JP2012004153A - Bonding apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique capable of intensively giving bonding energy to predetermined regions of a substrate and an object to be bonded when the object to be bonded is bonded to a predetermined position of the substrate.SOLUTION: When a substrate 23 is bonded to a predetermined position of a substrate 24 held by a stage 10, bonding energy consisting of ultrasonic vibration is given from an action surface 40a of an action part 40 to the substrate 24 and a predetermined region A of another substrate 23 superposed on the predetermined position of the substrate 24. However, bonding energy can be intensively given to the predetermined regions A of both substrates 23 and 24 because bonding energy transfer from the action part 40 to the peripheries of the predetermined regions A is blocked by a transfer blocking part consisting of a holding mechanism 50.

Description

  The present invention relates to a technique for bonding an object to be bonded to a predetermined position of a substrate.

  2. Description of the Related Art Conventionally, a technique for bonding an object to be bonded to a predetermined position on a substrate by bonding energy including ultrasonic vibration or heat is known. For example, in the mounting apparatus described in Patent Document 1, a substrate on which an IC chip is temporarily attached on an electrode pattern via a resin film is guided to a press support stage by a guide table, and the substrate is placed on the press support stage. In the supported state, the IC chip is pressed against the substrate by the pressing tool and heated, whereby the IC chip is mounted at a predetermined position on the substrate.

  Further, for example, in the joining apparatus described in Patent Document 2, the relative displacement between the flexible substrate sucked and held by the horn and the glass substrate placed on the substrate holder provided on the movable table is caused by the movable table. In the corrected state, the flexible substrate is pressed against the glass substrate by a horn and is applied with ultrasonic vibration, whereby the flexible substrate is bonded to a predetermined position of the glass substrate.

JP 2006-286659 A (paragraphs 0034 to 0037, FIG. 8, etc.) JP 2007-317932 A (paragraphs 0023-0027, FIGS. 1-3, etc.)

  By the way, in recent years, with the miniaturization of electronic devices and the like, the pitch of wiring patterns and the like provided on a substrate has been reduced, and as a result, the interval between a plurality of objects to be bonded to the substrate has been reduced. Therefore, the bonding energy consisting of ultrasonic vibration and heat when bonding the object to be bonded to the substrate is transmitted to the bonded objects around the object to be bonded, so that the bonding has already been completed. In the worst case, there is a possibility that a bonded object to be bonded may fall off from the substrate because peeling or the like may occur at the bonded portion between the object to be bonded and the substrate.

  In addition, when bonding an object to be bonded such as a flexible substrate on which electronic components are mounted to a predetermined position of the substrate on the stage, there is a bonding energy consisting of ultrasonic vibration and heat for bonding the object to be bonded to the substrate. There is a possibility that the electronic component is damaged by being applied to the electronic component mounted on the object to be bonded. Further, since the bonding energy for bonding the object to be bonded to a predetermined position on the substrate escapes to other parts of the substrate, the bonding energy may be insufficient and a bonding failure may occur between the substrate and the object to be bonded. It was.

  The present invention has been made in view of the above-described problems, and is a technique capable of intensively applying bonding energy to a predetermined region of a substrate and a bonded object when bonding the bonded object to a predetermined position of the substrate. The purpose is to provide.

  In order to solve the above-described problems, a bonding apparatus according to the present invention is a bonding apparatus that bonds an object to be bonded to a predetermined position of a substrate, and a stage that holds the substrate, and the substrate and the substrate and the predetermined position of the substrate are overlapped. An action portion for applying bonding energy comprising at least ultrasonic vibration or heat to a predetermined region of the bonded object, and a transmission blocking portion for blocking transmission of the bonding energy from the action portion to the periphery of the predetermined region. And a head provided. (Claim 1).

  At this time, it is preferable that the transmission blocking portion includes a holding body and includes a holding mechanism for holding the substrate between the holding body and the stage so as to surround the predetermined region. (Claim 2).

  Further, the holding mechanism may hold the object to be bonded together with the substrate (claim 3).

  Moreover, when the said clamping mechanism exists in a clamping state, you may further provide the cutting | disconnection means which cut | disconnects at least one part of the said to-be-joined object (Claim 4).

  Further, in the bonding apparatus according to any one of claims 1 to 4, an electrode pattern formed on another substrate as the object to be bonded is aligned with an electrode pattern formed at a predetermined position on the substrate, In the apparatus for bonding the other substrate to the substrate, the bonding energy is applied to the head by a region where the electrode pattern of the other substrate is formed as the predetermined region. A position adjusting means for further aligning the electrode pattern of the other substrate held by the holding portion with the electrode pattern of the substrate is further provided with a holding portion for holding the other substrate in the aligned state. Furthermore, you may provide (Claim 5).

  In addition, the head includes a resonator provided with the action portion, and the action portion applies at least ultrasonic vibration caused by ultrasonic vibration of the resonator to the predetermined region as the bonding energy. (Claim 6).

  According to the first aspect of the present invention, when the object to be bonded is bonded to the predetermined position of the substrate, at least ultrasonic vibration is applied to the substrate held on the stage and the predetermined region of the object to be bonded superimposed on the predetermined position of the substrate. Alternatively, the bonding energy consisting of heat is given by the action part, but since the transmission of the joining energy from the action part to the periphery of the predetermined area is blocked by the transmission blocking part, it is concentrated on the predetermined area of the substrate and the object to be bonded. Bonding energy can be given.

  According to the second aspect of the present invention, the transmission blocking portion includes the holding mechanism having the holding body, and the substrate is held between the holding body and the stage so as to surround the predetermined region by the holding mechanism. For this reason, it is possible to reliably prevent the bonding energy given to the predetermined area from the action part from being transmitted to the periphery of the predetermined area of the substrate beyond the holding portion by the holding mechanism.

