CN216487991U

CN216487991U - Chip laminating equipment

Info

Publication number: CN216487991U
Application number: CN202122634941.9U
Authority: CN
Inventors: 陈洁; 陈鸣; 余寺强; 丁晓华; 周翔
Original assignee: Shenzhen Eagle Eye Online Electronics Technology Co ltd
Current assignee: Shenzhen Eagle Eye Online Electronics Technology Co ltd
Priority date: 2021-10-28
Filing date: 2021-10-28
Publication date: 2022-05-10
Anticipated expiration: 2031-10-28

Abstract

The application discloses chip laminating equipment for laminating a chip. The chip bonding apparatus includes: a main workbench, a feeding tray module, a dispensing module, a carrier plate conveying module, a turning module and an attaching module which are arranged on the main workbench, wherein the feeding balance weight module is used for placing the chip base at a preset feeding position to position and detect the chip base, the chip base after positioning and detection is placed in a transfer tray, the dispensing module is used for positioning and detecting the height of the placed chip base, dispensing the chip base, transferring the dispensed chip base to the turning module, the overturning module is used for overturning the chip base, the carrier plate conveying module is used for conveying the carrier plate provided with the chip to the attached module and conveying the carrier plate of the unattached chip base to the next attaching device, and the attached module is used for attaching the chip base after overturning to the chip of the carrier plate.

Description

Chip laminating equipment

Technical Field

The application relates to the technical field of chip attachment, in particular to chip attachment equipment.

Background

With the continuous progress of scientific technology and the continuous development of intellectualization, the intelligent manufacturing trend is great, wherein the chip manufacturing is also developed towards the direction of science and technology, intellectualization and high-end, and the development of the chip inevitably has higher and higher requirements on the chip attaching process. At present, before chip attachment, a chip and a carrier plate thereof need to be cleaned, then the cleaned carrier plate is manually placed on a workbench of an attachment machine table or placed on a feeding station of the attachment machine table through a carrying box, however, in the carrier plate transferring process, secondary pollution of the cleaned chip is easily caused, and manual tray arrangement operation is needed after transferring. The uncertainty of manual operation easily causes the product to be bad, has reduced the production qualification rate, leads to the product to scrap or do over again, and these all increase the manufacturing cost increase of enterprise.

In addition, some chip manufacturers adopt integrated equipment to carry out assembly production, but the motion structure of these integrated equipment is complicated, and equipment cost is high, lacks dynamics control moreover and pastes the dress precision not high, leads to damaging the product easily, causes the defective rate after the chip laminating to be high. Moreover, in the existing chip laminating equipment in the industry, most of the existing chip laminating equipment is provided with one cleaning machine for only one laminating machine to work, and the mode of supplying by a single machine not only has lower production efficiency, but also has higher production line splicing cost.

Therefore, it is an urgent need to solve the problem of the art to provide a chip bonding apparatus with high yield, low cost, high productivity, high precision and controllable bonding force.

SUMMERY OF THE UTILITY MODEL

In view of the not enough of above-mentioned prior art, the aim at of this application provides a chip laminating equipment, aims at solving because the attached qualification rate of current chip is low, with high costs and the problem that production efficiency is low, realizes high qualification rate, low cost, high productivity, high accuracy and the controllable chip laminating of attached dynamics.

A chip attaching device is used for attaching a chip. The chip bonding apparatus includes: a main workbench, a feeding tray module, a dispensing module, a carrier plate conveying module, a turning module and an attaching module which are arranged on the main workbench, wherein the feeding balance weight module is used for placing a chip base at a preset feeding position, positioning and detecting the chip base, the chip base after positioning and detection is placed in a transfer tray, the dispensing module is used for positioning and detecting the height of the placed chip base, dispensing the chip base, transferring the dispensed chip base to the turnover module, the overturning module is used for overturning the chip base, the carrier plate conveying module is used for conveying a carrier plate provided with a chip to the attached module and conveying the carrier plate of the unattached chip base to the next attaching device, and the attached module is used for attaching the chip base after overturning to the chip of the carrier plate.

In an exemplary embodiment, the feeding and placing module includes a feeding assembly, a feeding and carrying assembly, a placing assembly, and a feeding and transferring assembly, wherein the feeding assembly is configured to provide the chip bases, the feeding and carrying assembly is configured to carry the chip bases out of the feeding assembly, the placing assembly is configured to sequentially place the chip bases in the feeding and transferring assembly, and the feeding and transferring assembly is configured to transmit the chip bases to the dispensing module.

In an exemplary embodiment, the feeding assembly includes a plurality of feeding trays, a plurality of feeding baskets, and a plurality of feeding basket supporting shafts, wherein the plurality of feeding trays are used for placing the chip bases, the plurality of feeding trays are all located inside the feeding baskets and are sequentially distributed along a height direction of the feeding baskets, two surfaces of the feeding baskets, which are not closed, are oppositely arranged and face the feeding carrying assembly, and the plurality of feeding basket supporting shafts are used for supporting the feeding baskets and driving the feeding baskets to move along an axial direction of the feeding basket supporting shafts.

In an exemplary embodiment, the material handling assembly comprises a material handling table shaft and a material handling table, wherein the material handling table is slidably connected with the material handling table shaft and moves along an axial direction of the material handling table shaft, the material handling table has a height between a bottom surface of the material basket and a material handling tray adjacent to the bottom surface of the material basket, and the material handling table is used for carrying the material handling tray out of the material basket.

In an exemplary embodiment, the wobble plate assembly includes a wobble plate support, a wobble plate shaft, a wobble plate connector, a pickup lever control element, and a pickup lever, wherein the wobble plate support is located at two sides of the loading and carrying table shaft and is fixedly connected with the general table, the wobble plate shaft is fixed at one side of the wobble plate support facing away from the general table and spans across the loading and carrying table shaft and is perpendicular to the loading and carrying table shaft, the wobble plate connector is located at one side of the wobble plate shaft facing away from the wobble plate support and is slidably connected with the wobble plate shaft, the pickup lever control element is fixed at one side of the wobble plate connector facing the loading assembly, one end of the pickup lever is located in and is slidably connected with the pickup lever control element, the pickup lever is perpendicular to the wobble plate shaft, and an axial direction of the pickup lever faces the general table, the wobble plate connector moves along the axial direction of the wobble plate shaft, and the picking rod control element is used for controlling the picking rod to move towards or away from the general workbench and picking up the chip base and correcting the chip base.

In an exemplary embodiment, material loading transfer subassembly includes transfer tray axle, transfer tray connecting piece and transfer tray, wherein, the transfer tray axle with material loading transport workstation axle is parallel and is located the inboard of balance support, the transfer tray axle with total workstation fixed connection, the transfer tray connecting piece is located the transfer tray axle is to one side of total workstation dorsad and with transfer tray axle sliding connection, the transfer tray is located the transfer tray connecting piece deviates from one side of transfer tray axle, the transfer tray connecting piece along the axial direction of transfer tray axle removes, the transfer tray is used for holding the chip base.

In an exemplary embodiment, the feeding balance swing module further includes a feeding positioning camera component and a feeding correction camera component, wherein the feeding positioning camera component is located between the feeding carrying table shaft and the balance swing shaft and used for photographing and positioning the chip base on the feeding tray, the feeding correction camera component is located between the feeding carrying table shaft and the transfer tray shaft and located below the picking rod, the feeding correction camera component is used for detecting whether the chip base meets a predetermined requirement and is photographed and calibrated, and the picking rod corrects the chip base and puts the chip base into the transfer tray.

In an exemplary embodiment, the dispensing module includes a dispensing component, a first pushing component, a second pushing component and a dispensing workbench component, wherein the first pushing component and the second pushing component are arranged side by side and opposite to each other, the dispensing workbench component is located between the dispensing component and the first pushing component, the first pushing component is used for pushing the transfer tray to the dispensing workbench component, the dispensing component is used for dispensing the chip base on the transfer tray, and the second pushing component is used for pushing the transfer tray after dispensing to the turnover module.

In an exemplary embodiment, the dispensing assembly includes a dispensing spindle, a first dispensing shaft, a second dispensing shaft, a first dispensing arm, a first dispensing head, a third dispensing shaft, a fourth dispensing shaft, a second dispensing arm, and a second dispensing head, wherein the dispensing spindle and the swing disc shaft are in the same straight line and are fixedly connected to the main table, the dispensing spindle is located on a side of the transfer tray shaft away from the loading and carrying table shaft, the first dispensing shaft is located on a side of the dispensing spindle away from the main table and is slidably connected to the dispensing spindle, the first dispensing shaft is perpendicular to the dispensing spindle and moves along an axial direction of the dispensing spindle, the second dispensing shaft is located on a side of the first dispensing shaft away from the dispensing spindle and is slidably connected to the first dispensing shaft, and the second dispensing shaft is perpendicular to the first dispensing shaft and has an axial direction toward the main table The second dispensing shaft can move along the axial direction of the first dispensing shaft, one end of the first dispensing arm is vertically and slidably connected with the second dispensing shaft, the other end of the first dispensing arm is close to the first pushing assembly, the first dispensing arm can move along the axial direction of the second dispensing shaft, the first dispensing head is fixed at one end of the first dispensing arm far away from the second dispensing shaft, the first dispensing head is used for carrying out dispensing operation on the first half part of the chip base on the transfer tray, the third dispensing shaft is located the dispensing main shaft deviates from one side of the main workbench and is slidably connected with the dispensing main shaft, the third dispensing shaft is located the first dispensing shaft deviates from one side of the swing disc assembly and is parallel to the first dispensing shaft, the third dispensing shaft moves along the axial direction of the dispensing main shaft, the fourth dispensing shaft is located the third dispensing shaft deviates from one side of the dispensing main shaft and is parallel to the third dispensing main shaft A sliding connection is glued to the point, the fourth point glue the axle with the third point is glued the axle and is just perpendicular the axial direction orientation that the axle was glued to the fourth point total workstation, the fourth point glue the axle can along the axial direction of the axle is glued to the third point removes, the second point glue the arm one end with the fourth point is glued the axle and is just sliding connection perpendicularly, and its other end is close to the second pushes away the material subassembly, the second point glue the arm can along the axial direction of the axle is glued to the fourth point removes, the second point is glued the head and is fixed in the second point is glued the arm and is kept away from the one end that the axle was glued to the fourth point, the second point is glued the head and is used for right the latter half of chip base on the transfer tray carries out the operation of gluing.

