JP2013118319A - Mounting device and mounting method for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting device capable of efficiently mounting a TAB component on a substrate.SOLUTION: The mounting device includes two first delivery bodies 8a which convey TAB components 5 punched by a punching device 2, an index table 11 where two TAB components 5 are delivered to a pair of holding heads 12, a cleaning device which cleans terminal parts of the TAB components 5 held by the holding heads 12 at the same time, two sticking holders 48a and 48b which receive the two cleaned TAB components 5 from second delivery bodies 27a and 27b and drive the two TAB components 5 with the terminal parts opposed to each other, two sticking devices 31A and 31B which press and stick pressure-sensitive adhesive tapes stuck on tops of a pair of release tapes traveling in parallel by one pressure tool 54, and four mounting heads which receive the TAB components 5 having the pressure-sensitive adhesive tapes stuck from fourth delivery bodies 57a and 57b and each mount two components on top surfaces of side parts of the substrates.

Description

  The present invention relates to an electronic component mounting apparatus and mounting method for mounting electronic components such as TCP (Tape Carrier Package) or COF (Chip on Film), which are TAB (Tape Automated Bonding), on a substrate such as a liquid crystal display panel using an adhesive tape. About.

  When manufacturing a liquid crystal display panel as a substrate, an electronic component such as TCP or COF is mounted on the liquid crystal display panel with an adhesive tape made of an anisotropic conductive member.

  A mounting apparatus for mounting electronic components on a substrate has a box-shaped apparatus body. A punching device for punching out the TCP from a carrier tape as a tape-like member is provided in the apparatus main body. The TCP punched by the punching device is received by the first transfer body.

  The first delivery body conveys the TCP punched by the punching device to a predetermined position, and among the plurality of holding heads provided in the index table that is rotationally driven intermittently by a predetermined angle at the position. Delivered to the holding head positioned at the supply position. The holding head is provided so as to be driven in the vertical direction.

  The TCP delivered to the holding head of the index table is cleaned by the sticking device at the sticking position after the terminal portion provided on the lower surface at the cleaning position is cleaned with a rotating brush according to the intermittent rotation of the index table. An adhesive tape cut to a predetermined length is attached to the terminal portion.

  The electronic component with the adhesive tape attached is received by the second transfer body at the transfer position and transferred to the mounting head, and then mounted on the side portion of the upper surface of the substrate positioned by the table device.

  That is, in the conventional mounting device, one index table is provided for one punching device, and the terminal portion of the electronic component is cleaned and the adhesive tape is attached to the terminal portion at a predetermined rotational position of the index table. In practice, the electronic component with the adhesive tape attached is transferred to one mounting head and mounted on the substrate.

JP 2010-80875 A

  In the mounting apparatus configured as described above, the punching of the electronic component from the carrier tape by the punching apparatus can be performed at a relatively high speed because it is a normal press process. For example, it can be punched according to the feed speed of the carrier tape.

  On the other hand, the operation of cleaning the terminal part of the electronic component held by the index table holder with a rotating brush or sticking the adhesive tape to the terminal part must be performed after stopping the feeding of the electronic component. Not only does it take time, but each work takes time, so it may take longer than the work of punching electronic components from the carrier tape.

  Furthermore, the operation of mounting the electronic component with the adhesive tape attached to the substrate by the mounting head must be performed after the electronic component is precisely positioned with respect to the substrate. It may take a lot of work time compared to the sticking work.

  However, in the conventional mounting device, as described above, one index table is arranged for one punching device, and the terminal portion of the electronic component is cleaned and the adhesive tape is attached to the terminal portion with this index table. At the same time, an electronic component having an adhesive tape attached by one mounting head is mounted on the substrate. That is, compared with the punching operation of the electronic component by the punching device, the work efficiency such as the cleaning of the terminal portion of the electronic component on the downstream side and the mounting on the substrate is low.

  Therefore, it may take a long time to mount the electronic component punched from the carrier tape by the punching device on the substrate, and it is particularly required to mount a plurality of electronic components on the side of the substrate. As a result, productivity increases as the number of electronic components increases.

  It is an object of the present invention to provide an electronic component mounting apparatus and mounting method capable of greatly improving the efficiency of the work of mounting a plurality of electronic components on a side portion of a substrate.

The present invention is a mounting device for mounting an electronic component having a terminal portion on the lower surface to a substrate with an adhesive tape,
A punching device for punching the electronic component from the tape-shaped member;
Two first delivery bodies for receiving and transporting the electronic component punched by the punching device;
An index table in which a plurality of pairs of holding heads that form a pair are provided at predetermined intervals in the circumferential direction, and two electronic components received by the two first transfer bodies are transferred to the two holding heads of each set; ,
Cleaning means for simultaneously cleaning the terminal portions on the lower surface of the electronic component held by the two holding heads of each set of the index table;
Two second delivery bodies that receive the electronic components from each set of two holding heads cleaned by the cleaning means and change the orientation of the two electronic components so that the terminal portions of the electronic components face each other;
The electronic component is received from the two second transfer bodies while holding the upper surface with the terminal portions facing each other, and can be driven to travel along a predetermined direction with the terminal portions of the electronic component facing each other. Two sets of third delivery bodies that are paired with two provided;
The adhesive tape divided into a length corresponding to the electronic component is attached to the upper surface, and has a release tape that is paired with two so as to be able to run in parallel with each other in the predetermined direction. One pressing tool provided so as to straddle two release tapes that form a pair when the two electronic components are positioned by the two third transfer bodies in the middle of the predetermined direction Two sets of adhering devices for pressure adhering the adhesive tape on the upper surfaces of the two release tapes to the terminal portions of the two electronic components;
Two pairs of fourth delivery bodies that form a pair of two each receiving two electronic components each having an adhesive tape attached thereto by each attaching device;
Four mounting heads that hold and receive the upper surface of the electronic component having the adhesive tape attached to the lower surface from the two fourth transfer bodies of each set, and mount them two at a time on the upper surface of the side portion of the substrate; An electronic component mounting apparatus comprising:

The electronic components received by the two first delivery means from the punching device are delivered to the two holding heads in each group with the terminal portions provided on the lower surface directed outward in the radial direction of the index table. And
The cleaning means is preferably a rotating brush having a length capable of simultaneously cleaning the terminal portions of two adjacent electronic components.

