JP2006237054A - Mounting tool and mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To stably mount an electronic device for surface mounting such as a chip-like semiconductor device on a flexible board which is thin and small-piece, and has weak strength with high positional accuracy. <P>SOLUTION: A mounting tool 100 is configured in such a way that a vertically moving pedestal 1 moves upward and abuts on a carrier 2 holding a plurality of flexible boards 4 detachably so as to be juxtaposed, the carrier 2 abuts on a fixed pressing plate 3 and is stacked thereon, the rear surface of a part mounting portion 41 of each of the flexible boards 4 positioned on each of suction holes 21 of the carrier 2 is placed on each of gaskets 12 covering each of gas discharging holes 11 of the pedestal 1, and the front surface of the part mounting portion 41 is supported at its peripheral edge by a mounting window 31 of the fixed pressing plate 3 and is exposed. Chip-like mounting parts 5 are each mounted on each of the flexible boards 4 by using the mounting tool 100. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a mounting jig and a mounting method, and more particularly, to a mounting jig and a mounting method capable of stably mounting an electronic component such as a chip-shaped semiconductor device on a small piece of a flexible substrate.

  Flexible flexible printed boards (hereinafter referred to as “flexible substrates”) are widely used as substrates suitable for high-density mounting of electronic components, such as downsizing of electronic devices and chip-like semiconductor devices associated therewith. Yes. In particular, since it can be appropriately bent and embedded so as to sew a narrow space in the casing of the electronic device, it is an indispensable member for miniaturization of portable and portable electronic devices.

  By the way, chip components made for miniaturization are difficult to align because they are small when mounted on a printed circuit board or the like. When mounting a chip-like semiconductor device or the like, a printed circuit board is generally placed on a carrier and conveyed to a mounting line. When the printed circuit board is small, a plurality of printed circuit boards are placed on the carrier and conveyed. At that time, a proposal has been made to improve the problem that the carrier is warped and the printed circuit board is not sufficiently positioned (see, for example, Patent Document 1).

  Here, since a plate-shaped carrier made of a stainless steel plate or the like is easily warped, the carrier on which a plurality of workpieces (small printed boards) are placed is sandwiched from above and below to stabilize the position and posture of the workpiece.

  In addition, a TAB method in which terminals are attached to a tape-like long flexible substrate in advance and the terminals are bonded to chip-like components such as semiconductor devices while the tapes are sequentially run is well known. . However, this bonding technique has been further advanced to make the tape itself a flexible substrate called a carrier tape, and then chip components are bonded on the flexible substrate (see, for example, Patent Document 2).

In the case of a tape shape in which such flexible substrates are connected to each other, if the perforations (feed holes) are provided on both sides of the tape, the flexible substrate itself can be transported as a carrier. Therefore, continuous running, intermittent running, etc. are free, and positioning can be controlled with high accuracy.
JP 2002-198380 A (see FIG. 1) JP-A-10-135278 (see FIG. 6)

  However, if the printed circuit board corresponding to the workpiece is thin and has no strength, and if it is small and strip-shaped, maintain a stable positioning and posture of the flexible circuit board before mounting electronic components on the mounting line. Conveying is cumbersome. For this reason, in the past, component mounting was relied on manual work, which was extremely inefficient.

  Even if a plate-like carrier is used, how to support the flexible substrate on the carrier is also troublesome. Further, when components are mounted on the flexible substrate, the carrier is deformed by heat or a load, and there is often a problem that the flatness of the component mounting portion cannot be ensured and normal mounting cannot be performed.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a mounting jig and a mounting method capable of accurately positioning and holding a thin strip-like flexible substrate and mounting a chip-shaped electronic component.

  The above-described problem is that, in claim 1, the base includes a base, a carrier, and a holding plate, and the base moves up and down to push up the carrier and the holding plate to overlap each other. A plurality of exhaust holes inserted in the thickness direction are arranged side by side, and the exhaust holes are covered with a gasket having a vent hole. When the carrier is overlaid on the base, A suction hole that communicates; and a fixing portion on which a flexible substrate having a component mounting portion aligned with the suction hole is detachably mounted at a central portion, and the pressing plate is layered on the carrier Then, it has a mounting window that communicates with the suction hole and sits above the base, and the carrier holding the flexible substrate is carried between the base and the carrier and pushed up to the base The flexible substrate is abutted against the holding plate and secured on the carrier. Together it is locked, the rear surface of the component mounting portion is located on the said gasket, mounting surface is solved by a mounting jig that is configured to expose from the mounting window.