In an exemplary embodiment, the dispensing table assembly includes a dispensing table support, a first dispensing table and a second dispensing table, wherein the dispensing table support is fixedly connected to the main table, the first dispensing table is located on a side of the dispensing table support away from the main table, the first dispensing table is located below the first dispensing head, the second dispensing table is located below the second dispensing head, and the first dispensing table and the second dispensing table are both used for supporting and fixing the transfer tray.

In an exemplary embodiment, the first pushing assembly includes a first pushing spindle, a first pushing connector, a first pushing lifting shaft, and a first material pushing arm, wherein the first pushing spindle is disposed opposite to and parallel to the dispensing spindle, the first pushing connector is disposed on a side of the first pushing spindle facing the dispensing assembly and slidably connected to the dispensing assembly, the first pushing connector moves along an axial direction of the first pushing spindle, one end of the first pushing lifting shaft is slidably connected to the first pushing connector, an end of the first pushing lifting shaft opposite to the first pushing connector is fixedly connected to the first material pushing arm, the first material pushing arm is perpendicular to the first pushing spindle and extends toward the dispensing assembly, and the first material pushing arm is slidably connected to the first pushing connector, the sliding direction is consistent with the axial direction of the first material pushing lifting shaft, and the first material shifting arm is used for pushing the transfer tray to the first dispensing workbench.

In an exemplary embodiment, the second pushing assembly includes a second pushing spindle, a second pushing connector, a second pushing lifting shaft, and a second material pushing arm, wherein the second pushing spindle is disposed opposite to and parallel to the dispensing spindle, the second pushing connector is disposed on a side of the second pushing spindle facing the dispensing assembly and slidably connected to the dispensing assembly, the second pushing connector moves along an axial direction of the second pushing spindle, one end of the second pushing lifting shaft is slidably connected to the second pushing connector, an end of the second pushing lifting shaft opposite to the second pushing connector is fixedly connected to the second material pushing arm, the second material pushing arm is perpendicular to the second pushing spindle and extends toward the dispensing assembly, and the second material pushing arm is slidably connected to the second pushing connector, the sliding direction is consistent with the axial direction of the second pushing lifting shaft, the second pushing arm is used for pushing the transfer tray to the second dispensing workbench, and the transfer tray is pushed to the overturning module after the rear part of the chip base is dispensed with glue. In an exemplary embodiment, the carrier plate conveying module includes an input assembly line, a lifting assembly line shaft, an output assembly line and a bottom conveying assembly line, the input assembly line, the lifting assembly line, the output assembly line and the bottom conveying assembly line are parallel to the first material pushing main shaft, the lifting assembly line shaft is fixedly connected with the main workbench and perpendicular to the lifting assembly line, the lifting assembly line is connected with the lifting assembly line shaft in a sliding manner and can move along the axial direction of the lifting assembly line shaft, the lifting assembly line and the output assembly line are located on two sides of the attaching module, the input assembly line is located at one end of the lifting assembly line far away from the attaching module, one end of the input assembly line far away from the lifting assembly line is connected with the cleaning machine or the previous-stage chip attaching device, the output assembly line is kept away from the one end of attached module with the drying-machine is connected or is connected with next-level chip laminating equipment, the output assembly line still has raising and lowering functions, bottom conveying assembly line is located the output assembly line with between the master work platform, bottom conveying assembly line includes support plate input and support plate output, the support plate input is close to the raising and lowering assembly line, the support plate output is close to the output assembly line.

In an exemplary embodiment, the carrier plate conveying module further comprises two material blocking plates, a carrier plate sensor and a carrier plate pushing rod, wherein the two material blocking plates are respectively installed at two ends of the input assembly line, close to and far away from the lifting assembly line, and used for controlling the conveying amount and the conveying speed of the carrier plate, the carrier plate sensor is arranged on the lifting assembly line and used for sensing whether the carrier plate leaves the lifting assembly line, and the carrier plate pushing rod is used for pushing the carrier plate to the attaching module.

In an exemplary embodiment, the flipping module includes a flipping table assembly and a flipping assembly, wherein the flipping table assembly is configured to receive the transfer tray transferred from the second material-shifting arm, and the flipping assembly is configured to flip the chip base on the transfer tray.

In an exemplary embodiment, the flipping table assembly includes a first flipping axis, a second flipping axis, a flipping table connecting member and a flipping table, wherein the first flipping axis is located at a side of the second dispensing table opposite to the first dispensing table and fixedly connected to the main table, the second flipping axis is located at a side of the first flipping axis opposite to the main table and perpendicular to the first flipping axis, the second flipping axis is slidably connected to the first flipping axis and moves along an axial direction of the first flipping axis, the flipping table connecting member is located at a side of the second flipping axis opposite to the first flipping axis and parallel to the first flipping axis, the flipping table connecting member is slidably connected to the second flipping axis and moves along an axial direction of the second flipping axis, the flipping table connecting member is used for supporting and fixing the flipping table, the height of the turnover workbench from the main workbench is consistent with that of the second dispensing workbench from the main workbench, and the turnover workbench is used for supporting and fixing the transfer tray.

In an exemplary embodiment, the turnover assembly includes a turnover assembly support, a turnover assembly connecting member, a turnover assembly positioning camera, a turnover spindle connecting member, a rotating member, a suction rod, and a suction head, wherein the turnover assembly support is fixedly connected to the main table, one end of the turnover assembly support opposite to the main table is fixedly connected to the turnover assembly connecting member, the turnover assembly positioning camera is located at one side of the turnover assembly connecting member facing the turnover table assembly, the turnover spindle is fixed to one side of the turnover assembly support and has an axial direction parallel to a height direction of the turnover assembly support, the turnover spindle connecting member is sleeved on a peripheral side of the turnover spindle and slidably connected to the turnover spindle, and the turnover spindle connecting member moves along the axial direction of the turnover spindle, the one end of rotating member with upset main shaft connecting piece fixed connection, the one end of absorbing the pole with the rotating member is kept away from the one end fixed connection of upset main shaft connecting piece, the axial direction orientation of absorbing the pole upset workstation subassembly, the rotating member area absorb the pole along the tangential direction rotation of absorbing the pole, it fixes to absorb the head absorb the pole and keep away from the one end of rotating member, it is used for absorbing to absorb the head chip base on the transfer tray.

In an exemplary embodiment, the attaching module includes an attaching assembly and an attaching table assembly, wherein the attaching assembly is used for correcting, detecting and attaching the chip base to the carrier plate, and the attaching table assembly is used for receiving the carrier plate transmitted from the lifting assembly line and conveying the carrier plate to the output assembly line.

In an exemplary embodiment, the attaching assembly comprises an attaching assembly support, an attaching main shaft, an attaching head connecting piece, an attaching head and an attaching correction camera, the attaching assembly support is fixedly connected with the general workbench, the attaching main shaft is positioned at one side of the attaching assembly support facing the overturning assembly and the overturning workbench assembly and is fixedly connected with the attaching assembly support, the attaching head connecting piece is positioned at one side of the attaching main shaft deviating from the attaching assembly support and is in sliding connection with the attaching main shaft, the attaching head connecting piece moves along the axial direction of the attaching main shaft, the attaching head is positioned at one side of the attaching head connecting piece deviating from the attaching main shaft and is fixedly connected with the attaching head connecting piece, the attaching head is used for absorbing the chip base and correcting the chip base after absorbing, attached correction camera is located upset workstation subassembly with between the attached workstation, and be located attached head below, attached correction camera is used for detecting after the upset whether the chip base accords with the predetermined requirement, attached head still includes force controller module, force controller module is used for control attached first attached dynamics.

In an exemplary embodiment, the attaching table assembly includes a first attaching shaft, a second attaching shaft, an attaching table, an attaching positioning camera connecting member and an attaching positioning camera, wherein the first attaching shaft is parallel to the main table and the elevating assembly line shaft, the second attaching shaft crosses the first attaching shaft and is perpendicular to and slidably connected to the first attaching shaft, the second attaching shaft moves along the axial direction of the first attaching shaft, the attaching table crosses the second attaching shaft and is perpendicular to and slidably connected to the second attaching shaft, the attaching table moves along the axial direction of the second attaching shaft, the attaching table is used for supporting and fixing the carrier plate transported from the elevating assembly line, one end of the attaching positioning camera connecting member is located on one side of the attaching assembly support deviating from the main table, and is located the top of first subsides attached axle, attached camera connecting piece is kept away from the one end of attached subassembly support to the direction of lift assembly line extends, the extension end of attached camera connecting piece is fixed with attached location camera, attached location camera is used for right on the support plate the chip is shot.

In an exemplary embodiment, the chip laminating equipment further comprises a recycling assembly line and a recycling workbench, the recycling assembly line is located on the inner side of the glue dispensing workbench support and below the first glue dispensing workbench, the recycling assembly line is fixedly connected with the main workbench, the recycling workbench is located between the recycling assembly line and the first turnover shaft, the recycling workbench is used for receiving the transfer tray and conveying the transfer tray to the recycling assembly line, and the recycling assembly line is used for conveying the transfer tray to the feeding hole of the glue dispensing module.

