JP4829813B2 - Electronic component mounting apparatus and mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting device that improves precision in mounting a TCP on a board. <P>SOLUTION: An X-Y-Z-&theta; driving source drives the TCP 9 to align the board W relative to the TCP 9. At this time, an imaging camera takes an image of terminals at both ends in an arrangement direction of a plurality of second terminals T2 arranged in rows on the TCP 9, a calculation process unit calculates a second central coordinate X2 at the center in the arrangement direction of the second terminals T2, based on the image taken, and the X-Y-Z-&theta; driving source aligns the board W relative to the TCP 9 so as to align the calculated second central coordinate with a precalculated first central coordinate X1 at the center of a line connecting a pair of first aligning marks m1 on the board W. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

  The present invention relates to an electronic component mounting apparatus and mounting method for mounting an electronic component on a top surface of one side of a substrate with precise positioning.

  For example, a TCP (Tape Carrier Package) which is an electronic component is pressure-bonded to a liquid crystal cell as a substrate through an anisotropic conductive member as an adhesive material. In the liquid crystal cell, two glass plates are bonded in a liquid-tight manner at a predetermined interval via a sealing material, liquid crystal is sealed between the glass plates, and a polarizing plate is attached to the outer surface of each glass plate. Configured. In the liquid crystal cell having the above-described configuration, the tape-like anisotropic conductive member is pressure-bonded to the upper surface of the side portion, the TCP is temporarily pressure-bonded to the anisotropic conductive member, and then the pressure-bonding is performed. .

  In order to temporarily press-bond the TCP to the liquid crystal cell, the lower surface of the liquid crystal cell is supported by the upper end surface of the backup tool, and the electronic component is pressure-bonded to the upper surface of the supported portion by the mounting tool. .

  When the TCP is pressure-bonded to the liquid crystal cell, the plurality of first terminals provided on the upper surface of one side of the liquid crystal cell and the plurality of second terminals provided on the TCP must be precisely aligned. . In recent years, in particular, as the performance of liquid crystal cells increases, the arrangement density of the first terminals and the arrangement density of the second terminals of the TCP tend to be narrowed in units of μm, for example.

  Therefore, when the TCP is mounted on the liquid crystal cell, if the relative position of the substrate and the TCP is slightly shifted from the arrangement direction of each terminal (this direction is the X direction), the first terminal and the second terminal May cause poor contact of the terminals.

Therefore, when the TCP is mounted on the liquid crystal cell, each pair of alignment marks provided on the liquid crystal cell and the TCP is imaged by a pair of imaging cameras. Then, the relative position between the liquid crystal cell and the TCP is calculated based on the imaging, and the liquid crystal cell is driven and aligned with respect to the TCP in the X, Y, and θ directions by the calculation, and then the TCP. Is mounted on the board. Such prior art is disclosed in Patent Document 1.
Patent Registration No. 2956842

  By the way, when aligning the liquid crystal cell and the TCP, normally, first, a pair of alignment marks provided on the liquid crystal cell and the TCP are respectively selected from the X, Y, and θ directions based on the imaging of the imaging camera. , Temporary alignment relative to the X direction and the θ direction. At this time, the alignment marks of the liquid crystal cell and the TCP are separated from the Y direction orthogonal to the X direction. The X direction is an arrangement direction of a plurality of terminals provided in the liquid crystal cell and the TCP, and the Y direction is a direction orthogonal to the arrangement direction of the terminals.

  Next, the liquid crystal cell is driven and positioned in the Y direction with respect to the TCP so that the pair of TCP alignment marks overlap the pair of alignment marks of the liquid crystal cell, and then the TCP is lowered to move the liquid crystal It is designed to be mounted on the cell.

  Conventionally, after the liquid crystal cell and the TCP are brought close to each other without overlapping, these alignment marks are picked up by an imaging camera, and the liquid crystal cell and the TCP are aligned sequentially based on the image pickup result. TCP is implemented.

  However, when positioning the liquid crystal cell and TCP temporarily positioned with respect to the X direction and the θ direction by relatively driving in the Y direction, the positioning is mechanically driven, for example, a table on which the liquid crystal cell is placed. Done. Therefore, the liquid crystal cell and the TCP may be displaced with respect to the X direction and the Y direction due to mechanical power transmission errors.

  The displacement in the Y direction is not a big problem, but even if the displacement in the X direction (arrangement direction of multiple terminals) is slight, the terminals provided in the liquid crystal cell and TCP are in μm units as the performance of the liquid crystal cell increases. If the pitch is narrowed, the terminals may not be connected to each other reliably, resulting in poor contact.

