JP4475204B2 - Method for cleaning nozzle of electronic component mounting apparatus, electronic component mounting apparatus, and electronic component mounting method - Google Patents

Description

  The present invention relates to a cleaning device for cleaning a nozzle provided in an electronic component mounting apparatus, a nozzle cleaning method in the electronic component mounting apparatus, and the like.

  2. Description of the Related Art In the field of picking up electronic components and mounting them on a workpiece such as a substrate, a mounting apparatus having a suction nozzle that picks up and picks up electronic components is known. A suction hole for sucking an electronic component is provided at the tip of the suction nozzle, and the electronic component is vacuum-sucked and picked up by vacuum suction inside the suction hole.

  The suction holes are very small holes, and air is sucked from these small holes during vacuum suction, so fine foreign substances such as airborne dust and mounting equipment oil mist adhere to the periphery of the suction holes. May accumulate. When such a foreign substance accumulates inside the suction hole, the suction hole, which is a minute hole, is clogged and the suction force is reduced. In addition, when foreign matter accumulates on the tip of the suction hole, there is a problem that the suction posture of the electronic component becomes unstable. Furthermore, when the electronic component vacuum-sucked by the nozzle is suction-destructed, there is a problem that the accumulated foreign matter is scattered by the compressed air blown from the suction hole and adheres to the electronic component or the substrate.

As means for solving such a problem, there has been proposed an apparatus for cleaning a nozzle by sliding the nozzle on a cleaning tape impregnated with a cleaning liquid (see, for example, Patent Document 1).
JP 2004-247498 A

  However, since the apparatus disclosed in Patent Document 1 includes a mechanism for impregnating the cleaning liquid with the cleaning liquid, it is expensive and requires time and labor for maintenance.

  Accordingly, an object of the present invention is to provide a nozzle cleaning device and a nozzle cleaning method in an electronic component mounting apparatus that can clean the nozzles cleanly without using a cleaning liquid.

A first aspect of the present invention is an electronic component mounting apparatus that picks up an electronic component supplied from an electronic component supply unit and mounts the electronic component on a substrate, and a plurality of nozzles that can independently move horizontally, vertically move, and rotate An intake / exhaust source that performs intake / exhaust in the suction hole of the nozzle, a control unit that controls horizontal movement operation, vertical movement operation and rotation operation of the nozzle, and intake / exhaust operation in the suction hole, and the nozzle A horizontal movement operation, a vertical movement operation and a rotation operation, and a storage unit storing a cleaning operation program in which driving amounts and driving times in the suction holes in the suction holes are combined in various patterns, and An opening into which the lower end of the nozzle is inserted; a cleaning tape that contacts and cleans the lower end of the nozzle; and A tape feeding unit to send the tape to the opening, the lower the cleaning tape groove along the feed direction of the is provided for supporting the cleaning tape sent to the opening from below at both ends of the groove A cleaning device including a receiving unit is provided in the electronic component supply unit, and the control unit performs operation control of the nozzle based on any cleaning operation program stored in the storage unit, thereby lowering the lower end of the nozzle. The part is rubbed against the cleaning tape pressed into the concave groove for cleaning.

Invention of Claim 2 is the cleaning method of the nozzle of the electronic component mounting apparatus of Claim 1 , Comprising: The said cleaning tape is pushed in into the said ditch | groove with the lower end part of the said nozzle inserted in the said opening part, With the cleaning tape in contact with the lower end of the nozzle, the operation of the nozzle is controlled based on any cleaning operation program stored in the storage unit, thereby cleaning the lower end of the nozzle. Clean by rubbing against the tape.

Substrate According to a third aspect of the invention, there is provided an electronic component mounting method according to the electronic component mounting apparatus according to claim 1 wherein, the adsorption to the electronic component supplied from the electronic component supply unit to the nozzle is positioned to pick up In the state where the cleaning tape is pressed into the concave groove by the lower end of the nozzle inserted into the opening and the cleaning tape is in contact with the lower end of the nozzle. Cleaning the nozzle of the electronic component mounting apparatus that performs cleaning by rubbing the lower end portion of the nozzle against the cleaning tape by performing operation control of the nozzle based on any cleaning operation program stored in the storage unit Process.

