JPH0729049Y2 - Chip-shaped electronic component feeder - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of use] The present invention relates to a device for extracting chip-shaped electronic components in a line from a container accommodating the chip-shaped electronic components in bulk into a component discharge pipe.

[Prior Art] Conventionally, when a chip-shaped electronic component is mounted at a predetermined position on a circuit board, it has been performed as follows using an automatic mounting device. That is, the chip-shaped electronic components that are stored in bulk in a plurality of containers are taken out one by one into a plurality of guide tubes that are piped in a distributor, and are respectively stored in storage recesses formed at predetermined positions of the template. Send and receive there. The storage recess is arranged in accordance with the position where each chip-shaped electronic component is mounted on the circuit board, and the suction recess corresponding to the arrangement of the storage recess is held while maintaining the relative position when stored in the circuit board. The chip-shaped electronic component is moved and mounted on the circuit board by the component moving means having the suction head protruding from the lower surface of the unit. As a result, each of the chip-shaped electronic components is mounted at a predetermined position on the circuit board. An adhesive is applied in advance to the position where the chip-shaped electronic component is to be mounted on the circuit board, and the mounted electronic component is soldered while the electronic component is temporarily fixed.

The component supply device used in this device is shown in FIG.
As shown in FIG. 6, it has a funnel-shaped slope on the bottom surface,
A container 1 for accommodating chip-shaped electronic components in bulk is provided, and a component discharge pipe 49 having a tip slidably inserted into the container 1 through a through hole at the center of the bottom of the container 1. Sixth
As shown in the figure, the upper end of the component discharge pipe 49 is obliquely opened. As shown in FIG. 4 and FIG. 5, the slide member 37 protruding from the bottom of the container 1 is slidably fitted in the recess of the guide member 36 fixed to the frame 35,
Thereby, the container 1 is guided slidably up and down. Furthermore, as shown in FIG. 5, the vertical drive mechanism 55 is connected to the arm 45 protruding from the upper end of the container 1 via the bracket 46, and the power transmitted from the motor 48 via the transmission mechanism 47. Thereby, the container 1 is reciprocally driven up and down.

In this way, by driving the container 1 up and down, the upper end of the component discharge pipe 49 relatively reciprocates up and down in the container 1. The upper end of the parts discharge pipe 49 is the container 1
The chip-shaped components a, a ... Are collapsed when they go up from the bottom, and the chip-shaped electronic components a are inserted into the discharge pipe 49 one by one from the opening when the tip of the component discharge pipe 49 is lowered. In this manner, the chip-shaped electronic components a that have entered the component discharge pipe 49 are lined up in a line and sequentially fed downward.

The lower end of this parts discharge pipe 47 is the distributor 2
Are arranged so that the upper ends of the component conveying paths 10 communicating with the guide pipes 21, 21 ... During this time, the slider 54 slides to the left and right in FIG.
The through hole is located at the lower end of the parts discharge pipe 49 and the parts conveying path 10.
Make a round trip to and from the upper end of. As a result, the chip-shaped electronic components a lined up in a line in the component discharge pipe 49 are sent out one by one to the component transfer path 10 and further through the guide pipe 21 to the already-mentioned template storing recess. .

[Problems to be Solved by the Invention] When the chip-shaped electronic components a, a ... Are stored in bulk in the container 1 of the conventional chip-shaped electronic component supply device, the chip-shaped electronic components a, a ... The problem is that it becomes a bridge state. A typical first example thereof is to construct a bridge over the opposite inclined surfaces of the container 1 like chip-shaped electronic components a, a ... This is the case when forming. In the second example, the chip-shaped electronic components a, a ... Are obliquely arranged along the bottom surface on the left side of the container 1 in FIG. This means that they are linearly connected and fixed along the bottom while lying down.

In order to prevent the bridge state as in the case of the first example, it is effective to make the slope of the bottom surface of the container 1 gentle to some extent. However, if the slope of the bottom surface of the container 1 is made gentle, then a bridge like the second example of the latter is likely to occur.
Thus, preventing bridging was extremely difficult and could not be completely prevented. When such a bridge state of the chip-shaped electronic components a occurs, the smooth discharge of the chip-shaped electronic components is hindered, which causes a supply error of the chip-shaped electronic components.

An object of the present invention is to solve the above conventional problems, to prevent the bridging of chip-shaped electronic components in a container from occurring, to smoothly discharge the chip-shaped electronic components, and to damage the chip-shaped electronic components. It is an object to provide a chip-shaped electronic component supply device that does not have any type.

