsorb | sucking the peeled UV sheet 6. FIG. Accordingly, the UV sheet 6 can be transported to a disposal box (not shown) or the like and discarded without dropping off the transport surface 83.

(Summary)
As described above, according to the electronic component conveying apparatus 1, the matrix-like LED chip 2b can be conveyed while being separated into pieces, without using the parts feeder and the linear feeder, unlike the conventional electronic component conveying apparatus. . For this reason, the manufacturing cost of the electronic component conveying apparatus 1 can be reduced, thereby contributing to the cost reduction of the LED chip 2.

  Further, according to the electronic component transport apparatus 1, the plurality of LED chips 2 are put into the electronic component transport apparatus 1 in a state where they are adhered to the UV sheet 6 in a matrix, and the LED chips 2 are aligned in a predetermined direction. It is singulated in the state that it is. For this reason, LED chips are inserted and vibrated like conventional electronic component transfer devices that align electronic components randomly placed in the parts feeder in a separated state in a predetermined direction by vibration. The two do not collide with each other. Thereby, it is possible to prevent the LED chip 2 from being damaged by the impact of the LED chips 2 colliding with each other.

  Furthermore, according to the electronic component transport apparatus 1, the bonding between the LED chips 2 due to the resin protruding due to these impacts, or a defect, or burrs of the electronic component substrate generated when the LED chips 2 are separated into individual pieces are caused. Since the clogging of the conveying means can be prevented, the LED chip 2 can be stably conveyed to an arbitrary conveyance destination.

  Thus, according to this embodiment, the electronic component transport apparatus 1 that can stably transport the LED chips 2 without colliding with each other can be realized at low cost.

  Note that both the first transport unit 10 and the second transport unit 40 are configured to be easily exchangeable with members of different sizes according to the size of the electronic component to be transported. For this reason, even when there is a change in the package size and shape of the electronic component to be transferred, the changed package size and the Can be matched to the shape. Thereby, the manufacturing cost accompanying the design change of the electronic component conveying apparatus 1 can be reduced.

  Further, the first separation plate 30 and the second separation plate 50 are configured to be easily exchangeable for members of different sizes according to the size of the electronic component to be slid. For this reason, even if there is a change in the package size and shape of an electronic component that slides on the first inclined surface 30a or the second inclined surface 50a, the first separation plate 30 and the second separation plate 50 are used. Can be easily adapted to the changed package size and shape. Thereby, the manufacturing cost accompanying the design change of the electronic component conveying apparatus 1 can be reduced.

  Moreover, although this embodiment demonstrated the case where the peeling plate 20 and the separation plate 30 were formed with a different member, this invention is not limited to this. For example, the peeling plate 20 and the separation plate 30 may be configured by a single member. Thereby, the structure of the electronic component conveying apparatus 1 can be simplified and manufacturing cost can be reduced.

[Embodiment 2]
A second embodiment relating to the electronic component conveying apparatus of the present invention will be described below with reference to FIG. The electronic component conveying apparatus according to the present embodiment is different from the electronic component conveying apparatus according to the first embodiment in the configuration of the second separating unit included in the electronic component conveying apparatus.

  For convenience of explanation, members having the same functions as those in the drawings described in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

(Configuration of separation transport mechanism)
FIG. 6 is a perspective view showing a part of the electronic component transport apparatus 1a according to the present embodiment. As shown in FIG. 6, in the electronic component transport apparatus 1 a, a separation transport mechanism (second separation unit) 51 is connected to the downstream side of the second transport unit 40.

  The separation transport mechanism 51 has a high-speed placement surface 51a having a transport speed higher than that of the second transport means 40. The individual LED chips 2 are placed on the high-speed placement surface 51a in the direction of the arrow D4. Transport. In addition, although the belt conveyor can be used suitably for the separation conveyance mechanism 51, it is not specifically limited, A roller etc. may be used.

(Flow of separation of electronic parts by separation transport mechanism)
Next, the structure which isolate | separates row-shaped LED chip 2b into each LED chip 2 using the separation conveyance mechanism 51 is demonstrated. In addition, since the conveyance process of the LED chip 2 on the upstream side and the downstream side of the separation conveyance mechanism 51 is the same as that of the first embodiment, the description thereof is omitted here.

  The row-shaped LED chips 2b transported to the separation transport mechanism 51 by the second transport means 40 are sequentially placed on the high-speed placement surface 51a for each LED chip 2. Here, as described above, since the high-speed placement surface 51a has a higher conveyance speed than the second conveyance means 40, the LED chip 2 that has been moved from the second conveyance means 40 to the high-speed placement surface 51a first, and the next In addition, there is a certain interval on the high-speed placement surface 51a between the LED chip 2 moved from the second transport means 40 to the high-speed placement surface 51a. In this way, by utilizing the difference in the conveyance speed between the second conveyance means 40 and the high-speed placement surface 51a, the LED chips 2b in a row can be separated into individual LED chips without causing the LED chips 2 to collide with each other. Can be separated into two.

