TWI602762B - The disc assembly and the apparatus that carries the disc assembly extract the components from the disc assembly Act and device - Google Patents

Description

Device for disc assembly and transfer tray assembly, side for extracting components from disc assembly Method and device

The present invention relates to a disk assembly and a device for transporting a disk assembly, a method and a device for extracting components from a disk assembly, and more particularly to a disk assembly for carrying an element to be processed in an electronic component of a flexible substrate and a carrier bonding process. And a device for transporting the disk assembly, and a method and device for extracting components from the disk assembly.

According to the general variety of electronic components, it is often necessary to combine two or more electronic components, such as a flexible substrate (FlexFble substrate, also referred to as a flexible printed circuit board FPC), with a carrier. A method of bonding an electronic component of a flexible substrate to a carrier, and the method used in the prior art includes a method of pressing by a heat source and a method of bonding with a glue, and the method of bonding with the adhesive is For example, in the prior art, the flexible substrate is manually applied one by one to cover the carrier to be attached one by one, and then flattened after bonding to determine the adhesive positioning.

This prior art is only applicable to a small number of bonding industries. In addition to consuming a large amount of human resources for a large number of flexible substrates, it also poses doubts about the quality of the bonding, and because of the popularity of smart phones, the amount is large. The light, short, and powerful properties make the area of the flexible substrate smaller, and the electronic circuit layout on the 3D circuit is no longer just a simple 2D circuit layout, so the positional accuracy of the carrier is required. Higher, the improvement of production efficiency and the stability of product quality are becoming more and more demanding. In addition, the labor cost is rising day by day, and it is no longer possible to manually carry out the cooperation. In order to solve the problem of adhesively bonding the flexible substrate in an automated way Carrier demand, flexibility During the process of the substrate being extracted and transferred to the carrier carrying the carrier in a loaded carrier, the flexible substrate is viscous on one side for bonding, which makes it difficult to directly extract, and How the flexible substrate can be positioned in the carrier, and how the carrier can be used for picking, attaching and aligning the flexible substrate on the carrier via the carrier when extracting and attaching It is necessary to propose an effective solution to how to carry the flexible substrate.

Accordingly, it is an object of the present invention to provide a disk assembly that facilitates efficient loading and transport of components to be processed.

Another object of the present invention is to provide an apparatus for transporting a disc assembly that facilitates processing and extraction of components to be processed in a disc assembly.

It is still another object of the present invention to provide a method of extracting an element from a disk assembly that is easy to extract an element to be processed from a disk assembly.

It is still another object of the present invention to provide an apparatus for performing a method of extracting components from a disc assembly as described.

A disk assembly according to the present invention includes a first carrier disk and a first cover disk, the first cover disk being coated on the first carrier disk; the disk assembly providing a plurality of first components to be processed a matrix arrangement is disposed therein; the first carrier is provided with a plurality of hollow working sections, the first component corresponding to the upper part of the working section; the first cover disk is provided with a plurality of hollow sections, the hollow section The operation interval corresponding to the lower first component is separated.

According to another aspect of the present invention, a device for transporting a disk assembly for transporting a disk assembly including a first carrier disk and a first cover disk, the first cover disk being disposed on the first carrier disk; A first component to be processed is placed in a plurality of matrix arrangements; the disk assembly is transported by a first carrier of a transport mechanism, the first carrier being parallel to a first transport slide with a long side By the arrangement, the long side of the other side is unsupported to suspend the first carrier below.

A method for extracting an element from a disk assembly according to still another aspect of the present invention, for extracting a first component from the disk assembly; and attaching the first component to a bonding portion having an adhesive a release film on the disc assembly; extracting the first element from the upper surface of the bonding portion of the first component to be extracted, adsorbing the lower surface of the release film with a negative pressure, so that the release film is formed with the first component The fitting portion is reversely displaced and the first member is extracted.

An apparatus for extracting components from a disk assembly according to still another object of the present invention comprises: means for performing a method of extracting components from the disk assembly.

The apparatus for disc assembly and the transport tray assembly of the embodiment of the present invention, and the method and apparatus for extracting components from the disc assembly, wherein the disc assembly includes a first carrier and a first cover, the first cover is coated on the first The disk assembly is provided with a first component to be processed in a plurality of matrix arrangements, so that the disk assembly can efficiently carry and transport the component to be processed; and the disk assembly is subjected to a transport mechanism. a first carrier is transported, the first carrier is disposed with a long side parallel to a first transporting slide rail, and the long side of the other side is unsupported to suspend the first carrier. The component to be processed in the disk assembly is easily processed and extracted; and, because the first component of the flexible substrate is on the first carrier of the first transfer flow path, the release film of the first disk assembly For the extraction, the first component is adhered to a release film disposed in the disk assembly with the adhesive portion having the adhesive; the upper surface of the bonding portion of the first component to be extracted Extracting the first component, adsorbing the lower surface of the film under negative pressure, leaving The film is reversely displaced relative to the bonding portion of the first member, and the first member is extracted; the negative pressure adsorbs the release film other than the bonding portion of the first component being extracted, and is positive pressure The gas is sprayed through the corresponding through hole on the release film to the bonding portion of the first component, so that the bonding portion is detached from the release film and extracted; therefore, even if the flexible substrate is extremely fine, the flexible substrate and the other are The bonding between the carriers can also be carried out efficiently and accurately by automation.