In the middle of the direction of travel of the release tape of each sticking device, one image pickup means for picking up images of the terminal portions on the lower surfaces of the two electronic components whose upper surfaces are held by the two third transfer bodies; ,
It is preferable to further have a control means for relatively positioning the two third transfer bodies and the adhesive tape based on the position of the terminal portion obtained by imaging by the imaging means.

The imaging means images the front end and the rear end of the adhesive tape attached to the terminal portion of the electronic component,
It is preferable that the control means discriminates the state of the front end portion and the rear end portion of the adhesive tape based on the imaging of the imaging means.

  The two fourth transfer bodies of each set simultaneously receive two electronic components having the adhesive tape attached thereto from the two third transfer bodies, and then simultaneously transfer them to two of the four mounting heads. The two mounting heads receiving the electronic component preferably mount the electronic component on the substrate at the same time.

This invention is a mounting method for mounting an electronic component having a terminal portion on the lower surface to a substrate with an adhesive tape,
A step of punching the electronic component from the tape-shaped member;
Receiving the punched electronic component and transporting it with two first delivery bodies;
A process of delivering two electronic components received by the two first delivery bodies to a plurality of pairs of holding heads that are paired by two provided at predetermined intervals in the circumferential direction of the index table;
Simultaneously cleaning the terminal portions on the lower surface of the electronic component held by the two holding heads of each set of the index table;
Receiving the electronic components from the two holding heads of each cleaned set by two second transfer bodies and changing the orientation of the two electronic components so that the terminal portions of these electronic components face each other;
A state in which the terminal parts of these electronic components are opposed to each other from the two second delivery bodies by two pairs of third delivery bodies that are paired with each other so as to be able to travel and drive along a predetermined direction. In the process of holding the upper surface and receiving alternately,
Two sets of mold release tapes that are paired with two adhesive tapes that are attached to the upper surface of the adhesive tape and cut in a length corresponding to the electronic component, and that can run parallel to each other along the predetermined direction. And when the two electronic components are positioned by the two third transfer bodies in the middle of the predetermined direction, the two electronic parts are provided to face each other across the two release tapes. Pressing the adhesive tape on the upper surfaces of the two release tapes onto the terminal portions of the two electronic components with a pressure tool; and
Receiving two electronic parts each having two adhesive parts affixed by two pairs of fourth transfer bodies,
The two sides of the substrate receive and hold the upper surface of the electronic component having the adhesive tape adhered to the lower surface alternately from the two fourth transfer bodies of each set by two of the four mounting heads. A method of mounting electronic components on the upper surface of the electronic component.

  According to the present invention, two electronic parts punched by one punching device are supplied to the index table two by two, the terminal portions of the two electronic parts are cleaned at the same time, and then the release tape that makes a pair of the two After the adhesive tape is simultaneously attached to the terminal portions of two electronic components by the two sets of attaching devices, the electronic component to which the adhesive tape is attached by each of the attaching devices is connected to two of the four mounting heads. The two electronic components were simultaneously mounted on the substrate by passing the two mounting heads alternately.

  For this reason, the punching speed of the electronic component in one punching device can be increased according to the mounting speed by the four mounting heads, so that the productivity can be greatly improved.

  In addition, since two electronic components held by two paired holding heads can be simultaneously cleaned in the index table, the cleaning time can be shortened. Since the pressure-sensitive adhesive tape can be adhered simultaneously by using two pressure tools, not only the time required for adhesion can be shortened, but also the configuration of the pressure-sensitive adhesive device can be simplified by using only one pressure tool.

The top view which shows a part of schematic structure of the mounting apparatus which shows one embodiment of this invention. The top view which shows the remaining part of the mounting apparatus shown in FIG. The side view of a cleaning apparatus. The front view which carried out the partial cross section of the cleaning apparatus shown in FIG. Explanatory drawing of the state in which the 2nd delivery body which received the TAB component by which the terminal part was cleaned from the index table was positioned below the sticking holding body. Explanatory drawing of the state by which the TAB component hold | maintained at the sticking holding body was positioned above the imaging camera. (A) is explanatory drawing of the state by which the TAB component hold | maintained at the sticking holding body was positioned by the pressurization tool, (b) is explanatory drawing of the state by which an adhesive tape is stuck on a TAB component with a pressurization tool. The side view of a sticking apparatus. The side view which shows the mechanism which divides the adhesive tape stuck to the release tape provided in the sticking apparatus into predetermined length. The front view of the part which guides the two release tapes of a sticking apparatus so that a perpendicular direction is possible by one guide roller. Explanatory drawing of the state which delivers the TAB component by which the adhesive tape was stuck from the sticking holding body to the 4th delivery body. Explanatory drawing of the state which delivers the TAB component delivered to the 4th delivery body to a mounting head. Explanatory drawing of the state which mounts the TAB component which the mounting head received in the side part of a board | substrate. The block diagram which shows the control system by a control apparatus.

An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 is a plan view of a part showing a schematic configuration of the mounting apparatus, and FIG. 2 is a plan view of the remaining part showing the schematic configuration of the mounting apparatus. As shown in FIG. 1, the mounting apparatus has a box-shaped apparatus body 1. Among the X and Y directions indicated by the arrows of the apparatus main body 1, one punching device 2 is arranged along the Y direction on the + Y direction side, which is the rear end portion in the front-rear direction indicated by the arrow Y.

  The punching device 2 has a mold part 3. Although the details of the mold part 3 are not shown, an upper mold and a lower mold are arranged facing each other in the vertical direction, and a carrier as a tape-like member fed from a supply reel is interposed between these molds. Tape 4 is supplied.

  The carrier tape 4 is formed with a TAB component 5 having terminal portions 5a such as TCP and COF as electronic components at predetermined intervals in the longitudinal direction, and the surface on which the TAB component 5 and the terminal portions 5a are formed. The mold part 3 is supplied downward.

  When the portion of the carrier tape 4 on which the TAB part 5 is formed is supplied to the mold part 3, the mold part 3 is activated to punch out the TAB part 5 from the carrier tape 4. .