  According to the invention of claim 3, since the holding mechanism holds the object to be joined together with the substrate, it is possible to prevent the joining energy from being transmitted around the predetermined region of the object to be joined. The junction energy can be concentrated on a predetermined region of the object.

  According to the invention of claim 4, since at least a part of the object to be bonded is cut by the cutting means when the holding mechanism is in the holding state, the object to be bonded to the predetermined position of the substrate is bonded. Since an unnecessary part of the bonded product can be cut, efficiency is high.

  According to the fifth aspect of the present invention, when an electrode pattern formed on another substrate as an object to be bonded is aligned with an electrode pattern formed at a predetermined position of the substrate and another substrate is bonded to the substrate. The other substrate is held by the holding unit and is held by the holding unit in a state where the bonding energy is given by the working unit with the region where the electrode pattern of the other substrate is formed as a predetermined region. Since the position adjustment means aligns the electrode pattern of the substrate and the electrode pattern of the substrate held on the stage, the bonding energy at the time of bonding is transferred to the other substrate and the region where the electrode pattern of the substrate is formed. Can give concentrated.

  In addition, the other substrate is held by the holding unit in a state where the action unit and the electrode pattern of the other substrate are aligned, and the electrode pattern of the other substrate held by the holding unit and the substrate held by the stage Since the alignment with the electrode pattern is performed by the position adjusting means, it is possible to easily align the working part, the electrode pattern of the other substrate, and the electrode pattern of the substrate. It is possible to concentrate the formed region and apply the bonding energy from the working part. Therefore, in order to give the bonding energy to the other substrate and the region where the electrode pattern of the substrate is formed, the electrode patterns of both the substrates are aligned before applying the bonding energy as in the prior art, and the other substrate is attached to the substrate. Since a process of temporary attachment with a conductive film or the like is not necessary, another substrate can be efficiently bonded to a predetermined position of the substrate.

  According to a sixth aspect of the present invention, the head includes a resonator provided with an action portion, and the action portion applies at least ultrasonic vibration caused by ultrasonic vibration of the resonator as a predetermined energy as bonding energy. It is practical because it can be given to.

It is a figure which shows the ultrasonic vibration joining apparatus which is 1st Embodiment of the joining apparatus of this invention. It is a figure which shows the resonator with which the ultrasonic vibration joining apparatus of FIG. 1 is provided. It is right side sectional drawing of a resonator. It is right side sectional drawing of a resonator. It is right side sectional drawing of the resonator in 2nd Embodiment of an ultrasonic vibration joining apparatus. It is a principal part enlarged view in 3rd Embodiment of an ultrasonic vibration joining apparatus. It is right side sectional drawing of the resonator in 4th Embodiment of an ultrasonic vibration joining apparatus. It is a partial bottom view of the action part provided in the resonator in 5th Embodiment of an ultrasonic vibration joining apparatus.

<First Embodiment>
A first embodiment of the joining apparatus of the present invention will be described with reference to FIGS. FIG. 1 is a view showing an ultrasonic vibration bonding apparatus 200 according to a first embodiment of the bonding apparatus of the present invention. 2A and 2B are diagrams showing the resonator 7 included in the ultrasonic vibration bonding apparatus 200 of FIG. 1, wherein FIG. 2A is a front view, FIG. 2B is a front view showing a state in which the resonator 7 is supported, and FIG. ) Is a bottom view showing a state in which the resonator 7 is supported, and (d) is a view showing a vibration state of the resonator 7 shown in (a) to (c). 3 is a right side cross-sectional view of the resonator 7, wherein (a) is a cross-sectional view taken along line AA in FIG. 2 (c), and (b) is a schematic view showing a state in which the substrate 23 is held. . 4A and 4B are right side cross-sectional views of the resonator 7, wherein FIG. 4A is a cross-sectional view taken along line AA in FIG. 2C, and FIG. 4B is a schematic view illustrating a state in which the substrate 23 is held. . 3 and 4 are diagrams showing different states.

1. 1. Apparatus Configuration The ultrasonic vibration bonding apparatus 200 shown in FIG. 1 includes a bonding mechanism 27, a mounting mechanism 28, a position recognition unit 29, a transport unit 30, and a control device 31, and the bonding mechanism 27 is used as an object to be bonded. The electrode pattern 23a formed on the other substrate 23 held by the head portion 26 is aligned with the electrode pattern 24a formed at a predetermined position of the substrate 24 held by the stage 10 of the mounting mechanism 28, and the ultrasonic wave The other substrate 23 is bonded to a predetermined position of the substrate 24 by applying vibration.

  The joining mechanism 27 includes a vertical drive mechanism 25 and a head portion 26 (corresponding to the “head” of the present invention). The vertical drive mechanism 25 includes a vertical drive motor 1, a bolt / nut mechanism 2 coupled to the rotary shaft of the vertical drive motor 1, and a head holding portion 6. The head holding portion 6 is vertically moved by a head escape guide 5. It is connected to the bolt and nut mechanism 2 while being pulled upward by its own weight counter 4 which is guided by the self weight and cancels its own weight.

  Therefore, when the vertical drive motor 1 is driven, the head holding portion 6 connected to the bolt and nut mechanism 2 moves up and down as the movable body of the bolt and nut mechanism 2 moves up and down while being guided by the vertical guide 3. . In addition, a head unit 26 having a resonator 7 is coupled to the head holding unit 6, and the head unit 26 moves up and down as the head holding unit 6 moves up and down.

  Further, a pressure sensor 32 formed by a load cell or the like is provided at a connection portion between the bolt and nut mechanism 2 and the head holding unit 6, and the pressure sensor 32 is held by the substrate 23 and the stage 10 held by the head unit 26. The pressure applied to the substrate 24 is detected. Further, a head height detecting means 36 formed by a linear encoder or the like is provided at the side end of the head holding portion 6, and the head height detecting means 36 is a position in the arrow Z direction of the head portion 26, that is, the head The height of the unit 26 with respect to the stage 10 is detected. The configuration and operation of the head unit 26 will be described in detail later.

