JP2008078272A - Ultrasonic vibration welding apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ultrasonic vibration welding apparatus where a holder and a heater are disposed that the structure of a horn will not become complex. <P>SOLUTION: The ultrasonic vibration welding apparatus 1 is equipped with an ultrasonic mounting tool 60, which is provided with a vibrator 9A that generates ultrasonic vibration, a horn 9B, and a holder 3 provided to the horn 9B to hold a bonding target, heaters 12A and 12B which are inserted into heater insertion holes 16A and 16B that are provided to the horn 9B, and a support member 11 which supports the ultrasonic mounting tool 60. The bonding target 100 held by the holder 3 is bonded to a bonded target 102, by vibrating the horn 9B, and pressing the bonding target 100 against the bonded target 102. The heater insertion holes 16A and 16B are formed between a part of the horn 9B, supported by the support member 11 and the holder 3. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an ultrasonic vibration bonding apparatus.

  As one means for joining an electronic component such as an IC chip to an electric wiring board, a means using an ultrasonic vibration joining apparatus is known. This ultrasonic vibration bonding apparatus causes the electric wiring board to vibrate in parallel by ultrasonic vibration while pressing the electronic component against the electric wiring board. The electronic component is joined to the electric wiring board by friction generated between the electronic component and the electric wiring board by the parallel vibration.

  The ultrasonic vibration bonding apparatus has a horn that transmits vibration of an ultrasonic vibrator, which is a generation source of vibration, to an electronic component, holds the electronic component in this horn, and vibrates while pressing against an electric wiring board. It is configured.

  The horn is formed to have a length that is an integral multiple of a half wavelength of the vibration so as to resonate with the ultrasonic vibration and amplify the vibration. In order to efficiently transmit the vibration of the horn to the electronic component, a holding portion for holding the electronic component is provided at a position corresponding to the abdominal portion of the vibration where the vibration is the largest in the horn. Further, the horn is supported with respect to the main body of the ultrasonic vibration bonding apparatus at a position corresponding to the vibration node where vibration is minimized in the horn. Since the vibration amplitude of the node portion is small, the amount of relative movement with respect to the main body portion is small, and the horn can be reliably supported by supporting the horn with this node portion.

  By the way, it is generally known that by applying heat between the electronic component and the electric wiring board, the bonding time between the electronic component and the electric wiring board can be shortened and the bonding strength can be enhanced. Therefore, the horn may be provided with a heater for the purpose of heating between the electronic component and the electric wiring board.

  For example, in the ultrasonic vibration bonding apparatus disclosed in Patent Document 1, a holding portion that holds an electronic component is provided on the abdomen of the horn, and the horn is supported on the main body at the node portion. And the structure which arrange | positions a heater and a holding part side by side in the thickness direction of a horn is disclosed.

Japanese Patent No. 3687638 (see FIG. 2 etc.)

  However, in general, a horn exhibits a columnar body having a thickness of about 2 cm. The holding portion is provided with a configuration such as a suction hole as a configuration for holding the electronic component by sucking air. Therefore, if the holding part and the heater are provided in the thickness direction so that the structures of the two do not interfere with each other, there is a problem that the structure of the holding part and the heater becomes complicated as described in Patent Document 1.

  Accordingly, an object of the present invention is to provide an ultrasonic vibration bonding apparatus in which a holding portion and a heater are arranged so that the structure of the horn is not complicated.

  In order to solve the above-described problems, an ultrasonic vibration bonding apparatus according to the present invention includes an ultrasonic mounting including a vibrator that generates ultrasonic vibration, a horn, and a holding unit that is provided in the horn and holds an object to be bonded. A tool, a heater that is passed through a heater insertion hole formed in the horn, and a support member that supports the ultrasonic mounting tool, while pressing the object to be joined held by the holding unit against the object to be joined In the ultrasonic vibration bonding apparatus for bonding an object to be bonded to an object to be bonded by vibrating the horn, the heater insertion hole is formed between the position supported by the support member of the horn and the holding portion. And

  By configuring the ultrasonic vibration bonding apparatus in such a configuration, the holding unit and the heater can be arranged so that the structure of the horn is not complicated.

  Further, in addition to the above-described invention, in another aspect of the invention, the holding portion is disposed on the abdomen of vibration of the horn, and the support member is a node of vibration of the horn. The ultrasonic mounting tool is supported at the adjacent node.

  By configuring the ultrasonic vibration bonding apparatus with such a configuration, the degree of freedom of the arrangement and configuration of the heater insertion hole, the holding unit and the support unit is increased, and the holding unit is used as a vibration abdomen of the horn. By arranging in, it is possible to effectively give vibration to the object to be joined. In addition, the ultrasonic mounting tool can be stably supported by disposing the support position of the horn by the support member at the vibration node. Furthermore, since the abdomen where the holding portion is disposed and the node where the support member supports the ultrasonic mounting tool are adjacent to each other, vibrations can be effectively applied to the objects to be joined, and the ultrasonic wave The minimum distance at which the mounting tool can be supported stably. That is, in addition to the high degree of freedom in the arrangement and configuration of the support position of the ultrasonic mounting tool by the heater insertion hole, the holding part and the support member, the size of the ultrasonic vibration bonding apparatus is suppressed, and the object to be bonded It is possible to effectively give vibration to an object and to stably support the ultrasonic mounting tool.

  In another invention, in addition to the above-described invention, the heater insertion hole has a gap with respect to a portion of the heater that is passed through the heater insertion hole.

  By configuring the ultrasonic vibration bonding apparatus in such a configuration, stress due to vibration of the horn transmitted to the heater can be weakened.

  In addition to the above-mentioned invention, in another invention, the horn is formed in an attachment member insertion hole through which an attachment member for attaching the horn to the support member is inserted, and in the holding portion for sucking an object to be joined to the holding portion. The suction hole is formed, and the heater insertion hole is formed substantially at the center between the attachment member insertion hole and the suction hole.

  By forming the heater insertion hole of the ultrasonic vibration bonding apparatus at the approximate center between the attachment member insertion hole and the suction hole, the distance between the heater insertion hole and the attachment member insertion hole, and the heater insertion hole and the suction hole Can be sufficiently spaced. Therefore, it becomes easy to perform the drilling process for forming each hole.

  In order to solve the above-described problems, an ultrasonic vibration bonding apparatus according to the present invention includes an ultrasonic mounting including a vibrator that generates ultrasonic vibration, a horn, and a holding unit that is provided in the horn and holds an object to be bonded. A tool, a heater that is passed through a heater insertion hole formed in the horn, and a support member that supports the ultrasonic mounting tool, and the horn while pressing the object to be joined held by the holding unit against the object to be joined In the ultrasonic vibration bonding apparatus that bonds the object to be bonded to the object to be bonded by vibrating the heater, the heater insertion hole is formed between the position supported by the support member of the horn and the free end of the horn. I will do it.

  By configuring the ultrasonic vibration bonding apparatus in such a configuration, the holding unit and the heater can be arranged so that the structure of the horn is not complicated.

