JPH05183298A - Method and equipment for mounting chip type circuit parts - Google Patents

Abstract

PURPOSE:To accurately correct deviation of the suction position of a chip type circuit parts even if some irregularity exists in the dimension of the chip type circuit parts. CONSTITUTION:After a chip type circuit parts (a) is sucked by a set nozzle 83, reciprocating movement between the set nozzle 83 and a guide case 61 is relatively performed several times while the stroke is gradually reduced. Firstly, the suction position of a chip type circuit parts (a) having a small size is corrected by the reciprocating movement of large stroke. Finally, the suction position of a chip type circuit parts (a) having a large size is corrected by the reciprocating movement of small stroke. The suction position of a chip type circuit parts (a) having an intermediate size is corrected by the reciprocating movement of middle stroke.

Description

Detailed Description of the Invention

The present invention relates to a method and apparatus for mounting a chip-shaped circuit component housed in a container at a predetermined position on a circuit board.

[0002]

2. Description of the Related Art Conventionally, when a chip-shaped circuit component is mounted at a predetermined position on a circuit board, it has been carried out by the following method using an automatic mounting device. That is, the chip-shaped circuit components stored in bulk in a plurality of containers are taken out one by one into a guide tube of a distributor, and sent to the guide cases formed at predetermined positions of the template through the guide tubes, To collect there. The position of this guide case is determined according to the position where each chip-shaped circuit component is mounted on the circuit board.
The chip-shaped circuit component is moved to and mounted on the circuit board by the component moving means having the set nozzle arranged on the lower surface of the suction head corresponding to the arrangement of the guide case in the position housed therein. As a result, the respective chip-shaped circuit components are mounted at predetermined positions on the circuit board.

An adhesive is applied to the circuit board in advance at the position where the chip-shaped circuit component is to be mounted, and the mounted circuit component is soldered while the circuit component is temporarily fixed with this adhesive. ..

The chip-like circuit component has a certain degree of variation in external dimensions due to variations in the coating thickness of the paint applied to it. Further, the chip-shaped circuit parts sent along the guide tube of the distributor are vertically dropped and received in the guide case arranged on the template. By the flow of air sucked from the opened through hole, the guide case is laid down and laid down. Therefore, as shown in FIG. 7, the inner dimension of the guide case 61 has a certain margin with respect to the dimension of the chip-shaped circuit component a.

However, if the guide case 61 has a sufficient dimension, the center of the chip-shaped circuit component a with respect to the center of the set nozzle 83 when the chip-shaped circuit component a is suction-held by the set nozzle 83. Guide case 61
May be received by. The chip-shaped circuit component a is sucked and held by the set nozzle 83, and the circuit board 9 is directly held.
If the chip-shaped circuit component a is moved to and disposed on the circuit board, the chip-shaped circuit component a will be mounted on the circuit board while being displaced from a predetermined position to be mounted.

Therefore, conventionally, the following position correction method has been proposed. That is, FIG. 7 shows an example of position correction in the width direction of the prismatic chip-shaped circuit component a. As shown in FIG. 7A, the chip-shaped circuit component a is adsorbed and held on the tip of the set nozzle 83, and slightly lifted as shown by the arrow, and then set as shown in FIG. The nozzle 83 is moved leftward in the figure by a distance x. After that, the set nozzle 83 is moved to the position shown in FIG.
The position is returned to the origin position shown by, and subsequently, as shown in FIG. As a result, the chip-shaped circuit component a, which is attracted and held while being displaced with respect to the set nozzle 10, is applied to the wall surface of the guide case 61, and the displacement is corrected. In addition to the width direction, the chip-shaped circuit component a
Similar position correction may be performed in the length direction of the.

[0007]

However, although the chip-shaped circuit component a is made to have a size as constant as possible, in reality, there is some dimensional variation with respect to the standard size. is doing. Here, considering the widthwise dimension of the chip-shaped circuit component a, as shown in FIG. 7D, if the standard width dimension is w and the permissible error is δ, it is actually on the circuit board 9. The width dimension of the mounted chip-shaped circuit component a is distributed within the range of w ± δ.
In this case, half the difference between the inner width dimension of the guide case 61 and the standard width dimension w of the chip-shaped circuit component a,
That is, when assuming that the chip-shaped circuit component a having the standard width dimension w is at the center of the guide case 61, the clearance on both sides thereof is defined as x, and the lateral displacement amounts shown in FIGS. 7B and 7C. When x is set to x, the chip-shaped circuit component a having the standard width dimension w is finally corrected so that the deviation becomes zero.

