JP4465791B2

JP4465791B2 - Electronic component supply method and electronic component supply apparatus

Info

Publication number: JP4465791B2
Application number: JP2000103053A
Authority: JP
Inventors: 秀浩佐保; 聡文和田; 純山内
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 2000-04-05
Filing date: 2000-04-05
Publication date: 2010-05-19
Anticipated expiration: 2020-04-05
Also published as: JP2001291994A

Description

【０００１】
【発明の属する技術分野】
本発明は、棒状中空の容器に収容された電子部品を送り出して供給する電子部品供給方法および電子部品供給装置に関するものである。
【０００２】
【従来の技術】
電子部品実装装置においては、電子部品の種類に応じて様々な形態の電子部品供給方法が用いられる。これらの電子部品供給の形態として、電子部品を棒状中空の容器であるスティック内に列状に収容しておき、電子部品を振動などの方法によって一定方向に搬送してピックアップ位置に順次供給する方法が知られている。以下従来の電子部品供給方法について図面を参照して説明する。
【０００３】
図５は従来の電子部品供給方法の説明図である。図５において、棒状中空の容器であるスティック１内には電子部品２が列状に収納されている。スティック１の先端部は水平姿勢で走路ブロック４に当接している。走路ブロック４には図外の振動手段により矢印方向の振動が付与されている。この振動はスティック１にも伝わり、この振動とスティック１の傾斜により電子部品２はスティック１から送り出されて走路ブロック４上に移動する。そして走路ブロック４に設けられた位置決め部４ａ内に送り込まれることにより位置決めされた状態の電子部品２は、供給対象装置である電子部品実装装置の移載ヘッドの吸着ノズル５によってピックアップされる。
【０００４】
【発明が解決しようとする課題】
ところで上記スティック１によって供給される種類の電子部品２は、プロトタイプ実装など比較的少数の部品を短期間で実装するケースに用いられる場合が多い。しかしながら、上記従来の電子部品供給方法では、スティック１から送り出された電子部品２が乗り移って位置決めされる走路ブロックが必要となる。この走路ブロックは、電子部品２の種類に応じて個別製作されしかも高精度を要する専用部品であるため、この走路ブロックの製作にコストと長期の製作期間を要する。このため従来のスティックを用いる電子部品供給方法では、少数部品を短期間で実装する必要があるケースへの対応が困難であるという問題点があった。
【０００５】
そこで本発明は、専用部品を必要とせず、低コスト・短期間で電子部品の供給が行える電子部品供給方法および電子部品供給装置を提供することを目的とする。
【０００６】
【課題を解決するための手段】
請求項１記載の電子部品供給方法は、棒状中空の容器に列状に収容された電子部品を送り出して供給対象装置の取り出しヘッドによる取り出し位置に供給する電子部品供給方法であって、ベース部材に振動防止板を介して装着された振動発生器と、振動発生器に傾斜して備えられた振動板と、振動板の上端部に固着されたプレートと、プレートの全端部に設けられた前記容器のガイド部材と、前記プレートに設けられて前記容器の中間部を上方より押える押え部材と、ピンの廻りに起倒自在に設けられて前記容器の後端部を下受けする下受け部材とを備え、前記容器の先端部の下面を前記ガイド部材の上面に当接させた状態で前記振動発生器を駆動することにより前記容器を振動させて電子部品を送り方向に搬送するものであり、前記容器の電子部品送り出し側の先端部に電子部品取り出し用の開口部を設けておき、供給対象装置の取り出しヘッドによりこの開口部を介して電子部品を直接取り出すようにした。
【０００７】
請求項２記載の電子部品供給装置は、内部に電子部品を列状に収容し供給対象装置に供給する棒状中空の容器を用いる電子部品供給装置であって、ベース部材に振動防止板を介して装着された振動発生器と、振動発生器に傾斜して備えられた振動板と、振動板の上端部に固着されたプレートと、プレートの全端部に設けられた前記容器のガイド部材と、前記プレートに設けられて前記容器の中間部を上方より押える押え部材と、ピンの廻りに起倒自在に設けられて前記容器の後端部を下受けする下受け部材とを備え、前記容器の先端部の下面を前記ガイド部材の上面に当接させた状態で前記振動発生器を駆動することにより前記容器を振動させて電子部品を送り方向に搬送するものであり、電子部品を収容する前記容器の電子部品送り出し側の先端部に、供給対象装置の取り出しヘッドによって電子部品を取り出すための開口部が形成されている。
【０００８】
本発明によれば、電子部品を収容する中空棒状の容器の電子部品送り出し側の先端部に電子部品取り出し用の開口部を設けておき、供給対象装置の取り出しヘッドによりこの開口部を介して電子部品を直接取り出すことにより、専用部品を必要とせず、低コスト・短期間で電子部品の供給が行える。
【０００９】
【発明の実施の形態】
次に本発明の実施の形態を図面を参照して説明する。図１は本発明の一実施の形態の電子部品供給装置の側面図、図２は本発明の一実施の形態の電子部品供給装置の平面図、図３、図４は本発明の一実施の形態の電子部品供給装置の部分斜視図である。
【００１０】