A‧‧‧ first component

A1‧‧‧Fitting parts

A2‧‧‧ non-adhesive parts

A3‧‧‧Folding film

A31‧‧‧Positioning holes

A32‧‧‧through hole

A4‧‧‧first carrier

A41‧‧‧ pivot

A42‧‧‧Workspace

A421‧‧‧Working area

A422‧‧‧ ribs

A423‧‧‧Magnetic parts

A43‧‧‧ buckle

A5‧‧‧First cover

A51‧‧‧ positioning pocket

A52‧‧‧ Short-term interval

A521‧‧‧ ribs

A522‧‧‧Operation interval

A523‧‧‧Disconnection

AA‧‧‧ first disk assembly

B‧‧‧Second component

B1‧‧‧second carrier

B11‧‧‧Workspace

B12‧‧‧Operation hole

B121‧‧‧ Positioning Department

B13‧‧‧ buckle

B14‧‧‧ pivot

B15‧‧‧Magnetic parts

B2‧‧‧Second cover

B21‧‧‧ positioning pocket

B22‧‧‧Sketch interval

B221‧‧‧ ribs

B222‧‧‧ rib section

BB‧‧‧second disk assembly

C‧‧‧ machine

C1‧‧‧ machine table

C2‧‧‧ working area

C3‧‧‧ side seat

D‧‧‧Transportation agency

D1‧‧‧First rail seat

D11‧‧‧First conveyor rail

D111‧‧‧ slide

D12‧‧‧ first carrier

D121‧‧‧Base

D1211‧‧‧First transition interval

D1212‧‧‧ long side

D122‧‧‧Seat

D1221‧‧‧Second transition interval

D1222‧‧‧Interval

D1223‧‧‧Set space

D1224‧‧ Locating pin

D1225‧‧‧ seat

D1226‧‧‧ nesting

D1227‧‧‧ hole

D123‧‧‧ Clip mechanism

D1231‧‧‧ clip assembly

D12311‧‧‧ Arm

D12312‧‧‧ clip arm

D12313‧‧ Inlay

D12314‧‧ Inlay

D12315‧‧‧Long slot

D12316‧‧‧Fixed parts

D12317‧‧‧ Fixed seat

D12318‧‧‧ drive parts

D12319‧‧‧ drive parts

D12320‧‧‧ drive rod

D2‧‧‧Second rail seat

D21‧‧‧Second transport rail

D22‧‧‧Second carrier

D221‧‧‧Base

D2211‧‧‧First transition interval

D222‧‧‧Seat

D2221‧‧‧Second transition interval

D2222‧‧‧ nesting

D2223‧‧‧ hole

E‧‧‧First Auxiliary Agency

E1‧‧‧ pedestal

E2‧‧‧ seat

E21‧‧‧rails

E3‧‧‧ stage

E31‧‧‧rails

E4‧‧‧ drive parts

E5‧‧‧Resident

E51‧‧‧ linkages

E52‧‧‧ air pressure seat

E53‧‧‧ stomata

E54‧‧‧Support

E55‧‧‧ gas zone

E56‧‧‧ contour edge

F‧‧‧Second auxiliary institution

F1‧‧‧ pedestal

F2‧‧‧ seat

F21‧‧‧rails

F3‧‧‧ stage

F31‧‧‧rails

F4‧‧‧ drive parts

F41‧‧‧ screw

F5‧‧‧Resident

F51‧‧‧ linkages

F52‧‧‧ air pressure seat

F53‧‧‧ nozzle

G‧‧‧Transportation agency

G1‧‧‧Loading rail seat

G11‧‧‧Transfer track

G12‧‧‧ Transfer seat

G121‧‧‧ fixed seat

G122‧‧‧ drive parts

G123‧‧‧rails

G124‧‧‧ slide

G125‧‧‧ Fixing frame

G2‧‧‧ affixing agency

G21‧‧‧Touch components

G211‧‧‧ Ontology

G212‧‧‧Resistance shaft

G213‧‧‧ Connections

G214‧‧‧Pressure mould

G2141‧‧‧ adsorption seat

G2142‧‧‧Resist

G2143‧‧‧Adsorption surface

G2144‧‧‧ Cavitation

G2145‧‧‧ rib

G2146‧‧‧ stomata

G2147‧‧‧Contact surface

G215‧‧‧temperature control components

G22‧‧‧ bearing seat

G221‧‧‧rails

G222‧‧‧ frame

G223‧‧‧上固定座

G224‧‧‧ lower seat

G23‧‧‧Rotating components

G231‧‧‧ axle wheel

G232‧‧‧ drive parts

G233‧‧‧Leather belt

G24‧‧‧ Pressure measuring components

G241‧‧‧Load weight measuring component

G25‧‧‧Adjustment components

G251‧‧‧ mask frame

G252‧‧‧ fine tuning components

G3‧‧‧ tape mechanism

G31‧‧‧Reel pulley

G311‧‧‧ drive parts

G32‧‧‧ reel round

G321‧‧‧ drive parts

G33‧‧‧ tape detection component

G34‧‧‧ Tape

G35‧‧‧Transport wheel set

G351‧‧‧ Idler

G4‧‧‧First inspection unit

G5‧‧‧Compression mechanism

G51‧‧‧First drive assembly

G511‧‧‧ fixed seat

G512‧‧‧ track

G513‧‧‧ slide

G514‧‧‧First drive

G52‧‧‧Second drive assembly

G521‧‧‧ fixed seat

G522‧‧‧ Track

G523‧‧‧ seat

G524‧‧‧Second slide

G525‧‧‧压座

G526‧‧‧压模模

G527‧‧‧second drive

H‧‧‧Second inspection unit

FIG. 1 is a perspective exploded view showing the first and second component bonding relationships in the embodiment of the present invention.

2 is a perspective exploded view of the first disk assembly in the embodiment of the present invention.

3 is a perspective exploded view of a second disk assembly in an embodiment of the present invention.

4 is a perspective view showing the configuration of each mechanism in the embodiment of the present invention.

Figure 5 is a left side view of the X-axis of Figure 4 in an embodiment of the present invention.

FIG. 6 is a perspective exploded view of the first carrier in the embodiment of the present invention.

FIG. 7 is a perspective exploded view showing the correspondence relationship between the first carrier, the first disk assembly, and the first auxiliary mechanism in the embodiment of the present invention.

Figure 8 is a perspective view of the first auxiliary mechanism in the embodiment of the present invention.

Figure 9 is a schematic view of the first auxiliary mechanism in the embodiment of the present invention.

FIG. 10 is a schematic view showing the distribution of each of the embedded holes in the insert seat below the seat of the first carrier in the embodiment of the present invention.

FIG. 11 is a schematic view showing the insertion hole of the first auxiliary mechanism in which the pin-shaped linking member is embedded in the lower seat of the first carrier, and the opening is provided downward.

Figure 12 is a schematic illustration of a second auxiliary mechanism in an embodiment of the present invention.

FIG. 13 is a perspective exploded view showing the correspondence relationship between the second carrier, the second disk assembly, and the second auxiliary mechanism in the embodiment of the present invention.

FIG. 14 is a schematic view showing the insertion hole of the second auxiliary mechanism in which the pin-shaped linking member is embedded in the lower seat of the second carrier and the opening is provided downward.

Figure 15 is a schematic view showing the arrangement of the respective holes in the insert below the seat of the second carrier in the embodiment of the present invention.

16 is a perspective exploded view showing the structural relationship between the bonding mechanism, the tape mechanism, and the first inspection unit in the embodiment of the present invention.

Figure 17 is a front elevational view showing the construction relationship of the bonding mechanism, the tape mechanism, and the first inspection unit in the embodiment of the present invention.