  ADVANTAGE OF THE INVENTION According to this invention, the ultrasonic vibration joining apparatus by which the holding | maintenance part and the heater are arrange | positioned so that the structure of a horn may not be complicated can be provided.

(First embodiment)
An ultrasonic vibration bonding apparatus 1 according to a first embodiment of the present invention will be described with reference to FIGS. 1 and 2.

  FIG. 1 shows the entire configuration of an ultrasonic vibration bonding apparatus 1 and a process of bonding an IC chip 100 that is a bonding target to a flexible substrate 101 that is a bonding target using the ultrasonic vibration bonding apparatus 1. It is a figure for demonstrating the outline of the apparatus used. FIG. 2 is a diagram illustrating a configuration of the vibration device 2 provided in the ultrasonic vibration bonding device 1.

  The ultrasonic vibration bonding apparatus 1 receives the supply of the IC chip 100 from the supply apparatus 200 and bonds the supplied IC chip 100 to the flexible substrate 101.

  First, an outline of a supply process in which the ultrasonic vibration bonding apparatus 1 receives supply of the IC chip 100 from the supply apparatus 200 will be described with reference to FIG. In addition, the configuration of the supply device 200 will be described together.

  The configuration of the supply device 200 that supplies the IC chip 100 to the ultrasonic vibration bonding apparatus 1 is roughly as follows. The supply device 200 includes an IC chip mounting table 201 on which a plurality of IC chips 100 are mounted, and a supply mechanism that supplies the IC chip 100 mounted on the IC chip mounting table 201 to the ultrasonic vibration bonding apparatus 1. 202.

  In the following description, a surface parallel to the surface on which the IC chip 100 is placed is defined as a horizontal plane, and a direction perpendicular to the surface is defined as a vertical direction. 1 is the front side (front), the back side is the rear side (rear), the right hand side is the right side (right side) and the left hand side is the left side (left side) from the front side toward the rear side. Will be described. That is, in FIG. 1, the X direction is the vertical direction and the Y direction is the horizontal direction.

  The IC chip 100 is mounted on the IC chip mounting table 201 while being accommodated in the container P. A plurality of IC chips 100 are accommodated in the container P, and the supply device 202 supplies the IC chips 100 from the container P to the ultrasonic bonding apparatus 1 one by one. In addition, a plurality of IC chips 100 may be formed as diced wafers and placed on the IC chip placement table 200 in the wafer state. Alternatively, the IC chip 100 is intermittently transported on the IC chip mounting table 201 while being repeatedly moved and stopped from the front to the rear by a transport mechanism such as a belt conveyor (not shown). The chips 100 may be supplied to the ultrasonic vibration bonding apparatus 1 one by one by the supply mechanism 202.

  The supply mechanism 202 includes an arm 203, a rotation mechanism 203A that rotates the arm 203, and a vertical drive unit 204 that moves the arm 203 up and down. The arm 203 is attached to an arm support rod 205 extending downward from the vertical drive unit 204 via a rotation mechanism 203A. In the arm drive unit 204, a motor (or an air cylinder or a hydraulic cylinder) (not shown) that drives the arm support rod 205 in the vertical direction is provided. Then, the arm 203 is moved in the vertical direction by the arm support rod 205 being displaced in the vertical direction by this motor (not shown).

  The rotation mechanism 203A includes a motor (not shown) fixed to the arm support rod 205 and a pair of bevel gears (not shown) whose rotation axes are orthogonal to each other. Of the pair of bevel gears (not shown), one bevel gear (not shown) is supported on the output shaft of a motor (not shown), and the other bevel gear (not shown) supports the arm 203. . When a motor (not shown) of the rotating mechanism 203A is driven, the arm 203 is rotated in a horizontal plane around the arm support rod 205 by a pair of bevel gears (not shown), and the arm 203 itself is horizontally It rotates around the axis in the direction along the direction.

  A pickup 206 that picks up the IC chip 100 placed on the IC chip mounting table 201 by sucking air is provided at the tip of the arm 203. A suction hole (not shown) through which air is sucked in by an air suction device (not shown) is formed in the lower surface portion 206A of the pickup 206 facing the IC chip mounting table 201. The IC chip 100 is picked up from the IC chip mounting table 201 by the air suction force by the suction holes (not shown).

  The supply apparatus 200 configured as described above supplies the IC chip 100 to the ultrasonic vibration bonding apparatus 1 as follows.

  First, the IC chip 100 on the IC chip mounting table 201 is sucked into the lower surface portion 206 </ b> A of the pickup 206. In other words, the arm support rod 205 is displaced downward by the arm driving unit 204, and the lower surface portion 206A of the pickup 206 is brought close to and opposed to the IC chip 100. Then, the IC chip 100 is adsorbed by the air suction force of a suction hole (not shown) formed in the lower surface portion 206A of the pickup 206.

  Subsequently, the arm support rod 205 is displaced upward by the arm driving unit 204 while the IC chip 100 is attracted to the pickup 206. At the same time, the arm 203 is rotated in the horizontal direction around the arm support rod 205 by the rotation mechanism 203A, and the pickup 206 is moved to the ultrasonic vibration bonding apparatus 1 side. At the same time, the arm 203 rotates about an axis in the horizontal direction, the pickup 206 that sucks the IC chip 100 is turned upside down, and the lower surface portion 206A that sucks the IC chip 100 faces upward.

  In the present embodiment, the supply device 200 is disposed so as to be located on the left front side with respect to the ultrasonic vibration bonding device 1, and the arm 203 is moved from the position where the pickup 206 sucks the IC chip 100 to the arm 203. When the support rod 205 is rotated 90 degrees in the horizontal direction toward the ultrasonic vibration bonding apparatus 1 side, the arm 203 is rotated 180 degrees around the axis in the horizontal direction, and the pickup 206 is turned upside down, the IC The chip 100 is configured to face a welding tool part 3 as a holding part described later.

  The IC chip mounting table 201 is configured to move back and forth and right and left by a driving mechanism (not shown) so that the IC chips 100 housed in the container P are sequentially sucked by the pickup 206 one by one. ing.

  As will be described later, a suction hole 3 </ b> A (see FIG. 2) that is an air suction hole is formed in the joining tool portion 3, as in the pickup 206. In the suction hole 3A, air is sucked by an air suction device (not shown), and the IC chip 100 is sucked by sucking the air. The joining tool unit 3 may be configured to hold the IC chip 100 by suction of air, to be configured to hold the IC chip 100 by a chuck mechanism, or to be magnetized by a magnetic force.

  In a state where the IC chip 100 adsorbed by the pickup 206 is opposed to the welding tool unit 3 in proximity or contact, the suction force for adsorbing the IC chip 100 of the pickup 206 is weakened. Then, the IC chip 100 is attracted from the pickup 206 to the joining tool part 3 side by the suction force of the joining tool part 3.

  By the way, the IC chip 100 is placed on the IC chip mounting table 201 with the side to be joined to the flexible circuit board 101 facing upward. Therefore, when the pickup 206 is turned upside down by the rotation mechanism 203A, the IC chip 100 attracted to the pickup 206 is directed downward on the side bonded to the flexible circuit board 101. When the IC chip 100 is attracted to the joining tool portion 3 in this orientation, the side to be joined to the flexible circuit board 101 is directed to the flexible circuit board 101 side.