  According to the present invention, the nozzle can be cleaned cleanly without using a cleaning liquid, and the cost and maintenance properties are excellent.

(Embodiment 1)
Embodiment 1 of the present invention will be described with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to Embodiment 1 of the present invention, FIG. 2 is a side view of the electronic component mounting apparatus according to Embodiment 1 of the present invention, and FIG. 3 is a cleaning according to Embodiment 1 of the present invention. 4A is a perspective view of the opening of the cleaning device according to the first embodiment of the present invention, FIG. 4B is a cross-sectional view of the same, and FIG. 5 is one embodiment of the present invention. FIG. 6 is a flowchart showing the operation of the electronic component mounting apparatus according to the embodiment of the present invention.

  First, the overall configuration of the electronic component mounting apparatus will be described with reference to FIGS. 1 and 2. In FIG. 1, a conveyance guide 2 is arranged in parallel at a substantially center on a base 1. The conveyance guide 2 serves as a substrate positioning unit that conveys the substrate 3 to be mounted and positions it at a predetermined position. In the present invention, the conveyance direction of the substrate 3 is the X direction, and the direction orthogonal to the substrate 3 in the horizontal plane is the Y direction.

Electronic component supply units 4 are disposed on both sides of the conveyance guide 2 in the Y direction, and a plurality of electronic component supply tape feeders 20 are detachably arranged in parallel. As shown in FIG. 2, the tape feeder 20 is held on a transport base 22 via a feeder base 21 and supplies an electronic component storage tape 24 that stores electronic components from a reel 23 mounted on the transport base 22. In response, the pitch is fed to the pickup position S. The transport table 22 is provided with a caster 25 and a handle 26, and an operator can operate the handle 26 to move the transport table 22 on the floor surface and attach / detach the tape feeder 5 to / from the component supply unit 4.

  A cleaning device 30 is mounted on the electronic component supply unit 4 in parallel with the tape feeder 20 (in the first embodiment, it is mounted on the end of the electronic component supply unit 4). As with the tape feeder 20, the cleaning device 30 is held on the carriage 22 and is detachable from the electronic component supply unit 4.

  In FIG. 1, a pair of Y tables 6 are disposed at both ends of the base 1 in the X direction. An X table 7 is installed on the Y table 6 and can be moved in the Y direction by driving the Y table 6. A transfer head 8 is mounted on the side of the X table 7 so that it can move in the X direction by driving the X table 7.

  In FIG. 2, the transfer head 8 is provided with a plurality of nozzle units 9, and nozzles 10 are respectively attached to the lower portions of the nozzle units 9. Each nozzle 10 is mounted independently so as to be movable up and down and these operations are performed based on a control command of the control unit 11. Each nozzle 10 communicates with an intake / exhaust source 12 and performs an intake / exhaust operation in the suction hole 10 a (see FIG. 5) of the nozzle 10 based on a control command of the control unit 11. Further, the control unit 11 controls the driving amount and driving time in the horizontal movement operation of the transfer head 8, the lifting and rotating operation of the nozzle 10, the intake / exhaust operation based on the cleaning operation program stored in the storage unit 13. Thus, the operation of the nozzle 10 during cleaning is controlled.

  In FIG. 1, a substrate recognition unit including a camera 14 and the like is provided on the side of the transfer head 8 and recognizes the substrate 3 from above. An electronic component recognition unit including a line camera 15 and the like is provided between the conveyance guide 2 and the electronic component supply unit 4 to recognize the electronic component sucked by the nozzle 10 from below.

  Next, the cleaning device 30 will be described with reference to FIG. In FIG. 3, the cleaning device 30 includes a main body 31 and a reel 33 that supplies a cleaning tape 32 to the main body 31. The reel 33 is mounted on the carriage 22 in the same manner as the reel 23 for supplying the cleaning tape 32 shown in FIG. The cleaning tape 32 is formed in a long shape from a porous material such as felt or paper, which has elasticity and flexibility, and is wound around and stored in a reel 33.

