JPH0658999B2 - Chip-shaped electronic component mounting method and device - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method and apparatus for mounting a chip-shaped electronic component housed in a container at a predetermined position on a circuit board.

[Prior Art] Conventionally, when a chip-shaped electronic component is mounted at a predetermined position on a circuit board, it has been carried out in the following manner by an apparatus as shown in FIG. That is, the chip-shaped electronic components stored in bulk in the plurality of containers 1 are taken out one by one by the guide means 2 constituted by the pipe-shaped chute 21 and the base plate 3, and the template 6 is placed at a predetermined position. It is sent to each of the storage recesses 61 formed in and is received there. The position of the storage recess 61 is determined according to the position where each chip-shaped electronic component is mounted on the circuit board 9, and the storage recess 61 is sucked according to the arrangement of the storage recess 6 in the position where it is stored. The chip-shaped electronic component a is moved and mounted on the circuit board 9 by the component moving means having the suction head 83 (see FIG. 8) arranged on the lower surface of the unit 8. As a result, the chip-shaped electronic components are mounted on the circuit board 9 at predetermined positions. In FIG. 7, reference numeral 7 denotes a conveyer for carrying the circuit board 9.

It should be noted that the circuit board is preliminarily coated with an adhesive at a position where the chip-shaped electronic component is to be mounted, and the mounted electronic component is soldered while the electronic component is temporarily fixed with the adhesive.

The chip-shaped electronic component a has a certain degree of variation in external dimensions due to variation in the coating thickness of the coating material applied to it. Further, since the chip-shaped electronic component a sent along the chute 21 of the guide means 2 is vertically dropped and received in the storage recess 61 arranged on the template 6, it is vibrated and The flow of the air sucked from the through hole 63 (see FIG. 8) opened at the bottom of the storage recess 61 causes the storage recess 61 to fall down and lie down. For this reason, as shown in FIG.
Has a certain margin with respect to the size of the chip-shaped electronic component a.

However, if the accommodation recess 61 has a sufficient size in this way, when the suction head 83 sucks and holds the chip-shaped electronic component a, for example, like the chip-shaped electronic component a on the right side in FIG. The center of the chip-shaped electronic component a may deviate from the center of the above, and may be received in the storage recess 61. When the suction head 83 sucks and holds the chip-shaped electronic component a, moves the chip-shaped electronic component a to the circuit board 9 and arranges the chip-shaped electronic component a, the chip-shaped electronic component a is displaced from a predetermined position to be mounted on the circuit board 9 and mounted. Will be done.

For example, the standard size of the chip-shaped electronic component a is 2.00 in length.
mm, diameter 1.25 mm, the maximum allowable error of the length is ±
If 0.25 mm, the maximum allowable length is 2.25 mm
The vertical length of the storage recess 61 must be 2.75 mm so that even if the chip-shaped electronic component a is stored, the clearance between the wall and the wall of the storage recess 61 is about 0.25 mm. For this reason, the minimum allowable length 1.
When the 75 mm chip-shaped electronic component a is received at the end of the storage recess 61, a maximum shift of 0.5 mm occurs.

Therefore, conventionally, as shown in Japanese Patent Laid-Open No. 59-152698, the following position correcting method has been proposed.
That is, as shown by the solid line in FIG. 8, after the chip-shaped electronic component a is sucked and held on the tip of the suction head 83, the suction head 83 is moved to x as shown by the arrow in FIG.
And a predetermined distance shift in the y direction. As a result, the chip-shaped electronic component a, which is held by being shifted with respect to the suction head 10, is applied to the wall surface of the storage recess 61 to correct the shift. In this case, in FIG. 9, when the suction position is shifted ± 0.25 mm in the x direction, the maximum ± 0.5 mm deviation is corrected to a maximum ± 0.25 mm error range.

It should be noted that the suction head 83 is displaced in the x and y directions because the storage recess 61 is arranged in the direction shown in FIG.
This is to cope with the case where they are arranged in the direction orthogonal to the figure.

[Problems to be Solved by the Invention] In the conventional mounting method for a chip-shaped electronic component, in the case where the longitudinal direction of the storage recess 61 is oriented in the x or y direction in which the suction head 10 is moved, that is, in FIG. When it is oriented in the direction shown in the drawing or in the direction orthogonal thereto, the displacement in the longitudinal direction of the chip-shaped electronic component a can be corrected as described above. However, for example, as shown in FIG. 10, when the longitudinal direction of the storage recess 61 is inclined with respect to the x or y direction in which the suction head 10 is moved, both ends of the chip-shaped electronic component a and the wall surface of the storage recess 61. There is a difference between the clearance d and the distance d ′ in the x or y direction. Therefore, there is a problem that the displacement of the suction position of the chip-shaped electronic component a cannot be corrected accurately.

