KR101454172B1 - Semiconducter Substrate Protect Film Auto Peeler - Google Patents

Semiconducter Substrate Protect Film Auto Peeler Download PDF

Info

Publication number
KR101454172B1
KR101454172B1 KR1020140051182A KR20140051182A KR101454172B1 KR 101454172 B1 KR101454172 B1 KR 101454172B1 KR 1020140051182 A KR1020140051182 A KR 1020140051182A KR 20140051182 A KR20140051182 A KR 20140051182A KR 101454172 B1 KR101454172 B1 KR 101454172B1
Authority
KR
South Korea
Prior art keywords
substrate
film
unit
scratch
tape
Prior art date
Application number
KR1020140051182A
Other languages
Korean (ko)
Inventor
황선오
Original Assignee
주식회사 코엠에스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 코엠에스 filed Critical 주식회사 코엠에스
Priority to KR1020140051182A priority Critical patent/KR101454172B1/en
Priority to PCT/KR2014/005234 priority patent/WO2015167070A1/en
Application granted granted Critical
Publication of KR101454172B1 publication Critical patent/KR101454172B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

An upright-type releasing method of a protective film for a semiconductor substrate includes: an adsorbing and clamping step (S10) of adsorbing a substrate (S) by a vacuum adsorption plate (11) and clamping an edge of the substrate (S) by a clamper (21) if the substrate (S) having a film attached thereto is loaded onto a vacuum adsorption plate (1); a unit forwarding step (S20) of allowing a unit transfer shuttle (30) having a scratch forming unit (40) and a tapping unit (50) mounted thereon to move forward; a scratch forming step (S30) forming a scratch, helping release the film, on an edge of the film (F) attached to the substrate (S) by the scratch forming unit (40); a preliminary film releasing step (S40) of delaminating the edge of the film (F) from the substrate by a tapping unit (50) as the tapping unit (50) tapes the scratch in the substrate (S) and moves backwards; a film releasing step (S50) of allowing the tapping unit (50) to release the film from the substrate (S), which is fixedly positioned, while moving down along a vertical frame (35) of the unit transfer shuttle (30); and a returning step (S60) of allowing the tapping unit (30) to move up again allowing the unit transfer shuttle (40) to move backwards such that the tapping unit (30) and the unit transferring shuttle (40) returns to its initial positions.

Description

TECHNICAL FIELD [0001] The present invention relates to an upright type peeling method and an upright type peeling apparatus for a semiconductor substrate protective film,

The present invention relates to an upright peeling method and a peeling apparatus for a substrate protective film for semiconductor.

Generally, a printed circuit board (PCB) is a printed circuit board (PCB), which is formed by printing a circuit wiring necessary for a thin plate made of epoxy or phenol resin with a copper foil, Means a substrate capable of operating a circuit after power is applied, and has a conductive function, an insulating function, and a supporting function. Therefore, the design of the printed circuit board (PCB) is very important because it is directly related to the operation, performance, lifetime and reliability of the product. The printed circuit board (PCB) as described above is an electronic component that serves to connect various parts such as semiconductor, condenser, and resistance, and connects the parts. It is used as an electronic component from TV, VTR, audio, It is used in all electronic devices, from computers to mobile phones to satellites.

Meanwhile, a printed circuit board (PCB) includes a flexible printed circuit board (FPCB) and a rigid printed circuit board (RPCB) Unlike the conventional rigid printed circuit board (RPCB), which has a rigid board, the flexible printed circuit board (FPCB) is thin and flexible, so that demand is rapidly increasing due to multimedia and light weight shortening of electronic products. The flexible printed circuit board (FPCB) among the circuit boards (PCBs) is an electronic component developed to cope with the tendency to miniaturize and complicate electronic products, and has good workability, excellent heat resistance, rust resistance and chemical resistance, And it is strong against heat. In addition, the working time can be reduced during assembly work.