  In order to prevent such mounting defects, the liquid crystal cell and the TCP are positioned in the X direction and the θ direction, and then the liquid crystal cell is driven in the Y direction and positioned with respect to the TCP. If it can be confirmed whether or not there is a deviation with respect to the X direction from the alignment of each of the pair of alignment marks, the TCP can be mounted on the liquid crystal cell by correcting the positional deviation in the X direction. Defects can be eliminated.

  When checking the alignment mark of the liquid crystal cell and TCP positioned in the Y direction, the liquid crystal cell and TCP pair of alignment marks that have been positioned and overlapped are imaged with an imaging camera and processed, and they are precisely positioned. It can be considered to determine whether or not it is done.

  However, when the alignment mark where the liquid crystal cell and the TCP overlap each other is imaged, it is impossible to accurately determine the degree of overlap between the alignment marks from the image obtained by binarizing the imaging signal. That is, if the overlapping alignment mark is binarized, the image becomes one black image.

  Therefore, when the liquid crystal cell is positioned in the X direction and the θ direction with respect to the TCP and then moved in the Y direction, whether or not there is a deviation between the liquid crystal cell and the TCP in the X direction orthogonal to the moving direction. Cannot be determined accurately.

  In other words, from the binarized image, it is impossible to determine whether or not the center of one of the overlapping alignment marks and the other alignment mark is precisely coincident with each other. It was difficult to position and connect.

  According to the present invention, even when a positional deviation occurs due to various causes when positioning the board and the electronic component, the electronic component can be mounted on the board by reliably correcting the deviation. To provide a mounting apparatus and a mounting method.

According to the present invention, the plurality of second terminals provided at the same interval as the first terminal are aligned with the plurality of first terminals provided at predetermined intervals on the side of the substrate. A mounting device for mounting the electronic component on the substrate,
Corresponding to a pair of first alignment marks provided on the outside of the board in the arrangement direction of the first terminals and the first alignment marks on the outside in the arrangement direction of the second terminals of the electronic component. A pair of imaging means for simultaneously imaging one and the other of the pair of second alignment marks provided at intervals in the same field of view;
From the first and second alignment marks imaged by the imaging means, the relative position between the substrate and the electronic component and the first central coordinate of the arrangement direction center of the pair of first alignment marks on the substrate are obtained. A calculating means for calculating;
Based on the relative position of the substrate and the electronic component calculated by the calculating means, the pair of the first alignment mark and the second alignment mark are positioned relative to each other so that the pair of the first alignment mark and the second alignment mark overlap each other. Comprising driving means for matching,
When the substrate and the electronic component are relatively aligned by the driving means,
The imaging means images the terminals at both ends in the arrangement direction of the plurality of second terminals provided in the electronic component,
The calculation means calculates a second center coordinate of the arrangement direction center of the plurality of second terminals based on the imaging,
Based on the calculation, the driving means relatively positions the substrate and the electronic component so that the first center coordinate and the second center coordinate are located on the same straight line orthogonal to the arrangement direction of the terminals. The electronic component mounting apparatus is characterized in that:

  Preferably, the driving means drives the electronic component and positions it with respect to the substrate.

According to the present invention, the plurality of second terminals provided at the same interval as the first terminal are aligned with the plurality of first terminals provided at predetermined intervals on the side of the substrate. A mounting method for mounting the electronic component on the substrate,
Corresponding to a pair of first alignment marks provided on the outside of the board in the arrangement direction of the first terminals and the first alignment marks on the outside in the arrangement direction of the second terminals of the electronic component. Imaging one and the other of each of a pair of second alignment marks provided at intervals in the same field of view simultaneously;
Calculating a relative position between the substrate and the electronic component and a first center coordinate of a placement direction center of the pair of first alignment marks on the substrate from the imaged first and second alignment marks; ,
Aligning the substrate and the electronic component such that the first alignment mark and the second alignment mark overlap based on the calculation of the relative position of the substrate and the electronic component;
After aligning the substrate and the electronic component, the terminals at both ends in the arrangement direction of the plurality of second terminals provided on the electronic component are imaged, and the center of the arrangement direction of the second terminal is based on the imaging. Calculating a second center coordinate;
A step of relatively positioning the substrate and the electronic component such that the calculated second center coordinate and the first center coordinate are located on the same straight line perpendicular to the arrangement direction of the terminals. The electronic component mounting method is characterized by the following.

