CN202573207U - Semi-automatic crimping and bonding mechanism - Google Patents
Semi-automatic crimping and bonding mechanism Download PDFInfo
- Publication number
- CN202573207U CN202573207U CN 201220108737 CN201220108737U CN202573207U CN 202573207 U CN202573207 U CN 202573207U CN 201220108737 CN201220108737 CN 201220108737 CN 201220108737 U CN201220108737 U CN 201220108737U CN 202573207 U CN202573207 U CN 202573207U
- Authority
- CN
- China
- Prior art keywords
- chip
- guide rail
- automatic
- circuit board
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
The utility model relates to the technical field of bonding equipment, and discloses a semi-automatic crimping and bonding mechanism for connecting chips to a flexible circuit board. The semi-automatic crimping and bonding mechanism comprises a film sticking machine, a press fit machine, an automatic feeding mechanism, a delivery mechanism and an automatic blanking mechanism, wherein the film sticking machine is used for automatically sticking electric conducting films on chips; the press fit machine can automatically connect the chips to the flexible circuit board; the delivery mechanism can deliver the chips in the film sticking machine to the press fit machine. The automatic bonding machine according to the utility model can automatically deliver the chips into the film sticking machine by utilizing the automatic feeding mechanism and stick the electric conducting films; the delivery mechanism can deliver the chips on which the electric conducting films are sticked to the press fit machine automatically; the chips are automatically connected to the flexible circuit board; the automatic blanking machine can automatically deliver the flexible circuit board connected with the chips to the outside; and during the whole process, automation is realized, the working efficiency is high, the yield can be improved greatly, and the labor intensity of workers is low.
Description
Technical field
The utility model relates to the technical field of bound device, relates in particular to semi-automatic crimping Bang Ding mechanism.
Background technology
Bound device is to be used for chip is connected the equipment on the flexible circuit board, and bound device generally comprises the laminator that is used for pasting on the chip conducting film, the chip behind the pad pasting is connected the pressing machine on the flexible circuit board.
In the prior art; General all is through manually-operated mode the most original chip to be connected on the flexible circuit board, promptly through manually-operated mode chip is placed in the laminator, again after laminator is attached to conducting film on the chip; Be placed in the pressing machine through will the fit chip of film of manually-operated again; The pressing machine directly is connected chip on the flexible circuit board, and is last, and the flexible circuit board that will stick chip through manually-operated mode again unloads.Above-mentioned whole process all is manually-operated, and its automaticity is lower, and efficient is also low, influences output, needs more workman's Attended Operation in process of production, and cost is higher, and working strength of workers is also bigger.
The utility model content
The utility model provides semi-automatic crimping Bang Ding mechanism, is intended to solve and utilizes bound device automaticity in the prior art low so that efficient is low, influence output, cost is higher and labor strength is big problem.
The utility model is to realize like this; Semi-automatic crimping Bang Ding mechanism; Be used for chip is connected in flexible circuit board; Comprise can be automatically with the laminator that sticks conducting film on the said chip and can automatically the chip that posts said conducting film be connected in the pressing machine on the said flexible circuit board; Comprise also and can grasp said chip and said chip is delivered to automatic charging structure in the said laminator, can the chip that post said conducting film in the said laminator be delivered to the conveying mechanism in the pressing machine and the flexible circuit board that can hold the flexible circuit board that has connected said chip in the said pressing machine and will connect chip is delivered to outside automatic blanking mechanism that said automatic feed mechanism, laminator, pressing machine and automatic blanking mechanism are provided with in regular turn.
Further, said conveying mechanism is located at a side of said laminator and said pressing machine.
Further, said automatic feed mechanism comprises first sucker that can hold said chip and can drive the first spatial movement assembly that said first sucker moves in the space.
Further; First vertical guide rail that the said first spatial movement assembly comprises first horizontal guide rail, be slidingly matched with said first horizontal guide rail, be connected in said first vertical guide rail and can drive said first vertical guide rail in first dynamical element that moves on said first horizontal guide rail, first move seat, be connected in said first and move seat and can drive said first and move the second power spare that seat moves and place said first to move seat and go up and can drive the 3rd power spare that said first sucker moves in vertical direction on said first vertical guide rail with said first vertical guide rail is slidingly matched, said first sucker is connected in said the 3rd power spare.
Further, said conveying mechanism comprises the 4th power spare, can driven the screw mandrel that rotates and be connected in said screw mandrel and can rotate and move and can hold second sucker of the chip that has sticked said conducting film along said screw mandrel with said screw mandrel by said the 4th power spare.