The printed circuit board (PCB) or the substrate for semiconductor manufacturing is protected by the protective film on the upper and lower surfaces of the substrate, . Therefore, in order to mount various components such as semiconductor, capacitor, and resistance on such a substrate, the protective film attached to the substrate surface must be removed.

As a conventional technique, there is a patent document No. 10-1119571 (patentee: COM, applicant). In the prior art, film peeling progresses in a state of lying on the substrate horizontally and the structure of the apparatus becomes larger, There are many problems.

The present invention provides an upright peeling method and a peeling apparatus for a substrate protective film for semiconductor which can reduce the size of the apparatus and reduce the transfer amount of the peeling apparatus by making it possible to miniaturize and compact the apparatus, .

The present invention relates to an upright type peeling method and a peeling apparatus for a substrate protective film for semiconductor which can accurately and completely peel a protective film of a substrate and can increase a working efficiency per hour while handling a substrate of 30 to 80 cm in size, .

When the substrate S on which the film is attached is loaded on the vacuum adsorption plate 10, the vacuum adsorption plate 11 adsorbs the substrate S and the clamper 21 clamps the edge of the substrate S Adsorption holding step (S10);

A unit advancing step S20 in which the unit transfer shuttle 30 on which the scratch forming unit 40 and the taping unit 50 are mounted advances;

A scratch forming step (S30) of forming a scratch on the side of the film (F) adhered to the substrate (S) by the scratch forming unit (40) to assist in delaminating the film;

A film preliminary peeling step (S40) in which the taping unit (50) tapes the scratches on the substrate (S) and then moves back to separate the side of the film (F) from the substrate;

A film peeling step (S50) of peeling the film from the fixed substrate (S) while the taping unit (50) descends on the vertical frame (35) of the unit transfer shuttle (30);

A returning step (S60) in which the taping unit (50) rises again and the unit transfer shuttle (40) is retracted and returns to the initial position;

The method of removing an upright film of a substrate protective film for semiconductor according to claim 1,

According to the present invention, there is provided an upright type peeling method and a peeling apparatus for a substrate protective film for semiconductor, which can reduce the size and size of the apparatus by reducing the transferring step of the substrate and the transferring amount of the peeling apparatus, .

In addition, according to the present invention, it is possible to accurately and completely peel a protective film of a substrate while improving a working efficiency per hour while handling a substrate of 30 to 80 cm in size, And a peeling apparatus are provided.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of an entire upright stripper of a substrate protective film for semiconductor according to an embodiment of the present invention; FIG.
FIG. 2 is a perspective view of an entire upright stripper of a substrate protective film for semiconductor according to an embodiment of the present invention. FIG.
3 (a) and (b) are views showing a vacuum adsorption portion and a clumping portion of an upright type peeling apparatus for a substrate protective film for semiconductor according to an embodiment of the present invention.
4 is a block diagram of a scratch-forming unit taping unit in an upright stripper of a substrate protective film for semiconductor according to an embodiment of the present invention.
5 is a flow chart of an upright removal method of a substrate protective film for semiconductor according to an embodiment of the present invention.
Fig. 6 is a view showing the substrate and the film bonded together according to the present invention. Fig.

Hereinafter, an upright peeling method and an upright peeling apparatus of a substrate protective film for semiconductor according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a perspective view of an entire upright peeling apparatus for a substrate protective film for semiconductor according to an embodiment of the present invention, FIG. 2 is an overall perspective view of an upright peeling apparatus for a substrate protective film for semiconductor according to an embodiment of the present invention, (a) and (b) are diagrams showing a vacuum adsorption part and a clipping part of an upright type peeling apparatus of a substrate protective film for semiconductor according to an embodiment of the present invention, and Fig. 4 And FIG. 5 is a flowchart of an upright removal method of a substrate protective film for semiconductor according to an embodiment of the present invention. Fig. 6 is a substrate and film bonding view of the object to be peeled off according to the present invention. Fig.

