TW201808756A - Tray assembly and device for transporting tray assembly, and method and device for picking components from tray assembly includes a tray assembly for placing a plurality of first components to be processed in a matrix arrangement - Google Patents

Abstract

The tray assembly and device for transporting tray assembly, and method and device for picking components from the tray assembly of the present invention comprises a tray assembly for placing a plurality of first components to be processed in a matrix arrangement, which includes a first carrier tray and a first cover tray, and the first cover tray is covered on the first carrier tray. The tray assembly is transported by a first carrier seat of a transporting mechanism. The first carrier seat has one long side mounted alongside and parallel to a first conveying sliding rail, and the other long side is unsupported to leave the first carrier suspended. The first element is adhered to a release film provided on the tray assembly with an adhesive portion having a glue. The first component is picked from the upper side of the adhesive portion of the first component, and the lower surface of the release film is sucked by negative pressure, so that the release film is moved oppositely to the first component and the first component is picked.

Description

Device for disc assembly and transfer tray assembly, method and device for extracting component from disc assembly

The present invention relates to a disk assembly and a device for transporting a disk assembly, a method and a device for extracting components from a disk assembly, and more particularly to a disk assembly for carrying an element to be processed in an electronic component of a flexible substrate and a carrier bonding process. And a device for transporting the disk assembly, and a method and device for extracting components from the disk assembly.

According to the general variety of electronic components, it is often necessary to combine two or more electronic components, such as a flexible substrate (FlexFble substrate, also referred to as a flexible printed circuit board FPC), with a carrier. A method of bonding an electronic component of a flexible substrate to a carrier, and the method used in the prior art includes a method of pressing by a heat source and a method of bonding with a glue, and the method of bonding with the adhesive is For example, in the prior art, the flexible substrate is manually applied one by one to cover the carrier to be attached one by one, and then flattened after bonding to determine the adhesive positioning.

This prior art is only applicable to a small number of bonding industries. In addition to consuming a large amount of human resources for a large number of flexible substrates, it also poses doubts about the quality of the bonding, and because of the popularity of smart phones, the amount is large. The light, short, and powerful properties make the area of the flexible substrate smaller, and the electronic circuit layout on the 3D circuit is no longer just a simple 2D circuit layout, so the positional accuracy of the carrier is required. Higher, the improvement of production efficiency and the stability of product quality are becoming more and more demanding. In addition, the labor cost is rising day by day, and it is no longer possible to manually carry out the cooperation. In order to solve the problem of adhesively bonding the flexible substrate in an automated way The need for the carrier, the flexible substrate is extracted and transferred to the carrier carrying the carrier in a loaded carrier for bonding, and the flexible substrate is viscous on one side for bonding. Difficult to extract directly, and how the flexible substrate can be positioned in the carrier, how the carrier can be extracted and attached, and other auxiliary mechanisms can be used to register the flexible substrate on the carrier via the carrier Firmly affixed stickers and Standards for the job, there is a need to come up with effective solutions on how to overcome contain such a flexible substrate.

Accordingly, it is an object of the present invention to provide a disk assembly that facilitates efficient loading and transport of components to be processed.

Another object of the present invention is to provide an apparatus for transporting a disc assembly that facilitates processing and extraction of components to be processed in a disc assembly.

It is still another object of the present invention to provide a method of extracting an element from a disk assembly that is easy to extract an element to be processed from a disk assembly.

It is still another object of the present invention to provide an apparatus for performing a method of extracting components from a disc assembly as described.

A disk assembly according to the present invention includes a first carrier disk and a first cover disk, the first cover disk being coated on the first carrier disk; the disk assembly providing a plurality of first components to be processed The matrix arrangement is placed in it.

According to another aspect of the present invention, a device for transporting a disk assembly for transporting a disk assembly including a first carrier disk and a first cover disk, the first cover disk being disposed on the first carrier disk; A first component to be processed is placed in a plurality of matrix arrangements; the disk assembly is transported by a first carrier of a transport mechanism, the first carrier being parallel to a first transport slide with a long side By the arrangement, the long side of the other side is unsupported to suspend the first carrier below.

A method for extracting an element from a disk assembly according to another aspect of the present invention is for extracting a first component from a disk assembly including a first carrier and a first cover disk, the first cover disk being overlaid on the first a disk assembly; the disk component is disposed in a plurality of matrixes for processing the first component to be processed; and the first component is adhered to the bonding component having the adhesive to a distance disposed in the disk component Forming a first element from the upper surface of the bonding portion of the first component to be extracted, adsorbing the lower surface of the film by a negative pressure, and causing the release film to be opposite to the bonding portion of the first component To the relative displacement, the first element is extracted.

An apparatus for extracting components from a disk assembly according to still another object of the present invention comprises: means for performing a method of extracting components from the disk assembly.

The apparatus for disc assembly and the transport tray assembly of the embodiment of the present invention, and the method and apparatus for extracting components from the disc assembly, wherein the disc assembly includes a first carrier and a first cover, the first cover is coated on the first The disk assembly is provided with a first component to be processed in a plurality of matrix arrangements, so that the disk assembly can efficiently carry and transport the component to be processed; and the disk assembly is subjected to a transport mechanism. a first carrier is transported, the first carrier is disposed with a long side parallel to a first transporting slide rail, and the long side of the other side is unsupported to suspend the first carrier. The component to be processed in the disk assembly is easily processed and extracted; and, because the first component of the flexible substrate is on the first carrier of the first transfer flow path, the release film of the first disk assembly For extracting, the first component is adhered to a release mold disposed in the disc assembly with a bonding portion having an adhesive; from the upper surface of the bonding portion of the first component to be extracted Extracting the first component, adsorbing the lower surface of the film under negative pressure, leaving The film is reversely displaced relative to the bonding portion of the first member, and the first member is extracted; the negative pressure adsorbs the release film other than the bonding portion of the first component being extracted, and is positive pressure The gas is sprayed through the corresponding through hole on the release film to the bonding portion of the first component, so that the bonding portion is detached from the release film and extracted; therefore, even if the flexible substrate is extremely fine, the flexible substrate and the other are The bonding between the carriers can also be carried out efficiently and accurately by automation.

Referring to FIG. 1 , an embodiment of the present invention is directed to a bonding process in which a first component A formed of a flexible substrate is attached to a second component B as a carrier, and the first processing to be processed is taken as an example. The component A includes a bonding portion A1 under which the adhesive is applied and a non-bonding portion A2 not coated with the adhesive underneath.