  In addition, the gantry 35, the frame 34 disposed above the gantry 35, and the four that are disposed around the head portion 26 so as to surround the center of pressure of the head portion 26 and connect the gantry 35 and the frame 34. The joining mechanism 27 is provided so as to be coupled to the frame 34. A part of the support column 13 and the frame 34 is not shown.

  The mounting mechanism 28 includes a stage 10 in which a stage heater 11 is provided, and a stage table 12 coupled to the stage 10. The stage 10 includes a holding mechanism that sucks and holds the substrate 24 on the placement surface by suction, and heats the substrate 24 sucked and held on the placement surface by the stage heater 11 as necessary. The stage table 12 has a movable shaft that can be moved in parallel and rotationally. By moving the stage 10 in parallel and rotationally, the stage table 12 moves relative to the substrate 23 held by the head portion 26 of the substrate 24 that is sucked and held by the stage 10. Adjust the position. Note that the configuration for holding the substrate 24 on the mounting surface of the stage 10 is not limited to the configuration in which the substrate 24 is attracted and held by suction, and the configuration in which the substrate 24 is held by electrostatic suction or the substrate 24 is held by a mechanical chuck mechanism. Any configuration can be used as long as the substrate 24 can be held, such as a configuration to be used, or the substrate 24 may be simply placed on the placement surface of the stage 10.

  The position recognition unit 29 includes an upper / lower mark recognition unit 14, an amplitude detector 33, and a recognition unit moving table 15 that moves the upper / lower mark recognition unit 14 and the amplitude detector 33 horizontally and vertically. The vertical mark recognizing means 14 is inserted between the substrate 23 and the substrate 24 which are respectively held by the head portion 26 and the stage 10 and are opposed to each other in the vertical direction, and is an alignment for position recognition provided on both the substrates 23 and 24. Recognize the mark. The amplitude detector 33 detects the amplitudes of the substrates 23 and 24 and the resonator 7.

  The transport unit 30 includes a substrate transport device 16 and a substrate transport conveyor 17 that transport another substrate 23 as an object to be bonded, and a substrate transport device 18 and a substrate transport conveyor 19 that transport the substrate 24.

  The control device 31 includes an operation panel (not shown) for controlling the entire ultrasonic vibration bonding apparatus 200, and controls the entire ultrasonic vibration bonding apparatus 200. That is, the control device 31 controls the drive of the vibrator 8 connected to the resonator 7 of the head unit 26 or the vertical drive mechanism based on the detection signal of the height position of the head unit 26 by the head height detecting means 36. 25 is adjusted to adjust the height of the head portion 26 in the arrow Z direction. Further, the control device 31 controls the vertical driving mechanism 25 based on the pressure applied to the substrate 23 and the substrate 24 detected by the pressure sensor 32 to control the pressure applied to the substrate 23 and the substrate 24, Based on the recognition result of the alignment marks on both substrates 23 and 24 by the recognition means 14, the stage table 12 is controlled to adjust the relative positions of both substrates 23 and 24, the resonator 7 detected by the amplitude detector 33, and the like. The vibrator 8 is driven and controlled based on the amplitude of the.

2. As shown in FIG. 2, the head unit 26 includes a resonator 7, a vibrator 8 connected to one end of the resonator 7 and driven and controlled by the control device 31, and a support that supports the resonator 7. Means 70, an action part 40 that is provided at a position f2 that is the maximum amplitude part of the resonator 7 and applies the joining energy to the predetermined area, and a transmission that prevents the joining energy from the action part 40 from being transmitted to the periphery of the predetermined area. And a holding mechanism 50 as a blocking portion.

  The resonator 7 is made of a metal such as titanium alloy (6Al-4V), iron, or stainless steel, and resonates with vibration generated by the vibrator 8 that is driven and controlled by the control device 31, and vibrates ultrasonically. Further, the resonator 7 is formed substantially symmetrically with the length of one wavelength of the resonance frequency so that the substantially center position f2 and both end positions f0 and f4 are the maximum amplitude portion.

  The resonator 7 is formed in a cylindrical shape having a substantially circular cross section, and the positions f1 and f3 corresponding to the minimum amplitude portion (nodal point: NP) of the resonator 7 are different from those of other positions. A small-diameter portion 7a having a small diameter is also formed. In this embodiment, the small-diameter portion 7a has an octagonal cross-sectional shape, but the cross-sectional shape of the small-diameter portion 7a is not limited to an octagonal shape, and may be formed in a circular shape or other polygonal shape. It may be formed.

  The support means 70 includes a base portion 71 supported by the head holding portion 6, and a clamp portion 72 having a first member 72 a and a second member 72 b provided on the base portion 71, and a small diameter formed in the resonator 7. The resonator 7 is supported by the clamp portion 72 by holding the portion 7 a by the first member 72 a and the second member 72 b and fixing the portion 7 a with the bolt 73. The means for supporting and fixing the resonator 7 is not limited to the clamp portion 72 using the bolt 73, and any means that can reliably support the resonator 7 such as a mechanical clamp mechanism configured to be electrically controllable. It may be something like this.

  The action portion 40 is projected at a position f2 that is the maximum amplitude portion of the resonator 7, and in this embodiment, as shown in FIGS. 2 (c) and 3 (a), a lower surface as the action surface 40a. The visual shape and the cross-sectional shape are formed in a rectangular parallelepiped shape having a substantially rectangular shape. The action unit 40 causes the resonator 7 to resonate with the vibration of the vibrator 8 when the action surface 40 a contacts a predetermined region of the substrate 23 superimposed on a predetermined position of the substrate 24 held on the stage 10. The joining energy consisting of ultrasonic vibration by is applied to a predetermined region.

