TWI650826B - Fpc pre-main bonding machine - Google Patents

Abstract

The invention relates to a flexible circuit board false-pressure integrated bonding device, which comprises a first lateral transfer device, a false pressure module, a pressure module, a false pressure support mechanism, a pressure support mechanism and A substrate transfer device. The dummy pressing module is configured to perform a pseudo pressing operation on a substrate located at a pseudo-pressing working position, so that at least one flexible circuit board is pseudo-joined to at least one circuit assembly area on one side of the substrate. The pressure module is configured to perform a pressing operation on the substrate that has completed the pseudo pressing operation, so that the flexible circuit board that has been pseudo-joined to the substrate is permanently bonded to the circuit assembly of the substrate. Area. The pseudo pressure module and the pressure module can be laterally moved on the first lateral transfer device, and the pressure module is located during the false pressure operation of the false pressure module. a side of the lateral transfer device for giving a working space to the false pressure module, and during the pressing operation of the pressure module, the false pressure module is located at the first lateral transfer device On the other side, the working space is given to the pressure module.

Description

Soft circuit board false pressure integrated bonding device

The present invention relates to a circuit board assembly apparatus, and more particularly to a flexible circuit board dummy press integrated bonding apparatus for assembling a flexible circuit board to a rigid circuit board or a display panel.

A flexible circuit board is assembled into a circuit assembly area around a display panel by a pseudo pressing operation and a pressing operation, so that the flexible circuit board and the display panel are electrically connected, which has been a common flexible circuit board assembly skill. Related to this, such as Taiwan Announcement I381200, I443057, I523594, I523593, M412376, M406035, I328990 and M298306 patents, as well as Taiwan Open 201237975 and 201112893 patents. In this technical field, a common flexible circuit board is a chip film of a chip on film (COF), generally referred to as a COF sheet. After a flexible circuit board is punched out from a roll, an asymmetrical conductive adhesive (ACF) is applied, and then a false pressing device (or preloading device) performs the false pressing operation. The work includes alignment, low temperature hot pressing, etc., whereby the flexible circuit board is temporarily bonded to the display panel. Then, the display panel is transported from the pseudo-pressure device to a pressing device by a transport mechanism to perform the pressing operation, including high temperature hot pressing, etc., thereby permanently bonding the flexible circuit board to the display panel. on.

In the past, since the circuit assembly area reserved by each display panel is still wide enough, the flexible circuit board pseudo-assembled to the circuit assembly area via the pseudo-pressure device is said to be firmly attached (because of the bonding of the two) The face is large enough to fall off during the process of transporting the display panel to the pressure device. However, in order to minimize the frame of the framed display, the circuit assembly area reserved by the current display panel to the flexible circuit board has become narrower and narrower. For example, the circuit assembly area has been about 1~. The width of 2 mm is narrowed to less than or equal to 0.4 mm. When the circuit assembly area of a display panel is narrowed to such an extent, the flexible circuit board pseudo-assembled to the circuit assembly area via the pseudo-pressure device is not firmly attached (because the joint faces of the two are too Small, so that in the process of transporting the display panel to the pressure device, the situation that the flexible circuit board is dropped often occurs and needs to be solved.

In view of the conventional knowledge, the pressure device often has a problem of falling off the flexible circuit board (when the circuit assembly area of a display panel is narrower, the probability of dropping the flexible circuit board that is falsely connected to the circuit group connection area is increased. High), the present invention provides a flexible circuit board false-pressure integrated bonding device, thereby solving the aforementioned problems.

The flexible circuit board false press integrated bonding device comprises a first lateral transfer device, a false pressure module, a pressure module, a false pressure support mechanism, a pressure support mechanism and a substrate shift Carrier device. The dummy pressure module is disposed on the first lateral transfer device for performing a pseudo pressing operation on a substrate located at a pseudo-pressure working position, so that at least one flexible circuit board is pseudo-joined to the substrate At least one circuit assembly area on the side, wherein the false pressure module is driven by the first lateral transfer device to perform lateral movement in a working interval during the false pressing operation, without performing the false pressing During the operation, the first lateral transfer device is driven to move laterally away from the working interval to give up the working interval. The pressure module is disposed on the first lateral transfer device for performing a pressing operation on the substrate that has completed the false pressing operation, so that the flexible circuit board that has been falsely bonded to the substrate is permanent. Engaging in the circuit assembly area of the substrate, wherein the local pressure module is driven by the first lateral transfer device to move laterally within the working interval during the pressing operation, without performing the During the pressing operation, the first lateral transfer device is driven to move laterally away from the working interval to give up the working interval. The false pressure support mechanism is configured to provide support for the bottom surface of the substrate corresponding to the circuit assembly area when the false pressure module performs the false pressing operation. The pressure supporting mechanism is configured to provide support for the bottom surface of the substrate corresponding to the circuit assembly area when the pressure module performs the pressing operation. The substrate transfer device is configured to transport the substrate such that the circuit assembly area of the substrate is located in the false pressure working position or the local pressure working position.

Preferably, the pressure supporting mechanism of the bonding device of the present invention comprises a second lateral transfer device and a pressing support. The second lateral transfer device is located below the first lateral transfer device and parallel to the first lateral transfer device. The pressure support seat is disposed on the second lateral transfer device and is laterally movable under the driving of the second lateral transfer device, wherein the pressure support seat is located in a book of the pressure module Directly below the lateral movement path of the indenter, to provide support for the bottom surface of the substrate corresponding to the circuit assembly area.