  As described above, the IC chip 100 is supplied from the supply device 200 to the ultrasonic vibration bonding apparatus 1.

  Next, the configuration of the ultrasonic vibration bonding apparatus 1 will be briefly described.

  As shown in FIG. 1, the ultrasonic vibration bonding apparatus 1 includes a flexible circuit board mounting table (hereinafter referred to as “FPC mounting table”) 4 on which a flexible circuit board 101 is mounted, and an IC chip 100. A pressing vibration device 5 that presses and vibrates the flexible circuit board 101 is provided. Both the FPC mounting table 4 and the pressing vibration device 5 are attached to the gantry 6. The pressing vibration device 5 is attached to the gantry 6 by a support member (not shown).

  A flexible circuit board 101 having a strip shape supplied to the upper surface of the FPC mounting table 4 through the rear side of the supply device 200 is repeatedly moved and stopped from the left side to the right side on the FPC mounting table 4. A conveyance device (not shown) that conveys intermittently is provided.

  The flexible circuit board 101 mounted on the FPC mounting table 4 is, for example, a copper foil on a tape for a so-called COF (Chip On Film or Chip On Flexible Circuit Board) which is made of a flexible thin resin film such as polyimide. Wiring, electrode terminals, etc. are formed by the above. Specifically, as shown in FIG. 3, it has a strip shape in which a plurality of identical unit substrates 102 are continuously formed. Each unit substrate 102 has a predetermined wiring pattern 102a and electrode terminals 102b formed in advance on the surface thereof. In addition, on both sides of the flexible circuit board 101, a perforation 101a that engages with a feed gear provided in a transport device (not shown) is formed.

  When the IC chip 100 is stacked on the unit substrate 102, the electrode terminal 102b and the IC chip 100 are arranged such that the electrode terminal 102b of the unit substrate 102 and the electrode terminal (not shown) on the IC chip 100 side are in contact with each other and overlap. A side electrode terminal (not shown) is provided. Then, in a state where the electrode terminals (not shown) of the IC chip 100 overlap the electrode terminals 102b of the unit substrate 102, the IC chip 100 is vibrated while being pressed against the unit substrate 102, as will be described later. The electrode terminal 102b of the unit substrate 102 and the electrode terminal (not shown) of the IC chip 100 are joined to each other. That is, the IC chip 100 is bonded to the flexible circuit board 101 to form a COF.

  The pressing vibration device 5 includes a vibration device 2 and a lifting device 7.

  The vibration device 2 includes an ultrasonic mounting tool 60 and the like. The ultrasonic mounting tool 60 includes a vibrator 9A including a vibration element 8 that oscillates ultrasonic vibration and a horn 9B. The vibration element 8 is configured to oscillate ultrasonic vibration by a piezoelectric effect when a DC voltage is applied to a piezoelectric element such as piezoelectric ceramics. The vibration element 8 may be configured to oscillate ultrasonic vibrations by the magnetostrictive effect.

  The ultrasonic mounting tool 60 as a whole has a rectangular column that is long in the left-right direction, and is densely formed from a material such as an iron alloy, a silver alloy, a copper alloy, a titanium alloy, or an aluminum alloy rather than a porous material. The length of the horn 9 </ b> B in the longitudinal direction is set to a length of 1.0 times the wavelength when the vibration input from the vibration element 8 propagates through the horn 9. The vibrator 9A is also formed from a high-density material such as an iron alloy, a silver alloy, a copper alloy, a titanium alloy, or an aluminum alloy. The length in the longitudinal direction of the vibrator 9 </ b> A is set to 0.5 times the vibration oscillated from the vibration element 8. That is, the ultrasonic mounting tool 60 is configured to be 1.5 times as long as the vibration oscillated from the vibration element 8 as a whole.

  By forming the vibrator 9A and the horn 9B densely rather than porous, it is possible to suppress vibration attenuation and transmit the vibration to the horn 9B. In addition, by setting the length of the horn 9B to an integral multiple of half the wavelength of the vibration propagating through the ultrasonic mounting tool 60, the vibration input to the horn 9B resonates within the horn 9B, resulting in vibration. Amplified. The horn 9B is not limited to a quadrangular column, and may be a cylindrical body or a hexagonal column.

  In the present embodiment, as described above, the horn 9B is set to a length that is 1.0 times the wavelength of vibration of the vibration element 8, but is not limited thereto, and is 0.5 times or 1.5 times longer. , 2.0 times, etc.

  The ultrasonic mounting tool 60 is supported by the ultrasonic vibration bonding device 1 by attaching the horn 9B to the vibration device support rod 10 extending downward from the lifting device 7 via the horn support arm 11. Yes. That is, the horn support arm 11 serves as a support member that supports the ultrasonic mounting tool 60 with respect to the ultrasonic vibration bonding apparatus 1. The horn support arm 11 is fixed to the vibration device support rod 10 at the lower end portion of the vibration device support rod 10.

  The horn support arm 11 has a substantially U-shape having two support pillars 11A and 11B extending in the vertical direction, and an attachment rod 11C connecting the two support pillars 11A and 11B. The horn support arm 11 is attached to the vibration device support rod 10 by an attachment rod 11C. The horn 9B is attached to the support columns 11A and 11B.

  The joining tool part 3 holding the IC chip 100 supplied from the supply device 200 is provided on the lower surface of the horn 9B. The support pillars 11A and 11B are attached to the horn 9B on both sides of the joining tool portion 3 in the left-right direction.

  Two heaters 12A and 12B are provided between the joining tool part 3 and the support pillars 11A and 11B. The heaters 12A and 12B are cylindrical bodies (see FIG. 2B) extending in the front-rear direction. The heaters 12A and 12B are arranged so as to penetrate the horn 9B in the front-rear direction. The heaters 12 </ b> A and 12 </ b> B that penetrate the horn 9 </ b> B in the front-rear direction are supported by the heater support arm 13. The heater support arm 13 is attached to the lower surface of the attachment rod 11C of the horn support arm 11.

  The elevating device 7 is attached to the vibration device support rod 10 via the horn support arm 11 by moving the vibration device support rod 10 up and down by a motor (or an air cylinder or a hydraulic cylinder) (not shown). The ultrasonic mounting tool 60 is configured to move up and down. As described above, the ultrasonic mounting tool 60 includes the vibrator 9A, the horn 9B, the heaters 12A and 12B, the heater support arm 13 that supports the heaters 12A and 12B, and the like, and the vibration device 2 is configured. Therefore, moving the vibration device support rod 10 up and down moves the vibration device 2 up and down.

  Next, an outline of the process of bonding the IC chip 100 to the flexible substrate 101 by the ultrasonic vibration device 1 configured as described above will be described.