To sum up, this application chip laminating equipment need not artifical participation chip and pastes dress process and passes through the carrier plate conveying module will be attached to the carrier plate that has the chip and carry extremely the secondary pollution that the operation leads to has been avoided artifical the transportation to the upset module, has improved the qualification rate of product and has reduced manufacturing cost. And, material loading balance module is fixed a position and is revised camera subassembly location and revise the chip base through material loading location camera subassembly, it is right that the module is glued to the point through a point location camera chip base location is passed through laser position sensor is right the chip base is visited the height and is detected, the upset module passes through upset subassembly location camera attached revise the camera and attached location camera is right the chip base detects and fixes a position, has improved the attached precision of chip and the qualification rate of product. In addition, many chip laminating equipment establishes ties with cleaning machine and drying-machine, has improved production flow's efficiency, attached head still is equipped with power controller module guarantees that attached dynamics is moderate at attached in-process, avoids appearing attached not in place or attached dynamics too big product damage that leads to, has further improved the qualification rate of product. This application chip laminating equipment still is equipped with the recovery assembly line, has realized transfer tray recycles. Consequently, the attached process of high qualification rate, low cost, high productivity, high accuracy and the controllable chip of attached dynamics has been realized to this application chip laminating equipment.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic arrangement diagram of modules of a chip bonding apparatus disclosed in an embodiment of the present application;

fig. 2 is a schematic structural diagram of a feeding assembly of a feeding balance module of the chip bonding apparatus disclosed in the embodiment of the present application;

fig. 3 is a schematic structural diagram of a wobble plate assembly of a feeding wobble plate module of the chip bonding apparatus disclosed in the embodiment of the present application;

fig. 4 is a schematic structural view of a dispensing assembly of a dispensing module of the chip bonding apparatus disclosed in the embodiment of the present application;

fig. 5 is a schematic structural view of a first pushing assembly of a dispensing module of the chip bonding apparatus disclosed in the embodiment of the present application;

fig. 6 is a schematic structural view of a second pushing assembly of the dispensing module of the chip bonding apparatus disclosed in the embodiment of the present application;

fig. 7 is a schematic structural view of a dispensing table assembly of a dispensing module of the chip bonding apparatus disclosed in the embodiment of the present application;

fig. 8 is a schematic structural diagram of a bottom conveying line of a carrier plate conveying module of the chip bonding apparatus disclosed in the embodiment of the present application;

fig. 9 is a schematic structural diagram of a flip table assembly of a flip module of the chip bonding apparatus disclosed in the embodiment of the present application;

fig. 10 is a schematic structural diagram of an overturning assembly of an overturning module of the chip bonding apparatus disclosed in the embodiment of the present application;

fig. 11 is a schematic structural view of a flip assembly positioning camera of a flip module of the chip bonding apparatus disclosed in the embodiment of the present application;

fig. 12 is a schematic structural diagram of an attachment assembly of a flip module of the chip attachment apparatus disclosed in the embodiment of the present application;

fig. 13 is a schematic structural view of an attachment table assembly of a flip module of the chip attachment apparatus disclosed in the embodiment of the present application;

fig. 14 is a schematic structural view of an attachment positioning camera assembly of a flip module of the chip attachment apparatus disclosed in the embodiment of the present application;

fig. 15 is a schematic flow diagram of a chip base and a carrier of the chip bonding apparatus disclosed in the embodiment of the present application.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

The following description of the various embodiments refers to the accompanying drawings, which are included to illustrate specific embodiments that can be implemented by the application. The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings). Directional phrases used in this application, such as, for example, "upper," "lower," "front," "rear," "left," "right," "inner," "outer," "side," and the like, refer only to the orientation of the appended drawings and are, therefore, used herein for better and clearer illustration and understanding of the application and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrally connected; may be a mechanical connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art. It should be noted that the terms "first", "second", and the like in the description and claims of the present application and in the drawings are used for distinguishing between different objects and not for describing a particular order.

Furthermore, the terms "comprises," "comprising," "includes," "including," or "including," when used in this application, specify the presence of stated features, operations, elements, and/or the like, but do not limit one or more other features, operations, elements, and/or the like. Furthermore, the terms "comprises" or "comprising" mean that there are corresponding features, numbers, steps, operations, elements, components or combinations thereof disclosed in the specification, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, elements, components or combinations thereof, and are intended to cover non-exclusive inclusion. Furthermore, when describing embodiments of the present application, the use of "may" mean "one or more embodiments of the present application. Also, the term "exemplary" is intended to refer to an example or illustration.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

In the prior art, before the chip is attached, the chip and the carrier plate thereof need to be cleaned, then the cleaned carrier plate is manually placed on a workbench of an attaching machine table or the carrier plate is placed on a feeding station of the attaching machine table through a carrying box, however, in the carrier plate transferring process, secondary pollution of the cleaned chip is easily caused, and manual tray placing operation is needed after transferring. The uncertainty of manual operation easily causes the product to be bad, has reduced the production qualification rate, leads to the product to scrap or do over again, and these all increase the manufacturing cost increase of enterprise. In addition, some chip manufacturers adopt integrated equipment to carry out assembly production, but the motion structure of these integrated equipment is complicated, and equipment cost is high, lacks dynamics control moreover and pastes the dress precision not high, leads to damaging the product easily, causes the defective rate after the chip laminating to be high. Moreover, in the existing chip laminating equipment in the industry, most of the existing chip laminating equipment is provided with one cleaning machine for only one laminating machine to work, and the mode of supplying by a single machine not only has lower production efficiency, but also has higher production line splicing cost.

This application hopes to provide a can solve the chip subsides dress scheme of above-mentioned technique, and it can be solved because the current artifical qualification rate that participates in the attached lead to of chip is not high and manufacturing cost is high, further improves the attached precision of chip and the efficiency of production procedure, realizes the control to attached dynamics at the attached in-process of chip. Details of the apparatus and process of the application scheme chip mounter will be described in the following embodiments.

Referring to fig. 1, fig. 1 is a schematic diagram illustrating arrangement of modules of a chip bonding apparatus according to an embodiment of the present disclosure, and as shown in fig. 1, the present disclosure provides a chip bonding apparatus 100 for attaching a chip. In the embodiment of the present application, the die bonding apparatus 100 may include at least: the device comprises a general workbench 10, a feeding balance module 20, a dispensing module 30, a carrier plate conveying module 40, a turnover module 50 and an attaching module 60. The general workbench 10 is used for supporting the feeding balance module 20, the dispensing module 30, the carrier plate conveying module 40, the turning module 50 and the attaching module 60, wherein, the feeding balance weight module 20 is used for placing the chip base at a preset feeding position, positioning and detecting the chip base, and the positioned and detected chip base is placed in a transfer tray, the dispensing module 30 is used for positioning and detecting the height of the placed chip base, dispensing the chip base, transferring the dispensed chip base to the flip module 50, the overturning module 50 is used for overturning the chip base, the carrier plate conveying module 40 is used for conveying the carrier plate with the chips mounted thereon to the attaching module 60 and conveying the carrier plate without the chip base attached thereto to the next attaching device, the attaching module 60 is used for attaching the turned chip base to the chip of the carrier.

In the embodiment of the present application, a plurality of chip bonding devices are connected in series with a cleaning machine and a dryer, that is, the carrier plate conveying module 40 receives the carrier plate from the previous stage chip bonding device or the cleaning machine, and transmits the carrier plate to the bonding module 60, and the carrier plate conveying module 40 also transmits the bonded carrier plate to the dryer or transmits the carrier plate to the next stage chip bonding device.

To sum up, this application chip laminating equipment 100 need not artifical participation chip and pastes dress process and passes through the carrier plate that the chip will be attached to is carried extremely to carrier plate conveying module 40 attached to secondary pollution that leads to has avoided artifical the transportation, has improved the qualification rate of product and has reduced manufacturing cost. The material loading balance module 20 is fixed a position and revises the chip base through the high accuracy camera, it is right that the module 30 is glued through the high accuracy camera chip base location is right through laser position sensor the chip base surveys the height and detects, attached module 60 is right through the high accuracy camera the chip base detects and fixes a position, has improved the attached precision of chip and the qualification rate of product. Many chip laminating equipment 100 establishes ties with cleaning machine and drying-machine, has improved production flow's efficiency, attached module 60 still is equipped with the force controller, guarantees that attached in-process attaching dynamics is moderate, avoids appearing attached not in place or attached too big product damage that leads to of dynamics, has further improved the qualification rate of product. Therefore, the chip attaching device 100 of the present application realizes a chip attaching process with high yield, low cost, high productivity, high precision and controllable attaching force.

Referring to fig. 2 and 3 together, fig. 2 is a schematic structural diagram of a feeding assembly of a feeding swing plate module of a chip bonding apparatus disclosed in an embodiment of the present application, and fig. 3 is a schematic structural diagram of a swing plate assembly of the feeding swing plate module of the chip bonding apparatus disclosed in the embodiment of the present application. In the embodiment of the present application, the general workbench 10 is formed by splicing two flat plates, and is configured to support the feeding balance module 20, the dispensing module 30, the carrier plate conveying module 40, the turnover module 50, and the attachment module 60. The feeding balance weight module 20 comprises a feeding assembly 21, a feeding carrying assembly 22, a balance weight assembly 23 and a feeding transfer assembly 24. The feeding assembly 21 is configured to provide the chip base, the feeding and carrying assembly 22 is configured to carry the chip base out of the feeding assembly 21, the balance assembly 23 is configured to sequentially place the chip bases to the feeding and transferring assembly 24, and the feeding and transferring assembly 24 is configured to transmit the chip base to the dispensing module 30.

In the present embodiment, the feeding assembly 21 includes a plurality of feeding trays 211, a feeding basket 212, and a plurality of feeding basket supporting shafts 213. The plurality of loading trays 211 are used for placing a plurality of chip bases, the plurality of loading trays 211 are all located inside the loading baskets 212 and are sequentially distributed along the height direction of the loading baskets 212, and the distance between the adjacent loading baskets 212 is consistent. The feeding basket 212 is a rectangular box-shaped structure with two unsealed sides, the two unsealed sides are oppositely arranged and face the feeding carrying assembly 22, and the feeding basket support shafts 213 are used for supporting the feeding basket 212 and driving the feeding basket 212 to move along the axial direction of the feeding basket support shafts 213.