  In this embodiment, the action portion 40 is formed integrally with the resonator 7, but is made of a metal other than the same material as the resonator 7, such as carbide tungsten carbide, ceramics, and diamond. The formed working part 40 may be fixed to the resonator 7 with a screw or the like. If comprised in this way, when the action part 40 is damaged by abrasion etc., the action part 40 can be easily decompress | restored by replacing | exchanging the screwed action part 40. FIG.

  Also, a working surface 40a is formed by adhering a plate-like member such as tungsten carbide carbide, ceramics or diamond to the lower surface of the working portion 40 with a resin adhesive or a metal braze such as Ni, Cu, or Ag. May be. If comprised in this way, when the plate-shaped member which forms the action surface 40a is damaged by abrasion etc., the action part 40 is easily decompress | restored by replacing | exchanging the member stuck on the lower surface of the action part 40. be able to. In addition, a plate-shaped ceramic heater may be attached to the lower surface of the action portion 40 to form the action surface 40a. In this way, thermal energy is bonded from the action portion 40 together with ultrasonic vibration as bonding energy. Can be given to the subject.

  The holding mechanism 50 includes a holding body 51, and a substrate between the holding body 51 and the stage 10 so as to surround a predetermined area of the substrate 23 superimposed on a predetermined position of the substrate 24 held on the stage 10. 23 and 24 are held. As shown in FIGS. 2C and 3A, the sandwiching body 51 is substantially the center of a plate-like member that forms a sandwiching surface 51a that sandwiches the substrates 23 and 24 with the stage 10. An insertion window 52 that is substantially the same shape as the working surface 40a and is slightly larger than the working surface 40a is formed through the portion.

  In addition, a pair of bases 53 are provided on the base 71 of the support means 70 so as to sandwich the substantially central portion of the resonator 7 supported by the support means 70 from the front and the back. In the state where the action part 40 is inserted and the action surface 40a is exposed downward, the bolts 54 are inserted into the through-holes formed in the flange portions on both sides of the holding body 51 facing the lower surfaces of the pair of bases 53. Is attached to the base 53. At this time, as shown in FIG. 3A and FIG. 4A, the holding body 51 is attached to the base 53 with a gap d provided between the flange portions on both sides and the lower surface of the base 53. Thus, the holding body 51 moves up and down in the range of the gap d.

  That is, as shown in FIGS. 3A and 3B, in the state where the head portion 26 (resonator 7) is separated from the stage 10, the holding body 51 is moved down by its own weight, and the working surface 40a is narrow. The holding body 51 is almost in the same plane as the holding surface 51a or slightly immersed in the holding body 51 side. Further, as shown in FIGS. 4A and 4B, the head portion 26 is close to the stage 10 so that the holding surface 51a (substrate 23) is in contact with the stage 10 (substrate 24). When approaching the stage 10, the holding body 51 moves upward relative to the action part 40 in the range of the gap d. Therefore, in a state in which the action surface 40a of the action portion 40 is in contact with the predetermined area indicated by the dotted line A in FIG. 4B, the gap between the holding surface 51a of the holding body 51 and the stage 10 so as to surround the predetermined area. Both substrates 23 and 24 are held together.

  Further, a suction groove 55 for sucking and holding the substrate 23 is formed on the holding surface 51 a of the holding body 51 so as to surround the insertion window 52. Further, the holding body 51 is provided with a suction hole 56 in which one opening 56 a is formed at the bottom of a predetermined portion of the suction groove 55 and the other opening 56 b is formed on the outer surface of the holding body 51. . A valve of a suction unit 80 (partially omitted) having a vacuum pump disposed outside is connected to the other opening 56b of the suction hole 56, and is sucked from the other opening 56b by the suction unit 80. As a result, the substrate 23 is sucked and held on the holding surface 51 a of the holding body 51.

  Also, alignment marks 57 for alignment are provided at the four corners of the holding surface 51a of the holding body 51, and the alignment marks 57 and the alignment marks provided on the substrate 23 are recognized by the upper and lower mark recognition means 14. By adjusting the position, the substrate 23 is sucked and held at a predetermined position of the holding surface 51a.

  In this embodiment, the electrode pattern 23a is formed so that the bonding energy is applied to the region where the electrode pattern 23a is formed on the substrate 23 as the predetermined region to which the bonding energy is applied. The substrate 23 is held by the holding body 51 in a state where the aligned region and the working surface 40a are aligned with each other. Then, both substrates 23 and 24 in which the alignment of the electrode pattern 23 a of the substrate 23 held on the holding body 51 and the electrode pattern 24 a of the substrate 24 held on the stage 10 is recognized by the upper and lower mark recognition means 14. This is performed by controlling the stage table 12 of the mounting mechanism 28 by the control device 31 based on the position information.

  As described above, in this embodiment, the holding body 51 functions as the “holding portion” of the present invention, and the mounting mechanism 28 functions as the “position adjusting means” of the present invention.

3. Next, an example of the bonding operation by the ultrasonic vibration bonding apparatus 200 will be described.

  First, the holding body in a state where the substrate 23 transported by the substrate transporting device 16 is aligned so that bonding energy is applied from the working surface 40a of the working portion 40 to the region of the substrate 23 where the electrode pattern 23a is formed. 51 is held by suction on the holding surface 51a. Then, the upper and lower mark recognition means 14 is inserted by the recognition means moving table 15 between the substrate 23 and the substrate 24 held so that the bonding surfaces face each other, and for positioning the substrates 23 and 24 held opposite to each other. The alignment mark is recognized by the upper and lower mark recognition means 14.