  In other words, in order to stably mount chip-shaped components on a small, flexible, small-sized flexible substrate, a carrier is provided with a holding portion so that the flexible substrate is detachably attached and held. When the carrier is pushed up from below by the base and abuts against the holding plate seated above the base, the component mounting portion of the flexible board is exposed from the mounting window of the holding plate.

  In this way, the flexible substrate held on the carrier is securely clamped and positioned by the holding plate. As a result, the component mounting portion is also exposed with its periphery held between the mounting windows, so that stable component mounting is possible.

  Next, in claim 2, the exhaust hole is exhausted by exhaust means provided on the back surface of the base, and the back surface of the component mounting portion of the flexible substrate is vacuum-adsorbed on the gasket. It is solved by the mounting jig.

  In other words, the component mounting portion of the flexible substrate is clamped by the mounting window of the plate while suppressing the periphery. By the way, it communicates from the exhaust hole of the base to the suction hole of the carrier and the mounting window of the holding plate. Therefore, if the exhaust hole is evacuated from the back surface of the base, the back surface of the component mounting portion is vacuum-sucked by the gasket covering the exhaust hole, and the flatness is maintained more stably.

  Next, in claim 3, the gasket is projected from the base and solved by the mounting jig according to claim 1 configured such that the surface is exposed to the suction hole of the carrier.

  That is, the gasket covering the exhaust hole of the base is projected by the thickness of the carrier. When the base is raised to push up the carrier, the gasket is made flush with the upper surface of the suction hole.

  If it does so, the component mounting part of the flexible substrate which is thin, is easy to bend, and is hard to keep flat can be vacuum-adsorbed on a gasket, and flatness can be maintained.

  Next, in claim 4, the fixing part is solved by the mounting jig according to claim 1 configured to be made of a pressure-sensitive adhesive that can be attached and detached.

  That is, the flexible substrate is secured to the carrier and carried onto the base, and if the chip-like component is mounted on the component mounting portion, it is unloaded and detached from the carrier. For this reason, a pressure-sensitive adhesive having pressure-sensitive tackiness (adhesiveness) that can be easily attached / detached is used for the attaching part of the carrier.

  If pressure sensitive tackiness is adjusted by blending the main agent and the tackifier, it is weak to the characteristics of the bonded portion intended by the present invention, i.e., upward force in the peeling direction, but tends to move. It is possible to have a strong drag against horizontal forces.

Next, in claim 5, a mounting method using the mounting jig according to claim 1,
A first step of aligning the component mounting portion of the flexible substrate with the suction hole of the carrier and releasably attaching the flexible substrate to a fixing portion provided at a central portion of the carrier;
A second step of conveying the carrier above the base;
Next, a third step of aligning the gasket covering the exhaust hole with the component mounting portion through the suction hole to raise the base, hitting the carrier and moving upward,
Next, a fourth step of further raising the base, hitting the holding plate to expose the component mounting portion from the mounting window and pressing the flexible substrate attached to the carrier;
A fifth step of mounting an electronic component on the component mounting portion exposed from the mounting window; and the base is lowered to disengage the carrier from the holding plate and the base from the carrier. And a sixth step of detaching the flexible substrate from the carrier.

  That is, in the first step, the flexible substrate is fixed so that the component mounting portion is aligned with the suction hole of the carrier, and in the second step, the carrier is transported above the base. In the third step, the base is raised so that the gasket abuts the back surface of the component mounting portion via the suction hole. In the fourth step, the base is further raised until the component mounting portion is exposed from the mounting window of the holding plate. In the fifth step, the flexible substrate fixed to the carrier is sandwiched between the holding plates, and the electronic component is mounted on the component mounting portion exposed from the mounting window.

  Further, in the sixth step, the base is lowered to disengage the carrier from the holding plate, and then the base is disengaged from the carrier. Then, when the flexible substrate on which the mounted component is mounted is detached from the carrier fixing portion, a series of steps for mounting the component is completed.