Preferably, the pressure supporting mechanism of the bonding device of the present invention further comprises a second lateral transfer device and a pressing support. The second lateral transfer device is located below the first lateral transfer device and parallel to the first lateral transfer device. The pressure support seat is disposed on the second lateral transfer device and is laterally movable under the driving of the second lateral transfer device, wherein the pressure support seat is located in a book of the pressure module Directly below the lateral movement path of the indenter, to provide support for the bottom surface of the substrate corresponding to the circuit assembly area. In addition, the false pressure support mechanism includes a third lateral transfer device, a false pressure support base and an image capture device. The third lateral transfer device is located below the first lateral transfer device and is parallel to the second lateral transfer device. The false pressure support seat is disposed on the third lateral transfer device and is laterally movable under the driving of the third lateral transfer device, wherein the false pressure support seat is located in the false pressure module Directly below the lateral movement path of the indenter, to provide support for the bottom surface of the substrate corresponding to the circuit assembly area. The image capturing device is disposed on the third lateral transfer device and is movable laterally in synchronization with the false pressure support seat under the driving of the third lateral transfer device, wherein the image capturing device is located Below the dummy pressure support seat, the alignment mark on the substrate and the alignment mark on the flexible circuit board sucked by the dummy pressure head are taken up.

Preferably, the image capturing device of the false pressure support mechanism comprises two image capturing lenses arranged side by side in the lateral direction, the false pressure supporting seat having two notches arranged side by side in the lateral direction, and the two imaging lenses respectively pass the two notches of the false pressing support seat Ingest these alignment markers.

Preferably, the false pressure head of the false pressure module is in front of the pressure head, and the pressure support seat is located directly below the lateral movement path of the pressure head, and the false pressure support seat is located at the false pressure head. Directly below the lateral movement path and in front of the present pressure support. Alternatively, the false pressure head of the false pressure module is behind the pressure head, the pressure support seat is located directly below the lateral movement path of the pressure head, and the false pressure support seat is located laterally of the dummy pressure head. Directly below the path and behind the pressure support.

Preferably, the pressure support mechanism of the laminating device of the present invention comprises a coaxial lateral transfer device and a compression support. Wherein the coaxial lateral transfer device is located below the first lateral transfer device and parallel to the first lateral transfer device. The pressure support seat is disposed on the coaxial lateral transfer device and directly under the lateral movement path of a pressing head of the pressure module for corresponding to the circuit assembly area of the bottom surface of the substrate Where the support is provided, wherein the pressure support seat is driven by the coaxial lateral transfer device to be laterally moved in a support working interval during the supporting operation, and the pressure is not matched During the operation, the shaft type lateral transfer device is driven to move laterally away from the support working interval to give up the support working interval. In addition, the false pressure support mechanism includes a false pressure support base and an image capture device. The pseudo-pressure support seat is disposed on the coaxial lateral transfer device and directly under the lateral movement path of a false pressure head of the false pressure module for corresponding to the bottom surface of the substrate. Supporting, wherein the false pressure support seat is driven by the coaxial lateral transfer device to perform lateral movement during the supporting operation, and the false pressure is performed without cooperation During the operation, the shaft type lateral transfer device is driven to move laterally away from the support working interval to give up the support working interval. The image capturing device is disposed on the coaxial lateral transfer device and is movable laterally in synchronization with the pseudo-pressure support seat under the driving of the coaxial lateral transfer device, wherein the image capturing device is located Below the dummy pressure support seat, the alignment mark on the substrate and the alignment mark on the flexible circuit board sucked by the dummy pressure head are taken up.

Preferably, the image capturing device of the false pressure support mechanism comprises two image capturing lenses arranged side by side in the lateral direction, the false pressure supporting seat having two notches arranged side by side in the lateral direction, and the two imaging lenses respectively pass the two notches of the false pressing support seat Ingest these alignment markers.

Preferably, the bonding device of the present invention further comprises a supporting mechanism comprising a substrate supporting seat, a lower pressing seat and a lower pressing driving device. The substrate supporting base is configured to be supported at a bottom surface of the substrate near the circuit assembly area when the circuit assembly area of the substrate is located at the pseudo-pressing working position or the pressing working position. The pressing seat is located directly above the substrate support and can be moved up and down to press the top of the substrate to face the substrate support. The pressing drive device is configured to drive the lower press seat for lifting movement.

Preferably, the first lateral transfer device of the laminating device of the present invention comprises a lateral slide rail, two loading platforms and a power device. Wherein, the lateral slide rail extends a length in the lateral direction. The two stages can be moved laterally along the lateral rails, and respectively carry the false pressure module and the pressure module. The power unit is configured to drive the pseudo-ballast stage and the ballast stage to move laterally.

Preferably, the second lateral transfer device of the pressure support mechanism comprises a lateral slide rail, a loading platform and a power device. Wherein, the lateral slide rail extends a length in the lateral direction. The stage is movable laterally along the transverse rail and carries the local pressure support mechanism. The power unit is used to drive the stage for lateral movement.

Preferably, the third lateral transfer device of the false pressure support mechanism comprises a lateral slide rail, a loading platform and a power device. Wherein, the lateral slide rail extends a length in the lateral direction. The stage is movable laterally along the transverse rail and carries the false pressure support mechanism. The power unit is used to drive the stage for lateral movement.