The present invention solves the conventional problems described above, and provides a mounting direction of a chip-shaped electronic component and a device capable of accurately correcting the displacement of the suction position of the chip-shaped electronic component a regardless of the direction of the storage recess. The purpose is to provide.

[Means for Solving the Problems] That is, in order to achieve the above-mentioned object, the present invention sends out the chip-shaped electronic component a from the containers 1, 1 ... , The chip-shaped electronic components a are received in the storage recesses 61, 61 ... Arranged at respective predetermined positions, and the suction heads 83 suck the chip-shaped electronic components a received in the storage recesses 61, 61. The chip-shaped electronic component a, which is held and sucked and held by the suction head 83, is moved in the arrangement state when the chip-shaped electronic component a is received in the storage recess 61, and is arranged at a predetermined position on the circuit board 9. In the method of mounting the chip-shaped electronic component a on the circuit board 9, after the chip-shaped electronic component a received in the storage recess 61 is sucked by the suction head 83, the chip-shaped electronic component a is removed from the storage recess 61. Before pulling out, the suction head 83 and the storage recess 61 are relatively moved circularly about the position where the chip electronic component a is pulled up from the storage recess 61, so that the wall surface of the storage recess 61 is brought into contact with the chip electronic component a. The chip-shaped electronic component mounting method for correcting the displacement of the chip-shaped electronic component a with respect to the suction head 83 is provided.

Further, the containers 1, 1, ...
, Means for sending the chip-shaped electronic component a to the guiding means 2 and carrying it, and storage recesses 61, 61 for receiving the chip-shaped electronic component a carried via the guiding means 2.
Means for arranging the template 6 in which each is arranged at a predetermined position and the chip-shaped electronic component a received in the storage recesses 61, 61 ... In a device that mounts the chip-shaped electronic component a having a and the like on the circuit board 9, the chip-shaped electronic component a is sucked and moved by the suction head 83,
A chip-shaped device provided with means for moving the suction head 83 and the storage recess 61 relatively in a circular motion around a position where the chip-shaped electronic component a sucked and held in the storage recess 61 is pulled up. An electronic component mounting device is provided.

[Operation] According to the chip-shaped electronic component mounting method, after the chip-shaped electronic component a received in the storage recess 61 is sucked by the suction head 83, the chip-shaped electronic component a is stored in the storage recess 6.
The chip-shaped electronic component a is stored in the storage recess 6 before being pulled out from 1.
Since the suction head 83 and the storage recess 61 are moved circularly relative to each other around the position where the suction head 83 is pulled up, both ends of the chip-shaped electronic component a sucked by the suction head 83 try to move circularly with respect to the storage recess 61. To do. Therefore, as shown in FIG. 2 or FIG. 5, both ends of the chip-shaped electronic component a are
The accommodation recess 61 moves by the same distance in the longitudinal direction. For example, when the circular movement is performed with a radius r, the storage recess 61 is relatively moved by ± r in the longitudinal direction. For this reason, by setting the radius of the circular motion as the correction distance of the shift, when the suction head 83 holds the chip-shaped electronic component a in a shifted state, the chip-shaped electronic component a is held on the wall surface of the storage recess 61. By contacting both ends, it becomes possible to correct the deviation.

Furthermore, according to the mounting device for a chip-shaped electronic component according to the present invention, the mounting method can be reliably carried out.

[Embodiment] Next, an embodiment of the present invention will be specifically described with reference to the drawings.

FIG. 7 shows an outline of the entire mounting device for a chip-shaped electronic component to which the present invention is applied. To briefly explain this configuration, the pipe-shaped chutes 21 of the guide means 2 are connected to the storage means which is composed of the container 1 in which the chip-shaped electronic components are stored in a bulk shape, and the lower end of the chute 21 has a joint 23. It is connected to the pattern base 3 via. Below the pattern base 3, a template 6 having a storage recess 61 provided at a mounting position of a chip-shaped electronic component on a circuit board is inserted. The joint 23 that is planted on the pattern base 3 is provided in each of the storage recesses 61 of the template 6.
It corresponds to each position. Therefore, when the template 3 is inserted under the pattern base 3, the lower end of the through hole communicating with the chute 21 connected to the joint 23 is
The template 6 is disposed on each storage recess 61.