  Next, in claim 6, after the third step or the fourth step, the component mounting portion of the flexible substrate, which is exhausted from the exhaust hole by the exhaust means and is fixed on the carrier, is attached to the gasket. The mounting method according to claim 5, wherein the vacuum suction is performed and the vacuum suction is released after the sixth step.

  That is, when the base rises and abuts on the carrier and further abuts on the holding plate, the exhaust hole of the base communicates with the suction hole of the carrier via the gasket. Accordingly, when vacuum exhaust is performed from the exhaust hole by the exhaust means, the back surface of the component mounting portion of the flexible substrate held on the carrier is vacuum-sucked on the gasket, and the flatness can be maintained. The step of vacuum-sucking the component mounting portion is the same as that of the fourth step in which the base is further raised and the carrier is brought into contact with the holding plate even after the third step in which the base is raised and brought into contact with the carrier. It may be later. In short, it may be performed before electronic components are mounted on the component mounting portion exposed from the mounting window.

  According to the present invention, a thin electronic component for surface mounting such as a semiconductor device is stably mounted on a component mounting portion of a small-sized flexible board that is thin and does not have strength and is easily bent and warped. Can be mounted on. Therefore, it has a great effect on the work efficiency and mounting reliability in the conventional manual component mounting process.

Reference numerals and names in the figure are: 1 is a base, 11 is an exhaust hole, 12 is a gasket, 13 is an adsorption hole, 2 is a carrier, 21 is a suction hole, 22 is a fixing portion, 3 is a holding plate, and 31 is a mounting window 4 is a flexible substrate, 41 is a component mounting portion, 42 is a terminal portion, 5 is a mounting component, 6 is an elevating means, and 100 is a mounting jig.
[First embodiment]
1 is an exploded perspective view of the mounting jig of the present invention, FIG. 2 is a partially cutaway perspective view after the operation of the mounting jig of the present invention, and FIG. 3 is a partially cutaway perspective view of the main part of the base.

  In FIG. 1, main components of the mounting jig 100 are a base 1 that supports the entire mounting jig 100, a carrier 2 that holds and conveys the flexible substrate 4, and a component mounting portion 41 of the flexible substrate 4. The pressing plate 3 is supported by pressing down. The base 1, the carrier 2, and the holding plate 3 are layered by three members when the base 1 is raised, and function as an integrated structure.

  The base 1 is configured to move up and down, and is made of a metal plate having a thickness of several millimeters. For example, an aluminum plate or the like may be used. The base 1 is provided with a plurality of exhaust holes 11 having a diameter of several millimeters, for example, which are inserted in the thickness direction. The exhaust hole 11 is inserted through the suction hole 21 of the carrier 2 and the mounting window 31 of the restraining plate 3 that are layered on the base 1. The interval between the positions of the exhaust holes 11 is determined by the width when the flexible substrates 4 are arranged side by side with a margin.

  The exhaust hole 11 is covered with a gasket 12. The gasket 12 is made of a material having both heat resistance and resilience, such as silicon rubber and fluorine rubber, and protrudes from the base 1 so as to be loosely fitted into the suction holes 21 of the carrier 2 to be stacked. .

  In FIG. 1, it is illustrated that the gasket 12 is fitted in a position where the exhaust hole 11 of the base 1 is located, but it is not essential to sit down.

  An adsorption hole 13 communicating with the exhaust hole 11 is provided in the central portion of the gasket 12 so that the exhaust passes. If a resilient foam material with air permeability is used for the gasket 12, the suction holes 13 may be omitted.

  The amount of protrusion of the gasket 12 from the base 1 is even more preferable if the surface of the gasket 12 is flush with the carrier 2 at a height corresponding to the thickness of the carrier 2, that is, the depth of the suction hole 21. . Further, the gasket 12 is sized so that the component mounting portion 41 of the flexible substrate 4 is sufficiently placed, like the suction hole 21.

  The carrier 2 carries the flexible substrate 4 on it. When the carrier 2 is transferred by a moving means (not shown), the flexible substrate 4 needs to be strong enough to withstand warping and bending so as not to cause a problem. For example, the carrier 2 is made of a stainless steel plate having a thickness of several millimeters.

