JP2524910Y2 - Chip electronic component supply device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an apparatus for taking out chip-shaped electronic components from a container storing the components in bulk into a component discharge pipe.

[Prior Art] Conventionally, when mounting a chip-shaped electronic component at a predetermined position on a circuit board, it has been performed as follows using an automatic mounting device. That is, the chip-shaped electronic components housed in bulk in a plurality of containers are taken out one by one into a plurality of guide tubes piped to a distributor, and each is taken out to a storage recess formed at a predetermined position of a template. Send and receive there. This storage recess,
Each chip-shaped electronic component is arranged in accordance with the position where it is mounted on the circuit board. While maintaining the relative position when housed in this, it protrudes from the lower surface of the suction unit in accordance with the arrangement of the housing recess. The chip-shaped electronic component is moved to the circuit board by the component moving means having the suction head provided,
Mount. Thus, each of the chip-shaped electronic components is mounted at a predetermined position on the circuit board. On the circuit board,
An adhesive is applied in advance to the position where the chip-shaped electronic component is to be mounted, and soldering is performed in a state where the mounted electronic component is temporarily fixed with the adhesive.

As shown in FIGS. 4 and 5, a component supply device used in this apparatus has a container 1 having a funnel-shaped slope on the bottom surface and containing chip-shaped electronic components in a bulk.
And a component discharge pipe 49 whose upper end is slidably inserted into the container 1 from a through hole in the center of the bottom of the container 1. The upper end of the component discharge pipe 49 is opened obliquely. A slide member 37 protruding from the bottom of the container 1 is slidably fitted in a recess of a guide member 36 fixed to the frame 35, whereby the container 1 is slidably guided up and down. Further, as shown in FIG. 4, a vertical drive mechanism 55 is connected via a bracket 46 to an arm 45 projecting from the upper end of the container 1, and a motor 48 is provided via a transmission mechanism 47.
The container 1 is reciprocated up and down by the power transmitted from the container 1.

As described above, the container 1 is driven up and down,
The upper end of the component discharge pipe 49 reciprocates up and down relatively in the container 1. When the upper end of the component discharge pipe 49 rises from the bottom of the container 1, the chip-shaped electronic components a, a.
When the upper end of the component discharge pipe 49 is lowered, the chip-shaped electronic component a enters the discharge pipe 49 from the opening. In this way, the chip-shaped electronic components a that have entered the component discharge pipe 49 are sequentially sent downward in a line.

The lower end of the component discharge pipe 49 is arranged such that the center axis thereof is deviated from the upper end of the component transport path 10 that communicates with the guide pipes 21 of the distributor 2. 4 and 5, the through hole reciprocates between the lower end of the component discharge pipe 49 and the upper end of the component conveying path 10. As a result, the chip-shaped electronic components a
Are sent out one by one to the component transport path 10 and further sent through the guide pipe 21 to the above-described recess for storing the template.

[Problem to be Solved by the Invention] In the above-described conventional component supply device, an appropriate volume for the container 1 is considered from the viewpoints of dischargeability of the chip-shaped electronic components a, a load at the time of driving, miniaturization of the device, and the like. Has been determined.
However, depending on the usage of the mounting device, the volume of the container 1 determined from such a viewpoint is not enough to store the chip-shaped electronic components a to be processed at one time, and the volume of the chip There is a problem that the electronic components a, a... Must be added.

In order to increase the amount of chip-like electronic components a that can be supplied, it is necessary to increase the volume of the container 1. However, if the volume of the container 1 is increased and a large number of chip-shaped electronic components a are stored, the weight of the entire container 1 increases, so that the driving load and the inertia when the container 1 reciprocates increase, and the supply operation becomes difficult. It is difficult to increase the speed. In addition, as a result of packing a large number of chip-shaped electronic components a into the container 1, the pressure of the chip-shaped electronic components a at the bottom of the container 1 increases, and the clogging or the like occurs, resulting in poor dischargeability.

The object of the present invention is to solve the conventional problem described above, without changing the balance of the container, which is considered to be the best in terms of the dischargeability of the chip-shaped electronic component, the driving load of the container, the size of the entire device, and the like.
An object of the present invention is to provide a chip-type electronic component supply device capable of increasing the storage capacity of chip-type electronic components.

