TWI567012B - The component transfer mechanism of the fitting process - Google Patents

The component transfer mechanism of the fitting process Download PDF

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Publication number
TWI567012B
TWI567012B TW105118718A TW105118718A TWI567012B TW I567012 B TWI567012 B TW I567012B TW 105118718 A TW105118718 A TW 105118718A TW 105118718 A TW105118718 A TW 105118718A TW I567012 B TWI567012 B TW I567012B
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TW
Taiwan
Prior art keywords
component
seat
bonding
tape
transfer
Prior art date
Application number
TW105118718A
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Chinese (zh)
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TW201742805A (en
Inventor
Pin-Chun Fang
Sheng-Xin Dong
Original Assignee
All Ring Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by All Ring Tech Co Ltd filed Critical All Ring Tech Co Ltd
Priority to TW105118718A priority Critical patent/TWI567012B/en
Priority to CN201610504214.1A priority patent/CN107517543B/en
Application granted granted Critical
Publication of TWI567012B publication Critical patent/TWI567012B/en
Publication of TW201742805A publication Critical patent/TW201742805A/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Automatic Assembly (AREA)

Description

貼合製程之元件移載機構 Component transfer mechanism

本發明係有關於一種移載機構,尤指一種撓性基板之電子元件與一載體貼合製程中用來移載待貼合元件的貼合製程之元件移載機構。 The invention relates to a transfer mechanism, in particular to an element transfer mechanism for a bonding process for transferring an electronic component of a flexible substrate and a carrier bonding process.

按,一般電子元件的種類廣泛,然基於必要的需求常有將二種以上的電子元件結合者,例如撓性基板(FlexFble substrate,又稱軟性印刷電路板FPC)與一載體的貼合,此種撓性基板之電子元件與一載體貼合的方法,先前技術中所採用者包括以熱源進行壓合的方式,以及以黏膠進行貼合的方式,茲以黏膠進行貼合的方式為例,先前技術通常採用人工逐一取用撓性基板將其逐一覆設於欲貼合其上的載體,再於貼合後予以敷平,以確定黏貼定位。 According to the general variety of electronic components, it is often necessary to combine two or more electronic components, such as a flexible substrate (FlexFble substrate, also referred to as a flexible printed circuit board FPC), with a carrier. A method of bonding an electronic component of a flexible substrate to a carrier, and the method used in the prior art includes a method of pressing by a heat source and a method of bonding with a glue, and the method of bonding with the adhesive is For example, in the prior art, the flexible substrate is manually applied one by one to cover the carrier to be attached one by one, and then flattened after bonding to determine the adhesive positioning.

該先前技術僅適用於少量的貼合作業,對於大量的撓性基板貼合除將耗用龐大的人力資源,對於貼合的品質亦構成疑慮,而由於時下智慧型手機盛行,其量大且輕薄短小、功能強的屬性,使撓性基板的面積更微小,其上的電子線路佈設亦3D化,已不再僅是單純的2D線路佈設,故其黏覆在載體的位置精確性要求更高,產能效率的提昇與產品品質的穩定性要求亦日益嚴苛,加上人工成本逐日攀昇,實不容再以人工進行貼合作業;又為解決在以自動化方式進行黏貼撓性基板在一載體的需求,撓性基板在一盛載之載盤中被提取及移載至盛載載體之載盤進行貼合的過程中,由於撓性基板為作貼合而在一側具有黏性,致困難直接提取、移載,且撓 性基板在提取時的定位及貼合在載體時的定位,為求充份取準、貼牢及貼準,實有必要針對撓性基板如何進行移載之機構提出有效的克服方案。 This prior art is only applicable to a small number of bonding industries. In addition to consuming a large amount of human resources for a large number of flexible substrates, it also poses doubts about the quality of the bonding, and because of the popularity of smart phones, the amount is large. The light, short, and powerful properties make the area of the flexible substrate smaller, and the electronic circuit layout on the 3D circuit is no longer just a simple 2D circuit layout, so the positional accuracy of the carrier is required. Higher, the improvement of production efficiency and the stability of product quality are becoming more and more demanding. In addition, the labor cost is rising day by day, and it is no longer possible to manually carry out the cooperation. In order to solve the problem of adhesively bonding the flexible substrate in an automated way The need for the carrier, the flexible substrate is extracted and transferred to the carrier carrying the carrier in a loaded carrier for bonding, and the flexible substrate is viscous on one side for bonding. Difficult to directly extract, transfer, and scratch The positioning of the substrate during the extraction and the positioning when it is attached to the carrier is an effective solution to the mechanism of how the flexible substrate is transferred in order to obtain sufficient accuracy, adhesion and alignment.

爰是,本發明的目的,在於提供一種使撓性基板元件可作有效率移載的貼合製程之元件移載機構。 Accordingly, it is an object of the present invention to provide a component transfer mechanism for a bonding process in which a flexible substrate component can be efficiently transferred.

依據本發明目的之貼合製程之元件移載機構,包括:一移載軌座,其上設有移載軌道,移載軌道上設有移載座,移載座上設有一貼合機構及一膠帶機構,貼合機構可連動膠帶機構所提供的膠帶黏附一第一元件並進行移載。 The component transfer mechanism of the bonding process according to the object of the present invention comprises: a transfer rail seat having a transfer track thereon, a transfer carrier on the transfer track, and a bonding mechanism on the transfer seat and A tape mechanism, the bonding mechanism can be attached to the tape provided by the tape mechanism to adhere a first component and transfer.

本發明實施例之貼合製程之元件移載機構,由於撓性基板之第一元件於第一傳送流路之第一軌座所傳送的第一載座上第一盤組件的離形膜上供提取,提取時採用移載機構中貼合機構抵壓模凸設的抵貼座下方膠帶黏附第一元件之貼合部位,並在提取時以第一盤組件下方第一輔助機構的抵座自與該貼合部位對應的氣壓座上氣孔提供正壓氣體進行吹氣,使正壓氣體經離形膜上對應的貫通孔對第一元件的貼合部位噴吹,以幫助貼合部位與膠帶黏附並被自離形膜脫離提取,並對應該正進行提取的第一元件之貼合部位下氣壓座以外的其它氣壓座上之氣孔提供負壓,使負壓漫佈各凹設之氣區吸附離形膜下表面,使在進行提取時,離形膜被呈與第一元件之貼合部位作反向相對位移,可協助二者分離並避免離形膜被上移中的膠帶黏附隆起;而貼合時第一元件被貼合機構抵壓模凸設的抵貼座下方膠帶黏附搬送於第二傳送流路之第二軌座所傳送的第二載座上第二盤組件的第二元件上,在第一元件之貼合部位完成貼合於第二元件上欲作脫離時,以第二輔助機構上抵座之氣壓座上吸嘴提供負壓吸力,使第二元件下方受到吸附,使膠帶自與第一元件的貼合部位黏附狀態脫離時,第二元件被呈與膠帶作反向相對位移,以協助膠帶與第一元件的貼合部位分離;且經第 一、二、三對位檢測步驟配合第一、二輔助機構上抵座可與第一、二載座連動,使其可作不同位置之二點取樣檢測以獲得精準對位;並在壓合步驟之壓抵座下端夾設的撓性材質構成的壓抵模對已完成貼合之第一元件的貼合部位上表面進行壓抵,使第一元件的貼合部位與第二元件充份貼合,故縱使撓性基板極微細,移載機構對將撓性基板移載與另一載體間貼合,可採自動化具效率而精確的進行。 In the component transfer mechanism of the bonding process of the embodiment of the present invention, the first component of the flexible substrate is on the release film of the first disk assembly on the first carrier conveyed by the first rail of the first transfer flow path. For the extraction and extraction, the bonding part of the abutting seat protruding from the pressing mechanism in the transfer mechanism is used to adhere the bonding part of the first component, and the first auxiliary mechanism is seated under the first disk assembly during the extraction. Positive air gas is supplied from the air hole corresponding to the bonding portion to supply a positive pressure gas, and the positive pressure gas is blown through the corresponding through hole on the release film to the bonding portion of the first element to help the bonding portion and The tape adheres and is extracted from the release film, and provides a negative pressure to the air holes on the air pressure seat other than the air pressure seat at the bonding portion of the first component that should be extracted, so that the negative pressure spreads the concave gas. The area adsorbs the lower surface of the release film, so that when the extraction is performed, the release film is reversely displaced relative to the bonding portion of the first member, which can assist the separation of the two and prevent the release film from being adhered by the upwardly moving tape. Uplift; the first component is attached to the machine when it is fitted The tape under the abutting seat of the pressing die is adhered to the second component of the second disk assembly on the second carrier conveyed by the second rail seat of the second conveying flow path, and the bonding portion of the first component When the fitting is completed on the second component, the suction nozzle is provided on the air pressure seat on the second auxiliary mechanism to provide a vacuum suction force, so that the second component is adsorbed under the second component, and the tape is bonded to the first component. When the part adhesion state is detached, the second component is reversely displaced relative to the tape to assist in separating the adhesive tape from the bonding portion of the first component; The first, second and third alignment detection steps cooperate with the first and second auxiliary mechanisms to be coupled with the first and second carriers, so that they can be used for two-point sampling detection at different positions to obtain accurate alignment; The pressing mold formed by the flexible material interposed between the lower end of the step is pressed against the upper surface of the bonding portion of the first component that has been bonded, so that the bonding portion of the first component and the second component are fully charged. Since the flexible substrate is extremely fine, the transfer mechanism can transfer the flexible substrate to the other carrier, and the automated tool can be efficiently and accurately performed.

