WO2015167070A1

WO2015167070A1 - Vertical separation method for semiconductor substrate protection film and vertical separation apparatus for same

Info

Publication number: WO2015167070A1
Application number: PCT/KR2014/005234
Authority: WO
Inventors: 황선오
Original assignee: 주식회사 코엠에스
Priority date: 2014-04-29
Filing date: 2014-06-16
Publication date: 2015-11-05
Also published as: KR101454172B1

Abstract

Disclosed is a vertical separation method for a semiconductor substrate protection film, comprising: a suction and hold step (S10) in which, when a substrate (S) having a film attached thereto is loaded on a vacuum suction plate (10), the vacuum suction plate (11) sucks the substrate (S) and a clamper (21) clamps the edge of the substrate (S); a unit progress step (S20) in which a unit transfer shuttle (30) on which a flaw forming unit (40) and a taping unit (50) are mounted moves forward; a flaw formation step (S30) in which the flaw forming unit (40) forms a flaw section on the periphery of the film (F) attached to the substrate (S), wherein the flaw section assists in separating the film; a preliminary film separation step (S40) in which the taping unit (50) moves backward after taping the flaw section on the substrate (S) and separates the periphery of the film (F) from the substrate; a film separation step (S50) in which the taping unit (50) separates the film from the fixed substrate (S) while moving downward along a vertical frame (35) of the unit transfer shuttle (30); and a return step (S60) in which the taping unit (50) moves upward again and the unit transfer shuttle (40) moves backward and returns to the initial location.

Description

Upright peeling method and upright peeling apparatus for semiconductor substrate protective film

The present invention relates to an upright peeling method and a peeling apparatus for a semiconductor substrate protective film.

In general, printed circuit boards (PCBs) are printed with copper foil for wiring of circuits required for thin plates made of epoxy or phenol resin, and are connected to each other. It refers to a substrate that can operate a circuit after applying power, and has a conductive function, an insulation function, and a support function. Therefore, the design of a printed circuit board (PCB) is very important in the manufacture of electronic-related products because it is directly related to the operation, performance, life and reliability of the product. Printed circuit board (PCB) as described above is an electronic component that serves as a component for connecting semiconductors, capacitors, resistors, etc. It is used in all electronic devices, from computers to mobile phones to satellites.

PCBs include flexible printed circuit boards (FPCBs) and rigid printed circuit boards (RPCBs), such as printed circuit boards (PCBs). Unlike conventional rigid printed circuit boards (FPCBs), which have a rigid substrate, the FPCB has a high demand due to the thinness and flexibility of electronic products. Among printed circuit boards, flexible printed circuit boards (FPCBs) are electronic components developed to cope with the trend of miniaturization and complexity of electronic products. They have good workability, excellent heat resistance, bending resistance, chemical resistance, and dimension change. It has the advantage of being less and heat-resistant, and it can reduce the working time during assembly work.

Printed circuit board (PCB) or semiconductor manufacturing board is protected by protecting the board surface by attaching a protective film to the upper and lower surfaces of the board for products that have been checked for abnormalities by removing contaminants that may be on the surface of the board during the manufacturing process. To lose. Therefore, in order to be able to insert various components such as semiconductors, capacitors and resistors on such substrates, the protective film attached to the substrate surface must be removed.

As a prior art, there is a registered patent No. 10-1119571 (Patent holder: COMS, Applicant) and the prior art is a film peeling proceeds in the horizontal lying state of the substrate, the configuration of the device becomes larger, the steps for the peeling and the transfer amount of the components There are many problems with this.

The present invention provides an upright peeling method and a peeling apparatus for a substrate protective film for a semiconductor, which can reduce the conveyance step of the substrate and the conveying amount of the peeling device, thereby miniaturizing and compacting the device, thereby providing excellent handling and enabling complete peeling. It is to.

The present invention can increase the work efficiency per hour while handling the substrate of 30 ~ 80cm size while accurately and completely peeling off the protective film of the substrate and provides an excellent peeling method and peeling device f of the substrate protective film for semiconductors excellent in durability It is to.

