JP2014157878A - Bonding device of printed wiring board and bonding method of printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bonding device of a printed wiring board capable of enhancing productivity, and to provide a bonding method of a printed wiring board.SOLUTION: A bonding device of a printed wiring board comprises: a plate jig provided with one or more aperture; one or more flexible board mounted on the plate jig so that the position of the aperture substantially matches a planned bonding area, with one or more flexible board being laminated on the side opposite from the aperture; a block member for fixing the other board and the flexible board on which the other board is laminated, by pressing the other board; and a bonding head. Bonding is performed by abutting the bonding head against the planned bonding area through the aperture of the plate jig.

Description

  The present technology relates to a printed wiring board bonding apparatus and a printed wiring board bonding method.

  In order to achieve downsizing and thinning of electronic devices, flexible substrates are used. The flexible substrate is used by being bonded to a rigid substrate, for example.

  A conventional method of joining a flexible substrate and a rigid substrate will be described with reference to FIG. FIG. 8 is a schematic view for explaining a conventional method of joining a flexible substrate and a rigid substrate. As shown in FIG. 8, after placing the rigid substrate 102 on the back plate 110 and disposing the flexible substrate 101 at a predetermined position on the rigid substrate 102, the bonding head 111 descends and the flexible substrate 101 is seen from above. Is pressed and heat pressed to cure and bond the adhesive material between the rigid substrate 102 and the flexible substrate 101.

  When performing manually, after placing the rigid board | substrate 102 on the backplate 110, the flexible board | substrate 101 is mounted on the rigid board | substrate 102 by hand, and after aligning, it crimps | bonds and it joins.

  In the case of using a fully automatic apparatus, the flexible substrate 101 is sucked and held by the bonding head 111, a mark for alignment is read, conveyed to a predetermined position of the target rigid substrate 102, and the flexible substrate 101 is superimposed on the rigid substrate 102. . Then, the bonding head 111 itself is heated and pressed against the upper surface of the flexible substrate 101, so that the flexible substrate 101 is pressure bonded to a predetermined position of the rigid substrate 102.

  As conventional techniques for joining printed wiring boards, for example, techniques described in Patent Documents 1 to 3 below are disclosed.

JP 2001-35627 A JP-A-7-168198 JP-A-9-186191

  However, in the conventional bonding method, since the flexible substrate is placed on the rigid substrate by hand and aligned and then crimped, it takes time and productivity is poor.

  Therefore, an object of the present technology is to provide a printed wiring board bonding apparatus and a printed wiring board bonding method capable of improving productivity.

  In order to solve the above-described problem, the present technology is a joining device that joins a flexible substrate and another substrate, a plate jig provided with one or more openings, a position of the opening, and a region to be joined. One or more flexible boards that are placed on a plate jig and have other boards laminated on the opposite side of the opening, and other boards and flexible boards on which other boards are laminated, A printed wiring board joining apparatus that comprises a block member that is fixed by pressing the substrate and a joining head, and that joins the joining head by abutting the joining head against a region to be joined through the opening of the plate jig. is there.

  The present technology is a bonding method for bonding a flexible substrate and another substrate, and the opening and the region to be bonded substantially coincide with one or more flexible substrates on a plate jig provided with one or more openings. After mounting, the other substrate is laminated on the opposite side of the opening of the flexible substrate, and the flexible substrate obtained by laminating the other substrate and the other substrate is fixed by the block member pressing the other substrate. This is a printed wiring board joining method in which a joining head is brought into contact with a planned joining area of a flexible board through an opening of a plate jig.

  According to the present technology, it is possible to provide a printed wiring board bonding apparatus and a printed wiring board bonding method capable of improving productivity.

It is a basic diagram for demonstrating the joining process of a flexible substrate and a rigid board | substrate. It is a basic diagram for demonstrating the joining process of a flexible substrate and a rigid board | substrate. It is a schematic sectional drawing for demonstrating the joining process of a flexible substrate and a rigid board | substrate. It is a basic diagram for demonstrating the joining process of a flexible substrate and a rigid board | substrate. It is a basic diagram for demonstrating the joining process of a flexible substrate and a rigid board | substrate. It is a basic diagram for demonstrating the joining process of a flexible substrate and a rigid board | substrate. It is a schematic sectional drawing for demonstrating the joining process of a flexible substrate and a rigid board | substrate. It is a schematic sectional drawing for demonstrating the joining process of the conventional flexible substrate and a rigid board | substrate.

Hereinafter, embodiments of the present technology will be described with reference to the drawings. The description will be given in the following order.
1. First Embodiment 2. FIG. Second Embodiment 3. FIG. Other embodiment (modification)

1. First Embodiment A printed wiring board bonding apparatus according to a first embodiment will be described. In the first embodiment, a printed circuit board bonding apparatus for bonding a rigid board and a flexible board will be described.