As shown in FIGS. 1 to 6, the upright peeling method of the substrate protective film for semiconductor according to an embodiment of the present invention is characterized in that the peeling step S10, the advancing step S20 and the flaw forming step S30 , A film preliminary peeling step (S40), a film peeling step (S50), and a returning step (S60). When the substrate S on which the film is adhered is loaded on the vacuum adsorption plate 10 in the adsorption holding step S10, the vacuum adsorption plate 11 adsorbs the substrate S and the clamper 21 adsorbs the substrate S, Clamp the edge of the wire.

In the unit advancing step S20, the unit transfer shuttle 30 on which the scratch forming unit 40 and the taping unit 50 are mounted advances. In the scratch forming step S30, the scratch forming unit 40 forms a scratch on the side of the film F adhered to the substrate S, which helps to peel off the film.

In the film preliminary peeling step (S40), the taping unit (50) is tapped on the substrate (S) and then moved backward to separate the side of the film (F) from the substrate. In the film peeling step (S50), the taping unit (50) descends on the vertical frame (35) of the unit transfer shuttle (30) to peel off the film from the fixed substrate (S). In the returning step S60, the taping unit 50 ascends again and the unit transfer shuttle 40 is retracted and returns to the initial position. As shown in the figure, the vacuum adsorption plate 10 adsorbs and fixes the substrate S such that a right-angled corner of the substrate S is located on the upper side.

As shown in FIGS. 1 to 6, in the upright type peeling method of the substrate protective film for semiconductor according to an embodiment of the present invention, in the unit advancing step (S20), the vacuum adsorption plate 11 is peeled And the unit transfer shuttle 30 is moved back and forth in a horizontal direction parallel to the bottom of the structure and at right angles to the vacuum adsorption plate 11. [ In the preliminary peeling step (S40), the scratch forming unit (40) forms a scratch on the right corner of the substrate (S). In the film peeling step S50 the vertical frame 35 of the unit transfer shuttle 30 is perpendicular to the direction of travel of the unit transfer shuttle 30 and remains upright from the bottom of the structure, And descends in the vertical direction parallel to the vacuum adsorption plate (11) on the vertical frame (35).

1 to 6, in the upright peeling method of the substrate protective film for semiconductor according to an embodiment of the present invention, in the preliminary peeling step (S40), the tape T is peeled from the film scratches The pressing roll 55 presses the supply roll 51 before the film peeling step S50 is performed to remove the film when peeling off the film. The tape T is fixed so as not to be released from the supply roll 51. [

1 to 6, an upright type peeling apparatus for a substrate protective film according to an embodiment of the present invention is an upright type peeling apparatus for a substrate protective film for a body, which comprises a main frame 1, A vacuum adsorption unit 10 for vacuum adsorbing a substrate on which a film is adhered by an adsorption hole 13 provided in the vacuum adsorption plate 11 when the substrate is loaded and a vacuum adsorption unit 10 for adsorbing the edge of the substrate adsorbed on the vacuum adsorption plate 11, A clamping unit 20 for clamping the workpiece W with a clamper 21 provided on the outer side of the vertical frame 35 and a vertical frame 35 mounted on the upright vertical frame 35 A unit transfer shuttle 30 to which the taping unit 50 is mounted and which is moved forward and backward on the horizontal rail 5 of the main frame 1 and the unit transfer shuttle 30 A scratch-forming unit 40 for forming a scratch on a right-angle corner of the substrate film while moving back and forth together . The scratch-forming unit 40 is mounted on the vertical frame 35 and tilted back and forth along with the unit transfer shuttle 30 to tear the scratched portion formed by the scratch-forming unit 40 and descend by the vertical frame 35, And a taping unit 50 for peeling off the substrate from the substrate.

1 to 6, in the upright type peeling apparatus of the substrate protective film for semiconductor according to the embodiment of the present invention, the unit transfer shuttle 30 is parallel to the bottom of the structure, and the vacuum adsorption plate 11 And the vertical frame 35 of the unit transfer shuttle 30 is perpendicular to the direction of travel of the unit transfer shuttle 30 and remains upright from the bottom of the structure, And the unit 50 descends in the vertical direction parallel to the vacuum adsorption plate 11 on the vertical frame 35.

