JP2022041400A - Component mounting device and component mounting method - Google Patents

Abstract

To provide a component mounting device and a component mounting method that can surely separate, from a nozzle, a component to be dumped and prevent a decrease in productivity due to interruption of work.SOLUTION: After a mounting head suctions, to a nozzle, a component supplied by a parts feeder, to pick it up (a component pick-up step in step ST2), quality of the component is determined (a determination step of step ST4). Then, from among the picked-up components, the component determined to be in good condition is mounted on a board (a component mounting step of step ST5 and step ST6), and the component determined to be in poor condition is dumped into a dumping component storage box without being mounted on the board (a component dumping step of step ST8). When the component is dumped, the mounting head is minutely vibrated laterally to shake the component off the nozzle.SELECTED DRAWING: Figure 5

Description

The present invention relates to a component mounting device and a component mounting method for mounting a component picked up by a mounting head on a nozzle on a substrate.

The component mounting device for mounting components on the board has a configuration in which the mounting head sucks the components supplied by the parts feeder to the nozzle and picks them up, and mounts the picked up components on the board positioned at the work position by the board positioning unit. It has become. In such a component mounting device, the quality of the component is determined by taking an image of the component picked up by the mounting head with a camera or the like. Then, the parts judged to be in good condition are mounted on the board, and the parts judged to be in poor condition are dropped into a defective product collection box prepared in advance and collected. (For example, see Patent Document 1 below).

Japanese Unexamined Patent Publication No. 6-177593

However, even if the adsorption of the component by the nozzle is released, if a sticky substance such as a paste adheres between the component and the nozzle, the component may not be easily detached from the nozzle. In such a case, after stopping the operation of the component mounting device, the operator must manually pull the component away from the nozzle, and during that time, the work by the component mounting device must be interrupted. There was a problem that productivity decreased.

Therefore, an object of the present invention is to provide a component mounting device and a component mounting method capable of reliably separating a component to be dumped from a nozzle and preventing a decrease in productivity due to interruption of work.

The component mounting device of the present invention is provided with a substrate positioning unit that positions the substrate at a working position, a parts feeder that supplies components, and a component feeder that is movably provided in the horizontal direction, and sucks components supplied by the component feeder to a nozzle. Of the mounting heads that are picked up by the mounting head, the determination unit that determines the quality of the parts picked up by the mounting head, and the parts that the mounting head picks up, the parts that are determined to be in good condition by the determination unit. Is mounted on the board positioned at the working position, and the component determined to be in a bad state by the determination unit is not mounted on the board but is dumped to a predetermined component dumping section. The operation control unit includes an operation control unit that operates the head, and the operation control unit causes the mounting head to vibrate laterally in a minute manner when the component is dumped by the mounting head.

The component mounting method of the present invention includes a board positioning step of positioning the board at a working position, a component pick-up process in which a mounting head sucks a component supplied by a parts feeder to a nozzle and picks it up, and the mounting head picks up the component. Of the parts picked up by the mounting head in the parts picking process and the determination process for determining the quality of the parts picked up in the process, the parts determined to be in good condition in the determination process are in the working position. Of the parts picked up by the mounting head in the component mounting step of operating the mounting head so as to be mounted on the positioned substrate and the component picking process, it is determined in the determination step that the state is defective. When a component dumping step of operating the mounting head so that the component is dumped to a predetermined component dumping section without being mounted on the substrate is included, and the component is dumped by the mounting head in the component dumping step. The mounting head is slightly vibrated laterally to shake off the component from the nozzle.

According to the present invention, the part to be dumped can be surely separated from the nozzle, and the decrease in productivity due to the interruption of work can be prevented.

Perspective view of the main part of the component mounting device according to the embodiment of the present invention. Top view of the main part of the component mounting device according to the embodiment of the present invention. A block diagram showing a control system of a component mounting device according to an embodiment of the present invention. The figure which shows the state which the mounting head provided in the component mounting apparatus in one Embodiment of this invention is slightly vibrated in the lateral direction. A flowchart showing the flow of component mounting work by the component mounting device according to the embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, the structure of the component mounting device 1 will be described with reference to FIGS. 1 and 2. In FIGS. 1 and 2, the component mounting device 1 is a device for mounting the component BH on the substrate KB, and includes a base 11, a conveyor 12, a plurality of component feeders 13, a head moving mechanism 14, a mounting head 15, and a component recognition camera. 16. It is equipped with a dumping parts storage box 17 and a control device 18.