In the embodiment of the present application, the material loading and carrying assembly 22 includes a material loading and carrying table shaft 221 and a material loading and carrying table 222. Wherein the axial direction of the loading and carrying worktable axis 221 and the unsealed two sides of the loading basket 212 are on the same straight line, the material loading and conveying table 222 is mounted on the material loading and conveying table shaft 221, the material loading and conveying table 222 is connected with the material loading and conveying table shaft 221 in a sliding manner and can move along the axial direction of the material loading and conveying table shaft 221, the upper transfer table 222 should be higher than the bottom surface of the upper basket 212, lower than the upper tray 211 closest to the bottom surface of the upper basket 212 (i.e., the lowest upper tray 211 in the upper basket 212), that is, the level of the upper transfer station 222 is between the bottom surface of the upper basket 212 and the upper tray 211 adjacent the bottom surface of the upper basket 212, the loading and carrying table 222 is used for carrying the loading tray 211 out of the loading basket 212.

In the embodiment of the present application, the loading baskets 212 are disposed on the loading basket supporting shaft 213, the loading baskets 212 are provided with a plurality of loading trays 211 sequentially distributed along the height thereof, the distance between the adjacent loading trays 211 is equal, and the loading trays 211 are provided with a plurality of chip bases. The feeding and carrying table 222 moves along the feeding and carrying table shaft 221 toward the direction of the non-closed surface of the feeding basket 212, and stops moving after the feeding and carrying table 222 completely enters the feeding basket 212, at this time, the feeding and carrying table 222 is higher than the bottom surface of the feeding basket 212 and lower than the feeding tray 211 closest to the bottom surface of the feeding basket 212 (i.e., the lowest feeding tray 211 in the feeding basket 212). The feeding basket support shaft 213 carries the feeding basket 212 and moves towards the direction of the main workbench 10 through screw transmission, after the feeding carrying workbench 222 completely supports the feeding tray 211 at the lowest layer in the feeding basket 212, the feeding basket support shaft 213 stops moving, that is, the moving distance is greater than the distance between the feeding carrying workbench 222 and the feeding tray 211 at the lowest layer in the feeding basket 212 and is smaller than the distance between adjacent feeding baskets 212, and the feeding carrying workbench 222 supports the feeding tray 211 to move along the feeding carrying workbench shaft 221 towards the direction away from the feeding assembly 21.

In the present embodiment, the wobble plate assembly 23 includes a wobble plate holder 231, a wobble plate shaft 232, a wobble plate link 233, a pickup lever control 234, and a pickup lever 235. The pendulum plate support 231 is located on two sides of the loading and carrying table shaft 221 and fixedly connected to the main table 10, the pendulum plate shaft 232 is fixed on one side of the pendulum plate support 231 facing away from the main table 10, and spans the loading and carrying table shaft 221 and is perpendicular to the loading and carrying table shaft 221, the pendulum plate connecting piece 233 is located on one side of the pendulum plate shaft 232 facing away from the pendulum plate support 231 and is slidably connected to the pendulum plate shaft 232, the pendulum plate connecting piece 233 can move along the axial direction of the pendulum plate shaft 232, the pickup rod control element 234 is fixed on one side of the pendulum plate connecting piece 233 facing the loading assembly 21, and the pickup rod control element 234 is used for controlling the pickup rod 235 to pick up the chip base. One end of the pick-up rod 235 is located in the pick-up rod control element 234 and is slidably connected with the pick-up rod control element 234, the pick-up rod 235 is perpendicular to the wobble plate shaft 232, the axial direction of the pick-up rod 235 faces the general workbench 10, and the pick-up rod 235 is used for sucking the chip base and can move towards or away from the general workbench 10 and amend the chip base.

In the present embodiment, the loading transfer assembly 24 includes a transfer tray shaft 241, a transfer tray connector 242, and a transfer tray 243. Wherein, the transfer tray axle 241 with material loading transport workstation axle 221 is parallel and is located the inboard of balance staff support 231, the transfer tray axle 241 with total workstation 10 fixed connection, transfer tray connecting piece 242 is located the transfer tray axle 241 is to one side of total workstation 10 and with transfer tray axle 241 sliding connection, transfer tray connecting piece 242 can along the axial direction of transfer tray axle 241 removes, transfer tray 243 is located transfer tray connecting piece 242 deviates from one side of transfer tray axle 241 is used for holding the chip base.

In the embodiment of the present application, the feeding balance module 20 further includes a feeding positioning camera assembly (not shown) and a feeding correction camera assembly (not shown). The feeding positioning camera assembly is located between the feeding carrying workbench shaft 221 and the swing disc shaft 232 and used for photographing and positioning the chip bases on the feeding tray 211 to obtain each chip base placement condition, so that the picking rod 235 can accurately pick each chip base. The feeding correction camera assembly is located between the feeding carrying workbench shaft 221 and the transfer tray shaft 241 and below the picking rod 235, and is used for detecting whether the chip base is qualified or not and photographing and calibrating.

In the embodiment of the present application, the feeding and carrying table 222 holds the feeding tray 211 and moves in the direction away from the feeding assembly 21 along the feeding and carrying table shaft 221, and the feeding and carrying table 222, the feeding correction camera assembly, and the transfer tray connector 242 are located on a straight line. The feeding positioning camera component takes a picture of the chip bases to obtain the placement condition of each chip base, the swinging disc connecting piece 233 moves to the position right above the feeding carrying workbench 222 along the axial direction of the swinging disc shaft 232, the picking rod control component 234 controls the picking rod 235 to suck a single chip base downwards, the picking rod 235 returns to a preset distance and moves to the position right above the feeding correction camera component, the feeding correction camera component detects that the chip bases are qualified, the picking rod 235 moves to the position above the transfer tray 243, and the picking rod control component 234 controls the picking rod 235 to move downwards and release the chip bases. Thus, the placement of one of the chip bases is completed, and the above steps are repeated until the chip base is fully placed in the transfer tray 243, the transfer tray 243 moves along the transfer tray shaft 241 in a direction away from the swinging tray assembly 23, and the transfer tray connector 242 conveys the transfer tray 243 to the dispensing module 30.

Please refer to fig. 4 to 7 together, fig. 4 is a schematic structural diagram of a dispensing assembly of a dispensing module of a chip bonding apparatus disclosed in the present embodiment, fig. 5 is a schematic structural diagram of a first pushing assembly of the dispensing module of the chip bonding apparatus disclosed in the present embodiment, fig. 6 is a schematic structural diagram of a second pushing assembly of the dispensing module of the chip bonding apparatus disclosed in the present embodiment, and fig. 7 is a schematic structural diagram of a dispensing worktable of the dispensing module of the chip bonding apparatus disclosed in the present embodiment.

In the embodiment of the present application, the dispensing module 30 includes a dispensing assembly 31, a first pushing assembly 32, a second pushing assembly 33, and a dispensing table assembly 34. The first pushing assembly 32 and the second pushing assembly 33 are arranged side by side and opposite to the dispensing assembly 31, and the dispensing worktable assembly 34 is located between the dispensing assembly 31 and the first pushing assembly 32. The first pushing assembly 32 is configured to push the transfer tray 243 to the dispensing table assembly 34, the dispensing assembly 31 is configured to dispense the chip bases on the transfer tray 243, and the second pushing assembly 33 is configured to push the transfer tray 243 to the flipping module 50 after dispensing.

As shown in fig. 4, in the embodiment of the present application, the dispensing assembly 31 includes a dispensing spindle 311, a first dispensing shaft 312, a second dispensing shaft 313, a first dispensing arm 314, a first dispensing head 315, a third dispensing shaft 316, a fourth dispensing shaft 317, a second dispensing arm 318, and a second dispensing head 319. Wherein, the dispensing spindle 311 and the wobble plate shaft 232 are in the same straight line and fixedly connected with the main worktable 10, the dispensing spindle 311 is located on a side of the transfer tray shaft 241 away from the loading and carrying table shaft 221, the first dispensing spindle 312 is located on a side of the dispensing spindle 311 away from the general table 10 and is slidably connected to the dispensing spindle 311, the first dispensing shaft 312 is perpendicular to the dispensing spindle 311 and can move along the axial direction of the dispensing spindle 311, the second dispensing shaft 313 is located on a side of the first dispensing shaft 312 away from the dispensing spindle 311 and is connected with the first dispensing shaft 312 in a sliding manner, the second dispensing axis 313 is perpendicular to the first dispensing axis 312 and the axial direction of the second dispensing axis 313 is toward the general table 10, the second dispensing shaft 313 is movable along the axial direction of the first dispensing shaft 312. One end of the first dispensing arm 314 is perpendicular to and slidably connected to the second dispensing shaft 313, and the other end thereof is close to the first pushing assembly 32, and the first dispensing arm 314 can move along the axial direction of the second dispensing shaft 313. The first dispensing head 315 is fixed to an end of the first dispensing arm 314 away from the second dispensing shaft 313, and the first dispensing head 315 is configured to perform dispensing operation on a front half portion of the chip base on the transfer tray 243. The third dispensing shaft 316 is located on a side of the dispensing spindle 311 away from the main table 10 and is slidably connected to the dispensing spindle 311, the third dispensing shaft 316 is located on a side of the first dispensing shaft 312 away from the wobble plate assembly 23 and is parallel to the first dispensing shaft 312, and the third dispensing shaft 316 can move along an axial direction of the dispensing spindle 311. The fourth glue shaft 317 is located on one side of the third glue shaft 316 departing from the dispensing spindle 311 and is connected to the third glue shaft 316 in a sliding manner, the fourth glue shaft 317 is perpendicular to the third glue shaft 316, the axial direction of the fourth glue shaft 317 faces the general workbench 10, and the fourth glue shaft 317 can move along the axial direction of the third glue shaft 316. One end of the second dispensing arm 318 is perpendicular to and slidably connected to the fourth dispensing shaft 317, and the other end thereof is close to the second pushing assembly 33, and the second dispensing arm 318 can move along the axial direction of the fourth dispensing shaft 317. The second dispensing head 319 is fixed at one end of the second dispensing arm 318, which is far away from the fourth dispensing shaft 317, and the second dispensing head 319 is used for dispensing the rear half part of the chip base on the transfer tray 243. The first dispensing arm 314 and the second dispensing arm 318 are respectively provided with a dispensing positioning camera (not shown) and a laser position sensor (not shown), the dispensing positioning cameras are used for photographing and positioning the chip bases on the transfer tray 243 to obtain the position information of each chip base, so that the first dispensing head 315 and the second dispensing head 319 can accurately dispense each chip base, and the laser position sensor is used for detecting the height of each chip base, thereby avoiding disqualification in dispensing due to the height difference of the chip bases.