  First, the IC chip 100 is supplied from the supply device 200 to the joining tool portion 3 in a state where the ultrasonic mounting tool 60 (vibration device 2) is moved upward by the lifting device 7. Then, the supplied IC chip 100 is sucked by sucking air through the suction holes 3 </ b> A and held in the joining tool portion 3. Subsequently, the vibration device support rod 10 of the elevating device 7 is lowered, the ultrasonic mounting tool 60 (vibration device 2) is moved downward, and the unit substrate of the flexible circuit board 101 placed on the FPC placement table 4 An electrode portion (not shown) of the IC chip 100 is brought into contact with the electrode 102b of the 102. In the flexible circuit board 101, when the ultrasonic mounting tool 60 (vibration device 2) is moved downward, the electrode terminal 102b of the unit board 102 is brought into contact with the electrode portion (not shown) of the IC chip 100. In addition, the arrangement position is set. Instead of pressing the IC chip 100 against the unit substrate 102 by the lifting device 7, a pressing mechanism that presses the IC chip 100 against the unit substrate 102 may be provided separately from the lifting device 7. . The pressing mechanism is composed of, for example, an air cylinder.

  In a state where the electrode portion (not shown) of the IC chip 100 and the electrode terminal 102b of the unit substrate 102 are in contact with each other, the lifting device 7 lightly presses the IC chip 100 against the unit substrate 102, and the unit from the IC chip 100 A pressing force is applied to the substrate 102. Then, the ultrasonic mounting tool 60 is vibrated by the vibration element 8, and the IC chip 100 is reciprocated in the left-right direction with respect to the unit substrate 102. As described above, the IC chip 100 is reciprocated in the left-right direction with respect to the unit substrate 102 in a state where a pressing force is applied between the electrode portion (not shown) of the IC chip 100 and the electrode terminal 102 b of the unit substrate 102. By vibrating, friction is generated between the electrode part (not shown) on the IC chip 100 side and the electrode terminal 102b on the unit substrate 102 side. Due to this friction, the electrode portion (not shown) on the IC chip 100 side and the electrode terminal 102b on the unit substrate 102 side are solid-phase bonded.

  In addition to friction between the electrode part (not shown) on the IC chip 100 side and the electrode terminal 102b on the unit substrate 102 side, the friction part is heated by the heaters 12A and 12B. The speed at which the electrode portion (not shown) and the electrode terminal 102b on the unit substrate 102 side are joined is increased, and the joining strength is improved.

  Then, after the bonding of the IC chip 100 to the unit substrate 102 is completed, the suction of the IC chip 100 to the bonding tool unit 3 is stopped, and the lifting device 7 is driven so that the ultrasonic mounting tool 60 (vibration device 2) is moved. Move upward. Since the IC chip 100 is bonded to the unit substrate 102, it remains on the unit substrate 102 side. That is, the bonding of the IC chip 100 to the unit substrate 102 is completed.

  Next, the flexible circuit board 101 is conveyed backward by the length 102L of the unit board 102. By this conveyance, the unit substrate 102 adjacent to the front side of the unit substrate 102 to which the IC chip 100 is bonded is disposed at a position directly below the bonding tool unit 3. Thereafter, the above-described process of bonding the IC chip 100 to the flexible substrate 101 is repeated, and the IC chips 100 are sequentially bonded onto the unit substrate 102 of the flexible circuit substrate 101. Then, the unit substrate 102 to which the IC chip 100 is bonded is cut out from the flexible circuit board 101 in which the IC chip 100 is bonded to each unit substrate 102. Each of the cut unit substrates 102 is used as a circuit component such as one electric product.

  Next, the configuration of the vibration device 2 will be described in more detail with reference to FIG.

  FIG. 2A is a front view of the vibration device 2 viewed from the front, and FIG. 2B is a bottom view of the vibration device 2 viewed from below. FIG. 2C is a diagram showing the relationship between the position of the ultrasonic mounting tool 60 in the left-right direction and the amplitude with respect to vibration propagating through the vibrator 9A and the horn 9B, that is, the ultrasonic mounting tool 60. The horizontal axis in FIG. 2C corresponds to the position in the left-right direction of the ultrasonic mounting tool 60, and the vertical axis indicates the amplitude at each position.

  The vibration oscillated by the vibration element 8 and input to the horn 9B propagates through the horn 9B as a longitudinal wave that vibrates in the left-right direction of the horn 9B. In FIG. 2C, the amplitude is shown in a direction orthogonal to the horizontal axis (position) direction, and this amplitude corresponds to the amount of displacement (amplitude) in the left-right direction at each position of the horn 9B. Therefore, the displacement amount in the left-right direction is large at the position of the horn 9B corresponding to the position having a large amplitude, and the displacement amount in the left-right direction is small at the position of the horn 9B corresponding to the position having a small amplitude. The position of the horn 9B corresponding to the portion where the amplitude is maximum, that is, the abdominal portion M which is the peak and valley of the waveform of FIG. Conversely, the position of the horn 9B corresponding to the node S where the amplitude is 0, that is, the portion where the waveform of FIG. 2C intersects the horizontal axis, has the smallest amount of displacement in the left-right direction.

  The horn 9B shown in the present embodiment is set to a length that is 1.0 times the wavelength of vibration propagating through the horn 9B. For example, when the vibration element 8 oscillates ultrasonic vibration of 40 kHz and the horn 9B is formed of an iron alloy (acoustic wave transmission speed of about 5000 m / s), the length of the horn 9B in the left-right direction is approximately 120 mm. Thus, by making the length of the horn 9B an integer multiple of the half wavelength of the vibration propagating through the horn 9B, the vibration propagating through the horn 9B resonates and the vibration is amplified. The thickness of the horn 9B is set to a thickness of 10 to 50 mm square so that the horn 9B does not become too thick, that is, while suppressing the enlargement of the vibration device 2, the vibration propagation efficiency is reduced. Can be made good. In this embodiment, it is set to 16 mm square.

  In the present embodiment, the vibration element 8 is arranged in a range of a quarter wavelength from the left end of the vibrator 9A. The vibration oscillated from the vibration element 8 is transmitted to the horn 9B through the vibrator 9A, resonates in the horn 9B, and propagates through the horn 9B as the vibration having the amplitude shown in FIG.

The joining tool part 3 is arrange | positioned in the position of the distance of 0.5 wavelength from the left end of the horn 9B. The joining tool portion 3 includes a pedestal portion 3B that protrudes downward, and a suction hole 3A that passes through the pedestal portion 3B and penetrates the horn 9B up and down. The lower surface portion of the pedestal portion 3B is formed in a plane portion 3C parallel to the horizontal plane.

The suction hole 3A is connected to an air suction device (not shown), and suction is performed so that air is sucked upward from below. Therefore, when the IC chip 100 is supplied from the supply device 200 to the joining tool part 3, the supplied IC chip 100 is attracted and held on the flat surface part 3C of the base part 3B by the air suction force of the suction hole 3A. .

  The horn 9B is attached to the support pillars 11A and 11B of the horn support arm 11 with screws 14A and 14B at positions of the quarter wavelength and the quarter wavelength from the left end. The screws 14A and 14B are passed through screw insertion holes 15A and 15B penetrating the horn 9B in the vertical direction, and a part on the tip side protrudes from the upper surface of the horn 9B. Then, the support pillars 11A and 11B are screwed to parts of the distal ends of the screws 14A and 14B protruding from the upper surface of the horn 9B, whereby the horn 9B is attached to the horn support arm 11. That is, the ultrasonic mounting tool 60 is attached to the horn support arm 11.