In FIGS. 1 and 2, the conveyor 12 extends from the central portion of the base 11 in the left-right direction (X-axis direction), and is provided by a pair of conveyor belts 12a arranged so as to face each other in the front-rear direction (Y-axis direction). , Both ends of the substrate KB are supported from below and conveyed. The conveyor 12 receives the substrate KB sent from the upstream side, conveys it to the central portion side of the base 11, and positions it at a predetermined work position. That is, in the present embodiment, the conveyor 12 is a substrate positioning unit that positions the substrate KB at the working position.

In FIGS. 1 and 2, the plurality of parts feeders 13 are attached side by side in the X-axis direction to the feeder base 11F provided on the front side of the conveyor 12 as seen from the operator OP. Each part feeder 13 supplies the part BH mounted on the substrate KB to the part supply port 13K provided at the end on the conveyor 12 side.

In FIGS. 1 and 2, the head moving mechanism 14 is a fixed beam 14A fixed to the base 11 and extended in the Y-axis direction, and a movement supported by the fixed beam 14A on one end side and extended in the X-axis direction. It is equipped with a beam 14B. The mounting head 15 is mounted on the moving beam 14B.

A beam moving linear motor 14C is provided between the fixed beam 14A and the moving beam 14B, and the moving beam 14B moves on the fixed beam 14A in the Y-axis direction by the operation of the beam moving linear motor 14C. A head moving linear motor 14D is provided between the moving beam 14B and the mounting head 15, and the mounting head 15 moves on the moving beam 14B in the X-axis direction by the operation of the head moving linear motor 14D. The mounting head 15 moves in the horizontal plane (XY) in the upper region of the base 11 by combining the movement in the Y-axis direction by the operation of the beam moving linear motor 14C and the movement in the X-axis direction by the operation of the head moving linear motor 14D. It can move freely in the in-plane direction.

In FIG. 1, the mounting head 15 includes a plurality of nozzles 15N extending downward. Each nozzle 15N is driven by a nozzle drive unit 15A provided in the mounting head 15 to perform an elevating operation with respect to the mounting head 15 and a rotating operation around the Z axis. Vacuum pressure can be supplied to each nozzle 15N through a valve unit 15B provided on the mounting head 15, whereby an attractive force can be generated at the lower end of each nozzle 15N. Further, a positive pressure can be applied to the nozzles 15N through the valve unit 15B, whereby air can be blown out from the lower end of each nozzle 15N.

In FIGS. 1 and 2, the parts recognition camera 16 is provided in the area between the conveyor 12 of the base 11 and the parts feeder 13. The component recognition camera 16 has the image pickup optical axis directed upward, and the component BH picked up by the mounting head 15 attracted to the nozzle 15N is imaged from below.

The dumped parts storage box 17 is a container that opens upward, and is provided on the side of the parts recognition camera 16 so as to be detachably attached to the base 11. Of the parts BH picked up by the mounting head 15, the parts BH picked up by the mounting head 15 and determined to be in poor condition and should not be mounted on the board KB as a result of being recognized by the parts recognition camera 16 are dumped in the dumped parts storage box 17. Will be done. The parts BH dumped in the dumped parts storage box 17 are collected by removing the dumped parts storage box 17 at an appropriate time.

In FIG. 3, the control device 18 controls the operation of each part included in the component mounting device 1. Specifically, the control device 18 operates the transfer conveyor 12 to transfer the substrate KB and position it at the work position, and operates each part feeder 13 to supply the component BH to the component supply port 13K. Further, the control device 18 operates the beam moving linear motor 14C and the head moving linear motor 14D to move the mounting head 15 in the horizontal plane. Further, the control device 18 operates the nozzle drive unit 15A to raise and lower and rotate each nozzle 15N. Further, the valve unit 15B is operated to generate an suction force at the lower end of each nozzle 15N, or air is blown out from the lower end of the nozzle 15N. Further, the control device 18 causes the component recognition camera 16 to take an image of the component BH picked up by the mounting head 15 attracted to the nozzle 15N, and recognizes the component BH.

In FIG. 3, the control device 18 includes a storage unit 21, an operation control unit 22, and a determination unit 23. In addition to the component mounting program that defines the execution procedure of the component mounting work, the storage unit 21 stores various data such as the type and size of the component BH to be mounted on the board KB. The operation control unit 22 operates each part of the component mounting device 1 in a predetermined order based on the component mounting program stored in the storage unit 21, and mounts the component BH at each target mounting coordinate defined on the board KB. ..

The determination unit 23 determines whether the condition of the component BH picked up by the mounting head 15 is good or bad. Here, "good or bad of the state of the part BH" means not only the good or bad of the part BH itself (whether or not there is a defective part) but also the good or bad of the suction state of the part BH with respect to the nozzle 15N (suction to the nozzle 15N in a normal posture). Whether or not it is done) etc. In the present embodiment, the determination unit 23 determines whether or not the state of the component BH is good or bad based on an image obtained by capturing the component BH picked up by the mounting head 15 by the component recognition camera 16.