18 is a schematic view showing the structural relationship of the pressing film-fit tape corresponding to the first member of the bonding mechanism in the embodiment of the present invention.

Fig. 19 is a perspective view showing the structural relationship of the pressure-sensitive adhesive tape of the bonding mechanism in the embodiment of the present invention.

Figure 20 is a perspective exploded view of the pressing mechanism in the embodiment of the present invention.

FIG. 21 is a schematic view showing the shifting mechanism of the transfer mechanism shifting the bonding mechanism, the tape mechanism, and the first inspection unit to the upper portion of the first disk assembly according to the embodiment of the present invention.

Figure 22 is a partially enlarged cross-sectional view showing the pressure-sensitive film interlocking tape of the bonding mechanism corresponding to the upper portion of the first member on the release film in the embodiment of the present invention.

Figure 23 is a partially enlarged cross-sectional view showing the portion of the pressure-sensitive film interlocking tape of the bonding mechanism corresponding to the lower portion of the film in the embodiment of the present invention.

Figure 24 is a partially enlarged cross-sectional view showing the portion of the pressure-sensitive adhesive film of the bonding mechanism adhered to the first member from the release film in the embodiment of the present invention.

FIG. 25 is a schematic view showing the shifting mechanism of the transfer mechanism shifting the bonding mechanism, the tape mechanism, and the first inspection unit to the top of the second inspection unit according to the embodiment of the present invention.

Figure 26 is a partially enlarged cross-sectional view showing the portion of the pressure-sensitive adhesive film of the bonding mechanism adhered to the upper portion of the second inspection unit.

FIG. 27 is a schematic view showing the shifting mechanism of the transfer mechanism shifting the bonding mechanism, the tape mechanism, and the first inspection unit to the upper portion of the second disk assembly according to the embodiment of the present invention.

Figure 28 is a partially enlarged cross-sectional view showing the portion of the pressure-sensitive adhesive film of the bonding mechanism adhered to the first member above the second member in the embodiment of the present invention.

Figure 29 is a partially enlarged cross-sectional view showing the bonding of the pressure-sensitive adhesive film of the bonding mechanism to the second component in the embodiment of the present invention.

FIG. 30 is a partially enlarged cross-sectional view showing the pressure-sensitive film interlocking tape of the bonding mechanism being attached to the second component after the bonding film of the bonding mechanism adheres to the second component in the embodiment of the present invention.

31 is a schematic view showing the pressing operation of the pressing mechanism in the embodiment of the present invention, and the transfer seat of the transfer mechanism displaces the bonding mechanism, the tape mechanism, and the first inspection unit to the upper portion of the first disk assembly.

Referring to FIG. 1 , an embodiment of the present invention is directed to a bonding process in which a first component A formed of a flexible substrate is attached to a second component B as a carrier, and the first processing to be processed is taken as an example. The component A includes a bonding portion A1 under which the adhesive is applied and a non-bonding portion A2 not coated with the adhesive underneath.

Referring to FIG. 2, the first component A is adhered to a release film A3 on the lower side of the adhesive-attached portion A1 and arranged in a plurality of matrixes. The non-bonding portion A2 is not coated with adhesive underneath. And being separated from the release film A3; the viscosity of the adhesive and the smooth surface of the release film A1 are available for the first component A to be extracted from the release film A3; the peripheral surface of the release film A3 is provided with a positioning The hole A31, the release film A3 is placed on a rectangular first carrier A4, and the positioning hole A31 on the peripheral surface of the release film A3 is nested in the corresponding pivot pin A41 on the first carrier A4. Positioning is obtained, and a first cover disk A5 is further disposed on the release film A3; a working area A42 is disposed on the first carrier A4, and a plurality of hollow working sections A421 are formed on the working area A42 and juxtaposed in the X-axis direction. a rib A422 is disposed between the two working sections A421, and is supported by the rib A422 under the release film A3; the first element A arranged in a matrix on the release film A3 is arranged in a plurality of Y-axis and juxtaposed into one The group mode corresponds to the upper part of the working area A421, and the total wheel width of the film A3 is larger than the total area of each working area A421, and is covered. It is disposed on the working area A42; the first carrier A4 has two long sides and a short side outside the outer side respectively provided with a height higher than the working area A42 The surface of the first cover disk A5 is smaller than the total wheel width of the first carrier A4, and covers the working area A42 and covers the release film A3, the first cover The disk A5 is provided with a positioning pocket A51 corresponding to the pivot pin A41 of the first carrier A4, and a plurality of hollow sections A52 arranged in parallel with the X-axis formed by the respective working sections A421 are provided, and each hollow section A52 is provided. The operation section A522 corresponding to the number and position of the first component A on the lower release film A3 is partitioned by the partition rib A521, and each of the barrier ribs A521 is formed with a disconnection portion A523 for communicating the two operation sections A522; The upper surface of the working area A42 is provided with a plurality of magnetic members A423 respectively disposed on two outer sides of the working sections A421. The first cover disc A5 is made of metal, so the first cover disc A5 can be subjected to the magnetic The suction member A423 is adsorbed to closely cover the first carrier A4; the release film A3 to which the first component A is attached is positioned between the first carrier A4 and the first cover A5, and the whole is formed into a first A plate of components AA.

Referring to FIG. 3, the second component B is mounted on a rectangular second carrier B1 and arranged in a plurality of matrixes. The second carrier B1 is provided with a working area B11. A plurality of rectangular operation holes B12 arranged in a matrix are arranged on the B11, and a dimple positioning portion B121 is disposed at each end of the operation hole B12, and the second element B is disposed above the operation hole B12 and respectively has two ends Positioned on the positioning portion B121, the second elements that are juxtaposed in the same Y axial direction form the same group, and the second element B of the second carrier B1 is further covered with a second cover disk B2; the second cover disk The total wheel width of the B2 is smaller than the total wheel width of the second carrier B1 and is disposed on the working area B11; the second carrier B1 has a rectangular height and a working area respectively on the outer side and the outer side. The upper surface of the B11 is a low buckle edge B13; the second cover disk B2 is provided with a positioning pocket B21 corresponding to the pivot pin B14 of the second carrier B1, and a plurality of hollow spaces corresponding to the operation holes B12 are provided. B22, each of the hollow sections B22 is provided with a rib B221 and a rib section B222 protruding to the hollow section B22, which is correspondingly located on the second carrier B1 B over the second element of the filled carrier, and a second limiting element B from the operation hole B12 B121 ends of the positioning portion; a second station on the platen B1 The upper surface of the working area B11 is provided with a plurality of magnetic members B15 respectively disposed on the opposite outer sides of the arrangement areas of the operation holes B12, and the second cover disk B2 is made of a metal material, so that the second cover disk B2 can be subjected to the magnetic members. The first carrier A4 carrying the second component B is covered by the first cover disk A5, and the second disk assembly BB is integrally formed by the B15.