  The TAB parts 5 punched out by the mold part 3 are alternately received by the two first transfer bodies 8a and 8b. The two first transfer bodies 8a and 8b are each driven in the X, Y, Z and θ directions by the first XYZθ driving source 7 shown in FIG. That is, the TAB component 5 punched out by the mold part 3 is supplied and held on the upper surfaces of the two first transfer bodies 8a and 8b with the surface on which the terminal part 5a is formed facing down.

The carrier tape 4 from which the TAB component 5 has been punched is taken up by a take-up reel (not shown).
Note that the Z direction is a vertical direction orthogonal to the plane formed by the X and Y directions, and the θ direction is a rotation direction centered on an axis orthogonal to the plane formed by the X and Y directions.

  The two first transfer bodies 8a and 8b that have received the TAB component 5 move in the + X direction and then move in the -Y direction as indicated by an arrow a in FIG. After being positioned at a position facing the lower side of the holding head 12 of the index table 11, it is driven upward in the Z direction to deliver the upper TAB component 5 to the suction surface 12 a of the holding head 12.

  That is, on the lower surface of the peripheral portion of the index table 11, four pairs of the holding heads 12 that form a pair are provided at intervals of 90 degrees in the circumferential direction. As shown in FIG. 3, the holding head 12 has an L-shaped side surface, and the lower end is formed on the suction surface 12a where a suction force is generated.

  A rotation shaft 11 a is provided at the center of the upper surface of the index table 11. The rotary shaft 11a is connected to a first rotary drive source 13 shown in FIG. The first rotational drive source 13 is configured to intermittently drive the index table 11 by a predetermined angle in the circumferential direction.

  In this embodiment, the index table 11 is rotated 90 degrees in the circumferential direction. Accordingly, the two holding heads 12 of each set provided on the lower surface of the index table 11 are sequentially positioned at the supply position indicated by S, the cleaning position indicated by C, the delivery position indicated by D, and the empty position indicated by E in FIG. It has come to be.

  When the TAB component 5 is supplied to the upper surface, the two first transfer bodies 8a and 8b move to the supply position S, and are moved to the two holding heads 12 positioned at the supply position S. At the same time.

  That is, the two first transfer bodies 8a and 8b are driven in the X direction and the Y direction as indicated by the arrow a and positioned below the two holding heads 12 at the supply position S, and then lifted in the Z direction. To do. Accordingly, as shown in FIG. 4, the upper surface of one end portion of the TAB component 5 having the terminal portion 5 a formed on the lower surface is sucked and held by the suction surfaces 12 a of the two holding heads 12.

  The two holding heads 12 that have received the TAB component 5 are positioned at the cleaning position C by the index table 11 being rotated 90 degrees. Below this cleaning position C, a cleaning device 15 as a cleaning means shown in FIGS. 3 and 4 is arranged.

  The cleaning device 15 has a mounting plate 17 that is driven in the vertical direction by a first Z drive source 16 such as a linear motor or a cylinder. A support case 18 having an upper surface opened is provided on the mounting plate 17, and a cleaning brush 19 is rotatably supported by the support case 18. As shown in FIG. 4, the cleaning brush 19 has a length dimension that can simultaneously clean the terminal portions 5 a on the lower surface of the TAB component 5 held by the two holding heads 12.

  As shown in FIG. 3, a second rotation drive source 21 is installed on one side of the support case 18 on the upper surface of the mounting plate 17. A belt 22 is stretched between pulleys 21 a and 19 a provided in the second rotation drive source 21 and the cleaning brush 19.

  Accordingly, the cleaning brush 19 is rotated in the clockwise direction indicated by an arrow in FIG. 3, that is, in a direction in which force is applied by the arrow b to the TAB component 5 sucked and held on the suction surface 12 a of the holding head 12. As a result, the TAB component 5 may move in the direction of the arrow b with respect to the suction surface 12a of the holding head 12 when the terminal portion 5a is cleaned, and the holding position may be displaced.

  On the other side of the support case 18 on the upper surface of the mounting plate 17, a positioning cylinder 23 is supported by a pedestal 24 with the axis line horizontal at a position above the cleaning brush 19. The tip of the rod 23a of the cylinder 23 is opposed to the lower end portion on which the suction surface 12a of the holding head 12 positioned at the cleaning position C is formed, and the tip thereof has substantially the same length as the cleaning brush 19. A pressing member 25 having a dimension, that is, a length dimension equal to or greater than the width dimension of the two TAB parts 5 held by the two holding heads 12 is provided.

  When the two holding heads 12 that suck and hold the TAB component 5 are positioned at the cleaning position C, the lower surface of the TAB component 5 in which the cleaning brush 19 is held by the two holding heads 12 by the first Z drive source 16. It is driven in the upward direction to a height at which it contacts the terminal portion 5a.

  Next, the cleaning brush 19 is rotationally driven in the direction of the arrow, and the terminal portions 5a of the two TAB parts 5 are simultaneously cleaned. After cleaning, the pressing member 25 provided on the rod 23a of the cylinder 23 is lowered until it reaches the same height as the TAB component 5 held by the holding head 12, and then the cylinder 23 is operated to move to the rod 23a. The end surfaces of the two TAB components 5 are simultaneously pressed in the direction opposite to the direction indicated by the arrow b in FIG. 3 by the provided pressing member 25.

  As a result, the holding position of the pair of TAB parts 5 with respect to the suction surface 12a of the holding head 12 is corrected. That is, by cleaning the terminal portion 5a of the TAB component 5 with the cleaning brush 19, even if the holding position of the TAB component 5 with respect to the suction surface 12a is shifted, the TAB component 5 is moved by the pressing member 25. The holding position with respect to the suction surface 12a is corrected so as to be a predetermined position.

  The pair of TAB parts 5 whose terminal portions 5 a have been cleaned at the cleaning position C are positioned at the delivery position D by the index table 11. The two TAB parts 5 positioned at the delivery position D are delivered to the pair of second delivery bodies 27a and 27b.