When the substrate S on which the film is attached is loaded onto the vacuum suction plate 10, the vacuum suction plate 11 sucks the substrate S and the clamper 21 clamps the edge of the substrate S. Adsorption gripping step (S10);

A unit forward step (S20) to which the unit transfer shuttle 30 to which the scratch forming unit 40 and the taping unit 50 are mounted is advanced;

A scratch forming step (S30) in which the scratch forming unit (40) forms a scratch portion to assist film peeling on the side of the film (F) attached to the substrate (S);

A film preliminary peeling step (S40) in which the taping unit (50) taps the scratches on the substrate (S) and then is retracted to separate the sides of the film (F) from the substrate;

A film peeling step (S50) of peeling off the film from the fixedly positioned substrate (S) while the tapering unit (50) descends on the vertical frame (35) of the unit transfer shuttle (30);

A return step (S60) in which the taping unit (50) is raised again and the unit transfer shuttle (40) is reversed to return to an initial position;

The upright peeling method of the board | substrate protective film for semiconductors comprised including what consists of including.

According to the present invention, a method for peeling and an upright peeling device for a substrate protective film for a semiconductor, which can reduce the conveyance step of the substrate and the transporting amount of the peeling device, thereby making the device compact and compact, thereby enabling excellent peeling and complete peeling. Is provided.

In addition, according to the present invention, while being able to accurately and completely peel off the protective film of the substrate while handling the substrate of 30 ~ 80cm size can increase the work efficiency per hour and upright peeling method of the substrate protective film for semiconductor excellent in durability And a peeling apparatus.

1 is a whole perspective view of an upright peeling apparatus for a substrate protective film for a semiconductor according to an embodiment of the present invention.

Figure 2 is a perspective view of the whole upright peeling apparatus of the semiconductor substrate protective film according to an embodiment of the present invention.

Figure 3 (a, b) is a vacuum adsorption portion and the clapping portion of the upright peeling device of the semiconductor substrate protective film according to an embodiment of the present invention.

Figure 4 is a configuration of the scratch forming unit taping unit of the upright peeling apparatus of the substrate protective film for a semiconductor according to an embodiment of the present invention.

Figure 5 is a flow chart of the upright peeling method of the substrate protective film for a semiconductor according to an embodiment of the present invention.

Figure 6 is a substrate and film bonding of the peeling target of the present invention.

Hereinafter, an upright peeling method and an upright peeling apparatus for a substrate protective film for a semiconductor according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. 1 is an overall perspective view of an upright peeling apparatus for a semiconductor substrate protective film according to an embodiment of the present invention, Figure 2 is an overall perspective view of an upright peeling apparatus for a semiconductor substrate protective film according to an embodiment of the present invention, Figure 3 (a, b) is a schematic view of the vacuum adsorption unit and the clapping portion of the upright peeling apparatus of the semiconductor substrate protective film according to an embodiment of the present invention, Figure 4 is a semiconductor substrate protection according to an embodiment of the present invention A scratch forming unit taping unit configuration diagram among the upright peeling apparatuses of the film, and FIG. 6 is a substrate and a film bonding of the peeling target of the present invention.

As shown in Figures 1 to 6, the upright peeling method of the substrate protective film for a semiconductor according to an embodiment of the present invention, the adsorption holding step (S10) and the net advance step (S20) and the scratch formation step (S30) ) And a film preliminary peeling step (S40), a film peeling step (S50) and a return step (S60). In the suction gripping step S10, when the substrate S on which the film is attached is loaded on the vacuum suction plate 10, the vacuum suction plate 11 sucks the substrate S and the clamper 21 the substrate S. Clamp the edge of.

In the unit advance step S20, the unit transfer shuttle 30 on which the scratch forming unit 40 and the taping unit 50 are mounted is advanced. In the scratch forming step (S30), the scratch forming unit 40 forms a scratch portion to assist the film peeling on the side of the film (F) attached to the substrate (S).

In the film preliminary peeling step (S40), the taping unit 50 taps the scratches on the substrate S and then is retracted to separate the side of the film F from the substrate. In the film peeling step S50, the taping unit 50 peels off the film from the fixedly positioned substrate S while descending on the vertical frame 35 of the unit transfer shuttle 30. In the return step S60, the taping unit 50 is raised again and the unit transfer shuttle 40 is reversed to return to the initial position. The vacuum suction plate 10 sucks and fixes the substrate S such that the right angled corner of the substrate S is located at the top.

As shown in Figure 1 to Figure 6, in the upright peeling method of the semiconductor substrate protective film according to an embodiment of the present invention, in the unit advance step (S20), the vacuum adsorption plate 11 is upright peeling The unit transfer shuttle 30 is moved forward and backward in a horizontal direction parallel to the bottom of the structure and perpendicular to the vacuum suction plate 11 while maintaining the upright position from the bottom of the structure in which the apparatus is located. In the preliminary peeling step (S40), the scratch forming unit 40 forms a scratch at a right angle corner of the substrate (S). In the film peeling step (S50), the vertical frame 35 of the unit transfer shuttle 30 is perpendicular to the advancing direction of the unit transfer shuttle 30 and remains upright from the bottom of the structure, and the taping unit 50 is Take the vertical frame 35 and descend in the vertical direction parallel to the vacuum suction plate (11).