Furthermore, when the template 6 is inserted under the pattern base 3, the vacuum case 4 is applied below it,
A flow of air sucked from the storage container 1 through the chute 21 and the storage recess 61 and from the intake duct 5 is formed. As a result, the electronic component is forcibly conveyed from the storage container 1 through the chute 21 to the storage recess 61, and the electronic component is further tilted in the storage recess 61 in a predetermined direction.

A component transfer means for moving and mounting the chip electronic component a thus received in the storage recess 61 of the template 6 on the circuit board 9 is provided. As the component transfer means, a normal duct 81 is used. Adsorption pump (not shown)
The suction unit 8 of the type that is connected to the above and holds the electronic component by suction from the storage recess 61 is used. The suction heads 83 are provided on the lower surface of the suction unit 8 so as to correspond to the storage recesses 61, 61 ... On the template 6 that are pulled out from below the pattern base 3. As shown in FIGS. 1, 3, and 4, the suction head 83 has a tip-shaped electronic component a at its tip by vacuum suction means.
Adsorb and hold.

The circuit board 9 is transported by a transporting means such as the conveyor 7, is positioned immediately below the suction head 8, is stopped, and is then transported.

The method of mounting electronic components by this device will be described below. First, the template 6 is inserted under the pattern base 3, and in this state, the electronic component is inserted into the storage recess 61 of the tape rate 6 from the storage container 1 side through the guide means 2. Parts are sent. Next, the template 6 is pulled out from below the pattern base 3 and moved to directly below the suction unit 8. Then, the suction unit 8 is mounted, and as shown in FIGS. 1, 3, and 4, the suction heads 83 are inserted into the respective storage recesses 61, and the chip-shaped electronic component a therein is placed in the suction heads. It is adsorbed and held at the tip of 1. At this time, the pins 62, 62 (see FIG. 7) protruding from the upper surface of the template 6 and the positioning holes 82 opened on the lower surface of the suction unit 8,
82 (see FIG. 7) is fitted, and the template 6 and the suction unit 8 are positioned relative to each other. afterwards,
The suction unit 8 rises slightly and the chip-shaped electronic component a
Is stopped almost at the upper edge of the storage recess 61.

Here, as shown in FIG. 1, the tip of the suction head 83 is
First, it is horizontally displaced by r with respect to the storage recess 61, and then horizontally rotated along a circumference having a radius of r. The radius r of this rotational movement is preferably set to about (L-1) / 2 when the length of the storage recess 61 is L and the reference dimension length of the chip-shaped electronic component a is 1.

As described above, when the chip-shaped electronic component a is deviated to the suction head 83 and suctioned and held by this circular movement,
Both ends thereof come into contact with the wall surface of the storage recess 61, and the deviation is corrected.

After that, the suction unit 8 moves up and the suction head 83
The chip-shaped electronic component a sucked and held at the tip of the is pulled up from the storage recess 61 of the template 6. At the same time, the template 6 comes out from under the suction unit 8 and returns to the base plate 3 side. Then, the suction unit 8 descends,
The chip-shaped electronic component a, which is moved to the stopped suction circuit board 9 and sucked and held by the tip of the suction head 83, is brought into contact with the circuit board 9, and the suction state of the suction head 83 is released in this state. To do.

An adhesive is applied in advance to each predetermined position of the circuit board 9 on which the chip-shaped electronic component a is to be mounted, and when the suction state of the suction head 83 is released, the chip-shaped electronic component a is bonded with the adhesive. Then, the mounting of the chip-shaped electronic component a on the circuit board is completed. After that, the circuit board 9 is sent to the next step by the conveyor 7, and the chip-shaped electronic component a is soldered to the electrodes formed on the circuit board 9.

FIG. 6 shows an example of a mechanism for moving the suction head 83 of the suction unit 8 and the storage recess 61 of the template 6 relative to each other. In FIG. 6, a cam mechanism is used to move the suction unit 8 to the substrate 10. A mechanism for circular motion is shown.

The suction unit 8 is supported by the base 10 so as to be movable in the plane direction, and the cam receiving portion 85 of the suction unit 8 is elastically supported by the base 10 via the springs 84, 84. In the base body 10, circumferential cams 102 and 102 and a flat cam 103 are attached to the same shaft 101, and the shaft 101 is rotated by a motor 104.
Further, the cam receiving portion 85 has a driven link 86 which makes rolling contact with the peripheral surface of the peripheral cam 102 and the plate surface of the end cam 103.
86 and 87 are rotatably supported.