  In the printed wiring board bonding apparatus according to the first embodiment, for example, the plate jig is transferred by a transfer apparatus such as a transfer conveyor, and the bonding operation of the rigid board and the flexible board described below is sequentially performed. In addition, you may comprise the apparatus which performs the joining operation | movement of the flexible substrate demonstrated below and a rigid board | substrate at once.

  The flexible board is a printed wiring board having flexibility, and the rigid board is a hard printed wiring board having no flexibility. The rigid substrate and the flexible substrate are provided with, for example, a plurality of wirings and electrodes.

  First, as shown in FIGS. 1A and 1B, the sheet 11 is placed on the plate jig 12. The sheet 11 includes one or more flexible substrates 1. For example, the sheet 11 is obtained by taking a plurality of flexible substrates 1. For example, the sheet 11 is obtained by removing six flexible substrates 1. The plate jig 12 is provided with one or more openings 12a. The sheet 11 is placed on the plate jig 12 so that the position of the opening 12a and the planned joining region 1a of the flexible substrate 1 to which the rigid substrate 2 is joined substantially coincide. In a state in which the sheet 11 is placed on the plate jig 12, the bonding planned area 1a is exposed from the opening 12a. For example, each joining plan area | region 1a is exposed from each opening 12a.

  The plate jig 12 is, for example, a magnet sheet, an adhesive sheet, or the like, and can stably fix the flexible substrate 1 placed on the plate jig 12. In addition, for example, an adhesive material (for example, an adhesive resin, an anisotropic conductive tape (ACF), or the like) for bonding the flexible substrate 1 and the rigid substrate 2 is disposed in the bonding region 1a. The flexible substrate 1 and the rigid substrate 2 are joined by curing the adhesive material. As another example, the terminal portion or the like of the flexible substrate 1 and the land portion or the like of the rigid substrate 2 are joined by dissolving a conductive material.

  Next, the rigid substrate 2 is carried to the bonding planned area 1a by the substrate handling block 13.

  The substrate handling block 13 is a block member that can freely move at least in the horizontal direction and the vertical direction, picks and places the rigid substrate 2 and handles it.

  As shown in FIGS. 1B, 1C, and 1D, the substrate handling block 13 is moved to a position where a large number of rigid substrate 2 groups for supply are arranged, and 1 from the large number of rigid substrate 2 groups for supply. The individual rigid substrates 2 are picked up by being sucked on the lower surface by vacuum suction or the like.

  The substrate handling block 13 moves while holding the rigid substrate 2 on the lower surface, carries the rigid substrate 2 and places it on the planned joining region 1a. Thereby, the rigid substrate 2 is laminated on the flexible substrate 1 on the opposite side of the opening 12a. In addition, the position of the joining plan area | region 1a is acquired by reading a positioning mark with reading means, such as a camera, and the board | substrate handling block 13 is controlled to carry the rigid board | substrate 2 to the acquired position.

  The substrate handling block 13 releases the holding of the rigid substrate 2 and delivers the rigid substrate 2 to the bonding scheduled area 1a. Thereafter, the substrate handling block 13 moves to the arrangement position of the supply rigid substrate 2 group in order to pick up another rigid substrate 2 to be joined next.

  Next, as shown in FIG. 2A, the substrate handling block 13 repeats the same operation, and sequentially carries the four rigid substrates 2 and delivers them to the planned joining region 1a.

  Next, the substrate handling block 13 carries the same rigid substrate 2 in the same operation and places it on the planned joining region 1a. As shown in FIG. 2B, the last rigid substrate 2 is placed on the planned joining region 1a. It stays at that position. As a result, the substrate handling block 13 is a flexible substrate in which the bottom surface is applied to the top surfaces of all the rigid substrates 2 placed in the bonding planned area 1a, the rigid substrate 2 is pressed, and the rigid substrate 2 and the rigid substrate 2 are laminated. 1 is fixed.

  For example, openings provided at positions corresponding to the plurality of openings 12a of the plate jig 12 in a state where the lower surface of the substrate handling block 13 is in contact with the upper surfaces of all the rigid substrates 2 placed in the planned bonding area 1a. The same number of bonding heads 14 as 12a are raised. The plate jig 12 and the substrate handling block 13 may be lowered.

  As shown in FIGS. 2C and 3, the plurality of bonding heads 14 pass through the respective openings 12 a, and the respective bonding heads 14 simultaneously abut on the plurality of bonding scheduled regions 1 a. As a result, the lower surface of the substrate handling block 13 is applied to the upper surface of the rigid substrate 2, and the bonding regions 1 a exposed from the openings 12 a are simultaneously pushed up from below, so that the gap between the substrate handling block 13 and the bonding head 14 is increased. Pressure is applied to the portion sandwiched between the two.