Referring to FIG. 4 and FIG. 5, the embodiment of the present invention can be illustrated by the apparatus shown in the figure, including: a machine C, which is recessed from the center of the machine table C1 to form a working section C2, so that the machine table C1 The two sides are higher and each form a side seat C3; a conveying mechanism D is disposed in the working section C2, and includes: a first rail seat D1 which is erected in the Z-axis direction and extends in parallel along the X-axis direction a second rail seat D2; wherein the first rail seat D1 is provided with an X-axis first transport rail D11 on a side in the machine C, and a first transport slide is arranged on the first transport rail D11. The rail D11 is vertical, and can be driven thereon to be disposed in a horizontal direction to perform a sliding displacement of the first carrier D12, the displacement path of which provides a first transport flow path for transporting the first disc assembly AA of FIG. 2; The first carrier D12 is approximately rectangular in shape, and is disposed in parallel with the first conveying rail D11 with a long side to provide stable transmission, and the long side of the other side is unsupported to make the first The carrier D12 is suspended below; the second rail D2 is disposed on one side of the machine C with an X-axis second transport rail D21, and the second The conveying rail D21 is provided with a second carrier D22 which is perpendicular to the second conveying rail D21 and can be driven thereon to be disposed in a horizontal direction for sliding displacement, and the displacement path thereof provides a second conveying flow path. The second disk assembly BB in FIG. 3 is transported; the second carrier D22 is approximately rectangular in shape, and is disposed in parallel with the second transport rail D21 with a long side to provide stable transmission, and the other The long side of the side is unsupported to suspend the second carrier D22 below; a first auxiliary mechanism E is disposed in the working section C2 in which the machine table C is recessed, and is between the first conveying rail D11 and the second conveying rail D21 of the conveying mechanism D, and is the first carrier D12. Below the first carrier D12 in the path of the sliding on the transport rail D11, a second auxiliary mechanism F is disposed in the working section C2 of the recess of the machine C, and the first conveying rail in the conveying mechanism D D11 and the second transport rail D21, and below the second carrier D22 in the path of the second carrier D22 sliding on the second transport rail D21; a transfer mechanism G, comprising: a transfer rail The seat G1 has two ends fixed on the side seats C3 of the machine table C, and is provided with a Y-axis transfer rail G11. The transfer rail G11 is provided with a transfer seat G12 and a transfer seat G12. The bonding mechanism G2, the tape mechanism G3 and the first inspection unit G4 are disposed, and the first carrier D12 and the second conveying rail D21 can be displaced on the first conveying rail D11 of the conveying mechanism D on the transfer rail G11. Between the second carrier D22; the first inspection unit G4 can be a CCD lens viewed from top to bottom; the transfer track G11 is located on the side of the second rail D2. The G5, the transfer seat G12 and the pressing mechanism G5 can be independently driven to be displaced on the transfer track G11; a second view unit H is disposed in the recess C of the machine C, and is in the Between the transport rail D11 and the second transport rail D21, and the mating mechanism G2 on the shifting seat G12 moves from the first carrier D12 on the first transport rail D11 to the second transport rail D21. In the path of the seat D22, it may be a CCD lens that is viewed from the bottom up; the first auxiliary mechanism E, the second auxiliary mechanism F, and the second inspection unit H are simultaneously loaded in the transfer mechanism G. G1 is below the straight-line transfer path guided by the transfer track G11, and is also below the path through which the bonding mechanism G2 can move, wherein the second view unit H, the first auxiliary mechanism E, and the second auxiliary mechanism F are The line on the transfer path is a line parallel to the transfer track G11.

Referring to FIGS. 5 and 6, the first carrier D12 and the second carrier D22 of the transport mechanism D have substantially the same structure, and are only opposite to each other when installed. The first carrier D12 is described as follows: the first carrier D12 includes a base D121 having a rectangular frame shape and having a rectangular moving hollow first D1011; and a long side D1212 of one side and a sliding seat D111 of the first conveying rail D11 are fixed and linked a seat D122 is disposed on the base D121 and has a rectangular frame shape, and a second movement interval D1221 is formed in the center, and the second movement interval D1221 is corresponding to the first movement interval D1211 of the base D121; a second spacer portion D1221 is respectively provided with a convex spacer portion D1222 on both sides of the Y-axis, and a second spacer portion D1221 between the two spacer portions D1222 forms a lower portion of the upper surface D1222 and is available for the first The disk assembly AA or the second disk assembly BB is placed in the disk space D1223, and the positioning space D1224 is disposed in the disk space D1223; the two sides of the long side of the seat D122 outside the spacer portion D1222 form a mutual a seat D1225 that is parallel and lower than the upper surface of the partition portion D1222; The second moving section D1221 below the seat D122 is provided with parallel strip-shaped inserts D1226 on both sides; a clip mechanism D123 is disposed on the seat D122 to be driven to expand or clamp, including two The clip assembly D1231 is respectively disposed at the two short sides of the X-axis at the front and rear ends of the seat D122, and is respectively disposed in a corresponding manner, each clip assembly D1231 includes an arm D12311, and respectively Each of the clamping arms D12312 pivotally disposed at the two ends of the arm D12311, the arm D12311 and the two clamping arms D12312 are respectively provided with inwardly facing inlays D12313 and D12314, and the front ends thereof respectively have upper and lower inner oblique tapers. The edge can be driven to be positioned by the first disk assembly AA or the second disk assembly BB above the driving device D122; the two clamping arms D12312 are respectively disposed between the inlay D12314 and the pivoting portion of the arm D12311 There is a long slotted hole D12315, and is pivoted at the long slot D12315 by the fixing member D12316. The two clamp arms D12312 are respectively disposed on the slot The distance between the two sides of the long side of the D122 is D1225, and the distance between the two inclined slots D12315 of the two clamp arms D12312 is the front narrow and the rear width; the arm D12311 and a fixing base D12317 fixed to the base D121 There is a slide rail D12318; a driving member D12319 disposed on the fixing base D12317 can pull or push the arm D12311 by a driving rod D12320; due to the two inclined slots on the two clamping arms D12312 The distance between the D12315 is narrow and the front is wide. Therefore, the driving rod D12320 of the driving member D12319 is pushed forward. Except that the two inlays D12313 on the two arms D12311 will be facing inward, the two arm clamps D12312 will also be pivoted by the fixing member D12316. The fulcrum is such that the front end two inlays D12314 are clamped. Otherwise, the driving rod D12320 of the driving member D12319 is pulled back, and the inlays D12313 on the two arms D12311 will be outwardly outward, and the front end two inlays D12314 of the two clamping arms D12312 will also be Outside Zhang.

