JP6715326B2 - Mounting head and mounting device - Google Patents

Description

The present invention relates to a mounting head and a mounting device.

2. Description of the Related Art Conventionally, as a mounting apparatus that mounts a component on a board, a mounting apparatus that includes a nozzle that mounts the component on the board and a cleaning unit that cleans the component has been proposed (for example, see Patent Document 1). In this mounting device, the components picked up by the nozzles are blown with air containing ions to remove and clean the components.

JP, 2008-103405, A

However, since the mounting device described in Patent Document 1 includes the cleaning unit having the air blow unit and the air suction unit, the device is large-scale. Further, although this device can clean parts, cleaning of the nozzle has not been considered.

The present invention has been made in view of the above problems, and a main object of the present invention is to provide a mounting head and a mounting apparatus capable of automatically cleaning a sampling portion with a simple configuration.

The present invention has adopted the following means in order to achieve the above-mentioned main object.

The mounting head disclosed in this specification is
A mounting head mounted on a mounting device for collecting components,
A collection unit that collects parts,
A cleaning unit for cleaning the sampling unit,
It is equipped with.

In this mounting head, since the sampling unit is cleaned by the cleaning unit provided in the same head, the sampling unit can be automatically cleaned with a relatively simple configuration.

This mounting head may have two or more mounting parts to which either the sampling part or the cleaning part can be mounted. In this mounting head, the sampling unit and the cleaning unit can be replaced with each other, and by sharing the mounting unit, the sampling unit can be cleaned while simplifying the configuration.

In this mounting head, the sampling unit is a suction nozzle that is mounted on a first mounting unit that is rotatable about an axis and that collects the component using pressure, and the cleaning unit is independent of the first mounting unit. The suction nozzle may be mounted on a second mounting portion that is rotatable about its axis to clean the suction nozzle using pressure. In this mounting head, for example, the suction nozzle can be cleaned while axially rotating the suction nozzle. Further, in this mounting head, the sampling unit can be cleaned while rotating the cleaning unit about its axis.

In this mounting head, the cleaning section may be a cleaning nozzle that cleans the sampling section using pressure. In this mounting head, the sampling part can be cleaned by the cleaning nozzle. This cleaning nozzle may be one that applies a positive pressure to the sampling portion, or one that sucks air around the sampling portion with a negative pressure. Alternatively, in this mounting head, the cleaning unit may be a cleaning brush that operates by using pressure to contact the cleaning unit and clean the cleaning unit. This mounting head can be cleaned by rubbing the sampling portion with a cleaning brush.

The mounting apparatus disclosed in this specification includes the mounting head described in any one of the above, and a control unit that executes a cleaning process for causing the cleaning unit to clean the sampling unit. Since this mounting apparatus includes any one of the mounting heads described above, it is possible to obtain an effect according to the adopted mode.

In this mounting apparatus, the control unit may axially rotate the sampling unit and vertically move the cleaning unit relative to the sampling unit when performing the cleaning process. With this mounting device, the entire sampling unit can be sufficiently cleaned.

This mounting apparatus includes a cleaning box capable of accommodating the sampling unit and the cleaning unit, and the control unit performs the cleaning process in a state where the sampling unit and the cleaning unit are accommodated in the cleaning box. It may be executed. In this mounting apparatus, foreign matter generated by cleaning can be put in the cleaning box, and it is possible to further suppress scattering of foreign matter inside the mounting apparatus.

In this mounting apparatus, the cleaning box may be a discard box that discards the component, and may include a detection unit that detects a housing state of the discarded component. In this mounting apparatus, the collection box can be automatically cleaned while the configuration is simplified by sharing the disposal box for discarding the components.

1 is a schematic explanatory diagram illustrating an example of a mounting system 10. FIG. Explanatory drawing showing the outline of the mounting head 22. The flowchart which shows an example of a cleaning process routine. Explanatory drawing of the cleaning process performed in the discard box 35. Explanatory drawing showing an example of the cleaning brush 40.

Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic explanatory diagram illustrating an example of a mounting system 10. FIG. 2 is an explanatory diagram showing an outline of the mounting head 22. The mounting system 10 is a system that executes a mounting process for mounting components on the board S. The mounting system 10 includes a mounting device 11 and a management computer (PC) 50. In FIG. 1, only one mounting device 11 is shown for convenience of description. In this embodiment, the left-right direction (X axis), the front-back direction (Y axis), and the up-down direction (Z axis) are as shown in FIG.