  Subsequently, based on the recognized positional information of both the substrates 23 and 24, the stage 10 is moved in parallel and rotated by the stage table 12 with the position of the substrate 23 as a reference, thereby moving the position of the substrate 24. The electrode pattern 23a and the electrode pattern 24a of the substrate 24 are aligned, and the upper and lower marks are recognized in a state where the bonding positions of the substrates 23 and 24 are aligned (the positions of the electrode patterns 23a and 24a are aligned). The means 14 is saved by the recognition means moving table 15.

  Then, the vertical drive mechanism 25 starts the descent of the head part 26 from the standby position, and the position of the head part 26 detected by the head height detecting means 36 from the stage 10 reaches a predetermined height, and both the substrates 23. 24 (electrode patterns 23a, 24a) immediately before the head part 26 descends. Next, as shown in FIG. 4B, when the head portion 26 reaches a predetermined height and the substrates 23 and 24 come into contact with each other, based on the detection signal from the pressure sensor 32, the substrate 24 and the substrate 24 are moved. It is detected that a predetermined area indicated by a dotted line A of another substrate 23 superimposed at a predetermined position is held between the action surface 40a of the action portion 40 and the stage 10. At this time, both the substrates 23 and 24 are held together between the holding surface 51a of the holding body 51 and the stage 10 so as to surround the predetermined area A.

  Subsequently, the control device 31 controls the pressure applied to the predetermined area A of the substrates 23 and 24 by the head unit 26, and the predetermined area A of the substrates 23 and 24 is superposed from the operating surface 40a of the operating unit 40 to the predetermined area A. Bonding energy consisting of sonic vibration is given. In addition, the ultrasonic vibration is applied to both the substrates 23 and 24 while the amplitude detector 33 confirms that “slip” is generated between the contact surfaces of the both substrates 23 and 24, and the head portion 26 approaches the stage 10. It is controlled to (down).

  Next, when the joining of both the substrates 23 and 24 is completed, the suction holding of the substrate 23 by the holding body 51 is released, the return movement of the head unit 26 to the standby position is started, and the head unit 26 is moved to the standby position. The movement of the head part 26 is stopped when reaching. Subsequently, a new substrate 23 to be bonded to the substrate 24 held on the stage 10 is supplied to the head unit 26, and the supplied new substrate 23 is bonded to the substrate 24 and set to the substrate 24. When the bonding of the substrate 23 to all the bonded positions is completed, the substrate 24 held on the stage 10 in a state in which the substrate 23 is bonded is discharged by the substrate transfer conveyor 19 of the substrate transfer device 18 and the bonding operation is performed. finish.

  As described above, according to the above-described embodiment, when the substrate 23 is bonded to the predetermined position of the substrate 24 held on the stage 10, the substrate 24 and the other substrate 23 superimposed on the predetermined position of the substrate 24 are arranged. Bonding energy consisting of ultrasonic vibration is applied to the predetermined area A from the action surface 40a of the action part 40, but transmission of the joining energy from the action part 40 to the periphery of the predetermined area A is performed by the transmission blocking part consisting of the holding mechanism 50. Therefore, the bonding energy can be concentrated on the predetermined area A of both the substrates 23 and 24.

  Further, since both the substrates 23 and 24 are held between the holding surface 51a of the holding body 51 and the stage 10 so as to surround the predetermined area A by the holding mechanism 50, the working surface 40a of the working unit 40 is provided. Therefore, it is possible to reliably prevent the bonding energy applied to the predetermined area A from being transmitted to the periphery of the predetermined area A of both the substrates 23 and 24 beyond the holding portion by the holding mechanism 50.

  At this time, since the holding mechanism 50 holds both the substrates 23 and 24 together, it is possible to prevent the bonding energy from being transmitted to the periphery of the predetermined region A of the substrate 23 held by the holding body 51. The bonding energy can be concentrated on the predetermined area A of the substrate 24.

  Further, the electrode pattern 23a formed on the substrate 23 held by the holding body 51 is aligned with the electrode pattern 24a formed at a predetermined position of the substrate 24 held by the stage 10, and the both substrates 23, 24 are joined. In this case, the substrate 23 is held by the sandwiching body 51 in a state in which the region where the electrode pattern 23a of the substrate 23 is formed is set as a predetermined region and the bonding energy is applied from the working surface 40a of the working unit 40. The mounting mechanism 28 aligns the electrode pattern 23a of the substrate 23 held on the holding body 51 and the electrode pattern 24a of the substrate 24 held on the stage 10, so that the bonding energy at the time of bonding is reduced. It can concentrate and give to the area | region in which the electrode patterns 23a and 24a of both the boards 23 and 24 were formed.

  Further, the substrate 23 is held by the holding body 51 in a state where the working surface 40 a of the working unit 40 and the electrode pattern 23 a of the board 23 are aligned, and the electrode of the substrate 23 held by the holding body 51. Since the positioning of the pattern 23a and the electrode pattern 24a of the substrate 24 held on the stage 10 is performed by the mounting mechanism 28, the action surface 40a of the action portion 40, the electrode pattern 23a of the substrate 23, and the electrode pattern 24a of the substrate 24 Can be easily aligned, and it is possible to concentrate the region where the electrode patterns 23a and 24a of both the substrates 23 and 24 are formed and to apply the bonding energy from the working surface 40a. Accordingly, in order to give bonding energy from the working surface 40a to the region where the electrode patterns 23a and 24a of both the substrates 23 and 24 are formed, the electrode pattern of the substrate 23 is applied before the step of applying the bonding energy as in the prior art. Since the step of temporarily attaching the substrate 23 to the substrate 24 with a conductive film or the like is not necessary in a state where the electrode pattern 24a of the substrate 24 and the substrate 24 are aligned, the substrate 23 can be efficiently bonded to a predetermined position on the substrate 24. it can.

  In addition, by providing the action portion 40 in the resonator 7, at least ultrasonic vibration caused by ultrasonic vibration of the resonator 7 can be easily applied to the predetermined region A as the bonding energy by the action portion 40. Is.