  The pair of second transfer bodies 27a and 27b are driven in the X, Y, Z and θ directions by the second XYZθ driving source 28 shown in FIG. When it is received, it is driven in the + Y direction and positioned below the pair of holding heads 12 positioned at the delivery position D as shown in FIG.

  Next, the pair of second transfer bodies 27a and 27b are driven upward in the Z direction to receive the TAB component 5 held on the suction surface 12a of the holding head 12, and then driven downward in the Z direction. It is driven in the Y direction and rotated 90 degrees in opposite directions as indicated by an arrow f in FIG. 1 so that the terminal portions 5a of the TAB parts 5 received on the respective upper surfaces face each other.

  Two sets of sticking devices 31A and 31B are arranged on the −Y direction side of the device body 1 with respect to the −Y direction side, symmetrically spaced in the X direction with the index table 11 as the center.

  As shown in FIG. 8, each set of sticking devices 31 </ b> A and 31 </ b> B has a supply reel 34 that is rotatably provided with a release tape 32 wound thereon. An adhesive tape 33 made of an anisotropic conductive member is attached to one side surface of the release tape 32, and the release tape 32 is fed from the supply reel 34 upward in the vertical direction.

  The release tape 32 fed out from the supply reel 34 is changed in the horizontal direction by the first guide roller 35 so that the surface to which the adhesive tape 33 is attached faces upward, and travels a predetermined length. The direction is changed downward by the second guide roller 36 in the vertical direction.

  A portion of the release tape 32 whose direction has been changed vertically by the second guide roller 36 is sandwiched by a pair of sandwiching pieces 37 a that are driven to open and close in the arrow direction of the feed chuck 37.

  The feed chuck 37 is driven in the vertical direction by a second Z drive source 38 shown in FIGS. Therefore, if the pair of sandwiching pieces 37 a are driven in the down direction, ie, the −Z direction, with the two release tapes 32 being sandwiched, the release tape 32 depends on the moving distance of the feed chuck 37. It is fed out from the supply reel 34 in length.

  A holding chuck 40 having a pair of clamping pieces 40 a that are driven to open and close in the direction of the arrow is provided upstream of the feed chuck 37 in the running direction of the release tape 32. The holding chuck 40 is driven with a predetermined stroke by the second Z drive source 38 with the feeding chuck 37 sandwiching the release tape 32 to feed the release tape 32, and then the holding piece 37a is moved. When releasing and returning to the original position, the release tape 32 is clamped to prevent the release tape 32 from loosening.

  As will be described later, when the adhesive tape 33 is attached to and removed from the TAB component 5, the unnecessary portion of the release tape 32 is discarded in the disposal box 47.

  A strip-shaped support member that supports a side surface of the release tape 32 opposite to the side surface to which the adhesive tape 33 is attached is attached to a portion of the release tape 32 that is fed vertically from the supply reel 34. 41 is provided.

  On one side where the adhesive tape 33 of the release tape 32 facing the support member 41 is attached, a pair of adhesive tapes 33 attached to the release tape 32 as shown in FIG. A cutting mechanism 43 having a pair of cutters 42 that form cutting lines 33a at predetermined intervals is provided. That is, the cutter 42 has a width dimension capable of forming the cutting line 33 a on the two adhesive tapes 33 at the same time.

  The cutting mechanism 43 has a first horizontal drive source 44 such as a cylinder arranged with its axis horizontal, and a pair of attachment mechanisms 44b provided at the tip of the drive shaft 44a of the first horizontal drive source 44 are paired. The cutters 42 are provided at predetermined intervals in the vertical direction.

  Therefore, when the first horizontal drive source 44 is activated, a pair of cutting lines 33a can be simultaneously formed on the adhesive tape 33 by the pair of cutters 42. At this time, the stroke of the cutter 42 is set so that the release tape 32 attached with the adhesive tape 33 is not cut by the cutter 42.

  A portion 33 b where the pair of cutting lines 33 a is formed by the cutter 42 of the adhesive tape 33 faces the extraction mechanism 45 when the release tape 32 is fed by the feed chuck 37 for a predetermined length. The extraction mechanism 45 is attached to the second horizontal drive source 46 and the tip of the drive shaft 46a of the second horizontal drive source 46, and presses against the pressure-sensitive adhesive tape 33 and travels opposite to the pressure piece 46b. The extraction tape 46c having the same width as the pressing piece 46b is provided.

  When the second horizontal drive source 46 is operated and the pressing piece 46b presses the part cut by the pair of cutting lines 33a of the two adhesive tapes 33 via the extraction tape 46c, the part 33b becomes It is stuck on the extraction tape 46c and removed at the same time. Accordingly, the adhesive tape 33 attached to one side surface of the release tape 32 is divided into lengths corresponding to the width dimension of the TAB component 5.

  Then, the release tape 32 of each of the pair of sticking devices 31A and 31B is in a state of being spaced apart in parallel at a predetermined interval, and the surface on which the adhesive tape 33 is stuck is up, and the −Y direction from the + Y direction shown in FIG. It is sent in the direction.

  As shown in FIG. 1, FIG. 7 or FIG. 10, the two sets of the sticking devices 31 </ b> A and 31 </ b> B are arranged close to each other so that the release tapes 32 run in parallel at a slight interval. Accordingly, the two sets of the sticking devices 31A and 31B have a support member 41 that supports the release tape 32 when the adhesive tape 33 is divided into a predetermined length, and first and second guides for the release tape 32. Guide rollers 35 and 36, a feed chuck 37 for feeding the release tape 32 at a predetermined stroke, and a holding chuck 40 simultaneously guide or feed the two release tapes 32 of the respective sticking devices 31A and 31B. Is set to a width dimension that can be

FIG. 10 shows a state where the second guide roller 36 is formed to have a width dimension that can guide the two release tapes 32.
The supply reel 34 may have a width dimension in which two release tapes 32 are wound at predetermined intervals.

  As shown in FIG. 1, a pair of third holding bodies 48 a and 48 b are respectively waiting at the end portions on the + Y direction side of the two sets of the bonding apparatuses 31 </ b> A and 31 </ b> B. That is, two sets of sticking holders 48a, 48a and 48b, 48b, which form two pairs, are arranged for the two sets of sticking devices 31A, 31B.

