JP2016174036A - Cleaning nozzle and cleaning method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To appropriately carry out cleaning work, while taking into consideration the cost, installation space and so forth.SOLUTION: The cleaning nozzle 100 set forth in the present invention sucks and holds, by air suction, components to be mounted on a substrate. The cleaning nozzle is attached in place of a suction nozzle to an attachment part to which the suction nozzle, removed when air is blown, is removably attached. Cleaning work takes place when the cleaning nozzle sucks or blows out air while being attached to the attachment part. Thus, cleaning work can be appropriately carried out just by preparing the cleaning nozzle. This makes it possible to appropriately carry out cleaning work at a low cost and in a smaller space.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a cleaning nozzle and a cleaning method for cleaning with a mounting work machine that mounts components on a substrate.

  In a mounting work machine that mounts components on a substrate, it is preferable that cleaning is performed periodically in order to ensure the operation of an instrument or the like disposed on the mounting work machine. Patent Document 1 below describes that a cleaning brush is held by a mounting head, and the cleaning operation is performed by the cleaning brush. Patent Document 2 below describes that the mounting work machine is provided with an air blow device, and the cleaning operation is performed by ejecting air by the air blow device.

JP 2009-267038 A JP 2001-94298 A

  According to the technique described in the above-mentioned patent document, it is possible to perform a cleaning operation to some extent. However, with the cleaning brush, it is difficult to properly remove dust and the like that has entered the inside of the instrument. In addition, it is not preferable to install an air blow device or the like on the mounting work machine in consideration of cost, installation space, and the like. This invention is made | formed in view of such a situation, and the subject of this invention is performing a cleaning operation | work appropriately, considering cost, arrangement | positioning space, etc.

  In order to solve the above-described problems, the cleaning nozzle described in the present application is configured to attach and detachably attach a suction nozzle that sucks and holds components mounted on a substrate by suction of air and detaches by ejection of air. In addition, the nozzle is mounted in place of the suction nozzle, and cleaning is performed by suction of air or ejection of air while being mounted on the mounting portion.

  In order to solve the above-described problem, the cleaning method described in the present application includes a mounting portion on which a component mounted on a substrate is sucked and held by air suction and a suction nozzle that is detached by air ejection is detachably mounted. A cleaning method for cleaning an instrument disposed on a mounting work machine having a working head and a moving device that moves the working head, the suction nozzle mounted on the mounting portion, or The cleaning is performed by sucking air from a cleaning nozzle mounted on the mounting portion instead of the suction nozzle, or by ejecting air.

  The cleaning nozzle described in the present application is mounted instead of the suction nozzle on the mounting part where the component mounted on the board is sucked and held by air suction and the suction nozzle that is detached by air ejection is detachably mounted. Nozzle. The cleaning is performed by sucking air or ejecting air while the cleaning nozzle is mounted on the mounting portion. Thereby, it becomes possible to clean appropriately only by preparing the cleaning nozzle.

  In the cleaning method described in the present application, cleaning is performed by the suction nozzle or the cleaning nozzle attached to the attachment portion. Thereby, it becomes possible to clean appropriately only by preparing only existing equipment or a cleaning nozzle.

It is a perspective view which shows an electronic component mounting apparatus. It is a perspective view which shows a suction nozzle. It is a top view which shows tape-ized components. It is a perspective view which shows the nozzle for cleaning. It is a figure which shows the flowchart of a control program. It is a figure which shows the flowchart of a control program.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

<Configuration of electronic component mounting device>
FIG. 1 shows an electronic component mounting apparatus 10. The electronic component mounting apparatus 10 includes one system base 12 and two electronic component mounting machines (hereinafter, may be abbreviated as “mounting machines”) 14 adjacent on the system base 12. Yes. The direction in which the mounting machines 14 are arranged is referred to as the X-axis direction, and the horizontal direction perpendicular to the direction is referred to as the Y-axis direction.