As shown in fig. 5, in the embodiment of the present application, the first pushing assembly 32 is disposed opposite to the first dispensing shaft 312, and the first pushing assembly 32 includes a first pushing main shaft 321, a first pushing connecting member 322, a first pushing lifting shaft 323, and a first material pulling arm 324. The first pushing main shaft 321 is opposite to and parallel to the dispensing main shaft 311, the first pushing connecting piece 322 is located on one side of the first pushing main shaft 321 facing the dispensing component 31 and is slidably connected to the dispensing component 31, the first pushing connecting piece 322 can move along the axial direction of the first pushing main shaft 321, one end of the first pushing lifting shaft 323 is slidably connected to the first pushing connecting piece 322, one end of the first pushing lifting shaft 323 opposite to the first pushing connecting piece 322 is fixedly connected to the first material shifting arm 324, the first material shifting arm 324 is perpendicular to the first pushing main shaft 321 and extends toward the dispensing component 31, the first material shifting arm 324 is slidably connected to the first pushing connecting piece 322, and the sliding direction is the same as the axial direction of the first lifting shaft 323, the first material shifting arm 324 is used for pushing the transfer tray 243 to the first dispensing table 342.

As shown in fig. 6, in the embodiment of the present application, the second pushing assembly 33 is disposed opposite to the third glue axis 316, and the second pushing assembly 33 includes a second pushing spindle 331, a second pushing connector 332, a second pushing lifting shaft 333, and a second material pulling arm 334. Wherein the second pushing spindle 331 is opposite to and parallel to the dispensing spindle 311, the second pushing connector 332 is disposed on a side of the second pushing spindle 331 facing the dispensing component 31 and is slidably connected to the dispensing component 31, the second pushing link 332 is movable along the axial direction of the second pushing spindle 331, one end of the second pushing lifting shaft 333 is slidably connected to the second pushing connecting member 332, one end of the second pushing lifting shaft 333 back to the second pushing connecting piece 332 is fixedly connected with the second material poking arm 334, the second material-pulling arm 334 is perpendicular to the second material-pushing spindle 332 and extends toward the dispensing assembly 31, the second material stirring arm 334 is slidably connected to the second material pushing connector 332, and the sliding direction is the same as the axial direction of the second material pushing lifting shaft 333. The second material-poking arm 334 is configured to push the transfer tray 243 to the second dispensing workbench 343, and push the transfer tray 243 with the rear half portion of the chip base dispensed to the flip module 50.

As shown in fig. 7, in the embodiment of the present application, the dispensing table assembly 34 is disposed between the dispensing assembly 31 and the first pushing assembly 32 and the second pushing assembly 33, and the dispensing table assembly 34 includes a dispensing table support 341, a first dispensing table 342, and a second dispensing table 343. The dispensing workbench support 341 is fixedly connected to the main workbench 10, the first dispensing workbench 342 and the second dispensing workbench 343 are located on one side of the dispensing workbench support 341 away from the main workbench 10, the first dispensing workbench 342 is located below the first dispensing head 315, the second dispensing workbench 343 is located below the second dispensing head 319, and both the first dispensing workbench 342 and the second dispensing workbench 343 are used for supporting and fixing the transfer tray 243. The dispensing module 30 further comprises a feeding hole (not shown), which is located between the transfer tray shaft 241 and the dispensing table assembly 34 and is aligned with the dispensing table assembly 34.

In the embodiment of the present application, the transfer tray connector 242 conveys the transfer tray 243 to the feed inlet of the dispensing module 30, the feed inlet supports the transfer tray 243 to rise to flush with the first dispensing workbench 342, the first material-shifting arm 324 moves to one side of the transfer tray 243 close to the transfer tray shaft 241 and aligns with the transfer tray 243 through the first material-pushing main shaft 321 and the first material-pushing lifting shaft 323, the first material-shifting arm 324 clamps and pushes the transfer tray 243 to the first dispensing workbench 342, the first material-shifting arm 324 releases the transfer tray 243, the dispensing positioning camera on the first dispensing arm 314 photographs the chip base and the laser position sensor detects the height of the chip base to obtain the position and height information of the chip base, the first dispensing head 315 performs dispensing operation on the front half portion of the chip base on the transfer tray 243. After the first half of the dispensing operation of the chip base is completed, the second material-stirring arm 334 moves to one side of the transfer tray 243 close to the feed port and aligns with the transfer tray 243 through the second material-pushing main shaft 331 and the second material-pushing lifting shaft 333, the second material-stirring arm 334 clamps and pushes the transfer tray 243 to the second dispensing workbench 343, the second material-stirring arm 334 releases the transfer tray 243, the dispensing positioning camera on the second dispensing arm 318 takes a picture of the chip base and the laser position sensor detects the height of the chip base to obtain the position and height information of the chip base, and the second dispensing head 319 performs the operation on the second half of the chip base on the transfer tray 243. After the second half of the die-based adhesive process is completed, the second material-transferring arm 334 slides to a side of the transfer tray 243 close to the first adhesive-dispensing workbench 342 and aligns with the transfer tray 243, and the second material-transferring arm 334 clamps and pushes the transfer tray 243 to the flipping module 50.

Referring back to fig. 1 and fig. 8, fig. 8 is a schematic structural diagram of a bottom conveying line of a carrier conveying module of a chip bonding apparatus disclosed in an embodiment of the present application. In the embodiment of the present application, the carrier plate conveying module 40 is disposed on one side of the first material pushing assembly 32 and the second material pushing assembly 33 departing from the dispensing assembly 31, and the carrier plate conveying module 40 includes an input flow line 41, an elevating flow line 42, an elevating flow line shaft 43, an output flow line 44 and a bottom conveying flow line 45. Wherein, input assembly line 41, lift assembly line 42 output assembly line 44 and bottom conveying assembly line 45 with it is parallel that first material main shaft 321 pushes away, lift assembly line axle 43 with total workstation 10 fixed connection and with lift assembly line 42 is perpendicular, lift assembly line 42 with lift assembly line axle 43 sliding connection just can follow the axial direction of lift assembly line axle 43 removes, lift assembly line 42 with output assembly line 44 is located the both sides of attached module 60, input assembly line 41 is located lift assembly line 42 keeps away from the one end of attached module 60, input assembly line 41 keeps away from the one end of lift assembly line 42 with cleaning machine or last one-level chip laminating equipment are connected, output assembly line 44 keeps away from the one end of attached module 60 with the drying-machine or with next-level chip laminating equipment is connected, output assembly line 44 still has raising and lowering functions, is convenient for receive attached chip base the support plate with attached chip base not the support plate, bottom conveying assembly line 45 is located output assembly line 44 with between the total workstation 10, bottom conveying assembly line 45 includes support plate input 451 and support plate output 452, support plate input 451 is close to lift assembly line 42, support plate output 452 is close to output assembly line 44. The carrier transport module 40 further includes two striker plates 411, a carrier sensor (not shown), and a carrier pushing rod (not shown). Wherein, two striker plate 411 installs respectively input assembly line 41 is close to and keeps away from lift assembly line 42's both ends are used for control the conveying capacity and the conveying speed of support plate, the support plate inductor sets up on the lift assembly line 42, be used for responding to whether the support plate leaves lift assembly line 42, the support plate push rod be used for with the support plate propelling movement extremely attached module 60.

In this application embodiment, lift assembly line 42 is followed lift assembly line 43's axial direction removes and with input assembly line 41 flushes, input assembly line 41 will follow cleaning machine or the equipment of laminating of last order chip are carried the support plate is carried extremely lift assembly line 42, carry a plurality of chip on the support plate, striker plate 411 goes up and down according to the attached condition, and then control the delivery capacity and the conveying speed of support plate. The lifting assembly line 42 conveys the carrier plate to the attaching module 60, when the carrier plate sensor senses that the carrier plate leaves the lifting assembly line 42, the carrier plate pushing rod pushes the carrier plate to the attaching module 60, and the output assembly line 44 conveys the attached carrier plate to the dryer. The lifting assembly line 42 moves along the axial direction of the lifting assembly line shaft 43 and is flush with the bottom conveying assembly line 45, the lifting assembly line 42 conveys the carrier plate to the bottom conveying assembly line 45, the output assembly line 44 is flush with the bottom conveying assembly line 45, and the carrier plate is conveyed to next-stage chip laminating equipment.

Please refer to fig. 9 to 14 together, fig. 9 is a schematic structural diagram of a flip table assembly of a flip module of a chip bonding apparatus disclosed in the present embodiment, fig. 10 is a schematic structural diagram of a flip assembly of a flip module of a chip bonding apparatus disclosed in the present embodiment, fig. 11 is a schematic structural diagram of a flip assembly positioning camera of a flip module of a chip bonding apparatus disclosed in the present embodiment, fig. 12 is a schematic structural diagram of an attachment assembly of a flip module of a chip bonding apparatus disclosed in the present embodiment, fig. 13 is a schematic structural diagram of an attachment table assembly of a flip module of a chip bonding apparatus disclosed in the present embodiment, and fig. 14 is a schematic structural diagram of an attachment positioning camera assembly of a flip module of a chip bonding apparatus disclosed in the present embodiment.

As shown in fig. 9 and 10, in the embodiment of the present application, the flipping module 50 includes a flipping table assembly 51 and a flipping assembly 52. The flipping unit 51 is configured to receive the transfer tray 243 transferred from the second material-transferring arm 334, and the flipping unit 52 is configured to flip the chip base on the transfer tray 243.