まず図１、図２を参照して電子部品供給装置の構造を説明する。図１においてベース部材１１には振動防止板１２を介して振動発生器１３が装着されている。振動発生器１３は所定の小角度αだけ傾斜した２枚の振動板１４を備えており、振動板１４の上端部はプレート１５に固着されている。ベース部材１１の後端部に配置されたコントローラ２５を操作して振動発生器１３を駆動することにより、振動板１４は矢印ａ方向に振動し、この振動はプレート１５に伝達される。このとき振動防止板１２によりベース部材１１への振動伝達が抑制される。
【００１１】
プレート１５の前端部には電子部品収納用容器であるスティック１のガイド部材１６が設けられている。スティック１は樹脂材料などで製作された棒状中空の容器であり、スティック１内には電子部品２が列状に多数収容されている。スティック１の電子部品送り出し側の先端部には、スティック１の上面側を電子部品１つ分を超える長さ範囲だけ除去することにより、電子部品取り出し用の開口部１ｃ（図３も参照）が設けられている。
【００１２】
スティック１を電子部品供給装置に装着した状態では、スティック１の先端部１ａの端面１ｂ（図３（ｂ）参照）は、ガイド部材１６に設けられたストッパ部１６ａの端面に当接する。スティック１はプレート１５に設けられた押え部材２０，２１により中間部を上方から押えられており、さらにスティック１の後端部は延長部材２２にピン２４の廻りに起倒自在に設けられた下受け部材２３によって下受けされている。このとき、押え部材２０，２１と下受け部材２３は、スティック１に上向きのそりを与えるような位置関係に設定されており、これによりスティック１の端面１ｂは略水平方向からストッパ部１６ａの端面に当接する。本実施の形態では、３本のスティック１を同時に装着可能な多連タイプの例を示している。
【００１３】
図３（ａ）に示すようにスティック１の先端部１ａの下面をガイド部材１６の上面に当接させた状態で、振動発生器１３を駆動することにより、プレート１５に伝達された振動はガイド部材１６を介してスティック１を振動させる。すなわち、電子部品２の送り方向（図１，２において右方）の振動成分を含む振動がスティック１に伝達されることにより、電子部品２は、図３（ｂ）に示すように送り方向に搬送され、電子部品の取り出し側の先端部１ａに到達する。先端部１ａに到達した電子部品は、開口部１ｃを介して上方から取り出しヘッドの吸着ノズル３２によってピックアップ可能な状態となる。
【００１４】
プレート１５上でのガイド部材１６の長手方向位置は調整が可能となっており、ガイド部材１６の位置を調整することによりストッパ部１６ａの位置が調整される。したがって電子部品２の停止位置、すなわち供給対象装置の取り出しヘッドの吸着ノズル３２（図３（ａ）参照）によるピックアップ位置を調整することができる。
【００１５】
電子部品２の供給を継続的に行う過程において、１つのスティック１内の電子部品２の数が減少したならば、図４に示すように新たなスティック１’から電子部品の補給を行う。すなわち、新たなスティック１’を傾斜させて端面を既装着のスティック１の後端面に位置合わせする。これにより、新たなスティック１に収容されている電子部品２が既装着のスティック１に移動し、電子部品２の補給が行われる。すなわち、先端部に開口部１ｃを設けるのは供給装置に装着される１部のスティックのみでよく、単に電子部品２の収容にのみ用いられるスティック１’には、取り出し用の開口部を設けなくてもよい。
【００１６】
上記説明したように、電子部品２を収容するスティック１の先端部に電子部品取り出し用の開口部１ｃを設けておき、電子部品供給装置にスティック１を装着した状態でこの開口部１ｃを介して電子部品２を直接取り出すことにより、従来はスティック１から送り出された電子部品２をガイドして位置決めするために各スティック種類に対応して個別に製作されていた専用部品を必要とせず、電子部品の取り出しが行える。したがって、少数量の電子部品を対象として短期間で実装等の作業を行うことが求められる場合にあっても、専用部品の手配に期間を要することなく低コスト・短期間で電子部品の供給作業を実行することができる。
【００１７】
【発明の効果】
本発明によれば、電子部品を収容する中空棒状の容器の電子部品送り出し側の先端部に電子部品取り出し用の開口部を設けておき、供給対象装置の取り出しヘッドによりこの開口部を介して電子部品を直接取り出すようにしたので、専用部品を必要とせず、低コスト・短期間で電子部品の供給作業を実行することができる。
【図面の簡単な説明】
【図１】本発明の一実施の形態の電子部品供給装置の側面図
【図２】本発明の一実施の形態の電子部品供給装置の平面図
【図３】本発明の一実施の形態の電子部品供給装置の部分斜視図
【図４】本発明の一実施の形態の電子部品供給装置の部分斜視図
【図５】従来の電子部品供給方法の説明図
【符号の説明】
１スティック
１ａ先端部
１ｃ開口部
２電子部品
１１ベース部材
１３振動発生器
１４振動板
１６ガイド部材[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component supply method and an electronic component supply apparatus that send and supply electronic components accommodated in a rod-shaped hollow container.
[0002]
[Prior art]