Second Embodiment
A second embodiment of the joining apparatus of the present invention will be described with reference to FIG. FIG. 5 is a right side sectional view of the resonator 7 in the second embodiment of the ultrasonic vibration bonding apparatus 200, in which (a) is a sectional view taken along line AA in FIG. c) are schematic views showing different states in a state where the substrate 23 is held.

  This embodiment differs from the first embodiment described above in that the urging means 58 is formed on the holding mechanism 50 by a spring having an urging force in a direction in which the base 53 and the holding body 51 are separated from each other. Is further provided. Since other configurations and operations are the same as those in the first embodiment, description of the configurations and operations is omitted by assigning the same reference numerals.

  As shown in FIG. 5 (a), a hole for disposing the biasing means 58 is further formed on the lower surface of the base 53 provided in the support means 70. For example, the biasing means is formed by a spring. 58 is inserted into the hole. The urging means 58 urges the holding body 51 in a direction away from the base 53 by the tip of the urging means 58 protruding from the hole coming into contact with the upper surface of the holding body 51.

  If comprised in this way, while having the same effect as above-mentioned 1st Embodiment, there can exist the following effects. That is, as shown in FIG. 5C, when the substrates 23 and 24 are held by the holding body 51 and the bonding energy is applied to the predetermined region A by the action part 40, the predetermined values of both the substrates 23 and 24 are obtained. Since the force held by the holding surface 51a of the holding member 51 and the stage 10 so as to surround the region A is increased by the urging force of the urging means 58, the bonding energy from the action portion 40 is more reliably increased. Transmission to the periphery of the predetermined area A of the substrates 23 and 24 can be prevented.

  In this embodiment, the urging means 58 is formed by a spring. However, the urging means 58 is not limited to this configuration, and a magnet is provided so as to repel the base 53 and the holding body 51, respectively. The biasing means 58 may be formed or biased by providing an air cylinder in a hole formed in the lower surface of the base 53 so as to have a driving force in a direction in which the holding body 51 is separated from the base 53. The means 58 may be formed. If the holding body 51 can be urged away from the base 53, the urging means 58 is formed by using a member having elasticity such as rubber. May be.

<Third Embodiment>
A third embodiment of the joining apparatus of the present invention will be described with reference to FIG. FIG. 6 is an enlarged view of a main part of the ultrasonic vibration bonding apparatus 200 according to the third embodiment. FIGS. 6A and 6B are schematic views showing different states in which the substrate 23 is held.

  This embodiment differs from the second embodiment described above in that an adsorption mechanism (not shown) is provided by forming an adsorption hole in the action portion 40 provided in the resonator 7. In comparison, a small chip component 123 or the like is attracted and held on the action surface 40 a of the action part 40 and joined to a predetermined position on the substrate 24. Since other configurations and operations are the same as those of the second embodiment described above, description of the configurations and operations is omitted by assigning the same reference numerals.

  As shown in FIG. 6A, the chip component 123 is sucked and held on the working surface 40 a of the working unit 40, and the electrode 123 a formed on the chip component 123 and the electrode pattern 24 a formed at a predetermined position on the substrate 24. Is aligned. Then, as shown in FIG. 6B, bonding energy is given to the chip component 123 and the predetermined region A of the substrate 24 from the action part 40 in a state where the chip component 123 is superimposed on the predetermined position of the substrate 24, and the chip The component 123 is bonded to a predetermined position on the substrate 24.

  With this configuration, as shown in FIG. 6B, when the bonding energy is applied to the predetermined area A of the chip component 123 and the substrate 24 from the action portion 40, the holding body 51 is surrounded so as to surround the predetermined area A. Since the substrate 24 is held between the holding surface 51 a and the stage 10, it is possible to prevent the bonding energy from the action part 40 from being transmitted to the periphery of the predetermined region A of the substrate 24, and the periphery of the predetermined region A of the substrate 24. Since the force for pinching is increased by the urging force of the urging means 58, the same effect as in the second embodiment described above can be obtained.

  In this embodiment, the urging means 58 is provided in the holding mechanism 50 as in the second embodiment, but the urging means 58 is not provided as in the first embodiment. Of course as well.

<Fourth embodiment>
A fourth embodiment of the joining apparatus of the present invention will be described with reference to FIG. FIG. 7 is a right side cross-sectional view of the resonator 7 in the fourth embodiment of the ultrasonic vibration bonding apparatus 200, where (a) is a cross-sectional view taken along line AA in FIG. 2 (c), and (b), ( c) are schematic views showing different states in a state where the substrate 23 is held.

  This embodiment differs from the first embodiment described above in that it further includes a cutting means 90 for cutting at least a part of the substrate 23 when the holding mechanism 50 is in the holding state of both the substrates 23 and 24. It is a point. Since other configurations and operations are the same as those in the first embodiment, description of the configurations and operations is omitted by assigning the same reference numerals.

  As shown in FIG. 7A, in this embodiment, the cutting means 90 is fixedly provided so that the cutting edge of the cutting blade faces downward along the inner surface of the insertion window 52 of the holding body 51. . Therefore, as shown in FIGS. 4A and 4B, if the holding body 51 is in the downward movement state, the cutting edge of the cutting means 90 is immersed in the holding body 51 side, and FIG. If the holding body 51 is in the upward movement state, the cutting edge of the cutting means 90 is in a state protruding from the holding surface 51 a of the holding body 51.

  With this configuration, as shown in FIG. 7B, the substrate 23 is sucked and held on the holding surface 51 a of the holding body 51, and the electrode pattern 23 a formed on the substrate 23 and a predetermined position of the substrate 24. Alignment with the electrode pattern 24a formed on is performed. Then, as shown in FIG. 5C, when the holding of the substrates 23 and 24 by the action unit 40 and the stage 10 in a state where the substrate 23 is superimposed on a predetermined position of the substrate 24 is started, the support is performed. The cutting means 90 also moves downward along with the downward movement of the means 70 (resonator 7), whereby the cutting edge of the cutting blade protrudes from the holding surface 51a, and the substrate 23 is cut by the cutting blade from which the cutting edge protrudes.