A‧‧‧第一元件 A‧‧‧ first component

A1‧‧‧貼合部位 A1‧‧‧Fitting parts

A2‧‧‧非貼合部位 A2‧‧‧ non-adhesive parts

A3‧‧‧離形膜 A3‧‧‧Folding film

A31‧‧‧定位孔 A31‧‧‧Positioning holes

A32‧‧‧貫通孔 A32‧‧‧through hole

A4‧‧‧第一載盤 A4‧‧‧first carrier

A41‧‧‧樞銷 A41‧‧‧ pivot

A42‧‧‧工作區 A42‧‧‧Workspace

A421‧‧‧工作區間 A421‧‧‧Working area

A422‧‧‧肋部 A422‧‧‧ ribs

A423‧‧‧磁吸件 A423‧‧‧Magnetic parts

A43‧‧‧扣抵緣 A43‧‧‧ buckle

A5‧‧‧第一蓋盤 A5‧‧‧First cover

A51‧‧‧定位凹穴 A51‧‧‧ positioning pocket

A52‧‧‧鏤空區間 A52‧‧‧ Short-term interval

A521‧‧‧隔肋 A521‧‧‧ ribs

A522‧‧‧操作區間 A522‧‧‧Operation interval

A523‧‧‧斷開部位 A523‧‧‧Disconnection

AA‧‧‧第一盤組件 AA‧‧‧ first disk assembly

B‧‧‧第二元件 B‧‧‧Second component

B1‧‧‧第二載盤 B1‧‧‧second carrier

B11‧‧‧工作區 B11‧‧‧Workspace

B12‧‧‧操作孔 B12‧‧‧Operation hole

B121‧‧‧定位部 B121‧‧‧ Positioning Department

B13‧‧‧扣抵緣 B13‧‧‧ buckle

B14‧‧‧樞銷 B14‧‧‧ pivot

B15‧‧‧磁吸件 B15‧‧‧Magnetic parts

B2‧‧‧第二蓋盤 B2‧‧‧Second cover

B21‧‧‧定位凹穴 B21‧‧‧ positioning pocket

B22‧‧‧鏤空區間 B22‧‧‧Sketch interval

B221‧‧‧隔肋 B221‧‧‧ ribs

B222‧‧‧肋段 B222‧‧‧ rib section

BB‧‧‧第二盤組件 BB‧‧‧second disk assembly

C‧‧‧機台 C‧‧‧ machine

C1‧‧‧機台台面 C1‧‧‧ machine table

C2‧‧‧工作區間 C2‧‧‧ working area

C3‧‧‧側座 C3‧‧‧ side seat

D‧‧‧輸送機構 D‧‧‧Transportation agency

D1‧‧‧第一軌座 D1‧‧‧First rail seat

D11‧‧‧第一輸送滑軌 D11‧‧‧First conveyor rail

D111‧‧‧滑座 D111‧‧‧ slide

D12‧‧‧第一載座 D12‧‧‧ first carrier

D121‧‧‧底座 D121‧‧‧Base

D1211‧‧‧第一移行區間 D1211‧‧‧First transition interval

D1212‧‧‧長側邊 D1212‧‧‧ long side

D122‧‧‧置座 D122‧‧‧Seat

D1221‧‧‧第二移行區間 D1221‧‧‧Second transition interval

D1222‧‧‧間隔部 D1222‧‧‧Interval

D1223‧‧‧置盤空間 D1223‧‧‧Set space

D1224‧‧‧定位銷 D1224‧‧ Locating pin

D1225‧‧‧靠座 D1225‧‧‧ seat

D1226‧‧‧嵌座 D1226‧‧‧ nesting

D1227‧‧‧嵌孔 D1227‧‧‧ hole

D123‧‧‧夾扣機構 D123‧‧‧ Clip mechanism

D1231‧‧‧夾扣組件 D1231‧‧‧ clip assembly

D12311‧‧‧座臂 D12311‧‧‧ Arm

D12312‧‧‧夾臂 D12312‧‧‧ clip arm

D12313‧‧‧嵌體 D12313‧‧ Inlay

D12314‧‧‧嵌體 D12314‧‧ Inlay

D12315‧‧‧長槽孔 D12315‧‧‧Long slot

D12316‧‧‧固定件 D12316‧‧‧Fixed parts

D12317‧‧‧固定座 D12317‧‧‧ Fixed seat

D12318‧‧‧驅動件 D12318‧‧‧ drive parts

D12319‧‧‧驅動件 D12319‧‧‧ drive parts

D12320‧‧‧驅動桿 D12320‧‧‧ drive rod

D2‧‧‧第二軌座 D2‧‧‧Second rail seat

D21‧‧‧第二輸送滑軌 D21‧‧‧Second transport rail

D22‧‧‧第二載座 D22‧‧‧Second carrier

D221‧‧‧底座 D221‧‧‧Base

D2211‧‧‧第一移行區間 D2211‧‧‧First transition interval

D222‧‧‧置座 D222‧‧‧Seat

D2221‧‧‧第二移行區間 D2221‧‧‧Second transition interval

D2222‧‧‧嵌座 D2222‧‧‧ nesting

D2223‧‧‧嵌孔 D2223‧‧‧ hole

E‧‧‧第一輔助機構 E‧‧‧First Auxiliary Agency

E1‧‧‧台座 E1‧‧‧ pedestal

E2‧‧‧立座 E2‧‧‧ seat

E21‧‧‧滑軌 E21‧‧‧rails

E3‧‧‧載台 E3‧‧‧ stage

E31‧‧‧滑軌 E31‧‧‧rails

E4‧‧‧驅動件 E4‧‧‧ drive parts

E5‧‧‧抵座 E5‧‧‧Resident

E51‧‧‧連動件 E51‧‧‧ linkages

E52‧‧‧氣壓座 E52‧‧‧ air pressure seat

E53‧‧‧氣孔 E53‧‧‧ stomata

E54‧‧‧支撐部 E54‧‧‧Support

E55‧‧‧氣區 E55‧‧‧ gas zone

E56‧‧‧輪廓緣 E56‧‧‧ contour edge

F‧‧‧第二輔助機構 F‧‧‧Second auxiliary institution

F1‧‧‧台座 F1‧‧‧ pedestal

F2‧‧‧立座 F2‧‧‧ seat

F21‧‧‧滑軌 F21‧‧‧rails

F3‧‧‧載台 F3‧‧‧ stage

F31‧‧‧滑軌 F31‧‧‧rails

F4‧‧‧驅動件 F4‧‧‧ drive parts

F41‧‧‧螺桿 F41‧‧‧ screw

F5‧‧‧抵座 F5‧‧‧Resident

F51‧‧‧連動件 F51‧‧‧ linkages

F52‧‧‧氣壓座 F52‧‧‧ air pressure seat

F53‧‧‧吸嘴 F53‧‧‧ nozzle

G‧‧‧移載機構 G‧‧‧Transportation agency

G1‧‧‧移載軌座 G1‧‧‧Loading rail seat

G11‧‧‧移載軌道 G11‧‧‧Transfer track

G12‧‧‧移載座 G12‧‧‧ Transfer seat

G121‧‧‧固定座 G121‧‧‧ fixed seat

G122‧‧‧驅動件 G122‧‧‧ drive parts

G123‧‧‧滑軌 G123‧‧‧rails

G124‧‧‧滑座 G124‧‧‧ slide

G125‧‧‧固定架 G125‧‧‧ Fixing frame

G2‧‧‧貼合機構 G2‧‧‧ affixing agency

G21‧‧‧觸壓組件 G21‧‧‧Touch components

G211‧‧‧本體 G211‧‧‧ Ontology

G212‧‧‧抵壓軸 G212‧‧‧Resistance shaft

G213‧‧‧聯結件 G213‧‧‧ Connections

G214‧‧‧抵壓模 G214‧‧‧Pressure mould

G2141‧‧‧吸附座 G2141‧‧‧ adsorption seat

G2142‧‧‧抵貼座 G2142‧‧‧Resist

G2143‧‧‧吸附面 G2143‧‧‧Adsorption surface

G2144‧‧‧氣穴 G2144‧‧‧ Cavitation

G2145‧‧‧凸肋 G2145‧‧‧ rib

G2146‧‧‧氣孔 G2146‧‧‧ stomata

G2147‧‧‧貼觸面 G2147‧‧‧Contact surface

G215‧‧‧溫控元件 G215‧‧‧temperature control components

G22‧‧‧承載座 G22‧‧‧ bearing seat

G221‧‧‧滑軌 G221‧‧‧rails

G222‧‧‧框座 G222‧‧‧ frame

G223‧‧‧上固定座 G223‧‧‧上固定座

G224‧‧‧下固定座 G224‧‧‧ lower seat

G23‧‧‧旋轉組件 G23‧‧‧Rotating components

G231‧‧‧軸輪 G231‧‧‧ axle wheel

G232‧‧‧驅動件 G232‧‧‧ drive parts

G233‧‧‧皮帶 G233‧‧‧Leather belt

G24‧‧‧測壓組件 G24‧‧‧ Pressure measuring components

G241‧‧‧荷重量測元件 G241‧‧‧Load weight measuring component

G25‧‧‧調整組件 G25‧‧‧Adjustment components

G251‧‧‧罩架 G251‧‧‧ mask frame

G252‧‧‧微調元件 G252‧‧‧ fine tuning components

G3‧‧‧膠帶機構 G3‧‧‧ tape mechanism

G31‧‧‧捲帶輪 G31‧‧‧Reel pulley

G311‧‧‧驅動件 G311‧‧‧ drive parts

G32‧‧‧捲收輪 G32‧‧‧ reel round

G321‧‧‧驅動件 G321‧‧‧ drive parts

G33‧‧‧膠帶偵測元件 G33‧‧‧ tape detection component

G34‧‧‧膠帶 G34‧‧‧ Tape

G35‧‧‧傳輸輪組 G35‧‧‧Transport wheel set

G351‧‧‧惰輪 G351‧‧‧ Idler

G4‧‧‧第一檢視單元 G4‧‧‧First inspection unit

G5‧‧‧壓合機構 G5‧‧‧Compression mechanism

G51‧‧‧第一驅動組件 G51‧‧‧First drive assembly

G511‧‧‧固定座 G511‧‧‧ fixed seat

G512‧‧‧軌道 G512‧‧‧ track

G513‧‧‧滑座 G513‧‧‧ slide

G514‧‧‧第一驅動件 G514‧‧‧First drive

G52‧‧‧第二驅動組件 G52‧‧‧Second drive assembly

G521‧‧‧固定座 G521‧‧‧ fixed seat

G522‧‧‧軌道 G522‧‧‧ Track

G523‧‧‧承座 G523‧‧‧ seat

G524‧‧‧第二滑座 G524‧‧‧Second slide

G525‧‧‧壓抵座 G525‧‧‧压座

G526‧‧‧壓抵模 G526‧‧‧压模模

G527‧‧‧第二驅動件 G527‧‧‧second drive

H‧‧‧第二檢視單元 H‧‧‧Second inspection unit

圖1係本發明實施例中第一、二元件貼合關係之立體分解示意圖。 FIG. 1 is a perspective exploded view showing the first and second component bonding relationships in the embodiment of the present invention.

圖2係本發明實施例中第一盤組件之立體分解示意圖。 2 is a perspective exploded view of the first disk assembly in the embodiment of the present invention.

圖3係本發明實施例中第二盤組件之立體分解示意圖。 3 is a perspective exploded view of a second disk assembly in an embodiment of the present invention.

圖4係本發明實施例中各機構配置之立體示意圖。 4 is a perspective view showing the configuration of each mechanism in the embodiment of the present invention.

圖5係本發明實施例中圖4中X軸向之左側視圖。 Figure 5 is a left side view of the X-axis of Figure 4 in an embodiment of the present invention.

圖6係本發明實施例中第一載座之立體分解示意圖。 FIG. 6 is a perspective exploded view of the first carrier in the embodiment of the present invention.

圖7係本發明實施例中第一載座、第一盤組件及第一輔助機構對應關係之立體分解示意圖。 FIG. 7 is a perspective exploded view showing the correspondence relationship between the first carrier, the first disk assembly, and the first auxiliary mechanism in the embodiment of the present invention.

圖8係本發明實施例中第一輔助機構之立體示意圖。 Figure 8 is a perspective view of the first auxiliary mechanism in the embodiment of the present invention.

圖9係本發明實施例中第一輔助機構上抵座之示意圖。 Figure 9 is a schematic view of the first auxiliary mechanism in the embodiment of the present invention.

圖10 係本發明實施例中各嵌孔在第一載座之置座下方嵌座上分佈之示意圖。 FIG. 10 is a schematic view showing the distribution of each of the embedded holes in the insert below the seat of the first carrier in the embodiment of the present invention.

圖11 係本發明實施例中第一輔助機構的銷狀連動件嵌入第一載座之置座下方嵌座所設開口朝下的嵌孔之示意圖。 FIG. 11 is a schematic view showing the pin-shaped linking member of the first auxiliary mechanism embedded in the inserting hole of the inserting seat of the first loading seat facing downward according to the embodiment of the present invention.

圖12 係本發明實施例中第二輔助機構之示意圖。 Figure 12 is a schematic view of a second auxiliary mechanism in the embodiment of the present invention.

圖13 係本發明實施例中第二載座、第二盤組件及第二輔助機構對應關係之立體分解示意圖。 FIG. 13 is a perspective exploded view showing the correspondence relationship between the second carrier, the second disk assembly, and the second auxiliary mechanism in the embodiment of the present invention.

圖14 係本發明實施例中第二輔助機構的銷狀連動件嵌入第二載座之置座下方嵌座所設開口朝下的嵌孔之示意圖。 FIG. 14 is a schematic view showing the insertion hole of the second auxiliary mechanism in which the pin-shaped linking member is embedded in the lower seat of the second carrier and having the opening facing downward.

圖15係本發明實施例中各嵌孔在第二載座之置座下方嵌座上分佈之示意圖。 Figure 15 is a schematic view showing the arrangement of the respective holes in the insert below the seat of the second carrier in the embodiment of the present invention.

圖16係本發明實施例中貼合機構、膠帶機構及第一檢視單元構造關係立體分解示意圖。 16 is a perspective exploded view showing the structural relationship between the bonding mechanism, the tape mechanism, and the first inspection unit in the embodiment of the present invention.

圖17係本發明實施例中貼合機構、膠帶機構及第一檢視單元構造關係正視圖。 Figure 17 is a front elevational view showing the construction relationship of the bonding mechanism, the tape mechanism, and the first inspection unit in the embodiment of the present invention.

圖18係本發明實施例中貼合機構之抵壓膜配合膠帶對應第一元件之構造關係示意圖。 18 is a schematic view showing the structural relationship of the pressing film-fit tape corresponding to the first member of the bonding mechanism in the embodiment of the present invention.

圖19係本發明實施例中貼合機構之抵壓膜吸附膠帶之構造關係立體示意圖。 Fig. 19 is a perspective view showing the structural relationship of the pressure-sensitive adhesive tape of the bonding mechanism in the embodiment of the present invention.

圖20係本發明實施例中壓合機構之立體分解示意圖。 Figure 20 is a perspective exploded view of the pressing mechanism in the embodiment of the present invention.

圖21係本發明實施例中移載機構之移載座將貼合機構、膠帶機構及第一檢視單元位移至第一盤組件上方之示意圖。 FIG. 21 is a schematic view showing the shifting mechanism of the transfer mechanism shifting the bonding mechanism, the tape mechanism, and the first inspection unit to the upper portion of the first disk assembly according to the embodiment of the present invention.

圖22係本發明實施例中貼合機構之抵壓膜連動膠帶對應位於離形膜上第一元件上方之部份剖面放大示意圖。 Figure 22 is a partially enlarged cross-sectional view showing the pressure-sensitive film interlocking tape of the bonding mechanism corresponding to the upper portion of the first member on the release film in the embodiment of the present invention.