  Each mounting machine 14 mainly includes a mounting machine main body 20, a transport device 22, a mounting head moving device (hereinafter also referred to as “moving device”) 24, a mounting head 26, a supply device 28, and a nozzle station 30. ing. The mounting machine main body 20 includes a frame portion 32 and a beam portion 34 that is overlaid on the frame portion 32.

  The transport device 22 includes two conveyor devices 40 and 42. The two conveyor devices 40 and 42 are disposed in the frame portion 32 so as to be parallel to each other and extend in the X-axis direction. Each of the two conveyor devices 40 and 42 conveys a circuit board supported by the conveyor devices 40 and 42 in the X-axis direction by an electromagnetic motor (not shown). The circuit board is fixedly held by a board holding device (not shown) at a predetermined position.

  The moving device 24 is an XY robot type moving device. The moving device 24 includes an electromagnetic motor (not shown) that slides the slider 50 in the X-axis direction and an electromagnetic motor (not shown) that slides in the Y-axis direction. A mounting head 26 is attached to the slider 50, and the mounting head 26 is moved to an arbitrary position on the frame portion 32 by operation of two electromagnetic motors.

  The mounting head 26 mounts electronic components on the circuit board. A suction nozzle 60 is provided on the lower end surface of the mounting head 26. As shown in FIG. 2, the suction nozzle 60 includes a body cylinder 64, a flange portion 66, an air flow pipe 67, a suction pipe 68, and a latch pin 69. The body cylinder 64 has a cylindrical shape, and the flange portion 66 is fixed so as to overhang the outer peripheral surface of the body cylinder 64. The air circulation pipe 67 is disposed inside the body cylinder 64 and communicates with a positive / negative pressure supply device (not shown) through negative pressure air and positive pressure air passages. The adsorption pipe 68 is connected to the air circulation pipe 67 in a state of extending downward from the lower end portion of the body cylinder 64. The latch pin 69 is provided at the upper end portion of the trunk cylinder 64 so as to extend in the radial direction of the trunk cylinder 64. The suction nozzle 60 is detachably attached to the mounting head 26 using a latch pin 69 with one touch.

  With such a structure, the suction nozzle 60 sucks and holds the electronic component by the negative pressure in the suction pipe 68 and detaches the held electronic component by the positive pressure. That is, the suction nozzle 60 sucks and holds the electronic component by the air sucked from the tip portion of the suction tube 68, and detaches the electronic component by the air ejected from the tip portion of the suction tube 68. The mounting head 26 includes a nozzle lifting device (not shown) that lifts and lowers the suction nozzle 60 and a nozzle rotation device that rotates the suction nozzle 60 about its axis. Thereby, the mounting head 26 changes the vertical position of the electronic component to be held by the nozzle lifting device, and adjusts the posture of the electronic component to be held by the nozzle rotation device.

  The supply device 28 is a feeder-type supply device, and is disposed at the front end of the frame portion 32 as shown in FIG. The supply device 28 has a plurality of tape feeders 70. Each tape feeder 70 accommodates a taped component in a wound state. As shown in FIG. 3, the taped component 72 includes a carrier tape 74, an electronic component 76, and a top cover tape 78. The carrier tape 74 has a large number of receiving recesses 80 and feed holes 82 formed at an equal pitch, and the electronic components 76 are received in the receiving recesses 80. The housing recess 80 in which the electronic component 76 is housed is covered with a top cover tape 78.

  A sprocket (not shown) is built in the tape feeder 70, and the sprocket is engaged with the feed hole 82 of the taped component 72. Thereby, the taped part 72 is sent out toward the supply position by rotating the sprocket. Note that a peeling device (not shown) is provided in the arrangement path of the taped component 72, and the top cover tape 78 is peeled from the carrier tape 74. Then, the taped component 72 from which the top cover tape 78 has been peeled is sent to the supply position, whereby the electronic component 76 is supplied at the supply position.