In an electronic component mounting apparatus, various types of electronic component supply methods are used according to the type of electronic component. As a form of supplying these electronic components, a method in which the electronic components are accommodated in a row in a stick that is a rod-shaped hollow container, and the electronic components are conveyed in a certain direction by a method such as vibration and sequentially supplied to a pickup position. It has been known. A conventional electronic component supply method will be described below with reference to the drawings.
[0003]
FIG. 5 is an explanatory view of a conventional electronic component supply method. In FIG. 5, the electronic components 2 are accommodated in a row in a stick 1 which is a rod-like hollow container. The tip of the stick 1 is in contact with the runway block 4 in a horizontal posture. The runway block 4 is given vibration in the direction of the arrow by vibration means (not shown). This vibration is also transmitted to the stick 1, and the electronic component 2 is sent out from the stick 1 by the vibration and the inclination of the stick 1 and moves onto the runway block 4. Then, the electronic component 2 positioned by being fed into the positioning portion 4a provided in the runway block 4 is picked up by the suction nozzle 5 of the transfer head of the electronic component mounting apparatus that is the supply target apparatus.
[0004]
[Problems to be solved by the invention]
By the way, the electronic component 2 of the type supplied by the stick 1 is often used in a case where a relatively small number of components such as prototype mounting are mounted in a short period of time. However, the above-described conventional electronic component supply method requires a runway block on which the electronic component 2 delivered from the stick 1 is transferred and positioned. Since this runway block is a dedicated part that is individually manufactured according to the type of the electronic component 2 and requires high precision, the production of this runway block requires cost and a long production period. For this reason, the conventional electronic component supply method using a stick has a problem that it is difficult to cope with a case where a small number of components must be mounted in a short period of time.
[0005]
Therefore, an object of the present invention is to provide an electronic component supply method and an electronic component supply apparatus that can supply electronic components at low cost and in a short period of time without requiring dedicated components.