1 to 6, in the upright type peeling apparatus for a substrate protective film for semiconductor according to an embodiment of the present invention, the clamping unit 20 includes a back plate (not shown) for supporting the vacuum adsorption plate 11 A radial cylinder 25 fixed to an outer edge of the radial piston 26 and a radial piston 26 reciprocating by the radial cylinder 25 and a radial piston 26 coupled to a distal end of the radial piston 26, A horizontal cylinder body 22 reciprocating in an outer radial direction in parallel with the horizontal cylinder body 22 and a horizontal piston reciprocating in the horizontal direction by the horizontal cylinder body 22, And a clamper 21 for clamping the side while reversing.

Here, when the radial cylinder 25 extends the radial cylinder body 22 in the outer radial direction through the radial piston 26, the horizontal cylinder body 22 is guided to the clamper 21 through the horizontal piston, To the front of the substrate. When the radial cylinder 25 further retracts the horizontal cylinder body 22 in the inner radial direction through the radial piston 26, the horizontal cylinder body 22 shrinks the horizontal piston, So as to clamp the substrate.

As shown in FIGS. 1 to 6, in the upright type peeling apparatus of the substrate protective film for semiconductor according to the embodiment of the present invention, the scratches mounted on the vertical steel plate 60, The forming unit 40 includes a knife for forming a scratch on the film while moving in a straight path, a rotor 41 for forming a scratch on the film while rotating on a knurled surface, Laser is preferable. The rotor 41 having a knurling surface is rotatably fixed to a mounting block 43 fixed to the lift plate 60.

As shown in FIGS. 1 to 6, in the upright type peeling apparatus for a substrate protective film for semiconductor according to an embodiment of the present invention, taping (not shown) mounted on a vertical steel plate 60 The unit 50 includes a supply roll 51 to which the main body of the tape T is rotatably mounted, a tape support 52 for supporting the opposite side of the peeled tape T from the adhesive surface, A drive recovery roll 53 for pulling the tape T past the tape support 52 and a drive roller 53 for moving the tape T released between the tape support 52 and the supply roll 51 and the drive recovery roll 53 And a guide roll (R) supporting the opposite side of the adhesive surface.

1 to 6, the taping unit 50 is further provided with a plurality of taping rolls 60 before the lifting plate 60 is lowered to peel off the film after the tape T adheres to the film scratches of the substrate, And a press gripping roll 55 for pressing and fixing the supply roll 51 so that the tape T is no longer released from the supply roll 51 when the film is peeled off. The drive recovery roll 53 causes the drive motor 54 to rotate forward and reverse.

1 to 6, in the upright type peeling apparatus for a substrate protective film for semiconductor according to an embodiment of the present invention, the press gripping roll 55 is mounted on the second auxiliary support 56 , The second auxiliary support 56 is lifted and lowered by a pneumatic cylinder and the drive recovery roll 53 is moved up and down by a preliminary peeling step in which the tape T is stuck to the film scratches of the substrate and then a part of the square- It is desirable to repeat the tape winding and unwinding.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but on the contrary, ≪ RTI ID = 0.0 > and / or < / RTI >

It is to be understood that the appended claims are intended to supplement the understanding of the invention and should not be construed as limiting the scope of the appended claims.

1: Mainframe
5: Horizontal rail
10: Vacuum adsorption part
11: Vacuum suction plate
17: back plate
20: clamping part
21: Clamper
22: Horizontal cylinder body
25: Radial cylinder
26: Radial piston
30: clamping part
35: vertical frame
40: flaw forming unit
50: taping unit

Claims (10)