Referring to Figures 2, 7-9, the first auxiliary mechanism E includes a pedestal E1, a pedestal E1 is provided with a stand E2, and a Z-axis slide rail E21 is arranged on the side of the stand E2, and the slide rail E21 is provided. There is an X-axis horizontal stage E3. The stage E3 is driven by a screw E41 driven by a driving member E4 to be lifted up and down in the Z-axis. The stage E3 is provided with an X-axis slide rail E31, and the slide rail E31. An abutment E5 and a pin-like linkage E51 coupled to the seat E4 and disposed on opposite sides of the seat E5 are provided. The abutment E5 can be driven up and extended through the base D121 of the first carrier D12. The first shifting interval D1211 and the second shifting interval D1221 of the rectangular cutout of the seating D122 are placed in the working section A421 of the first loading tray A4 of the first disk assembly AA on the first carrier D12, and are offset by The lower part of the release film A3 is close to the release film A3; the upper surface of the seat E5 is arranged in a Y-axis direction arranged in a matrix and juxtaposed as a group. The number of the first elements A is provided with the same number of air pressure seats E52, and each pressure seat E52 The plurality of air holes E53 arranged in the X-axis spacing are arranged, and the first component A corresponding to one of the release films A3 above each of the air pressure seats E52 has a glue. The joint portion A1, the position of the air hole E53 on the opposite air pressure seat E52 of the release film A3 also has a through hole A32; the second air pressure seat E52 is provided with a support portion E54, and a concave air zone is arranged between the air pressure seats E52. E55, A contoured edge E56 of the micro-convex is formed outside the gas zone E55; the gas holes E53 of the same gas pressure seat E52 can simultaneously discharge positive pressure gas or convert to provide negative pressure suction; please refer to FIGS. 10 and 11, the first auxiliary mechanism E is seated The pin-shaped linking member E51 on both sides of the E5 can be inserted into the opening of the long-shaped insert D1226 disposed on both sides of the second shifting section D1221 below the seat D122 of the first carrier D12 when the seat E5 is driven to rise. In the lower insertion hole D1227, when the first carrier D12 is X-axis displaced on the first conveying rail D11 on the first rail seat D1, the interlocking seat E5 is in the X-axis slide rail of the horizontal stage E3. Synchronous displacement is performed on the E31; the long-shaped insertion D1226 on both sides of the second movement section D1221 below the seating D122 is provided with a downwardly-facing insertion hole D1227, and the separation interval corresponds to the first carrier A4 on the first disk assembly AA. Each working section A421 is arranged with a hole D1227 symmetrically arranged on the left and right inserts D1226.

Referring to FIGS. 12-14, the second auxiliary mechanism F includes a pedestal F1. The pedestal F1 is provided with a stand F2, and a Z-axis slide rail F21 is disposed on the side of the stand F2, and an X is disposed on the slide rail F21. The axial horizontal stage F3 is provided with a driving member F4 under the loading table F3. The driving member F4 drives a screw F41 downward, and the reverse driving stage F3 can be raised and lowered in the Z-axis direction, and the loading table F3 is provided. The X-axis slide rail F31, the slide rail E31 is provided with an abutment F5 and a pin-like linkage F51 coupled with the abutment F5 and disposed on both sides of the abutment F5, the abutment F5 can be driven up by the driving member F4. a second transition section D2211 extending through the rectangular cutout of the base D221 of the second carrier D22 and a second transition section D2221 of the rectangular cutout of the seating D222, and passing through the second disk assembly BB placed on the second carrier D22 The hole B12 is operated on the second carrier B4, and is close to the second component B under the second component B; the upper surface of the seating F5 is arranged in a matrix of Y-axis spacing and juxtaposed as a group of the second component B. There are the same number of air pressure seats F52, each air pressure seat F52 is provided with two suction nozzles F53, and each of the air pressure seats F52 corresponds to a second component B; the air pressure seat F52 F53 vacuum suction nozzle may be provided.

Referring to FIGS. 14 and 15, the pin-shaped linking member F51 on both sides of the second auxiliary mechanism F on the seat F5 can be inserted into the second shifting section of the seat D222 of the second carrier D22 when the seat F5 is driven to rise. The long strip D2222 disposed at the lower side of the D2221 is provided with the opening downwardly facing the hole D2223, and the second carrier D22 is displaced by the X-axis when the second conveying rail D21 is displaced on the second rail seat D2. The interlocking seat F5 is synchronously displaced on the X-axis slide rail F31 of the horizontal stage F3; the long-shaped insert D2222 of the second shift section D2221 on the side of the seat D222 is opened downwardly. D2223, corresponding to the spacing between the second tray B4 of the second disk assembly BB and the Y-axis spacing arranged in a matrix, is arranged as a group of operation holes B12, and a hole is respectively arranged symmetrically on the left and right nests D2222. D2223 mode setting.