  The carrier 2 is provided with a suction hole 21 at a position corresponding to the exhaust hole 11 of the base 1. Further, in the lateral direction of the central portion of the carrier 2, for example, the adhering portion 22 is provided in the form of a continuous band or a spot at a position corresponding to the intermittent suction hole 21.

  The adhering portion 22 is temporarily mounted during a series of mounting steps until the mounting of the mounting components 5 on the plurality of flexible boards 4 is completed in a state where the component mounting portion 41 is aligned with the suction hole 21 on the carrier 2. In order to temporarily place it, it is designed to be releasably attached.

  In other words, the adhering portion 22 fixes, for example, a pressure-sensitive adhesive material having a pressure-sensitive tackiness (adhesiveness) by directly applying the pressure-sensitive adhesive material to a coating film or impregnating a base material such as a nonwoven fabric. Or can be configured.

  The pressure-sensitive tackiness sticks once when pressed, and the adherend is less likely to slip laterally. However, it is a property that can be easily peeled off when a peeling force that peels upward is applied. If the adhesive surface is not covered or soiled by adhesive such as foreign matter, it can be used repeatedly a plurality of times. Therefore, this is a convenient property for temporarily attaching the flexible substrate 4 to the carrier 2 in the present invention.

  This pressure-sensitive adhesive having tackiness can be constituted by mixing a tackifier such as an alkylphenol resin with a main ingredient such as polyisobutylene. If the amount of tackifier added is adjusted, a so-called peeling test is performed. The strength of tackiness that does not damage the flexible substrate 4 when it is peeled off, that is, the balance between adhesiveness and peeling can be adjusted as appropriate.

  When the base 1 rises as indicated by an arrow 81, the carrier 2 collides with the base 1, follows the base 1, and moves up as indicated by an arrow 82.

  When viewed from the base 1, the holding plate 3 is fixed at a predetermined gap, that is, a position having a margin enough to carry the carrier 2. The holding plate 3 is for the carrier 2 rising in cooperation with the rising movement of the base 1 to be abutted, and the flexible substrate 4 fixed to the carrier 2 is pressed and held. . Accordingly, a certain strength that can withstand the collision is required, and for example, it is made of a stainless steel plate having a thickness of several mm.

  A mounting window 31 is formed in the holding plate 3. This mounting window 31 communicates with the exhaust hole 11 and exposes the component mounting part 41 of the flexible substrate 4 placed on the gasket 12 inserted through the suction hole 21.

  The mounting window 31 is for mounting the mounting component 5 on the component mounting portion 41 exposed from the mounting window 31. Therefore, the mounting window 31 has both a size that allows the mounting component 5 to be taken in and out and a mounting operation sufficiently, and a size that supports the periphery of the component mounting portion 41 with good positioning.

  Thus, the base 1 rises as shown by the arrow 81 and collides with the carrier 2, and further, the base 1 rises as shown by the arrow 82 in cooperation with pushing up the carrier 2 to raise the carrier 2 collides with the restraining plate 3 to form an integral structure.

  FIG. 2 shows a state in the mounting jig 100 when the base 1 finishes rising in the direction of the arrow 81, and the base 1, the carrier 2, and the holding plate 3 collide with each other and overlap each other. Here, various states are shown so that the correlation between the three parties can be understood well.

  The exhaust hole 11 provided in the base 1 communicates with the suction hole 13 of the gasket 12, and the gasket 12 covering the exhaust hole 11 of the base 1 protrudes and fits into the suction hole 21 of the carrier 2. In a state where the carrier 2 does not have the flexible substrate 4, the gasket 12 is exposed from the mounting window 31-1. Further, in a state before the mounting component 5 is mounted, the component mounting portion 41 of the flexible substrate 4 is exposed from the mounting window 31-2. Furthermore, in the state after mounting the mounting component 5, the mounting component 5 mounted on the mounting window 31-3 can be seen.

  In a normal mounting operation in the mounting jig 100 according to the present invention, as shown in the state of the mounting window 31-2, the flexible substrate 4 is fixed to the fixing portion 22 of the carrier 2, and the component mounting portion 41 is mounted. Is supported and positioned by the window frame of the mounting window 31. If the mounting operation is performed in this state, stable component mounting is possible.

  In FIG. 3, the base 1 is raised in the direction of an arrow 81 by the elevating means 6 or lowered in the direction of an arrow 83. As this elevating / lowering means 6, for example, a cylinder / piston using a fluid or a screw utilizing a motion is used although not shown.