On the peripheral surfaces of the peripheral cams 102, 102 and the end surface of the end cam 103, as shown in FIG. 1, the tip of the suction head 10 first shifts horizontally by a radius r of a circular motion, and then shifts. A cam curve is formed so as to draw a locus of drawing a circle having a radius r around the previous starting point by 360 °, then moving toward the center of the circle by the above r, and returning to the original starting point. Therefore, every time the shaft 101 makes one rotation, the tip of the suction head 10 moves so as to draw the above-mentioned locus.

The means for circularly moving the tip of the suction head 10 with respect to the storage recess 61 is not limited to the combination of the peripheral surface cam 102 and the end surface cam 103 as described above, but is a known mechanism such as a combination of a crank mechanism and a gear mechanism. It can also be configured by.

In the above-described embodiment, the suction unit is moved up to the position where the chip-shaped electronic component a is located almost at the upper edge of the storage recess 61. Shift r in the direction,
A circular motion with a radius r may be performed horizontally. Further, the movements of the suction head 83 and the storage recess 61 need only be relative. Therefore, in addition to the circular movement of the suction unit 8 as in the above embodiment, the template 6 side having the storage recess 61 is also moved circularly. Or, adsorption unit 8 and template 6
Both may be exercised.

[Effects of the Invention] As described above, according to the present invention, no matter which direction the storage recess 61 for receiving the chip-shaped electronic component a faces, the suction head 83 of the chip-shaped electronic component a received therein is held. The deviation can be corrected under the same conditions. As a result, regardless of the orientation of the storage recess 61, the chip-shaped electronic component a
It is possible to obtain the effect that it is possible to surely and accurately correct the suction deviation of the.

[Brief description of drawings]

FIG. 1 is a sectional perspective view showing a storage recess of a mounting device for a chip-shaped electronic component showing an embodiment of the present invention, FIG. 2 is a plan view of the storage recess, and FIG. 3 is a longitudinal section of a main part of a template. The front view and FIG. 4 are side elevation views of the main part of the template,
FIG. 5 is a plan view of the storage recess, FIG. 6 is a plan view showing an example of a mechanism for circularly moving the suction unit, and FIG.
FIG. 8 is a schematic perspective view showing the configuration of a chip-shaped electronic component mounting device, FIG. 8 is a side view of a main part of a template portion showing a conventional example of a mounting device for chip-shaped electronic components, and FIG. 9 and FIG. It is a top view of the storage recessed part in a prior art example. DESCRIPTION OF SYMBOLS 1 ... Storage container, 2 ... Guide means, 6 ... Template, 61
... template storage recess, 8 ... suction unit, 9 ... circuit board, 83 ... suction head.

Claims (2)

[Claims] 1. Containers 1 and 1 containing a chip-shaped electronic component a.
, From which the chip-shaped electronic component a is sent via the guide means 2, and the chip-shaped electronic component a is received by the storage recesses 61, 61 ... An arrangement state when the chip-shaped electronic component a received by the suction head 83 is sucked and held by the suction head 83, and the chip-shaped electronic component a sucked and held by the suction head 83 is received by the storage recess 61. In the method of mounting the chip-shaped electronic component a on the circuit board 9 by moving the chip-shaped electronic component a at a predetermined position on the circuit board 9, the chip-shaped electronic component a received in the storage recess 61 is sucked by the suction head 83. After sucking and before pulling out the chip-shaped electronic component a from the storage recess 61, the suction head 8 is centered around the position where the chip-shaped electronic component a is pulled up from the storage recess 61.
3 and the storage recess 61 are relatively circularly moved so that the chip-shaped electronic component a is brought into contact with the wall surface of the storage recess 61 to correct the displacement of the chip-shaped electronic component a with respect to the suction head 83. Chip-shaped electronic component mounting method. 2. Containers 1 and 1 for accommodating a chip-shaped electronic component a.
, And means for sending the chip-shaped electronic component a to the guide means 2 for conveyance, and storage recesses 61, 61 for receiving the chip-shaped electronic component a conveyed via the guide means 2, respectively. A chip having a template 6 arranged at a position, and means for adsorbing, holding and moving the chip-shaped electronic component a received in the storage recesses 61, 61 ... In the device for mounting the electronic component a on the circuit board 9, the electronic component a is sucked and moved by the suction head 83, and the means for disposing the electronic component a on the circuit board 9 separates the suction head 83 and the storage recess 61. A chip-shaped electronic component mounting device comprising a mechanism for relatively circularly moving the chip-shaped electronic component a sucked and held in the storage recess 61 around a position where the chip-shaped electronic component a is pulled up.