Further, said automatic blanking mechanism comprises the 3rd sucker that can hold the flexible circuit board that has connected said chip and can drive the second spatial movement assembly that said the 3rd sucker moves in the space.
Further; Second vertical guide rail that the said second spatial movement assembly comprises second horizontal guide rail, be slidingly matched with said second horizontal guide rail, be connected in said second vertical guide rail and can drive said second vertical guide rail in the 5th dynamical element that moves on said second horizontal guide rail, second move seat, be connected in said second and move seat and can drive said second and move the 6th power spare that seat moves and place said second to move seat and go up and can drive the 7th power spare that said the 3rd sucker moves in vertical direction on said second vertical guide rail with said second vertical guide rail is slidingly matched, said the 3rd sucker is connected in said the 7th power spare.
Further; Said pressing machine comprises and can the chip that stick conducting film placed the precompressed mechanism on the said flexible circuit board and can the said chip that has sticked conducting film be connected in this press mechanism on the said flexible circuit board that said precompressed mechanism and said press mechanism are arranged in regular turn.
Compared with prior art; Automatic nation in the utility model decides machine and can utilize automatic feed mechanism automatically chip to be delivered to stick conducting film in the laminator, and conveying mechanism will post the chip of conducting film and deliver to automatically in the pressing machine, with chip from being automatically connected on the flexible circuit board; Automatic blanking mechanism can deliver to the outside with the flexible circuit board that connects chip automatically; Whole process realizes automation, and high efficiency can improve output greatly; Only need two workmans to be placed on chip on the automatic feed mechanism respectively and will connect flexible circuit board that automatic blanking mechanism grasps take off then can, working strength of workers is little.
Description of drawings
Fig. 1 is the schematic top plan view of the semi-automatic crimping Bang Ding mechanism that provides of the utility model;
Fig. 2 is the schematic top plan view of the automatic feed mechanism that provides of the utility model embodiment;
Fig. 3 is the schematic top plan view of the automatic blanking mechanism that provides of the utility model embodiment.
The specific embodiment
For the purpose, technical scheme and the advantage that make the utility model is clearer,, the utility model is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
The utility model provides semi-automatic crimping Bang Ding mechanism; Be used for chip is connected in flexible circuit board; Comprise can be automatically in the laminator that sticks conducting film on the said chip and can automatically the chip that posts said conducting film be connected in the pressing machine on the said flexible circuit board; Comprise also and can grasp said chip and said chip is delivered to automatic charging structure in the said laminator, can the chip that post said conducting film in the said laminator be delivered to the conveying mechanism in the pressing machine and the flexible circuit board that can hold the flexible circuit board that has connected said chip in the said pressing machine and will connect chip is delivered to outside automatic blanking mechanism that said automatic feed mechanism, laminator, pressing machine and automatic blanking mechanism are provided with in regular turn.
Semi-automatic crimping Bang Ding mechanism in the utility model can be connected chip on the flexible circuit board automatically; And automatic feed mechanism capable of using is used for chip and grasps; Automatic blanking mechanism then can take off the flexible circuit board that connects chip; Its high efficiency improve output greatly, and working strength of workers is lower.
Shown in Fig. 1～3, a preferred embodiment that provides for the utility model.
The semi-automatic crimping Bang Ding mechanism 1 that present embodiment provides is used for chip is connected flexible circuit board, and it comprises the laminator 12 that can on chip, stick conducting film automatically, the automatic blanking mechanism 15 that can chip delivered to automatic feed mechanism 11 in the laminator 12 automatically, can the chip that posts conducting film is connected pressing machine on the flexible circuit board, can the chip that post film delivered to conveying mechanism 16 in the pressing machine and can the flexible circuit board that connects chip be taken out from the pressing machine.According to the order of transmission of chip, automatic feed mechanism 11, laminator 12, pressing machine and automatic blanking mechanism 15 in above-mentioned are provided with in regular turn, thereby have also guaranteed the order of whole Manufacturing Automated process.
Utilize above-mentioned semi-automatic crimping Bang Ding mechanism 1 can realize chip from being automatically connected in the whole process on the flexible circuit board, its particularly operating process be such, automatic feed mechanism 11 is picked up the chip of outside; Deliver in the laminator 12, in laminator 12, laminator 12 is attached to conducting film on the chip; After posting, 16 grab chips of conveying mechanism are delivered to chip in the pressing machine; In the pressing machine, the chip that has posted film then can be connected on the flexible circuit board, then; 15 in automatic blanking mechanism can grasp the flexible circuit board that has been connected with chip in the pressing machine down, and delivers to the outside.