As shown in Figure 1 to Figure 6, in the upright peeling method of the substrate protective film for a semiconductor according to an embodiment of the present invention, in the preliminary peeling step (S40), the tape (T) is a film scratch portion of the substrate After the adhesion, the drive recovery roll 53 was repeatedly wound and unwound tape, and the pressure gripping roll 55 pressurized the feed roll 51 before the film peeling step S50 was carried out so that the film was no longer peeled off. The tape T is fixed so as not to be released from the supply roll 51.

1 to 6, the upright peeling apparatus of the substrate protective film for semiconductors according to an embodiment of the present invention is an upright peeling apparatus of the body substrate protective film, on one side of the main frame (1) When the substrate on which the film is attached is loaded, the vacuum adsorption unit 10 for vacuum adsorption to the adsorption hole 13 provided in the vacuum adsorption plate 11 and the edge of the substrate adsorbed to the vacuum adsorption plate 11 are connected to the vacuum adsorption plate. (C) lifting up and down the clamping unit (20) clamped by the clamper (21) installed at the outer side of the (11), the scratch forming unit (40) and the vertical frame (35) to the upright vertical frame (35). The taping unit 50 is mounted, and the unit transfer shuttle 30 is mounted on the horizontal rail 5 of the main frame 1 and moves forward and backward, and is installed on the vertical frame 35. The flaw forming unit 40 for forming a flaw in the right angle corner of the substrate film while moving backward together Include. In addition, the tape is mounted on the vertical frame 35, while moving backward with the unit transfer shuttle 30, by taping the scratches made by the scratch forming unit 40, and then backward, the film is lowered on the vertical frame 35. It further includes a taping unit 50 for peeling off from the substrate.

As shown in Figure 1 to 6, in the upright peeling apparatus of the substrate protective film for a semiconductor according to an embodiment of the present invention, the vacuum suction plate 10 is located at the top right corner of the substrate (S). The substrate S is sucked and fixed so that the unit transfer shuttle 30 moves forward and backward in a horizontal direction parallel to the bottom of the structure and perpendicular to the vacuum suction plate 11, and perpendicular to the unit transfer shuttle 30. The frame 35 is perpendicular to the traveling direction of the unit transfer shuttle 30 and remains upright from the bottom of the structure, and the taping unit 50 rides on the vertical frame 35 and is parallel to the vacuum suction plate 11. And descending in one vertical direction.

As shown in Figure 1 to Figure 6, in the upright peeling apparatus of the substrate protective film for a semiconductor according to an embodiment of the present invention, the clamping portion 20, the back plate for supporting the vacuum suction plate 11 ( A radial cylinder 25 fixed to the outer edge of the 17 and a radial piston 26 reciprocating by the radial cylinder 25, coupled to the tip of the radial piston 26 and back plate 17. A horizontal cylinder 22 reciprocating in the outer radial direction and a horizontal piston forward and backward in the horizontal direction by the horizontal cylinder body 22 and parallel to the tip of the horizontal piston It comprises a clamper 21 for clamping while reversing the sides.

Here, when the radial cylinder 25 extends the horizontal cylinder body 22 through the radial piston 26 in the outer radial direction, the horizontal cylinder body 22 passes through the horizontal piston to the clamper 21. Advance the front of the substrate. When the radial cylinder 25 again contracts the horizontal cylinder body 22 in the inner radial direction through the radial piston 26, the horizontal cylinder body 22 contracts the horizontal piston to form the clamper 21. The substrate is clamped by rewinding.

As shown in Figure 1 to Figure 6, in the upright peeling apparatus of the substrate protective film for a semiconductor according to an embodiment of the present invention, the scratches mounted on the elevating plate 60 to be elevated along the vertical frame 35 The forming unit 40 includes a knife for forming a scratch on the film while moving in a straight path, a rotor 41 for forming a scratch on the film while the knurled surface is rotated, or a non-contact forming a scratch on the film. It is preferable that it is one selected from a laser. The rotor 41 having a knurled surface is rotatably fixed to the mounting block 43 fixed to the lifting plate 60.