Referring to FIG. 4, FIG. 16~17, a resetting seat G121 is disposed on the transfer base G12 of the transfer mechanism G2. The first inspection unit G4 is disposed on one side of the fixing base G121, and a driving component is disposed on the other side. G122, the driving member G122 drives a sliding seat G124 on a Z-axis slide rail G123 on the fixing base G121 to be displaced in the Z-axis upward and downward; the sliding seat G124 is provided with a fixing frame G125, and the fixing frame G125 is disposed on the fixing frame G125. The bonding mechanism G2 and the tape mechanism G3 enable the driving mechanism G122 to drive the bonding mechanism G2 and the tape mechanism G3 on the fixing frame G125 to be vertically displaced in the Z-axis direction; the bonding mechanism G2 includes: a touch-pressure component G21, a body G211 is disposed on a Z-axis slide rail G221 of a carrier G22, and can be displaced in the Z-axis up and down on the slide rail G221, and the contact pressure component G21 is provided with a pressing shaft G212, and a coupling is made below The G213 can be connected to a pressing mold G214 which is replaced according to different product processing requirements; the body G211 can be provided with a heating element (not shown) according to different product processing requirements, and the temperature detecting element G215 is used for temperature detection. Measure and control; a rotating component G23, spaced apart in a frame G222 on the carrier G22 G223 and G224 holder between the fixing seat is provided with a toothed wheel G231 shaft, the shaft is a driven wheel member G231 G232 G233 coupled to the belt may be driven for rotation; a pressure measuring component G24 is provided with a load weight measuring component G241 and located between the rotating component G23 and the touch component G21. The pressure measuring component G24 is linked by the rotating component G23 to rotate the pressing axis G211 of the contact pressure component G21; The component G25 is disposed on the upper fixing base G223, and includes a cover frame G251 and a fine adjustment component G252 including an elastic component therein. The fine adjustment operation of the adjustment component G25 can be linked to the rotation component G23, and the pressure is measured. The component G24 enables the touch pressure component G21 to be finely adjusted up and down on the Z-axis slide rail G221 of the carrier G22; the carrier G22 is carried by the touch component G21, the rotating component G23, the pressure measuring component G24, and the adjustment The bonding mechanism G2 formed by arranging the components G25 in the same center axis and connected in series is disposed on the fixing frame G125. The tape mechanism G3 includes a tape roll and is driven by a fixing frame G125 rear side driving member G311. The reeling pulley G31 and the winding reel G32 for recovering the reel and being driven by the rear side driving member G321 of the fixing frame G125, wherein the reeling pulley G31 and the winding reel G32 are located in the fixing frame relative to the first inspection unit G4. G125 is attached to the other side of the mechanism G2, and The pulley G31 is located below the winding reel G32; a tape detecting component G33 is disposed on the winding pulley G31 side to detect whether the tape G34 on the winding reel G31 is used up; the winding reel G31 and the winding reel G32 are matched by a set The transmission wheel set G35 composed of a plurality of idler gears G351 forms a transport flow path of the adhesive tape G34, and the transport flow path surrounds the periphery of the bonding mechanism G2 with the adhesive G34 having the adhesive side facing outward, so that the bonding mechanism G2 is located The inside of the flow path is transported, and the tape G34 is wound around the pressing member G21 attached to the bonding mechanism G2 under the pressing mold G214.

Referring to FIGS. 18 and 19, the pressing mold G214 includes a suction seat G2141 and an abutting seat G2142 protruding downwardly from the bottom end of the adsorption seat G2141. The two sides of the suction seat G2141 are respectively provided with a slope-shaped adsorption surface. G2143, each surface of each adsorption surface G2143 is concavely provided with a plurality of air pockets G2144 which are arranged in a plane and communicate with each other, and between the two air pockets G2144 For the rib G2145, a plurality of ribs G2145 are collectively arranged in a plane shape; the adsorption surface G2143 is provided with a vent G2146 for providing a vacuum suction force in the air holes G2144; and the two inclined surface adsorption surfaces G2143 on both sides are tapered. The bottom surface of the abutting seat G2142 is inclined; The contact surface G2147 forms a long rectangular flat surface, and is provided with a recessed receiving section G2148 on the flat surface. The position of the receiving section G2147 and the depth of the recess are matched with the desired construction. The electronic circuit protuberance portion on the bonding portion A1 of the first component A of the flexible substrate; the tape G34 transmitted through the pressing mold G214 first passes through the idler G351 on the side of the pressing mold G214 against the outer side of the resisting mold G214 Then, the adsorption seat G2141 corresponds to the inclined surface adsorption surface G2143 of the side idler gear G351, and then passes through the bottom contact surface G2147 of the abutting seat G2142, and then passes through the inclined surface adsorption surface G2143 on the other side of the adsorption seat G2141, and then Opposite the idler gear G351 corresponding to the side adsorption surface G2143 The outer side of the stamper G214; the adhesive tape G34 which is attached to the bottom end of the abutting seat G2142 of the pressing mold G214, and has a surface of the adhesive facing downward corresponding to the adhesive portion A1 having the adhesive under the first component A. Upper surface.

Referring to FIG. 4 and FIG. 20, the pressing mechanism G5 includes a first driving component G51, and a fixing base G511. The fixing base G511 is provided with a Z-axis rail G512, and the rail G512 is provided with a first sliding seat G513. The first sliding seat G513 can be driven by the first driving member G514 of a motor to be displaced in the Z-axis direction on the rail G512. The second driving component G52 is provided with a fixing base G521 and the fixing base G521. The Z-axis rail G522 and a bearing G523 are disposed; the second rail G 524 is disposed on the rail G522, and the second sliding seat G524 is provided with a pressing seat G525 coupled thereto, and the lower end of the pressing seat G525 is biased. The pressing mold G526 composed of the material has a bottom wheel shape that can match the upper surface shape of the bonding portion A1 having the adhesive under the first component A; the pressing seat G525 can be subjected to a pressure on the bearing G523. The second driving member G527 of the cylinder acts as a gas pressure. When the second sliding seat G524 is displaced by the resistance on the rail G522, the air pressure of the second driving member G527 formed by the pneumatic cylinder forms a buffer for the upward displacement of the pressing mold G526.