  In FIG. 3, the main body 31 has an elongated frame 34 placed on the upper part of the feeder base 21, and an engaged part 34 a provided on the lower part of the frame 34 is provided on the end of the feeder base 21. It is mounted at a predetermined position by engaging with the joint portion 21a. Further, in a state in which the frame 34 is mounted on the feeder base 21, the cleaning control unit 35 incorporated in the frame 34 is connected to the control unit 11 (see FIG. 2) of the electronic component mounting apparatus.

  The front end portion (right side in FIG. 3) of the main body portion 31 is a tape feeding portion 36. The tape feeding section 36 is a feed roller 37 that feeds the cleaning tape 32, pressing rollers 38 and 39 that urge the cleaning tape 32 against the feed roller 37, and mesh with the feed roller 37 to transmit driving force. And a motor 41 for driving the driving roller 40. A tooth surface that meshes with a bevel gear coupled to the output shaft of the motor 41 is provided on a side surface of the drive roller 40.

The motor 41 is repeatedly driven and stopped at a predetermined interval according to the drive command of the cleaning control unit 35, whereby the drive roller 40 is index rotated (arrow e). In conjunction with this, the feed roller 37 rotates index (arrow f) and pitches the cleaning tape 32 at a predetermined interval (arrow g).

  By this pitch feeding operation, the cleaning tape 32 wound around the reel 33 is guided into the frame 34 from the rear end portion (left side in FIG. 3) of the main body portion 31 and is postured along the tape feeding path in the frame 34. The pitch is fed to the opening 42 formed on the upper surface of the front end portion in a state where the is held. The position of the opening 42 is stored as position data in the storage unit 13, and the nozzle 10 is positioned during cleaning based on this position data.

  4 (a) and 4 (b), the opening 42 is provided with a lower receiving portion 43 for supporting the pitch-fed cleaning tape 32 from below. A concave groove 43a is formed in the lower receiving portion 43 along the pitch feeding direction of the cleaning tape 32. As shown in FIG. 4B, the cleaning tape 32 is supported by both side portions 43b of the concave groove 43a. It is like that.

  Next, a method for cleaning the nozzle 10 will be described with reference to FIG. In FIG. 5A, the suction hole 10 a is formed in the nozzle 10 and opens at the lower end of the nozzle 10. The suction / exhaust source 12 shown in FIG. 2 is driven to suck and exhaust the inside of the suction hole 10a. When the suction hole 10a is sucked, the electronic component can be vacuum-sucked, and the electronic component is mounted on the substrate. When doing so, the compressed air is exhausted to break the vacuum adsorption state to facilitate mounting.

  In FIG. 5A, the nozzle 10 is positioned above the concave groove 43 a of the lower receiving portion 43 provided in the opening 42. The cleaning tape 32 is pitch-fed to the opening 42 and is supported from below by the lower receiving portion 43.

  In FIG. 5B, the nozzle 10 is lowered to press the lower end portion against the upper surface of the cleaning tape 32, the cleaning tape 32 is pushed into the concave groove 43a, and the lower surface of the cleaning tape 32 is brought into contact with the bottom surface 43c of the concave groove 43a. Make contact. Since the cleaning tape 32 has elasticity, the cleaning tape 32 is pressed and brought into contact with the periphery of the lower end portion of the nozzle 10.

  5C, the nozzle 10 is caused to perform horizontal movement (arrow a), vertical movement (arrow b), and horizontal rotation (arrow c), and the lower end portion is rubbed against the cleaning tape 32. As a result, the periphery of the lower end portion is uniformly cleaned by the cleaning tape 32, and foreign matter and the like are removed to be in a clean state. Since the cleaning tape 32 is made of a porous material such as felt or paper, it has a high ability to remove foreign substances and enables effective cleaning.

  In addition, as shown in FIG. 5D, by cleaning the inside of the suction hole 10a of the nozzle 10 while exhausting (arrow d), the foreign matter adhering to the suction hole 10a is discharged to the outside and removed. The foreign matter is prevented from entering the suction hole 10a.