  As shown in FIG. 5, each sticking holding body 48a, 48b has an L-shaped side surface, and the lower surface of one end projecting downward is formed on the suction surface 48c. 49, respectively, in the Y direction. A pair of sticking holders 48a, 48a and 48b, 48b in each set stand by at the end in the + Y direction of the two sets of sticking devices 31A, 31B with the one end where the suction surface 48c is formed facing each other. doing.

  And a pair of said 2nd delivery bodies 27a and 27b which received the TAB component 5 in the said delivery position D are first driven to -X direction, and oppose the edge part of the + Y direction side of one sticking apparatus 31A. And it positions below the pair of sticking holding bodies 48a and 48a which waited.

  That is, positioning is performed so that the suction surfaces 48c of the pair of holding holders 48a and 48a face the upper surface of the terminal portion 5a formed on the lower surface of the TAB component 5 held on the upper surfaces of the second delivery bodies 27a and 27b. Is done. This state is shown in FIG.

  The sticking holders 48 a and 48 a are driven by separate Y drive sources 49, but may be integrally driven by one Y drive source 49.

  Next, the pair of second transfer bodies 27a and 27b are driven upward in the Z direction. Thereby, the upper surface of the portion where the terminal portion 5a is formed on the lower surface of the TAB component 5 held on the upper surfaces of the second delivery bodies 27a and 27b is adsorbed and held by the adsorbing surfaces 48c of the pair of attaching holders 48a and 48a. Is done.

  As shown in FIGS. 7A and 7B, the pair of sticking holders 48a and 48a that suck and hold the upper surface of the end portion of the TAB component 5 having the terminal portion 5a formed on the lower surface are provided with the terminal portion 5a. It is driven in the −Y direction so as to face the upper surfaces of the two release tapes 32.

  The pair of sticking holders 48a and 48a are arranged in such a manner that the tips of the terminal portions 5a of the TAB parts 5 are arranged to face the lower part in the running direction of the two release tapes 32 as indicated by Y1 in FIG. The imaging position is driven to the imaging position facing the field of view of the imaging camera 51. This state is shown in FIG. Here, the tip part of the terminal part 5a of the two TAB components 5 sucked and held on the suction surfaces 48c of the pair of sticking holding bodies 48a and 48a is imaged.

  The imaging signal of the imaging camera 51 is processed by the image processing unit 52 shown in FIG. The control device 53 is provided with an arithmetic processing unit (not shown), and the arithmetic processing unit calculates the Y coordinate along the Y direction of the tip of the terminal portion 5a of the TAB component 5 from the imaging signal of the imaging camera 51.

  Next, the pair of sticking holders 48a, 48a is a process in which the terminal portion 5a of the TAB component 5 is disposed on the lower surface side of the pair of release tapes 32 based on the calculated Y coordinate of the tip of the terminal portion 5a. It is driven in the -Y direction to the sticking position indicated by Y2 in FIG.

  As shown in FIG. 7 (a), the pressing tool 54 has a width across two release tapes 32 spaced apart in parallel, and is driven in the upward direction by a Z drive source 55. . When the pair of sticking holders 48a and 48a are positioned at the position indicated by Y2 in FIG. 1, the pressurizing tool 54 is driven in the upward direction by the Z drive source 55. This state is shown in FIG.

  As a result, the release tape 32 with the adhesive tape 33 divided into a predetermined length on the upper surface is pushed up, and the TAB component 5 adsorbed and held on the adsorption surfaces 48c of the pair of attachment holders 48a and 48a. Therefore, the adhesive tape 33 on the upper surface is simultaneously attached to the terminal portions 5a of the two TAB parts 5.

  The adhesive tape 33 is previously positioned by the feed chuck 37 so that the tip of the portion divided into a predetermined length is at a predetermined position with respect to the pressure tool 54. Therefore, if the terminal part 5a of the TAB component 5 is positioned with respect to the pressing tool 54, the divided part of the adhesive tape 33 can be reliably adhered to the terminal part 5a.

  When the adhesive tape 33 is attached to the terminal part 5a of the TAB component 5, the release tape 32 is peeled from the adhesive tape 33 attached to the terminal part 5a by a release roller (not shown).

  The TAB component 5 having the adhesive tape 33 adhered to the terminal portion 5a is driven in the −Y direction from the position Y2 by the pair of attachment holders 48a and 48a, and the tip of the terminal portion 5a is driven by the imaging camera 51. It is positioned at the position of Y1, which is the imaging position. Here, the tip of the terminal portion 5a is imaged. Next, the TAB component 5 is driven in the −Y direction, the rear end portion of the terminal portion 5 a is positioned at the imaging position Y 1, and is imaged by the imaging camera 51.

  Imaging signals at the front end and rear end of the terminal portion 5a to which the adhesive tape 33 is attached are output to the image processing unit 52 and converted from analog signals to digital signals, and then the arithmetic operation (not shown) of the control device 53 is performed. The processing unit binarizes the predetermined threshold value, and the number of black and white pixels in the field of view is counted.

  Thereby, it is determined whether or not the front end portion and the rear end portion of the adhesive tape 33 adhered to the terminal portion 5a of the TAB component 5 are turned up, that is, whether the both end portions of the adhesive tape 33 are adhered. The And when a sticking state is unsatisfactory, the TAB component 5 is discarded before mounting on the side part of the board | substrate W so that it may mention later.

  Note that the two second transfer bodies 27a and 27b that receive the two TAB components 5 whose terminal portions 5a have been cleaned at the transfer position D of the index table 11 are the two TAB components 5 of the two attaching devices 31A. After passing to the sticking holders 48a and 48a, the hands are passed to the two sticking holders 48b and 48b of the other sticking device 31B.

  That is, the second delivery bodies 27a and 27b are in contrast to two sets of sticking holding bodies 48a and 48a and 48b and 48b that are paired by one sticking device 31A and the other sticking device 31B. Then, the TAB parts 5 are alternately delivered, and the adhesive tape 33 is stuck to the terminal portions 5a of the two TAB parts 5 alternately by the one sticking device 31A and the other sticking device 31B.