圖23係本發明實施例中貼合機構之抵壓膜連動膠帶對應下抵離形膜上第一元件之部份剖面放大示意圖。 Figure 23 is a partially enlarged cross-sectional view showing the portion of the pressure-sensitive film interlocking tape of the bonding mechanism corresponding to the lower portion of the film in the embodiment of the present invention.

圖24係本發明實施例中貼合機構之抵壓膜連動膠帶黏附第一元件脫離離形膜之部份剖面放大示意圖。 Figure 24 is a partially enlarged cross-sectional view showing the portion of the pressure-sensitive adhesive film of the bonding mechanism adhered to the first member from the release film in the embodiment of the present invention.

圖25係本發明實施例中移載機構之移載座將貼合機構、膠帶機構及第一檢視單元位移至第二檢視單元上方之示意圖。 FIG. 25 is a schematic view showing the shifting mechanism of the transfer mechanism shifting the bonding mechanism, the tape mechanism, and the first inspection unit to the top of the second inspection unit according to the embodiment of the present invention.

圖26係本發明實施例中貼合機構之抵壓膜連動膠帶黏附第一元件位移至第二檢視單元上方之部份剖面放大示意圖。 Figure 26 is a partially enlarged cross-sectional view showing the portion of the pressure-sensitive adhesive film of the bonding mechanism adhered to the upper portion of the second inspection unit.

圖27係本發明實施例中移載機構之移載座將貼合機構、膠帶機構及第一檢視單元位移至第二盤組件上方之示意圖。 FIG. 27 is a schematic view showing the shifting mechanism of the transfer mechanism shifting the bonding mechanism, the tape mechanism, and the first inspection unit to the upper portion of the second disk assembly according to the embodiment of the present invention.

圖28係本發明實施例中貼合機構之抵壓膜連動膠帶黏附第一元件位於第二元件上方之部份剖面放大示意圖。 Figure 28 is a partially enlarged cross-sectional view showing the portion of the pressure-sensitive adhesive film of the bonding mechanism adhered to the first member above the second member in the embodiment of the present invention.

圖29係本發明實施例中貼合機構之抵壓膜連動膠帶黏附第一元件貼合於第二元件之部份剖面放大示意圖。 Figure 29 is a partially enlarged cross-sectional view showing the bonding of the pressure-sensitive adhesive film of the bonding mechanism to the second component in the embodiment of the present invention.

圖30係本發明實施例中貼合機構之抵壓膜連動膠帶黏附第一元件貼合於第二元件後,貼合機構之抵壓膜連動膠帶上移之部份剖面放大示意圖。 FIG. 30 is a partially enlarged cross-sectional view showing the pressure-sensitive film interlocking tape of the bonding mechanism being attached to the second component after the bonding film of the bonding mechanism adheres to the second component in the embodiment of the present invention.

圖31係本發明實施例中壓合機構進行壓合操作,及移載機構之移載座將貼合機構、膠帶機構及第一檢視單元位移至第一盤組件上方之示意圖。 31 is a schematic view showing the pressing operation of the pressing mechanism in the embodiment of the present invention, and the transfer seat of the transfer mechanism displaces the bonding mechanism, the tape mechanism, and the first inspection unit to the upper portion of the first disk assembly.

請參閱圖1,本發明實施例以進行將撓性基板構成的第一元件A貼合在作為載體的第二元件B上預設定位的貼合加工為例,該待加工貼合之第一元件A包括下方塗覆有黏膠的貼合部位A1與下方未塗覆有黏膠的非貼合部位A2。 Referring to FIG. 1 , an embodiment of the present invention is directed to a bonding process in which a first component A formed of a flexible substrate is attached to a second component B as a carrier, and the first processing to be processed is taken as an example. The component A includes a bonding portion A1 under which the adhesive is applied and a non-bonding portion A2 not coated with the adhesive underneath.

請參閱圖2,第一元件A以具有黏膠的貼合部位A1下方側黏貼於一離形膜A3上並以複數個成矩陣排列,該非貼合部位A2則因未於下方塗覆黏膠而與離形膜A3呈分離狀態;該黏膠的黏性及離形膜A1的光滑表面可供第一元件A自離形膜A3上被提取;該離形膜A3周緣表面上設有定位孔A31,離形膜A3被置於一矩形的第一載盤A4受盛載,並以離形 膜A3周緣表面上定位孔A31恰嵌套於第一載盤A4上對應的樞銷A41而獲得定位,並於離形膜A3上方再覆設一第一蓋盤A5;第一載盤A4上設有一工作區A42,工作區A42上形成依X軸向併列的多個鏤空狀工作區間A421,兩工作區間A421之間設有肋部A422,並以肋部A422支撐於該離形膜A3下方;離形膜A3上矩陣排列的第一元件A以複數個作Y軸向間隔併列為一群組方式恰對應位該工作區間A421中的上方,離形膜A3的總輪闊面積大於各工作區間A421的總面積,並覆設於該工作區A42上;第一載盤A4矩形兩長側邊外近外側分別各設有一段高度較工作區A42上表面為低的扣抵緣A43;第一蓋盤A5的總輪闊面積小於第一載盤A4的總輪闊面積,並覆於工作區A42上且覆罩該離形膜A3,第一蓋盤A5上設有對應第一載盤A4上樞銷A41的定位凹穴A51,並設有對應各工作區間A421所形成的依X軸向併列的多個鏤空區間A52,每一鏤空區間A52中以隔肋A521區隔出數目對應下方離形膜A3上第一元件A數目及位置的操作區間A522,每一隔肋A521分別各形成一斷開部位A523使二操作區間A522相通;第一載盤A4上位於工作區A42上表面設有複數個磁吸件A423分別設於各工作區間A421相對應的兩外側,第一蓋盤A5為金屬材質,故第一蓋盤A5可受該等磁吸件A423所吸附而緊貼蓋覆第一載盤A4;所述貼有第一元件A的離形膜A3受定位於第一載盤A4與第一蓋盤A5間,其整體形成一第一盤組件AA。 Referring to FIG. 2, the first component A is adhered to a release film A3 on the lower side of the adhesive-attached portion A1 and arranged in a plurality of matrixes. The non-bonding portion A2 is not coated with adhesive underneath. And being separated from the release film A3; the viscosity of the adhesive and the smooth surface of the release film A1 are available for the first component A to be extracted from the release film A3; the peripheral surface of the release film A3 is provided with a positioning The hole A31, the release film A3 is placed on a rectangular first carrier A4, and is carried away. The positioning hole A31 on the peripheral surface of the film A3 is nested on the corresponding pivot pin A41 of the first carrier A4 to obtain the positioning, and a first cover disk A5 is further disposed above the release film A3; the first carrier A4 is placed on the first carrier A4 A working area A42 is formed, and a plurality of hollow working sections A421 arranged in the X-axis direction are formed on the working area A42, and ribs A422 are arranged between the two working sections A421, and are supported by the ribs A422 under the release film A3. The first element A arranged in a matrix on the release film A3 is arranged in a plurality of Y-axis intervals and arranged in a group to correspond to the upper portion of the working section A421, and the total wheel width of the release film A3 is larger than each work. The total area of the section A421 is overlaid on the working area A42; the outer side and the outer side of the rectangular side of the first carrier A4 are respectively provided with a buckle edge A43 having a lower height than the upper surface of the working area A42; The total wheel width of a cover plate A5 is smaller than the total wheel width of the first carrier A4, and covers the working area A42 and covers the release film A3. The first cover plate A5 is provided with a corresponding first carrier. The positioning pocket A51 of the A4 upper pivot pin A41 is provided with a plurality of hollow sections A corresponding to the X-axis direction formed by the respective working sections A421. 52, in each of the hollow sections A52, the partition section A521 is provided with an operation section A522 corresponding to the number and position of the first component A on the lower release film A3, and each of the barrier ribs A521 respectively forms a disconnection portion A523 to be two The first tray A4 is provided on the upper surface of the working area A42, and the plurality of magnetic parts A423 are respectively disposed on the outer sides of the working areas A421. The first cover plate A5 is made of metal, so the first The cover plate A5 is adsorbed by the magnetic members A423 to closely cover the first carrier A4; the release film A3 to which the first component A is attached is positioned on the first carrier A4 and the first cover disk A5 is integrally formed with a first disc assembly AA.

請參閱圖3,第二元件B以一側置設於一矩形的第二載盤B1上受盛載並以複數個成矩陣排列,該第二載盤B1上設有一工作區B11,工作區B11上設有複數個成矩陣排列的矩形操作孔B12,操作孔B12兩端各設有一微凹之定位部B121,該第二元件B跨置於該操作孔B12上方處並以兩端分別各置於該定位部B121上受定位,同一Y軸向間隔併列的第二 元件形成同一群組,第二載盤B1的第二元件B上方再覆設一第二蓋盤B2;第二蓋盤B2的總輪闊面積小於第二載盤B1的總輪闊面積,並覆設於該工作區B11上;第二載盤B1矩形兩長側邊外近外側分別各設有一段高度較工作區B11上表面為低的扣抵緣B13;第二蓋盤B2上設有對應第二載盤B1上樞銷B14的定位凹穴B21,並設有對應各操作孔B12所形成的多個鏤空區間B22,每一鏤空區間B22中設有隔肋B221及向鏤空區間B22凸伸的肋段B222,其對應位於第二載盤B1中盛載之第二元件B上方,而限制第二元件B脫離操作孔B12兩端之定位部B121;第二載盤B1上位於工作區B11上表面設有複數個磁吸件B15分別設於各操作孔B12佈設區域的相對應兩外側,第二蓋盤B2為金屬材質,故第二蓋盤B2可受該等磁吸件B15所吸附而緊貼蓋覆第一載盤A4;所述載有第二元件B的第一載盤A4受第一蓋盤A5覆蓋,其整體形成一第二盤組件BB。 Referring to FIG. 3, the second component B is mounted on a rectangular second carrier B1 and arranged in a plurality of matrixes. The second carrier B1 is provided with a working area B11. A plurality of rectangular operation holes B12 arranged in a matrix are arranged on the B11, and a dimple positioning portion B121 is disposed at each end of the operation hole B12, and the second element B is disposed above the operation hole B12 and respectively has two ends Positioned on the positioning portion B121, and the second side of the same Y-axis is juxtaposed The components are formed in the same group, and the second component B of the second carrier B1 is further covered with a second cover disk B2; the total width of the second cover disk B2 is smaller than the total wheel width of the second carrier B1, and The second loading tray B1 is provided with a buckle edge B13 having a lower height than the upper surface of the working area B11; and a second cover disk B2 is disposed on the outer side and the outer side of the rectangular side of the second carrier B1. Corresponding to the positioning pocket B21 of the pivot pin B14 of the second carrier B1, and a plurality of hollow sections B22 formed corresponding to the operation holes B12, each of the hollow sections B22 is provided with a rib B221 and convex to the hollow section B22. a rib section B222 extending corresponding to the second component B carried in the second carrier B1, and restricting the second component B from the positioning portion B121 at both ends of the operation hole B12; the second carrier B1 is located in the working area The upper surface of the B11 is provided with a plurality of magnetic members B15 respectively disposed on the opposite outer sides of the arrangement area of each operation hole B12, and the second cover disk B2 is made of a metal material, so that the second cover disk B2 can be received by the magnetic parts B15 Adsorbing and covering the first carrier A4; the first carrier A4 carrying the second component B is covered by the first cover A5, and its overall shape A second disc assembly BB.