These cleaning operations are controlled based on a cleaning operation program stored in the storage unit 13 shown in FIG. This cleaning operation program includes various cleaning patterns. By combining the driving amount and driving time in the horizontal movement operation, vertical movement operation, rotation operation, and intake / exhaust operation of the nozzle 10 in various patterns, the types of the nozzle 10 are combined. The cleaning method corresponding to the time used for mounting and the like can be selected. Therefore, as shown in FIG. 5D, the nozzle 10 can be cleaned not only by a cleaning method that causes the nozzle 10 to perform all the operations a to d at the same time, but also by a combination of operations a to d that are appropriately selected.

  In this way, the nozzle 10 is moved in various ways so that the lower end is rubbed against the cleaning tape 32 to remove the foreign matter, so that the lower end is cleaned without dissolving the foreign matter using a cleaning liquid or the like. Can be cleaned.

  Since the foreign matter removed from the nozzle 10 adheres to the cleaning tape 32 that has cleaned one nozzle 10, when cleaning another nozzle 10, the cleaning tape 32 is pitch-fed and cleaned to the opening 42. A new part of the tape 32 is supplied.

  The mounting operation of the electronic component mounting apparatus configured as described above will be described with reference to the flowchart of FIG. When the mounting operation is started, first, the substrate 3 is carried onto the conveyance guide 2 and positioned at a predetermined position (ST1). Further, the electronic component supplied from the tape feeder 5 is sucked to the nozzle 10 (ST2). Next, the nozzle 10 that has attracted the electronic component is moved to align the electronic component mounting location on the substrate 3 with the electronic component (ST3). When the alignment is completed, the nozzle 10 is lowered and the electronic component is mounted on the electronic component mounting portion on the substrate 3 (ST4). Thereafter, the operations of ST2 to ST4 are repeated and continued, and when mounting of electronic components is completed at all the electronic component mounting locations on the substrate 3, a new substrate 3 is carried onto the transport guide 2 and the substrate is replaced. Perform (ST5). As described above, the operations of ST1 to ST5 are repeated, and the mounting operation is completed when the electronic component is completely mounted on the predetermined substrate.

  In the process of this mounting operation, foreign matter such as airborne dust and oil mist adheres and accumulates on the lower end portion around the suction hole 10a of the nozzle 10, so that the nozzle 10 is cleaned at a predetermined timing. . The nozzle 10 moves above the opening 42 of the cleaning device 30 in a state in which the electronic component is not attracted to the lower end, that is, from when the electronic component is completely mounted on the substrate 3 until the next electronic component is attracted. Then, the cleaning operation is performed to descend at this position and press the lower end portion into the cleaning tape 32 and rub it (ST6).

  By performing this cleaning operation as appropriate, a foreign substance attached to the lower end portion can be removed and a clean state can be maintained. Thereby, it can prevent that adsorption | suction hole 10a causes clogging and a suction | attraction force falls. In addition, it is possible to avoid the problem that foreign matter or the like accumulates at the lower end and the suction posture of the electronic component becomes unstable. Further, when ST4 is mounted, the accumulated foreign matter or the like is scattered by the compressed air blown out from the suction hole 10a to adhere to the electronic component, the substrate 3 or the like in order to suck and destroy the electronic component sucked by the nozzle 10. Etc. can be avoided.

(Embodiment 2)
Next, the cleaning device 50 according to Embodiment 2 of the present invention will be described with reference to FIG. FIG. 7 is a side sectional view of the cleaning device according to the second embodiment of the present invention. The cleaning device 50 is different from the cleaning device 30 in that the cleaning tape 51 is built in the main body 52. The front end portion of the main body portion 52 is a tape feeding portion, and the feeding roller 53 and the tension roller 54 are spaced apart from each other, and the cleaning tape 51 is adjusted to the feeding roller 53 and the tension roller 54.

The feed roller 53 is meshed with the drive roller 40, and a bevel gear coupled to the output shaft of the motor 41 is meshed with a tooth surface formed on the side surface of the drive roller 40. The motor 41 is repeatedly driven and stopped at predetermined intervals according to a drive command from the cleaning control unit 35. As a result, the drive roller 40 rotates index (arrow h), and the feed roller 53 rotates in conjunction with this (arrow i), and the cleaning tape 51 is pitch fed at predetermined intervals (arrow j).