However, in the chip-shaped circuit component a having a width dimension of w + δ, when the set nozzle 83 and the guide case 61 are relatively moved by the displacement amount ± x, as shown in FIG. The chip-shaped circuit component a is the guide case 6
When it hits one inner wall surface of No. 1, it shifts by half of the allowable error δ, that is, δ / 2.

Further, in the chip-shaped circuit component a having a width dimension of w-δ, the set nozzle 83 and the guide case 6 are used.
There is a case where the relative movement amount of 1 and the relative movement amount of ± x is insufficient and the relative movement amount is insufficient, and the correction cannot be completed. Therefore, in the same manner as described above, half of the allowable error δ, that is, δ / 2
However, the gap remains. The present invention solves the above-mentioned conventional problems, and can correct the displacement of the suction position of the chip-shaped circuit component accurately even if the chip-shaped circuit component a has some variation in size. An object of the present invention is to provide a mounting method and device.

[0010]

[Means for Solving the Problems] That is, in order to achieve the above-mentioned object, the present invention delivers the chip-shaped circuit component a from a container 1 in which the chip-shaped circuit component a is accommodated through a distributor 2 to form the chip-shaped circuit component a. The circuit parts a are received in the guide cases 61 arranged at the predetermined positions,
The chip-shaped circuit component a received in the guide case 61 is sucked and held by the set nozzle 83, and further, before the chip-shaped circuit component a is pulled out from the guide case 61,
By relatively reciprocating the set nozzle 83 and the guide case 61, the chip-shaped circuit component a is brought into contact with the wall surface of the guide case 61, and the misalignment of the chip-shaped circuit component a with respect to the set nozzle 83 is corrected. , The chip-shaped circuit component a sucked and held by the set nozzle 83
Is moved in the arrangement state when it is received in the guide case 61, is arranged at a predetermined position of the circuit board 9, and the chip-shaped circuit component a is mounted on the circuit board 9. Provided is a chip-shaped circuit component mounting method characterized in that the reciprocating movement of the set nozzle 83 and the guide case 61, which is performed before a is pulled out from the guide case 61, is performed a plurality of times while gradually reducing the stroke. To do.

Further, a container 1 for accommodating the chip-shaped circuit component a, a means for sending the chip-shaped circuit component a to the distributor 2 and carrying it, and the chip-shaped circuit component a carried through the distributor 2 are provided. The template 6 in which the guide cases 61 to be received are arranged at predetermined positions respectively, and the chip-shaped circuit component a received in the guide cases 61 is sucked and held by the set nozzle 83, moved, and disposed on the circuit board 9. Means for adsorbing and moving the chip-shaped circuit component a by the set nozzle 83 and disposing the chip-shaped circuit component a on the circuit board 9 is the set nozzle 83.
In a device for mounting the chip-shaped circuit component a on the circuit board 9 having a mechanism for reciprocally moving the guide case 61 on the template 6, a mechanism for relatively reciprocating the set nozzle 83 and the guide case 61. Is
Provided is a chip-shaped circuit component mounting device having a mechanism for reciprocating a plurality of times while gradually reducing the stroke.

In these cases, x is half the difference between the inner dimension of the guide case 61 and the standard dimension of the chip-shaped circuit component a, and δ is the maximum allowable error of the dimension of the chip-shaped circuit component a. At this time, the maximum displacement amount of the relative backward movement stroke of the set nozzle 83 and the guide case 61 by the reciprocating mechanism is ± (x + δ / 2), and the minimum displacement amount is ± (x−δ / 2). Is desirable.

[0013]

In the mounting method and apparatus according to the present invention, after the chip-shaped circuit component a is sucked by the set nozzle 83,
Since the relative reciprocal movement between the set nozzle 83 and the guide case 61 is performed a plurality of times while changing from a large stroke to a gradually smaller stroke, first, a chip-like circuit component having a small dimension with a large stroke reciprocating movement. The suction position of a is corrected, and the suction position of the chip-shaped circuit component a having a large size is corrected by the last reciprocating movement of a small stroke. The chip-shaped circuit component a having an intermediate size has its suction position corrected by the reciprocating movement of a medium stroke during this period. In particular,
When the maximum displacement amount of the relative backward movement stroke of the set nozzle 83 and the guide case 61 is ± (x + δ / 2) and the minimum displacement amount is ± (x−δ / 2), the chip-shaped circuit component Even if a varies in the range of ± δ around the predetermined standard dimension, it is possible to correct the chip-shaped circuit components a without deviation.