[0006]
[Means for Solving the Problems]
The electronic component supply method according to claim 1 is an electronic component supply method for supplying an electronic component accommodated in a row in a rod-shaped hollow container and supplying the electronic component to a take-out position by a take-out head of a supply target device. A vibration generator mounted via a vibration prevention plate, a vibration plate provided at an inclination to the vibration generator, a plate fixed to the upper end portion of the vibration plate, and the plate provided at all end portions of the plate A guide member for the container, a pressing member provided on the plate for pressing the intermediate part of the container from above, and a lower receiving member provided for lowering around the pin and receiving the rear end of the container. The container is vibrated by driving the vibration generator in a state where the lower surface of the tip of the container is in contact with the upper surface of the guide member, and the electronic component is conveyed in the feeding direction. Of the container May be provided an opening for the electronic component pickup at the tip of the electronic component feeding side, it was taken out of the electronic component directly through the opening by the pick head of the supply target device.
[0007]
The electronic component supply apparatus according to claim 2 is an electronic component supply apparatus that uses a rod-shaped hollow container that houses the electronic components in a row and supplies the supply target device to the supply target device. A mounted vibration generator, a vibration plate inclined to the vibration generator, a plate fixed to an upper end portion of the vibration plate, and a guide member of the container provided at all end portions of the plate ; A holding member that is provided on the plate and presses an intermediate portion of the container from above; and a lower receiving member that is provided so as to be able to rise and fall around a pin and receives the rear end portion of the container. The container is vibrated by driving the vibration generator in a state in which the lower surface of the tip is in contact with the upper surface of the guide member, and the electronic component is conveyed in the feeding direction, and the electronic component is accommodated in the container. Electronic component delivery side of container The distal end portion, an opening is formed for taking out the electronic components supply target device pick head.
[0008]
According to the present invention, an opening for taking out an electronic component is provided at the distal end of the hollow rod-like container that houses the electronic component on the electronic component delivery side, and the electronic device is connected via the opening by the takeout head of the supply target device. By taking out the parts directly, it is possible to supply electronic parts at a low cost and in a short period of time without the need for dedicated parts.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a side view of an electronic component supply apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of the electronic component supply apparatus according to an embodiment of the present invention, and FIGS. It is a fragmentary perspective view of the electronic component supply apparatus of a form.
[0010]
First, the structure of the electronic component supply apparatus will be described with reference to FIGS. In FIG. 1, a vibration generator 13 is attached to the base member 11 via a vibration preventing plate 12. The vibration generator 13 includes two diaphragms 14 inclined by a predetermined small angle α, and the upper end portion of the diaphragm 14 is fixed to the plate 15. By operating the controller 25 disposed at the rear end of the base member 11 to drive the vibration generator 13, the diaphragm 14 vibrates in the direction of arrow a, and this vibration is transmitted to the plate 15. At this time, vibration transmission to the base member 11 is suppressed by the vibration preventing plate 12.
[0011]
A guide member 16 of the stick 1 that is an electronic component storage container is provided at the front end of the plate 15. The stick 1 is a rod-shaped hollow container made of a resin material or the like, and a large number of electronic components 2 are accommodated in the stick 1 in a row. An opening 1c (see also FIG. 3) for taking out the electronic component is provided at the tip of the electronic component delivery side of the stick 1 by removing the upper surface side of the stick 1 by a length range exceeding one electronic component. Is provided.
[0012]
In a state in which the stick 1 is mounted on the electronic component supply device, the end surface 1b (see FIG. 3B) of the tip 1a of the stick 1 abuts on the end surface of the stopper 16a provided on the guide member 16. The stick 1 has its intermediate portion pressed from above by holding members 20 and 21 provided on the plate 15, and the rear end portion of the stick 1 is a lower portion provided on the extension member 22 so that it can be tilted around a pin 24. It is received by the receiving member 23. At this time, the holding members 20, 21 and the lower receiving member 23 are set to have a positional relationship that gives an upward warp to the stick 1, so that the end face 1b of the stick 1 extends from the substantially horizontal direction to the end face of the stopper portion 16a. Abut. In the present embodiment, an example of a multiple type in which three sticks 1 can be simultaneously mounted is shown.
[0013]
As shown in FIG. 3A, the vibration transmitted to the plate 15 is guided by driving the vibration generator 13 with the lower surface of the tip 1a of the stick 1 in contact with the upper surface of the guide member 16. The stick 1 is vibrated through the member 16. That is, the vibration including the vibration component in the feeding direction (right side in FIGS. 1 and 2) of the electronic component 2 is transmitted to the stick 1, so that the electronic component 2 is moved in the feeding direction as shown in FIG. It is conveyed and reaches the leading end 1a on the electronic component take-out side. The electronic component that has reached the tip 1a is taken out from above through the opening 1c and can be picked up by the suction nozzle 32 of the head.