  Note that the mounting machine 14 employs two types of tape feeders 70, that is, a normal tape feeder and an auto loading feeder. In a normal tape feeder, when the taped component 72 is set on the tape feeder 70, the operator manually peels off the top cover tape 78 from the carrier tape 74 and sets it on the peeling device. On the other hand, in the auto loading feeder, a cutter mechanism (not shown) is provided in the arrangement path of the taped component 72, and the top cover tape 78 is automatically peeled off from the carrier tape 74 by the operation of the cutter mechanism. Set in the device.

  As shown in FIG. 1, the nozzle station 30 includes a nozzle tray 88 that accommodates a plurality of suction nozzles 60. In the nozzle station 30, the suction nozzle 60 attached to the mounting head 26 and the suction nozzle 60 accommodated in the nozzle tray 88 are automatically replaced by the operation of the moving device 24 or the like.

  Furthermore, the mounting machine 14 has a mark camera (not shown) and a parts camera 90. The mark camera is attached to the slider 50 so as to face downward, and is moved on the frame portion 32 together with the mounting head 26. Thereby, the mark camera images an arbitrary position on the frame unit 32. The parts camera 90 is disposed between the transport device 22 and the supply device 28 on the frame portion 32 so as to face upward. Thereby, the parts camera 90 images the electronic component held by the suction nozzle 60.

<Mounting work with a mounting machine>
In the mounting machine 14, an electronic component mounting operation is performed on the circuit board held by the transfer device 22 with the above-described configuration. Specifically, the circuit board is transported to the work position and is fixedly held by the board holding device at that position. Next, the mark camera moves above the circuit board and images the circuit board. Thereby, information on the holding position of the circuit board and the like can be obtained. Further, the mark camera moves above the tape feeder 70 and images a feeder mark (not shown) marked on the tape feeder 70. The feeder mark is a mark for calibrating the supply position of the tape feeder 70. In the tape feeder 70, electronic components are supplied at a predetermined supply position. Then, the mounting head 26 moves above the supply position of the tape feeder 70, and the position of the mounting head 26 is finely adjusted based on information obtained by imaging the feeder mark. Then, the suction nozzle 60 is lowered and sucks and holds the electronic component by sucking air. Subsequently, the mounting head 26 holding the electronic component moves above the parts camera 90, and the electronic component held by the suction nozzle 60 is imaged by the parts camera 90. As a result, information on the holding position of the component can be obtained. Subsequently, the mounting head 26 holding the electronic component moves above the circuit board and corrects an error in the holding position of the circuit board, an error in the holding position of the component, and the like. Then, the suction nozzle 60 is lowered, and the electronic component is detached by the ejection of air, so that the electronic component is mounted on the circuit board.

<Cleaning the tape feeder>
In the mounting machine 14, as described above, the electronic component supplied by the tape feeder 70 is sucked and held by the suction nozzle 60, and the electronic component is mounted on the circuit board. In such a mounting operation, the tape feeder 70 is fed out by the rotation of the sprocket, and the top cover tape 78 is peeled off from the carrier tape 74 so that the electronic component is supplied at the supply position. At this time, dust or the like is generated due to the peeling of the top cover tape 78, and therefore, cleaning of the tape feeder 70 is preferably performed periodically.

  However, in order to clean the tape feeder 70, the tape feeder 70 is removed from the mounting machine 14, the removed tape feeder 70 is cleaned outside the apparatus, and the tape feeder 70 is mounted on the mounting machine 14 again. Takes some time. In particular, when a large number of tape feeders 70 are mounted on the mounting machine 14, it takes a lot of time to remove, clean, and remount these many tape feeders 70. Also, the burden on the operator is considerable. For this reason, in the mounting machine 14, the cleaning operation of the tape feeder 70 is automatically performed.