According to the present invention, the center coordinates of the pair of first alignment marks provided on the substrate are obtained in advance, and the substrate and the electronic component are relatively positioned so that the alignment marks provided on these overlap each other. Sometimes, the center coordinates in the arrangement direction of the plurality of second terminals provided in the electronic component are obtained, and the center coordinates of the pair of first alignment marks and the center coordinates in the arrangement direction of the second terminals are identical. The relative position between the substrate and the electronic component is corrected so as to be positioned on the line.
Therefore, the electronic components can be mounted on the substrate by precisely aligning the terminals so that the terminals of the substrate and the electronic components do not shift.

An embodiment of the present invention will be described below with reference to the drawings.
The mounting apparatus shown in FIG. 1 includes a base table 1. An X table 2 is provided on the base table 1. The X table 2 is driven along an X direction orthogonal to the paper surface by an X drive source 3 provided on one side of the base table 1.

  A Y table 4 as a holding table is provided on the X table 2 so as to be movable along the Y direction orthogonal to the X direction. The Y table 4 is driven by a Y drive source 5 provided on one side of the X table 2 along a Y direction perpendicular to the X direction indicated by an arrow in the figure.

  On the upper surface of the Y table 4, that is, the holding surface 4 a, a substrate W such as a liquid crystal cell having two glass plates bonded together is adsorbed and held with one side protruding from one side of the Y table 4. The Y table 4 holding the substrate W is positioned by controlling the driving of the X drive source 3 and the Y drive source 5 by the control device 6 shown in FIG.

  Position information is input and set to the control device 6 in advance by an input unit (not shown) according to the size of the substrate W, and the X drive source 3 and the Y drive source 5 are driven based on the position information. One side of the substrate W held on the Y table 4 is positioned at a predetermined position.

  A TCP 9 as an electronic component to be described later is mounted on the upper surface of one side portion of the substrate W thus positioned. At that time, the lower surface of one side portion of the substrate W on which the TCP 9 is mounted is supported by the backup tool 8.

  The backup tool 8 is provided on the backup table 11 so as to be driven in the vertical direction via the lower Z drive source 12. A lower X guide rail 13 is provided on the upper surface of one end of the base table 1 along the X direction.

  The backup table 11 is driven by a linear motor (not shown) along the lower X guide rail 13. Thereby, the backup tool 8 is provided on the lower surface of one side portion of the substrate W on which the TCP 9 is mounted so as to be driven along the direction along the one side portion, that is, along the X direction shown in FIG. .

  First and second imaging cameras 14A and 14B as imaging means are provided on both side surfaces of the lower Z drive source 12 in the width direction along the X direction. The imaging signals of the pair of imaging cameras 14A and 14B are A / D converted (binarized) by the image processor 15 as shown in FIG. Is output.

  The pair of imaging cameras 14A and 14B are provided at a pair of first alignment marks m1 provided on one side of the substrate W and at one end of the TCP 9, as shown in FIGS. One and the other of the pair of second alignment marks m2 are simultaneously imaged in the respective visual fields S1 and S2. Further, the terminals T1 and T2 at both ends of the substrate W and the TCP 9 are also within the visual fields S1 and S2 at this time, and can be imaged.

  In this embodiment, the first alignment mark m1 is a double circle, and the second alignment mark m2 is a double circle larger than the first alignment mark m1, but these alignment marks The shapes of m1 and m2 may be other shapes such as a square shape and a cross shape.

  On one side of the substrate W, a plurality of first terminals T1 along the Y direction are provided at predetermined intervals in the X direction, and the pair of first terminals T1 is disposed outside the first terminal T1 in the X direction (arrangement direction). One alignment mark m1 is provided.

  The second terminals T2 are provided at one end of the TCP 9 at a number and interval corresponding to the first terminals T1, and a pair of the second positions are arranged outside the second terminals T2 in the arrangement direction. The alignment mark m2 is provided at the same interval as the first alignment mark m1. That is, the distance between the centers of the pair of first alignment marks m1 and the distance between the centers of the pair of second alignment marks m2 are set to be the same as indicated by L in FIG.

  The arithmetic processing unit 16 detects the pair of first alignment mark m1 and second alignment mark m2 from the imaging signals of the pair of imaging cameras 14A and 14B binarized by the image processing unit 15. From the X and Y coordinates and the X and Y coordinates, the amount of displacement of each pair of first and second alignment marks m1 and m2 is calculated.