[Means for Solving the Problems] That is, in order to achieve the above-mentioned object, the present invention has a container 1 having a funnel-shaped slope on the bottom surface and accommodating chip-shaped electronic components a in a bulk shape, and the container 1. Is provided with a component discharge pipe 49 slidably inserted into the container 1 from the bottom center to an upper end, and the container 1 is slidably supported in the axial direction of the component discharge pipe 49 and In a chip-shaped electronic component supply device equipped with a drive mechanism for reciprocating the container 1 in the axial direction of the container 1, a spring arm 56 having elasticity is attached to the container 1, and its swingable free end is Is arranged at a position where the tip of the component discharge pipe 49 comes into contact with the reciprocating motion of the above, and a weight 57 which gives inertia to the free end side of the spring arm 56 is attached. Providing Jo electronic component feeding device.

[Operation] In the chip-shaped electronic component supply device according to the present invention, since the spring arm 56 is provided in the container 1 that reciprocates in the axial direction of the component discharge pipe 49, the spring arm 56 is inertial when the container 1 reciprocates. Causes it to swing with its own elasticity.
Further, the swinging of the spring arm 56 is biased by the inertia of the weight 57, so that the swinging of the container 1 is surely performed even if the container 1 is slightly reciprocated. Further, since the free end side of the spring arm 56 is arranged at the position where it abuts against the tip of the component discharge pipe 49 as the container 1 reciprocates, the component discharge pipe that moves up and down relatively with respect to the bottom surface of the container 1. The free end side of the spring arm 49 is pushed up by the tip of 49 and swings.
In this way, the free end of the spring arm 56 is
By moving up and down in the inside, the chip-shaped electronic component a in the container 1 is repelled by the elasticity of the arm 56, and the formation of the bridge state of the chip-shaped electronic component a as described above is prevented.

On the other hand, since the spring arm 56 is attached to the container 1, the attaching portion of the arm 56, which is less susceptible to the elastic action, reciprocates together with the container 1 and the chip-shaped electronic component a therein. Therefore, the spring arm 56 does not exert an excessive force that strongly presses the chip-shaped electronic component a in the container 1. That is, although only the free end of the spring arm 56, on which the elastic force acts, exerts a force on the chip-shaped electronic component a to the extent that the same is applied, the mounting portion of the arm 56 attached to the container 1 is the chip-shaped component. Almost no force works on pushing a. Therefore, the spring arm 56 and its mounting portion do not exert a force for crushing the chip-shaped component a, and there is no possibility of damaging the chip-shaped electronic component a.

[Embodiment] Next, an embodiment of the present invention will be specifically described with reference to the drawings.

FIG. 3 shows an outline of the entire mounting device for a chip-shaped electronic component to which the present invention is applied. That is, a plurality of containers 1 in which chip-shaped electronic components are stored in bulk are arranged,
A delivery unit 11 which is an escapement is connected to this via a tube 10. Further, the distributor 2 is arranged below the sending unit 11.

The distributor 2 has a fixed base 23 fixed below the delivery section 11, and a movable base 22 arranged in parallel thereunder and having the template 6 detachably attached to the lower surface thereof. Base 23 and movable base
22 are four linear members 24 having the same length and having flexibility,
The four corners are connected to each other at 24 ....

The vibrator 3 for vibrating the movable base 22 is connected to the movable base 22, so that the movable base 22 is horizontally vibrated. It is desirable that the vibrations be applied independently in two directions orthogonal to each other. Due to the connection structure using the linear bodies 24, 24, ..., The horizontal vibration applied from the vibrator 3 to the movable base 22 does not reach the fixed base 23 side.

Further, flexible guide tubes 21, 21 for guiding and carrying the chip-shaped electronic component between the fixed base 23 and the movable base 22.
... is piped. The guide tubes 21, 21 ... Are arranged so as to connect the component discharge port of the delivery section 11 and the through hole (not shown) of the movable base 22. The through hole of the movable base 22 is formed so as to match the position where the chip-shaped electronic component is to be mounted on the wiring board, and the position of this through hole corresponds to the storage recess 61 of the template 6. ..

Below the movable base 22, the template 6 provided with the storage recess 61 is inserted and fixed in accordance with the mounting position of the chip-shaped electronic component on the circuit board. At this time, the through hole of the movable base 22 which communicates with the lower end of the guide tube 21 is arranged above each of the storage recesses 61 of the template 6.

Furthermore, when the template 6 is inserted under the movable base 22, the vacuum case 4 is placed under the template 6 to form a flow of air sucked from the container 1 through the guide tube 21 and the storage recess 61 and from the intake duct 5. To be done.

A component transfer means for moving and mounting the chip-shaped electronic component stored in the storage recess 61 of the template 6 onto the circuit board 9 is provided. As this component transfer means, a normal duct 81 is used. Connected to a suction pump (not shown),
A suction unit 8 of a type that sucks and holds an electronic component from the storage recess 61 is used. For example, on the lower surface of the suction unit 8, the storage recesses 61, 61 ...
Suction heads (not shown) are provided so as to correspond to the respective positions, and the tip-shaped electronic component is sucked and held at the tip portion thereof which is maintained at a negative pressure.

The circuit board 9 is carried by a carrying means such as the conveyor 7, is positioned immediately below the suction unit 8, is stopped, and is then sent.