Preferably, the coaxial lateral transfer device of the pressure support mechanism comprises a lateral slide rail, two loading platforms and a power device. Wherein, the lateral slide rail extends a length in the lateral direction. The two stages can be laterally moved along the lateral rails, and respectively carry the false pressure support mechanism and the local pressure support mechanism. The power unit is used to drive the two stages for lateral movement.

Preferably, the power devices of the four lateral transfer devices are all optional with a linear motor having a set of stators and a plurality of movers, the set of stators extending laterally along the slide rails, the movers respectively corresponding to Set on the stages.

Compared with the prior art, the flexible circuit board false pressure integrated bonding device of the present invention can be applied to the false pressing and the pressing operation of the substrate with a relatively narrow circuit assembly area, and the conventional circuit and the pressure device often have a flexible circuit board. The problem of falling.

1 and 2 are schematic diagrams showing a preferred embodiment of the flexible circuit board false-pressure integrated bonding apparatus 100 of the present invention, the flexible circuit board false-pressure integrated bonding apparatus 100 is used for A flexible circuit board 90, shown at 3, is assembled to a circuit assembly area 91 on one of the substrates 9 such that the circuitry on the flexible circuit board 90 is electrically coupled to the circuitry on the substrate 9. The flexible circuit board 90 can be a COF sheet with an anisotropic conductive adhesive (ACF) attached thereto, but is not limited thereto. The substrate 9 can be a liquid crystal display panel, an OLED display panel, or other types of display panels, or a printed circuit board, but is not limited thereto.

As shown in FIG. 1 , the flexible circuit board false press integrated bonding device 100 includes a base 10 , a base 101 disposed on the base 10 , a first lateral transfer device 1 , and A false pressure module 2 on the first lateral transfer device 1 and at least one pressure module 3 are provided. In this embodiment, the dummy pressure module 2 has only one set, and the pressure module 3 has two sets of the same, but the number of the two is not limited thereto.

As shown in FIG. 1 , the first lateral transfer device 1 includes a set of lateral slides 102 disposed on the base 101 , and is disposed on the lateral slide 102 and laterally movable along the transverse slide 102 . One or more stages (such as a dummy ballast table 11 and two ballast stations 12), and a power unit 13 for driving the stages for lateral movement, the number of the stages depends on The number of the dummy pressure module 2 and the pressure module 3 to be carried. In this embodiment, the base 101 is preferably in the form of a gantry as shown in the figure. The set of lateral slides 102 is fixed on a front side of the base 101 and extends a length along the x-axis direction. . Preferably, the power unit 13 is a linear motor, and the stator 13a of the linear motor is located on the front side of the base 101 and extends in the x-axis direction for a length and parallel to the lateral rail 102, and the linear motor moves. There are a plurality of sub- 13b, and are respectively disposed corresponding to the sub-stages. In this manner, the power unit 13 can drive the stages, for example, the dummy press stage 11 and the ballast stage 12 to move laterally along the transverse rail 101.

The false pressure module 2 is disposed on the false pressure loading platform 11 , and the dummy pressure module 2 can be laterally moved in the x direction by the dummy pressure loading platform 11 , and can also be on the false pressure loading platform 11 . Move in the z direction to adjust its position. The false pressure module 2 has a false ram 20 which can be moved in the z direction to descend to a false pressure position and return to the original position. The dummy ram 20 is also capable of moving in the yaw direction (y direction), lateral movement (x direction), and horizontal rotation (the θ rotation in an x-y plane) to adjust its position.

The pressure modules 3 are respectively disposed on the pressure stations 12, and each of the pressure modules 3 can be laterally moved in the x direction by the respective pressure stations 12, and The ballast table 12 is moved up and down in the z direction to adjust its height position. The pressure module 3 further has a pressure head 30 which can be moved in the z direction to descend to a pressure position and return to the original position. In addition, the present indenter 30 can also perform a tilting movement (y direction), a lateral movement (x direction), and a horizontal rotation (theta rotation in an x-y plane) to adjust its position. Wherein, as shown in FIG. 2, the indenter 30 is further located behind the dummy indenter 20, that is, in the direction of the twist (y direction), the dummy indenter 20 is in front and the indenter 30 is present. is behind.

In the preferred embodiment, when the pseudo-pressure module 2 and the local pressure module 3 are respectively located in the lateral direction (x direction), the two are spaced apart in the lateral direction by a distance. It is the working section of the false pressure module 2 and the pressure module 3.

Referring to FIG. 1 to FIG. 2, the flexible circuit board dummy pressure bonding device 100 of the present invention further includes a pressure supporting mechanism 4 located below the pressing head 30, located under the dummy pressing head 20 and located at the same A false pressure support mechanism 5 in front of the pressure support mechanism 4 and a support mechanism 6 located in front of the false pressure support base 5. The pressure support mechanism 4, the false pressure support mechanism 5 and the support mechanism 6 are all disposed on a top surface of the base 10.