[0014]
The longitudinal position of the guide member 16 on the plate 15 can be adjusted. By adjusting the position of the guide member 16, the position of the stopper portion 16a is adjusted. Therefore, the stop position of the electronic component 2, that is, the pickup position by the suction nozzle 32 (see FIG. 3A) of the takeout head of the supply target device can be adjusted.
[0015]
If the number of electronic components 2 in one stick 1 decreases in the process of continuously supplying the electronic components 2, the electronic components are replenished from a new stick 1 'as shown in FIG. That is, the new stick 1 ′ is inclined to align the end face with the rear end face of the already-attached stick 1. Thereby, the electronic component 2 accommodated in the new stick 1 moves to the already-attached stick 1, and the electronic component 2 is replenished. That is, the opening 1c may be provided at the tip portion only with one stick attached to the supply device, and the stick 1 'used only for housing the electronic component 2 is not provided with an opening for taking out. May be.
[0016]
As described above, an opening 1c for taking out an electronic component is provided at the tip of the stick 1 that accommodates the electronic component 2, and the stick 1 is attached to the electronic component supply device through the opening 1c. By directly taking out the electronic component 2, there is no need for a dedicated component that has been manufactured individually for each stick type in order to guide and position the electronic component 2 that has been fed from the stick 1. Can be taken out. Therefore, even when it is required to perform work such as mounting for a small amount of electronic parts in a short period of time, it is possible to supply electronic parts at low cost and in a short period of time without requiring a period for arranging dedicated parts. Can be executed.
[0017]
【The invention's effect】
According to the present invention, an opening for taking out an electronic component is provided at the distal end of the hollow rod-like container that houses the electronic component on the electronic component delivery side, and the electronic device is connected via the opening by the takeout head of the supply target device. Since the parts are directly taken out, no special parts are required, and the electronic parts can be supplied at low cost and in a short period of time.
[Brief description of the drawings]
FIG. 1 is a side view of an electronic component supply apparatus according to an embodiment of the present invention. FIG. 2 is a plan view of an electronic component supply apparatus according to an embodiment of the present invention. FIG. 4 is a partial perspective view of an electronic component supply apparatus according to an embodiment of the present invention. FIG. 5 is an explanatory view of a conventional electronic component supply method.
DESCRIPTION OF SYMBOLS 1 Stick 1a Tip part 1c Opening part 2 Electronic component 11 Base member 13 Vibration generator 14 Diaphragm 16 Guide member

Claims

An electronic component supply method for feeding electronic components housed in a row in a rod-shaped hollow container and supplying them to a take-out position by a take-out head of a supply target device, wherein vibration is generated by mounting the base member via a vibration prevention plate A vibration plate inclined to the vibration generator, a plate fixed to the upper end portion of the vibration plate, a guide member of the container provided at the front end portion of the plate, and a plate provided on the plate A holding member that presses the middle portion of the container from above; and a lower receiving member that is provided to be able to be raised and lowered around a pin and that receives the rear end portion of the container. The container is vibrated by driving the vibration generator while being in contact with the upper surface of the guide member, and the electronic component is conveyed in the feeding direction. Part It may be provided an opening for taking out an electronic component feeding method characterized by taking out an electronic component directly through the opening by the pick head of the supply target device.

An electronic component supply device that uses a hollow rod-shaped container that houses electronic components in a row and supplies them to a supply target device, and includes a vibration generator mounted on a base member via a vibration prevention plate, and a vibration generator The plate provided at an upper end of the vibration plate, the guide member of the container provided at the front end of the plate, and the intermediate portion of the container provided on the plate. A holding member that can be pressed from above, and a lower receiving member that can be moved up and down around the pin and that receives the rear end of the container. The lower surface of the front end of the container is brought into contact with the upper surface of the guide member. Drive the vibration generator in contact with the container to vibrate the container and transport the electronic component in the feeding direction, and supply the tip of the container containing the electronic component on the electronic component feeding side Removing the target device Electronic component supplying apparatus, wherein the opening for taking out the electronic components head is formed.