Referring to FIGS. 4, 11, and 21 to 24, in the embodiment of the present invention, when performing the extraction of the flexible substrate, a one-position step is performed: the transfer carrier G12 (FIG. 4) of the transfer mechanism G is displaced to the first transfer flow path. The first viewing unit G4 is disposed above the first disk assembly A1 on the first carrier D12, so that the first viewing unit G4 corresponds to the first component A to be extracted on the release film A3 in the first disk assembly AA. Above the bonding part A1 (Fig. 21); at this time, the first auxiliary mechanism E is located just below the first disk assembly AA, and the pin-shaped linking member E51 that is raised to the two sides is embedded in the first carrier D12 The long-shaped insert D1226 disposed on both sides of the second shifting section D1221 below the seat D122 is provided with the opening D1227 facing downward, and the first carrier D12 is interlocked with the seating E5 (FIG. 11); a one-position detecting step: detecting, by the first viewing unit G4, the bonding portion A1 of the first component A to be extracted on the release film A3 of the first disk assembly AA from top to bottom to obtain the position information thereof Sampling the two fixed position on the bonding part A1 during the detection, since the first inspection unit G4 can only perform Y-axis displacement with the transfer seat G12 Therefore, after the first fixed-point detection sampling is completed, the first carrier D12 is driven to be coupled with the occupant E5 to perform X-axis displacement on the first rail seat D1 to obtain the second fixed-point position information; an extraction step, According to the position information obtained by the registration detecting step, the abutting seat G2142 protruding from the pressing mold G214 under the bonding mechanism G12 on the transfer seat G12 corresponds to the release film A3 in the first disk assembly AA. The bonding part A1 of the first component A to be extracted is above (FIG. 22); the bonding mechanism G2 is driven to move downward, and the side of the adhesive tape G34 having the adhesive is abutted against the adhesive G2142. Extracting the upper surface of the bonding part A1 of the first component A and adhering it (Fig. 23), and then driving the bonding mechanism G2 to move up slowly, and attaching the sticker of the first component A by the tape G34 In the joint portion A1, the first member A is gradually separated from the release film A3, and the extraction of the first member A is completed (FIG. 24); wherein the bonding mechanism G2 adheres to the bonding portion A1 of the first member A on the tape G34. The upward moving speed of the detachment extraction is slower than the original bonding mechanism G2 is driven to make the tape G34 resist the lowering speed of the bonding portion A1 of the first component A, so that the first component A is completed from the detaching film A3. And the detachment is sufficient; when the bonding portion A1 of the adhesive tape G34 adheres the first component A is to be extracted upward, the lower seat E5 of the first disk assembly AA is vented from the air pressure seat E52 corresponding to the bonding portion A1. E53 provides a positive pressure gas for blowing (Fig. 24), and the positive pressure gas is sprayed through the corresponding through hole A32 of the release film A3 to the bonding portion A1 of the first element A to help the bonding portion A1 and the tape G34. Adhered and detached from the release film A3; at the same time, the air pressure hole E52 other than the air pressure seat E52 under the bonding part A1 of the first component A which is being extracted is provided with a negative pressure a negative pressure is applied to each of the recessed gas zones E55, and the negative pressure is used to adsorb the first component A being extracted. The lower surface of the release film A3 other than the portion A1 is joined, so that when the extraction is performed, the release film A3 is reversely displaced relative to the bonding portion A1 of the first member A to assist the separation and avoid the release. The film A3 is adhered to the ridge by the upwardly moving tape G34; the first disk assembly AA is in the same working section A421, and the first component A is axially spaced and juxtaposed as a group, and the first auxiliary mechanism E is seated E5. It will be driven down to release the interlocking state with the first carrier D12, and then the first carrier D12 will be driven forward to correspondingly shift the next working section A421 of the first disk assembly AA to the seating of the first auxiliary mechanism E. Above the E5, the abutment E5 is driven to rise in conjunction with the first carrier D12, and the Y-axis in the working section A421 of the first corresponding disk assembly AA on the corresponding seat E5 is axially spaced and juxtaposed as a group. Element A continues to be extracted.

Referring to FIGS. 4, 14, and 25 to 30, when performing the bonding of the flexible substrate, the embodiment of the present invention performs: a second alignment detecting step: after the flexible substrate is extracted, the transfer base G12 (FIG. 4) of the transfer mechanism G is displaced between the first transport rail D11 and the second transport rail D21, and is transferred The fixing mechanism G2 of the seat G12 moves from the first carrier D12 on the first conveying rail D11 to the second inspection unit H in the path of the second carrier D22 on the second conveying rail D21 (Fig. 25), so that The CCD lens that is viewed from the bottom up is detected below the bonding portion A1 of the first component A adhered to the adhesive tape G34 under the abutting G2142 of the bonding mechanism G2 (FIG. 26) to obtain Position information under the bonding part A1; one-position step: after completing the second registration detecting step, shifting the transfer seat G12 (FIG. 4) of the transfer mechanism G to the second carrier D22 of the second rail D2 Above the two-disc assembly BB, the bonding portion A1 of the first component A adhered to the adhesive tape G34 under the abutting seat G2142 of the bonding mechanism G2 is corresponding to the preset position of the second component B (Fig. 27 28); at this time, the second auxiliary mechanism F is located just below the second disk assembly BB, and the pin F5 is raised to the pin-like linking member F51 on both sides. The long-shaped insert D2222 disposed at the lower side of the second shifting section D2221 of the seat D22 of the carrier D22 is provided with the opening D2223 with the opening facing downward, and the second carrier D22 is interlocked with the seating F5 ( Figure 14); a bonding step: the lowering of the bonding mechanism G2 under the abutment G2142 against the push tape G34 to the lower position of the bonding portion A1 of the first component A against the second component B (Fig. 29); After the fitting is completed, the abutting seat G2142 is driven along with the tape G34 to move up slowly below the original downward moving speed. At this time, the second auxiliary mechanism F located below the second disk assembly BB is seated on the air pressure seat F52 of the seat F5. The suction nozzle F53 provides a negative pressure suction force to cause the lower side of the second member B to be adsorbed, and when the adhesive tape G34 is disengaged from the adhesion position of the bonding portion A1 of the first member A, the second member B is reversely displaced relative to the adhesive tape G34. To assist the tape G34 to be separated from the bonding portion A1 of the first component A; a third alignment detecting step: the first viewing unit G4 is correspondingly located in the second disk component BB and has been attached to the second component B. The bonding portion A1 of the first component A is carried out from top to bottom. Detecting to obtain the position information; sampling the two fixed point positions on the bonding part A1 during the detection, after completing the first fixed point detection sampling, the second carrier D22 is driven to interlock with the seating F5 in the second rail seat D2 The X-axis is displaced back and forth to obtain the second fixed-point position information. For a pressing step, please refer to FIG. 4 and 27. According to the position information obtained by the third registration detecting step, the pressing mechanism G5 is correspondingly located. Above the two-disc assembly BB, at this time, the transfer seat G12 (FIG. 4) of the transfer mechanism G is displaced to the first disk assembly AA on the first carrier D12 of the first rail D1 for the next extraction; The first driving component G51 of the mechanism G5 is driven to be displaced in the Z-axis direction, and the pressing die G526 formed by the flexible material sandwiched between the lower end of the second driving component G52 and the lower end of the G525 is engaged. The upper surface of the bonding portion A1 of one element A is pressed so that the bonding portion A1 of the first element A and the second element B are sufficiently adhered, and when the pressing mold G526 receives the resistance, the pneumatic cylinder is formed. The second driving member G527 acts as a buffer to prevent the bonding of the first component A. A1 is excessively applied to cause damage; after the second element B of the second disk assembly BB is axially spaced and juxtaposed into the same group is finished, the abutment F5 of the second auxiliary mechanism F is driven to be moved downward to be released. In conjunction with the first carrier D12, then the second carrier D22 will be driven forward to displace the second disk assembly BB to the second component B of the next same group corresponding to the upper F5 of the second auxiliary mechanism F And the occupant F5 is driven to rise in conjunction with the second carrier D22, and the second component B, which is axially spaced apart from the second disk assembly BB currently on the corresponding seat F5 and arranged in the same group, is continuously executed. After the first component A and the second component B on the second disk assembly BB are completed, the second disk component BB is returned to the second delivery flow path of the second delivery slide D21.