  The positions of the 1/4 wavelength and 3/4 wavelength from the left end of the horn 9B, where the support pillars 11A and 11B of the horn support arm 11 are attached to the horn 9B, are positions corresponding to the vibration node S. As described above, this node is a position where the amplitude in the left-right direction is minimized, and the displacement amount of the position of the horn 9B corresponding to this node S is a position (abdomen M and abdomen M not corresponding to the other nodes S). And between the joint S). Therefore, when the horn support arm 11 supports the horn 9B at the position corresponding to the node S, the amount of vibration of the horn 9B transmitted to the horn support arm 11 side can be reduced.

  On the other hand, for example, when the horn support arm 11 supports the horn 9B at the site corresponding to the abdomen M, the horn support arm 11 vibrates with the vibration of the abdomen M in the left-right direction. For this reason, the vibration of the horn 9B is transmitted to the ultrasonic vibration bonding apparatus 1 side, causing a problem that the entire ultrasonic vibration bonding apparatus 1 vibrates. Therefore, the occurrence of such a problem can be suppressed by supporting the horn 9B with the horn support arm 11 at a position corresponding to the node portion S.

  Between the suction hole 3A and the screw insertion hole 15A, and between the suction hole 3A and the screw insertion hole 15B, the heater insertion holes 16A, which penetrate the horn 9B in the front-rear direction and pass through the heaters 12A, 12B, respectively. 16B is formed. The heater insertion hole 16A is formed in the approximate center between the screw insertion hole 15A and the suction hole 3A, and the heater insertion hole 16B is also formed in the approximate center between the screw insertion hole 15B and the suction hole 3A.

  The heaters 12A and 12B are respectively passed through the heater insertion holes 16A and 16B and supported by the heater support arm 13. The heaters 12A and 12B include, for example, a ceramic heater in which a heating element (not shown) such as a nichrome wire that is energized and heated by conductive wires 17A and 17B connected to a power supply unit (not shown) is embedded in ceramics. To do. The heaters 12A and 12B are sheathed heaters or cartridge heaters in which a heating element such as a nichrome wire is disposed in a metal sheath (pipe) and the periphery thereof is solidified with an insulator (magnesium oxide or the like), or around the heating element. A silicon heater having a structure covered with silicon rubber may be used.

  The heater support arm 13 includes an attachment rod 13A for fixing the heater support arm 13 to the horn support arm 11, and heater support plates 13B and 13C provided on the left and right sides of the attachment rod 13A. The heater support plates 13B and 13C are provided as a pair of front and rear, respectively, two before and after the mounting rod 13A. The heater support plates 13B and 13C have lower tips positioned in front of and behind the horn 9B, respectively. That is, the horn 9B is disposed between the pair of front and rear heater support plates 13B and between the pair of front and rear heater support plates 13C.

  A heater support hole 13D is formed in the heater support plate 13B disposed before and after the horn 9B at a position facing the heater insertion hole 16A formed in the horn 9B. Similarly, a heater support hole 13E is also formed in a heater support plate 13C disposed before and after the horn 9B at a position facing the heater insertion hole 16B formed in the horn 9B.

  The heater 12A is inserted into the heater insertion hole 16A with the front and rear portions being inserted into the heater support hole 13D and supported by the heater support plate 13B. The heater 12B is also inserted into the heater insertion hole 16B with the front and rear portions being inserted into the heater support hole 13E and supported by the heater support plate 13C. The heater 12A is fixed to the heater support hole 13D with a heat-resistant adhesive or the like so that the heater 12A does not fall out of the heater support hole 13D. The heater 12B is also fixed to the heater support hole 13E with a heat-resistant adhesive or the like so that the heater 12B does not fall out of the heater support hole 13E. The heater support holes 13D and 13E that support the heaters 12A and 12B do not have to be through holes as long as the heaters 12A and 12B do not fall out.

  The heater insertion holes 16A and 16B formed in the horn 9B are formed in such a size that a gap is formed with respect to the heaters 12A and 12B inserted therein. The size of the gap is larger than the magnitude of the vibration in the left-right direction of the horn 9B at the position where the heater insertion holes 16A and 16B are formed, that is, the amount of displacement.

  A heater support arm 13 that supports the heaters 12 </ b> A and 12 </ b> B is fixed to a horn support arm 11 that is fixed to the ultrasonic vibration bonding apparatus 1. Therefore, the heaters 12 </ b> A and 12 </ b> B are fixed to the ultrasonic vibration bonding apparatus 1. On the other hand, the positions where the heater insertion holes 16A and 16B are formed are not the node S of the horn 9B, and thus vibrate in the left-right direction with respect to the ultrasonic vibration bonding apparatus 1.

  Therefore, when there is no gap between the heaters 12A and 12B and the heater insertion holes 16A and 16B, the heaters 12A and 12B are subjected to a stress that is pushed and bent in the left-right direction between the horn 9B and the heater support arm 13. As a result, the heaters 12A and 12B may be damaged.

  On the other hand, as described above, by providing a gap between the heaters 12A and 12B and the heater insertion holes 16A and 16B, even if the horn 9B vibrates in the left-right direction, the heaters 12A and 12B It can prevent that the stress which pushes and bends 12B acts.

  As described above, the size of the gap between the heater insertion holes 16A and 16B and the heaters 12A and 12B inserted therein is greater than the displacement in the left-right direction of the horn 9B at the heater insertion holes 16A and 16B. In this case, the vibrating horn 9B does not collide with the heaters 12A and 12B. Therefore, the stress that the horn 9B pushes and bends the heaters 12A and 12B can be completely eliminated.

  On the other hand, if the stress that pushes and bends the heaters 12A and 12B acting between the horn 9B and the heater support arm 13 is such that the heaters 12A and 12B are not damaged, the heater insertion holes 16A and 16B and the heaters 12A and 12B May be less than the amount of displacement of the horn 9B in the heater insertion holes 16A and 16B in the horizontal direction, and the horn 9B may slightly collide with the heaters 12A and 12B. If no gap is provided between the heaters 12A and 12B and the heater insertion holes 16A and 16B, the vibration of the horn 9B reaches the heaters 12A and 12B as it is, and the heater 12A and 12B are subjected to a large bending stress. Although acting, this push bending stress can be reduced by forming a gap.

  The heater insertion holes 16A, 16B are formed in the left-right direction with respect to the suction hole 3A, and substantially at the center between the suction hole 3A and the screw insertion holes 15A, 15B. By disposing the heater insertion holes 16A and 16B in the left-right direction with respect to the suction hole 3A, that is, in the length direction of the horn 9B, the heater insertion holes 16A and 16B are formed at positions away from the suction hole 3A. Can do. By forming the heater insertion holes 16A and 16B at positions away from the suction hole 3A, the drilling process for forming the suction hole 3A and the heater insertion holes 16A and 16B in the horn 9B is facilitated.