The pressure support mechanism 4 preferably includes a second lateral transfer device 41 and at least one pressure support base 42. The second lateral transfer device 41 is disposed on the top surface of the base 10 and has the same configuration as the first lateral transfer device 1 . The pressure support base 42 is disposed on the second lateral transfer device 41 and is laterally movable under the driving of the second lateral transfer device 41. The pressure support base 42 is located directly below the lateral movement path of the present ram 30. among them. The number of the pressure support bases 42 is determined by the number of the present pressure module 3, and the carrier on the second lateral transfer device 41 is used to carry the pressure support base 42 correspondingly, and the number depends on The number of the pressure support seats 42. In this embodiment, a plurality of sets of the local pressure support bases 42 are driven by the second lateral transfer device 41 to be laterally movable directly under the lateral movement path of the present pressure head 30.

In addition, the present pressure support mechanism 4 may also adopt a long-type pressure support base, and the length of the long-type pressure support base is substantially equal to or larger than the side of the substrate 9 to which the flexible circuit board 90 needs to be assembled. The length of the side. Since it can provide support for all of the circuit assembly areas 91 on the substrate 9 adjacent to the side, lateral movement is not required as with the short, positive pressure support 42 described above.

The squeezing support mechanism 5 preferably includes a third lateral transfer device 51, a false pressure support base 52 disposed on the third lateral transfer device 51, and an image capture device 53. The third lateral transfer device 51 is disposed on the top surface of the base 10 and has the same configuration as the first lateral transfer device 1 . The third lateral transfer device 51 is located in front of the second lateral transfer device 41 and is parallel. The imaginary pressure support base 52 and the image capturing device 53 are mounted on the same stage 510 (the stage 510 is the same as the above-described stage, and will not be described above), so that it can be driven by the third lateral transfer device 51. Synchronously move horizontally. The false pressure support seat 52 is located directly below the lateral movement path of the false pressure head 20 and is movable up and down. The image capturing device 53 is located below the false pressure support base 52. In this embodiment, the image capturing device 53 has two image pickup lenses 531 which are movable in the x direction to be close to each other or away from each other. As shown in FIG. 5, the false pressure support base 52 has two notches 521 to avoid blocking the two imaging lenses 531. The stage on the third lateral transfer device 51 is configured to correspondingly carry the false pressure support base 52 and the image capturing device 53. In this embodiment, only one stage simultaneously carries the false pressure support base 52 and the image capturing device. Device 53. If there is another false pressure support and its image taking device, another stage is needed to carry them. More preferably, the second and third lateral transfer devices 41, 51 can be coaxially designed, as shown in FIG. 10, and will be described later.

As shown in FIG. 1 , the support mechanism 6 includes a panel support base 60 located in front of the false pressure support base 5 and a lower pressure seat 62 located above the panel support base 60 and capable of moving up and down, and for driving the same. The lower press seat 62 serves as at least a lower pressure driving device 63 for lifting and lowering. In this embodiment, the panel support 60 and the lower presser 62 are both elongated and facing each other, and the push-down driving device 63 has two sides 10 on the top surface 10 of the base 10, and They are respectively connected to both ends of the lower press seat 62. The panel support 60 can be moved up and down in the z direction, so that the height of the substrate 9 can be adjusted correspondingly.

As shown in FIG. 3, a substrate transfer device (not shown) transports the substrate 9 to a position above a pseudo-pressure working position. At this time, it is located on the top surface of the substrate 9 and adjacent to one side thereof. A circuit assembly area 91 is located between the dummy ram 20 and the corresponding squeezing support 52.

Then, the substrate transfer device further lowers the substrate 9 to the pseudo-pressure working position, as shown in FIG. 4, at this time, the panel support 60 supports the bottom surface of the substrate 9, and the pseudo-pressure support 52 The bottom surface of the substrate 9 is supported to correspond to the circuit assembly area 91. Then, under the driving of the pressing device 63 of the supporting mechanism 6, the pressing seat 62 is lowered to a position pressed against the top surface of the substrate 9 so that the substrate 9 is clamped on the panel supporting base 60 and Between the lower pressers 62, the substrate 9 is stably supported, so that the circuit assembly area 91 of the substrate 9 and its adjacent areas can be kept flat for subsequent pseudo-pressing operations.

After the supporting operation of the substrate 9 is completed as described in the preceding paragraph, a pseudo-pressing operation of the flexible circuit board 90 is performed, and as shown in FIG. 4, the dummy ram 20 of the dummy pressing module 2 has sucked a flexible circuit. The plate 90 is laterally moved directly above the circuit assembly area 91 of the substrate 9 by the dummy press stage 11. Wherein, the flexible circuit board 90 is attached with an anisotropic conductive adhesive (ACF) in a previous operation, and then transported to a recessed space 103 behind the base 10 by a transport mechanism (not shown) (see Figure 1), waiting for the false ram 20 to take it away. The recessed space 103 is located below the lateral movement path of the dummy ram 20. The dummy ram 20 is laterally moved above the recessed space 103 by the dummy press stage 11, and then descends to the transport mechanism to suck the flexible circuit board 90 sent by the transport mechanism.

Next, the two imaging lenses 531 of the image capturing device 53 located below the false pressure support base 52 pick up the alignment marks on the substrate 9 and the flexible circuit board 90. Next, the pseudo-pressure module 2 adjusts the position of the dummy ram 20 according to the obtained alignment mark so that the alignment mark on the flexible circuit board 90 can be aligned with the alignment mark on the substrate 9, once The alignment is completed. As shown in FIG. 5, the two imaging lenses 531 respectively obtain the alignment marks described above via the two notches 521 of the false pressure support base 52.