Further, the exhaust unit 7 collects a plurality of exhaust holes 11 by an exhaust pipe 71 and performs vacuum exhaust by a vacuum exhaust system (not shown). It is not always necessary to exhaust the air, and control is performed so that the ascending operation of the base 1 starts and collides with the carrier, and starts when the component mounting portion of the flexible substrate is placed on the gasket 12. Of course, the control is performed so that the exhaust is stopped immediately after the mounting of the mounted component on the component mounting portion is completed.
[Second Embodiment]
4 to 6 show steps (parts 1 to 3) of the mounting method of the present invention, and the reference numerals and names in the drawings are the same as those in the first embodiment.

  FIG. 4A shows a first step of securing the flexible substrate 4 to the carrier 2 of FIG. 4B in the step (No. 1) of the mounting method of the present invention shown in FIG. The flexible substrate 4 is placed one by one so that the component mounting portion 41 closes each of the plurality of suction holes 21 formed in the carrier 2.

  The first step of securing the flexible substrate 4 can be easily automated by placing the carrier 2 at another place and not by manual work. Thus, the flexible substrate 4 is held in pressure contact with the holding portion 22 on the carrier 2. In the second step of carrying in the carrier 2 with the flexible substrate attached, the carrier 2 with the flexible substrate attached as shown in FIG. 4C is not shown, but it is held by a conveying means such as a robot arm. FIG. 4D is a step of carrying in on the base 1 shown in FIG. Although not shown here, a holding plate is fixed above the base 1 with a predetermined gap, and the carrier 2 with the flexible substrate attached thereto is carried into this gap.

  In FIG. 4D, the base 1 has an exhaust hole 11 at a position corresponding to the suction hole 21 of the carrier 2, and protrudes by the thickness of the carrier 2 so as to cover the exhaust hole 11. A gasket 12 is provided. The gasket 12 is provided with an adsorption hole 13, and the adsorption hole 13 communicates with the exhaust hole 11.

  In the third step in which the base 1 is raised in the direction of the arrow 81 by the lifting means (not shown) and abuts on the carrier 2 with the flexible substrate attached, as shown in FIG. The carrier 2 with the flexible substrate attached is placed on the table 1. Since the protruding gasket 12 is fitted into the suction hole 21 of the carrier 2, the back surface of the component mounting portion 41 of the flexible substrate 4 is placed on the gasket 12.

  In FIG. 5 (step 2) of the mounting method of the present invention, FIG. 5 (E) is a reproduction of FIG. 4 (E), and the carrier 2 with the flexible substrate attached is placed on the base 1 and cooperated. It shows a state of moving and rising in the direction of arrow 82.

  FIG. 5F shows the holding plate 3, which is fixedly provided above the base 1 with a predetermined gap. The holding plate 3 is provided with a plurality of mounting windows 31 so that the component mounting portion 41 of the flexible substrate 4 secured to the carrier 2 is exposed.

  When the base 1 rises in cooperation with the carrier 2 with the flexible substrate attached, the carrier 2 abuts against the holding plate 3 and stops with a predetermined pressure, and the fourth step ends.

  FIG. 5G shows a mounting jig 100 in which the base 1, the carrier 2, and the holding plate 3 are stacked. The holding plate 3 holds the flexible substrate 4 secured to the carrier 2 and presses and holds the periphery of the component mounting portion 41 with the window frame of the mounting window 31. As a result, the component mounting portion 41 is exposed from the mounting window 31 with high positioning accuracy.

  FIG. 5 (H) shows the mounting component 5, and in the fifth step of mounting the mounting component 5 on the flexible substrate 4, the component exposed from the mounting window 31 of the holding plate 3 shown in FIG. 5 (G). The mounting component 5 is mounted at a predetermined position of the mounting portion 41. That is, as shown in FIG. 5I, for example, a mounting component 5 such as a chip-shaped semiconductor device or a surface mounting chip component is mounted by mounting means such as a chip mounter.