  That is, when the heater insertion holes 16A and 16B and the suction hole 3A are arranged in the vertical direction, the heater insertion holes 16A and 16B are limited by the thickness of the horn 9B (16 mm in the present embodiment). And a space between the suction holes 3A cannot be secured widely. Therefore, in order to arrange the suction hole 3A and the heater insertion holes 16A and 16B within the thickness of the horn 9B, the suction hole 3A and the heater insertion holes 16A and 16B are detoured so as not to interfere with each other. It is forced to have a complicated structure.

  On the other hand, when the heater insertion holes 16A and 16B are arranged on the left and right sides of the suction hole 3A, the gaps L1 and L1 between the suction hole 3A and the heater insertion holes 16A and 16B should be wide. Can do. Therefore, there is no need to adopt a complicated configuration that bypasses the suction hole 3A and the heater insertion holes 16A and 16B, and the structure of the horn 9B can be simplified. By ensuring the wide intervals L1 and L1, it becomes easy to perform the drilling work for forming the suction holes 3A and the heater insertion holes 16A and 16B. That is, when the distances L1 and L1 are narrow, the partition walls 18 and 18 between the suction hole 3A and the heater insertion holes 16A and 16B are thinned, and the partition walls 18 and 18 may be broken during the drilling operation. is there. By disposing the heater insertion holes 16A and 16B on the left and right of the suction hole 3A, the thickness of the partition walls 18 and 18 can be increased, and the drilling work is facilitated.

  Further, the heater insertion holes 16A and 16B are arranged on the left and right sides with respect to the screw insertion holes 15A and 15B. Therefore, the space | interval L2, L2 between heater insertion hole 16A, 16B and screw insertion hole 15A, 15B can be ensured widely. That is, the thickness of the partition walls 19 and 19 between the heater insertion holes 16A and 16B and the screw insertion holes 15A and 15B can be increased. Therefore, the drilling process for forming the heater insertion holes 16A and 16B and the screw insertion holes 15A and 15B is facilitated.

  The effect of facilitating the drilling process for forming the heater insertion holes 16A, 16B and the screw insertion holes 15A, 15B, as described above, by ensuring the wide distances L2, L2 and increasing the thickness of the partition walls 19, 19. In addition, there are the following effects.

  In the node S where the screw insertion holes 15A and 15B of the horn 9B are formed, the stress due to the vibration of the horn 9B acts strongly. Therefore, the distances L2 and L2 between the heater insertion holes 16A and 16B and the screw insertion holes 15A and 15B are narrowed, and the partition walls 19 and 19 between the heater insertion holes 16A and 16B and the screw insertion holes 15A and 15B are thinned. Further, there is a risk that the partition walls 19 and 19 may be broken and damaged due to stress acting by vibration. By securing a large distance L2 and L2 and making the partition wall 19 thick, it is possible to prevent the partition wall 19 from being broken and damaged by vibration stress.

  In the present embodiment, an example is shown in which the heater insertion holes 16A and 16B are formed at substantially the center of the screw insertion holes 15A and 15B and the suction hole 3A. As described above, the heater insertion holes 16A and 16B are disposed substantially at the center of the screw insertion holes 15A and 15B and the suction hole 3A, so that the heater insertion holes 16A and 16B, the screw insertion holes 15A and 15B, and the suction hole 3A. Each drilling process can be easily performed. That is, if the heater insertion holes 16A, 16B are formed at positions that are biased to either the screw insertion holes 15A, 15B or the suction holes 3A, the difficulty of drilling the narrower one of the intervals L1 and L2 increases. . Therefore, for example, it may be necessary to change the processing accuracy depending on the degree of deviation. However, by forming the heater insertion holes 16A and 16B at substantially the center of the screw insertion holes 15A and 15B and the suction hole 3A, each hole can be formed with the same processing accuracy.

  However, the positions where the heater insertion holes 16A and 16B are formed are not limited to the approximate center of the screw insertion holes 15A and 15B and the suction hole 3A. Table 1 shows the appropriateness from the viewpoint of the ease of drilling with respect to the distances L1 and L1 between the heater insertion holes 16A and 16B and the suction holes 3A. Table 2 also shows the ease of drilling for the distances L2 and L2 between the heater insertion holes 16A and 16B and the screw insertion holes 15A and 15B, and the strength against stress due to vibration of the horn 9B acting on the partition walls 19 and 19. Shows the appropriateness of the viewpoint.

  When the vibration frequency of the vibration element 8 is 40 kHz and the horn 9B is an iron alloy, the transmission speed of the sound wave is about 5000 m / s. Therefore, the length of 1/100 wavelength is about 1.25 mm, 1 The length of / 40 wavelength is about 3.125 mm, and the length of 1/20 wavelength is about 6.25 mm.

  Tables 1 and 2 show the degree of appropriateness with respect to the above viewpoints by ◯, Δ, and ×. The mark “◯” is appropriate, it is easy to perforate, and indicates that the strength against stress due to vibration of the horn 9B acting on the partition wall 19 can be secured. The x mark is inadequate, indicating that drilling is difficult and the strength against stress caused by vibration of the horn 9B acting on the partition wall 19 cannot be secured. The Δ mark indicates that the hole can be drilled somehow, and the strength against the stress caused by the vibration of the horn 9B indicates that there is no problem in a normal use situation.

  From Tables 1 and 2, the screw insertion holes 15A and 15B are formed so that the thicknesses of the partition wall 18 and the partition wall 19, that is, the distance L1 and the distance L2 are each 1/20 wavelength or longer (thickness). When the heater insertion holes 16A and 16B and the suction hole 3A are formed, the drilling process can be easily performed, and the strength against the stress acting on the partition wall 19 can be secured. Specifically, the distances L1 and L2 are preferably 3 mm or more apart, more preferably 6 mm or more, respectively, when the horn 9B is an iron alloy.

  Note that the interval L1 at which the drilling process can be properly performed, and the interval L2 at which the drilling process can be properly performed and the strength against the stress acting on the partition wall 19 can be ensured are the material of the horn 9B and the frequency of vibration propagating through the horn 9B. It sets suitably by etc.

  By the way, as described above, the heater insertion holes 16A and 16B are formed in the left-right direction with respect to the suction hole 3A and between the suction hole 3A and the screw insertion holes 15A and 15B. A wide space between the heater insertion holes 16A and 16B can be secured. Therefore, the heaters 12A and 12B can be increased in size.

(Second Embodiment)
4 and 5 show an ultrasonic vibration bonding apparatus 30 according to the second embodiment of the present invention.

  The horn 9B of the ultrasonic vibration bonding apparatus 1 according to the first embodiment is set to a length that is 1.0 times the wavelength of vibration propagating through the horn 9B, while the second embodiment. The horn 31B of the ultrasonic vibration bonding apparatus 30 according to the above is set to a length of 0.5 times the wavelength.

  4 and 5, members and configurations similar to those of the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.