Above-mentioned automatic binding machine sticks conducting film with chip, and the chip that will paste conducting film again is connected the whole process on the flexible circuit board, realizes modernization fully, and its high efficiency can improve output greatly, and working strength of workers is also less.In practical operation; Only need two workmans then can, a people is placed on chip in batches in the automatic feed mechanism 11, thus he automechanism then can grasps chip and deliver in the laminator 12; In addition; After chip was connected flexible circuit board, automatic blanking mechanism 15 crawled out flexible circuit board, as long as the flexible circuit board that another workman then will take out is moved then can.
In the present embodiment; Automatic feed mechanism 11 comprises first sucker 111 and can drive the first spatial movement assembly 112 that first sucker 111 moves in the space; First sucker 111 can hold chip; And under the drive of the first spatial movement assembly 112, chip delivered to carry out pad pasting operation in the laminator 12.
Particularly; First vertical guide rail 1122 that the first spatial movement assembly 112 comprises first horizontal guide rail 1121, be slidingly matched with first horizontal guide rail 1121, be connected on first vertical guide rail 1122 and can drive first vertical guide rail 1122 the first power spare 1124 that moves on first horizontal guide rail 1121, with first vertical guide rail 1122 be slidingly matched first move seat 1126, can drive first move seat 1126 at the second power spare 1125 that moves on first vertical guide rail 1122, be installed in first and move on the seat 1126 and can drive the 3rd power spare 1123 that first sucker, 111 in the vertical directions move, first sucker 111 in above-mentioned is connected on the 3rd power spare 1123.
The concrete function mode of the automatic feed mechanism 11 in above-mentioned is following: the first power spare 1124 drives first vertical guide rail 1122 and on first horizontal guide rail 1121, moves; 1125 drivings first of the second power spare are moved seat 1126 and on first vertical guide rail 1122, are moved; And the 3rd power spare 1123 drives first sucker 111 and moves at vertical direction, thereby realizes first sucker 111 moving spatially.Pick up chip and deliver in the process of laminator 12 at first sucker 111, the spatial movement track of this automatic feed mechanism 11 is the control system control by the outside, and it can guarantee that each chip delivers to the accurate position in the laminator 12 accurately.
Particularly; 16 of conveying mechanisms in above-mentioned comprise the 4th power spare 161, can driven the screw mandrel 162 that rotates and be connected on the screw mandrel 162 and second sucker 163 that can move along screw mandrel 162 with the rotation of screw mandrel 162 by the 4th power spare 161; This second sucker 163 can pick up the chip that has posted film in the laminator 12; And chip delivered in the pressing machine, chip is connected on the flexible circuit board, certainly; For the ease of operation, screw mandrel 162 is to extend along a side of laminator 12 and pressing machine to arrange.
In the present embodiment, identical during the structure of automatic charging structure and automatic blanking mechanism 15, only the run trace of the sucker on it is inconsistent, and they all are to realize picking up object, and object is delivered to the another one position.
Particularly; Automatic blanking mechanism 15 comprises the 3rd sucker 151 and can drive the second spatial movement assembly 152 that the 3rd sucker 151 moves in the space; The 3rd sucker 151 can hold the flexible circuit board that has connected chip; And under the drive of the second spatial movement assembly 152, flexible circuit board is delivered to the outside, and take off by the workman and to deliver to next production line.
Particularly; Second vertical guide rail 1522 that the second spatial movement assembly 152 comprises second horizontal guide rail 1521, be slidingly matched with second horizontal guide rail 1521, be connected on second vertical guide rail 1522 and can drive second vertical guide rail 1522 the 5th power spare 1524 that moves on second horizontal guide rail 1521, with second vertical guide rail 1522 be slidingly matched second move seat 1526, can drive second move seat 1526 at the 6th power spare 1525 that moves on second vertical guide rail 1522, be installed in second and move on the seat 1526 and can drive the 7th power spare 1523 that the 3rd sucker 151 in the vertical directions move, the 3rd sucker 151 in above-mentioned is connected on the 7th power spare 1523.
The concrete function mode of the automatic feed mechanism 11 in above-mentioned is following: the 5th power spare 1524 drives second vertical guide rail 1522 and on second horizontal guide rail 1521, moves; 1525 drivings second of the 6th power spare are moved seat 1526 and on second vertical guide rail 1522, are moved; And the 7th power spare 1523 drives the 3rd sucker 151 and moves at vertical direction, thereby realizes the 3rd sucker 151 moving spatially.After the 3rd sucker 151 picked up the flexible circuit board that connects chip, the spatial movement track of this automatic blanking mechanism 15 was that it can guarantee that each flexible circuit board is sent to outside accurate position exactly by the control system control of outside.