Referring to FIG. 2, the first component A is adhered to a release film A3 on the lower side of the adhesive-attached portion A1 and arranged in a plurality of matrixes. The non-bonding portion A2 is not coated with adhesive underneath. And being separated from the release film A3; the viscosity of the adhesive and the smooth surface of the release film A1 are available for the first component A to be extracted from the release film A3; the peripheral surface of the release film A3 is provided with a positioning The hole A31, the release film A3 is placed on a rectangular first carrier A4, and the positioning hole A31 on the peripheral surface of the release film A3 is nested in the corresponding pivot pin A41 on the first carrier A4. Positioning is obtained, and a first cover disk A5 is further disposed on the release film A3; a working area A42 is disposed on the first carrier A4, and a plurality of hollow working sections A421 are formed on the working area A42 and juxtaposed in the X-axis direction. a rib A422 is disposed between the two working sections A421, and is supported by the rib A422 under the release film A3; the first element A arranged in a matrix on the release film A3 is arranged in a plurality of Y-axis and juxtaposed into one The group mode corresponds to the upper part of the working area A421, and the total wheel width of the film A3 is larger than the total area of each working area A421, and is covered. It is disposed on the working area A42; the outer side of the rectangular side of the first carrier A4 is respectively provided with a buckle edge A43 having a lower height than the upper surface of the working area A42; the total width of the first cover plate A5 is wide The area is smaller than the total wheel width of the first carrier A4, and covers the working area A42 and covers the release film A3. The first cover disk A5 is provided with a positioning concave corresponding to the pivot pin A41 of the first carrier A4. The hole A51 is provided with a plurality of hollow sections A52 arranged in the X-axis direction corresponding to the respective working sections A421, and each of the hollow sections A52 is partitioned by the partition ribs A521 to correspond to the first component on the lower split film A3. A number and position of the operation section A522, each of the barrier ribs A521 respectively form a disconnection portion A523 to communicate with the two operation sections A522; the first tray A4 is located on the upper surface of the work area A42 with a plurality of magnetic parts A423 respectively The first cover disk A5 is made of a metal material, so that the first cover disk A5 can be adhered to the first carrier plate A4 by the magnetic member A423; The release film A3 to which the first component A is attached is positioned between the first carrier A4 and the first cover disk A5, and integrally forms a first disk Component AA.

Referring to FIG. 3, the second component B is mounted on a rectangular second carrier B1 and arranged in a plurality of matrixes. The second carrier B1 is provided with a working area B11. A plurality of rectangular operation holes B12 arranged in a matrix are arranged on the B11, and a dimple positioning portion B121 is disposed at each end of the operation hole B12, and the second element B is disposed above the operation hole B12 and respectively has two ends Positioned on the positioning portion B121, the second elements that are juxtaposed in the same Y axial direction form the same group, and the second element B of the second carrier B1 is further covered with a second cover disk B2; the second cover disk The total wheel width of the B2 is smaller than the total wheel width of the second carrier B1 and is disposed on the working area B11; the second carrier B1 has a rectangular height and a working area respectively on the outer side and the outer side. The upper surface of the B11 is a low buckle edge B13; the second cover disk B2 is provided with a positioning pocket B21 corresponding to the pivot pin B14 of the second carrier B1, and a plurality of hollow spaces corresponding to the operation holes B12 are provided. B22, each of the hollow sections B22 is provided with a rib B221 and a rib section B222 protruding to the hollow section B22, which is correspondingly located on the second carrier B1 The second component B is disposed above the positioning portion B121 at both ends of the operation hole B12; the second carrier B1 is disposed on the upper surface of the working area B11, and a plurality of magnetic members B15 are respectively disposed at each The second cover disk B2 is made of a metal material, so that the second cover plate B2 can be adhered to the first carrier A4 by the magnetic member B15; The first carrier A4 having the second component B is covered by the first cover disk A5, which integrally forms a second disk assembly BB.

Referring to FIG. 4 and FIG. 5, the embodiment of the present invention can be illustrated by the apparatus shown in the figure, including: a machine C, which is recessed from the center of the machine table C1 to form a working section C2, so that the machine table C1 The two sides are higher and each form a side seat C3; a conveying mechanism D, which is disposed in the working section C2, includes: a first rail seat D1 which is erected in the Z-axis direction and extends in parallel along the X-axis direction a second rail seat D2; wherein the first rail seat D1 is provided with an X-axis first transport rail D11 on a side in the machine C, and a first transport slide is arranged on the first transport rail D11. The rail D11 is vertical, and can be driven thereon to be disposed in a horizontal direction to perform a sliding displacement of the first carrier D12, the displacement path of which provides a first transport flow path for transporting the first disc assembly AA of FIG. 2; The first carrier D12 is approximately rectangular in shape, and is disposed in parallel with the first conveying rail D11 with a long side to provide stable transmission, and the long side of the other side is unsupported to make the first The carrier D12 is suspended below; the second rail D2 is provided with an X-axis second transport rail D21 on one side of the machine C, and The second conveying rail D21 is provided with a second carrier D22 which is perpendicular to the second conveying rail D21 and can be driven thereon to be disposed in a horizontal direction for sliding displacement, and the displacement path thereof provides a second conveying flow path. For transporting the second disk assembly BB in FIG. 3; the second carrier D22 is approximately rectangular in shape, and is disposed in parallel with the second conveying rail D21 with a long side to provide stable transmission, and The long side of one side is unsupported to vacate the second carrier D22 below; a first auxiliary mechanism E is disposed in the working section C2 of the recess of the machine C, and is conveyed at the first conveying mechanism D Between the slide rail D11 and the second transport rail D21, and below the first carrier D12 in the path of the first carrier D12 sliding on the first transport rail D11, a second auxiliary mechanism F is disposed at the first carrier D12. The working section C2 in which the machine table C is recessed, and between the first conveying rail D11 and the second conveying rail D21 of the conveying mechanism D, and the path of the second carrier D22 sliding on the second conveying rail D21. Below the second carrier D22; a transfer mechanism G, comprising: a transfer rail seat G1, the two ends of which are fixed on the machine C The side seat C3 is provided with a Y-axis transfer track G11, and the transfer track G11 is provided with a transfer seat G12. The transfer seat G12 is provided with a bonding mechanism G2, a tape mechanism G3 and a first view. The unit G4 can be displaced between the first carrier D12 on the first transport rail D11 of the transport mechanism D and the second carrier D22 on the second transport rail D21 on the transfer track G11; the first view unit G4 The CCD lens can be viewed from the top to the bottom; the transfer rail G11 is provided with a pressing mechanism G5 on the side of the second rail D2, and the transfer seat G12 and the pressing mechanism G5 can be independently driven. Displacement on the transfer rail G11; a second inspection unit H, disposed in the recessed working section C2 of the machine C, and between the first transport rail D11 and the second transport rail D21, and is a transfer seat The G12 upper bonding mechanism G2 moves from the first carrier D12 on the first transporting slide D11 to the second carrier D22 on the second transporting slide D21, which can be a CCD lens that is viewed from the bottom up. The first auxiliary mechanism E, the second auxiliary mechanism F, and the second inspection unit H are guided by the transfer rail G11 on the transfer rail base G1 in the transfer mechanism G. Below the straight-line transfer path, which is also below the path through which the bonding mechanism G2 can move, wherein the second viewing unit H, the first auxiliary mechanism E, and the second auxiliary mechanism F are connected on the transfer path. It is a straight line parallel to the transfer track G11.