  The amount of displacement between the first alignment mark m1 and the second alignment mark m2 calculated by the arithmetic processing unit 16 is output to the drive output unit 17. The drive output unit 17 aligns the TCP 9 with respect to the substrate W with respect to the X direction and the θ direction based on the displacement amount calculated by the arithmetic processing unit 16, and then aligns the TCP 9 with the Y direction. Mounted on one side of W as described below.

As shown in FIG. 1, a mounting tool 21 is provided above the backup tool 8. The mounting tool 21 has a suction nozzle 22 at the tip, and one end of the TCP 9 is sucked and held by the suction nozzle 22. The mounting tool 21 is driven in the X, Y, θ, and Z directions by an X / Y / θ / Z drive source 23.
The lower Z drive source 12 and the X, Y, θ, Z drive source 23 are controlled by the control device 6.

  Next, an operation when the TCP 9 is mounted on one side of the substrate W by the mounting apparatus having the above configuration will be described.

  When the operation is started, the X drive source 3 and the Y drive source 5 are driven based on the preset value set in the control device 6, and the substrate W held on the holding surface 4a of the Y table 4 is moved in the X and Y directions. Is positioned at a predetermined position. That is, positioning is performed so that one side portion of the substrate W is located above the backup tool 8 in the Y direction.

  When the substrate W is positioned, the mounting tool 21 is driven to position the TCP 9. In other words, the TCP 9 includes a pair of first alignment marks m1 provided on the substrate W and a pair of second alignment marks m2 provided on the TCP 9, as shown in FIG. The X, Y, θ, and Z drive sources 23 drive the X and Y directions to the positions where the imaging cameras 14A and 14B enter the respective visual fields S1 and S2. At this time, the X and Y coordinates of the TCP 9 are preset by the control device 6 as the imaging position.

  When the TCP 9 is positioned at the imaging position, a pair of first alignment mark m1 and second alignment mark m2 are imaged by the first and second imaging cameras 14A and 14B, respectively. The imaging signals of the pair of imaging cameras 14A and 14B are subjected to A / D conversion processing by the image processing unit 15, and the arithmetic processing unit 16 calculates the X and Y coordinates of the alignment marks m1 and m2.

  Thereby, the amount of displacement between the pair of first alignment marks m1 provided on the substrate W and the pair of second alignment marks m2 provided on the TCP 9 is calculated. At this time, the arithmetic processing unit 16 calculates center coordinates X1 in the X direction of the two first alignment marks m1 from the X coordinates of the pair of first alignment marks m1.

  The calculated value calculated by the arithmetic processing unit 16 is output to the drive output unit 17. The drive output unit 17 first drives the TCP 9 in the X direction and θ direction by the X, Y, θ, and Z drive sources 23, and a pair of second alignment marks m 2 provided on the TCP 9 are provided on the substrate W. The pair of first alignment marks m1 is positioned in the X direction and the θ direction.

  That is, as shown in FIG. 4, the straight line connecting the pair of first alignment marks m1 and the straight line connecting the pair of second alignment marks m2 are parallel to each other, and each pair of the first alignments facing each other. The mark m1 and the second alignment mark m2 are positioned so as to have the same X coordinate.

  Next, the TCP 9 is driven along the Y direction to a position where the center of the second alignment mark m2 coincides with the center of the first alignment mark m1. If the TCP 9 is driven in the Y direction based on the Y coordinate of the first alignment mark m1 and the Y coordinate of the second alignment mark m2 calculated in advance, the TCP 9 is captured by the pair of imaging cameras 14A and 14B at that time. The both ends of the plurality of second terminals T2 provided in the image are imaged.

  The imaging signals of the pair of imaging cameras 14A and 14B are A / D converted by the image processing unit 15 and then positioned by the arithmetic processing unit 16 at both ends in the width direction positioned in the pair of visual fields S1 and S2 shown in FIG. The X coordinates of the outer edges E1, E2 of the pair of second terminals T2 are calculated, and the X-direction center coordinates X2 of the plurality of second terminals T2 are obtained from the X coordinates of the outer edges E1, E2.

  At this time, the second terminal T2 of the TCP 9 has only one end overlapped with the first terminal T1 of the substrate W in the visual fields S1 and S2 of the pair of imaging cameras 14A and 14B, and the other end does not overlap. Thus, the X coordinates of the outer edges E1 and E2 of the pair of second terminals T2 can be accurately obtained from the image of the non-overlapping portion, and the center coordinate X2 can be calculated from these X coordinates.