  In this way, when the adhesive tape 33 is attached to the terminal portion 5a of the TAB component 5, and the quality of the attached state of the adhesive tape 33 is determined, the two attachment holders 48a, 48a of each group and 48b and 48b are driven in the -Y direction to a position deviated from the horizontally running portion of the release tape 32 as indicated by a chain line in FIG. This position is indicated by Y3 in FIG.

  When the two sticking holders 48a, 48a and 48b, 48b of each set are positioned at the position indicated by Y3, a pair of two fourth sets for receiving the TAB component 5 from each sticking device 31A, 31B. The bodies 57a, 57a and 57b, 57b enter below and are positioned so as to face the sticking holding bodies 48a, 48a and 48b, 48b.

  The two sets of fourth transfer bodies 57a, 57a and 57b, 57b are driven in the X, Y, Z, and θ directions by a third XYZθ drive source 58 shown in FIG.

  The two sets of the fourth delivery bodies 57a, 57a and 57b, 57b are positioned at positions facing the lower sides of the sticking holding bodies 48a, 48a and 48b, 48b, and then upward in the Z direction as indicated by arrows. Driven and receives the TAB parts 5 held on the attachment holders 48a, 48a and 48b, 48b on the upper surface thereof.

  At this time, since the adhesive tape 33 is adhered to the terminal portion 5a on the lower surface of the TAB component 5, the adhesive tape 33 does not adhere to the upper surfaces of the fourth delivery bodies 57a, 57a and 57b, 57b. A concave stepped portion 57c is formed at one end of the upper surface.

  As shown by the arrows in FIG. 1, the two fourth delivery bodies 57 a and 57 a that have received the TAB component 5 from the two sticking holding bodies 48 a and 48 a of one sticking device 31 </ b> A move in the −Y direction. The terminal portions 5a of the TAB parts 5 that are rotated 90 degrees in opposite directions and held on the upper surface are positioned in the -Y direction.

  Similarly, the two fourth delivery bodies 57b and 57b that have received the TAB component 5 from the two sticking holding bodies 48b and 48b of the other sticking device 31B move in the -Y direction, while the arrows in FIG. As shown in FIG. 5, the terminal portions 5a of the TAB parts 5 that are rotated 90 degrees in opposite directions and held on the upper surface are positioned in the -Y direction.

  As shown in FIGS. 1 and 2, two sets of fourth transfer bodies 57a and 57a in each of the two sticking devices 31A and 31B are located on the −Y direction side of the two sticking devices 31A and 31B. The two mounting heads 61a, 61a and 61b, 61b, which receive the TAB component 5 from 57b and 57b and are simultaneously mounted on the side part of the substrate W, are opposed to the side part of the substrate W. At the position, it waits in a row and alternately along the X direction. The fourth transfer bodies 57a, 57a and 57b, 57b are shown in duplicate in FIGS.

  As shown in FIGS. 12 and 13, each mounting head 61a, 61a and 61b, 61b has an L-shaped side surface, and a lower end of one end thereof is formed on the suction surface 62, and a fourth XYZθ drive source. 63 is driven in the X, Y, Z and θ directions.

  The substrate W is supplied and placed on the upper surface of the X table 64 having a smaller area than the substrate W. The substrate W protrudes outward from the periphery of the upper surface of the X table 64 and is provided so as to be movable along a pair of X rails 65 arranged in parallel along the X direction. The X table 64 is driven so as to be positioned in the X direction by an X drive source 66 shown in FIG.

  A terminal of the TAB component 5 which is received by the TAB component 5 from the two attachment holders 48a and 48a of the one attachment device 31A and rotated 90 degrees in opposite directions as shown by the arrows in FIG. The two fourth transfer bodies 57a and 57a having the portion 5a positioned in the -Y direction move in the X and Y directions as shown by arrows b1 and b2 in FIG. 2, and one pair as shown in FIG. The two mounting heads 61a and 61a are moved downward.

  Next, the two fourth transfer bodies 57a and 57a are driven upward in the Z direction as indicated by arrows in FIG. 12, and the upper surface of the portion corresponding to the terminal portion 5a of the TAB component 5 held on the upper surface is one set. The two mounting heads 61a and 61a are held by suction.

  Here, the mounting heads 61a and 61a that have attracted the TAB component 5 discard the TAB component 5 in a disposal box (not shown) when the adhesive tape 33 attached to the TAB component 5 is turned over. Only the TAB component 5 in which the adhesive tape 33 is not turned is performed.

  The two mounting heads 61a and 61a that suck and hold the TAB component 5 are driven in the −Y direction as indicated by arrows c1 and c2 in FIG. 2 and move above the side portion of the substrate W, as shown in FIG. After positioning the TAB component 5 on the side of the substrate W as described above, the TAB component 5 is lowered and mounted on the upper surface of the side of the substrate W as indicated by the arrow. That is, two TAB components 5 are simultaneously mounted on the side portion of the substrate W by the two mounting heads 61a and 61a.

  At this time, the lower surface of the side portion of the substrate W is supported by a backup tool (not shown). Further, the positioning of the TAB component 5 with respect to the side portion of the substrate W is performed by simultaneously imaging the alignment marks provided on the substrate W and the TAB component 5 from below the side portion of the substrate W by an imaging camera (not shown). This is performed based on imaging.

  As another means, the substrate W is placed on the X table 64 so that the position where the TAB component 5 on the side portion of the substrate W is mounted coincides with the standby position in the X direction of the two mounting heads 61a and 61a. Position by.

  If the two mounting heads 61a and 61a receive the TAB component 5 from the fourth delivery bodies 57a and 57a, respectively, the two mounting heads 61a and 61a are driven by a preset distance in the −Y direction. You may make it mount by descending from.

  In this way, when the TAB component 5 is delivered from the two fourth delivery bodies 57a, 57a of one set to the two mounting heads 61a, 61a of one set and mounted on the substrate W, the other set As shown by arrows d1 and d2 in FIG. 2, the two fourth delivery bodies 57b and 57b move in the X and Y directions and deliver the TAB component 5 to the other two mounting heads 61b and 61b.