Means for Solving the Problems In order to achieve the above object, the present invention provides a container having a funnel-shaped slope on the bottom surface, in which chip-shaped electronic components are housed in a bulk, and a bottom center of the container. And a component discharge pipe whose upper end is slidably inserted into the container,
In a chip-shaped electronic component supply device, a container is slidably supported in an axial direction of a component discharge pipe and has a drive mechanism for reciprocating the container in the axial direction with respect to the component discharge pipe. A hopper-shaped spare container is provided at a distance from the container, a gently sloped component discharge path from the bottom of the container to the component discharge port is formed at the bottom of the preliminary container, and the component discharge port is formed on the upper surface of the container. Provided is a chip-shaped electronic component supply device that is open toward an opening and has a gate that opens and closes the component discharge port.

[Operation] In the chip-shaped electronic component supply device according to the present invention, when the chip-shaped electronic components in the container are low, the chip-shaped electronic components are supplied from the spare container on the chip. Thereby, from the viewpoint of the dischargeability of the chip-shaped electronic components, the driving load, etc., while using the container having an appropriate volume as it is,
Consequently, its practical volume can be increased by the volume of the spare container. And since the hopper-shaped spare container is provided apart from the container, the driving load and inertia of the container itself driven up and down are not increased even if the spare container is provided. Therefore, the container can be driven up and down at high speed, so that the operation can be speeded up.

Also, since the component outlet at the lower end of the spare container is open toward the opening on the upper surface of the container, and a gate for opening and closing the component outlet is provided, the chip-shaped electronic components in the container can be removed. When the remaining amount is low, the gate can be opened to supply chip-shaped electronic components from the spare container to the container. In this case, since the chip-shaped electronic components in the spare container reach the component discharge port from the bottom of the container through a gentle component discharge path, a large amount of chip-shaped electronic components are suddenly generated when the gate is opened. It is not discharged from the component outlet. Therefore, a large amount of chip-shaped electronic components is not supplied from the spare container to the container at one time, and it is possible to supply only a necessary amount of chip-shaped electronic components to the container only when necessary.

Therefore, even if the spare container has a sufficiently large volume compared to the container, a necessary amount of chip-shaped electronic components can be supplied to the container at any time. Electronic components can be supplied continuously. Also, it is not necessary to store an excessive amount of chip-shaped electronic components in the container, and a large amount of chip-shaped electronic components are not supplied at once from the spare container.
The pressure of the chip-shaped electronic component at the bottom of the container is also reduced, and the chip-shaped electronic component is less likely to be clogged.

[Example] Next, an example of the present invention will be specifically described with reference to the drawings.

FIG. 3 shows an overview of a mounting device for a chip-shaped electronic component to which the present invention is applied. That is, a plurality of containers 1 in which chip-shaped electronic components are stored in a bulk shape are arranged, and a delivery unit 11 serving as an escapement is connected to the containers 1 via a tube 10. Further, the distributor 2 is arranged below the sending unit 11.

The distributor 2 has a fixed base 23 fixed below the sending portion 11 and a movable base 22 disposed in parallel below the fixed base 23 and to which the template 6 is detachably attached on the lower surface side. The base 23 and the movable base 22 are made of four striated flexible bodies 2 having the same length.
The four corners are connected to one another at 4, 24.

The vibrator 3 that applies vibration to the movable base 22 is connected, and the movable base 22 vibrates horizontally. The vibration is desirably given independently in two directions orthogonal to each other. Due to the connection structure using the linear bodies 24, 24,... As described above, the horizontal vibration given to the movable base 22 from the vibrator 3 does not reach the fixed base 23 side.

Further, a flexible guide tube 21, which guides and conveys the chip-shaped electronic component between the fixed base 23 and the movable base 22,
21 ... is plumbed. These guide tubes 21, 21 ...
The pipe is connected to connect the component discharge port of the delivery section 11 and a through hole (not shown) of the movable base 22. The through hole of the movable base 22 is opened at a position where the chip-shaped electronic component is to be mounted on the wiring board, and the position of the through hole corresponds to the recess 61 of the template 6. .

Under the movable base 22, the template 6 provided with the storage recess 61 in accordance with the mounting position of the chip-shaped electronic component on the circuit board is inserted and fixed. At this time, a through hole of the movable base 22 that communicates with the lower end of the guide tube 21 is provided on each of the storage recesses 61 of the template 6.

Further, when the template 6 is inserted under the movable base 22, the vacuum case 4 is applied below the template 6 to form a flow of air sucked from the container 1 through the guide tube 21 and the storage recess 61 from the intake duct 5. Is done.

Component transfer means for moving the chip-shaped electronic component stored in the storage recess 61 of the template 6 to the circuit board 9 and mounting the electronic component is provided. The component transfer means is usually provided through a duct 81. A suction unit 8 is used which is connected to a suction pump (not shown) and sucks and holds electronic components from the storage recess 61. For example, on the lower surface of the suction unit 8, a storage recess 61 on the template 6,
Suction heads (not shown) are provided so as to correspond to the positions 61, respectively, and suck and hold the chip-shaped electronic components at the tips maintained at a negative pressure.