As shown in Figure 1 to Figure 6, in the upright peeling apparatus of the substrate protective film for a semiconductor according to an embodiment of the present invention, the tape is mounted on the elevating plate 60 to be elevated along the vertical frame 35 The unit 50 includes a supply roll 51 on which the main body of the tape T is rotatably mounted, a tape support 52 for supporting the opposite side of the adhesive surface of the released tape T, and a supply roll 51. The drive recovery roll 53 for pulling the tape T past the tape support 52, and the tape T released between the tape support 52, the supply roll 51 and the drive recovery roll 53. It includes a guide roll (R) to support and guide the opposite side of the adhesive surface.

As shown in FIGS. 1 to 6, the taping unit 50 also includes the feed roll before the lifting plate 60 is lowered to peel off the film after the tape T adheres to the film scratch portion of the substrate. And a pressure gripping roll 55 for pressurizing and fixing the feed roll 51 such that the tape T is no longer released from the feed roll 51 when the film 51 is pressed to release the film. The drive recovery roll 53 rotates the drive motor 54 forward and reverse.

As shown in Figure 1 to 6, in the upright peeling apparatus of the substrate protective film for a semiconductor according to an embodiment of the present invention, the pressing gripping roll 55 is mounted on the second auxiliary support (56) The second auxiliary support 56 is lifted and lifted by a pneumatic cylinder, and the drive recovery roll 53 is a preliminary peeling to separate a square corner portion of the film from the substrate after the tape T adheres to the film scratch of the substrate. It is preferable to repeat the tape winding and unwinding.

Although the present invention has been described in connection with the above-mentioned preferred embodiments, the scope of the present invention is not limited to these embodiments, and the scope of the present invention is defined by the following claims, and equivalent scope of the present invention. It will include various modifications and variations belonging to.

The reference numerals set forth in the claims below are merely to aid the understanding of the present invention, not to affect the interpretation of the scope of the claims, and the scope of the claims should not be construed narrowly.

Claims

An adsorption gripping step (S10) in which the substrate (S) to which the film is attached is loaded onto the vacuum adsorption plate (10), wherein the vacuum adsorption plate (11) adsorbs the substrate (S);

A unit forward step (S20) to which the unit transfer shuttle 30 to which the scratch forming unit 40 and the taping unit 50 are mounted is advanced;

A scratch forming step (S30) in which the scratch forming unit (40) forms a scratch portion to assist film peeling on the side of the film (F) attached to the substrate (S);

A film preliminary peeling step (S40) in which the taping unit (50) taps the scratches on the substrate (S) and then is retracted to separate the sides of the film (F) from the substrate;

A film peeling step (S50) of peeling off the film from the fixedly positioned substrate (S) while the tapering unit (50) descends on the vertical frame (35) of the unit transfer shuttle (30);

A return step (S60) in which the taping unit (50) is raised again and the unit transfer shuttle (40) is reversed to return to an initial position;

The upright peeling method of the board | substrate protective film for semiconductors comprised including what consists of including.
The method of claim 1,

The vacuum adsorption plate (10) is an upright peeling method of the substrate protective film for a semiconductor, characterized in that for adsorbing and fixing the substrate (S) so that the right corner of the substrate (S) is located at the top.
The method of claim 1,

In the unit advancing step (S20), the vacuum suction plate 11 is maintained upright from the bottom of the structure in which the upright peeling device is located, the unit transfer shuttle 30 is parallel to the bottom of the structure and the vacuum suction plate 11 Forward and backward in the horizontal direction perpendicular to the;

In the film preliminary peeling step (S40), the scratch forming unit (40) forms a scratch at a right angle corner of the substrate (S);

In the film peeling step (S50), the vertical frame 35 of the unit transfer shuttle 30 is perpendicular to the advancing direction of the unit transfer shuttle 30 and maintains an upright position from the bottom of the structure,

The taping unit 50 is descending in the vertical direction parallel to the vacuum suction plate (11) on the vertical frame 35, the upright peeling method of the semiconductor substrate protective film.
The method of claim 1,

In the film pre-peeling step (S40),

After the tape T adheres to the film scratch of the substrate, the drive recovery roll 53 winds and unwinds the tape,

The pressure gripping roll 55 presses the supply roll 51 before the film peeling step S50 is performed to fix the tape T so that the tape T is no longer released from the supply roll 51 when the film is peeled off. An upright peeling method of a substrate protective film for semiconductors.
In the upright peeling apparatus of the board | substrate protective film for semiconductors,