When the substrate S on which the film is attached is loaded on the vacuum adsorption plate 10, the vacuum adsorption plate 11 adsorbs the substrate S and the clamper 21 clamps the edge of the substrate S Adsorption holding step (S10);
A unit advancing step S20 in which the unit transfer shuttle 30 on which the scratch forming unit 40 and the taping unit 50 are mounted advances;
A scratch forming step (S30) of forming a scratch on the side of the film (F) adhered to the substrate (S) by the scratch forming unit (40) to assist in delaminating the film;
A film preliminary peeling step (S40) in which the taping unit (50) tapes the scratches on the substrate (S) and then moves back to separate the side of the film (F) from the substrate;
A film peeling step (S50) of peeling the film from the fixed substrate (S) while the taping unit (50) descends on the vertical frame (35) of the unit transfer shuttle (30);
A returning step (S60) in which the taping unit (50) rises again and the unit transfer shuttle (40) is retracted and returns to the initial position;
The method of removing an upright film of a substrate protective film for semiconductor according to claim 1, delete The method according to claim 1,
In the unit advancing step S20, the vacuum adsorption plate 11 is kept upright from the bottom of the structure where the upright type peeling apparatus is located, and the unit transfer shuttle 30 is parallel to the bottom of the structure and the vacuum adsorption plate 11 Backward in a horizontal direction at right angles to the horizontal direction;
In the film preliminary peeling step (S40), the scratch forming unit (40) forms a scratch on the right corner of the substrate (S);
In the film peeling step S50 the vertical frame 35 of the unit transfer shuttle 30 is perpendicular to the direction of travel of the unit transfer shuttle 30 and remains upright from the bottom of the structure,
Wherein the taping unit (50) descends in the vertical direction parallel to the vacuum adsorption plate (11) while riding on the vertical frame (35). The method according to claim 1,
In the film preliminary peeling step (S40)
After the tape T adheres to the film scratching portion of the substrate, the drive recovery roll 53 winds the tape and loosens the tape,
The pressurizing holding roll 55 presses the supply roll 51 before the film peeling step S50 is performed so that the tape T is no longer loosened from the supply roll 51 when the film is peeled off Wherein the protective film is formed on the substrate. An upright type peeling apparatus for a substrate protective film for semiconductor,
A vacuum adsorption unit 10 installed at one side of the main frame 1 and vacuum-adsorbed by a suction hole 13 provided on a vacuum adsorption plate 11 when a substrate with a film is loaded;
A clamping unit 20 clamping an edge of the substrate adsorbed on the vacuum adsorption plate 11 by a clamper 21 provided on an outer side of the vacuum adsorption plate 11;
A scratch forming unit 40 and a taping unit 50 which ascends and descends by riding the vertical frame 35 are mounted on the upright vertical frame 35 and are mounted on the horizontal rail 5 of the main frame 1, A unit transfer shuttle 30;
A scratch forming unit 40 installed on the vertical frame 35 and forming a scratch on the right corner of the substrate film while moving forward and backward together with the unit transfer shuttle 30;
The scratches formed by the scratch forming unit 40 are tapped and backward while being moved forward and backward together with the unit transfer shuttle 30 and then descended on the vertical frame 35, A taping unit (50) for peeling off the substrate;
Wherein the protective film is formed on the substrate. 6. The method of claim 5,
The unit transfer shuttle 30 is moved forward and backward in a horizontal direction parallel to the bottom of the structure and perpendicular to the vacuum adsorption plate 11,
The vertical frame 35 of the unit transfer shuttle 30 is perpendicular to the direction of travel of the unit transfer shuttle 30 and remains upright from the bottom of the structure and the taping unit 50 rides on the vertical frame 35 And a lowering in a vertical direction parallel to the vacuum adsorption plate (11). 6. The method of claim 5,
The clamping part (20)
A radial cylinder 25 fixed to an outer edge of a back plate 17 supporting the vacuum attracting plate 11 and a radial piston 26 reciprocating by the radial cylinder 25,
A horizontal cylinder body (22) coupled to a front end of the radial piston (26) and reciprocating in an outer radial direction parallel to the back plate (17), and a horizontal cylinder body A horizontal direction piston,
A clamper (21) coupled to a tip of the horizontal piston for backward clamping the side of the substrate,
≪ / RTI >