Referring to FIGS. 5 and 6, the first carrier D12 and the second carrier D22 of the transport mechanism D have substantially the same structure, and are only opposite to each other when installed. The first carrier D12 is described as follows: the first carrier D12 includes : a base D121 having a rectangular frame shape and having a rectangular movement first D111 in the interior; and being fixed by and coupled with the long side D1212 of one side and the sliding seat D111 of the first conveying rail D11 a second seat shifting section D1221 is disposed on the base D121 and has a rectangular frame shape at the center, and a second shifting section D1221 is disposed at the center, and the second shifting section D1221 is corresponding to the first shifting section D1211 of the base D121; Y-axis of the second transition interval D1221 Each of the two sides is provided with a convex partition portion D1222, and a second partitioning portion D1221 between the two partition portions D1222 forms a lower surface of the upper partition portion D1222 and is available for the first disc assembly AA or the second disc assembly BB. The mounting space D1223 is disposed therein, and the positioning pin D1224 is disposed in the mounting space D1223; the two sides of the long side of the seating D122 outside the two partition portions D122 are formed parallel to each other and lower than the upper surface of the spacing portion D1222 The base D1225; the second shift section D1221 below the seat D122 is provided with parallel strip-shaped inserts D1226 on both sides; a clip mechanism D123, which is arranged on the seat D122, can be driven to expand or clamp The two clip assemblies D1231 are respectively disposed at the two short sides of the X-axis at the front and rear ends of the X-axis, respectively, which are respectively disposed in a corresponding manner, and each clip assembly D1231 includes An arm D12311, and a clamping arm D12312 pivotally disposed at two ends of the arm D12311, respectively, each of the arm D12311 and the second arm D12312 are provided with inwardly facing inlays D12313, D12314, respectively, the front ends of which have upper and lower sides respectively Outer tapered inner edge, can be driven toward the seat D122 The upper first disc assembly AA or the second disc assembly BB is pushed to be positioned; the two clamp arms D12312 are respectively provided with an inclined long slot D12315 between the inlay D12314 and the pivoted portion of the arm D12311. The two clamping arms D12312 are respectively disposed on the base D1225 of the two sides of the long side of the seat D122 at the long slot D12315, and the two slots D12315 of the two inclined arms D12312 are spaced apart. The front arm is narrow and wide; the arm D12311 is disposed with a sliding rail D12318 fixed to the fixed seat D12317 of the base D121; a driving member D12319 disposed on the fixing base D12317 can pull the arm D12311 with a driving rod D12320 The operation of the lead or push forward; because the distance between the two inclined slots D12315 of the two clamp arms D12312 is the front narrow and the rear width, the drive rod D12320 of the driving member D12319 is pushed forward, except for the two inlays D12313 on the two arms D12311 In the opposite direction, the two-arm clamp D12312 also uses the pivoting fixing member D12316 as a fulcrum to clamp the front end two inlays D12314. On the contrary, the driving member D12320 of the driving member D12319 is pulled back, and the two arms D12311 are respectively The inlay D12313 will be outwardly stretched, and the two clamp arms D12312 front end two inlays D1231 4 will also be outside.

Referring to Figures 2, 7 to 9, the first auxiliary mechanism E includes a pedestal E1, a pedestal E1 is provided with a stand E2, and a Z-axis slide rail E21 is arranged on the side of the stand E2, and the slide rail E21 is provided. There is an X-axis horizontal stage E3. The stage E3 is driven by a screw E41 driven by a driving member E4 to be lifted up and down in the Z-axis. The stage E3 is provided with an X-axis slide rail E31, and the slide rail E31. An abutment E5 and a pin-like linkage E51 coupled to the seat E4 and disposed on opposite sides of the seat E5 are provided. The abutment E5 can be driven up and extended through the base D121 of the first carrier D12. The first shifting interval D1211 and the second shifting interval D1221 of the rectangular cutout of the seating D122 are placed in the working section A421 of the first loading tray A4 of the first disk assembly AA on the first carrier D12, and are offset by The lower part of the release film A3 is close to the release film A3; the upper surface of the seat E5 is arranged in a Y-axis direction arranged in a matrix and juxtaposed as a group. The number of the first elements A is provided with the same number of air pressure seats E52, and each pressure seat E52 The plurality of air holes E53 arranged in the X-axis spacing are arranged, and the first component A corresponding to one of the release films A3 above each of the air pressure seats E52 has a glue. The fitting portion A1, the position of the air hole E53 on the opposite air pressure seat E52 of the release film A3 is also provided with a through hole A32; the second air pressure seat E52 is provided with a support portion E54, and a recessed gas is arranged between the air pressure seats E52. In the area E55, a contoured edge E56 of the micro-convex is formed outside the air zone E55; the air holes E53 on the same air pressure seat E52 can simultaneously emit positive pressure gas or convert to provide negative pressure suction;

Referring to FIGS. 10 and 11, the pin-shaped linking member E51 on the two sides of the first auxiliary mechanism E on the opposite side of the seat E5 can be embedded in the second moving section below the seat D122 of the first carrier D12 when the seat E5 is driven to rise. The long strip D1226 disposed on both sides of the D1221 is provided with the opening D1227 facing downward, and the first carrier D12 is X-axis displaced on the first transport rail D11 on the first rail D1. The interlocking seat E5 is synchronously displaced on the X-axis slide rail E31 on the horizontal stage E3; the long-shaped insert D1226 disposed on both sides of the second shifting section D1221 below the seat D122 is opened downwardly into the lower hole D1227, The separation interval is corresponding to each working section A421 of the first carrier A4 on the first disk assembly AA, and is set symmetrically by a hole D1227 on the left and right inserts D1226.