  At this time, the first alignment mark m1 on the substrate W and the second alignment mark m2 on the TCP 9 overlap in the vertical direction. For this reason, even if the image of that portion is binarized by A / D conversion, the entire image becomes a black image. Therefore, the centers of the first alignment mark m1 and the second alignment mark m2 are precisely matched. It is difficult to determine whether or not

  Next, the central coordinate X1 in the X direction of the pair of alignment marks m1 and the central coordinate X2 in the X direction of the plurality of second terminals T2 are compared by the arithmetic processing unit 16 provided in the control device 6. The pair of center coordinates X1 and X2 is shifted from the X direction when the mounting tool 21 is driven precisely by the X, Y, θ, and Z drive source 23 when the TCP 9 is driven in the Y direction. Since it does not occur, the center coordinates X1 and X2 coincide with each other precisely.

  In that case, since the plurality of first terminals T1 provided on the substrate W and the plurality of second terminals T2 provided on the TCP 9 coincide with each other in the X direction, the mounting tool 21 is lowered at that position. Driven in the direction, the TCP 9 is mounted on the upper surface of one side of the substrate W.

  When the mounting tool 21 is not precisely driven in the Y direction, the first center coordinates X1 in the X direction of the pair of alignment marks m1 and the second center coordinates X2 in the X direction of the plurality of second terminals T2 No longer match. In that case, the mounting tool 21 is driven in the X direction in accordance with the amount of deviation between the first center coordinate X1 and the second center coordinate X2.

  If the TCP 9 is driven in the X direction in accordance with the amount of deviation between the center coordinates X1 and X2, the opposite ends of the second terminal T2 in the arrangement direction are imaged again by the pair of imaging cameras 14A and 14B, and the positions are located at both ends of the arrangement direction. The second center coordinate X2 is calculated from the X coordinates of the outer edges E1 and E2 of the pair of second terminals T2, and the first center calculated from the second center coordinate X2 and the pair of first alignment marks m1. The comparison of the X coordinate of the center coordinate X1 is repeated, and positioning of the TCP 9 is repeated until the predetermined allowable range is reached.

When the amount of deviation in the X direction between the second center coordinate X2 of the TCP 9 and the first center coordinate X1 of the pair of first alignment marks m1 of the substrate W falls within the allowable range, the TCP 9 is lowered. Then, it may be mounted on the upper surface of one side of the substrate W.
Note that the correction of the shift amount between the first center coordinate X1 and the second center coordinate X2 may be performed once instead of being performed a plurality of times.

  As described above, after the substrate W and the TCP 9 are positioned with respect to the X direction and the θ direction, before the TCP 9 is driven in the Y direction and mounted on the substrate W, a plurality of second terminals T2 provided on the TCP 9 are arranged. The center coordinate X2 in the arrangement direction is calculated based on the imaging of the pair of imaging cameras 14A and 14B, the center coordinate X2 is compared with the center coordinate X1 of the pair of first alignment marks m1 on the substrate W, and their centers are calculated. The TCP 9 is mounted on the substrate W after the position of the TCP 9 is corrected with respect to the X direction so that the coordinates X1 and X2 coincide.

  Therefore, the second terminal T2 of the TCP 9 and the first terminal T1 of the substrate W can be precisely positioned with respect to the arrangement direction of the terminals T1 and T2. Even if the arrangement density is narrowed, the TCP 9 can be mounted on the substrate W without causing poor contact between the terminals T1 and T2.

  When the mounting tool 21 is driven in the Y direction, the TCP 9 may be displaced with respect to the substrate W not only in the X direction but also in the Y direction. However, since the plurality of first and second terminals T1 and T2 provided on the substrate W and the TCP 9 are provided at predetermined intervals along the X direction, even if a shift occurs in the Y direction, the plurality of first and second terminals T1 and T2 are provided. The first terminal T1 and the second terminal T2 do not cause poor contact. Therefore, the deviation in the Y direction hardly affects the mounting accuracy of the TCP 9.

  When the TCP 9 is mounted on the substrate W, the TCP 9 is driven and positioned in the X, Y, and θ directions with respect to the positioned substrate W, and then is further driven in the Z direction for mounting. When the substrate W is driven in the X, Y, Z, and θ directions instead of the TCP 9, the substrate W is thin and large, and therefore shake occurs with the driving.

  Therefore, since it becomes impossible to perform imaging by the pair of imaging cameras 14A and 14B and mounting of the TCP 9 until the shake of the substrate W is settled, the tact time is increased correspondingly and productivity is reduced. There is.