請參閱圖4、5,本發明實施例可以如圖中所示之裝置來說明,包括:一機台C,其自機台台面C1中央向下凹陷形成一工作區間C2,使機台台面C1兩側較高而各形成一側座C3;一輸送機構D,設於該工作區間C2中,包括:呈Z軸向立設並相隔間距平行沿X軸向延伸之第一軌座D1、第二軌座D2;其中,該第一軌座D1朝機台C內的一側設有X軸向第一輸送滑軌D11,並於該第一輸送滑軌D11上設有一與第一輸送滑軌D11垂直,並可在其上被驅動而以水平方向設置進行滑動位移的第一載座D12,其位移的路徑提供一第一傳送流路,以搬送該圖2中第一盤組件AA;第一載座D12約略呈矩形態樣,其以一長側邊與第一輸送滑軌D11平行併靠設置,以提供穩定的傳輸,另一側之長側邊則不受支撐地使第一載座D12下方懸空設置;該第二軌座D2朝機 台C內的一側設有X軸向第二輸送滑軌D21,並於該第二輸送滑軌D21上設有一與第二輸送滑軌D21垂直,並可在其上被驅動而以水平方向設置進行滑動位移的第二載座D22,其位移的路徑提供一第二傳送流路,以搬送該圖3中的第二盤組件BB;第二載座D22約略呈矩形態樣,其以一長側邊與第二輸送滑軌D21平行併靠設置,以提供穩定的傳輸,另一側之長側邊則不受支撐地使第二載座D22下方懸空設置;一第一輔助機構E,設於該機台C凹陷的工作區間C2中,並在輸送機構D之第一輸送滑軌D11與第二輸送滑軌D21間,且為第一載座D12在第一輸送滑軌D11上滑移的路徑中的第一載座D12下方,一第二輔助機構F,設於該機台C凹陷的工作區間C2中,並在輸送機構D之第一輸送滑軌D11與第二輸送滑軌D21間,且為第二載座D22在第二輸送滑軌D21上滑移的路徑中的第二載座D22下方;一移載機構G,包括:一移載軌座G1,其兩端固設於機台C之兩側側座C3上,其上設有Y軸向之移載軌道G11,移載軌道G11上設有移載座G12,移載座G12上設有貼合機構G2、膠帶機構G3及第一檢視單元G4,可在移載軌道G11上位移於該輸送機構D之第一輸送滑軌D11上第一載座D12與第二輸送滑軌D21上第二載座D22間;該第一檢視單元G4可為一由上往下進行檢視之CCD鏡頭;移載軌道G11上位於朝第二軌座D2一側設有一壓合機構G5,所述移載座G12及壓合機構G5可分別被獨立驅動在移載軌道G11上位移;一第二檢視單元H,設於該機台C凹陷的工作區間C2中,並在第一輸送滑軌D11與第二輸送滑軌D21間,且為移載座G12上貼合機構G2自第一輸送滑軌D11上第一載座D12移至第二輸送滑軌D21上第二載座D22的路徑中,其可為一由下往上進行檢視之CCD鏡頭; 所述第一輔助機構E、第二輔助機構F、第二檢視單元H同在移載機構G中移載軌座G1上移載軌道G11所引導提供之直線移載路徑下方,亦為貼合機構G2可移經的路徑下方,其中,該第二檢視單元H、第一輔助機構E、第二輔助機構F在該移載路徑上之連線為一平行於該移載軌道G11之直線。 Referring to FIG. 4 and FIG. 5, the embodiment of the present invention can be illustrated by the apparatus shown in the figure, including: a machine C, which is recessed from the center of the machine table C1 to form a working section C2, so that the machine table C1 The two sides are higher and each form a side seat C3; a conveying mechanism D is disposed in the working section C2, and includes: a first rail seat D1 which is erected in the Z-axis direction and extends in parallel along the X-axis direction a second rail seat D2; wherein the first rail seat D1 is provided with an X-axis first transport rail D11 on a side in the machine C, and a first transport slide is arranged on the first transport rail D11. The rail D11 is vertical, and can be driven thereon to be disposed in a horizontal direction to perform a sliding displacement of the first carrier D12, the displacement path of which provides a first transport flow path for transporting the first disc assembly AA of FIG. 2; The first carrier D12 is approximately rectangular in shape, and is disposed in parallel with the first conveying rail D11 with a long side to provide stable transmission, and the long side of the other side is unsupported to make the first The bottom of the carrier D12 is suspended; the second rail D2 is facing the machine One side of the table C is provided with an X-axis second conveying rail D21, and the second conveying rail D21 is provided with a vertical perpendicular to the second conveying rail D21, and can be driven thereon in a horizontal direction. Providing a second carrier D22 for performing a sliding displacement, the path of the displacement providing a second conveying flow path for conveying the second disk assembly BB of FIG. 3; the second carrier D22 having a substantially rectangular shape, The long side is parallel to the second transport rail D21 and is disposed to provide stable transmission, and the long side of the other side is unsupported to be suspended below the second carrier D22; a first auxiliary mechanism E, It is disposed in the working section C2 of the recess of the machine C, and is between the first conveying rail D11 and the second conveying rail D21 of the conveying mechanism D, and is sliding on the first conveying rail D11 of the first carrier D12. Below the first carrier D12 in the moving path, a second auxiliary mechanism F is disposed in the recessed working section C2 of the machine C, and the first conveying rail D11 and the second conveying rail in the conveying mechanism D Between D21, and below the second carrier D22 in the path of the second carrier D22 sliding on the second transport rail D21; a transfer mechanism G The utility model comprises: a transfer rail seat G1, the two ends of which are fixed on the side seats C3 of the machine table C, and the Y-axis transfer rail G11 is arranged thereon, and the transfer rail G11 is provided with a transfer seat G12, the transfer base G12 is provided with a bonding mechanism G2, a tape mechanism G3 and a first inspection unit G4, which can be displaced on the transfer rail G11 on the first transport rail D11 of the transport mechanism D, the first carrier D12 Between the second carrier D22 and the second carrier D22; the first viewing unit G4 can be a CCD lens viewed from top to bottom; the transfer track G11 is located on the side of the second rail D2. The pressing mechanism G5, the transfer seat G12 and the pressing mechanism G5 can be independently driven to be displaced on the transfer track G11; a second inspection unit H is disposed in the working section C2 of the machine C recessed, and Between the first conveying rail D11 and the second conveying rail D21, and the bonding mechanism G2 on the shifting seat G12 is moved from the first carrier D12 on the first conveying rail D11 to the second conveying rail D21. In the path of the second carrier D22, it can be a CCD lens that is viewed from the bottom up; The first auxiliary mechanism E, the second auxiliary mechanism F, and the second inspection unit H are also disposed below the linear transfer path guided by the transfer rail G11 on the transfer rail base G1 in the transfer mechanism G. The path of the second inspection unit H, the first auxiliary mechanism E, and the second auxiliary mechanism F on the transfer path is a line parallel to the transfer track G11.

請參閱圖5、6,該輸送機構D之第一載座D12與第二載座D22構造大致相同,僅安裝時左右相反,茲以第一載座D12作說明:該第一載座D12包括:一底座D121,呈矩形框體狀而於內部設有一矩形鏤空之第一移行區間D1211;並以一側之長側邊D1212與第一輸送滑軌D11上滑座D111固設並受其連動;一置座D122,設於該底座D121上並呈矩形框體狀而於中央設有一矩形鏤空之第二移行區間D1221,第二移行區間D1221與底座D121的第一移行區間D1211對應並相通;第二移行區間D1221之Y軸向兩側分別各設有凸設的間隔部D1222,二間隔部D1222間的第二移行區間D1221上方形成一較間隔部D1222上表面低且可供所述第一盤組件AA或第二盤組件BB置放其中的置盤空間D1223,置盤空間D1223中並設有凸設之定位銷D1224;二間隔部D1222外的置座D122長側邊兩側各形成相互平行且較間隔部D1222上表面低的靠座D1225;置座D122下方之第二移行區間D1221兩側各設有相互平行的長條狀嵌座D1226;一夾扣機構D123,設於該置座D122上可受驅動進行擴張或夾靠之操作,包括二夾扣組件D1231在X軸向前後兩端分別各設於置座D122二短側邊處,其分別各以相對應ㄇ狀之方式設置,每一夾扣組件D1231各包括一座臂D12311,以及分別各樞設於座臂D12311兩端的夾臂D12312,座 臂D12311及二夾臂D12312上分別各設有相向朝內之嵌體D12313、D12314其前端分別各具有上內下外之斜錐狀內緣,可受驅動朝置座D122上方第一盤組件AA或第二盤組件BB推抵使其定位;該二夾臂D12312各於該嵌體D12314與和座臂D12311兩端樞設部位間設有一傾斜之長槽孔D12315,並在長槽孔D12315處以固定件D12316樞設二夾臂D12312各分別座設於該置座D122長側邊兩外側之靠座D1225上,二夾臂D12312上之二傾斜之長槽孔D12315間距為前窄後寬;該座臂D12311與一固設於底座D121的固定座D12317間設有滑軌D12318;一設於固定座D12317上的驅動件D12319以一驅動桿D12320可對座臂D12311進行拉引或前推之操作;由於二夾臂D12312上之二傾斜之長槽孔D12315間距為前窄後寬,故驅動件D12319之驅動桿D12320前推,除二座臂D12311上二嵌體D12313將相向內夾外,二臂夾D12312亦將各以樞設之固定件D12316為支點,使前端二嵌體D12314內夾,反之,驅動件D12319之驅動桿D12320後拉,則二座臂D12311上各嵌體D12313將相向外張,且二夾臂D12312前端二嵌體D12314亦將外張。 Referring to FIGS. 5 and 6, the first carrier D12 and the second carrier D22 of the transport mechanism D have substantially the same structure, and are only opposite to each other when installed. The first carrier D12 is described as follows: the first carrier D12 includes a base D121 having a rectangular frame shape and having a rectangular moving hollow first D1011; and a long side D1212 of one side and a sliding seat D111 of the first conveying rail D11 are fixed and linked a seat D122 is disposed on the base D121 and has a rectangular frame shape, and a second movement interval D1221 is formed in the center, and the second movement interval D1221 is corresponding to the first movement interval D1211 of the base D121; a second spacer portion D1221 is respectively provided with a convex spacer portion D1222 on both sides of the Y-axis, and a second spacer portion D1221 between the two spacer portions D1222 forms a lower portion of the upper surface D1222 and is available for the first The disk assembly AA or the second disk assembly BB is placed in the disk space D1223, and the positioning space D1224 is disposed in the disk space D1223; the two sides of the long side of the seat D122 outside the spacer portion D1222 form a mutual a seat D1225 that is parallel and lower than the upper surface of the partition portion D1222; The second moving section D1221 below the seat D122 is provided with parallel strip-shaped inserts D1226 on both sides; a clip mechanism D123 is disposed on the seat D122 to be driven to expand or clamp, including two The clip assembly D1231 is respectively disposed at the two short sides of the X-axis at the front and rear ends of the seat D122, and is respectively disposed in a corresponding manner, each clip assembly D1231 includes an arm D12311, and respectively Each of the clamp arms D12312 pivoted at the ends of the arm D12311 The arms D12311 and the two clamp arms D12312 are respectively provided with inwardly facing inlays D12313 and D12314, respectively, each of which has an upper inner lower outer tapered inner edge, and can be driven to the first disk assembly AA above the facing D122. Or the second disk assembly BB is pushed to be positioned; the two clamping arms D12312 are respectively provided with an inclined long slot D12315 between the inlay D12314 and the pivoting portion of the arm D12311, and at the long slot D12315 The fixing member D12316 pivotally has two clamping arms D12312 respectively seated on the seats D1225 on the outer sides of the long sides of the seat D122, and the two inclined long holes D12315 on the two clamping arms D12312 are spaced apart from the front narrow rear width; A sliding rail D12318 is disposed between the arm D12311 and a fixing base D12317 fixed to the base D121. A driving member D12319 disposed on the fixing base D12317 can pull or push the arm D12311 by a driving rod D12320. Because the distance between the two inclined slots D12315 of the two clamp arms D12312 is the front narrow and the rear width, the driving rod D12320 of the driving member D12319 is pushed forward, except that the two inlays D12313 on the two arms D12311 will be facing inward, 2 The arm clamp D12312 also uses the pivoting fixing member D12316 as a fulcrum to make the front end two The clip body D12314, conversely, the drive rod drive member of the pull D12320 D12319, D12313 inlay the each phase arm outwardly D12311 two sheets, and the two gripping arms D12314 D12312 will also flared distal two inlays.