  At this time, the bonding head 14 applies heat or ultrasonic waves to the abutting portion. As a result, the flexible substrate 1 and the rigid substrate 2 are joined by curing, for example, an adhesive, an anisotropic conductive tape (ACF) disposed between the flexible substrate 1 and the rigid substrate 2. To do.

  Instead of simultaneously pushing up the respective bonding planned areas 1 a exposed from the respective openings 12 a from below by the plurality of bonding heads 14, the respective bonding planned areas 1 a exposed from the respective openings 12 a are moved downward by one bonding head 14. You may make it push up sequentially.

  As described above, as shown in FIG. 2D, the plurality of flexible substrates 1 and the plurality of rigid substrates 2 are joined together.

  In the first embodiment of the present technology, since the plurality of flexible substrates 1 and the plurality of rigid substrates 2 are joined together, productivity can be improved.

  In the first embodiment of the present technology, since the rigid substrate 2 is handled instead of the flexible substrate 1, warping or heat of the substrate itself that occurs when the flexible substrate 1 is handled. It is preferable because it is very difficult to handle due to elongation due to, and the like, and bonding is difficult.

2. Second Embodiment A printed wiring board bonding apparatus according to a second embodiment will be described. In the second embodiment, a printed wiring board bonding apparatus that bonds the flexible board 1 and the rigid board 2 will be described.

  In the printed wiring board joining apparatus according to the second embodiment, for example, the plate jig 12 is transported by a transport apparatus such as a transport conveyor, and the joining operation of the flexible board 1 and the rigid board 2 described below is sequentially performed. Is called. In addition, you may comprise the apparatus by which the joining operation | movement of the flexible substrate 1 demonstrated below and the rigid board | substrate 2 is performed by one apparatus.

  First, as shown in FIGS. 4A and 4B, the sheet 11 is placed on the plate jig 12. The sheet 11 includes one or more flexible substrates 1. For example, the sheet 11 is obtained by taking a plurality of flexible substrates 1. For example, the sheet 11 is obtained by removing six flexible substrates 1. The plate jig 12 is provided with one or more openings 12a. The sheet 11 is placed on the plate jig 12 so that the position of the opening 12a and the planned joining region 1a of the flexible substrate 1 to which the rigid substrate 2 is joined substantially coincide. In a state in which the sheet 11 is placed on the plate jig 12, the planned joining region 1a for joining the rigid substrate 2 is exposed from the opening 12a. For example, each joining plan area | region 1a is exposed from each opening 12a.

  Next, the rigid substrate 2 is transported to the joining region 1 a with the flexible substrate 1 by the substrate setting block 21.

  As shown in FIG. 4B, FIG. 4C and FIG. 4D, the board setting block 21 moves to a position where a large number of supply rigid boards 2 groups are arranged, and 1 The individual rigid substrates 2 are picked up by being sucked on the lower surface by vacuum suction or the like.

  The board setting block 21 moves while holding the rigid board 2 on the lower surface, carries the rigid board 2 and places it on the planned bonding area 1a. Thereby, the rigid substrate 2 is laminated on the flexible substrate 1 on the opposite side of the opening 12a. The position of the planned joining area 1a is obtained by reading the positioning mark with a reading means such as a camera, and the board setting block 21 is controlled so as to carry the rigid board 2 to the obtained position.

  The board setting block 21 releases the holding of the rigid board 2 and delivers the rigid board 2 to the planned joining area 1a. Thereafter, the substrate setting block 21 moves to the arrangement position of the rigid substrate 2 group for supply in order to pick up another rigid substrate 2 to be joined next.

  Next, as shown in FIG. 5A and FIG. 5B, the substrate setting block 21 repeats the same operation, sequentially carries five rigid substrates 2, and delivers them to the bonding scheduled region 1a.

  Next, as shown in FIG. 5C, the abutting block 22 is made to stagnate at the position in a state where the abutting block 22 is applied to the upper surfaces of all the rigid substrates 2 from above. As a result, the abutting block 22 is a flexible substrate in which the bottom surface is applied to the top surfaces of all the rigid substrates 2 placed in the planned joining region 1a, the rigid substrate 2 is pressed, and the rigid substrate 2 and the rigid substrate 2 are laminated. 1 is fixed.

  As shown in FIG. 6A, positions corresponding to the plurality of openings 12a of the plate jig 12 in a state where the lower surface of the abutting block 22 is in contact with the upper surfaces of all the rigid substrates 2 placed in the planned joining region 1a. For example, the same number of bonding heads 14 as the openings 12a are raised. The plate jig 12 and the abutting block 22 may be lowered.