  FIG. 6 (I) is a reproduction of FIG. 5 (I), and after the mounting of the mounting component 5 on the flexible substrate 4 is completed, the base 1 and the carrier 2 are lowered in the direction of the arrow 83 in cooperation. Then, the holding plate 3 shown in FIG. 6 (J) is disengaged from the carrier 2. Further, as shown in FIG. 6K, when the base 1 is lowered in the direction of the arrow 84, the carrier 2 on which the flexible substrate is mounted on which the mounting component 5 is mounted is disengaged from the base 1.

  Thereafter, the carrier 2 is unloaded by a conveying means (not shown), and the flexible substrate 4 on which the mounting component 5 is mounted is sequentially peeled off from the holding portion 22 in the direction of the arrow 85 as shown in FIG. As shown in FIG. 6 (M), the flexible substrate 4 on which the mounting component 5 is mounted on the predetermined component mounting portion 41 is obtained.

  In order to detach the flexible substrate 4 from the carrier 2, if the terminal portion 42 in the direction opposite to the component mounting portion 41 of the flexible substrate 4 is peeled off, it can be easily peeled off from the attachment portion 22. The difficulty of this detachment work can be adjusted by the mixing ratio of the main component of the pressure-sensitive adhesive material and the tackifier that is provided in the holding part 22. Therefore, automation is possible by adjusting so that it can be easily peeled off by inserting, grasping and lifting a jig for peeling under the terminal portion 42.

  On the other hand, in order to more reliably place and fix the component mounting portion 41 of the flexible substrate 4 on the gasket 12 of the base 1, as shown in FIG. The component mounting portion 41 is vacuum-adsorbed on the gasket 12 by evacuating from the vacuum 11.

  This exhaust operation need not always be performed. That is, the base 1 raised in the third step collides with the carrier 2, the gasket 12 is fitted into the suction hole 21, and the exhaust is exhausted at the timing when the back surface of the component mounting portion 41 contacts the surface of the gasket 12. Start. Alternatively, in the fourth step, even if the carrier 2 rises in cooperation with the base 1 and abuts against the restraining plate 3 to start exhausting at the timing when the window frame of the mounting window 31 presses the component mounting portion 41. Good. The timing of stopping the exhaust operation is after the mounting of the mounting component 5 on the component mounting portion 41 is completed in the fifth step. The start / stop of such an exhaust operation can be easily automated using a sensor or the like.

  For mounting components on the component mounting part, if the material of the gasket that supports the component mounting part from the back side is selected, various bonding methods such as thermocompression bonding, ultrasonic bonding, and soldering can be used, and various modifications are possible. is there.

  In addition, here, one component is mounted on one flexible substrate, but the present invention is not limited to this, and a plurality of components can be mounted, and various modifications are possible.

  Furthermore, here, the attachment of the strip-like flexible substrate in parallel on the carrier is illustrated, but various arrangements such as the attachment portion and the suction hole are possible depending on the shape of the flexible substrate and the positional relationship of the component mounting portion. Can be modified.

(Additional remark 1) It has a base, a carrier, and a control board,
The base moves up and down and pushes up the carrier and the holding plate to overlap each other. A plurality of exhaust holes inserted in the thickness direction are arranged in parallel, and the exhaust holes pass through the base. Covered with a gasket with pores,
The carrier includes a suction hole that communicates with the exhaust hole when layered on the base, and a fixing portion on which a flexible substrate having a component mounting portion aligned with the suction hole is detachably mounted at a central portion. Have
The restraining plate is seated above the base with a mounting window that communicates with the suction holes when overlaid on the carrier.
When the carrier holding the flexible substrate is carried between the base and the carrier and pushed up to the base, it abuts the holding plate, and the flexible substrate fixed on the carrier A mounting jig, wherein the mounting jig is characterized in that the component mounting portion is positioned on the gasket, and the component mounting portion is exposed from the mounting window.

(Appendix 2) The exhaust hole is exhausted by exhaust means provided on the back surface of the base,
The mounting jig according to claim 1, wherein the back surface of the component mounting portion of the flexible substrate is vacuum-sucked on the gasket.

(Supplementary note 3) The mounting jig according to supplementary note 1, wherein the gasket protrudes from the base and the surface is exposed to the suction hole of the carrier.

(Supplementary note 4) The mounting jig according to supplementary note 1, wherein the fixing portion is made of a pressure-sensitive adhesive that can be freely attached and detached.