In the present embodiment, the flipping table assembly 51 comprises a first flipping axis 511, a second flipping axis 512, a flipping table connector 513 and a flipping table 514. The first turning shaft 511 is fixedly connected to the main table 10, the axial direction of the first turning shaft 511 is aligned with the first dispensing table 342 and the second dispensing table 343, the first turning shaft 511 is located on one side of the second dispensing table 343 away from the first dispensing table 342, that is, the first turning shaft 511 and the second dispensing table 343 are located on two opposite sides of the first dispensing table 342. The second flipping axis 512 is located on one side of the first flipping axis 511 away from the main workbench 10 and is perpendicular to the first flipping axis 511, the second flipping axis 512 is connected with the first flipping axis 511 in a sliding manner and can move along the axial direction of the first flipping axis 511, the flipping table connector 513 is located on one side of the second flipping axis 512 away from the first flipping axis 511 and is parallel to the first flipping axis 511, the flipping table connector 513 is connected with the second flipping axis 512 in a sliding manner and can move along the axial direction of the second flipping axis 512, one end of the flipping table connector 513 protrudes toward the second dispensing workbench 343, an extending end of the flipping table connector 513 is used for supporting and fixing the flipping table 514, the height of the flipping table 514 from the main workbench 10 is consistent with the height of the second dispensing workbench 343 from the main workbench 10, the turn-over table 514 is used for supporting and fixing the transfer tray 243.

In the embodiment of the present application, the turnover worktable 514 passes through the first turnover shaft 511 and the second turnover shaft 512 move to with the first dispensing worktable 342 and the second dispensing worktable 343 are located on the same straight line, and are close to the second dispensing worktable 343, the second material poking arm 334 pushes the transfer tray 243 to the turnover worktable 514, the turnover worktable 514 is fixed the transfer tray 243 and passes through the first turnover shaft 511 and the second turnover shaft 512 move below the turnover component 52.

As shown in fig. 10 and 11, in the embodiment of the present application, the flipping unit 52 is located on a side of the second dispensing arm 318 facing away from the first dispensing arm 314, and the flipping unit 52 includes a flipping unit support 521, a flipping unit connector 522, a flipping unit positioning camera 523, a flipping spindle 524, a flipping spindle connector 525, a rotating unit 526, a suction rod 527, and a suction head 528. The overturning component support 521 is fixedly connected with the general workbench 10, the overturning component support 521 is back to one end of the general workbench 10 and is fixedly connected with the overturning component connecting piece 522, the overturning component positioning camera 523 is located on one side of the overturning component connecting piece 522 facing the overturning workbench component 51, the overturning spindle 524 is fixed on one side of the overturning component support 521, the axial direction of the overturning spindle 524 is parallel to the height direction of the overturning component support 521, the overturning spindle connecting piece 525 is sleeved on the periphery side of the overturning spindle 524 and is in sliding connection with the overturning spindle 524, and the overturning spindle connecting piece 525 can move along the axial direction of the overturning spindle 524. One end of the rotating member 526 is fixedly connected to the turning spindle connector 525, one end of the suction rod 527 is fixedly connected to one end of the rotating member 526 far away from the turning spindle connector 525, the axial direction of the suction rod 527 faces the turning table assembly 51, the rotating member 526 drives the suction rod 527 to rotate along the tangential direction of the suction rod 527, one end of the suction rod 527 far away from the rotating member 526 is fixed with the suction head 528, and the suction head 528 is used for sucking the chip base on the transfer tray 243.

In the application embodiment, the flipping table 514 holds the transferring tray 243 and moves to the lower side of the flipping unit positioning camera 523 through the first flipping shaft 511 and the second flipping shaft 512, the flipping unit positioning camera 523 photographs the transferring tray 243 to obtain the position information of each chip pad placed in the transferring tray 243, the single chip pad is located right under the suction head 528 through the first flipping shaft 511 and the second flipping shaft 512, the flipping spindle connector 525 moves towards the direction of the suction head 528 facing the transferring tray 243 to keep a predetermined gap between the suction head 528 and the chip pad, the suction head 528 sucks the chip pad, and then the flipping spindle connector 525 moves towards the direction of the suction head 528 far away from the transferring tray 243, the moving distance is such that the chip base does not contact the transfer tray 243 when rotating, the rotating member 526 drives the suction rod 527 and the suction head 528 to rotate 180 degrees, that is, one end of the chip base where the glue is dispensed faces the transfer tray 243, the turning spindle connector 525 moves towards the direction where the suction head 528 faces the transfer tray 243, so that the suction head 528 and the chip base keep a predetermined gap, and then the suction head 528 releases the chip base, so that the rotation of the single chip base is completed, and the above steps are repeated to complete the turning of each chip base.

As shown in fig. 12 and 13, in the embodiment of the present application, the attaching module 60 includes an attaching assembly 61 and an attaching table assembly 62. Wherein the attaching assembly 61 is used for correcting, detecting and attaching the chip base to the carrier plate, and the attaching table assembly 62 is used for receiving the carrier plate transferred from the lifting assembly line 42 and conveying the carrier plate to the output assembly line 44.

In the present embodiment, the attaching assembly 61 includes an attaching assembly support 611, an attaching main shaft 612, an attaching head connector 613, and an attaching head 614. Wherein the attaching component support 611 is fixedly connected with the general workbench 10, the attaching main shaft 612 is positioned at one side of the attaching component support 611 facing the overturning component 51 and the overturning workbench component 52, the attaching main shaft 612 is fixedly connected with the attaching assembly support 611, the attaching head connecting piece 613 is positioned at one side of the attaching main shaft 612, which is far away from the attaching assembly support 611, and is connected with the attaching main shaft 612 in a sliding way, the attachment head connector 613 is movable along the axial direction of the attachment main shaft 612, the attaching head 614 is located on a side of the attaching head connecting piece 613 facing away from the attaching main shaft 612 and is fixedly connected with the attaching head connecting piece 613, the attaching head 614 is retractable in a direction facing the general table 10, and the attaching head 614 is used for sucking the chip base and correcting the sucked chip base. Attached subassembly 61 still includes attached correction camera (not shown), wherein, attached correction camera is located upset workstation subassembly 51 with between the attached workstation subassembly 62, just attached correction camera with distance between the total workstation 10 is less than attached head 614 with distance between the total workstation 10, attached correction camera is used for right the chip base is shot, is convenient for detect whether the chip base is qualified. The attachment head 614 also includes a force controller module (not shown) that is used primarily to control the attachment force of the attachment head 614.

Specifically, in this application embodiment of the institute, it accomplishes to absorb head 528 every on the transfer tray 243 the upset of chip base, transfer tray 243 passes through first trip shaft 511 with second trip shaft 512 moves to the below of attached head 614, attached head 614 absorbs on the transfer tray 243 move behind the chip base directly over attached correction camera, attached correction camera is right the chip base is shot, if it is qualified to detect, attached head 614 will be followed the axial direction of attached main shaft 612 will the chip base moves to attached workstation subassembly 62, if it is unqualified to detect, attached head 614 can be unqualified the chip base is thrown to the throwing box (not shown).

As shown in fig. 13 and 14, in the present embodiment, the attaching table assembly 62 is located between the elevating and lowering line 42 and the output flow line 44, and the attaching table assembly 62 includes a first attaching shaft 621, a second attaching shaft 622, an attaching table 623, an attaching and positioning camera connector 624, and an attaching and positioning camera 625. Wherein the first attaching shaft 621 is fixedly connected to the main table 10 and parallel to the lifting assembly line shaft 43, the second attaching shaft 622 crosses the first attaching shaft 621 and is vertically and slidably connected to the first attaching shaft 621, the second attaching shaft 622 can move along the axial direction of the first attaching shaft 621, the attaching table 623 crosses the second attaching shaft 622 and is vertically and slidably connected to the second attaching shaft 622, the attaching table 623 can move along the axial direction of the second attaching shaft 622, the attaching table 623 is parallel to the first attaching shaft 621, the attaching table 623 is used for supporting and fixing the carrier plate transported from the lifting assembly line 42, one end of the attaching positioning camera connecting piece 624 is located on the side of the attaching support 611 departing from the main table 10 and above the first attaching shaft 621, attached camera connecting piece 624 is kept away from the one end of attached subassembly support 611 to the direction of lift assembly line 42 extends, the extension end of attached camera connecting piece 624 is fixed with attached location camera 625, attached location camera 625 is used for right on the support plate the chip is shot, obtains every the positional information of chip.

In the embodiment of this application, lift assembly line 42 along lift assembly line axle 43's axial direction remove and with attached workstation 623 flushes, attached workstation 623 passes through first attached axle 621 with second attached axle 622 draws close lift assembly line 42, attached workstation 623 with lift assembly line 42 is located same straight line. The carrier pushing rod pushes the carrier on the lifting line 42 to the attaching table 623, the affixing table 623 is moved to directly below the affixing positioning camera 625 by the first affixing shaft 621 and the second affixing shaft 622, the attaching and positioning camera 625 photographs the carrier plate to obtain the position information of each chip on the carrier plate, the attachment head 614 moves the chip base above the attachment table 623 and aligns the chip position, the attaching head 614 moves in a direction facing the attaching table 623 and attaches the chip pad to the chip, in the attaching process, the force controller module monitors and controls attaching force in real time, so that the attaching of the chip base and the chip is completed, and the steps are repeated to complete the attaching of each chip on the carrier plate.

In this application embodiment, attached workstation 623 passes through first attached axle 621 with second attached axle 622 to output assembly line 44 draws close, attached workstation 623 with output assembly line 44 is in same straight line and flushes, attached workstation 623 release right the support plate fixed and with the support plate is carried extremely on the output assembly line 44, output assembly line 44 will the support plate is carried to the drying-machine.