  On the other hand, in this embodiment, as described above, the TCP 9 that is sufficiently small with respect to the substrate W is driven in the X, Y, and Z directions to be positioned with respect to the substrate W. Therefore, the TCP 9 is unlikely to sway like the substrate W, and even if the swaying occurs, the TCP 9 is settled in a short time, so that productivity can be improved as compared with the case where the substrate W is driven and positioned. .

  In the above embodiment, when the TCP and the substrate are aligned, the TCP is driven in the X, Y, Z, and θ directions with respect to the pre-positioned substrate, but the substrate is driven instead of the electronic component. In short, the board and the electronic component may be driven relative to the X, Y, Z, and θ directions to position and mount them.

BRIEF DESCRIPTION OF THE DRAWINGS The schematic block diagram of the mounting apparatus which shows one embodiment of this invention. The front view of the backup table provided with the backup tool. The block diagram of a control system. Explanatory drawing which looked at a part of board | substrate positioned in X direction and (theta) direction, and TCP from the lower side. Explanatory drawing which looked at the state which, after positioning a board | substrate and TCP in the X direction and (theta) direction, driving and positioning TCP in the Y direction from the lower side.

Explanation of symbols

  2 ... X table, 4 ... Y table, 6 ... control device, 8 ... backup tool, 9 ... TCP, 14A, 14B ... imaging camera (imaging means), 15 ... image processing unit, 16 ... calculation processing unit, 17 ... drive Output unit 21 ... Mounting tool 22 ... Suction nozzle 23 ... X / Y / Z / [theta] drive source, W ... Substrate, T1, T2 ... Terminal.

Claims (3)

A plurality of second terminals provided at the same interval as the first terminal are aligned with the plurality of first terminals provided at predetermined intervals on the side of the substrate, and the substrate is aligned with the second terminal. A mounting device for mounting electronic components,
Corresponding to a pair of first alignment marks provided on the outside of the board in the arrangement direction of the first terminals and the first alignment marks on the outside in the arrangement direction of the second terminals of the electronic component. A pair of imaging means for simultaneously imaging one and the other of the pair of second alignment marks provided at intervals in the same field of view;
From the first and second alignment marks imaged by the imaging means, the relative position between the substrate and the electronic component and the first central coordinate of the arrangement direction center of the pair of first alignment marks on the substrate are obtained. A calculating means for calculating;
Based on the relative position of the substrate and the electronic component calculated by the calculating means, the pair of the first alignment mark and the second alignment mark are positioned relative to each other so that the pair of the first alignment mark and the second alignment mark overlap each other. Comprising driving means for matching,
When the substrate and the electronic component are relatively aligned by the driving means,
The imaging means images the terminals at both ends in the arrangement direction of the plurality of second terminals provided in the electronic component,
The calculation means calculates a second center coordinate of the arrangement direction center of the plurality of second terminals based on the imaging,
Based on the calculation, the driving means relatively positions the substrate and the electronic component so that the first center coordinate and the second center coordinate are located on the same straight line orthogonal to the arrangement direction of the terminals. An electronic component mounting apparatus characterized by:   2. The electronic component mounting apparatus according to claim 1, wherein the driving means drives the electronic component to position the electronic component relative to the substrate. A plurality of second terminals provided at the same interval as the first terminal are aligned with the plurality of first terminals provided at predetermined intervals on the side of the substrate, and the substrate is aligned with the second terminal. A mounting method for mounting electronic components,
Corresponding to a pair of first alignment marks provided on the outside of the board in the arrangement direction of the first terminals and the first alignment marks on the outside in the arrangement direction of the second terminals of the electronic component. Imaging one and the other of each of a pair of second alignment marks provided at intervals in the same field of view simultaneously;
Calculating a relative position between the substrate and the electronic component and a first center coordinate of a placement direction center of the pair of first alignment marks on the substrate from the imaged first and second alignment marks; ,
Aligning the substrate and the electronic component such that the first alignment mark and the second alignment mark overlap based on the calculation of the relative position of the substrate and the electronic component;
After aligning the substrate and the electronic component, the terminals at both ends in the arrangement direction of the plurality of second terminals provided on the electronic component are imaged, and the center of the arrangement direction of the second terminal is based on the imaging. Calculating a second center coordinate;
A step of relatively positioning the substrate and the electronic component such that the calculated second center coordinate and the first center coordinate are located on the same straight line perpendicular to the arrangement direction of the terminals. An electronic component mounting method characterized by the above.

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