The operation control unit 22 of the control device 18 has a substrate in which the component BH of the component BH picked up by the mounting head 15 is positioned at the working position for the component BH determined to be in good condition by the determination unit 23. The mounting head 15 is operated so that it can be mounted on the KB. On the other hand, the operation control unit 22 considers that it is inappropriate to mount the component BH picked up by the mounting head 15 on the board KB, which is determined to be in a bad state by the determination unit 23. The mounting head 15 is operated so that the mounting head 15 is dumped into a predetermined component dumping section (here, the dumping component storage box 17) without being mounted on the board KB.

Here, when the mounting head 15 is to dump the component BH, the operation control unit 22 moves the mounting head 15 above the dumped component storage box 17 to release the suction of the component BH by the nozzle 15N. Then, the head moving linear motor 14D is operated, and the mounting head 15 is slightly vibrated in the lateral direction (here, the X-axis direction which is the direction along the moving beam 14B) so that the component BH is shaken off from the nozzle 15N. (Fig. 4). Therefore, even if a sticky substance such as a paste is attached between the component BH and the nozzle 15N, the component BH can be reliably separated from the nozzle 15N.

Further, the operation control unit 22 operates the valve unit 15B while the mounting head 15 is slightly vibrated in the lateral direction, and the nozzle 15N (at least the nozzle sucking the component BH determined to be in a bad state) is sucked. A positive pressure is applied to 15N). As a result, air is blown from the lower end of the nozzle 15N, and the component BH is pushed downward from the lower end of the nozzle 15N, so that the component BH is more reliably separated from the nozzle 15N.

Next, the flow of the component mounting work (component mounting method) executed by the component mounting device 1 will be described with reference to the flowchart shown in FIG. In the component mounting work, first, the conveyor 12 receives the board KB sent from the upstream side, conveys it, and positions it at the work position (board positioning step of step ST1).

When the board KB is positioned at the work position, the head moving mechanism 14 moves the mounting head 15 above the parts feeder 13. When the mounting head 15 moves above the parts feeder 13, the parts BH supplied by the parts feeder 13 are attracted to each of the plurality of nozzles 15N and picked up (part pick-up step in step ST2).

After the mounting head 15 picks up the component BH, the head moving mechanism 14 moves the mounting head 15 so that the component BH picked up by the mounting head 15 passes above the component recognition camera 16. The component recognition camera 16 takes an image of the component BH when the component BH passes above, and the control device 18 recognizes the component BH based on the image obtained by the image taken by the component recognition camera 16 (part recognition in step ST3). Process).

When the control device 18 recognizes the component BH as described above, the determination unit 23 determines whether or not the state of each component BH picked up by the mounting head 15 is good or bad (determination step of step ST4). As a result, when there is no component BH determined to be in a bad state, the head moving mechanism 14 moves the mounting head 15 above the board KB, and the mounting head 15 moves the picked up component BH to the board KB. It is mounted at the set target mounting coordinates (part mounting process in step ST5). When the mounting head 15 mounts the component BH at the target mounting coordinates, the position is corrected based on the recognition result of the component BH.

On the other hand, in the determination step of step ST4, when there is a component BH determined to be in a bad state, the control device 18 moves the mounting head 15 above the substrate KB and the state is good. After mounting only the component BH determined to be the above on the substrate KB (step ST6, component mounting step), the mounting head 15 is moved above the dumped component storage box 17 (step ST7, mounting head moving step). Then, after releasing the adsorption of the component BH by the nozzle 15N, air is blown out from the lower end of the nozzle 15N while the mounting head 15 is slightly vibrated in the lateral direction (here, the X-axis direction which is the direction along the moving beam 14B). By causing the parts BH to be dumped into the dumped parts storage box 17 (step ST8, the parts dumping step).

When the control device 18 executes the component dumping step of step ST8, the component BH determined to be in a bad state in the determination process of step ST4, that is, all the component BHs to be dumped are separated from the nozzle 15N. It is determined whether or not (step ST9). This determination is made by moving the mounting head 15 above the component recognition camera 16 and using the component recognition camera 16 to image the nozzle 15N that has picked up the component BH to be dumped. Alternatively, the pressure in the nozzle 15N may be measured, and it may be determined from the pressure value whether or not the component BH has fallen off from the nozzle 15N.

When it is determined in step ST9 that at least one component BH among the component BHs to be dumped has not separated from the nozzle 15N, the control device 18 manually performs the nozzle 15N by the operator OP. The operation of the component mounting device 1 is temporarily stopped so that the operation of removing the component BH from the component BH can be performed (step ST10). On the other hand, when the component BH is mounted on the substrate KB in the component mounting process of step ST5, or when it can be confirmed that all the component BHs to be dumped have been separated from the nozzle 15N in step ST9, step ST11 Proceed to.