The apparatus for disc assembly and the transport tray assembly of the embodiment of the present invention, and the method and apparatus for extracting components from the disc assembly, the first component A of the flexible substrate is transported by the first rail D1 of the first transport flow path The release film A3 of the first disk assembly AA on the carrier D12 is extracted, and is extracted by the bonding mechanism G2, and the adhesive tape G214 is adhered to the adhesive tape G24. Attached to the bonding portion A1 of the first component A, and at the time of extraction, the air hole E53 from the air pressure seat E52 corresponding to the bonding portion A1 can be passed through the first seat AA under the first disk assembly AA. The first and second transition sections D1211 and D1221 which are hollowed out in the base D121 and the seat D122 of the carrier D12 supply a positive pressure gas for blowing, so that the positive pressure gas passes through the corresponding through hole A32 of the release film A3 to the first component A. The bonding portion A1 is sprayed to help the bonding portion A1 adhere to the tape G34 and is extracted from the release film A3; and the bonding portion A1 of the first component A that should be being extracted is not the pressure seat E52. The air hole E53 on the other air pressure seat E52 provides a negative pressure, so that the negative pressure diffuses the concave gas area E55 to adsorb the lower surface of the film A3, so that when the extraction is performed, the release film A3 is formed with the first element A. The abutting position A1 is reversely displaced, which can assist the separation of the two parts and prevent the adhesive film A3 from being adhered and swelled by the adhesive tape G34; and the first component A is adhered to the G2 by the bonding mechanism G2. The adhesive tape G34 under the abutting seat G2142 is adhered and conveyed to the second rail seat D2 of the second transport flow path. On the second component B of the second carrier assembly BB on the second carrier D22, the bonding portion A1 of the first component A is attached to the second component B to be detached, and is applied to the second auxiliary mechanism F. The suction nozzle F53 of the air pressure seat F52 of the seat F5 provides a negative pressure suction force through the first and second transition sections D2211 and D221 which are hollowed out in the base D221 and the seat D222 of the second carrier D22, so that the second component B is adsorbed underneath. When the adhesive tape G34 is detached from the bonding position of the first component A, the second component B is reversely displaced relative to the adhesive tape G34 to assist the separation of the adhesive tape G34 from the bonding portion A1 of the first component A; And the first, second and third alignment detecting steps are matched with the first and second auxiliary mechanisms E, F, and the E5 and F5 can be interlocked with the first and second carriers D12 and D22, so that they can be used as two points in different positions. The sampling test is performed to obtain the precise alignment; and the pressing mold G526 formed of the flexible material interposed at the lower end of the pressing seat G525 in the pressing step presses the upper surface of the bonded portion A1 of the completed first component A. Abutting, the bonding portion A1 of the first component A and the second component B are fully adhered, so that even The flexible substrate is extremely fine, and the bonding between the flexible substrate and the other carrier can be performed efficiently and accurately.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

A‧‧‧ first component

A1‧‧‧Fitting parts

A3‧‧‧Folding film

A31‧‧‧Positioning holes

A4‧‧‧first carrier

A41‧‧‧ pivot

A42‧‧‧Workspace

A421‧‧‧Working area

A422‧‧‧ ribs

A423‧‧‧Magnetic parts

A43‧‧‧ buckle

A5‧‧‧First cover

A51‧‧‧ positioning pocket

A52‧‧‧ Short-term interval

A521‧‧‧ ribs

A522‧‧‧Operation interval

A523‧‧‧Disconnection

Claims (11)

A disc assembly includes a first carrier and a first cover, the first cover is disposed on the first carrier; the disk assembly is disposed in a plurality of matrixes for processing a first component to be processed Wherein, the first carrier is provided with a plurality of hollow working sections, and the first component is corresponding to the upper part of the working section; the first cover disk is provided with a plurality of hollow sections, and the hollow section is separated from the corresponding lower section. The operating interval of the first component. The disc assembly of claim 1, wherein the first carrier is provided with a working area, and the working area is formed with the plurality of hollow working sections juxtaposed in the X-axis direction, and between the two working sections Ribs. The disk assembly of claim 1, wherein the first cover disk is provided with the plurality of hollow sections juxtaposed in the X-axis direction, and the operation of the corresponding first component is separated by the rib zone in each hollow section Interval. The disk assembly of claim 3, wherein each of the barrier ribs respectively forms a disconnected portion to communicate the two operating intervals. The disk assembly of claim 1, wherein the first carrier is located on the upper surface of the working area, and the plurality of magnetic members are respectively disposed on two outer sides of the working sections, and the first cover plate is metal. The material can be adsorbed by the magnetic members. The disc assembly of claim 1, wherein the first member is adhered to a release film on a lower side of the adhesive portion having the adhesive. The disk assembly of claim 6, wherein the peripheral surface of the release film is provided with a positioning hole, and the release film is placed on the first carrier and is positioned on the peripheral surface of the release film. The positioning is obtained by nesting a corresponding pivot pin on the first carrier. A device for transporting a disk assembly for transporting a disk assembly including a first carrier disk and a first cover disk, the first cover disk being overlaid on the first carrier disk; the disk assembly being provided for a first to be processed The components are arranged in a plurality of matrix arrangements; the disk assembly is transported by a first carrier of a transport mechanism, the first carrier is disposed parallel to a first transport rail and disposed adjacent to the first transport rail, and the other The long side of the side is unsupported to suspend the first carrier below. A method for extracting an element from a disk assembly, wherein a first component is extracted from the disk assembly according to any one of claims 1 to 7; and the first component is adhered to a bonding portion having a glue Disposed on a release film in the disc assembly; extracting the first component from the upper surface of the bonding portion of the first component to be extracted, adsorbing the lower surface of the adhesive film under a negative pressure, so that the release film is The first element is extracted in a reverse relative displacement with the bonding portion of the first element. The method of extracting an element from a disk assembly according to claim 9, wherein the negative pressure adsorption is performed on a release film other than the bonding portion of the extracted first element, and the positive pressure gas is passed through the release film. The corresponding one through hole is blown to the bonding portion of the first element, and the bonding portion is detached from the release film and extracted. An apparatus for extracting an element from a disk assembly, comprising: means for performing the method of extracting an element from the disk assembly according to any one of claims 9 to 10.