Referring to fig. 7, in the embodiment of the present application, the die bonding apparatus 100 further includes a recycling line 70 and a recycling table (not shown). The recycling assembly line 70 is located inside the dispensing workbench support 341 and below the first dispensing workbench 342, the recycling assembly line 70 is fixedly connected with the main workbench 10, and the recycling workbench is located between the recycling assembly line 70 and the first overturning shaft 511. The recycling workbench is configured to receive the transfer tray 243 and convey the transfer tray 243 to the recycling line 70, and the recycling line 70 is configured to convey the transfer tray 243 to the feeding hole.

In the embodiment of the present application, the attaching head 614 absorbs the chip base on the transfer tray 243, the turning table 514 is close to the recycling line 70 through the first turning shaft 511 and the second turning shaft 512, and moves to the right above the recycling line, the recycling line is upwards jacked up and fixed to the transfer tray 243, the turning table 514 is far away from the recycling line 70 through the first turning shaft 511 and the second turning shaft 512, the recycling line 70 is flush with the recycling line 70 downwards, and the transfer tray 243 is conveyed to the recycling line 70, the recycling line 70 conveys the transfer tray 243 to the feed port, the feed port conveys the transfer tray 243 to the transfer tray connector 242, the transfer tray connector 242 moves to the swing tray assembly 23 along the axial direction of the transfer tray shaft 241, the transfer tray 243 waits for the next round of placing the chip base. Thus, the recycling of the relay tray 243 is completed.

Referring to fig. 15, fig. 15 is a schematic flow direction diagram of a chip base and a carrier plate of the chip bonding apparatus disclosed in the embodiment of the present application, in which the flow direction of the chip base sequentially includes the feeding tray 211, the feeding and carrying table 222, the transfer tray connector 242, the feeding hole, the first dispensing table 342, the second dispensing table 343, the flip table 514, and the bonding table 623. The flow direction of the carrier plate is sequentially a cleaning machine or a previous-stage chip laminating device, the input assembly line 41, the lifting assembly line 42, the attaching workbench 623, the output assembly line 44 or the bottom conveying assembly line 45 and a drying machine or a next-stage chip laminating device.

To sum up, this application chip laminating equipment 100 need not artifical participation chip and pastes dress process and passes through the carrier plate that has the chip to be attached to is carried extremely to carrier plate conveying module 40 the secondary pollution that the operation leads to has been avoided artifical the transportation to upset module 50, has improved the qualification rate of product and has reduced manufacturing cost. Moreover, material loading balance weight module 20 revises camera subassembly location and revises the chip base through material loading positioning camera subassembly and material loading, it is right that module 30 is glued through point and is glued the location camera to the chip base location and pass through laser position sensor is right the chip base is visited the height and is detected, upset module 50 passes through upset subassembly location camera 523 attached revises the camera and attached location camera 625 is right the chip base detects and fixes a position, has improved the attached precision of chip and the qualification rate of product. In addition, many chip laminating equipment establishes ties with cleaning machine and drying-machine, has improved production flow's efficiency, attached head 614 still is equipped with power controller module guarantees that attached dynamics is moderate at attached in-process, avoids appearing attached not in place or attached dynamics too big and leads to the product to damage, has further improved the qualification rate of product. The chip bonding equipment 100 is further provided with a recycling assembly line 70, and the transfer tray 243 is recycled. Therefore, the chip attaching device 100 of the present application realizes a chip attaching process with high yield, low cost, high productivity, high precision and controllable attaching force.

It should be understood that the application of the present application is not limited to the above examples, and that modifications or changes may be made by those skilled in the art based on the above description, and all such modifications and changes are intended to fall within the scope of the appended claims. It will be understood by those skilled in the art that all or part of the above-described embodiments may be implemented and equivalents may be made thereto without departing from the scope of the utility model as defined by the appended claims.

Claims

1. A chip bonding apparatus, comprising: a main workbench, a feeding tray module, a dispensing module, a carrier plate conveying module, a turning module and an attaching module which are arranged on the main workbench, wherein the feeding balance weight module is used for placing a chip base at a preset feeding position, positioning and detecting the chip base, the chip base after positioning and detection is placed in a transfer tray, the dispensing module is used for positioning and detecting the height of the placed chip base, dispensing the chip base, transferring the dispensed chip base to the turnover module, the overturning module is used for overturning the chip base, the carrier plate conveying module is used for conveying the carrier plate provided with the chip to the attached module and the next laminating equipment, and the attached module is used for laminating the chip base after overturning on the chip of the carrier plate.

2. The chip bonding apparatus according to claim 1, wherein the loading tray module comprises a loading assembly, a loading carrying assembly, a tray assembly and a loading transfer assembly, wherein the loading assembly is configured to provide the chip bases, the loading carrying assembly is configured to carry the chip bases out of the loading assembly, the tray assembly is configured to sequentially place the chip bases in the loading transfer assembly, and the loading transfer assembly is configured to transfer the chip bases to the dispensing module.

3. The chip bonding apparatus according to claim 2, wherein the feeding assembly comprises a plurality of feeding trays, a feeding basket and a plurality of feeding basket supporting shafts, wherein the plurality of feeding trays are used for placing the chip bases, the plurality of feeding trays are all located inside the feeding basket and are sequentially distributed along the height direction of the feeding basket, two unsealed sides of the feeding basket are oppositely arranged and face the feeding carrying assembly, and the plurality of feeding basket supporting shafts are used for supporting the feeding basket and driving the feeding basket to move along the axial direction of the feeding basket supporting shafts.

4. The apparatus for die attachment according to claim 3, wherein the material handling assembly comprises a material handling table shaft and a material handling table, wherein the material handling table is slidably connected to the material handling table shaft and moves along an axial direction of the material handling table shaft, the material handling table has a height between a bottom surface of the material lifting basket and a material handling tray adjacent to the bottom surface of the material lifting basket, and the material handling table is configured to carry the material handling tray out of the material lifting basket.

5. The chip bonding apparatus according to claim 4, wherein the wobble plate assembly comprises a wobble plate support, a wobble plate shaft, a wobble plate connector, a pickup lever control element, and a pickup lever, wherein the wobble plate support is located on both sides of the loading and carrying table shaft and is fixedly connected to the main table, the wobble plate shaft is fixed to a side of the wobble plate support facing away from the main table and spans across the loading and carrying table shaft and is perpendicular to the loading and carrying table shaft, the wobble plate connector is located on a side of the wobble plate shaft facing away from the wobble plate support and is slidably connected to the wobble plate shaft, the pickup lever control element is fixed to a side of the wobble plate connector facing the loading assembly, one end of the pickup lever is located within the pickup lever control element and is slidably connected to the pickup lever control element, and the pickup lever is perpendicular to the wobble plate shaft, and the axial direction of the picking rod faces to the general workbench, the wobble plate connecting piece moves along the axial direction of the wobble plate shaft, and the picking rod control element is used for controlling the picking rod to move towards or away from the general workbench and picking up the chip base and correcting the chip base.

6. The chip bonding apparatus according to claim 5, wherein the loading transfer assembly includes a transfer tray shaft, a transfer tray connector, and a transfer tray, wherein the transfer tray shaft is parallel to the loading and carrying table shaft and is located inside the swing tray support, the transfer tray shaft is fixedly connected to the main table, the transfer tray connector is located on a side of the transfer tray shaft opposite to the main table and slidably connected to the transfer tray shaft, the transfer tray is located on a side of the transfer tray connector opposite to the transfer tray shaft, the transfer tray connector moves along an axial direction of the transfer tray shaft, and the transfer tray is used for holding the chip base.

7. The chip bonding apparatus according to claim 6, wherein the loading balance swing module further comprises a loading positioning camera component and a loading correction camera component, wherein the loading positioning camera component is located between the loading carrying table shaft and the balance swing shaft and used for photographing and positioning the chip base on the loading tray, the loading correction camera component is located between the loading carrying table shaft and the transfer tray shaft and located below the pick-up rod and used for detecting whether the chip base meets a predetermined requirement and photographing and calibrating, and the pick-up rod corrects the chip base and puts the chip base into the transfer tray.

8. The chip bonding apparatus according to claim 6, wherein the dispensing module includes a dispensing component, a first pushing component, a second pushing component, and a dispensing table component, wherein the first pushing component and the second pushing component are arranged side by side and opposite to the dispensing component, the dispensing table component is located between the dispensing component and the first pushing component, the first pushing component is used for pushing the transfer tray to the dispensing table component, the dispensing component is used for dispensing the chip base on the transfer tray, and the second pushing component is used for pushing the transfer tray after dispensing to the flipping module.

9. The apparatus for die bonding according to claim 8, wherein the dispensing assembly comprises a dispensing spindle, a first dispensing spindle, a second dispensing spindle, a first dispensing arm, a first dispensing head, a third dispensing spindle, a fourth dispensing spindle, a second dispensing arm, and a second dispensing head, wherein the dispensing spindle is aligned with the pivot axis and is fixedly connected to the main table, the dispensing spindle is located on a side of the transfer tray axis away from the loading and carrying table axis, the first dispensing spindle is located on a side of the dispensing spindle away from the main table and is slidably connected to the dispensing spindle, the first dispensing spindle is perpendicular to the dispensing spindle and moves along an axial direction of the dispensing spindle, and the second dispensing spindle is located on a side of the first dispensing spindle away from the dispensing spindle and is slidably connected to the first dispensing spindle, the second dispensing shaft is perpendicular to the first dispensing shaft, the axial direction of the second dispensing shaft faces the main workbench, the second dispensing shaft can move along the axial direction of the first dispensing shaft, one end of a first dispensing arm is perpendicular to and slidably connected with the second dispensing shaft, the other end of the first dispensing arm is close to the first pushing assembly, the first dispensing arm can move along the axial direction of the second dispensing shaft, a first dispensing head is fixed at one end of the first dispensing arm far away from the second dispensing shaft, the first dispensing head is used for dispensing the first half part of a chip base on the transit tray, the third dispensing shaft is located on one side, away from the main workbench, of the dispensing spindle and slidably connected with the dispensing spindle, the third dispensing shaft is located on one side, away from the swing disc assembly, of the first dispensing shaft and parallel to the first dispensing shaft, the axle is glued to the third point is followed the axial direction of point main shaft removes, the axle is glued to the fourth point is located the axle deviates from the third point glue the axle one side of main shaft and with the axle sliding connection is glued to the third point, the fourth point glue the axle with the axle is perpendicular just glued to the third point the axial direction orientation of axle is glued to the fourth point total workstation, the fourth point glue the axle can along the axial direction removal of axle is glued to the third point, the second point glue the arm one end with the axle is glued to the fourth point is perpendicular and sliding connection, and its other end is close to the second pushes away the material subassembly, the second point glue the arm can along the axial direction removal of axle is glued to the fourth point, the second point is glued the head and is fixed in the second point is glued the arm and is kept away from the one end of axle is glued to the fourth point, the second point is glued the head and is used for right the latter half of chip base on the transfer tray carries out the point and glues the operation.