  FIG. 4 is a diagram showing an outline of a process for bonding the IC chip 100 as a bonding target to the flexible substrate 101 as the bonding target using the ultrasonic vibration bonding apparatus 30. FIG. 5 is a diagram illustrating a configuration of the vibration device 32 in the ultrasonic vibration bonding device 30. FIG. 5A is a front view of the vibration device 32 as viewed from the front, and FIG. 5B is a bottom view of the vibration device 32 as viewed from below. FIG. 5C is a diagram showing the relationship between the position of the horn 31B in the left-right direction and the amplitude with respect to vibration propagating through the horn 31B. The horizontal axis in FIG. 5C corresponds to the position of the horn 31B in the left-right direction, and the vertical axis indicates the amplitude at each position.

  As described above, in the ultrasonic vibration bonding apparatus 30, the length in the left-right direction of the horn 31B is set to 0.5 times the wavelength of vibration propagating through the horn 31B. That is, since the horn 31B is formed of an iron alloy and the vibration element 8 oscillates ultrasonic vibration of 40 kHz, the length of the horn 31B is set to approximately 62.5 mm. The thickness of the horn 31B is set to about 16 mm square. In the second embodiment, the ultrasonic mounting tool 61 includes a vibrator 31A that holds the vibration element 8, the horn 31B, and the vibration element 8 and transmits the vibration generated by the vibration element 8 to the horn 31B. It is configured.

  The ultrasonic mounting tool 60 in the ultrasonic vibration welding apparatus 1 according to the first embodiment is configured such that the horn 9B sandwiches the bonding tool part 3 and the left and right sides of the ultrasonic vibration bonding apparatus 1 with respect to the ultrasonic vibration bonding apparatus 1 by the horn support arms 11. It was supported. The ultrasonic mounting tool 61 is light in weight because the horn 31B is shorter in the left-right direction than the horn 9B of the first embodiment. Therefore, the ultrasonic mounting tool 61 is directly supported with respect to the vibration device support rod 10 only at one portion of the node S located at a quarter wavelength from the left end of the horn 31B. In addition, the joining tool part 3 is arrange | positioned by the position of the abdominal part M in the position of the left end of the horn 31B.

  The horn 31 </ b> B is attached to the vibration device support rod 10 with a screw 33 at a position supported by the vibration device support rod 10. The screw 33 is passed through a screw insertion hole 34 that penetrates the horn 31B in the vertical direction, and a part of the tip side protrudes from the upper surface of the horn 31B. The ultrasonic mounting tool 61 is attached to the vibration device support rod 10 by a part of the tip of the screw 33 protruding from the upper surface of the horn 31 </ b> B being screw-coupled to the vibration device support rod 10. In addition, in the site | part corresponding to the node part S of the horn 31B, the quantity which the vibration of the horn 31B is transmitted to the vibration device support rod 10 side becomes small by supporting the ultrasonic mounting tool 61 with respect to the vibration device support rod 10. .

  The heater support arm 13 that supports the heaters 12A and 12B is directly attached to the vibration device support rod 10 on the right side end surface of the support rod 13A.

  In the ultrasonic vibration bonding apparatus 30 in the second embodiment, there is no hole corresponding to the screw insertion hole 15A in the first embodiment on the left side of the heater insertion hole 16A. Therefore, the heater insertion hole 16A is arranged so that the distance from the suction hole 3A, that is, the distance L3 is 1/20 wavelength or more. On the other hand, the heater insertion holes 16B are arranged so as to be at least 1/20 wavelength with respect to the suction holes 3A and the screw insertion holes 34, respectively. That is, it arrange | positions so that the space | interval L1 and L2 may become 1/20 wavelength or more. As described above, by providing the heater insertion holes 16A and 16B, the suction hole 3A, and the screw insertion hole 34, it is possible to easily perform the drilling process of each hole. Further, it is possible to ensure strength against stress due to vibration of the horn 9B acting on the partition wall 19.

  In the ultrasonic vibration bonding apparatus 1 and the ultrasonic vibration bonding apparatus 30 shown in each of the above-described embodiments, the inside of the node portion S on both sides sandwiching the suction hole 3A, that is, a quarter wavelength across the suction hole 3A. The screw insertion holes 15A and 15B, the screw insertion hole 34, and the heater insertion holes 16A and 16B are formed. Therefore, the position for supporting the horn 9B and the horn 31B and the position for supporting the heaters 12A, 12B are biased toward the welding tool part 3 side. The ultrasonic vibration bonding apparatus 1 and the ultrasonic vibration bonding apparatus 30 Miniaturization can be achieved.

  In each of the above-described embodiments, the bonding target is the IC chip 100, but the bonding target is not limited to the IC chip, and may be a resistance element other than the IC chip, or an electronic component such as light emission. Moreover, although the to-be-joined target object was made into the flexible substrate 101 to which the IC chip 100 is joined and becomes COF, the flexible substrate 101 is not limited to that constituting the COF. In addition to the flexible substrate 101, a printed circuit board made of epoxy resin or the like may be used as an object to be joined. Further, as described above, the joining object and the object to be joined are not limited to the electronic component and the flexible substrate or the printed wiring board, but may be metal parts or plastic parts, for example.

(Modification 1)
FIG. 6 shows a configuration of a vibration device 62 in which a portion of the vibration device 2 in the ultrasonic vibration bonding apparatus 1 according to the first embodiment of the present invention is deformed.

  The same members and configurations as those of the ultrasonic vibration bonding apparatus 1 according to the first embodiment shown in FIGS. 1 and 2 are denoted by the same reference numerals, and description thereof is omitted or simplified. Compared with the vibration device 2, the structure for supporting the ultrasonic mounting tool 60 on the vibration device support rod 10 and the structure for supporting the heaters 12A and 12B are mainly different.

  The ultrasonic mounting tool 60 is supported with respect to the vibration device support rod 10 by a horn support arm 63 as a support member and two support screws 64 and 65. The horn support arm 63 has a rectangular parallelepiped that is long in the left-right direction, and has holes 66 and 67 penetrating in the front-rear direction at two locations on the left and right. The horn support arm 11 is fixed to the vibration device support rod 10 at the lower end portion of the vibration device support rod 10.

  The holes 66 and 67 penetrate the horn support arm 63 in the front-rear direction in a substantially rectangular parallelepiped shape. The upper and lower portions of the horn support arm 63 where the holes 66 and 67 are formed are thin thin plate portions 68 and 69.

  Screw holes 70 and 71 to which the support screws 64 and 65 are screwed are formed at positions of the 1/4 wavelength and 3/4 wavelength nodes S from the left end of the horn 9B. On the left side of the hole 66 of the horn support arm 63 and the right side of the hole 67, screw insertion holes 72 and 73 through which support screws 64 and 65 are inserted at positions facing the screw holes 70 and 71 of the horn 9B, respectively. Is formed. Therefore, the ultrasonic mounting tool 60 is supported by passing the support screws 64 and 65 from the upper side of the horn support arm 63 to the horn 9B side and screwing the support screws 64 and 65 into the screw holes 70 and 71, respectively. The vibration device support rod 10 is supported via screws 64 and 65 and a horn support arm 63.