As shown in FIG. 6, after the alignment is completed, the dummy ram 20 is driven to move down to a false pressing position, so that the flexible circuit board 90 together with the substrate 9 is clamped on the dummy ram 20 and A predetermined time period between the corresponding false pressure support seats 52. Since the dummy ram 20 is internally provided with a low temperature heater (not shown, the heating temperature depends on the type of the anisotropic conductive paste used in the flexible circuit board 90), so under the low temperature hot pressing, The flexible circuit board 90 is dummy (or temporarily) bonded to the one of the circuit assembly regions 90 of the substrate 9, thus completing the dummy pressing operation of the flexible circuit board 90.

Subsequently, the dummy ram 20 is driven to move up and away from the substrate 9, and is laterally moved back to the original position with the dummy ball stage 11, and then the next piece of the flexible circuit board 90 is obtained, and the other substrate 9 is prepared. A circuit assembly area 91 performs another false pressing operation. At this time, the dummy pressure support base 52 is correspondingly moved directly below the other circuit assembly area 91 for support. By analogy, all of the circuit assembly regions 91 located near one of the sides of the substrate 9 are falsely bonded to a flexible circuit board 90, and the false pressing operation of the one side of the substrate 9 is completed.

After the false pressing module 2 completes the above-mentioned false pressing operation on the one side (for example, the long side) of the substrate 9, the false pressing module 2 moves laterally away from the working interval and returns to the original position, and Therefore, the working section is given for the present pressure module 3 to perform the subsequent pressing operation. Further, under the driving of the depression driving device 63 of the supporting mechanism 6, the lower pressing seat 62 is raised back to the original position without pressing the substrate 9. Next, as shown in FIG. 7, the substrate transfer device (not shown) first raises the substrate 9 so that the bottom surface of the substrate 9 is separated from the false pressure support base 52 and the panel support 60, and then The substrate 9 is moved to the upper side of the pressing operation position along the direction of the pressing head 30. At this time, one of the circuit assembly areas 91 of the one side of the substrate 9 is located at the pressing head 30. Between the pressure support 4 and the present pressure support.

Next, the substrate transfer device lowers the substrate 9 to the local pressure working position. At this time, the panel support 60 supports the substrate 9, and the local pressure support 42 supports the substrate 9 to face away. The circuit assembly area 91 is shown in FIG. Subsequently, under the driving of the pressing device 63 of the supporting mechanism 6, the pressing seat 62 is lowered to a position pressed against the top surface of the substrate 9, so that the substrate 9 is stably supported, so that the substrate 9 is The circuit assembly area 91 and its adjacent areas can be kept flat to facilitate subsequent pressing operations.

At this time, the present indenter 30 of the pressure module 3 has been laterally moved to the upper side of the circuit assembly area 91 of the substrate 9 by the present pressure carrier 12, and then the pressure operation is performed, as shown in FIG. The indenter 30 is driven to move down to a pressing position, so that the flexible circuit board 90 and the substrate 9 that have been pseudo-joined are clamped on the pressing head 30 and the pressing support 42. A preset time. Since the high temperature heater is disposed inside the indenter 30 (not shown, the heating temperature depends on the type of the anisotropic conductive adhesive used in the flexible circuit board 90), and the inside of the pressure support base 42 is also provided. The heater (not shown, the heating temperature depends on the type of the anisotropic conductive paste used in the flexible circuit board 90), so the flexible circuit board 90 is permanently bonded under the high temperature hot pressing. The circuit assembly area 91 of the substrate 9 has heretofore completed the local pressing operation of the flexible circuit board 90.

Subsequently, the present indenter 30 is driven to move upwardly away from the substrate 9, and is moved laterally above the next circuit assembly area 91 with the present pressure carrier 12, and then, the next piece has been pseudo-joined. The flexible circuit board 90 performs another pressing operation. At this time, the corresponding local pressure support base 42 is also laterally moved below the lower flexible circuit board 90 for support. And so on, until all the circuit assembly areas 91 on one side of the substrate 9 and the flexible circuit board 90 thereof are permanently bonded together by performing the aforementioned high temperature hot pressing, one of the substrates 9 is completed. After the pressing operation of the side, the pressure head 30 of the pressure module 3 is moved laterally away from the working section by the ball pressing table 12 to return to the working position for the false pressure. Module 2 performs the next false pressing operation.

In this embodiment, since there are two present pressure modules 3, the present pressing operation can be performed simultaneously on the two flexible circuit boards 90 that have been pseudo-joined on the substrate 9. If it is assumed that there are 10 circuit assembly areas 91 on one side of the substrate 9, since there are two pressure modules 3, the first pressure module 3 on the left side in the first figure can be responsible for the substrate 9. The first pressing operation of the first to fifth circuit assembling regions 91 and the flexible circuit board 90, the second pressing force of the sixth to tenth circuit assembling regions 91 and the flexible circuit board 90 on the substrate 9 is performed by the second pressing voltage The module 3 is responsible for the first, the first pressure module 3 is first traversed directly above the first circuit assembly area 91, and the second pressure module 3 is first traversed to the first Directly above the six circuit assembly areas 91, then the first and second voltage modules 3 are synchronously respectively responsible for the circuit assembly area 91 and its flexible circuit board 90 from left to right. Press the job.