In the present embodiment; The above-mentioned first power spare 1124, the second power spare 1125, the 3rd power spare 1123, the 4th power spare 161, the 5th power spare 1524, the 6th power spare 1525, the 7th power spare 1523 can be motors, also can be other power-equipments.
In the present embodiment; The pressing machine that chip is connected on the flexible circuit board comprises precompressed mechanism 13 and this press mechanism 14; The precompressed mechanism 13 chip of pad pasting is placed on the accurate position of flexible circuit board in advance, utilizes this press 14 structures to realize being connected of chip and flexible circuit board again.According to the pass order of chip, automatic feed mechanism 11, laminator 12, preformer 13, this press 14 and automatic blanking mechanism 15 in above-mentioned are provided with in regular turn.
The above is merely the preferred embodiment of the utility model; Not in order to restriction the utility model; Any modification of being done within all spirit and principles at the utility model, be equal to replacement and improvement etc., all should be included within the protection domain of the utility model.
Claims (8)
1. semi-automatic crimping Bang Ding mechanism; Be used for chip is connected in flexible circuit board; Comprise can be automatically with the laminator that sticks conducting film on the said chip and can automatically the chip that posts said conducting film be connected in the pressing machine on the said flexible circuit board; It is characterized in that; Comprise also and can grasp said chip and said chip is delivered to automatic charging structure in the said laminator, can the chip that post said conducting film in the said laminator be delivered to the conveying mechanism in the pressing machine and the flexible circuit board that can hold the flexible circuit board that has connected said chip in the said pressing machine and will connect chip is delivered to outside automatic blanking mechanism that said automatic feed mechanism, laminator, pressing machine and automatic blanking mechanism are provided with in regular turn.
2. semi-automatic crimping Bang Ding as claimed in claim 1 mechanism is characterized in that said conveying mechanism is located at a side of said laminator and said pressing machine.
3. according to claim 1 or claim 2 semi-automatic crimping Bang Ding mechanism is characterized in that said automatic feed mechanism comprises first sucker that can hold said chip and can drive the first spatial movement assembly that said first sucker moves in the space.
4. semi-automatic crimping Bang Ding as claimed in claim 3 mechanism; It is characterized in that; First vertical guide rail that the said first spatial movement assembly comprises first horizontal guide rail, be slidingly matched with said first horizontal guide rail, be connected in said first vertical guide rail and can drive said first vertical guide rail in first dynamical element that moves on said first horizontal guide rail, first move seat, be connected in said first and move seat and can drive said first and move the second power spare that seat moves and place said first to move seat and go up and can drive the 3rd power spare that said first sucker moves in vertical direction on said first vertical guide rail with said first vertical guide rail is slidingly matched, said first sucker is connected in said the 3rd power spare.
5. semi-automatic crimping Bang Ding as claimed in claim 3 mechanism; It is characterized in that said conveying mechanism comprises the 4th power spare, can driven the screw mandrel that rotates and be connected in said screw mandrel and can rotate and move and can hold second sucker of the chip that has sticked said conducting film along said screw mandrel with said screw mandrel by said the 4th power spare.
6. semi-automatic crimping Bang Ding as claimed in claim 3 mechanism; It is characterized in that said automatic blanking mechanism comprises the 3rd sucker that can hold the flexible circuit board that has connected said chip and can drive the second spatial movement assembly that said the 3rd sucker moves in the space.
7. semi-automatic crimping Bang Ding as claimed in claim 6 mechanism; It is characterized in that; Second vertical guide rail that the said second spatial movement assembly comprises second horizontal guide rail, be slidingly matched with said second horizontal guide rail, be connected in said second vertical guide rail and can drive said second vertical guide rail in the 5th dynamical element that moves on said second horizontal guide rail, second move seat, be connected in said second and move seat and can drive said second and move the 6th power spare that seat moves and place said second to move seat and go up and can drive the 7th power spare that said the 3rd sucker moves in vertical direction on said second vertical guide rail with said second vertical guide rail is slidingly matched, said the 3rd sucker is connected in said the 7th power spare.