[0014]

Embodiments of the present invention will now be specifically described with reference to the drawings. FIG. 6 shows an outline of the entire mounting device for a chip-shaped circuit component according to an embodiment of the present invention. That is, a plurality of containers 1 in which chip-shaped circuit components are stored in a bulk shape are arranged, and a delivery section 11 which is an escapement is connected to the containers 1 via a tube 10. Further, the distributor 2 is arranged below the sending unit 11.

The distributor 2 has a fixed frame 23 fixed below the sending section 11, and a movable frame 22 arranged in parallel thereunder and having the lower surface side to which the template 6 is detachably attached. However, the fixed frame 23 and the movable frame 22 are connected to each other at their four corners by four columns having flexibility and having the same length. Between the fixed frame 23 and the movable frame 22, flexible guide tubes 21, 21 ... Which guide and convey the chip-shaped circuit component are arranged.

Below the movable frame 22, the template 6 placed on the template frame 65 is inserted and fixed. This template 6 has a guide case 61 arranged on a base board 60 in accordance with the mounting position of a chip-shaped circuit component on a circuit board. Then, when the template 6 is inserted directly below the distributor 2, the lower end of the guide tube 21 connected to the movable frame 22 is positioned above each guide case 61 of the template 6.

At this time, the vacuum case 4 is placed under the template 6 so that the lower surface of the template 6 is maintained at a negative pressure. Therefore, air is drawn from the guide tube 21 to the back surface side of the template 6 through the through hole formed at the bottom of the guide case 61, and an air flow is formed. Here, the chip-shaped circuit component a sent from each container 1 side is sent through the guide tube 21 of the distributor 2 due to its gravity and the flow of the air, for example, as shown in FIG. As shown by the dotted line, it is stored in the guide case 61 of the template 6. In these drawings, reference numeral 63 sucks air toward the vacuum case 4 side to guide the chip-shaped circuit component a to the guide tube 21.
It is a through hole that serves as a passage for ventilation for sending to the guide case 61 via the.

As shown in FIG. 6, the template frame 6
The template 6 placed on the plate 5 is moved by the slide mechanism 66 between directly below the distributor 2 and directly below the suction head 8. As a result, the chip-shaped circuit components are received by the respective predetermined guide cases 61 of the template 6 immediately below the distributor 2, and then the template 6 moves to below the suction head 8.
Then, the chip-shaped circuit components received in the guide case 61 are respectively adsorbed by the set nozzles of the suction head 8.
After that, the template is retracted from under the suction head 8, and then the circuit board 9 conveyed by the conveyor 7 is inserted under the head 8. Then, the suction head 8 mounts the chip-shaped circuit component sucked on the tip of the set nozzle 83 on the circuit board 9.

FIG. 4 shows an example of a mechanism for moving the set nozzle 83 of the suction head 8 and the guide case 61 of the template 6 relative to each other. A reciprocating mechanism is shown. The suction head 8 is supported by the horizontal guides 82, 82 so as to be movable in the plane direction with respect to the frame 81, the cam follower 86 is pivotally supported by the cam receiving portion 87 of the suction head 8, and the elasticity of the spring 88 causes the suction head 8 to move. The cam follower 86 hits a cam 85 rotated by a motor 84 and follows the cam 85. A plurality of set nozzles 83, 83 ... Are attached to the lower surface of the suction head 8, and a vacuum chamber 90 for making the tip of the set nozzles 83, 83 a negative pressure is provided inside the head 8, which is shown in the drawing. Not connected to a vacuum source.

In FIG. 4, reference numeral 6 denotes a template inserted under the suction head 8, and on the template 6, guide cases 61, 61 ... Corresponding to the positions of the set nozzles 83, 83. Is provided. On the bottom surface of these guide cases 61, 61 ...
The inside of 1, 61 ...
Through hole 6 for sucking the chip-shaped circuit component a through
3 is provided. When the template 6 is inserted under the suction head 8, the template 6 is positioned at a predetermined position with respect to the frame 81 by fitting the positioning pin 62 and the positioning recess 89.