  Specifically, cleaning nozzles are stored in the nozzle tray 88 of the nozzle station 30. As shown in FIG. 4, the cleaning nozzle 100 includes a body cylinder 102, a flange portion 104, an air circulation pipe 106, an ejection pipe 108, a brush 110, and a latch pin 112. The body cylinder 102, the flange portion 104, the air circulation pipe 106, and the latching pin 112 of the cleaning nozzle 100 have the same shape as the body cylinder 64, the flange portion 66, the air circulation pipe 67, and the latching pin 69 of the suction nozzle 60. is there. For this reason, the cleaning nozzle 100 can be mounted on the mounting head 26 instead of the suction nozzle 60. Further, the ejection pipe 108 is connected to the air circulation pipe 106. Thereby, air is ejected from the tip of the ejection pipe 108 by the supply of positive pressure to the air circulation pipe 106. In addition, a brush 110 is disposed in an annular shape at the tip of the ejection pipe 108 so as to surround an ejection hole (not shown) through which air is ejected and to extend downward. Moreover, the brush 110 is arrange | positioned so that it may converge toward the downward direction of the ejection hole from which air is ejected in the front-end | tip part. That is, the brush 110 has a tapered shape.

  Further, a cleaning command button for cleaning the tape feeder 70 is displayed on the display panel (not shown) of the mounting machine 14, and the cleaning command execution screen (not shown) is operated by operating the button. Is displayed on the display panel. On the cleaning command execution screen, a selection button (not shown) for selecting the tape feeder 70 to be cleaned and a start button (not shown) are displayed. In this cleaning command execution screen, the selection of the tape feeder 70 to be cleaned by operating the selection button moves the mark camera above the nozzle tray 88 of the nozzle station 30, and the nozzle tray 88 is imaged by the mark camera. Is done. Then, it is determined whether or not the cleaning nozzle 100 is stored in the nozzle tray 88. At this time, when the cleaning nozzle 100 is not stored in the nozzle tray 88, a nozzle storage guide screen is displayed on the display panel. Since the cleaning nozzle 100 is not stored in the nozzle tray 88 on the nozzle guide storage screen, a comment that prompts storage of the cleaning nozzle 100 in the nozzle tray 88 is displayed. Thereby, the operator accommodates the cleaning nozzle 100 in the nozzle tray 88 by viewing this screen.

  When the operator operates the start button on the cleaning command execution screen, the mounting head 26 moves above the nozzle tray 88 and is stored in the suction nozzle 60 attached to the mounting head 26 and the nozzle tray 88. The replacement with the cleaning nozzle 100 is performed at the nozzle station 30. When the cleaning nozzle 100 is mounted on the mounting head 26, a cleaning operation by the cleaning nozzle 100 is executed.

  During the cleaning operation by the cleaning nozzle 100, air is ejected from the tip of the ejection pipe 108 by supplying positive pressure to the air circulation pipe 106. That is, air is ejected from the brush 110 arranged in an annular shape at the tip of the ejection pipe 108. Furthermore, at the time of the cleaning operation by the cleaning nozzle 100, the cleaning nozzle 100 rotates around the axis by the operation of the nozzle rotation device. As a result, the brush 110 rotates around its axis. At this time, when the brush 110 of the cleaning nozzle 100 is brought into contact with the feeder mark of the tape feeder 70 to be cleaned, dust attached to the feeder mark is removed, and the feeder mark can be appropriately confirmed. It becomes possible. In addition, air is ejected and the rotating brush 110 comes into contact with the sprocket of the tape feeder 70 to be cleaned, so that dust attached to the sprocket is removed and rotation of the sprocket is secured.

  Further, when the tape feeder 70 to be cleaned is an auto loading feeder, air is ejected and the rotating brush 110 contacts the cutting mechanism of the auto loading feeder to be cleaned. Since the cutting mechanism of the auto loading feeder is a mechanism for peeling the top cover tape 78 from the carrier tape 74 as described above, dust or the like is likely to adhere thereto. Moreover, there is a possibility that an adhesive or the like when the top cover tape 78 is bonded to the carrier tape 74 is attached to the cutting mechanism. For this reason, by cleaning the cutting mechanism with the cleaning nozzle 100, it is possible to remove the deposit from the cutting mechanism by the rotation of the brush 110 and to blow off the removed deposit from the cutting mechanism. Thereby, it becomes possible to clean a cutting mechanism appropriately.