As shown in FIG. 1, the mounting apparatus 11 includes a board transfer unit 12, a component supply unit 13, a pressure applying unit 14, a control unit 18, a mounting unit 20, and a discard box 35. The board transfer unit 12 is a unit for carrying in, carrying, fixing at the mounting position, and carrying out the board S. The substrate transfer unit 12 has a pair of conveyor belts which are provided in front and rear of FIG. The substrate S is transported by this conveyor belt. The component supply unit 13 supplies components to the mounting unit 20 and includes a plurality of reels. A tape is wound around each reel, and a plurality of components are held on the surface of the tape along the longitudinal direction of the tape. This tape is unwound from the reel, and in a state where the components are exposed, it is sent to the sampling position where the suction nozzle 25 collects the tape.

The pressure applying unit 14 is a unit that applies a negative pressure or a positive pressure to the mounting head 22. The pressure applying unit 14 includes a positive pressure supply unit 15, a negative pressure supply unit 16, and a switching valve 17. The positive pressure supply unit 15 includes a pressure pump and the like, and supplies a positive pressure to the mounting head 22. The negative pressure supply unit 16 includes a vacuum pump and the like, and supplies a negative pressure to the mounting head 22. The switching valve 17 is connected to an atmospheric pressure pipe, a positive pressure supply unit 15, and a negative pressure supply unit 16, and has a path for supplying either the atmospheric pressure, the positive pressure, or the negative pressure to the mounting head 22. Switch.

The control unit 18 controls the entire mounting apparatus 11, and is configured as a microprocessor including a CPU 19. The control unit 18 outputs control signals to the board transport unit 12, the component supply unit 13, the pressure applying unit 14, and the mounting unit 20, and inputs signals from the component supply unit 13 and the mounting unit 20. The control unit 18 executes a cleaning process that causes the cleaning nozzle 30 to clean the suction nozzle 25.

The mounting unit 20 collects components from the component supply unit 13 and arranges the components on the substrate S fixed to the substrate transport unit 12. The mounting unit 20 includes a head moving unit 21 and a mounting head 22. The head moving unit 21 includes a slider that is guided by a guide rail and moves in the XY directions, and a motor that drives the slider. The mounting head 22 is detachably attached to the slider, and is moved in the XY directions by the head moving unit 21. As shown in FIGS. 1 and 2, the mounting head 22 includes a first mounting portion 23, a second mounting portion 24, a suction nozzle 25, a first vertical movement motor 26, a first shaft rotation motor 27, and a first rotation motor 27. The motor 2 includes a vertical movement motor 28, a second shaft rotation motor 29, and a cleaning nozzle 30. The mounting head 22 is configured such that one suction nozzle 25 can be mounted on each of the first mounting portion 23 and the second mounting portion 24. The first mounting portion 23 removably mounts all of the various suction nozzles 25, the cleaning nozzle 30, and the cleaning brush 40 (see FIG. 5 described later). The first mounting portion 23 detachably mounts the suction nozzle 25 by, for example, negative pressure or a holder. The first mounting portion 23 is vertically moved by a first vertical movement motor 26, and is axially rotated by a first shaft rotation motor 27. The second mounting portion 24 has the same configuration as the first mounting portion 23, and all of the various suction nozzles 25, the cleaning nozzles 30, and the cleaning brush 40 are detachably mounted. The second mounting portion 24 is vertically moved by the second vertical movement motor 28, and is axially rotated independently of the first mounting portion 23 by the second shaft rotation motor 29. For convenience of description, the first mounting portion 23 and the second mounting portion 24 are collectively referred to as a mounting portion, and the first vertical movement motor 26 and the second vertical movement motor 28 are collectively referred to as a vertical movement motor. The first shaft rotation motor 27 and the second shaft rotation motor 29 are collectively referred to as a shaft rotation motor. Further, here, a case where the suction nozzle 25 is mounted on the first mounting portion 23 and the cleaning nozzle 30 is mounted on the second mounting portion 24 will be mainly described.