After the present pressing operation is performed on the one side (for example, the long side) of the substrate 9 on the one side of the substrate 9. All of the pressure modules 3 are retracted to their original positions, and the lower pressure seats 62 are also raised back to the original position without pressing the substrate 9. Then, the substrate 9 is transported back to the original position by the substrate transfer device to leave the bonding device 100 of the flexible circuit board of the present invention. At this time, if the circuit assembly area of the substrate 9 having the other side (for example, a short side adjacent to the long side) needs to assemble the same flexible circuit board 90, the substrate 9 is turned to make the The other side of the substrate 9 faces the bonding device 100 of the flexible circuit board of the present invention, and then, as described above, sequentially performs the above-mentioned dummy on the circuit assembly area of the other side. Pressing operation and this pressing operation.

In addition, it should be particularly noted that, for the circuit assembly area 91 of the same side of the substrate 9, when the spacing between the circuit assembly areas 91 is large, each circuit assembly area 91 of the side is first The pseudo-pressing operation is performed such that each of the circuit assembly regions 91 of the side is pseudo-joined by a flexible circuit board 90, and then the softness of the dummy bonding of each of the circuit assembly regions 91 of the side is performed. The circuit board 90 performs the pressing operation in sequence so that each of the circuit assembly regions 91 of the sides is permanently joined to a flexible circuit board 90. However, when the pitch between the circuit assembly areas 91 is small, the side circuit assembly area 91 is subjected to a jump type pseudo-press operation and a jump type of pressure operation, for example, to the first, third, and fifth portions. And the seven or nine circuit assembly areas 91 perform the pseudo-pressing operation first, and then perform the pressing operation, and then perform the pseudo-pressing operation on the second, fourth, sixth, eighth, and tenth circuit assembly areas 91, and then Perform this pressure operation.

In addition, in the above embodiment, the dummy ram 20 is located in front of the ram 30, and the imaginary pressure supporting mechanism 5 is located in front of the local pressure supporting mechanism 4, so that the substrate 9 is The dummy pressure supporting mechanism 5 is transferred to the false pressing head 20 to perform a false pressing operation, and then transferred to the present pressure supporting mechanism 4 in the same transfer direction to perform a pressing operation by the present pressing head 30. However, it can be changed that the dummy pressure head 20 is located behind the re-compression head 30. In this case, the false pressure support mechanism 5 is also correspondingly changed to be located behind the local pressure support mechanism 4, and After the substrate 9 is transferred over the top of the pressure supporting mechanism 4, it reaches the false pressure supporting mechanism 5, and a false pressing operation is performed by the dummy pressing head 20, and then the pressure is reversed to the opposite pressure in the opposite transfer direction. The support mechanism 4 is subjected to a pressing operation by the present indenter 30.

Referring to FIG. 10, another preferred embodiment of the flexible circuit board false-pressure integrated bonding apparatus of the present invention is substantially the same as the above preferred embodiment, and the difference is mainly in the other preferred embodiment. The embodiment replaces the second and third lateral transfer devices 41, 51 described above by a coaxial lateral transfer device 7. The coaxial lateral transfer device 7 is the same as the first lateral transfer device 1 described above, and the coaxial lateral transfer device 7 has at least one stage 71 for carrying the above-mentioned local pressure support base 42. There is also at least one other stage 72 for carrying the above-described false pressure support base 52 and image taking device 53. The stages 71 and 72 are slidably disposed on the same group of slide rails 73 and can be laterally moved along the slide rails 73. The power source can also adopt the linear motor described above. The number of the stages 71 depends on the number of the pressure support seats 42, and the number of the other stages 72 depends on the number of the false pressure support seats 52. In any event, the pressure support base 42 and the false pressure support base 52 and the image capturing device 53 thereof are laterally moved along the same axis by the coaxial lateral transfer device 7.

In another preferred embodiment, when the pseudo-pressure module 2 and the local pressure module 3 are respectively located in the lateral direction (x direction), the two are spaced apart in the lateral direction, and are spaced apart. The distance is the working section of the false pressure module 2 and the pressure module 3. When the pseudo-pressure support seat 52 and the pressure support base 42 are respectively located in the lateral direction (x direction), the two are spaced apart in the lateral direction, and the distance between the two is a pseudo-pressure support seat 52, The working section of the press support 42 is referred to as a support working section. The false pressure module 2 is moved laterally by the first lateral transfer device 1 during the false pressing operation, and is not moved during the false pressing operation. The lateral transfer device 1 is driven to move laterally away from the working interval to give up the working interval. The false-pressure support seat 52 is driven by the coaxial lateral transfer device 7 to perform lateral movement during the supporting operation period, and during the false-press operation, The coaxial lateral transfer device 7 is driven to move laterally away from the support working interval to give up the support working interval. In contrast, during the operation of the present pressure, the pressure module 3 is moved by the first lateral transfer device 1 and moved laterally within the working section, and during the period of not performing the pressure operation, the first A lateral transfer device 1 is driven to move laterally away from the working interval to give up the working interval. The pressure support base 42 is moved by the coaxial lateral transfer device 7 to perform lateral movement during the support operation, and is not moved during the operation of the pressure. The coaxial lateral transfer device 7 is driven to move laterally away from the support working interval to give up the support working interval.