  As described above, according to this embodiment, the same effects as those of the first embodiment described above can be obtained, and when the holding mechanism 50 is in the holding state of both the boards 23 and 24, the board 23 is provided. Since at least a part of the substrate 23 is cut by the cutting means 90, unnecessary portions of the substrate 23 can be cut when the substrate 23 is bonded to a predetermined position of the substrate 24, which is efficient.

  In addition, it is good also as a structure provided with the biasing means 58 in the holding mechanism 50 similarly to above-mentioned 2nd Embodiment. Moreover, it is good also as a structure which provides the cutting | disconnection means 90 in this embodiment in the above-mentioned 3rd Embodiment, In this case, the board | substrate 24 etc. which were provided in the small components hold | maintained at the action surface 40a of the action part 40 are used. Can be cut when the parts are joined to a predetermined position. Further, when the substrate 24 is a lead frame substrate, the lead portion of the substrate 24 may be cut together with the substrate 23 by the cutting means 90.

  Further, the cutting blade provided in the cutting means 90 includes various cutting blades such as high carbon steel, carbon tool steel, alloy tool steel, high speed steel, sintered high speed steel, cemented carbide, ceramics, cermet, and industrial diamond. The material can be formed of a material, and the material may be appropriately selected according to the type of the object to be cut and the required size of the cut piece. Also, the cutting edge may be coated with a hard material such as titanium nitride, titanium carbonitride, titanium aluminum nitride, aluminum chrome nitride by chemical vapor deposition (CVD) or physical vapor deposition (PVD). Good.

  Further, a cutting blade as a cutting means may be formed integrally with the action portion 40 so that the blade tip faces the workpiece and the substrate. In this way, since the ultrasonic vibration is applied when the substrates 23 and 24 are cut by the cutting blade, the substrates 23 and 24 can be efficiently cut.

<Fifth Embodiment>
A fifth embodiment of the joining apparatus of the present invention will be described with reference to FIG. FIG. 8 is a partial bottom view of the action part 140 provided in the resonator 7 in the fifth embodiment of the ultrasonic vibration bonding apparatus 200, and FIG. 8A is a partial bottom view of the action part 140 and the holding body 151. (B) is a figure which shows the state by which the flexible substrate 223 was hold | maintained at the holding body 151. FIG.

  This embodiment is different from the first to fourth embodiments described above in that the shape of the insertion window 152 formed in the action surface 140a of the action part 140 and the holding member 151 is different. Other configurations and operations are the same as those in the first to fourth embodiments described above, and therefore, description of the configurations and operations is omitted by assigning corresponding reference numerals.

  As shown in FIG. 8A, in this embodiment, two strip-shaped action surfaces 140a are projected on the tip surface of the action part 140, and the holding member 151 has a shape of the action surface 140a. Two corresponding insertion windows 152 are formed. Further, a suction groove 155 for holding the flexible substrate 223 by suction is formed between the two insertion windows 152 of the holding surface 151a of the holding body 151 (opening is not shown).

  If comprised in this way, as shown in FIG.8 (b), the clamping surface 151a of the clamping body 151 in the state which the electrode pattern 223a formed in the both sides of the flexible substrate 223 and the action surface 140a were aligned. The flexible substrate 223 is sucked and held to align the electrode pattern 223a formed on the flexible substrate 223 with the electrode pattern 24a formed on the substrate 24 at a predetermined position. Then, in a state where the flexible substrate 223 is overlaid at a predetermined position of the substrate 24, bonding energy is given from the action part 140 to a predetermined region (region where the electrode pattern 223a is formed) of the flexible substrate 23, and the flexible substrate 223 is then mounted on the substrate. It is joined to 24 predetermined positions.

  As described above, according to this embodiment, the same effects as those of the first embodiment described above can be obtained, and the bonding energy is concentrated and applied to the region where the electrode pattern 223a of the flexible substrate 223 is formed. Therefore, since the transmission of bonding energy to the periphery of the region where the electrode pattern 223a is formed is suppressed, for example, even if the electronic element is already mounted on the central portion of the flexible substrate 223, the flexible substrate 223 is not attached to the substrate 24. It is possible to prevent the electronic element mounted on the flexible substrate 223 from being damaged by the bonding energy when bonded to the predetermined position.

  The present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit thereof. For example, in the above-described embodiment, the operation surface The insertion windows 52 and 152 are formed so that the entire peripheries of 40a and 140a are surrounded by the sandwiching bodies 51 and 151. The holding bodies 51 and 151 need only be formed so as to surround the surfaces 40a and 140a, and the holding bodies 51 and 151 do not necessarily have to be formed so as to surround the entire circumference of the working surfaces 40a and 140a.

  In the above-described embodiment, the suction mechanism by suction with a vacuum pump is described as an example of the configuration for holding the substrate 23, the chip component 123, etc., but the configuration for holding the substrate 23, the chip component 123, etc. However, the present invention is not limited to this, and it is possible to hold the substrate 23, the chip component 123, and the like on the head unit 26, such as an adsorption mechanism using electrostatic adsorption, a holding mechanism using a mechanical chuck mechanism, or a holding mechanism using magnetic force by a magnet. Anything is possible if possible.

  The shape, material, size, and the like of the resonator 7 described above are merely examples, and the resonator 7 may be formed in any manner. Further, the position of the resonator 7 where the action portions 40 and 140 are provided is not limited to the central portion. For example, the action portions 40 and 140 may be provided on the peripheral surface portion of the side end of the resonator 7 or other than the maximum amplitude portion. You may provide the action parts 40 and 140 in these places.