The suction nozzle 25 is a collection unit that is mounted on the mounting unit and collects components using pressure (positive pressure air or negative pressure air). The suction nozzle 25 sucks the component by the negative pressure supplied from the negative pressure supply unit 16 via the switching valve 17. In addition, the suction nozzle 25 releases the suction of the component by the positive pressure supplied from the positive pressure supply unit 15 via the switching valve 17. The cleaning nozzle 30 is a cleaning unit that cleans the suction nozzle 25 using pressure. The cleaning nozzle 30 removes foreign matter adhering to the suction nozzle 25 by spraying a positive pressure on the suction nozzle 25. As shown in FIG. 2, the cleaning nozzle 30 includes a mounting plate 31, a connecting pipe 32, and a discharge pipe 33. The mounting plate 31 is a member that is joined to the mounting portion, and has a hole for transmitting the pressure applied from the pressure applying unit 14. The connection pipe 32 is a pipe connected below the mounting plate 31. The discharge pipe 33 is a pipe connected to the connection pipe 32 and having an opening in the horizontal direction. The discharge pipe 33 is attached to the attachment portion with its opening facing the suction nozzle 25 side.

The discard box 35 is a box body that discards components that are inconvenient for mounting processing, such as components that are abnormal in shape such as deformation, or components that cannot be arranged due to abnormal sampling posture. The disposal box 35 also serves as a cleaning box that houses the suction nozzle 25 and the cleaning nozzle 30 and cleans the suction nozzle 25. The discard box 35 is provided with a component sensor 36 that detects the storage state (storage amount) of discarded components. The component sensor 36 may be, for example, a transmissive sensor that has an irradiation unit and a light receiving unit and detects that the discarded component has been accommodated up to that position when the state where the light is blocked continues. Alternatively, the component sensor 36 may be a contact-type sensor that detects that the waste component is accommodated up to that position by contacting the waste component. Further, in the waste box 35, a scattering prevention material 37 is provided on the opening side of the discharge pipe 33 of the cleaning nozzle 30. The anti-scattering material 37 is formed of, for example, a material such as sponge or felt, and is a member that prevents the scattered foreign matter from being entangled.

Next, an operation of the mounting apparatus 11 of the present embodiment configured as described above, particularly a process of cleaning the suction nozzle 25 will be described. FIG. 3 is a flowchart showing an example of a cleaning processing routine executed by the CPU 19 of the control unit 18. FIG. 4 is an explanatory diagram of a cleaning process of the suction nozzle 25 performed in the discard box 35. The cleaning processing routine is executed by the CPU 19 at a predetermined timing, for example, after the mounting processing using the suction nozzle 25 has passed a predetermined time. For example, in the mounting process, the mounting head 22 mounts all the suction nozzles 25 on the mounting portion, and mainly executes the collection of components. The cleaning nozzle 30 is assumed to be mounted on a holder (not shown) arranged in the apparatus. When this routine is started, the CPU 19 mounts the cleaning nozzle 30 on the second mounting portion 24 (step S100). Here, the CPU 19 mounts the cleaning nozzle 30 on the second mounting portion 24.

Next, the CPU 19 inputs the value of the component sensor 36 (step S110), and determines whether or not the discarded component exists up to the position of the component sensor 36 (step S120). When the discarded parts exist up to the position of the component sensor 36, the CPU 19 instructs the operator to dispose of the discarded parts, for example, by displaying a message on the operation panel (not shown) to dispose of the discarded parts in the discard box 35. Notify (step S130). The operator who confirms this discards the discarded parts in the waste box 35. On the other hand, when the discarded component does not exist up to the position of the component sensor 36, the CPU 19 moves the mounting head 22 onto the discard box 35 (step S140), lowers the suction nozzle 25 and the cleaning nozzle 30, and disposes them. Is placed inside (step S150).

Subsequently, the CPU 19 executes a cleaning process of the suction nozzle 25, in which the suction nozzle 25 is axially rotated and the cleaning nozzle 30 is moved up and down while supplying a positive pressure from the opening of the discharge pipe 33 (step S150). The foreign matter or the like adhering to the suction nozzle 25 is blown by the cleaning nozzle 30 and separated from the suction nozzle 25, and is removed by, for example, the scattering prevention material 37 (see FIG. 4). Then, after performing the cleaning process for a predetermined time (for example, 10 seconds), the CPU 19 removes the cleaning nozzle 30 (step S170), and ends this routine.

Here, the correspondence relationship between the constituent elements of the present embodiment and the constituent elements of the present invention will be clarified. The suction nozzle 25 of the present embodiment corresponds to a sampling unit, the cleaning nozzle 30 corresponds to a cleaning unit, the mounting head 22 corresponds to a mounting head, the control unit 18 corresponds to a control unit, and the disposal box 35 corresponds to a cleaning box. And the component box 36 corresponds to the detection unit.