Referring to FIGS. 12-14, the second auxiliary mechanism F includes a pedestal F1. The pedestal F1 is provided with a stand F2, and a Z-axis slide rail F21 is disposed on the side of the stand F2, and an X is disposed on the slide rail F21. The axial horizontal stage F3 is provided with a driving member F4 under the loading table F3. The driving member F4 drives a screw F41 downward, and the reverse driving stage F3 can be raised and lowered in the Z-axis direction, and the loading table F3 is provided. The X-axis slide rail F31, the slide rail E31 is provided with an abutment F5 and a pin-like linkage F51 coupled with the abutment F5 and disposed on both sides of the abutment F5, the abutment F5 can be driven up by the driving member F4. a second transition section D2211 extending through the rectangular cutout of the base D221 of the second carrier D22 and a second transition section D2221 of the rectangular cutout of the seating D222, and passing through the second disk assembly BB placed on the second carrier D22 The hole B12 is operated on the second carrier B4, and is close to the second component B under the second component B; the upper surface of the seating F5 is arranged in a matrix of Y-axis spacing and juxtaposed as a group of the second component B. There are the same number of air pressure seats F52, each air pressure seat F52 is provided with two suction nozzles F53, and each of the air pressure seats F52 corresponds to a second element B; the air pressure seat F The upper nozzle F53 can provide a vacuum suction.

Referring to FIGS. 14 and 15, the pin-shaped linking member F51 on both sides of the second auxiliary mechanism F on the seat F5 can be inserted into the second shifting section of the seat D222 of the second carrier D22 when the seat F5 is driven to rise. The long strip D2222 disposed at the lower side of the D2221 is provided with the opening downwardly facing the hole D2223, and the second carrier D22 is displaced by the X-axis when the second conveying rail D21 is displaced on the second rail seat D2. The interlocking seat F5 is synchronously displaced on the X-axis slide rail F31 of the horizontal stage F3; the long-shaped insert D2222 of the second shift section D2221 on the side of the seat D222 is opened downwardly. D2223, corresponding to the spacing between the second tray B4 of the second disk assembly BB and the Y-axis spacing arranged in a matrix, is arranged as a group of operation holes B12, and a hole is respectively arranged symmetrically on the left and right nests D2222. D2223 mode setting.

Referring to FIG. 4, 16~17, a resetting seat G121 is disposed on the transfer base G12 of the transfer mechanism G2. The first inspection unit G4 is disposed on one side of the fixed seat G121, and a driving member is disposed on the other side. G122, the driving member G122 drives a sliding seat G124 on a Z-axis slide rail G123 on the fixing base G121 to be displaced in the Z-axis upward and downward; the sliding seat G124 is provided with a fixing frame G125, and the fixing frame G125 is disposed on the fixing frame G125. The bonding mechanism G2 and the tape mechanism G3 enable the driving mechanism G122 to drive the bonding mechanism G2 and the tape mechanism G3 on the fixing frame G125 to be vertically displaced in the Z-axis direction; the bonding mechanism G2 includes: a touch-pressure component G21, a body G211 is disposed on a Z-axis slide rail G221 of a carrier G22, and can be displaced in the Z-axis up and down on the slide rail G221, and the contact pressure component G21 is provided with a pressing shaft G212, and a coupling is made below The G213 can be connected to a pressing mold G214 which is replaced according to different product processing requirements; the body G211 can be provided with a heating element (not shown) according to different product processing requirements, and the temperature detecting element G215 is used for temperature detection. Measure and control; a rotating component G23, in a frame G222 on the carrier G22 in the compartment A toothed shaft wheel G231 is disposed between the upper fixed seat G223 and the lower fixed seat G224. The shaft wheel G231 is driven by a driving member G232 coupled by a belt G233 for rotation; a pressure measuring component G24 is provided with a load weight. The measuring component G241 is located between the rotating component G23 and the touch component G21. The pressure measuring component G24 is rotated by the rotating component G23 and can be rotated by the pressing axis G211 of the contact component G21. An adjusting component G25 is disposed on the upper fixing seat G223. The utility model comprises a cover frame G251 and a fine adjustment component G252 including an elastic component therein. The fine adjustment operation of the adjustment component G25 can link the rotation component G23 and the pressure measurement component G24 to make the pressure component G21 Up-and-down fine-tuning displacement on the Z-axis slide rail G221 of the carrier G22; the carrier G22 is carried by the touch-pressure component G21, the rotating component G23, the pressure measuring component G24, and the adjusting component G25 are connected in series above and below the same central axis The affixing mechanism G2 is disposed on the fixing frame G125. The tape mechanism G3 includes a winding reel G31 carrying a tape roll and driven by a fixing frame G125 rear side driving member G311, and a reeling tape. Backed by a fixed frame G125 The winding pulley G32 driven by the member G321, wherein the winding pulley G31 and the winding reel G32 are located on the other side of the bonding mechanism G2 on the fixing frame G125 of the first inspection unit G4, and the winding reel G31 is located at the winding Below the wheel G32; a tape detecting component G33 is disposed on the side of the winding pulley G31 to detect whether the tape G34 on the winding reel G31 is used up; the winding reel G31 and the winding reel G32 are combined with a plurality of idlers G351 The transmission wheel set G35 is formed to form a transport flow path of the adhesive tape G34. The transport flow path surrounds the periphery of the bonding mechanism G2 with the adhesive G34 having the adhesive side facing outward, so that the bonding mechanism G2 is located inside the transport flow path. And the tape G34 is attached to the touch-pressing component G21 of the bonding mechanism G2 under the pressing mold G214.

Referring to FIGS. 18 and 19, the pressing mold G214 includes a suction seat G2141 and an abutting seat G2142 protruding downwardly from the bottom end of the adsorption seat G2141. The two sides of the suction seat G2141 are respectively provided with a slope-shaped adsorption surface. G2143, each surface of each adsorption surface G2143 is concavely provided with a plurality of air pockets G2144 which are arranged in a plane and communicate with each other, and between the two air pockets G2144, a convex rib G2145 is formed, and a plurality of convex ribs G2145 are arranged in a plane shape. The adsorption surface G2143 is provided with a pore G2146 for providing a vacuum suction force in the gas pockets G2144; the two inclined surface adsorption surfaces G2143 on both sides are tapered in a tapered shape toward the abutment G2142; the bottom end of the abutment G2142 is in contact with the surface G2147 forms a shape matching the upper surface shape of the bonding portion A1 having the adhesive under the first component A. In the present example, the bottom contact surface G2147 of the abutting seat G2142 forms a long rectangular flat surface. And a recessed accommodating section G2148 is disposed on the flat surface, and the position of the accommodating section G2147 and the recessed depth are matched with the electrons on the bonding part A1 of the first component A of the flexible substrate to be constructed. Line protuberance; transmission through the pressure The tape G34 of G214 is firstly pressed against the outer side of the pressing mold G214 via the idler gear G351 on the side of the pressing mold G214, and then passes through the adsorption seat G2141 corresponding to the inclined surface adsorption surface G2143 of the side idler gear G351, and then passes through the abutting seat G2142. The bottom end contact surface G2147, and then the inclined surface adsorption surface G2143 on the other side of the adsorption seat G2141, and then the idler gear G351 corresponding to the side adsorption surface G2143 is opposite to the outer side of the pressing mold G214; The adhesive tape G34 of the G2142 bottom end contact surface G2147 has a surface with an adhesive surface facing downward corresponding to the upper surface of the bonding portion A1 having the adhesive under the first component A.