8. according to claim 1 or claim 2 semi-automatic crimping Bang Ding mechanism; It is characterized in that; Said pressing machine comprises and can the chip that stick conducting film placed the precompressed mechanism on the said flexible circuit board and can the said chip that has sticked conducting film be connected in this press mechanism on the said flexible circuit board that said precompressed mechanism and said press mechanism are arranged in regular turn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220108737 CN202573207U (en) | 2012-03-21 | 2012-03-21 | Semi-automatic crimping and bonding mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220108737 CN202573207U (en) | 2012-03-21 | 2012-03-21 | Semi-automatic crimping and bonding mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202573207U true CN202573207U (en) | 2012-12-05 |
Family
ID=47242656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220108737 Expired - Lifetime CN202573207U (en) | 2012-03-21 | 2012-03-21 | Semi-automatic crimping and bonding mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202573207U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104582305A (en) * | 2014-12-25 | 2015-04-29 | 深圳市联得自动化装备股份有限公司 | Glass circuit board based FPC (flexible printed circuit) board hot-pressing device, processing system and method |
| TWI650826B (en) * | 2017-07-31 | 2019-02-11 | 旭東機械工業股份有限公司 | Fpc pre-main bonding machine |
-
2012
- 2012-03-21 CN CN 201220108737 patent/CN202573207U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104582305A (en) * | 2014-12-25 | 2015-04-29 | 深圳市联得自动化装备股份有限公司 | Glass circuit board based FPC (flexible printed circuit) board hot-pressing device, processing system and method |
| TWI650826B (en) * | 2017-07-31 | 2019-02-11 | 旭東機械工業股份有限公司 | Fpc pre-main bonding machine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203039522U (en) | Automatic rotor production system | |
| CN102957273B (en) | Automatic production system of rotor | |
| CN103121135A (en) | Thin film solar cell bus bar intersection automatic hot welding device | |
| CN102951317B (en) | Full-automatic mylar adhering equipment | |
| CN102709785A (en) | Terminal crimping module of multifunctional fully-automatic terminal crimping machine for flat cables | |
| CN103165255A (en) | Automatic potentiometer assembling equipment | |
| CN202573207U (en) | Semi-automatic crimping and bonding mechanism | |
| CN103531668A (en) | Full-automatic photovoltaic module laminating equipment | |
| CN101673795B (en) | Double-row track feed type system for specific feeding of vertical LED lead frame | |
| CN207239052U (en) | A kind of automatic placement rivet assembly line | |
| CN103547141A (en) | Laminating machine | |
| CN207558983U (en) | A kind of automation attaches PC film equipments | |
| CN203109457U (en) | Automatic hot welding device of thin film solar cell confluence intersections | |
| CN104619127A (en) | Insertion machine | |
| CN104353944B (en) | A kind of pin pay-off | |
| CN203265450U (en) | Punch press waste material automatic recovery system | |
| CN203523241U (en) | Laminating machine | |
| CN209097695U (en) | Feed mechanism and chip manufacture device | |
| CN207558946U (en) | Formation device | |
| CN203246957U (en) | Automatic winding binding machine | |
| CN105048250B (en) | A kind of socket device for automatic socket machine | |
| CN207791960U (en) | A kind of multi-position disc feeding device | |
| CN208485381U (en) | A kind of automatic collecting device of polar plate of lead acid storage battery | |
| CN204078828U (en) | A kind of compound type auto-paralleling transplanter | |
| CN204277244U (en) | A kind of pin pay-off |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN SKING INTELLIGENT EQUIPMENT CO., LTD. Free format text: FORMER NAME: SHENZHEN SKING PNEUMATIC EQUIPMENT CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: 518000 Guangdong city of Shenzhen province Baoan District Fuyong Tong Mei Fu Hong Feng Tong Road community third industrial zone first, second, third, four, seven layers of Fuyong Street Yong Mei community Fuyuan Industrial District A1 Building 1 floor, building C2-1 B B Patentee after: Shenzhen Sking Intelligent Equipment Co., Ltd. Address before: 518000, Guangdong, Shenzhen province Baoan District Xinghua Road, North forty-three District, a village committee, South Building, B, South third floor Patentee before: Shenzhen Sking Pneumatic Equipment Co., Ltd. |
|
| C56 | Change in the name or address of the patentee | ||
| CP02 | Change in the address of a patent holder |
Address after: 518000, Guangdong, Shenzhen, Baoan District, Fuyong street, Tong tail community, Feng Tang Avenue, Fu Hong Industrial Zone, third, first, second, third, four, seven, Fuyong street, Tong community, Fuyuan Industrial Zone, A1 building,, B, C2-1 building, B Patentee after: Shenzhen Sking Intelligent Equipment Co., Ltd. Address before: 518000 Guangdong city of Shenzhen province Baoan District Fuyong Tong Mei Fu Hong Feng Tong Road community third industrial zone first, second, third, four, seven layers of Fuyong Street Yong Mei community Fuyuan Industrial District A1 Building 1 floor, building C2-1 B B Patentee before: Shenzhen Sking Intelligent Equipment Co., Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20121205 |
|
| CX01 | Expiry of patent term |