  By this pitch feeding operation, the cleaning tape 51 is pitch fed to the opening 42 formed on the upper surface of the front end portion of the main body 52. A lower receiving portion 43 that supports the pitch-fed cleaning tape 32 from below is formed in the opening 42 (see FIG. 4).

  The cleaning device 50 can clean the lower end portion of the nozzle 10 of the electronic component mounting apparatus by being mounted on the electronic component supply unit 4 in the same manner as the cleaning device 30.

  The present invention has the advantage that the nozzle can be cleaned cleanly without using a cleaning liquid, and is excellent in cost and maintenance, and a workpiece such as a substrate is picked up by picking up and picking up an electronic component on the nozzle. This is useful in the field of implementation.

1 is a plan view of an electronic component mounting apparatus according to Embodiment 1 of the present invention. The side view of the electronic component mounting apparatus in Embodiment 1 of this invention Side sectional view of the cleaning device according to Embodiment 1 of the present invention. (A) Perspective view of the opening of the cleaning device in Embodiment 1 of the present invention (b) Cross-sectional view of the opening of the cleaning device in Embodiment 1 of the present invention Operation explanatory diagram showing a cleaning method in an embodiment of the present invention Flowchart showing operation of electronic component mounting apparatus according to one embodiment of the present invention Side sectional view of the cleaning device according to Embodiment 2 of the present invention.

Explanation of symbols

3 Substrate 4 Electronic component supply unit 10 Nozzle 30 and 50 Cleaning device 32 and 51 Cleaning tape 42 Opening portion 36 Tape feeding portion 43 Bottom receiving portion

Claims (3)

An electronic component mounting apparatus that picks up an electronic component supplied from an electronic component supply unit and mounts it on a substrate,
A plurality of nozzles capable of horizontal movement, vertical movement and rotation independently, an intake / exhaust source for performing intake and exhaust in the suction holes of the nozzle, horizontal movement operation, vertical movement operation and rotation operation of the nozzle, and The control unit that controls the intake / exhaust operation in the suction hole, and the drive amount and drive time in the horizontal movement operation, vertical movement operation and rotation operation of the nozzle, and the intake / exhaust operation in the suction hole are combined in various patterns. A storage unit storing a cleaning operation program stored therein,
An opening into which the lower end of the nozzle is inserted, a cleaning tape that contacts and cleans the lower end of the nozzle, a tape feeding unit that sends the cleaning tape to the opening, and a feeding direction of the cleaning tape The electronic component supply unit is provided with a cleaning device including a recessed portion provided along the groove, and including a receiving portion that supports the cleaning tape sent to the opening from below at both ends of the recessed groove ,
The control unit rubs the lower end portion of the nozzle against the cleaning tape pressed into the concave groove by performing operation control of the nozzle based on any cleaning operation program stored in the storage unit. An electronic component mounting apparatus that performs cleaning. A method for cleaning a nozzle of an electronic component mounting apparatus according to claim 1 ,
The cleaning tape is pushed into the concave groove by the lower end of the nozzle inserted into the opening , and any one of the data stored in the storage unit is in a state where the cleaning tape is in contact with the lower end of the nozzle . A nozzle cleaning method for an electronic component mounting apparatus, wherein cleaning is performed by rubbing a lower end portion of the nozzle against the cleaning tape by performing operation control of the nozzle based on a cleaning operation program . An electronic component mounting method using the electronic component mounting apparatus according to claim 1 ,
The electronic component supplied from the electronic component supply unit is picked up by a nozzle, picked up and transferred to a substrate that has been positioned, and the cleaning is performed by the lower end of the nozzle inserted into the opening. By controlling the operation of the nozzle based on one of the cleaning operation programs stored in the storage unit in a state where the tape is pushed into the groove and the cleaning tape is in contact with the lower end of the nozzle. And a nozzle cleaning step of an electronic component mounting apparatus that performs cleaning by rubbing the lower end portion of the nozzle against the cleaning tape.

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