  The other two mounting heads 61b and 61b that have received the TAB component 5 are driven in the -Y direction and positioned above the side portion of the substrate W as indicated by arrows e1 and e2 in FIG. Driven in the downward direction. Thereby, the two TAB components 5 are simultaneously mounted on the upper surface of the side portion of the substrate W by the two mounting heads 61b and 61b, and the two TABs previously mounted by the two mounting heads 61a and 61a of one set. The component 5 is mounted at an alternate position.

  When the four TAB components 5 are mounted on the side portions of the substrate W by the four mounting heads 61a, 61a and 61b, 61b, the substrate W is moved by the X table 64 by the arrow in FIG. Next, the substrate W is positioned with respect to the X direction so that the side portion of the substrate W on which the TAB component 5 is mounted corresponds to the two mounting heads 61a, 61a and 61b, 61b. .

  After the substrate W is positioned, the TAB component 5 is repeatedly mounted on the side portion of the substrate W by the two sets of mounting heads 61a, 61a and 61b, 61b as described above.

  The first to fourth XYZθ drive sources 7, 28, 58, 63, the first and second rotary drive sources 13, 21, the first to third Z drive sources 16, 38, 55, the first. The second horizontal drive source 44, 46, 46, the Y drive source 49, and the X drive source 66 are connected to the control device 53 as shown in FIG. 14, and are driven based on the sequence set for the control device 53. Is to be controlled.

  According to the mounting device having the above-described configuration, a pair of TAB parts 5 punched by one punching device 2 are arranged side by side so as to be paired by two index tables 11 by two first transfer bodies 8a and 8b. At the same time, it is transferred to the holding head 12, and at the cleaning position C, the terminal portions 5 a of the two TAB components 5 are collectively cleaned by one cleaning brush 19.

  Therefore, the cleaning of the terminal portion 5 a by the cleaning brush 19 can be performed more efficiently than when the cleaning is performed for each TAB component 5.

  Moreover, since the terminal portions 5a of the two TAB parts 5 can be collectively cleaned by one cleaning brush 19, two index tables 11 are provided to obtain the same cleaning efficiency, and one TAB is provided for each index table 11. As compared with the case where the terminal portion 5a of the component 5 is cleaned, the configuration can be simplified and downsized.

  After the two TAB parts 5 cleaned at the cleaning position C of the index table 11 are delivered to the two second delivery bodies 27a and 27b, one set of the sticking device 31A and the other set of sticking The adhesive tape 33 was simultaneously affixed to the terminal portions 5a of the two TAB parts 5 by alternately passing the paired attachment holders 48a, 48a and 48b, 48b of the device 31B.

  Although the operation of adhering the adhesive tape 33 to the terminal portion 5a of the TAB component 5 takes longer than the operation of cleaning the terminal portion 5a with the cleaning brush 19, the above-described adhering operation is performed in two sets of the adhering devices 31A. , 31B, and the adhesive devices 33A and 31B of each group can attach the adhesive tape 33 to the two TAB components 5 at the same time, so that the operation of attaching the adhesive tape 33 to the terminal portion 5a of the TAB component 5 is efficient. Can be done well.

  Each pair of sticking devices 31A, 31B sticks the adhesive tape 33 to the two TAB parts 5 held by the two sticking holding bodies 48a, 48a and 48b, 48b simultaneously by one pressure tool 54. Can be worn.

  Therefore, the number of the pressure tools 54 can be halved as compared with the case where the adhesive tape 33 is attached to the terminal portion 5a of one TAB component 5 by one pressure tool 54, which also simplifies the configuration. , Miniaturization, and efficiency can be improved.

  When sticking the adhesive tape 33 to the two TAB components 5, the tip portions of the terminal portions 5a of the two TAB components 5 are simultaneously imaged by one imaging camera 51, and the two TAB components 5 are based on the imaging. Each of the two holding holders 48a, 48a and 48b, 48b holding the sack was positioned at the sticking position.

  That is, since the two TAB parts 5 can be simultaneously imaged by the single imaging camera 51, the configuration can be simplified, the size can be reduced, and the efficiency can be improved.

  Further, after sticking the adhesive tape 33 to the TAB component 5, the front end portion and the rear end portion of the two TAB components 5 are sequentially positioned at the imaging position Y 1 of the one imaging camera 51, and the terminals of the two TAB components 5 It was determined at the same time whether the both end portions of the adhesive tape 33 adhered to the part 5a were in good condition, that is, whether there was any blistering. Therefore, it is possible to simplify the configuration, reduce the size, and improve the efficiency.

  The TAB parts 5 to which the adhesive tape 33 is adhered by the two sets of the sticking devices 31A and 31B were delivered to the two pairs of fourth delivery bodies 57a, 57a and 57b, 57b, each of which forms a pair. Thereafter, these four transfer bodies 57a, 57a and 57b, 57b are alternately transferred to two sets of mounting heads 61a, 61a and 61b, 61b, and each of the two sets of mounting heads 61a. , 61a and 61b, 61b, two TAB parts 5 are mounted on the side of the substrate W at the same time and alternately two by two.

  Therefore, since the TAB components 5 punched one by one by one punching device 2 are finally mounted by the four mounting heads 61a, 61a and 61b, 61b, the TAB component 5 is punched from the carrier tape 4. In comparison, it is possible to perform a mounting operation which takes a long time without reducing the punching speed of the TAB component 5 by the punching device 2.

  That is, according to the mounting apparatus having the above-described configuration, the TAB component 5 can be mounted on the substrate W without reducing the punching speed of the TAB component 5 by the punching device 2, so that productivity can be greatly improved. it can.

  In addition, two TAB parts 5 punched by the punching device 2 are transferred to the index table 11, the respective sticking devices 31A, 31B, and the four mounting heads 61a, 61a, 61b, 61b. 5 can be performed simultaneously two by two, such as cleaning performed on 5, adhesion of the adhesive tape 33, inspection of the adhesion state of the adhered adhesive tape 33, and mounting of the TAB component 5 on the substrate W. Therefore, productivity can be improved also by that.

  In the above-described embodiment, two TAB parts punched by the punching device are sent to each process as a pair until they are mounted on the substrate. However, the two TAB parts may not necessarily be sent as a pair. For example, it may be sent one by one, or two and one may be sent alternately.