In addition, in another preferred embodiment, the dummy ram 20 and the ram 30 are preferably moved laterally along a first transverse path x1 to allow the false pressure support 52 to The pressure support base 42 is laterally moved along a second lateral path x2, and the second lateral path x2 is located directly below the first lateral path x1. Thus, the substrate transfer device for transporting the substrate 9 is It is only necessary to transport the circuit assembly area 91 on the side of the substrate 9 adjacent to the same side to the first lateral path x1 and the second lateral path x2, and it is not necessary to transport the dummy to the dummy as in the above preferred embodiment. The working position is pressed and then transported to the working position of the pressure, or in another preferred embodiment, the working position of the false pressing is actually the same as the working position of the pressing. This means that one side of the substrate 9 can be directly subjected to the pressing operation without changing the position after performing the false pressing operation.

As can be seen from the above description, since the flexible circuit board dummy pressure bonding device 100 of the present invention has both the dummy pressure module 2 and the pressure module 3, the circuit assembly of the same side of the substrate 9 can be performed. The zone performs the pseudo-pressing operation and the pressing operation first and then, and the distance from the pseudo-pressure working position to the pressing working position of the substrate 9 is short, or the pseudo-pressing working position is the same position as the pressing working position. Therefore, the flexible circuit board 90 that has been pseudo-joined on the substrate 9 is less likely to fall off during transport, even if the width of the circuit assembly area of the substrate 9 is a narrow width of less than or equal to 0.4 mm. . In short, the flexible circuit board false pressure integrated bonding device 100 of the present invention can be applied to the false pressing and the pressing operation of the substrate with a relatively narrow circuit assembly area, and the conventional fake and the present pressure device often occur. The problem of the sexually bonded flexible circuit board falling during the transport process.

100‧‧‧Soft circuit board false pressure integrated bonding device

1‧‧‧First lateral transfer device

101‧‧‧Base

103‧‧‧ recessed space

10‧‧‧Base

102‧‧‧Horizontal slides

11‧‧‧false pressure carrier

12‧‧‧This ballast station

13‧‧‧Powerplant

13a‧‧‧stator

13b‧‧‧ mover

2‧‧‧Fake pressure module

20‧‧‧ False indenter

3‧‧‧This pressure module

30‧‧‧This head

4‧‧‧This pressure support mechanism

41‧‧‧Second horizontal transfer device

42‧‧‧This pressure support

5‧‧‧Fake pressure support mechanism

51‧‧‧ Third lateral transfer device

52‧‧‧Fake pressure support

53‧‧‧Image capture device

531‧‧‧ camera lens

6‧‧‧Support institutions

60‧‧‧ panel support

62‧‧‧ Lower press seat

63‧‧‧Second drive

7‧‧‧Coaxial lateral transfer device

71, 72‧‧‧

73‧‧‧Slide rails

9‧‧‧Substrate

90‧‧‧Soft circuit board

91‧‧‧Circuit assembly area

92‧‧‧Compression support zone

93‧‧‧Flat support area

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a preferred embodiment of a preferred embodiment of a flexible circuit board assembly according to the present invention. Figure 2 is a side elevational view of the preferred embodiment of the present invention. 3 to 6 are schematic views showing the process of performing a false pressing operation in the preferred embodiment of the present invention. 7 to 9 are schematic views showing the process of a press operation performed by the preferred embodiment of the present invention. Fig. 10 is a perspective view showing another preferred embodiment of the bonding apparatus of the flexible circuit board of the present invention.

Claims (14)