Referring to FIG. 4 and FIG. 20, the pressing mechanism G5 includes: a first driving component G51, which is provided with a fixing base G511. The fixing base G511 is provided with a Z-axis rail G512, and the rail G512 is provided with a first sliding seat G513. The first sliding seat G513 can be driven by the first driving member G514 of a motor to be displaced in the Z-axis up and down on the rail G512. The second driving component G52 is provided with a fixing base G521 and the fixing base G521. The Z-axis rail G522 and a bearing G523 are disposed; the second rail G 524 is disposed on the rail G522, and the second sliding seat G524 is provided with a pressing seat G525 coupled thereto, and the lower end of the pressing seat G525 is biased. The pressing mold G526 composed of the material has a bottom wheel shape that can match the upper surface shape of the bonding portion A1 having the adhesive under the first component A; the pressing seat G525 can be second formed by a pneumatic cylinder on the bearing G523. The driving member G527 acts on the air pressure. When the second sliding seat G524 is displaced by the resistance on the rail G522, the air pressure of the second driving member G527 formed by the pneumatic cylinder forms a buffer for the upward displacement of the pressing mold G526.

Referring to FIGS. 4, 11, and 21 to 24, in the embodiment of the present invention, when performing the extraction of the flexible substrate, a one-position step is performed: the transfer carrier G12 (FIG. 4) of the transfer mechanism G is displaced to the first transfer flow path. The first viewing unit G4 is disposed above the first disk assembly A1 on the first carrier D12, so that the first viewing unit G4 corresponds to the first component A to be extracted on the release film A3 in the first disk assembly AA. Above the bonding part A1 (Fig. 21); at this time, the first auxiliary mechanism E is located just below the first disk assembly AA, and the pin-shaped linking member E51 that is raised to the two sides is embedded in the first carrier D12 The long-shaped insert D1226 disposed on both sides of the second shifting section D1221 below the seat D122 is provided with the opening D1227 facing downward, and the first carrier D12 is interlocked with the seating E5 (FIG. 11); a one-position detecting step: detecting, by the first viewing unit G4, the bonding portion A1 of the first component A to be extracted on the release film A3 of the first disk assembly AA from top to bottom to obtain the position information thereof Sampling the two fixed position on the bonding part A1 during the detection, since the first inspection unit G4 can only make the Y-axis position with the transfer seat G12 Therefore, after the first fixed-point detection sampling is completed, the first carrier D12 is driven to be coupled to the occupant E5 to perform X-axis displacement on the first rail seat D1 to obtain the second fixed-point position information; According to the position information obtained by the registration detecting step, the abutting seat G2142 protruding from the pressing mold G214 under the bonding mechanism G12 on the transfer seat G12 corresponds to the release film A3 in the first disk assembly AA. The bonding part A1 of the first component A to be extracted is above (FIG. 22); the bonding mechanism G2 is driven to move downward, and the side of the adhesive tape G34 having the adhesive is abutted against the adhesive G2142. Extracting the upper surface of the bonding portion A1 of the first component A and adhering it (FIG. 23), and then driving the bonding mechanism G2 to move up slowly, and bonding the bonding portion A1 of the first component A with the tape G34 to make the first component A is gradually separated from the release film A3, and the extraction of the first component A is completed (Fig. 24); wherein the bonding mechanism G2 adheres to the bonding portion A1 of the first component A on the adhesive tape G34 to be removed. , the lowering speed of the bonding portion A1 of the first component A is driven to be slower than that of the original bonding mechanism G2. In order to make the first component A completely and fully detached from the release film A3; when the adhesive portion G1 adheres to the bonding portion A1 of the first component A for upward extraction, the first disk assembly AA is seated below the E5. The air hole E53 of the air pressure seat E52 corresponding to the bonding portion A1 supplies a positive pressure gas for blowing (Fig. 24), and the positive pressure gas passes through the corresponding through hole A32 of the release film A3 to the bonding portion of the first element A. A1 is blown to help the bonding portion A1 adhere to the tape G34 and is detached from the release film A3; at the same time, other than the air pressure seat E52 under the bonding portion A1 of the first component A which is being extracted. The air pressure seat E52 has a negative pressure on the air hole E53, so that the negative pressure spreads the concave air area E55, and the negative pressure adsorbs the outer portion of the first component A which is being extracted. The lower surface of the film A3 is such that when the extraction is performed, the release film A3 is reversely displaced relative to the bonding portion A1 of the first member A to assist the separation of the two and prevent the release film A3 from being moved up. The adhesive tape G34 adheres to the ridge; the first disk assembly AA is axially spaced in the same working area A421 and is juxtaposed as a group of first components. After the A is extracted, the seat E5 of the first auxiliary mechanism E will be driven to move down to release the interlocking state with the first carrier D12, and then the first carrier D12 will be driven forward to make the first disk assembly AA down. A working section A421 is correspondingly displaced above the seating E5 of the first auxiliary mechanism E, and the abutting E5 is driven to rise in conjunction with the first carrier D12, and the first disk assembly AA currently on the corresponding seat E5 is operated. The first element A in the interval A421 in which the Y axial intervals are juxtaposed as a group continues to be extracted.