請參閱圖2、7~9,該第一輔助機構E包括一台座E1,台座E1上設有一立座E2,並於立座E2一側設有Z軸向滑軌E21,滑軌E21上設有一X軸向水平載台E3,載台E3受一驅動件E4所驅動的螺桿E41所作用而可作Z軸向上、下昇降,載台E3上設有X軸向滑軌E31,滑軌E31上設有一抵座E5及與抵座E4連動並設於抵座E5兩側之銷狀連動件E51,該抵座E5可受驅動上移而伸經第一載座D12之底座D121內部矩形鏤空之第一移行區間D1211及置座D122矩形鏤空之第二移行區間D1221,並經置放於第一載座D12上的第一盤組件AA之第一載盤A4上工作區間A421,而抵於離形膜A3下方與離形膜A3靠近;抵座E5上表面依矩陣排列的Y 軸向間隔併列為一群組之第一元件A數目設有同數目的氣壓座E52,每一氣壓座E52上設有X軸向相隔間距排列的複數個氣孔E53,且每一個氣壓座E52上方各對應一個離形膜A3上的第一元件A具有黏膠的貼合部位A1,離形膜A3上相對氣壓座E52上氣孔E53的位置亦開有貫通孔A32;二氣壓座E52間設有支撐部E54,且環繞各氣壓座E52間設有凹設之氣區E55,氣區E55外形成微凸之輪廓緣E56;同一個氣壓座E52上各氣孔E53可同時噴出正壓氣體或轉換提供負壓吸力;請參閱圖10、11,該第一輔助機構E上抵座E5兩側之銷狀連動件E51在抵座E5被驅動上昇時,可嵌入第一載座D12之置座D122下方第二移行區間D1221兩側所設的長條狀嵌座D1226所設開口朝下的嵌孔D1227中,而使第一載座D12在第一軌座D1上第一輸送滑軌D11作X軸向位移時,將連動抵座E5在水平載台E3在X軸向滑軌E31上作同步位移;該置座D122下方第二移行區間D1221兩側所設長條狀嵌座D1226開口朝下的嵌孔D1227,係採相隔間距對應第一盤組件AA上第一載盤A4每一工作區間A421,以左、右嵌座D1226上對稱分別設一嵌孔D1227方式設置。 Referring to Figures 2, 7-9, the first auxiliary mechanism E includes a pedestal E1, a pedestal E1 is provided with a stand E2, and a Z-axis slide rail E21 is arranged on the side of the stand E2, and the slide rail E21 is provided. There is an X-axis horizontal stage E3. The stage E3 is driven by a screw E41 driven by a driving member E4 to be lifted up and down in the Z-axis. The stage E3 is provided with an X-axis slide rail E31, and the slide rail E31. An abutment E5 and a pin-like linkage E51 coupled to the seat E4 and disposed on opposite sides of the seat E5 are provided. The abutment E5 can be driven up and extended through the base D121 of the first carrier D12. The first shifting interval D1211 and the second shifting interval D1221 of the rectangular cutout of the seating D122 are placed in the working section A421 of the first loading tray A4 of the first disk assembly AA on the first carrier D12, and are offset by Below the release film A3 is close to the release film A3; the upper surface of the seat E5 is arranged in a matrix Y The number of the first elements A which are axially juxtaposed as a group is provided with the same number of air pressure seats E52, and each of the air pressure seats E52 is provided with a plurality of air holes E53 arranged in the X-axis interval, and each of the air pressure seats E52 The first component A corresponding to one of the release films A3 has a bonding portion A1 of the adhesive, and the position of the air hole E53 of the opposite pressure seat E52 on the release film A3 is also provided with a through hole A32; Supporting portion E54, and surrounding the air pressure seat E52 is provided with a recessed gas zone E55, the gas zone E55 forms a micro convex contour edge E56; the same air pressure seat E52 on each air hole E53 can simultaneously emit positive pressure gas or convert provides Negative pressure suction; referring to Figures 10 and 11, the pin-like linkage E51 on both sides of the first auxiliary mechanism E against the seat E5 can be embedded under the seat D122 of the first carrier D12 when the seat E5 is driven to rise. The elongated insert D1226 disposed on both sides of the second shifting section D1221 is provided with the opening downwardly facing the hole D1227, so that the first carrier D12 is the first transporting rail D11 on the first rail seat D1 as the X-axis. In the case of displacement, the interlocking seat E5 is synchronously displaced on the horizontal stage E3 on the X-axis slide rail E31; The second strip-shaped insert D121 is provided with a long-shaped insert D1226 on both sides of the opening D1226, and the corresponding spacing is corresponding to the first tray AA on the first tray AA, and each working section A421 is left and right. The insert D1226 is symmetrically arranged with a hole D1227.

請參閱圖12~14,該第二輔助機構F包括一台座F1,台座F1上設有一立座F2,並於立座F2一側設有Z軸向滑軌F21,滑軌F21上設有一X軸向水平載台F3,載台F3下方設一驅動件F4,該驅動件F4向下驅動一螺桿F41,而反向驅動載台F3可作Z軸向上、下昇降,載台F3上設有X軸向滑軌F31,滑軌E31上設有一抵座F5及與抵座F5連動並設於抵座F5兩側之銷狀連動件F51,該抵座F5可受驅動件F4驅動上移而伸經第二載座D22之底座D221內部矩形鏤空之第一移行區間D2211及置座D222矩形鏤空之第二移行區間D2221,並經置放於第二載座D22上的第 二盤組件BB之第二載盤B4上操作孔B12,而抵於第二元件B下方與第二元件B靠近;抵座F5上表面依矩陣排列的Y軸向間隔併列為一群組之第二元件B數目設有同數目的氣壓座F52,每一氣壓座F52上設有二吸嘴F53,且每一個氣壓座F52上方各對應一個第二元件B;該氣壓座F52上吸嘴F53可提供負壓吸力。 Referring to FIGS. 12-14, the second auxiliary mechanism F includes a pedestal F1. The pedestal F1 is provided with a stand F2, and a Z-axis slide rail F21 is disposed on the side of the stand F2, and an X is disposed on the slide rail F21. The axial horizontal stage F3 is provided with a driving member F4 under the loading table F3. The driving member F4 drives a screw F41 downward, and the reverse driving stage F3 can be raised and lowered in the Z-axis direction, and the loading table F3 is provided. The X-axis slide rail F31, the slide rail E31 is provided with an abutment F5 and a pin-like linkage F51 coupled with the abutment F5 and disposed on both sides of the abutment F5, the abutment F5 can be driven up by the driving member F4. a second transition section D2211 extending through the rectangular cutout of the base D221 of the second carrier D22 and a second transition section D2221 of the rectangular cutout of the seating D222, and being placed on the second carrier D22 The second carrier BB of the two-disc assembly BB operates the hole B12, and is adjacent to the second element B under the second element B; the upper surface of the seating F5 is arranged in a matrix of Y-axis spacing and is juxtaposed as a group. The number of the two components B is provided with the same number of air pressure seats F52, each of the air pressure seats F52 is provided with two suction nozzles F53, and each of the air pressure seats F52 corresponds to a second component B; the air pressure seat F52 can be sucked by the nozzle F53 Provide vacuum suction.

請參閱圖14、15,該第二輔助機構F上抵座F5兩側之銷狀連動件F51在抵座F5被驅動上昇時,可嵌入第二載座D22之置座D222上第二移行區間D2221兩側下方所設的長條狀嵌座D2222所設開口朝下的嵌孔D2223中,而使第二載座D22在第二軌座D2上第二輸送滑軌D21作X軸向位移時,將連動抵座F5在水平載台F3的X軸向滑軌F31上作同步位移;該置座D222上第二移行區間D2221兩側下方所設長條狀嵌座D2222開口朝下的嵌孔D2223,係採相隔間距對應第二盤組件BB上第二載盤B4依矩陣排列的Y軸向間隔併列為一群組之操作孔B12,以左、右嵌座D2222上對稱分別設一嵌孔D2223方式設置。 Referring to FIGS. 14 and 15, the pin-shaped linking member F51 on both sides of the second auxiliary mechanism F on the seat F5 can be inserted into the second shifting section of the seat D222 of the second carrier D22 when the seat F5 is driven to rise. The long strip D2222 disposed at the lower side of the D2221 is provided with the opening downwardly facing the hole D2223, and the second carrier D22 is displaced by the X-axis when the second conveying rail D21 is displaced on the second rail seat D2. The interlocking seat F5 is synchronously displaced on the X-axis slide rail F31 of the horizontal stage F3; the long-shaped insert D2222 of the second shift section D2221 on the side of the seat D222 is opened downwardly. D2223, corresponding to the spacing between the second tray B4 of the second disk assembly BB and the Y-axis spacing arranged in a matrix, is arranged as a group of operation holes B12, and a hole is respectively arranged symmetrically on the left and right nests D2222. D2223 mode setting.

請參閱圖4、16~17,該移載機構G的移載座G12上設有一立設之固定座G121,固定座G121上一側設該第一檢視單元G4,另一側設一驅動件G122,該驅動件G122驅動固定座G121上一Z軸向滑軌G123上的一滑座G124可作Z軸向上、下位移;滑座G124上設一固定架G125,該固定架G125上設置該貼合機構G2及膠帶機構G3,使驅動件G122的驅動可使固定架G125上的貼合機構G2及膠帶機構G3同步作Z軸向上、下位移;該貼合機構G2包括:一觸壓組件G21,以一本體G211設於一承載座G22的Z軸向滑軌G221上,可在滑軌G221上作Z軸向上、下位移,觸壓組件G21設有一抵壓軸G212,其下方藉一聯結件G213可連結接設一依不同產品加工需求作拆換 的抵壓模G214;該本體G211可依不同產品加工需求設置一加熱元件(圖中未示),並以溫控元件G215進行溫度偵測及控制;一旋轉組件G23,於承載座G22上的一框座G222中相隔間距的上固定座G223與下固定座G224間設有一有齒的軸輪G231,該軸輪G231被一驅動件G232以皮帶G233聯結驅動而可作旋轉;一測壓組件G24,設有荷重量測元件G241並位於旋轉組件G23與觸壓組件G21間,測壓組件G24受旋轉組件G23所連動而可連動觸壓組件G21的抵壓軸G211旋轉;一調整組件G25,設於該上固定座G223上,其包括一罩架G251及於其內設有包括彈性元件的微調元件G252;藉對調整組件G25的微調操作,可連動經旋轉組件G23,測壓組件G24而使該觸壓組件G21可在承載座G22的Z軸向滑軌G221上作上、下微調位移;該承載座G22承載由觸壓組件G21、旋轉組件G23,測壓組件G24、調整組件G25以上下串聯在同一中心軸線所組構形成的貼合機構G2並設於該固定架G125上;該膠帶機構G3包括一載有膠帶捲並受一固定架G125後側驅動件G311驅動的捲帶輪G31及供回收捲帶並受一固定架G125後側驅動件G321驅動的捲收輪G32,其中,該捲帶輪G31及捲收輪G32同位於相對第一檢視單元G4的固定架G125上貼合機構G2另一側,且捲帶輪G31位於捲收輪G32下方;捲帶輪G31側設有一膠帶偵測元件G33,以偵測捲帶輪G31上膠帶G34是否用完;捲帶輪G31及捲收輪G32配合一組由複數個惰輪G351所組成的傳輸輪組G35形成一膠帶G34的傳輸流路,該傳輸流路以膠帶G34具有黏膠的一側朝外方式環繞貼合機構G2周圍,使貼合機構G2位於 傳輸流路的內部,且使膠帶G34繞貼附於貼合機構G2之觸壓組件G21上抵壓模G214下方。 Referring to FIG. 4, FIG. 16~17, a resetting seat G121 is disposed on the transfer base G12 of the transfer mechanism G. The first inspection unit G4 is disposed on one side of the fixed seat G121, and a driving member is disposed on the other side. G122, the driving member G122 drives a sliding seat G124 on a Z-axis slide rail G123 on the fixing base G121 to be displaced in the Z-axis upward and downward; the sliding seat G124 is provided with a fixing frame G125, and the fixing frame G125 is disposed on the fixing frame G125. The bonding mechanism G2 and the tape mechanism G3 enable the driving mechanism G122 to drive the bonding mechanism G2 and the tape mechanism G3 on the fixing frame G125 to be vertically displaced in the Z-axis direction; the bonding mechanism G2 includes: a touch-pressure component G21, a body G211 is disposed on a Z-axis slide rail G221 of a carrier G22, and can be displaced in the Z-axis up and down on the slide rail G221, and the contact pressure component G21 is provided with a pressing shaft G212, and a coupling is made below G213 can be connected and connected according to different product processing requirements. The pressing mold G214; the body G211 can be provided with a heating element (not shown) according to different product processing requirements, and temperature detecting and controlling by the temperature controlling element G215; a rotating component G23 on the carrying seat G22 A toothed shaft wheel G231 is disposed between the upper fixing seat G223 and the lower fixing seat G224 of the frame G222, and the shaft wheel G231 is driven by a driving member G232 by a belt G233 to rotate; a pressure measuring component G24, is provided with a load weight measuring component G241 and is located between the rotating component G23 and the touch pressure component G21. The pressure measuring component G24 is rotated by the rotating component G23 to rotate the pressing axis G211 of the contact pressure component G21; an adjusting component G25 is provided. The upper mounting seat G223 includes a cover frame G251 and a fine adjustment component G252 including an elastic member therein. The fine adjustment operation of the adjustment component G25 can be linked to the rotation component G23 and the pressure measurement component G24. The contact pressure component G21 can be finely adjusted up and down on the Z-axis slide rail G221 of the carrier G22; the carrier G22 is carried by the touch component G21, the rotating component G23, the pressure measuring component G24, and the adjusting component G25. Tandem in the same central axis The affixing mechanism G2 is disposed on the fixing frame G125. The tape mechanism G3 includes a winding reel G31 carrying a tape roll and driven by a fixing frame G125 rear side driving member G311, and a reeling tape. The winding reel G32 driven by the rear side driving member G321 of the fixing frame G125, wherein the reeling wheel G31 and the winding reel G32 are located on the other side of the bonding mechanism G2 on the fixing frame G125 of the first inspection unit G4. The winding pulley G31 is located below the winding reel G32; a tape detecting component G33 is disposed on the winding pulley G31 side to detect whether the tape G34 on the winding reel G31 is used up; the winding reel G31 and the winding reel G32 cooperate with one The transmission wheel set G35 composed of a plurality of idler gears G351 forms a transport flow path of the adhesive tape G34, and the transport flow path surrounds the periphery of the bonding mechanism G2 with the adhesive G34 having the adhesive side facing outward, so that the bonding mechanism G2 is located The inside of the flow path is transported, and the tape G34 is wound around the pressing member G21 attached to the bonding mechanism G2 under the pressing mold G214.