When the radial cylinder 25 extends the radial cylinder body 22 radially outwardly through the radial piston 26,
The horizontal cylinder body 22 advances the clamper 21 forward from the front face of the substrate through the horizontal piston,
Again, if the radial cylinder 25 shrinks the horizontally oriented cylinder body 22 radially inwardly through the radial piston 26,
Wherein the horizontal cylinder body (22) shrinks the horizontal piston to move the clamper (21) backward to clamp the substrate. 6. The method of claim 5,
A scratch-forming unit (40) mounted on a vertical steel plate (60) that ascends and descends along the vertical frame (35)
A knife for forming a scratch on the film while moving in a linear path, a rotor 41 for forming a scratch on the film while rotating on a knurled surface, or a laser for forming a scratch on the film in a noncontact manner Of the protective film for semiconductor substrate. 6. The method of claim 5,
A taping unit (50) mounted on a vertical steel plate (60) that ascends and descends along the vertical frame (35)
A supply roll 51 on which the tape T main body is rotatably mounted,
A tape support 52 for supporting the opposite side of the adhesive surface of the unwound tape T,
A drive recovery roll 53 for pulling the tape T past the tape support 52 from the supply roll 51,
A guide roll R which supports and supports the opposite side of the adhesive surface of the tape T released between the tape support 52 and the supply roll 51 and the drive recovery roll 53,
The tape T is no longer pressed against the supply roll 51 when the film T is pressed against the supply roll 51 before the lifting plate 60 is lowered to peel off the film after the tape T adheres to the film scratch of the substrate. A press gripping roll 55 which press-fixes the supply roll 51 so as not to be released from the press roll,
Wherein the protective film is formed on the substrate. 10. The method of claim 9,
The press gripping roll 55 is mounted on the second supporter 56 and the second supporter 56 is elevated by the pneumatic cylinder,

Wherein the drive recovery roll (53) repeatedly winds and uncovers the tape for preliminary peeling, in which the tape (T) adheres to the film scratches of the substrate and then separates a part of the square corners of the film from the substrate An upright stripping device for a protective film.
KR1020140051182A 2014-04-29 2014-04-29 Semiconducter Substrate Protect Film Auto Peeler KR101454172B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020140051182A KR101454172B1 (en) 2014-04-29 2014-04-29 Semiconducter Substrate Protect Film Auto Peeler
PCT/KR2014/005234 WO2015167070A1 (en) 2014-04-29 2014-06-16 Vertical separation method for semiconductor substrate protection film and vertical separation apparatus for same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140051182A KR101454172B1 (en) 2014-04-29 2014-04-29 Semiconducter Substrate Protect Film Auto Peeler

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020140070520A Division KR101543786B1 (en) 2014-06-11 2014-06-11 Semiconducter substrate protect film auto peeler

Publications (1)

Publication Number Publication Date
KR101454172B1 true KR101454172B1 (en) 2014-10-30

Family

ID=51998609

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140051182A KR101454172B1 (en) 2014-04-29 2014-04-29 Semiconducter Substrate Protect Film Auto Peeler

Country Status (2)

Country Link
KR (1) KR101454172B1 (en)
WO (1) WO2015167070A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101611172B1 (en) 2015-03-20 2016-04-12 연세대학교 산학협력단 Method and apparatus for removing protective film of printed circuit board
CN106129475A (en) * 2016-06-29 2016-11-16 东莞市骏智机电科技有限公司 A kind of automatic film tearing device for lithium battery
KR20190063341A (en) * 2017-11-29 2019-06-07 코스텍시스템(주) Apparatus for peeling of temporary bonding film and thereof method
KR20220139713A (en) * 2021-04-08 2022-10-17 주식회사 한빛테크놀로지 Automatically Peel and Automatic Peel Method of Protective Film on Semiconductor Printed Circuit Board

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111746093A (en) * 2020-07-31 2020-10-09 苏州市锐翊电子科技有限公司 Automatic film tearing machine