The circuit board 9 is transported by a transporting means such as the conveyor 7, is positioned immediately below the suction unit 8, is stopped, and is then transported.

FIG. 1 shows a component supply apparatus according to an embodiment of the present invention used in such an apparatus. This component supply device has a plurality of containers 1 each having a slope on the bottom surface and containing chip-shaped electronic components a, a,... In a bulk shape, one of which is shown in FIG.

In these embodiments, the container 1 has a funnel-shaped bottom surface, and has a base member 38 constituting a bottom wall of the container 1 and a cylindrical member which is fitted around the base member 38 and forms a peripheral wall of the container 1. The base member 38 has a through hole in the center where the bottom surface is the lowest. Further, the upper end of the component discharge pipe 49 is slidably fitted into the through hole of the base member 39, and the upper end of the pipe 49 is inserted into the container 1. In the case shown, the component discharge pipe 49 is inserted so as to substantially coincide with the central axis of the container 1,
Its upper end is open obliquely.

Further, a hopper-like preliminary container 50 is placed on the container 1.
Is arranged. As shown in FIG. 2, this spare container 50 is attached to a frame of a mounting device via a bracket 59, and is set at a height that does not hinder the vertical movement of the container 1. A component discharge path 57 having a gentle slope for discharging chip-shaped electronic components is formed at the bottom of the spare container 5, and the lower end thereof opens downward as a component discharge port 56 toward the upper surface opening of the container 1. A gate 58 for opening and closing the component discharge port 56 is provided. In FIGS. 1 and 2, the state indicated by a solid line indicates that the component discharge port 56 is closed, and the state indicated by a two-dot chain line indicates the component discharge port 56. Is open.

By opening the base gate 58, the chip-shaped electronic components a, a,.
After entering the container 57, it is supplied through the discharge passage 58 to the part discharge port 56 into the container 1 thereunder. Further, by closing the gate 58, the supply of the chip-shaped electronic components a, a,... Is stopped.

In the illustrated embodiment, the volume of the spare container 50 is
Although slightly larger, as in the previous embodiment,
If the spare container 50 is not driven up and down together with the container 1, the volume can be arbitrarily selected.

[Effects of the Invention] As described above, according to the present invention, the practical storage amount of the chip-shaped electronic component is substantially increased while the proper volume of the container 1 is maintained, and the amount can be arbitrarily increased. Can be set. Also, with existing chip-shaped electronic component mounting equipment,
The effect that the storage amount of the chip-shaped electronic component can be increased without replacing the container is obtained.

[Brief description of the drawings]

FIG. 1 is a vertical sectional side view of a main part of a chip-type electronic component supply device according to an embodiment of the present invention. FIG. 2 is a vertical cross-sectional side view of a main part showing details of a spare container provided in the component supply device. FIG. 3 is a schematic perspective view showing the entirety of a chip-shaped electronic component mounting device using the same component supply device, and FIG. 4 is a view showing a main part of a chip-shaped electronic component mounting device provided with a conventional component supply device. FIG. 5 is a vertical sectional side view showing a main part of the conventional component supply device. 1 ... container, 36 ... guide member, 37 ... slide member,
45 ... arm, 50 ... spare container, 56 ... parts outlet, 57
…… Component discharge path, a …… Chip-shaped electronic components

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Tsutomu Shimomura 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Yuden Co., Ltd. (72) Hirokazu Kobayashi 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Yuden (72) Creator Fujio Seki 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Yuden Co., Ltd. (72) Creator Yutaka Nagai 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Yuden Co., Ltd. 56) References JP-A-53-22267 (JP, A) JP-A-58-38637 (JP, U)

Claims (1)

(57) [Scope of request for utility model registration] 1. A container having a funnel-shaped slope on its bottom surface and containing chip-shaped electronic components in a bulk shape, and a component discharge pipe having a top center and a top end slidably inserted into the container from the bottom center of the container. Wherein the container is slidably supported in the axial direction of the component discharge pipe, and a drive mechanism for reciprocating the container in the axial direction with respect to the component discharge pipe. A hopper-shaped spare container is provided on the container apart from the container, and a gently sloped component discharge path from the bottom of the container to the component outlet is formed at the bottom of the spare container. The chip-shaped electronic component supply device is characterized in that the device is open toward the opening on the upper surface of the container and is provided with a gate for opening and closing the component discharge port.