  When the cleaning operation of one tape feeder 70 is completed according to the above operation procedure, the cleaning operation of the next tape feeder 70 is executed, and the tape feeders 70 selected as objects to be cleaned are sequentially cleaned. When all the cleaning operations of the tape feeder 70 selected as the cleaning target are completed, the mounting head 26 moves above the nozzle tray 88 and the cleaning nozzle 100 mounted on the mounting head 26 and the nozzle tray 88. Exchange with the suction nozzle 60 housed in is performed. That is, when the cleaning operation is completed, the cleaning nozzle 100 is returned to the nozzle tray 88, and the suction nozzle 60 is mounted on the mounting head 26 for the mounting operation. Thereby, it becomes possible to perform mounting | wearing operation | work using the tape feeder 70 by which cleaning object was completed.

  As described above, in the mounting machine 14, dust and the like can be removed and the tape feeder 70 can be appropriately cleaned by the rotation of the brush 110 and the ejection of air. Further, in the mounting machine 14, the tape feeder 70 is automatically cleaned while being mounted on the mounting machine 14 without removing the tape feeder 70 from the mounting machine 14. Thereby, while shortening the cleaning time of the tape feeder 70, it becomes possible to reduce an operator's burden.

  In the mounting machine 14, the cleaning nozzle 100 housed in the nozzle tray 88 is mounted on the mounting head 26 instead of the suction nozzle 60, and cleaning is performed by the cleaning nozzle 100. For this reason, it is possible to clean the tape feeder 70 by preparing the cleaning nozzle 100 and using the existing moving device 24, the mounting head 26, the nozzle station 30, and the like. This makes it possible to perform a cleaning operation using the cleaning nozzle 100 in an existing mounting machine with little cost. Furthermore, the brush 110 of the cleaning nozzle 100 has a tapered shape. For this reason, the cleaning nozzle 100 can be properly returned into the nozzle tray 88 even if the tip of the brush 110 is somewhat expanded by cleaning the tape feeder 70.

  In addition, before the cleaning operation by the cleaning nozzle 100, it is possible to check the degree of contamination of the tape feeder 70. Specifically, before the cleaning operation, the mark camera captures images of the feeder mark, sprocket, cutting mechanism, and the like of the tape feeder 70 to be cleaned. Then, based on the imaging data, the degree of contamination of the feeder mark, sprocket, cutting mechanism, etc. is determined. At this time, for example, when it is determined that almost no dust or the like is attached, it is possible to clean only the part that is severely soiled by dust or the like without performing the cleaning work on the part. is there. As described above, it is possible to reduce the time required for the cleaning work by checking the degree of contamination of the tape feeder 70 before the cleaning work.

  The above-described cleaning operation by the cleaning nozzle 100 is performed by executing a control program in a control device (not shown) of the mounting machine 14. Hereinafter, a flow when the control program is executed will be described with reference to FIGS. 5 and 6.

  In the control program, first, it is determined whether or not the cleaning command button has been operated (S100). When the cleaning command button is not operated (NO in S100), the process of S100 is repeated. On the other hand, when the cleaning command button is operated (YES in S100), it is determined whether or not the tape feeder 70 to be cleaned is selected on the cleaning command execution screen (S102). When the tape feeder 70 to be cleaned is not selected (NO in S102), the process in S102 is repeated.

  On the other hand, when the tape feeder 70 to be cleaned is selected (YES in S102), the nozzle tray 88 is imaged by the mark camera, and the cleaning nozzle 100 is stored in the nozzle tray 88 based on the imaging data. It is judged whether or not (S104). When the cleaning nozzle 100 is not stored in the nozzle tray 88 (NO in S104), a nozzle storage guide screen is displayed on the display panel (S106). Then, the process returns to S104. On the other hand, when the cleaning nozzle 100 is stored in the nozzle tray 88 (YES in S104), it is determined whether or not the start button is operated on the cleaning command execution screen (S108).