(Supplementary note 5) The mounting jig according to supplementary note 4, wherein the pressure-sensitive adhesive has an adjustable tackiness according to a mixing ratio of the main agent and the tackifier.

(Appendix 6) A mounting method using the mounting jig described in Appendix 1,
A first step of aligning the component mounting portion of the flexible substrate with the suction hole of the carrier and releasably attaching the flexible substrate to a retaining portion provided at a central portion of the carrier;
A second step of conveying the carrier above the base;
Next, a third step of aligning the gasket covering the exhaust hole with the component mounting portion via the suction hole to raise the base and move it together with the carrier,
Next, a fourth step of further raising the base and hitting against the holding plate to expose the component mounting portion from the mounting window and hold the flexible substrate secured to the carrier;
A fifth step of mounting an electronic component on the component mounting portion exposed from the mounting window.

(Supplementary Note 7) After the third step or the fourth step, the component mounting portion of the flexible substrate, which is exhausted from the exhaust hole by the exhaust means and is fixed on the carrier, is vacuum-adsorbed to the gasket. The mounting method according to appendix 6, wherein the vacuum suction is released after the sixth step.

Industrial applicability

  The present invention is applied to an operation of stably mounting an electronic device for surface mounting such as a chip-like semiconductor device on a component mounting portion of a small flexible substrate, with a thin and weak strength, and with high positioning accuracy. effective.

It is a disassembled perspective view of the mounting jig of this invention. It is a partially cutaway perspective view after the operation of the mounting jig of the present invention. It is a partially cutaway perspective view of the principal part of a base. It is the process (the 1) of the mounting method of this invention. It is the process (the 2) of the mounting method of this invention. It is the process (the 3) of the mounting method of this invention.

Explanation of symbols

1 Base 11 Exhaust Hole 12 Gasket 13 Adsorption Hole 2 Carrier
21 Suction hole 22 Adhering part 3 Holding plate 31 Mounting window 4 Flexible substrate 41 Component mounting part 42 Terminal part 5 Mounting part 6 Lifting means 7 Exhaust means 71 Exhaust pipes 81, 82, 83, 84, 85 Arrow 100 Mounting jig

Claims (5)

A base, a carrier, and a holding plate;
The base moves up and down and pushes up the carrier and the holding plate to overlap each other. A plurality of exhaust holes inserted in the thickness direction are arranged in parallel, and the exhaust holes pass through the base. Covered with a gasket with pores,
The carrier includes a suction hole that communicates with the exhaust hole when layered on the base, and a fixing portion on which a flexible substrate having a component mounting portion aligned with the suction hole is detachably mounted at a central portion. Have
The restraining plate is seated above the base with a mounting window that communicates with the suction holes when overlaid on the carrier.
When the carrier holding the flexible substrate is carried between the base and the carrier and pushed up to the base, it abuts the holding plate, and the flexible substrate fixed on the carrier A mounting jig, wherein the mounting jig is pressed, the back surface of the component mounting portion is positioned on the gasket, and the mounting surface is exposed from the mounting window. The exhaust hole is exhausted by exhaust means provided on the back surface of the base,
The mounting jig according to claim 1, wherein the back surface of the component mounting portion of the flexible substrate is vacuum-sucked on the gasket. The mounting jig according to claim 1, wherein the gasket protrudes from the base, and the surface is exposed flush with the suction hole of the carrier. A mounting method using the mounting jig according to claim 1,
A first step of aligning the component mounting portion of the flexible substrate with the suction hole of the carrier and releasably attaching the flexible substrate to a retaining portion provided at a central portion of the carrier;
A second step of conveying the carrier above the base;
Next, a third step of aligning the gasket covering the exhaust hole with the component mounting portion via the suction hole to raise the base and move it together with the carrier,
Next, a fourth step of further raising the base and hitting against the holding plate to expose the component mounting portion from the mounting window and hold the flexible substrate secured to the carrier;
A fifth step of mounting an electronic component on the component mounting portion exposed from the mounting window. After the third step or the fourth step, air is exhausted from the exhaust hole by the exhaust means, and the component mounting portion of the flexible substrate held on the carrier is vacuum-adsorbed to the gasket, and the sixth step is performed. The mounting method according to claim 5, wherein the vacuum suction is released after the step.

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