FIG. 1 shows a component supplying apparatus according to an embodiment of the present invention used in such an apparatus. These component supply devices are provided with a plurality of containers 1 each having a slope on the bottom surface and accommodating chip-shaped electronic components a, a ... In bulk form, one of which is shown in FIG.

As shown in FIG. 2, in these embodiments, the container 1 has a funnel-shaped bottom surface, and is fitted into the base member 38 forming the bottom wall of the container 1 and the peripheral portion of the base member 38. And a cylindrical tubular member 39 forming the peripheral wall of the container 1, and a through hole is formed in the central portion where the bottom surface of the base member 38 is the lowest. Further, the upper end of the component discharge pipe 49 is slidably fitted into the through hole of the base member 38, and the upper end of the pipe 49 is inserted into the container 1.
In the illustrated case, the component discharge pipe 49 is inserted so as to substantially coincide with the central axis of the container 1, and the upper end thereof is obliquely opened.

A spring arm 56 is mounted in the container 1. The spring arm shown in the drawing is made of a tenacious steel wire whose tip is bent in a J-shape, such as a piano wire, and the portion near the base end thereof is a fulcrum 58 at the tubular member 39 of the container 1.
It is swingably attached to the wall of the. Furthermore, the base end side is led out from the wall portion of the tubular member 39 to the outside thereof, and the weight 57 is attached thereto. On the other hand, the J-shaped tip is
It extends near the opposite bottom surface of the container 1.

A slide member 37 protruding from the center of the bottom surface of the base member 39 is slidably fitted in a recess of a guide member 36 fixed to the frame 35, whereby the container 1 is supported slidably in the vertical direction. There is. Further, the tubular member 38
An arm similar to that shown in FIG. 5 (indicated by the reference numeral 45 in FIG. 5) is attached to the upper part of the. Further, a vertical drive mechanism (shown by reference numeral 55 in FIG. 4) similar to that shown in FIG. 4 is connected to this arm via a bracket, and the container 1 is vertically moved by the power of a motor or the like. Is driven back and forth.

When the container 1 moves up and down, the spring arm 56 not only swings vertically due to its own weight, but also swings around the fulcrum 58 due to the inertia of the weight 57. Further, as shown in FIG. 3, the tip of the component discharge pipe 49 that moves up and down relative to the container 1 occasionally pushes up the portion of the spring arm 56 near the tip, causing the arm 56 to swing. This prevents the chip-shaped electronic components a, a ... As described above from having a bridge shape.

The weight 57 does not interfere with the discharge of the chip-shaped electronic components a, a ... To the component discharge pipe 49, inside the container 1, that is, between the fulcrum and the tip of the spring arm 56. It can also be provided. Further, by completely fixing the base end of the spring arm 56 to the container 1, the spring arm 56 is attached in a so-called cantilever state, and a light weight is attached to the tip, or such a weight is not provided. It is also effective as a structure in which the elasticity of the spring arm 56 can be fully utilized.

[Effects of the Invention] As described above, according to the present invention, the chip-shaped electronic component is less likely to be in a bridge state in the container, the component can be smoothly discharged, and the chip-shaped electronic component can be stably supplied,
Moreover, the chip-shaped electronic component is not damaged.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional side view of a main portion of a chip-shaped electronic component supply apparatus according to an embodiment of the present invention, FIG. 2 is an enlarged vertical sectional view showing the vicinity of the bottom of the container, and FIG. 3 is the same component supply. FIG. 4 is a partial cross-sectional side view showing an essential part of a chip-shaped electronic component mounting device provided with a conventional component supply device, FIG.
FIG. 5 is a vertical cross-sectional side view of essential parts of the conventional component supply device, and FIG. 6 is an enlarged vertical cross-sectional view showing the vicinity of the bottom of the container. 1 ... Container, 49 ... Component discharge pipe, 56 ... Spring arm, a ... Chip-shaped electronic component

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hirokazu Kobayashi 6-16-20 Ueno, Taito-ku, Tokyo Within Taiyo Denki Co., Ltd. (56) References: Sho 58-30627

Claims (1)

[Scope of utility model registration request] 1. A container (1) having a funnel-shaped slope on the bottom surface, in which chip-shaped electronic components (a) are stored in a bulk shape, and a container (1) having a bottom center to an upper end. And a container (1) slidably supported in the axial direction of the component discharge pipe (49) and having a component discharge pipe (49) slidably inserted therein. In a chip-shaped electronic component supply device having a drive mechanism for reciprocating the container (1) in the axial direction of the lever, a spring arm (56) having elasticity in the container (1)
Is attached, and its swingable free end is attached to the container (1).
Is arranged at a position where the tip end of the component discharge pipe (49) abuts with the reciprocating movement of (1), and a weight (57) for giving inertia to its free end is attached to the spring arm (56). Chip-shaped electronic component feeder.