  If the start button has not been operated (NO at S108), the process at S108 is repeated. On the other hand, when the start button is operated (YES in S108), the mounting head 26 moves above the nozzle tray 88 and is accommodated in the suction nozzle 60 mounted on the mounting head 26 and the nozzle tray 88. The cleaning nozzle 100 is replaced (S110). Next, the feeder mark of the tape feeder 70 to be cleaned is cleaned by the cleaning nozzle 100 (S112). Subsequently, the sprocket of the tape feeder 70 to be cleaned is cleaned by the cleaning nozzle 100 (S114).

  Next, it is determined whether or not the tape feeder 70 to be cleaned is an auto loading feeder (S116). When the tape feeder 70 to be cleaned is an auto loading feeder (YES in S116), the cutting mechanism of the tape feeder 70 to be cleaned is cleaned by the cleaning nozzle 100 (S118). Then, the process proceeds to S120. On the other hand, when the tape feeder 70 to be cleaned is not an auto loading feeder (NO in S116), the process of S118 is skipped and the process proceeds to S120.

  In S120, it is determined whether or not all cleaning operations of the tape feeder 70 selected on the cleaning command execution screen have been completed (S120). If all the cleaning operations for the tape feeder 70 selected on the cleaning command execution screen have not been completed (NO in S120), the process returns to S112. On the other hand, when all the cleaning operations of the tape feeder 70 selected on the cleaning command execution screen have been completed (YES in S120), the processing of the control program ends.

  In addition, this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiment, the cleaning operation is performed by ejecting air from the ejection pipe 108 of the cleaning nozzle 100, but cleaning is performed by sucking air from the ejection pipe 108. It is possible to perform work. That is, like a vacuum cleaner, it is possible to perform a cleaning operation by sucking dust and the like from the ejection pipe 108. However, in such a case, it is necessary to provide a filter inside the air circulation pipe 106 and the like to prevent dust and the like from entering the positive / negative pressure supply device.

  Moreover, in the said Example, although the cleaning object by the nozzle 100 for cleaning is made into the tape feeder 70, for cleaning various instruments, such as the nozzle station 30 and the parts camera 90 which are arrange | positioned at the mounting machine 14, A cleaning nozzle 100 can be used.

  Moreover, in the said Example, although the cleaning operation is performed using the cleaning nozzle 100 with which the brush 110 was arrange | positioned, you may perform a cleaning operation with the cleaning nozzle without the brush 110. FIG. Furthermore, it is possible to perform the cleaning operation using the suction nozzle 60 instead of the cleaning nozzle 100. In other words, it is possible to blow out dust or the like by blowing air toward the cleaning target device by the suction nozzle 60 used for the mounting operation of the electronic component, thereby performing the cleaning operation. Thus, by performing the cleaning operation using the suction nozzle 60, it is not necessary to prepare the cleaning nozzle 100, and the cleaning operation can be performed at a very low cost.

  14: Electronic component mounting machine (mounting work machine) 24: Moving device 26: Mounting head (working head) 60: Adsorption nozzle 70: Tape feeder (feeder type component supply device) (tool) 100: Cleaning nozzle 110: Brush

Claims (5)

  A nozzle mounted instead of the suction nozzle on a mounting portion on which a suction nozzle that holds and holds a component mounted on the substrate by suction of air and is detachably mounted by ejection of air, A cleaning nozzle that performs cleaning by suction of air or ejection of air in a state of being mounted on the mounting portion. The cleaning nozzle
The cleaning nozzle according to claim 1, further comprising a brush disposed at a tip portion.   The cleaning nozzle according to claim 2, wherein the brush has a tapered shape. A work head having a mounting portion on which a suction nozzle that detachably mounts a component mounted on the substrate by suction of air and is detached by ejection of air, and
A cleaning method for cleaning an instrument disposed in a mounting work machine having a moving device for moving the work head,
Cleaning is performed by suction of air from the suction nozzle mounted on the mounting unit or a cleaning nozzle mounted on the mounting unit instead of the suction nozzle, or by jetting air. Method. The cleaning method is
The cleaning method according to claim 4, wherein the cleaning method is a cleaning method for cleaning a feeder-type component supply device disposed in the mounting work machine.

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