  As shown in FIGS. 6B and 7, the plurality of bonding heads 14 pass through the respective openings 12 a, and the respective bonding heads 14 simultaneously abut on the plurality of bonding scheduled regions 1 a. As a result, the lower surface of the abutting block 22 is brought into contact with the upper surface of the rigid substrate 2, and the respective joining planned areas 1 a exposed from the respective openings 12 a are simultaneously pushed up from below, so Pressure is applied to the portion sandwiched between the two.

  At this time, the bonding head 14 applies heat, ultrasonic waves, or the like to the portion where the bonding head 14 abuts. As a result, the flexible substrate 1 and the rigid substrate 2 are joined by curing, for example, an adhesive, an anisotropic conductive tape (ACF) disposed between the flexible substrate 1 and the rigid substrate 2. To do.

  Instead of simultaneously pushing up the respective bonding planned areas 1 a exposed from the respective openings 12 a from below by the plurality of bonding heads 14, the respective bonding planned areas 1 a exposed from the respective openings 12 a are moved downward by one bonding head 14. You may make it push up sequentially.

  As described above, as shown in FIG. 6C, the plurality of flexible substrates 1 and the plurality of rigid substrates 2 are joined together.

  In the second embodiment of the present technology, as in the first embodiment, since the plurality of flexible substrates 1 and the plurality of rigid substrates 2 are joined together, productivity can be improved.

  Further, in the second embodiment of the present technology, since the rigid substrate 2 is handled instead of the flexible substrate 1 as in the first embodiment, the flexible substrate 1 is handled. It is preferable that the substrate is not easily handled due to warpage of the substrate itself, elongation due to heat, and the like, and bonding becomes difficult.

  In the second embodiment of the present technology, the abutment block 22 is introduced, and the placement process of the rigid substrate 2 and the joining process of the placed rigid substrate 2 are performed in parallel processing, thereby performing the first implementation. As a result, the tact time can be shortened.

3. Other Embodiments The present technology is not limited to the above-described embodiments of the present technology, and various modifications and applications can be made without departing from the gist of the present technology.

  For example, the numerical values, structures, shapes, materials, raw materials, manufacturing processes and the like given in the above-described embodiments and examples are merely examples, and different numerical values, structures, shapes, materials, raw materials, and the like as necessary. A manufacturing process or the like may be used.

  The configurations, methods, processes, shapes, materials, numerical values, and the like of the above-described embodiments and examples can be combined with each other without departing from the gist of the present technology.

  In the above-described embodiment, the example in which the rigid substrate is bonded to the flexible substrate has been described. However, the present invention is not limited to this. For example, the rigid substrate may be replaced with a flexible substrate, and the flexible substrate and the flexible substrate may be joined.

DESCRIPTION OF SYMBOLS 1 ... Flexible substrate 2 ... Rigid substrate 11 ... Sheet 12 ... Plate jig 12a ... Opening 13 ... Block for substrate handling 14 ... Head for joining 21 ... Substrate set Block 22 ... Abutting block

Claims (7)

A joining device for joining a flexible substrate and another substrate,
A plate jig provided with one or more openings;
One or more flexible substrates that are placed on the plate jig so that the position of the opening and the region to be joined substantially coincide, and the other substrate is laminated on the opposite side of the opening;
A block member for fixing the other substrate and the flexible substrate on which the other substrate is laminated by pressing the other substrate;
A joining head,
A printed wiring board joining apparatus for joining by joining the joining head to the joining-scheduled region through the opening of the plate jig.   The printed circuit board bonding apparatus according to claim 1, wherein the block member carries the other board and stacks the other board on the flexible board. Further comprising another block member,
The printed wiring board bonding apparatus according to claim 1, wherein the other block member carries the other board and stacks the other board on the flexible board. A plurality of the joining heads are provided,
The printed wiring according to any one of claims 1 to 3, wherein a plurality of the bonding heads are simultaneously abutted against a plurality of the bonding scheduled regions through the plurality of openings provided in the plate jig. Substrate bonding device.   The printed wiring board bonding apparatus according to claim 1, wherein the other board is a rigid board.   The printed wiring board bonding apparatus according to claim 1, wherein the bonding head applies heat or ultrasonic waves to the bonding scheduled region. A joining method for joining a flexible substrate and another substrate,
After placing one or more flexible substrates on a plate jig provided with one or more openings so that the opening and the region to be joined substantially coincide with each other, another substrate is placed on the opening of the flexible substrate. Laminate on the opposite side,
The flexible substrate obtained by stacking the other substrate and the other substrate is fixed by pressing the other substrate with a block member,
A method for joining printed wiring boards, wherein a joining head is joined by abutting the joining head against the planned joining area of the flexible board through the opening of the plate jig.

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