The substrate held by the stage 10 may be any substrate such as a printed circuit board, a glass substrate, a flexible substrate, a film substrate, a wafer, a lead frame substrate, a metal foil substrate, a single layer and a multilayer resin substrate. Good. In addition, as an object to be bonded to the substrate held on the stage 10, a semiconductor substrate, a resin substrate, a flexible substrate, a film substrate, a chip obtained by dicing these substrates, an electronic component, an electrical component, or a lead frame substrate As long as various parts such as metal foil, metal bar, tab-shaped lead electrode, (coating) electric wire can be bonded to the substrate and the material of the bonded portion can be bonded by applying ultrasonic vibration Any thing is acceptable. For example, metal melt bumps or wiring patterns formed on wafers or chips formed of Si, SiO ₂ , glass, lithium ionic acid, oxide single crystal (LT), ceramic oxide, etc. Can be joined.

  In the above-described embodiment, the ultrasonic vibration bonding apparatus 200 has been described as an example of the bonding apparatus according to the present invention. However, by applying bonding energy consisting of heat from the action portion, an object to be bonded at a predetermined position on the substrate. Of course, the present invention may be applied to a joining apparatus that joins by thermocompression bonding, melts and joins a soldering material such as solder, or joins by curing a thermosetting adhesive.

  In the embodiment described above, the holding bodies 51 and 151 are made of the same material as that of the resonator 7. However, the material forming the holding bodies 51 and 151 may be made of a material different from that of the resonator 7. Alternatively, the holding bodies 51 and 151 may be formed of a vibration absorbing member such as sponge or urethane rubber. In this way, it is possible to efficiently prevent the joining energy composed of ultrasonic vibrations from being transmitted to the periphery of the predetermined region A beyond the holding bodies 51 and 151.

  Further, the sandwiching bodies 51, 151 may be formed of a heat insulating material such as urethane resin, phenol resin, or polystyrene foam, or the sandwiching bodies 51, 151 may be formed in a shape having a heat sink structure (cooling plate). If comprised in this way, it can prevent efficiently that the joining energy which consists of heat | fever passes over the holding bodies 51 and 151 and transmits to the predetermined area | region A periphery.

  In the above-described embodiment, the object to be bonded is held on the holding surfaces 51 and 151 or the action surface 40a of the action part 40, and the position of the held object to be bonded and the substrate is adjusted (aligned). The structure is such that the object to be bonded is bonded to a predetermined position of the substrate, but the position adjustment between the substrate and the object to be bonded is performed first, and the substrate and the object to be bonded are in close proximity, or the substrate In a state where an object to be bonded is temporarily attached to the predetermined position of the substrate by pressing with the action surface of the action portion and applying bonding energy composed of ultrasonic vibration or heat to the predetermined area A, the predetermined position of the substrate The article to be joined may be joined to the joint.

  In addition, pin-shaped convex portions are provided as alignment marks on the holding surfaces 51a and 151a of the holding bodies 51 and 151, and the alignment holes formed in the substrate when the substrate is supplied to the holding bodies 51 and 151. The pinching protrusions 51a and 151a provided on the pinching surfaces 51a and 151a may be inserted into the pinching surfaces 51a and 151a to align the pinching bodies 51 and 151 with the substrate.

  In addition, for example, when joining an object to be joined to a lead frame substrate by applying ultrasonic vibration from the action part, by transmitting the ultrasonic vibration from the action part to the lead part of the lead frame substrate, the lead part is The action part may function as a cutting means so as to be broken and cut by ultrasonic vibration.

  In addition, vacuum holes are provided on the inner surface of the insertion window of the holding body that surrounds the action part of the resonator, and suction is performed by a suction unit provided outside, so that dust or dust generated during joining is sucked from the vacuum hole. You may make it remove.

7 Resonator 10 Stage 23 Other substrate (bonded object)
23a Electrode pattern 24 Substrate 24a Electrode pattern 26 Head (head)
28 Mounting mechanism (position adjustment means)
40,140 action part 50 nipping mechanism (transmission blocking part)
51,151 Nipping body (holding part)
90 cutting means 123 chip parts (bonded objects)
223 Flexible substrate (bonded object)
200 Ultrasonic vibration bonding device (bonding device)
A Predetermined area

Claims (6)

In a bonding apparatus for bonding an object to be bonded to a predetermined position of a substrate,
A stage for holding the substrate;
An action part that applies bonding energy consisting of at least ultrasonic vibration or heat to a predetermined region of the substrate and the object to be bonded superimposed on a predetermined position of the substrate, and the bonding energy from the action part around the predetermined region And a head provided with a transmission blocking portion for blocking the transmission of the bonding device. The transmission blocking unit is
The bonding apparatus according to claim 1, further comprising: a holding mechanism that holds the substrate between the holding body and the stage so as to surround the predetermined region.   The bonding apparatus according to claim 2, wherein the holding mechanism holds the object to be bonded together with the substrate.   The joining apparatus according to claim 2 or 3, further comprising a cutting means for cutting at least a part of the object to be joined when the holding mechanism is in a holding state. In the joining apparatus in any one of Claims 1 thru | or 4,
An apparatus for aligning an electrode pattern formed on another substrate as the object to be bonded with an electrode pattern formed at a predetermined position of the substrate, and bonding the other substrate to the substrate,
The head includes a holding unit that holds the other substrate in a state where the bonding energy is applied to the region where the electrode pattern of the other substrate is formed as the predetermined region by the action unit. Further provided,
A joining apparatus further comprising position adjusting means for aligning the electrode pattern of the other substrate held by the holding unit with the electrode pattern of the substrate. The head includes a resonator provided with the action portion,
The joining device according to claim 1, wherein the action unit applies, as the joining energy, at least ultrasonic vibration caused by ultrasonic vibration of the resonator to the predetermined region.

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