  The high-speed placement surface 51a preferably has a higher frictional resistance than the placement surface of the second transport unit 40. As a result, the row of LED chips 2b transported to the separation transport mechanism 51 can be smoothly moved to the high-speed placement surface 51a and separated into individual LED chips 2.

  The high-speed placement surface 51a is configured so that it can be easily replaced in accordance with the size of the LED chip 2. For this reason, even if the package size and shape of the LED chip 2 are changed, it is possible to easily match the changed package size and shape by exchanging the high-speed placement surface 12a. Thereby, the manufacturing cost accompanying the design change of the electronic component conveying apparatus 1a can be reduced.

[Embodiment 3]
A third embodiment relating to the electronic component conveying apparatus of the present invention will be described below with reference to FIG. The electronic component conveying apparatus according to the present embodiment is different from the electronic component conveying apparatuses according to the first and second embodiments in the configuration of the second separating unit included in the electronic component conveying apparatus.

  For convenience of explanation, members having the same functions as those in the drawings described in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

(Configuration of separation transfer arm mechanism)
FIG. 7 is a perspective view showing a part of the electronic component transport apparatus 1b according to the present embodiment. As shown in FIG. 7, in the electronic component transfer apparatus 1 b, the separation transfer arm mechanism (second separation unit) 50 is disposed on the downstream side of the second transfer unit 40. Further, a notch 40a is formed at the end of the second transfer means on the separation transfer arm mechanism 52 side.

  The separation transfer arm mechanism 52 has a plurality of transfer arms 52a that rotate and move in the direction of arrow D4. Each LED chip 2 is placed on each transfer arm 52a and transferred in the direction of arrow D4.

  The separation transfer arm mechanism 52 includes a transfer arm 52 a, and the transfer arm 52 a rotates and moves so as to extend upward on the downstream side of the second transfer means 40 and contract downward on the upstream side of the third transfer means 60. .

(Flow of separation of electronic parts by separation transfer arm mechanism)
Next, the structure which isolate | separates row-shaped LED chip 2b into each LED chip 2 using the separation conveyance arm mechanism 52 is demonstrated. In addition, since the conveyance process of the LED chip 2 on the upstream side and the downstream side of the separation conveyance arm mechanism 52 is the same as that of the first embodiment, the description thereof is omitted here.

  When the row-shaped LED chips 2b are transported to the separation / transport arm mechanism 52 side by the second transport means 40, the leading LED chip 2 of the row-shaped LED chips 2b is positioned in the notch 40a. At this time, the transport arm 52a rises toward the LED chip 2 below the leading LED chip 2, passes through the notch 40a, and comes into contact with the bottom of the leading LED chip 2. As a result, the individual LED chips 2 are sequentially placed on the transport arm 52 a and transported to the third transport means 60. As described above, the separation and transfer arm mechanism 52 can separate the LED chips 2b in a row into individual LED chips 2 without causing the LED chips 2 to collide with each other.

  In addition, it is preferable that the mounting surface of the transfer arm 52a has a member that attracts the LED chip 2. Thereby, the LED chip 2 can be moved to the 3rd conveyance means 60 in the stable state. Moreover, although the shape of the notch 40a is a concave shape toward the direction of the arrow D3, the shape is not limited to the concave shape as long as the transfer arm 52a can pass therethrough.

  Further, the transfer arm 52a is configured so that it can be easily replaced in accordance with the size of the LED chip 2. For this reason, even if the package size and shape of the LED chip 2 are changed, it is possible to easily match the changed package size and shape by exchanging the mounting table. Thereby, the manufacturing cost accompanying the design change of the electronic component conveying apparatus 1b can be reduced.

[Summary of Embodiment]
In each embodiment, the configuration in which the electronic component is an LED chip has been described. However, the present invention is not limited to this. For example, a semiconductor chip other than the LED chip may be used. Moreover, although each embodiment demonstrated the structure which the sheet affixed on an electronic component is a UV sheet, it is not limited to this, For example, the sheet | seat etc. which apply | coated the adhesive agent may be sufficient.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

  The present invention can be used in an electronic component transport apparatus for stably transporting electronic components.

DESCRIPTION OF SYMBOLS 1 Electronic component conveying apparatus 1a Electronic component conveying apparatus 1b Electronic component conveying apparatus 2 LED chip (electronic component)
2a Matrix LED chip (matrix electronic component)
2b row LED chip (row electronic component)
6 UV sheet (sheet)
DESCRIPTION OF SYMBOLS 10 1st conveyance means 11 Roller 12 Adsorption roller 12a Suction port (adsorption means)
20 Peeling plate (peeling means)
30 First separation plate (first separation means)
30a 1st inclined surface 40 2nd conveyance means 50 2nd separation plate (2nd separation means)
50a Second inclined surface 51 Separation transport mechanism (second separation means)
51a High-speed placement surface 52 Separation transfer arm mechanism (second separation means)
52a Conveying arm 80 Sheet conveying means

Claims (17)