Referring to FIGS. 4, 14, and 25 to 30, in the embodiment of the present invention, when performing the bonding of the flexible substrate, a second alignment detecting step is performed: after the flexible substrate is extracted, the transfer mechanism G is transferred. The seat G12 (Fig. 4) is displaced between the first conveying rail D11 and the second conveying rail D21, and the fitting mechanism G2 on the shifting seat G12 is moved from the first carrier D12 on the first conveying rail D11 to the first 2 above the second inspection unit H in the path of the second carrier D22 on the transport rail D21 (FIG. 25), the CCD lens that is viewed from the bottom up is attached to the pressing mold G214 of the bonding mechanism G2. The lower part of the bonding part A1 of the first component A adhered to the adhesive tape G34 under the G2142 is detected (Fig. 26) to obtain the position information under the bonding part A1. One-position step: after the second registration detecting step is completed, the shifting is performed. The transfer seat G12 (FIG. 4) of the carrier mechanism G is displaced to the upper portion of the second disk assembly BB of the second carrier D22 of the second rail base D2, and the abutment G2142 of the pressing mechanism G214 of the bonding mechanism G2 is protruded. The bonding portion A1 of the first component A adhered by the lower tape G34 corresponds to the preset positioning of the second component B (Fig. 27, 28); at this time, the second auxiliary mechanism F The strip-shaped insert seat located below the second shifting section D2221 of the second carrier D22 is embedded in the second tray assembly BB and the pin-shaped linking member F51 that is raised to the two sides of the second carrier D22. D2222 is provided with the opening D2223 facing downward, and the second carrier D22 is interlocked with the seating F5 (Fig. 14); a fitting step: the lowering of the bonding mechanism G2 against the seat G2142 against the adhesive tape G34 The bonding position A1 of the first component A abuts against the preset positioning of the second component B (Fig. 29); after the bonding is completed, the abutting seat G2142 is driven along with the tape G34 to be slower than the original downward moving speed. Shifting, at this time, the second auxiliary mechanism F located below the second disk assembly BB on the air pressure seat F52 of the seat F5, the suction nozzle F53 provides a negative pressure suction force, so that the second element B is adsorbed under the second element B, so that the tape G34 is self-contained When the bonding position A1 of the component A is detached, the second component B is reversely displaced relative to the tape G34 to assist the separation of the adhesive tape G34 from the bonding portion A1 of the first component A; a third alignment detecting step Corresponding to the first view unit G4 corresponding to the first component of the second disc assembly BB that has been attached to the second component B The bonding portion A1 of the component A is detected from the top to the bottom to obtain the position information thereof; when the detection is performed, the two fixed position positions on the bonding portion A1 are sampled, and after the first fixed-point detection sampling is completed, the second carrier D22 is The driving and the seating F5 are interlocked on the second rail seat D2 to perform the X-axis front-rear displacement to obtain the second fixed-point position information; a pressing step, refer to FIGS. 4 and 27, according to the third registration detecting step. The position information drives the pressing mechanism G5 to be located above the second disk assembly BB. At this time, the transfer seat G12 (FIG. 4) of the transfer mechanism G is displaced to the first carrier D12 of the first rail D1. The next extraction is performed above the disk assembly AA; the first driving component G51 of the pressing mechanism G5 is driven to be displaced downward in the Z-axis, so as to interlock with the flexible material of the second driving component G52 pressed against the lower end of the G525. The pressing mold G526 presses the upper surface of the bonding portion A1 of the first element A that has been bonded so that the bonding portion A1 of the first element A and the second element B are sufficiently adhered and pressed. When the G526 is subjected to the resistance, the pressure of the second driving member G527 formed by the pneumatic cylinder is slowed down. Punching, avoiding damage caused by excessive force applied to the bonding portion A1 of the first component A; after the second component B of the second disk assembly BB is axially spaced and juxtaposed into the same group is finished, the second auxiliary mechanism The seating F5 of F will be driven down to release the interlocking state with the first carrier D12, and then the second carrier D22 will be driven forward to displace the second disk assembly BB to the second component of the next same group B corresponds to the upper portion of the second auxiliary mechanism F, and the abutment F5 is driven to rise and interlock with the second carrier D22, and the Y-axis of the second disk assembly BB currently corresponding to the seat F5 is axially spaced and juxtaposed as The second component B of the same group continues to be engaged; after the first component A and all the second components B on the second disk component BB are finished, the second disk component BB follows the original second delivery rail D21. The second transfer stream is sent back.

The apparatus for disc assembly and the transport tray assembly of the embodiment of the present invention, and the method and apparatus for extracting components from the disc assembly, the first component A of the flexible substrate is transported by the first rail D1 of the first transport flow path The release film A3 of the first disk assembly AA on the carrier D12 is extracted, and the bonding portion G1 of the first component A is adhered to the adhesive tape G34 under the abutting G2142 protruding from the pressing mold G214 by the bonding mechanism G2. At the time of extraction, the air hole E53 from the air pressure seat E52 corresponding to the bonding portion A1 can be passed through the first seat D12 and the base D121 and the seat D122 by the seating E5 of the first auxiliary mechanism E below the first disk assembly AA. The first and second transition sections D1211 and D1221 of the hollow supply provide a positive pressure gas for blowing, and the positive pressure gas is blown through the corresponding through hole A32 of the release film A3 to the bonding portion A1 of the first component A to help the sticker. The joint portion A1 adheres to the tape G34 and is extracted from the release film A3; and provides a negative pressure to the air hole E53 on the air pressure seat E52 other than the air pressure seat E52 under the bonding portion A1 of the first component A which is to be extracted. So that the negative pressure spreads the recessed gas zone E55 to adsorb the lower surface of the film A3. When the extraction is performed, the release film A3 is reversely displaced relative to the bonding portion A1 of the first member A, which can assist the separation of the two and prevent the release film A3 from being adhered by the tape G34 which is moved upward; When the bonding is performed, the first component A is adhered to the second carrier D22 conveyed by the second rail D2 of the second transport flow path by the tape G34 under the abutting seat G2142 protruding from the bonding mold G2. The second component B of the second disk assembly BB is such that the bonding portion A1 of the first component A is attached to the second component B to be disengaged, and the air pressure seat F52 of the second auxiliary mechanism F is seated on the F5. The upper nozzle F53 provides a negative pressure suction force through the first and second transition sections D2211 and D221 of the hollow in the base D221 and the seat D222 of the second carrier D22, so that the lower side of the second component B is adsorbed, so that the tape G34 is self-contained. When the bonding position A1 of the component A is detached, the second component B is reversely displaced relative to the tape G34 to assist the separation of the adhesive tape G34 from the bonding portion A1 of the first component A; The three-position detection step cooperates with the first and second auxiliary mechanisms E and F, and the E5 and F5 can be combined with the first and second carriers D1. 2, D22 linkage, so that it can be used for two-point sampling test at different positions to obtain accurate alignment; and the pressure-bonding mold G526 formed by the flexible material clamped at the lower end of the pressing G525 at the pressing step is completed. The upper surface of the bonding portion A1 of the first element A is pressed against, and the bonding portion A1 of the first element A and the second element B are sufficiently bonded. Therefore, even if the flexible substrate is extremely fine, the flexible substrate and the flexible substrate are The bonding between the other carriers can also be carried out efficiently and accurately by automation.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