請參閱圖18、19,該抵壓模G214包括一吸附座G2141及位於吸附座G2141底端下凸設的抵貼座G2142;其中,該吸附座G2141下方兩側各對應設有一斜面狀吸附面G2143,每一吸附面G2143的表面各凹設有複數個共同佈設成面狀且相互連通的氣穴G2144,兩氣穴G2144間則相對成凸肋G2145,複數個凸肋G2145共同佈設成面狀;吸附面G2143設有氣孔G2146提供負壓吸力於該等氣穴G2144中;兩側對應的二斜面狀吸附面G2143共同呈錐狀朝抵貼座G2142傾斜;抵貼座G2142底端貼觸面G2147形成配合第一元件A下方具有黏膠的貼合部位A1上表面形狀的造形,在本實例中,該抵貼座G2142底端貼觸面G2147形成一長條狀矩形的平設狀表面,並於該平設狀表面上設有凹陷的容置區間G2148,該容置區間G2147的位置及凹陷深度係配合容置所欲施工的撓性基板第一元件A之貼合部位A1上的電子線路隆凸部位;傳輸經該抵壓模G214的膠帶G34先經抵壓模G214一側的惰輪G351相對抵壓模G214的外側,再經該吸附座G2141對應該側惰輪G351的斜面狀吸附面G2143,而後繞經抵貼座G2142底端貼觸面G2147,再經吸附座G2141另一側的斜面狀吸附面G2143,而後繞經對應該側吸附面G2143的惰輪G351相對抵壓模G214的外側;繞經該抵壓模G214的抵貼座G2142底端貼觸面G2147之膠帶G34,其具有黏膠的表面朝下對應第一元件A下方具有黏膠的貼合部位A1上表面。 Referring to FIGS. 18 and 19, the pressing mold G214 includes a suction seat G2141 and an abutting seat G2142 protruding downwardly from the bottom end of the adsorption seat G2141. The two sides of the suction seat G2141 are respectively provided with a slope-shaped adsorption surface. G2143, each surface of each adsorption surface G2143 is concavely provided with a plurality of air pockets G2144 which are arranged in a plane and communicate with each other, and between the two air pockets G2144, a convex rib G2145 is formed, and a plurality of convex ribs G2145 are arranged in a plane shape. The adsorption surface G2143 is provided with a pore G2146 for providing a vacuum suction force in the gas pockets G2144; the two inclined surface adsorption surfaces G2143 on both sides are tapered in a tapered shape toward the abutment G2142; the bottom end of the abutment G2142 is in contact with the surface G2147 forms a shape matching the upper surface shape of the bonding portion A1 having the adhesive under the first component A. In the present example, the bottom contact surface G2147 of the abutting seat G2142 forms a long rectangular flat surface. And a recessed accommodating section G2148 is disposed on the flat surface, and the position of the accommodating section G2147 and the recessed depth are matched with the electrons on the bonding part A1 of the first component A of the flexible substrate to be constructed. Line protuberance; transmission through the pressure The tape G34 of G214 is firstly pressed against the outer side of the pressing mold G214 via the idler gear G351 on the side of the pressing mold G214, and then passes through the adsorption seat G2141 corresponding to the inclined surface adsorption surface G2143 of the side idler gear G351, and then passes through the abutting seat G2142. The bottom end contact surface G2147, and then the inclined surface adsorption surface G2143 on the other side of the adsorption seat G2141, and then the idler gear G351 corresponding to the side adsorption surface G2143 is opposite to the outer side of the pressing mold G214; The adhesive tape G34 of the G2142 bottom end contact surface G2147 has a surface with an adhesive surface facing downward corresponding to the upper surface of the bonding portion A1 having the adhesive under the first component A.

請參閱圖4、20,該壓合機構G5包括:一第一驅動組件G51,其設有一固定座G511,固定座G511上設有Z軸向軌道G512,軌道G512上設有一第一滑座G513,該第一滑座G513可 受一馬達構成的第一驅動件G514驅動而在軌道G512上作Z軸向上、下位移;一第二驅動組件G52,其設有一固定座G521,固定座G521上設有Z軸向軌道G522及一承座G523;該軌道G522上設有一第二滑座G524,第二滑座G524上設有一與其連動的壓抵座G525,壓抵座G525下端夾設一撓性材質構成的壓抵模G526,其底面輪闊形狀可配合第一元件A下方具有黏膠的貼合部位A1上表面形狀;壓抵座G525可受承座G523上一氣壓缸構成的第二驅動件G527氣壓作用,在第二滑座G524在軌道G522上位移受到阻力時,藉氣壓缸構成的第二驅動件G527之氣壓形成壓抵模G526向上位移的緩衝。 Referring to FIG. 4 and FIG. 20, the pressing mechanism G5 includes a first driving component G51, and a fixing base G511. The fixing base G511 is provided with a Z-axis rail G512, and the rail G512 is provided with a first sliding seat G513. , the first sliding seat G513 can Driven by a first driving member G514 formed by a motor and displaced in the Z-axis direction on the rail G512; a second driving component G52 is provided with a fixing base G521, and the fixing seat G521 is provided with a Z-axis orbit G522 and A bearing G523 is disposed on the rail G522; a second sliding seat G524 is disposed on the second sliding seat G524, and a pressing contact seat G525 is disposed on the second sliding seat G524, and a pressing material G526 is formed on the lower end of the pressing seat G525. The bottom wheel width shape can match the upper surface shape of the adhesive portion A1 having the adhesive under the first component A; the pressing seat G525 can be pressed by the second driving member G527 formed by a pneumatic cylinder on the bearing G523, in the first When the displacement of the second carriage G524 on the rail G522 is resisted, the air pressure of the second driving member G527 formed by the pneumatic cylinder forms a buffer for the upward displacement of the pressing mold G526.

請參閱圖4、11、21~24本發明實施例在進行撓性基板之提取時,執行:一到位步驟:使移載機構G的移載座G12(圖4)位移至第一傳送流路之第一軌座D1所傳送的第一載座D12上第一盤組件AA上方,使第一檢視單元G4恰對應位於第一盤組件AA中離形膜A3上一待提取之第一元件A的貼合部位A1上方(圖21);此時第一輔助機構E恰位於第一盤組件AA下方,且抵座E5被上昇至兩側之銷狀連動件E51嵌入第一載座D12之置座D122下方第二移行區間D1221兩側所設的長條狀嵌座D1226所設開口朝下的嵌孔D1227中,而使第一載座D12與抵座E5形成連動(圖11);一第一對位檢測步驟:以第一檢視單元G4對應位於第一盤組件AA中離形膜A3上一待提取之第一元件A的貼合部位A1由上往下進行檢測,以取得其位置資訊;在進行檢測時取樣貼合部位A1上二個定點位置,由於第一檢視單元G4隨移載座G12僅能作Y軸向位移,故完成第一定點檢測 取樣後,第一載座D12將被驅動與抵座E5連動在第一軌座D1上作X軸向前後位移,以取得第二定點位置資訊;一提取步驟,依據該對位檢測步驟取得的位置資訊,使移載座G12上貼合機構G2下方的之抵壓模G214凸設的抵貼座G2142恰對應位於第一盤組件AA中離形膜A3上之該待提取之第一元件A的貼合部位A1上方(圖22);使貼合機構G2被驅動下移,而以抵貼座G2142抵推膠帶G34具有黏膠的一側抵覆於該待提取之第一元件A的貼合部位A1上方表面並予黏附(圖23),再驅動貼合機構G2緩慢上移,藉膠帶G34黏帶第一元件A的貼合部位A1,使第一元件A逐漸脫離離形膜A3,而完成提取第一元件A之提取(圖24);其中,該貼合機構G2在膠帶G34黏附第一元件A的貼合部位A1欲作脫離提取的上移速度,比原貼合機構G2被驅動欲使膠帶G34抵觸第一元件A的貼合部位A1之下移速度慢,以使第一元件A自離形膜A3作完整而充份的脫離;在膠帶G34黏附第一元件A的貼合部位A1欲作提取上移時,該第一盤組件AA下方抵座E5自與該貼合部位A1對應的氣壓座E52上氣孔E53提供正壓氣體進行吹氣(圖24),使正壓氣體經離形膜A3上對應的貫通孔A32對第一元件A的貼合部位A1噴吹,以幫助貼合部位A1與膠帶G34黏附並被自離形膜A3脫離提取;在此同時,對應該正進行提取的第一元件A之貼合部位A1下氣壓座E52以外的其它氣壓座E52,其上之氣孔E53則提供負壓,使負壓漫佈各凹設之氣區E55,並藉該負壓吸附正進行提取的第一元件A之貼合部位A1處以外的離形膜A3下表面,使在進行提取時,離形膜A3被呈與第一元件A之貼合部位A1作反向相對位移,以協助二者分離並避免離形膜A3被上移中的膠帶G34黏附隆起;第一盤組件AA同一工作區間A421中Y軸向間隔併列為一群組的第一元件A被提取完後,第一輔助機構E的抵座E5將被驅動下移而解除與 第一載座D12的連動狀態,然後第一載座D12將被驅動前移使第一盤組件AA下一個工作區間A421對應位移至第一輔助機構E的抵座E5上方,並使抵座E5被驅動上昇與第一載座D12連動,及使抵座E5上目前對應的第一盤組件AA上工作區間A421中Y軸向間隔併列為一群組的第一元件A繼續被提取。 Referring to FIGS. 4, 11, and 21 to 24, in the embodiment of the present invention, when performing the extraction of the flexible substrate, a one-position step is performed: the transfer carrier G12 (FIG. 4) of the transfer mechanism G is displaced to the first transfer flow path. The first viewing unit G4 is disposed above the first disk assembly A1 on the first carrier D12, so that the first viewing unit G4 corresponds to the first component A to be extracted on the release film A3 in the first disk assembly AA. Above the bonding part A1 (Fig. 21); at this time, the first auxiliary mechanism E is located just below the first disk assembly AA, and the pin-shaped linking member E51 that is raised to the two sides is embedded in the first carrier D12 The long-shaped insert D1226 disposed on both sides of the second shifting section D1221 below the seat D122 is provided with the opening D1227 facing downward, and the first carrier D12 is interlocked with the seating E5 (FIG. 11); a one-position detecting step: detecting, by the first viewing unit G4, the bonding portion A1 of the first component A to be extracted on the release film A3 of the first disk assembly AA from top to bottom to obtain the position information thereof Sampling the two fixed position on the bonding part A1 during the detection, since the first inspection unit G4 can only perform Y-axis displacement with the transfer seat G12 So complete the first fixed point detection After sampling, the first carrier D12 will be driven to move back and forth on the first rail seat D1 in the X-axis direction to obtain the second fixed-point position information, and an extraction step is performed according to the alignment detecting step. The position information is such that the abutment G2142 protruding from the pressing mold G214 under the bonding mechanism G12 on the transfer seat G12 corresponds to the first component A to be extracted located on the release film A3 of the first disk assembly AA. Above the bonding part A1 (Fig. 22); the bonding mechanism G2 is driven to move downward, and the side of the adhesive tape G34 having the adhesive is pressed against the first component A to be extracted by the abutting seat G2142. The upper surface of the joint A1 is adhered to the surface (Fig. 23), and the driving mechanism G2 is slowly moved upward, and the bonding portion A1 of the first component A is adhered by the tape G34, so that the first component A is gradually separated from the release film A3. The extraction of the first component A is completed (FIG. 24); wherein the bonding mechanism G2 adheres to the bonding portion A1 of the first component A on the adhesive tape G34, and the upward moving speed of the extraction is removed, which is higher than the original bonding mechanism G2. Driving the tape G34 against the bonding position A1 of the first component A to move down slowly, so that the first component A is self-release film A3 A complete and sufficient detachment; when the bonding portion A1 of the first component A is adhered to the tape G34 for upward extraction, the lower seat E5 of the first disk assembly AA is from the air pressure seat E52 corresponding to the bonding portion A1. The upper air hole E53 supplies a positive pressure gas for blowing (Fig. 24), and the positive pressure gas is blown to the bonding portion A1 of the first element A through the corresponding through hole A32 on the release film A3 to help the bonding portion A1 and The tape G34 is adhered and detached from the release film A3; at the same time, the air hole E53 other than the air pressure seat E52 under the bonding portion A1 of the first component A which is being extracted is provided, and the air hole E53 is provided thereon. Negative pressure, the negative pressure is spread over the recessed gas zone E55, and the lower surface of the release film A3 other than the bonding portion A1 of the first component A being extracted is adsorbed by the negative pressure, so that the extraction is performed The release film A3 is reversely displaced relative to the bonding portion A1 of the first member A to assist in the separation of the two and to prevent the release film A3 from being adhered by the tape G34 which is moved upward; the first disk assembly AA is the same In the working area A421, after the Y-axis interval is juxtaposed as a group, the first component A is extracted, and the first auxiliary machine E The dolly E5 will be driven down to release the The interlocking state of the first carrier D12, and then the first carrier D12 will be driven forward to correspondingly shift the next working section A421 of the first disk assembly AA to the upper seat E5 of the first auxiliary mechanism E, and make the seat E5 The driving device is driven to rise in conjunction with the first carrier D12, and the first component A, which is axially spaced apart in the working section A421 of the first disk assembly AA on the corresponding E5, is continuously extracted.