  1. An electronic component transport apparatus that transports a plurality of matrix electronic components attached to a sheet while being separated into pieces,
    First conveying means for conveying the matrix-shaped electronic component;
    Peeling means for peeling the sheet from the matrix electronic component;
    A first separating unit that is provided on the downstream side of the first conveying unit and separates the matrix-shaped electronic component from which the sheet has been peeled into a plurality of rows of electronic components;
    A second transport means for transporting the row of electronic components in the direction in which the electronic components are arranged;
    A second separating means provided on the downstream side of the second conveying means, for separating the row-shaped electronic components into individual electronic components;
    With
    The first separation means has a first inclined surface that is inclined in the conveying direction of the matrix-shaped electronic component,
    The matrix-shaped electronic component from which the sheet is peeled slides on the first inclined surface and moves to the second conveying means for each row arranged in a direction perpendicular to the conveying direction. An electronic component conveying apparatus characterized by the above.
  2. The second separation means has a second inclined surface that is inclined in the conveying direction of the row of electronic components,
    2. The electronic component transport apparatus according to claim 1, wherein the row of electronic components slide on the second inclined surface for each electronic component.
  3.   3. The plate according to claim 1, wherein the peeling means is a plate disposed on the first conveying means so that the peeling means can be inserted into an adhesive surface between the sheet and the matrix electronic component. The electronic component conveying apparatus as described.
  4.   The electronic component conveying apparatus according to any one of claims 1 to 3, wherein the first or second conveying means is a plurality of rollers or a belt conveyor.
  5.   5. The electronic component conveying apparatus according to claim 1, further comprising: a suction unit that sucks the sheet peeled from the matrix-shaped electronic component.
  6. The first conveying means is a plurality of rollers,
    The electronic component conveying apparatus according to claim 5, wherein the suction unit is provided in any one of the plurality of rollers.
  7. The first conveying means is a belt conveyor,
    6. The electronic component conveying apparatus according to claim 5, wherein the suction means is provided on the belt conveyor.
  8.   The electronic component transport apparatus according to claim 1, wherein the first transport unit and the second transport unit have a transport direction that is approximately 90 degrees different from each other.
  9.   The first conveying means so that the row of electronic components sliding on the first inclined surface does not come into contact with the other preceding row of electronic components placed on the second conveying means. The electronic component conveying apparatus according to claim 1, wherein the electronic component conveying apparatus is stopped intermittently.
  10.   10. The electronic component transport apparatus according to claim 1, wherein the first transport unit or the second transport unit is replaceable according to the size of the electronic component to be transported.
  11.   11. The electronic component transport apparatus according to claim 1, wherein the first inclined surface is replaceable according to a size of an electronic component to be slid. 11.
  12.   The said 2nd conveyance means is stopped intermittently so that each electronic component which slid on the said 2nd inclined surface may not contact other preceding electronic components, It is characterized by the above-mentioned. Electronic component transfer device.
  13.   The electronic component transport apparatus according to claim 2, wherein the second inclined surface is replaceable according to a size of the electronic component to be slid.
  14. The second separation unit has a placement surface having a higher conveyance speed than the second conveyance unit,
    12. The electronic component carrying apparatus according to claim 1, wherein the row-shaped electronic components are placed on the placement surface for each electronic component.
  15. The second separation means has a transfer arm,
    12. The electronic component transport apparatus according to claim 1, wherein the row-shaped electronic components are mounted on the transport arm for each individual electronic component.
  16.   4. The electronic component conveying apparatus according to claim 1, wherein the peeling unit and the first separating unit are made of one member. 5.
  17.   17. The electronic component conveying apparatus according to claim 1, further comprising a sheet conveying unit that conveys the sheet peeled from the matrix-shaped electronic component while adsorbing the sheet.
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JPH0725476B2 (en) * 1985-02-28 1995-03-22 三洋電機株式会社 Te in the automatic mounting apparatus for electronic components - flop transfer device
JPH0745465Y2 (en) * 1989-10-17 1995-10-18 株式会社イナックス Tile of the transfer device
JP2574518B2 (en) * 1990-05-31 1997-01-22 ジューキ株式会社 Component supplying method and apparatus
JPH06227641A (en) * 1993-02-02 1994-08-16 Orii:Kk Conveyance device of frozen foods arranged in a row
JPH09194028A (en) * 1996-01-19 1997-07-29 Nagata Seiki Co Ltd Part feeding device
JP3275202B2 (en) * 1996-08-30 2002-04-15 東京エレクトロン株式会社 The thin film forming apparatus
JPH11150133A (en) * 1997-09-04 1999-06-02 Hitachi Ltd Method and system for mounting semiconductor element semiconductor element separator, and production of ic card
JP3076290B2 (en) * 1997-11-28 2000-08-14 山形日本電気株式会社 Pickup apparatus and method of the semiconductor chip
JP2001335131A (en) * 2000-05-24 2001-12-04 Mitsubishi Heavy Ind Ltd Planar body carrier conveyor

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