The mounting head 22 of the present embodiment described above includes the suction nozzle 25 (collection unit) that collects a component, and the cleaning nozzle 30 (cleaning unit) that cleans the suction nozzle 25. In this mounting head 22, since the suction nozzle 25 is cleaned by the cleaning nozzle 30 provided in the same head, the sampling portion can be automatically cleaned with a relatively simple configuration. Further, since the mounting head 22 has two or more mounting portions on which either the suction nozzle 25 or the cleaning nozzle 30 can be mounted, the suction nozzle 25 and the cleaning nozzle 30 can be replaced, and the mounting portion can be shared. Thus, the suction nozzle 25 can be cleaned while simplifying the configuration. Further, since the cleaning nozzle 30 is mounted on the second mounting portion 24 that can be axially rotated independently of the first mounting portion 23 and cleans the suction nozzle using pressure, for example, the suction nozzle 25 is It can be cleaned while rotating the shaft. Further, in the mounting head 22, the suction nozzle 25 can be cleaned while rotating the cleaning nozzle 30 about its axis. Furthermore, the mounting head 22 can be cleaned with a cleaning nozzle 30 that cleans the suction nozzle 25 using pressure. When the cleaning process is executed, the control unit 18 axially rotates the suction nozzle 25 and vertically moves the cleaning nozzle 30, so that the entire suction nozzle 25 can be sufficiently cleaned. Further, since the control unit 18 executes the cleaning process in the state where the suction nozzle 25 and the cleaning nozzle 30 are accommodated in the discard box 35, it is possible to store the foreign matter generated by the cleaning in the discard box 35, It is possible to further suppress the scattering of foreign matter inside the mounting apparatus. Furthermore, in the mounting apparatus 11, since the discard box 35 also serves as the cleaning box, the suction nozzle 25 can be automatically cleaned while simplifying the configuration. Further, since the mounting device 11 detects the accommodation state of the discarded components by the component sensor 36, it is possible to avoid contact between the suction nozzle 25 and the cleaning nozzle 30 and the discarded components.

It is needless to say that the present invention is not limited to the above-described embodiments and can be implemented in various modes as long as they are within the technical scope of the present invention.

For example, in the above-described embodiment, the suction nozzle 25 is mounted on the first mounting portion 23 and the cleaning nozzle 30 is mounted on the second mounting portion 24. However, the suction nozzle 25 is mounted on the second mounting portion 24. The cleaning nozzle 30 may be mounted on the first mounting portion 23. Further, in the above-described embodiment, the two mounting portions, that is, the first mounting portion 23 and the second mounting portion 24 are provided, but any number of mounting portions may be provided as long as the number is two or more.

In the above-described embodiment, when the cleaning process is executed, the CPU 19 axially rotates the suction nozzle 25 and vertically moves the cleaning nozzle 30, but the suction nozzle 25 may be vertically moved, or cleaning may be performed. Both the nozzle 30 and the suction nozzle 25 may be moved up and down. Further, the CPU 19 may rotate the cleaning nozzle 30 axially (rotate) within a range where positive pressure is applied to the suction nozzle 25. Further, the CPU 19 may omit any one or more of this operation if positive pressure is applied to the suction nozzle 25 from the discharge pipe 33.

In the above-described embodiment, the cleaning nozzle 30 blows a positive pressure to the suction nozzle 25, but the suction nozzle 25 may be cleaned by sucking air around the suction nozzle 25 with a negative pressure.

In the above-described embodiment, the CPU 19 executes the process of cleaning the suction nozzle 25 after the mounting process using the suction nozzle 25 has passed the predetermined time. The process of cleaning the suction nozzle 25 may be executed after the foreign matter is detected by the suction nozzle 25 during the image processing of (1).