In step ST11, it is determined whether or not all the parts BH to be mounted are mounted on the board KB that is currently the target of mounting the parts. As a result, if there is a component BH that has not yet been mounted on the board KB, the process returns to step ST2 to pick up the component BH by the nozzle 15N. On the other hand, when it is determined in step ST11 that all the parts BH to be mounted on the board KB have been mounted, the conveyor 12 carries out the board KB to the downstream side of the component mounting device 1 (step ST12). As a result, the component mounting work for the board KB currently targeted for component mounting is completed.

As described above, in the component mounting device 1 according to the present embodiment, when the component BH determined to be in a bad state by the determination unit 23 is dumped into the component dumping unit (discarded component storage box 17), the mounting head The component BH is shaken off from the nozzle 15N by slightly vibrating the 15 in the lateral direction. As a result, the component BH to be dumped can be reliably separated from the nozzle 15N, so that it is not necessary for the operator OP to manually separate the component BH from the nozzle 15N by stopping the operation of the component mounting device 1. It is possible to prevent a decrease in productivity due to interruption of work.

Although the embodiments of the present invention have been described so far, the present invention is not limited to the above-mentioned ones, and various modifications and the like are possible. For example, in the above-described embodiment, when the component BH to be dumped is shaken off from the nozzle 15N, air is blown out from the lower end of the nozzle 15N, but this air blowing is not essential and the component. After releasing the adsorption of BH, the mounting head 15 may only be slightly vibrated in the lateral direction.

Further, in the above-described embodiment, the head moving mechanism 14 for freely moving the mounting head 15 in the horizontal plane is driven by a drive system using a linear motor (beam moving linear motor 14C and head moving linear motor 14D). Although it was configured, it may be driven by another drive system such as a drive system using a ball screw instead of a linear motor.

Further, in the above-described embodiment, the box-shaped member (discarded parts storage box 17) is used as the parts dumping section, but the parts dumping section does not have to be a box-shaped member, and may be a stage-shaped member, a conveyor, or the like. It doesn't matter.

Provided are a component mounting device and a component mounting method capable of reliably separating a component to be dumped from a nozzle and preventing a decrease in productivity due to interruption of work.

1 Parts mounting device 12 Conveyor conveyor (board positioning unit)
13 Parts feeder 14 Head movement mechanism 15 Mounting head 15N Nozzle 16 Parts recognition camera (camera)
17 Disposal parts storage box (parts dumping section)
22 Operation control unit 23 Judgment unit BH parts KB board

Claims (6)

A board positioning unit that positions the board at the work position,
The parts feeder that supplies the parts and
A mounting head that is movably provided in the horizontal plane and picks up the parts supplied by the parts feeder by adsorbing them to the nozzle.
A determination unit that determines the quality of the parts picked up by the mounting head, and
Among the parts picked up by the mounting head, the parts determined to be in good condition by the determination unit are mounted on the substrate positioned at the work position, and the determination unit determines that the condition is poor. The component is provided with an operation control unit that operates the mounting head so that the component is dumped to a predetermined component dumping section without being mounted on the substrate.
The operation control unit is a component mounting device that slightly vibrates the mounting head in the lateral direction when the mounting head dumps the component. The component mounting device according to claim 1, wherein the mounting head blows air from the lower end of the nozzle when the component is dumped. The component according to claim 1 or 2, further comprising a camera that captures an image of the component picked up by the mounting head, wherein the determination unit determines the quality of the component based on the image of the component acquired by the camera. Mounting device. The board positioning process that positions the board at the work position and
The parts pickup process in which the mounting head sucks the parts supplied by the parts feeder to the nozzle and picks them up.
A determination step of determining whether the state of the component picked up by the mounting head in the component pickup process is good or bad, and
Among the parts picked up by the mounting head in the component pick-up process, the mounting head is operated so that the component determined to be in a good state in the determination step is mounted on the substrate positioned at the working position. The parts mounting process to be made and
Among the parts picked up by the mounting head in the component pick-up process, the component determined to be in a bad state in the determination step is dumped to a predetermined component dumping section without being mounted on the substrate. Including the parts dumping process that operates the mounting head,
A component mounting method in which, when a component is dumped by the mounting head in the component dumping step, the mounting head is slightly vibrated laterally to shake off the component from the nozzle. The component mounting method according to claim 4, wherein in the component dumping step, air is blown from the lower end of the nozzle to push the component downward from the lower end of the nozzle. The component mounting method according to claim 4 or 5, wherein in the determination step, the quality of the component is determined based on the image of the component picked up by the mounting head by the camera.

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