A‧‧‧ first component
A1‧‧‧Fitting parts
A2‧‧‧ non-adhesive parts
A3‧‧‧Folding film
A31‧‧‧Positioning holes
A32‧‧‧through hole
A4‧‧‧first carrier
A41‧‧‧ pivot
A42‧‧‧Workspace
A421‧‧‧Working area
A422‧‧‧ ribs
A423‧‧‧Magnetic parts
A43‧‧‧ buckle
A5‧‧‧First cover
A51‧‧‧ positioning pocket
A52‧‧‧ Short-term interval
A521‧‧‧ ribs
A522‧‧‧Operation interval
A523‧‧‧Disconnection
AA‧‧‧ first disk assembly
B‧‧‧Second component
B1‧‧‧second carrier
B11‧‧‧Workspace
B12‧‧‧Operation hole
B121‧‧‧ Positioning Department
B13‧‧‧ buckle
B14‧‧‧ pivot
B15‧‧‧Magnetic parts
B2‧‧‧Second cover
B21‧‧‧ positioning pocket
B22‧‧‧Sketch interval
B221‧‧‧ ribs
B222‧‧‧ rib section
BB‧‧‧second disk assembly
C‧‧‧ machine
C1‧‧‧ machine table
C2‧‧‧ working area
C3‧‧‧ side seat
D‧‧‧Transportation agency
D1‧‧‧First rail seat
D11‧‧‧First conveyor rail
D111‧‧‧ slide
D12‧‧‧ first carrier
D121‧‧‧Base
D1211‧‧‧First transition interval
D1212‧‧‧ long side
D122‧‧‧Seat
D1221‧‧‧Second transition interval
D1222‧‧‧Interval
D1223‧‧‧Set space
D1224‧‧ Locating pin
D1225‧‧‧ seat
D1226‧‧‧ nesting
D1227‧‧‧ hole
D123‧‧‧ Clip mechanism
D1231‧‧‧ clip assembly
D12311‧‧‧ Arm
D12312‧‧‧ clip arm
D12313‧‧ Inlay
D12314‧‧ Inlay
D12315‧‧‧Long slot
D12316‧‧‧Fixed parts
D12317‧‧‧ Fixed seat
D12318‧‧‧ drive parts
D12319‧‧‧ drive parts
D12320‧‧‧ drive rod
D2‧‧‧Second rail seat
D21‧‧‧Second transport rail
D22‧‧‧Second carrier
D221‧‧‧Base
D2211‧‧‧First transition interval
D222‧‧‧Seat
D2221‧‧‧Second transition interval
D2222‧‧‧ nesting
D2223‧‧‧ hole
E‧‧‧First Auxiliary Agency
E1‧‧‧ pedestal
E2‧‧‧ seat
E21‧‧‧rails
E3‧‧‧ stage
E31‧‧‧rails
E4‧‧‧ drive parts
E5‧‧‧Resident
E51‧‧‧ linkages
E52‧‧‧ air pressure seat
E53‧‧‧ stomata
E54‧‧‧Support
E55‧‧‧ gas zone
E56‧‧‧ contour edge
F‧‧‧Second auxiliary institution
F1‧‧‧ pedestal
F2‧‧‧ seat
F21‧‧‧rails
F3‧‧‧ stage
F31‧‧‧rails
F4‧‧‧ drive parts
F41‧‧‧ screw
F5‧‧‧Resident
F51‧‧‧ linkages
F52‧‧‧ air pressure seat
F53‧‧‧ nozzle
G‧‧‧Transportation agency
G1‧‧‧Loading rail seat
G11‧‧‧Transfer track
G12‧‧‧ Transfer seat
G121‧‧‧ fixed seat
G122‧‧‧ drive parts
G123‧‧‧rails
G124‧‧‧ slide
G125‧‧‧ Fixing frame
G2‧‧‧ affixing agency
G21‧‧‧Touch components
G211‧‧‧ Ontology
G212‧‧‧Resistance shaft
G213‧‧‧ Connections
G214‧‧‧Pressure mould
G2141‧‧‧ adsorption seat
G2142‧‧‧Resist
G2143‧‧‧Adsorption surface
G2144‧‧‧ Cavitation
G2145‧‧‧ rib
G2146‧‧‧ stomata
G2147‧‧‧Contact surface
G215‧‧‧temperature control components
G22‧‧‧ bearing seat
G221‧‧‧rails
G222‧‧‧ frame
G223‧‧‧上固定座
G224‧‧‧ lower seat
G23‧‧‧Rotating components
G231‧‧‧ axle wheel
G232‧‧‧ drive parts
G233‧‧‧Leather belt
G24‧‧‧ Pressure measuring components
G241‧‧‧Load weight measuring component
G25‧‧‧Adjustment components
G251‧‧‧ mask frame
G252‧‧‧ fine tuning components
G3‧‧‧ tape mechanism
G31‧‧‧Reel pulley
G311‧‧‧ drive parts
G32‧‧‧ reel round
G321‧‧‧ drive parts
G33‧‧‧ tape detection component
G34‧‧‧ Tape
G35‧‧‧Transport wheel set
G351‧‧‧ Idler
G4‧‧‧First inspection unit
G5‧‧‧Compression mechanism
G51‧‧‧First drive assembly
G511‧‧‧ fixed seat
G512‧‧‧ track
G513‧‧‧ slide
G514‧‧‧First drive
G52‧‧‧Second drive assembly
G521‧‧‧ fixed seat
G522‧‧‧ Track
G523‧‧‧ seat
G524‧‧‧Second slide
G525‧‧‧压座
G526‧‧‧压模模
G527‧‧‧second drive
H‧‧‧Second inspection unit