In the above-described embodiment, the cleaning nozzle 30 that cleans the suction nozzle 25 using pressure is used, but the invention is not particularly limited to this. For example, as shown in FIG. It may be the cleaning brush 40 that contacts and cleans. FIG. 5 is an explanatory diagram illustrating an example of the cleaning brush 40. The cleaning brush 40 is a cleaning unit that cleans the suction nozzle 25 by rubbing with the brush. The cleaning brush 40 includes a mounting plate 41, a connecting pipe 42, a main body 43, and a brush main body 45. The mounting plate 41 is a member that is joined to the mounting portion, and has a hole for transmitting the pressure applied from the pressure applying unit 14. The connection pipe 42 is a pipe connected below the mounting plate 41. The main body 43 is connected to the connection pipe 32, and an internal space 44 is formed in the interior thereof in the horizontal direction, and is a cylinder that slides the brush main body 45 in the horizontal direction. The brush main body 45 has a brush disposed on the front end side and a flange that receives the pressure supplied from the connection pipe 42 on the rear end side. A spring 46 is arranged on the flange portion of this flange. The spring 46 urges the brush body 45 to move to the internal space 44 side. When the positive pressure is supplied from the pressure applying unit 14, the cleaning brush 40 moves to the side away from the main body 43, and when the positive pressure is released, the brush is urged by the spring 46 to move the brush 43 to the main body 43. Move to the side closer to. The mounting head 22 can be cleaned by rubbing the suction nozzle 25 by the operation of the brush.

In the above-described embodiment, the discard box 35 also serves as a cleaning box, but the mounting apparatus 11 may include a cleaning box in addition to the discard box 35. Also in this mounting apparatus, the sampling unit can be automatically cleaned by the cleaning unit. Alternatively, the control unit 18 may clean the suction nozzle 25 at a predetermined place other than the discard box 35 and the cleaning box.

In the above-described embodiment, the collection unit to be cleaned has been described as the suction nozzle 25, but the collection unit to be cleaned may be a mechanical chuck that grips and collects components. With this mounting device, the mechanical chuck can be automatically cleaned.

In the above-described embodiment, the present invention has been described as the mounting apparatus 11 including the mounting head 22, but the present invention is not limited to this and the present invention may be used as the mounting head 22.

INDUSTRIAL APPLICABILITY The present invention can be used in the field of mounting electronic components.

DESCRIPTION OF SYMBOLS 10 mounting system, 11 mounting apparatus, 12 board|substrate conveyance unit, 13 component supply unit, 14 pressure application unit, 15 positive pressure supply part 16 negative pressure supply part, 17 switching valve, 18 control unit, 19 CPU, 20 mounting unit, 21 Head moving part, 22 mounting head, 23 first mounting part, 24 second mounting part, 25 suction nozzle, 26 first vertical movement motor, 27 first axis rotation motor, 28 second vertical movement motor, 29 second axis rotation Motor, 30 cleaning nozzle, 31 mounting plate, 32 connecting pipe, 33 discharge pipe, 35 waste box, 36 component sensor, 37 anti-scattering material, 40 cleaning brush, 41 mounting plate, 42 connecting pipe, 43 body part, 44 internal space , 45 brush body, 46 spring, 50 management computer (PC50), S board.

Claims (9)

A mounting head mounted on a mounting device for collecting components,
A collection unit that collects parts,
And a cleaning unit that cleans the collecting unit,
The collecting unit is a suction nozzle that is mounted on the first mounting unit that is rotatable about an axis and that collects the component by using pressure.
The cleaning unit is mounted on a second mounting unit that is axially rotatable independently of the first mounting unit, and cleans the suction nozzle using pressure.
Mounting head. The mounting head according to claim 1, further comprising two or more mounting parts capable of mounting either the sampling part or the cleaning part. The cleaning unit is a cleaning nozzle for cleaning with a pressure the sampling unit, the mounting head according to claim 1 or 2. The cleaning unit is a cleaning brush for cleaning in contact with the sampling unit operates with the pressure, the mounting head according to claim 1 or 2. A mounting head according to any one of claims 1-4,
A control unit that executes a cleaning process that causes the cleaning unit to clean the collection unit;
Mounting device equipped with. The mounting apparatus according to claim 5 , wherein the control unit axially rotates the sampling unit and vertically moves the cleaning unit relative to the sampling unit when performing the cleaning process. A mounting head including a collecting unit that collects components, and a cleaning unit that cleans the collecting unit ,
And a control unit for executing a cleaning process for cleaning the collecting section to the cleaning section,
The mounting device , wherein the control unit axially rotates the sampling unit and vertically moves the cleaning unit relative to the sampling unit when performing the cleaning process . The mounting apparatus according to any one of claims 5 to 7 ,
A cleaning box capable of accommodating the collecting section and the cleaning section;
The said mounting part is a mounting apparatus which performs the said cleaning process in the state which accommodated the said collection part and the said cleaning part in the said cleaning box. The mounting apparatus according to claim 8, wherein the cleaning box is a discard box that discards the component, and includes a detection unit that detects a storage state of the discarded component.

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