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101119571B1 (en) 2011-09-19 2012-03-06 주식회사 코엠에스 Semiconducter substrate protect film auto peeler
KR20130041583A (en) * 2011-10-17 2013-04-25 주식회사 에스에프에이 System for attaching polarizer to panel
KR20130041582A (en) * 2011-10-17 2013-04-25 주식회사 에스에프에이 Polarizer attach apparatus
KR20140046825A (en) * 2012-10-11 2014-04-21 주식회사 에스에프에이 Apparatus for attaching functional film

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101119571B1 (en) 2011-09-19 2012-03-06 주식회사 코엠에스 Semiconducter substrate protect film auto peeler
KR20130041583A (en) * 2011-10-17 2013-04-25 주식회사 에스에프에이 System for attaching polarizer to panel
KR20130041582A (en) * 2011-10-17 2013-04-25 주식회사 에스에프에이 Polarizer attach apparatus
KR20140046825A (en) * 2012-10-11 2014-04-21 주식회사 에스에프에이 Apparatus for attaching functional film

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101611172B1 (en) 2015-03-20 2016-04-12 연세대학교 산학협력단 Method and apparatus for removing protective film of printed circuit board
CN106129475A (en) * 2016-06-29 2016-11-16 东莞市骏智机电科技有限公司 A kind of automatic film tearing device for lithium battery
CN106129475B (en) * 2016-06-29 2023-09-29 湖南携赢动力科技有限公司 Automatic film tearing device for lithium battery
KR20190063341A (en) * 2017-11-29 2019-06-07 코스텍시스템(주) Apparatus for peeling of temporary bonding film and thereof method
KR102041553B1 (en) * 2017-11-29 2019-11-06 코스텍시스템(주) Apparatus for peeling of temporary bonding film and thereof method
KR20220139713A (en) * 2021-04-08 2022-10-17 주식회사 한빛테크놀로지 Automatically Peel and Automatic Peel Method of Protective Film on Semiconductor Printed Circuit Board
KR102458941B1 (en) * 2021-04-08 2022-10-25 (주)한빛테크놀로지 Automatically Peel and Automatic Peel Method of Protective Film on Semiconductor Printed Circuit Board

Also Published As

Publication number Publication date
WO2015167070A1 (en) 2015-11-05

Similar Documents

Publication Publication Date Title
KR101454172B1 (en) Semiconducter Substrate Protect Film Auto Peeler
JP4803751B2 (en) Wafer protective tape peeling device
US6618937B2 (en) Method of assembling electronic applications and display devices
JP2009044008A5 (en)
KR101119571B1 (en) Semiconducter substrate protect film auto peeler
JP5339550B2 (en) Vacuum lamination system and vacuum lamination molding method
JP5273791B2 (en) Equipment for applying adhesive tape to substrates
KR20190065134A (en) Release film peeling method and release film peeling apparatus
JP2007310035A (en) Apparatus and method for peeling protective film stuck on substrate
JP2002329965A (en) Method and device for manufacturing thin film laminate
TW201320852A (en) Apparatus for peeling protection film of substrate and method for peeling protection film of substrate
JP2012216606A (en) Substrate transfer method and substrate transfer device
KR20140086361A (en) Die bonding method and apparatus
JPH10322100A (en) Method for positioning printed board
CN215514519U (en) Film tearing device
KR101543786B1 (en) Semiconducter substrate protect film auto peeler
KR20060057616A (en) Method for sticking adhesive tape for die bonding and method for mounting electronic component
JP2007165351A (en) Die bonding method
KR101439889B1 (en) Semiconducter Substrate Protect Film Auto Peeler
KR102558075B1 (en) Sheet peeling device and peeling method
JP2006041160A (en) Sheet peeling device and method therefor
JP3275743B2 (en) Chip mounting equipment
CN113163699A (en) Method and device for attaching radiating fins of circuit board
KR102466350B1 (en) Method and apparatus for separating protective tape
KR102458941B1 (en) Automatically Peel and Automatic Peel Method of Protective Film on Semiconductor Printed Circuit Board

Legal Events

Date Code Title Description
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20171117

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20180905

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20190918

Year of fee payment: 6