10. The apparatus for die bonding according to claim 9, wherein the dispensing station assembly comprises a dispensing station support, a first dispensing station and a second dispensing station, wherein the dispensing station support is fixedly connected to the main station, the first dispensing station and the second dispensing station are located on a side of the dispensing station support away from the main station, the first dispensing station is located below the first dispensing head, the second dispensing station is located below the second dispensing head, and both the first dispensing station and the second dispensing station are used for supporting and fixing the transfer tray.

11. The chip bonding apparatus according to claim 10, wherein the first pushing assembly comprises a first pushing spindle, a first pushing connector, a first pushing lifting shaft and a first pushing arm, wherein the first pushing spindle is disposed opposite to and parallel to the dispensing spindle, the first pushing connector is disposed on a side of the first pushing spindle facing the dispensing assembly and slidably connected to the dispensing assembly, the first pushing connector moves along an axial direction of the first pushing spindle, one end of the first pushing lifting shaft is slidably connected to the first pushing connector, an end of the first pushing lifting shaft opposite to the first pushing connector is fixedly connected to the first pushing arm, the first pushing arm is perpendicular to the first pushing spindle and extends toward the dispensing assembly, and the first pushing arm is slidably connected to the first pushing connector, the sliding direction is consistent with the axial direction of the first material pushing lifting shaft, and the first material shifting arm is used for pushing the transfer tray to the first dispensing workbench.

12. The chip bonding apparatus according to claim 11, wherein the second pushing assembly comprises a second pushing spindle, a second pushing connector, a second pushing lifting shaft, and a second material pushing arm, wherein the second pushing spindle is disposed opposite to and parallel to the dispensing spindle, the second pushing connector is disposed on a side of the second pushing spindle facing the dispensing assembly and slidably connected to the dispensing assembly, the second pushing connector moves along an axial direction of the second pushing spindle, one end of the second pushing lifting shaft is slidably connected to the second pushing connector, an end of the second pushing lifting shaft opposite to the second pushing connector is fixedly connected to the second material pushing arm, and the second material pushing arm and the second pushing spindle are perpendicular to each other and extend toward the dispensing assembly, the second dials the material arm with the second pushes away material connecting piece sliding connection, gliding direction with the second pushes away the axial direction unanimous that pushes away the material lift axle, the second dials the material arm and is used for with the propelling movement of transfer tray extremely workstation is glued to the second point to will accomplish the latter half point of chip base is glued transfer tray propelling movement extremely the upset module.

13. The chip bonding apparatus according to claim 12, wherein the carrier plate conveying module includes an input flow line, a lifting flow line shaft, an output flow line, and a bottom conveying flow line, the input flow line, the lifting flow line, the output flow line, and the bottom conveying flow line are parallel to the first pushing main shaft, the lifting flow line shaft is fixedly connected to the main worktable and perpendicular to the lifting flow line, the lifting flow line is slidably connected to the lifting flow line shaft and can move along an axial direction of the lifting flow line shaft, the lifting flow line and the output flow line are located on two sides of the bonding module, the input flow line is located at an end of the lifting flow line away from the bonding module, an end of the input flow line away from the lifting flow line is connected to the cleaning machine or the previous chip bonding apparatus, the output assembly line is kept away from the one end of attached module with the drying-machine is connected or is connected with next-level chip laminating equipment, the output assembly line still has raising and lowering functions, bottom conveying assembly line is located the output assembly line with between the master work platform, bottom conveying assembly line includes support plate input and support plate output, the support plate input is close to the raising and lowering assembly line, the support plate output is close to the output assembly line.

14. The chip bonding apparatus according to claim 13, wherein the carrier plate conveying module further comprises two material blocking plates, a carrier plate sensor and a carrier plate pushing rod, wherein the two material blocking plates are respectively installed at two ends of the input assembly line, which are close to and far away from the lifting assembly line, for controlling the conveying amount and the conveying speed of the carrier plate, the carrier plate sensor is arranged on the lifting assembly line for sensing whether the carrier plate leaves the lifting assembly line, and the carrier plate pushing rod is used for pushing the carrier plate to the bonding module.

15. The die attaching apparatus according to claim 13, wherein said flipping module includes a flipping station assembly for receiving said transfer tray transferred from said second pick arm and a flipping assembly for flipping said die pads on said transfer tray.

16. The chip bonding apparatus according to claim 15, wherein the flipping table assembly comprises a first flipping shaft, a second flipping shaft, a flipping table connecting member and a flipping table, wherein the first flipping shaft is located at a side of the second dispensing table opposite to the first dispensing table and fixedly connected to the main table, the second flipping shaft is located at a side of the first flipping shaft opposite to the main table and perpendicular to the first flipping shaft, the second flipping shaft is slidably connected to the first flipping shaft and moves along an axial direction of the first flipping shaft, the flipping table connecting member is located at a side of the second flipping shaft opposite to the first flipping shaft and parallel to the first flipping shaft, the flipping table connecting member is slidably connected to the second flipping shaft and moves along an axial direction of the second flipping shaft, the turnover worktable connecting piece is used for supporting and fixing the turnover worktable, the distance between the turnover worktable and the total worktable is equal to the distance between the second dispensing worktable and the total worktable, and the turnover worktable is used for supporting and fixing the transfer tray.

17. The die bonding apparatus according to claim 16, wherein the flip assembly includes a flip assembly holder, a flip assembly connector, a flip assembly positioning camera, a flip spindle connector, a rotary member, a suction rod, and a suction head, wherein the flip assembly holder is fixedly connected to the main table, one end of the flip assembly holder facing away from the main table is fixedly connected to the flip assembly connector, the flip assembly positioning camera is located on a side of the flip assembly connector facing the flip table assembly, the flip spindle is fixed to one side of the flip assembly holder with its axial direction parallel to a height direction of the flip assembly holder, the flip spindle connector is sleeved on a peripheral side of the flip spindle and slidably connected to the flip spindle, and the flip spindle connector moves along the axial direction of the flip spindle, the one end of rotating member with upset main shaft connecting piece fixed connection, the one end of absorbing the pole with the rotating member is kept away from the one end fixed connection of upset main shaft connecting piece, the axial direction orientation of absorbing the pole upset workstation subassembly, the rotating member area absorb the pole along the tangential direction rotation of absorbing the pole, it fixes to absorb the head absorb the pole and keep away from the one end of rotating member, it is used for absorbing to absorb the head chip base on the transfer tray.

18. The chip bonding apparatus of claim 14, wherein the attachment module comprises an attachment assembly and an attachment table assembly, wherein the attachment assembly is configured to modify, inspect and attach the chip base to the carrier plate, and the attachment table assembly is configured to receive the carrier plate transferred from the lift line and to transport the carrier plate to the output line.

19. The chip bonding apparatus according to claim 18, wherein the attachment assembly comprises an attachment assembly support, an attachment main shaft, an attachment head connecting member, an attachment head, and an attachment correction camera, the attachment assembly support is fixedly connected to the main table, the attachment main shaft is located at one side of the attachment assembly support facing the turnover assembly and the turnover table assembly and is fixedly connected to the attachment assembly support, the attachment head connecting member is located at one side of the attachment main shaft deviating from the attachment assembly support and is slidably connected to the attachment main shaft, the attachment head connecting member moves along the axial direction of the attachment main shaft, the attachment head is located at one side of the attachment head connecting member deviating from the attachment main shaft and is fixedly connected to the attachment head connecting member, the attachment head is used for absorbing the chip base and correcting the chip base after absorption, attached correction camera is located upset workstation subassembly with between the attached workstation, and be located attached head below, attached correction camera is used for detecting after the upset whether the chip base accords with the predetermined requirement, attached head still includes force controller module, force controller module is used for control the attached dynamics of attached head.

20. The chip bonding apparatus of claim 19, wherein the attaching table assembly comprises a first attaching shaft, a second attaching shaft, an attaching table, an attaching positioning camera connector and an attaching positioning camera, wherein the first attaching shaft is fixedly connected with the main table and parallel to the lifting assembly line shaft, the second attaching shaft crosses the first attaching shaft and is perpendicular to and slidably connected to the first attaching shaft, the second attaching shaft moves along an axial direction of the first attaching shaft, the attaching table crosses the second attaching shaft and is perpendicular to and slidably connected to the second attaching shaft, the attaching table moves along an axial direction of the second attaching shaft, the attaching table is used for supporting and fixing the carrier plate transported from the lifting assembly line, one end of the attaching positioning camera connector is located on a side of the attaching assembly support departing from the main table, and the attaching camera connecting piece is positioned above the first attaching shaft, the one end of the attaching assembly support is far away from the attaching camera connecting piece, the extending end of the attaching camera connecting piece is fixedly provided with the attaching positioning camera, and the attaching positioning camera is used for positioning the chip on the support plate in a photographing mode.

21. The apparatus for die bonding according to claim 16, further comprising a recycling line and a recycling table, wherein the recycling line is located inside the support of the dispensing table and below the first dispensing table, the recycling line is fixedly connected to the main table, the recycling table is located between the recycling line and the first flipping axis, the recycling table is configured to receive the transfer tray and convey the transfer tray to the recycling line, and the recycling line is configured to convey the transfer tray to the feeding port of the dispensing module.