In FIG. 5A, when the set nozzle 83 is at the center of the guide case 61, the origin is the cam 85.
7 shows the amount of displacement of the set nozzle 83 in the width direction with respect to the origin with respect to the allocation angle. Here, FIG.
As shown in (b), the tolerance of the width dimension of the chip-shaped circuit component a is δ, and the chip-shaped circuit component a having the standard width dimension w.
The clearance on both sides of the guide case 61 is assumed to be x, and the displacement amount is represented by δ and x. That is, while the cam 85 makes one rotation, the set nozzle 83 moves in the guide case 61 for three times.
The stroke amount of the first and second strokes and the third and second strokes is gradually reduced. Specifically, the first reciprocating stroke is ± (x + δ / 2), the second reciprocating stroke is ± x, and the last reciprocating stroke is ± (x−δ / 2).

This operation will be described with reference to FIGS.
In these figures, the amount of displacement of the set nozzle 83 is represented by positive displacement in the right direction and negative displacement in the left direction. Figure 1 shows the first stroke,
First, as shown by the chain double-dashed line in FIG. 4A, the chip-shaped circuit component a housed in the guide case 61 is set in the set nozzle 8
After being adsorbed at the tip of 3, it is slightly lifted as indicated by the arrow. Thereafter, as shown in FIG. 1B, the set nozzle 83 moves from the origin by x + δ / 2 to the left in the figure. After that, the set nozzle 83 returns to the origin, and then, as shown in FIG. 1C, moves from the origin by x + δ / 2 to the right in the figure. After that, the set nozzle 83 returns to the origin as shown in FIG. In this operation, particularly in the case of the chip-shaped circuit component a having a width w−δ narrower than the standard width dimension w by the tolerance δ as shown in FIG. By the stroke operation shown, the chip-shaped circuit component a hits the inner wall surfaces of the guide case 61 facing each other, and the position is accurately corrected to the center of the set nozzle a.

FIG. 2 shows the second stroke. First, the set nozzle 83 moves from the origin position shown in FIG. 2A to the left by x as shown in FIG. 2B. After that, the set nozzle 83 returns to the origin, and subsequently, FIG.
As shown in (c), only x moves from the origin to the right in the figure. After that, the set nozzle 83 returns to the origin as shown in FIG. In this operation, particularly in the case of the chip-shaped circuit component a having the standard width dimension w as shown in FIG. 2D, the chip-shaped circuit component a is moved by the stroke operation shown in FIGS. 2B and 2C. It hits the inner wall surfaces of the guide case 61 facing each other, and the position is accurately corrected to the center of the set nozzle a.

FIG. 3 shows the third stroke. First, the set nozzle 83 moves to the left by x−δ / 2 from the origin position shown in FIG. 3A, as shown in FIG. 3B. After that, the set nozzle 83 returns to the origin, then moves from the origin to x to the right in the figure as shown in FIG. 3C, and then returns to the origin as shown in FIG. 3D.
In this operation, particularly in the case of the chip-shaped circuit component a having a width w + δ whose width is wider than the standard width dimension w by the allowable error δ as shown in FIG. ), The chip-shaped circuit component a hits the inner wall surfaces of the guide case 61 facing each other, and the position is accurately corrected to the center of the set nozzle a.

In the case of this embodiment, the set nozzle 8
The reciprocating movement of the guide case 61 of 3 is ± (x + δ /
2), ± x and ± (x-δ / 2) stroke,
Since the process is divided into three steps, the position of the chip-shaped circuit component a having the standard width dimension w and the width dimension of the maximum allowable error w ± δ can be accurately corrected. However, in the case of the chip-shaped circuit component a having a width dimension between them, for example, a width dimension of w ± δ / 2, a suction deviation that cannot be completely corrected by δ / 4 may remain. Further, the reciprocating movement of the set nozzle 83 with respect to the guide case 61 is ± (x + δ / 2), ±
(X + δ / 4), ± x, ± (x−δ / 4) and ± (x−
If it is performed in five stages according to the displacement amount of δ / 2), the position of the chip-shaped circuit component a having the width dimension of w + δ / 2 or w−δ / 2 can be accurately corrected. In this case, the maximum deviation of the adsorption position that cannot be completely corrected is δ / 4. Further, in the above embodiment, the correction of the suction position of the chip-shaped circuit component a in the width direction has been described.
Needless to say, the correction of the suction position in the length direction can be performed in the same manner.

[0026]

As described above, according to the present invention, even if there is a certain degree of variation in the dimensions of the chip-shaped circuit component, it is possible to accurately correct the displacement of the suction position of the chip-shaped circuit component. It is possible to provide a method and apparatus for mounting a circuit component.

[Brief description of drawings]

FIG. 1 is a sectional view of an essential part showing a first relative reciprocating motion between a set nozzle and a guide case for correcting a suction position of a chip-shaped circuit component according to an embodiment of the present invention.