FIG. 1 is a perspective exploded view showing the first and second component bonding relationships in the embodiment of the present invention. 2 is a perspective exploded view of the first disk assembly in the embodiment of the present invention. 3 is a perspective exploded view of a second disk assembly in an embodiment of the present invention. 4 is a perspective view showing the configuration of each mechanism in the embodiment of the present invention. Figure 5 is a left side view of the X-axis of Figure 4 in an embodiment of the present invention. FIG. 6 is a perspective exploded view of the first carrier in the embodiment of the present invention. FIG. 7 is a perspective exploded view showing the correspondence between the first carrier, the first disk assembly, and the first auxiliary mechanism in the embodiment of the present invention. Figure 8 is a perspective view of the first auxiliary mechanism in the embodiment of the present invention. Figure 9 is a schematic view of the first auxiliary mechanism in the embodiment of the present invention. FIG. 10 is a schematic view showing the distribution of each of the embedded holes in the insert below the seat of the first carrier in the embodiment of the present invention. FIG. 11 is a schematic view showing the pin-shaped linking member of the first auxiliary mechanism embedded in the inserting hole of the inserting seat of the first loading seat facing downward according to the embodiment of the present invention. Figure 12 is a schematic view of a second auxiliary mechanism in the embodiment of the present invention. FIG. 13 is a perspective exploded view showing the correspondence relationship between the second carrier, the second disk assembly, and the second auxiliary mechanism in the embodiment of the present invention. FIG. 14 is a schematic view showing the insertion hole of the second auxiliary mechanism in which the pin-shaped linking member is embedded in the lower seat of the second carrier and having the opening facing downward. Figure 15 is a schematic view showing the arrangement of the respective holes in the insert below the seat of the second carrier in the embodiment of the present invention. 16 is a perspective exploded view showing the structural relationship between the bonding mechanism, the tape mechanism, and the first inspection unit in the embodiment of the present invention. Figure 17 is a front elevational view showing the construction relationship of the bonding mechanism, the tape mechanism, and the first inspection unit in the embodiment of the present invention. 18 is a schematic view showing the structural relationship of the pressing film-fit tape corresponding to the first member of the bonding mechanism in the embodiment of the present invention. Fig. 19 is a perspective view showing the structural relationship of the pressure-sensitive adhesive tape of the bonding mechanism in the embodiment of the present invention. Figure 20 is a perspective exploded view of the pressing mechanism in the embodiment of the present invention. FIG. 21 is a schematic view showing the shifting mechanism of the transfer mechanism shifting the bonding mechanism, the tape mechanism, and the first inspection unit to the upper portion of the first disk assembly according to the embodiment of the present invention. Figure 22 is a partially enlarged cross-sectional view showing the pressure-sensitive film interlocking tape of the bonding mechanism corresponding to the upper portion of the first member on the release film in the embodiment of the present invention. Figure 23 is a partially enlarged cross-sectional view showing the portion of the pressure-sensitive film interlocking tape of the bonding mechanism corresponding to the lower portion of the film in the embodiment of the present invention. Figure 24 is a partially enlarged cross-sectional view showing the portion of the pressure-sensitive adhesive film of the bonding mechanism adhered to the first member from the release film in the embodiment of the present invention. FIG. 25 is a schematic view showing the shifting mechanism of the transfer mechanism shifting the bonding mechanism, the tape mechanism, and the first inspection unit to the top of the second inspection unit according to the embodiment of the present invention. Figure 26 is a partially enlarged cross-sectional view showing the portion of the pressure-sensitive adhesive film of the bonding mechanism adhered to the upper portion of the second inspection unit. FIG. 27 is a schematic view showing the shifting mechanism of the transfer mechanism shifting the bonding mechanism, the tape mechanism, and the first inspection unit to the upper portion of the second disk assembly according to the embodiment of the present invention. Figure 28 is a partially enlarged cross-sectional view showing the portion of the pressure-sensitive adhesive film of the bonding mechanism adhered to the first member above the second member in the embodiment of the present invention. Figure 29 is a partially enlarged cross-sectional view showing the bonding of the pressure-sensitive adhesive film of the bonding mechanism to the second component in the embodiment of the present invention. FIG. 30 is a partially enlarged cross-sectional view showing the pressure-sensitive film interlocking tape of the bonding mechanism being attached to the second component after the bonding film of the bonding mechanism adheres to the second component in the embodiment of the present invention. 31 is a schematic view showing the pressing operation of the pressing mechanism in the embodiment of the present invention, and the transfer seat of the transfer mechanism displaces the bonding mechanism, the tape mechanism, and the first inspection unit to the upper portion of the first disk assembly.

Claims (11)

A disc assembly includes a first carrier and a first cover, the first cover is disposed on the first carrier; the disk assembly is disposed in a plurality of matrixes for processing a first component to be processed among them. The disk assembly of claim 1, wherein the first carrier is provided with a working area, and the working area is formed with a plurality of hollow working sections juxtaposed in the X-axis direction, and ribs are arranged between the two working sections. unit. The disc assembly of claim 1, wherein the first cover disc is provided with a plurality of hollow sections juxtaposed in the X-axis direction, and each of the hollow sections is separated by an interval corresponding to the operation area of the first component. . The disk assembly of claim 3, wherein each of the barrier ribs respectively forms a disconnected portion to communicate the two operating intervals. The disk assembly of claim 1, wherein the first carrier is located on the upper surface of the working area, and the plurality of magnetic members are respectively disposed on two outer sides of the working sections, and the first cover plate is metal. The material can be adsorbed by the magnetic members. The disc assembly of claim 1, wherein the first member is adhered to a release film on a lower side of the adhesive portion having the adhesive. The disk assembly of claim 6, wherein the peripheral surface of the release film is provided with a positioning hole, and the release film is placed on the first carrier and is positioned on the peripheral surface of the release film. The positioning is obtained by nesting a corresponding pivot pin on the first carrier. A device for transporting a disk assembly for transporting a disk assembly including a first carrier disk and a first cover disk, the first cover disk being overlaid on the first carrier disk; the disk assembly being provided for a first to be processed The components are arranged in a plurality of matrix arrangements; the disk assembly is transported by a first carrier of a transport mechanism, the first carrier is disposed parallel to a first transport rail and disposed adjacent to the first transport rail, and the other The long side of the side is unsupported to suspend the first carrier below. A method for extracting components from a disk assembly for extracting a first component from a disk assembly including a first carrier disk and a first cover disk, the first cover disk being overlaid on the first carrier disk; The first component to be processed is placed in a plurality of matrixes; the first component is adhered to a release mold disposed in the disk assembly by a bonding portion having an adhesive; The upper surface of the bonding portion of the first component to be extracted extracts the first component, and adsorbs the lower surface of the film under negative pressure, so that the release film is reversely displaced relative to the bonding portion of the first component, and The first component is extracted. The method of extracting an element from a disk assembly according to claim 1, wherein the negative pressure adsorption is performed on a release film other than the bonding portion of the extracted first element, and the positive pressure gas is passed through the release film. The corresponding one through hole is blown to the bonding portion of the first element, and the bonding portion is detached from the release film and extracted. An apparatus for extracting an element from a disk assembly, comprising: means for performing the method of extracting an element from the disk assembly according to any one of claims 9 to 10.