A vacuum suction unit 10 installed at one side of the main frame 1 and vacuum-adsorbed to a suction hole 13 provided in the vacuum suction plate 11 when the substrate to which the film is attached is loaded;

A clamping part (20) for clamping the edge of the substrate adsorbed on the vacuum suction plate (11) with a clamper (21) provided at an outer side of the vacuum suction plate (11);

The upright vertical frame 35 is equipped with a scratch forming unit 40 and a taping unit 50 for lifting up and down on the vertical frame 35, and are driven forward and backward on the horizontal rail 5 of the main frame 1. A unit transfer shuttle 30;

A flaw forming unit (40) installed in the vertical frame (35) to form a flaw at a right angle corner of the substrate film while moving backward with the unit transfer shuttle (30);

Installed in the vertical frame 35 and backed up with the unit transfer shuttle 30, while tapping the scratches made by the scratch forming unit 40, and then back, and descend the ride on the vertical frame 35 A taping unit 50 that peels from the substrate;

The upright peeling apparatus of the board | substrate protective film for semiconductors characterized by including a.
The method of claim 5,

The vacuum suction plate 10 adsorbs and fixes the substrate S such that a right angled corner of the substrate S is positioned at the top thereof, and the unit transfer shuttle 30 is parallel to the bottom of the structure and is connected to the vacuum suction plate 11. In the horizontal direction at right angles, back and forth,

The vertical frame 35 of the unit transfer shuttle 30 is perpendicular to the traveling direction of the unit transfer shuttle 30 and remains upright from the bottom of the structure, and the taping unit 50 rides on the vertical frame 35. Upright peeling apparatus of the substrate protective film for a semiconductor, characterized in that it comprises a lowering in a vertical direction parallel to the vacuum suction plate (11).
The method of claim 5,

The clamping unit 20,

A radial cylinder 25 fixed to an outer edge of the back plate 17 supporting the vacuum suction plate 11 and a radial piston 26 reciprocating by the radial cylinder 25;

Horizontally forward and backward by the horizontal cylinder body 22 and the horizontal cylinder body 22 coupled to the front end of the radial piston 26 and reciprocating in the outer radial direction in parallel with the back plate 17. With the horizontal piston

A clamper 21 coupled to the front end of the horizontal piston to clamp the reverse side of the substrate;

It is configured to include;

If the radial cylinder 25 extends the horizontal cylinder body 22 in the outer radial direction through the radial piston 26,

The horizontal cylinder body 22 advances the clamper 21 in front of the substrate front through the horizontal piston,

When the radial cylinder 25 again contracts the horizontal cylinder body 22 in the inner radial direction via the radial piston 26,

The horizontal cylinder body 22 is the upright peeling apparatus of the substrate protective film for a semiconductor, characterized in that the clamping the substrate by retracting the horizontal piston to reverse the clamper (21).
The method of claim 5,

The scratch forming unit 40 mounted on the elevating plate 60 which is elevated along the vertical frame 35,

It is selected from among a knife that forms a scratch on the film while moving in a straight path, a rotor 41 that forms a scratch on the film while the knurled surface is rotated, or a laser that forms a scratch on the film in a non-contact manner. The upright peeling apparatus of the board | substrate protective film for semiconductors made into.
The method of claim 5,

Taping unit 50 is mounted to the elevating plate 60 to be elevated along the vertical frame 35,

Supply roll 51 to which the tape (T) body is rotatably mounted,

A tape supporter 52 for supporting the opposite side of the adhesive surface of the loosened tape T,

A drive recovery roll 53 for pulling the tape T past the tape support 52 from the supply roll 51;

A guide roll (R) for supporting and guiding the opposite side of the adhesive surface of the tape (T) released between the tape support (52), the supply roll (51) and the drive recovery roll (53),

After the tape T adheres to the film scratches of the substrate, the feed roll 51 is pressed before the lifting plate 60 is lowered to peel off the film. A pressure gripping roll 55 for pressing and fixing the supply roll 51 so as not to be released from

The upright peeling apparatus of the board | substrate protective film for semiconductors characterized by including a.
The method of claim 9,

The pressing gripping roll 55 is mounted to the second auxiliary support 56, the second auxiliary support 56 is elevated by a pneumatic cylinder,

The drive recovery roll 53 is a substrate for a semiconductor, characterized in that the tape T is stuck to the film scratches of the substrate, and then the tape is wound and unrolled for preliminary peeling away from the substrate. Upright peeling device for protective film.