A soft circuit board false-pressure integrated bonding device comprises: a first lateral transfer device; a false pressure module disposed on the first lateral transfer device for positioning at a false pressure working position Performing a pseudo pressing operation on a substrate to falsely bond at least one flexible circuit board to at least one circuit assembly area on one side of the substrate, wherein the dummy pressure module is subjected to the false pressing operation a lateral transfer device is driven to move laterally within a working interval, and during the period of not performing the false pressing operation, the first lateral transfer device is driven to laterally move away from the working interval to give up the working interval; a pressing module is disposed on the first lateral transfer device for performing a pressing operation on the substrate that has completed the pseudo pressing operation, so that the flexible circuit board that has been pseudo-joined to the substrate is permanently The circuit assembly area is slidably coupled to the circuit assembly area, wherein the local pressure module is driven by the first lateral transfer device to move laterally within the working section during the operation of the local pressure, without performing The pressure operation period And the first lateral transfer device is driven to move laterally away from the working interval to give up the working interval; a false pressing support mechanism is configured to perform the false pressing operation on the substrate during the false pressing operation The bottom surface provides support for the circuit assembly area; a pressure support mechanism for supporting the bottom surface of the substrate corresponding to the circuit assembly area when the pressure module performs the pressing operation; and The substrate transfer device is configured to transport the substrate such that the circuit assembly area of the substrate is located in the pseudo-press working position or the local-press working position. The flexible circuit board false pressure integrated bonding device according to claim 1, wherein the pressure supporting mechanism comprises: a second lateral transfer device located below the first lateral transfer device, and Parallel to the first lateral transfer device; and a pressure support seat disposed on the second lateral transfer device and capable of laterally moving under the driving of the second lateral transfer device, wherein the pressure is The support seat is located directly below the lateral movement path of a pressing head of the pressure module to provide support for the bottom surface of the substrate corresponding to the circuit assembly area. The flexible circuit board false pressure integrated bonding device according to claim 1, wherein the pressure supporting mechanism comprises: a second lateral transfer device located below the first lateral transfer device, and Parallel to the first lateral transfer device; and a pressure support seat disposed on the second lateral transfer device and capable of laterally moving under the driving of the second lateral transfer device, wherein the pressure is The support seat is located directly below the lateral movement path of a pressing head of the pressure module for supporting the bottom surface of the substrate corresponding to the circuit assembly area; the false pressure support mechanism comprises: a third lateral movement a carrier device located below the first lateral transfer device and parallel to the second lateral transfer device; a false pressure support seat disposed on the third lateral transfer device and capable of being in the third lateral direction Moving laterally under the driving of the transfer device, wherein the false pressure support seat is located directly below the lateral movement path of a false pressure head of the false pressure module for corresponding to the bottom surface of the substrate corresponding to the circuit assembly area Provide support; and take a picture The device is disposed on the third lateral transfer device and can be laterally moved synchronously with the pseudo-pressure support seat under the driving of the third lateral transfer device, wherein the image-taking device is located on the false-pressure support Below the seat, the alignment mark on the substrate and the alignment mark on the flexible circuit board sucked by the dummy head are taken up. The flexible circuit board false pressure integrated bonding device according to claim 3, wherein the image capturing device comprises two camera lenses side by side in the lateral direction, the false pressure support base having two notches arranged side by side in the lateral direction, The two camera lenses respectively take the alignment marks through the two notches of the false pressure support. The flexible circuit board false pressure integrated bonding device according to claim 3, wherein the dummy pressing head is located in front of the pressing head, and the pressing support seat is located in a lateral movement path of the pressing head Directly below, the false pressure support seat is located directly below the lateral movement path of the false ram and is located in front of the pressure support seat. The flexible circuit board false pressure integrated bonding device according to claim 3, wherein the dummy pressing head is located behind the pressing head, and the pressing support seat is located in a lateral movement path of the pressing head. Directly below, the false pressure support seat is located directly below the lateral movement path of the false pressure head and behind the pressure support base. The flexible circuit board false pressure integrated bonding device according to claim 1, wherein the pressure support mechanism comprises: a coaxial lateral transfer device located below the first lateral transfer device, and Parallel to the first lateral transfer device; and a pressure support base disposed on the coaxial lateral transfer device and located directly below the lateral movement path of a pressing head of the pressure module Supporting the bottom surface of the substrate corresponding to the circuit assembly area, wherein the local pressure support seat is driven by the coaxial lateral transfer device during a supporting operation period The lateral movement is carried out by the axial lateral transfer device and laterally moved away from the support working interval to give up the support working interval; the false pressure support mechanism includes: The pressure support seat is disposed on the coaxial lateral transfer device and located directly below the lateral movement path of a false pressure head of the false pressure module for corresponding to the bottom surface of the substrate corresponding to the circuit assembly area provide The squeezing support is driven by the coaxial lateral transfer device to move laterally within the support working interval during the false pressing operation, and during the false pressing operation, And the lateral movement device is driven to move laterally away from the support working interval to give up the support working interval; and an image capturing device is disposed on the coaxial lateral transfer device, and can be Driven by the axial lateral transfer device, laterally moving in synchronization with the false pressure support base, wherein the image capture device is located below the false pressure support base for upwardly capturing the alignment mark on the substrate and The alignment mark on the flexible circuit board sucked by the dummy ram. The flexible circuit board false pressure integrated bonding device according to claim 7, wherein the image capturing device comprises two camera lenses side by side in the lateral direction, the false pressure support base having two notches arranged side by side in the lateral direction, The two camera lenses respectively take the alignment marks through the two notches of the false pressure support. The flexible circuit board false-pressure integrated bonding device according to any one of claims 1 to 8, comprising a supporting mechanism, comprising: a substrate supporting base for circuit assembly on the substrate When the region is located at the pseudo-pressing working position or the pressing working position, the bottom surface of the substrate is supported near the circuit assembly area; the lower pressing seat is located directly above the substrate supporting seat and can be moved up and down for pressing The top of the substrate faces the substrate support; and the lower pressure driving device drives the lower pressure seat for lifting movement. The flexible circuit board false pressure integrated bonding device according to claim 1, wherein the first lateral transfer device comprises: a lateral sliding rail extending a length in a lateral direction; The lateral rails are laterally moved and respectively carry the false pressure module and the pressure module; and a power device for driving the false pressure carrier and the pressure carrier for lateral movement. The flexible circuit board false pressure integrated bonding device according to claim 3, wherein the second lateral transfer device comprises: a lateral sliding rail extending a length in a lateral direction; a loading platform capable of The lateral rail moves laterally and carries the pressure support mechanism; and a power device for driving the stage for lateral movement. The flexible circuit board false pressure integrated bonding device according to claim 3, wherein the third lateral transfer device comprises: a lateral sliding rail extending a length in a lateral direction; and a loading platform capable of The lateral rail moves laterally and carries the false pressure support mechanism; and a power device for driving the stage for lateral movement. The flexible circuit board false-pressure integrated bonding device according to claim 7, wherein the coaxial lateral transfer device comprises: a lateral sliding rail extending a length in a lateral direction; The lateral rails are laterally moved and respectively carry the false pressure support mechanism and the pressure support mechanism; and a power device for driving the two stages for lateral movement. The flexible circuit board false-pressure integrated bonding device according to any one of claims 10 to 13, wherein the power device is a linear motor having a set of stators and a plurality of movers, The group of stators extends laterally along the slide rails, and the movers are respectively disposed on the plurality of stages.