請參閱圖4、14、25~30,本發明實施例在進行撓性基板之貼合時,執行:一第二對位檢測步驟:前述撓性基板完成提取後,移載機構G的移載座G12(圖4)位移至第一輸送滑軌D11與第二輸送滑軌D21間,且為移載座G12上貼合機構G2自第一輸送滑軌D11上第一載座D12移至第二輸送滑軌D21上第二載座D22的路徑中的第二檢視單元H上方(圖25),使由下往上進行檢視之CCD鏡頭對貼合機構G2之抵壓模G214凸設的抵貼座G2142下方膠帶G34黏附的第一元件A之貼合部位A1下方進行檢測(圖26),以取得貼合部位A1下方位置資訊;一到位步驟:完成第二對位檢測步驟後,使移載機構G的移載座G12(圖4)位移至第二軌座D2的第二載座D22上第二盤組件BB上方,使貼合機構G2之抵壓模G214凸設的抵貼座G2142下方膠帶G34黏附的第一元件A之貼合部位A1對應第二元件B之預設定位上方(圖27、28);此時第二輔助機構F恰位於第二盤組件BB下方,且抵座F5被上昇至兩側之銷狀連動件F51嵌入第二載座D22之置座D222上第二移行區間D2221兩側下方所設的長條狀嵌座D2222所設開口朝下的嵌孔D2223中,而使第二載座D22與抵座F5形成連動(圖14);一貼合步驟:使貼合機構G2下方抵貼座G2142抵推膠帶G34將第一元件A的貼合部位A1下方抵貼於第二元件B之預設定位(圖29);完成貼 合後,抵貼座G2142連同膠帶G34被驅動以低於原下移速度下緩慢上移,此時位於第二盤組件BB下方的第二輔助機構F上抵座F5之氣壓座F52上吸嘴F53提供負壓吸力,使第二元件B下方受到吸附,使膠帶G34自與第一元件A的貼合部位A1黏附狀態脫離時,第二元件B被呈與膠帶G34作反向相對位移,以協助膠帶G34與第一元件A的貼合部位A1分離;一第三對位檢測步驟:以第一檢視單元G4對應位於第二盤組件BB中已完成貼合於第二元件B上之第一元件A的貼合部位A1由上往下進行檢測,以取得其位置資訊;在進行檢測時取樣貼合部位A1上二個定點位置,完成第一定點檢測取樣後,第二載座D22被驅動與抵座F5連動在第二軌座D2上作X軸向前後位移,以取得第二定點位置資訊;一壓合步驟,請參閱圖4、27,依據第三對位檢測步驟所取得的位置資訊,驅動該壓合機構G5對應位於第二盤組件BB上方,此時該移載機構G的移載座G12(圖4)位移至第一軌座D1的第一載座D12上第一盤組件AA上方進行下一次的提取;使壓合機構G5之第一驅動組件G51被驅動作Z軸向下位移,以連動第二驅動組件G52上壓抵座G525下端夾設的撓性材質構成的壓抵模G526對已完成貼合之第一元件A的貼合部位A1上表面進行壓抵,以使第一元件A的貼合部位A1與第二元件B充份貼合,並在壓抵模G526受到阻力時,藉氣壓缸構成的第二驅動件G527氣壓作用形成緩衝,避免對第一元件A的貼合部位A1過度施力造成損壞;第二盤組件BB中Y軸向間隔併列為同一群組的第二元件B被執行貼合完後,第二輔助機構F的抵座F5將被驅動下移而解除與第一載座D12的連動狀態,然後第二載座D22將被驅動前移使第二盤組件BB位移至下一個同一群組的第二元件B對應第二輔助機構F的抵座F5上方,並使抵座F5被驅動上昇與第二載座D22連動,及使抵座F5上目前對應的第二盤 組件BB上Y軸向間隔併列為同一群組的第二元件B繼續被執行貼合;所述第一元件A與第二盤組件BB上所有第二元件B完成貼合後,第二盤組件BB循原第二輸送滑軌D21的第二傳送流路回送。 Referring to FIGS. 4, 14, and 25 to 30, in the embodiment of the present invention, when performing the bonding of the flexible substrate, a second alignment detecting step is performed: after the flexible substrate is extracted, the transfer mechanism G is transferred. The seat G12 (Fig. 4) is displaced between the first conveying rail D11 and the second conveying rail D21, and the fitting mechanism G2 on the shifting seat G12 is moved from the first carrier D12 on the first conveying rail D11 to the first 2 above the second inspection unit H in the path of the second carrier D22 on the transport rail D21 (FIG. 25), the CCD lens that is viewed from the bottom up is attached to the pressing mold G214 of the bonding mechanism G2. The lower part of the bonding part A1 of the first component A adhered to the adhesive tape G34 under the G2142 is detected (Fig. 26) to obtain the position information under the bonding part A1. One step is: after the second registration detecting step is completed, the shifting is performed. The transfer seat G12 (FIG. 4) of the carrier mechanism G is displaced to the upper portion of the second disk assembly BB of the second carrier D22 of the second rail base D2, and the abutment G2142 of the pressing mechanism G214 of the bonding mechanism G2 is protruded. The bonding portion A1 of the first component A adhered by the lower tape G34 corresponds to the preset positioning of the second component B (Fig. 27, 28); at this time, the second auxiliary mechanism F is just Below the second disk assembly BB, and the pin-shaped linking member F51 that is raised to the two sides of the seat F5 is inserted into the seat D222 of the second carrier D22, and the elongated frame is disposed below the two sides of the second moving section D2221. D2222 is provided with the opening D2223 facing downward, and the second carrier D22 is interlocked with the seating F5 (Fig. 14); a fitting step: the lowering of the bonding mechanism G2 against the seat G2142 against the adhesive tape G34 The lower part of the bonding part A1 of the first component A is abutted against the preset positioning of the second component B (Fig. 29); After the assembly, the abutment G2142 is driven along with the tape G34 to move up slowly below the original downward moving speed. At this time, the second auxiliary mechanism F located below the second disk assembly BB is attached to the pressure seat F52 of the seat F5. F53 provides a negative pressure suction, so that the lower side of the second element B is adsorbed, and when the adhesive tape G34 is detached from the bonding position of the first component A, the second component B is reversely displaced relative to the adhesive tape G34, Assisting the adhesive tape G34 to be separated from the bonding portion A1 of the first component A; a third alignment detecting step: the first viewing unit G4 correspondingly located in the second disk component BB has been completed and attached to the second component B The bonding portion A1 of the component A is detected from the top to the bottom to obtain the position information thereof; when the detection is performed, the two fixed position positions on the bonding portion A1 are sampled, and after the first fixed-point detection sampling is completed, the second carrier D22 is The driving and the seating F5 are interlocked on the second rail seat D2 to perform the X-axis front-rear displacement to obtain the second fixed-point position information; a pressing step, refer to FIGS. 4 and 27, according to the third registration detecting step. Position information, driving the pressing mechanism G5 corresponding to the second disk group Above BB, at this time, the transfer seat G12 (FIG. 4) of the transfer mechanism G is displaced to the first disk assembly AA on the first carrier D12 of the first rail D1 for the next extraction; the pressing mechanism G5 is made. The first driving component G51 is driven to be displaced in the Z-axis downward direction to interlock the pressing member G526 formed by the flexible material of the second driving component G52 pressed against the lower end of the G525 pair to the completed first component A. The upper surface of the bonding portion A1 is pressed so that the bonding portion A1 of the first element A and the second element B are sufficiently adhered, and when the pressing mold G526 receives the resistance, the second driving by the pneumatic cylinder The air pressure of the member G527 forms a buffer to avoid damage caused by excessive force applied to the bonding portion A1 of the first component A; and the second component B of the second disk assembly BB is axially spaced and juxtaposed into the same group is finished. The abutment F5 of the second auxiliary mechanism F will be driven to move down to release the interlocking state with the first carrier D12, and then the second carrier D22 will be driven forward to displace the second disk assembly BB to the next same group. The second component B of the group corresponds to the upper portion of the abutment F5 of the second auxiliary mechanism F, and the abutment F5 is driven to rise and the first The second carrier D22 is linked, and the second disk corresponding to the current seat F5 is placed. The second component B of the component BB which is axially spaced and juxtaposed into the same group continues to be engaged; after the first component A and all the second component B of the second disk component BB are finished, the second disk component The BB returns according to the second conveying flow path of the original second conveying rail D21.

本發明實施例之貼合製程之元件移載機構,由於撓性基板之第一元件A於第一傳送流路之第一軌座D1所傳送的第一載座D12上第一盤組件AA的離形膜A3上供提取,提取時採用移載機構中G中貼合機構G2抵壓模G214凸設的抵貼座G2142下方膠帶G34黏附第一元件A之貼合部位A1,並在提取時以第一盤組件AA下方第一輔助機構E的抵座E5自與該貼合部位A1對應的氣壓座E52上氣孔E53提供正壓氣體進行吹氣,使正壓氣體經離形膜A3上對應的貫通孔A32對第一元件A的貼合部位A1噴吹,以幫助貼合部位A1與膠帶G34黏附並被自離形膜A3脫離提取;並對應該正進行提取的第一元件A之貼合部位A1下氣壓座E52以外的其它氣壓座E52上之氣孔E53提供負壓,使負壓漫佈各凹設之氣區E55吸附離形膜A3下表面,使在進行提取時,離形膜A3被呈與第一元件A之貼合部位A1作反向相對位移,可協助二者分離並避免離形膜A3被上移中的膠帶G34黏附隆起;而貼合時採用第一元件A被貼合機構G2抵壓模G214凸設的抵貼座G2142下方膠帶G34黏附搬送於第二傳送流路之第二軌座D2所傳送的第二載座D22上第二盤組件BB的第二元件B上,使第一元件A之貼合部位A1完成貼合於第二元件B上欲作脫離時,以第二輔助機構F上抵座F5之氣壓座F52上吸嘴F53提供負壓吸力,使第二元件B下方受到吸附,使膠帶G34自與第一元件A的貼合部位A1黏附狀態脫離時,第二元件B被呈與膠帶G34作反向相對位移,以協助膠帶G34與第一元件A的貼合部位A1分離;且經第一、二、三對位檢測步驟配合第一、二輔助機構E、F上抵座E5、F5可與第一、二載座D12、D22連動,使其可作不 同位置之二點取樣檢測以獲得精準對位;並在壓合步驟之壓抵座G525下端夾設的撓性材質構成的壓抵模G526對已完成貼合之第一元件A的貼合部位A1上表面進行壓抵,使第一元件A的貼合部位A1與第二元件B充份貼合,故縱使撓性基板極微細,移載機構G對將撓性基板移載與另一載體間貼合,可採自動化具效率而精確的進行。 In the component transfer mechanism of the bonding process of the embodiment of the present invention, the first component A of the flexible substrate is on the first carrier D12 of the first carrier D1 of the first transfer flow path. The release film A3 is for extraction, and the bonding portion A1 of the first component A is adhered to the adhesive tape G34 under the abutting seat G2142 of the G-bonding mechanism G2 in the transfer mechanism G in the transfer mechanism, and is extracted at the time of extraction. The positive pressure gas is supplied from the air hole E53 of the air pressure seat E52 corresponding to the bonding portion A1 by the abutment E5 of the first auxiliary mechanism E below the first disk assembly AA, and the positive pressure gas is blown through the release film A3. The through hole A32 is blown to the bonding portion A1 of the first member A to help the bonding portion A1 adhere to the tape G34 and is extracted from the release film A3; and the first component A to be extracted is attached. The air hole E53 on the air pressure seat E52 other than the air pressure seat E52 at the joint portion A1 provides a negative pressure, so that the negative pressure diffuses the concave gas area E55 to adsorb the lower surface of the film A3, so that when the extraction is performed, the film is removed. A3 is reversely displaced relative to the bonding portion A1 of the first component A to assist in separating and avoiding The film A3 is adhered to the ridge by the upwardly moving tape G34; and the first component A is adhered to the second conveying flow path by the tape G34 under the abutting seat G2142 which is protruded from the pressing mold G214 by the bonding mechanism G2. When the second component B of the second disk assembly BB is transported on the second carrier D22 of the second rail D2, the bonding portion A1 of the first component A is attached to the second component B to be detached. The suction nozzle F53 of the air pressure seat F52 of the second auxiliary mechanism F is provided with a negative pressure suction force, so that the lower side of the second element B is adsorbed, and the tape G34 is detached from the bonding position of the first component A. The second component B is reversely displaced relative to the tape G34 to assist in separating the adhesive tape G34 from the bonding portion A1 of the first component A; and the first, second, and third alignment detecting steps are combined with the first and second auxiliary The E5 and F5 on the E and F of the mechanism can be linked with the first and second carriers D12 and D22, so that they can be used as Two-point sampling test at the same position to obtain accurate alignment; and a pressing material G526 composed of a flexible material sandwiched at the lower end of the press-fit seat G525 at the pressing step is applied to the fitting portion of the completed first component A The upper surface of A1 is pressed to make the bonding portion A1 of the first element A and the second element B fully adhered. Therefore, even if the flexible substrate is extremely fine, the transfer mechanism G transfers the flexible substrate to another carrier. The fit can be automated and efficient.

惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。 The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

G121‧‧‧固定座 G121‧‧‧ fixed seat

G122‧‧‧驅動件 G122‧‧‧ drive parts

G123‧‧‧滑軌 G123‧‧‧rails

G124‧‧‧滑座 G124‧‧‧ slide

G125‧‧‧固定架 G125‧‧‧ Fixing frame

G2‧‧‧貼合機構 G2‧‧‧ affixing agency

G21‧‧‧觸壓組件 G21‧‧‧Touch components

G211‧‧‧本體 G211‧‧‧ Ontology

G212‧‧‧抵壓軸 G212‧‧‧Resistance shaft

G213‧‧‧聯結件 G213‧‧‧ Connections

G214‧‧‧抵壓模 G214‧‧‧Pressure mould

G215‧‧‧溫控元件 G215‧‧‧temperature control components

G22‧‧‧承載座 G22‧‧‧ bearing seat

G221‧‧‧滑軌 G221‧‧‧rails

G222‧‧‧框座 G222‧‧‧ frame

G223‧‧‧上固定座 G223‧‧‧上固定座

G224‧‧‧下固定座 G224‧‧‧ lower seat

G23‧‧‧旋轉組件 G23‧‧‧Rotating components

G231‧‧‧軸輪 G231‧‧‧ axle wheel

G232‧‧‧驅動件 G232‧‧‧ drive parts

G233‧‧‧皮帶 G233‧‧‧Leather belt

G24‧‧‧測壓組件 G24‧‧‧ Pressure measuring components

G241‧‧‧荷重量測元件 G241‧‧‧Load weight measuring component

G25‧‧‧調整組件 G25‧‧‧Adjustment components

G251‧‧‧罩架 G251‧‧‧ mask frame

G252‧‧‧微調元件 G252‧‧‧ fine tuning components

G3‧‧‧膠帶機構 G3‧‧‧ tape mechanism

G31‧‧‧捲帶輪 G31‧‧‧Reel pulley

G311‧‧‧驅動件 G311‧‧‧ drive parts

G32‧‧‧捲收輪 G32‧‧‧ reel round

G321‧‧‧驅動件 G321‧‧‧ drive parts

G33‧‧‧膠帶偵測元件 G33‧‧‧ tape detection component

G34‧‧‧膠帶 G34‧‧‧ Tape

G35‧‧‧傳輸輪組 G35‧‧‧Transport wheel set

G351‧‧‧惰輪 G351‧‧‧ Idler

G4‧‧‧第一檢視單元 G4‧‧‧First inspection unit

Claims (14)

一種貼合製程之元件移載機構,包括:一移載軌座,其上設有移載軌道,移載軌道上設有移載座,移載座上設有一貼合機構及一膠帶機構,貼合機構可連動膠帶機構所提供的膠帶黏附一第一元件並進行移載。 The component transfer mechanism of the bonding process comprises: a transfer rail seat, on which a transfer rail is arranged, a transfer carriage is arranged on the transfer rail, and a transfer mechanism and a tape mechanism are arranged on the transfer seat, The bonding mechanism can adhere to the first component and transfer the tape provided by the tape mechanism. 如申請專利範圍第1項所述貼合製程之元件移載機構,其中,該第一元件位於一第一盤組件中,該貼合機構連動膠帶機構所提供的膠帶黏附第一元件移載至一第二盤組件中,並將第一元件貼合於第二元件上。 The component transfer mechanism of the bonding process of claim 1, wherein the first component is located in a first disk assembly, and the bonding mechanism is coupled to the tape provided by the tape mechanism to adhere the first component to the In a second disk assembly, the first component is attached to the second component. 如申請專利範圍第1項所述貼合製程之元件移載機構,其中,該移載座可位移於一第一輸送滑軌上一第一載座與一第二輸送滑軌上一第二載座間。 The component transfer mechanism of the bonding process according to the first aspect of the invention, wherein the transfer carrier is displaceable on a first transporting rail and a second transporting rail. Carrier room. 如申請專利範圍第1項所述貼合製程之元件移載機構,其中,該移載機構的移載座上設有一立設之固定座,固定座上一側設一第一檢視單元,另一側設一驅動件,該驅動件驅動固定座上一Z軸向滑軌上的一滑座可作Z軸向上、下位移;滑座上設一固定架,該固定架上設置該貼合機構及膠帶機構,使驅動件的驅動可使固定架上的貼合機構及膠帶機構同步作Z軸向上、下位移。 The component transfer mechanism of the bonding process according to the first aspect of the invention, wherein the transfer base of the transfer mechanism is provided with a standing fixing seat, and a first inspection unit is disposed on one side of the fixing seat, and A driving member is disposed on one side, and the driving member drives a sliding seat on a Z-axis sliding rail of the fixing seat to be displaced in the Z-axis upward and downward; the sliding seat is provided with a fixing frame, and the fixing frame is provided with the fitting The mechanism and the tape mechanism enable the driving member to drive the bonding mechanism and the tape mechanism on the fixing frame to simultaneously shift the Z-axis up and down. 如申請專利範圍第1項所述貼合製程之元件移載機構,其中,該貼合機構包括:一觸壓組件,以一本體設於一承載座的Z軸向滑軌上,可在滑軌上作Z軸向上、下位移,觸壓組件設有一抵壓軸,其下方藉一聯結件可連結接設一可作拆換的抵壓模。 The component transfer mechanism of the bonding process according to the first aspect of the invention, wherein the bonding mechanism comprises: a touch-pressure component, and a body is disposed on a Z-axis slide rail of a carrier, which is slidable The Z-axis is displaced upwards and downwards on the rail, and the touch-pressure component is provided with a pressing shaft, and a connecting member is connected to the bottom of the rail to connect and replace the pressing mold. 如申請專利範圍第5項所述貼合製程之元件移載機構,其中,該貼合機構之抵壓模包括一吸附座及位於吸附座底端下凸設的抵貼座。 The component transfer mechanism of the bonding process according to the fifth aspect of the invention, wherein the pressing die of the bonding mechanism comprises a suction seat and an abutment seat protruding below the bottom end of the adsorption seat. 如申請專利範圍第5項所述貼合製程之元件移載機構,其中,該貼合機構之抵壓模設有氣孔提供負壓吸力以吸附膠帶。 The component transfer mechanism of the bonding process according to the fifth aspect of the invention, wherein the pressing die of the bonding mechanism is provided with a venting hole to provide a negative pressure suction to adsorb the tape. 如申請專利範圍第1項所述貼合製程之元件移載機構,其中,該貼合機構包括:一旋轉組件,設於一承載座上的一框座中相隔間距的上固定座與下固定座間設有一有齒的軸輪,該軸輪被一驅動件以皮帶聯結驅動而可作旋轉。 The component transfer mechanism of the bonding process according to the first aspect of the invention, wherein the bonding mechanism comprises: a rotating component, the upper fixing seat and the lower fixing at a distance in a frame seat disposed on a carrier A toothed axle wheel is provided between the seats, and the axle wheel is driven by a drive member to be rotated by a belt coupling. 如申請專利範圍第1項所述貼合製程之元件移載機構,其中,該貼合機構包括:一測壓組件,其設有荷重量測元件並位於一旋轉組件與一觸壓組件間,測壓組件受旋轉組件所連動而可連動觸壓組件的一抵壓軸旋轉。 The component transfer mechanism of the bonding process of claim 1, wherein the bonding mechanism comprises: a pressure measuring component, which is provided with a load measuring component and is located between a rotating component and a touch component. The load cell is rotated by the rotating component and can be rotated by a pressing shaft of the touch component. 如申請專利範圍第1項所述貼合製程之元件移載機構,其中,該貼合機構包括:一調整組件,設於一上固定座上,其包括一罩架及於其內設有包括彈性元件的微調元件。 The component transfer mechanism of the affixing process of claim 1, wherein the affixing mechanism comprises: an adjusting component, disposed on an upper fixing base, comprising a cover frame and being disposed therein Fine tuning element of the elastic element. 如申請專利範圍第1項所述貼合製程之元件移載機構,其中,該貼合機構包括:設於一固定架上的承載座,承載座上承載並組構一觸壓組件、旋轉組件,測壓組件、調整組件以上下串聯在同一中心軸線;該調整組件的微調操作,可連動經旋轉組件、測壓組件而使該觸壓組件可在承載座的一Z軸向滑軌上作上、下微調位移。 The component transfer mechanism of the bonding process according to the first aspect of the invention, wherein the bonding mechanism comprises: a carrier disposed on a fixing frame, and the bearing block carries and assembles a touch component and a rotating component The pressure measuring component and the adjusting component are connected in series on the same central axis; the fine adjustment operation of the adjusting component can be linked through the rotating component and the pressure measuring component so that the touch component can be made on a Z-axis slide of the bearing seat Fine adjustment of the upper and lower displacements. 如申請專利範圍第1項所述貼合製程之元件移載機構,其中,該膠帶機構包括一載有膠帶捲並受一固定架後側驅動件驅動的捲帶輪及供回收捲帶並受一固定架後側驅動件驅動的捲收輪;其中,該捲帶輪及捲收輪同位於貼合機構一側,且捲帶輪位於捲收輪下方。 The component transfer mechanism of the bonding process according to the first aspect of the invention, wherein the tape mechanism comprises a take-up reel carrying a tape roll and driven by a rear side driving member of the fixing frame, and is used for recycling the tape. a reeling wheel driven by a rear side driving member of the fixing frame; wherein the reeling pulley and the winding reel are located on one side of the bonding mechanism, and the reeling wheel is located below the reeling wheel. 如申請專利範圍第12項所述貼合製程之元件移載機構,其中,該膠帶機構之捲帶輪側設有一膠帶偵測元件,以偵測捲帶輪上膠帶。 The component transfer mechanism of the laminating process according to claim 12, wherein the tape reel side of the tape mechanism is provided with a tape detecting component for detecting the tape on the reel. 如申請專利範圍第12項所述貼合製程之元件移載機構,其中,該捲帶輪及捲收輪配合一組由複數個惰輪所組成的傳輸輪組形成一膠帶的傳輸流路,該傳輸流路以膠帶具有黏膠的一側朝外方式環繞貼合機構周圍,使貼合機構位於傳輸流路的內部,且使膠帶繞貼附於貼合機構之一觸壓組件上一抵壓模下方。 The component transfer mechanism of the bonding process according to claim 12, wherein the take-up reel and the reeling wheel cooperate with a set of transmission wheels formed by a plurality of idlers to form a tape conveying flow path. The transport flow path surrounds the periphery of the bonding mechanism with the adhesive side of the adhesive tape facing outward, so that the bonding mechanism is located inside the transport flow path, and the adhesive tape is attached to one of the contact components of the bonding mechanism. Below the stamper.
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