  By doing in this way, even when the total number of TAB components to be mounted on the substrate is an odd number or when the TAB components that have been turned over by the adhesive tape attached by the attaching device are discarded Several TAB components can be mounted on the substrate.

  Moreover, although the case where two TAB parts are paired has been described, there may be a case where there is one TAB part. For example, the punching speed of the TAB component in the punching device is faster than the operation of cleaning the terminal portion of the TAB component or the operation of attaching the adhesive tape to the terminal portion. Even if TAB parts are sent one by one, the time required to mount a predetermined number of TAB parts on the substrate can be shortened.

  DESCRIPTION OF SYMBOLS 1 ... Apparatus main body, 2 ... Punching device, 4 ... Carrier tape (tape-shaped member), 5 ... TAB components (electronic component), 8a, 8b ... 1st delivery body, 11 ... Index table, 12 ... Holding head, 15 ... cleaning device (cleaning means), 19 ... cleaning brush, 27a, 27b ... second delivery body, 31A, 31B ... sticking device, 32 ... release tape, 33 ... adhesive tape, 48a, 48b ... sticking holder (Third transfer body), 51 ... imaging camera, 53 ... control device, 54 ... pressurizing tool, 57a, 57b ... fourth transfer body, 61a, 61b ... mounting head.

Claims (6)

A mounting device for mounting an electronic component having a terminal portion on a lower surface to a substrate with an adhesive tape,
A punching device for punching the electronic component from the tape-shaped member;
Two first delivery bodies for receiving and transporting the electronic component punched by the punching device;
An index table in which a plurality of pairs of holding heads that form a pair are provided at predetermined intervals in the circumferential direction, and two electronic components received by the two first transfer bodies are transferred to the two holding heads of each set; ,
Cleaning means for simultaneously cleaning the terminal portions on the lower surface of the electronic component held by the two holding heads of each set of the index table;
Two second delivery bodies that receive the electronic components from each set of two holding heads cleaned by the cleaning means and change the orientation of the two electronic components so that the terminal portions of the electronic components face each other;
The electronic component is received from the two second transfer bodies while holding the upper surface with the terminal portions facing each other, and can be driven to travel along a predetermined direction with the terminal portions of the electronic component facing each other. Two sets of third delivery bodies that are paired with two provided;
The adhesive tape divided into a length corresponding to the electronic component is attached to the upper surface, and has a release tape that is paired with two so as to be able to run in parallel with each other in the predetermined direction. One pressing tool provided so as to straddle the two release tapes that form a pair when the two electronic components are positioned by the two third transfer bodies in the middle of the predetermined direction Two sets of adhering devices for pressure adhering the adhesive tape on the upper surfaces of the two release tapes to the terminal portions of the two electronic components;
Two pairs of fourth delivery bodies that form a pair of two each receiving two electronic components each having an adhesive tape attached thereto by each attaching device;
Four mounting heads that hold and receive the upper surface of the electronic component having the adhesive tape attached to the lower surface from the two fourth transfer bodies of each set, and mount them two at a time on the upper surface of the side portion of the substrate; An electronic component mounting apparatus comprising: The electronic components received by the two first delivery means from the punching device are delivered to the two holding heads in each group with the terminal portions provided on the lower surface directed outward in the radial direction of the index table. And
2. The electronic component mounting apparatus according to claim 1, wherein the cleaning means is a rotating brush having a length capable of simultaneously cleaning the terminal portions of two adjacent electronic components. In the middle of the direction of travel of the release tape of each sticking device, one image pickup means for picking up images of the terminal portions on the lower surfaces of the two electronic components whose upper surfaces are held by the two third transfer bodies; ,
2. A control means for relatively positioning the two third delivery bodies and the adhesive tape based on the position of the terminal portion obtained by imaging by the imaging means. The electronic component mounting apparatus described. The imaging means images the front end and the rear end of the adhesive tape attached to the terminal portion of the electronic component,
4. The electronic component mounting apparatus according to claim 3, wherein the control means discriminates states of a front end portion and a rear end portion of the adhesive tape based on an image picked up by the image pickup means.   The two fourth transfer bodies of each set simultaneously receive two electronic components having the adhesive tape attached thereto from the two third transfer bodies, and then simultaneously transfer them to two of the four mounting heads. 2. The electronic component mounting apparatus according to claim 1, wherein the two mounting heads receiving the electronic component simultaneously mount the electronic component on the substrate. A mounting method for mounting an electronic component having a terminal portion on a lower surface to a substrate with an adhesive tape,
A step of punching the electronic component from the tape-shaped member;
Receiving the punched electronic component and transporting it with two first delivery bodies;
A process of delivering two electronic components received by the two first delivery bodies to a plurality of pairs of holding heads that are paired by two provided at predetermined intervals in the circumferential direction of the index table;
Simultaneously cleaning the terminal portions on the lower surface of the electronic component held by the two holding heads of each set of the index table;
Receiving the electronic components from the two holding heads of each cleaned set by two second transfer bodies and changing the orientation of the two electronic components so that the terminal portions of these electronic components face each other;
A state in which the terminal parts of these electronic components are opposed to each other from the two second delivery bodies by two pairs of third delivery bodies that are paired with each other so as to be able to travel and drive along a predetermined direction. In the process of holding the upper surface and receiving alternately,
Two sets of mold release tapes that are paired with two adhesive tapes that are attached to the upper surface of the adhesive tape and cut in a length corresponding to the electronic component, and that can run parallel to each other along the predetermined direction. And when the two electronic components are positioned by the two third transfer bodies in the middle of the predetermined direction, the two electronic parts are provided to face each other across the two release tapes. Pressing the adhesive tape on the upper surfaces of the two release tapes onto the terminal portions of the two electronic components with a pressure tool; and
Receiving two electronic parts each having two adhesive parts affixed by two pairs of fourth transfer bodies,
The two sides of the substrate receive and hold the upper surface of the electronic component having the adhesive tape adhered to the lower surface alternately from the two fourth transfer bodies of each set by two of the four mounting heads. And a mounting method on the upper surface of the electronic component.

Images