FIG. 2 shows a set nozzle and a guide case for correcting a suction position of a chip-shaped circuit component according to an embodiment of the present invention.
It is a principal part sectional view which shows the relative reciprocating motion of the time.

FIG. 3 shows a set nozzle and a guide case for correcting a suction position of a chip-shaped circuit component according to an embodiment of the present invention.
It is a principal part sectional view which shows the relative reciprocating motion of the time.

FIG. 4 is a schematic cross-sectional view showing an example of a mechanism for relatively reciprocating the set nozzle and the guide case to correct the suction position of the chip-shaped circuit component according to the embodiment of the present invention.

FIG. 5 is an operation curve diagram (a) showing the relationship between the cam allocation angle for correcting the suction position of the chip-shaped circuit component and the displacement of the set nozzle according to the embodiment of the present invention, the chip-shaped circuit component and the guide case. It is a principal part sectional view (b) which shows the dimensional relationship with.

FIG. 6 is a perspective view conceptually showing the whole of a chip-shaped circuit component mounting apparatus to which the present invention is applied.

FIG. 7 is a cross-sectional view of essential parts showing a relative reciprocating operation between a set nozzle and a guide case for correcting the suction position of a chip-shaped circuit component according to a conventional example.

[Explanation of symbols]

 a Chip-shaped circuit component 1 Container 2 Distributor 61 Guide case 83 Set nozzle 9 Circuit board

Claims (4)

[Reference number] 0030632-01 [Claims] 1. A guide case 61 in which the chip-shaped circuit component a is sent out from a container 1 containing the chip-shaped circuit component a through a distributor 2, and the chip-shaped circuit component a is arranged at a predetermined position. The chip-shaped circuit component a received in the guide case 61 is sucked and held by the set nozzle 83, and before the chip-shaped circuit component a is pulled out from the guide case 61, the set nozzle 83 and the guide case By relatively reciprocating with 61, the chip-shaped circuit component a is brought into contact with the wall surface of the guide case 61, and the set nozzle 83
The misalignment of the chip-shaped circuit component a with respect to the circuit board is moved, and then the chip-shaped circuit component a sucked and held by the set nozzle 83 is moved in the arrangement state when it is received in the guide case 61, In a method of mounting the chip-shaped circuit component a on the circuit board 9 by disposing the chip-shaped circuit component a at a predetermined position of the guide circuit board 9, A method of mounting a chip-shaped circuit component, wherein the reciprocating movement is performed a plurality of times while gradually reducing the stroke. 2. The guide case 61 according to claim 1,
1 of the difference between the inner dimension of and the standard dimension of the chip-shaped circuit component a
When // 2 is x and the maximum allowable error of the dimensions of the chip-shaped circuit component a is δ, the maximum amount of displacement of the relative backward movement stroke of the set nozzle 83 and the guide case 61 is ± (x + δ
/ 2), and the minimum displacement amount is ± (x-δ / 2). 3. A container 1 for accommodating a chip-shaped circuit component a.
A template 6 in which a means for sending out the chip-shaped circuit component a to the distributor 2 and transporting it and a guide case 61 for receiving the chip-shaped circuit component a transported via the distributor 2 are arranged at predetermined positions. And a means for adsorbing, holding and moving the chip-shaped circuit component a received in the guide case 61 by the set nozzle 83 and disposing the chip-shaped circuit component a on the circuit board 9. The chip-shaped circuit component a is provided with a mechanism in which the nozzle 83 sucks and moves the nozzle 83 and arranges it on the circuit board 9 including a mechanism for reciprocating the set nozzle 83 relative to the guide case 61 on the template 6. In the device mounted on the substrate 9, the mechanism for relatively reciprocating the set nozzle 83 and the guide case 61 makes the stroke gradually smaller. Chip-like circuit component mounting apparatus which is a mechanism for a plurality of times back and forth movement while comb. 4. The guide case 61 according to claim 3,
1 of the difference between the inner dimension of and the standard dimension of the chip-shaped circuit component a
/ 2 is x and the maximum allowable error of the dimensions of the chip-shaped circuit component a is δ, the set nozzle 8 by the reciprocating mechanism
The maximum amount of displacement of the relative backward movement stroke of 3 and the guide case 61 is ± (x + δ / 2), and the minimum amount of displacement is ±
(X- [delta] / 2) Chip-shaped circuit component mounting device characterized by the above-mentioned.