  By disposing the screw holes 70 and 71 as described above, the thickness of the partition wall (corresponding to the partition walls 19 and 19 in FIG. 2) between the heater insertion holes 16A and 16B and the screw holes 70 and 71 is increased. Can do. Therefore, the drilling work for forming the heater insertion holes 16A and 16B and the screw holes 70 and 71 is facilitated.

  By thickening the partition between the heater insertion holes 16A, 16B and the screw holes 70, 71, as described above, the hole forming process for forming the heater insertion holes 16A, 16B and the screw holes 70, 71 is facilitated. In addition to the effect of becoming, there are the following effects.

  In the node S where the screw holes 70 and 71 of the horn 9B are formed, the stress due to the vibration of the horn 9B acts strongly. Therefore, if the space between the heater insertion holes 16A, 16B and the screw holes 70, 71 is narrowed and the partition wall between the heater insertion holes 16A, 16B and the screw holes 70, 71 is thinned, the stress due to vibration causes the stress. There is a possibility that the partition wall breaks and breaks. By securing a wide space between the heater insertion holes 16A, 16B and the screw holes 70, 71 and increasing the thickness of the partition, it is possible to prevent the partition from being broken and damaged by stress due to vibration.

  A protrusion 74 is formed on the upper surface of the horn 9 </ b> B opposite to the welding tool part 3 at a position facing the welding tool part 3. The upper surface of the protrusion 74 is formed in a rectangular plane. The front-rear width of the upper surface of the projection 74 is the same as the front-rear width of the horn 9B. That is, the width in the front-rear direction of the upper surface of the protrusion 74 is formed to the full width in the front-rear direction of the horn 9B.

  A bearing member 75 is disposed between the protrusion 74 and the horn support arm 63. The joining tool receiver 75 is fixed to the horn support arm 63 and is not fixed to the protrusion 74. The ultrasonic mounting tool 60 is supported by the support screws 64 and 65 with respect to the horn support arm 11 in a state where the joining tool receiver 75 is sandwiched between the protrusion 74 and the horn support arm 63.

  The joining tool receiver 75 has a rectangular parallelepiped shape, and the surface that contacts the upper surface of the protrusion 74 is the same shape as the rectangular upper surface of the protrusion 74, and the upper surface of the protrusion 74 and the bonding tool receiver 75 are mutually connected. It is in contact over the entire surface.

  The through holes 66 and 67 are formed at positions that do not overlap the joining tool receiver 75 in the vertical direction. That is, the through holes 66 and 67 are formed above the right and left of the joining tool receiver 75. Further, as described above, the upper and lower portions of the through holes 66 and 67 of the horn support arm 63 are the thin plate portions 68 and 69. Therefore, when the support screws 64 and 65 are tightened into the screw holes 70 and 71 in a state in which the joining tool receiver 75 is sandwiched between the horn support arm 63 and the protrusion 74, the thin plate portions 68 and 69 are It bends downward from the center side toward the outside (left and right end sides of the horn support arm 63). That is, the thin plate portions 68 and 69 serve as leaf springs. Therefore, it can prevent that the force which acts on the contact part of the horn support arm 63 and the upper surface of the joining tool receiver 75 concentrates only on the right and left sides of the contact part. Therefore, when the lifting device 7 presses the IC chip 100 held by the joining tool portion 3 against the unit substrate 102, the pressing force of the lifting device 7 and the like is surely applied from the horn support arm 63 to the joining tool receiver 75. It is transmitted. Then, this pressing force is transmitted to the protruding portion 74, and the joining tool portion 3 located below the protruding portion 74 presses the IC chip 100 against the unit substrate 102.

  Further, since the thin plate portions 68 and 69 serve as leaf springs, even if the tightening force of the support screws 64 and 65 into the screw holes 70 and 71 is different on the left and right, the horn support arm 63 and the joining tool receiver. It acts on the contact portion with the upper surface of 75. As a result, the strength in the left-right direction of the force for sandwiching the joining tool receiver 75 between the horn support arm 63 and the protrusion 74 can be made uniform.

  Further, by providing the projecting portion 74, the pressing force of the elevating device 7 and the like can be concentratedly received by the projecting portion 74. And since this projection part 74 is provided in the position facing the joining tool part 3, a pressing force is efficiently transmitted with respect to the joining tool part 3. FIG. Since the protrusion 74 and the joining tool receiver 75 are not fixed as described above, when the horn 9A vibrates in the left-right direction due to the vibration generated by the vibration element 8, the horn 9B Slid with respect to the joining tool receiver 75.

  In the vibration device 63, the joining tool part 3 is provided with a pedestal part 3E having a rectangular flat part 3D that is long in the front-rear direction, and the IC chip 100 is held on the flat part 3D of the pedestal part 3E. Since the flat portion 3D is long in the front-rear direction, it is suitable for holding the IC chip 100 that is long in the front-rear direction.

  The suction hole 3 </ b> A penetrates the welding tool receiver 75 and the horn support arm 63 in the vertical direction, passes through the vibration device support rod 10, and penetrates the vibration device support rod 10 side surface. An air suction device (not shown) is connected to the suction hole 3A penetrating the side surface.

  A heater support plate 76 is provided before and after the horn 9B. The heater support plate 76 is attached to the horn support arm 63 with screws 78. A heater support hole 77 is formed in the heater support plate 76 at a position facing the heater insertion holes 16A and 16B. Heaters 12A and 12B are passed through the heater support holes 77 and supported. The heaters 12A and 12B and the heater support plate 76 are fixed between the heater 12A and the heater support hole 77 and between the heater 12B and the heater support hole 77 with a heat resistant adhesive or the like. The heater support hole may be structured so that the heater does not fall out, and the heater may not be fixed with an adhesive or the like.

  A thermocouple 79 is provided at the right end of the welding tool part 3 to detect the temperature of the welding tool part 3. Based on the temperature detected by the thermocouple 79, the temperature of the heaters 12A and 12B is controlled. By providing the thermocouple 79 in the joining tool part 3 in the vicinity of the joining part of the IC chip 100 that is the joining target and the flexible substrate 101 that is the joining target, the detection accuracy of the joining temperature of the joining part is increased. can do.

(Modification 2)
FIG. 7 shows a configuration of a vibration device 80 obtained by modifying a portion of the vibration device 32 in the ultrasonic vibration bonding apparatus 30 according to the second embodiment of the present invention.

  The same members and configurations as those of the ultrasonic vibration bonding apparatus 30 according to the second embodiment shown in FIGS. 4 and 5 are denoted by the same reference numerals, and the description thereof is omitted or simplified.

  Compared with the vibration device 32, the structure for supporting the ultrasonic mounting tool 61 on the vibration device support rod 10 and the insertion position of the heater 81 into the horn 31 </ b> B are mainly different.

  The ultrasonic mounting tool 61 is supported with respect to the vibration device support rod 10 by a horn support arm 82 and a support screw 83 as support members. The horn support arm 82 is fixed at the lower end of the vibration device support rod 10 and extends to the right side of the vibration device support rod 10.

  In the horn 31B, a screw hole 84 to which the support screw 83 is screwed is formed at the position of the node portion S that is a position of a quarter wavelength from the left end of the horn 31B. A screw insertion hole 85 through which the support screw 83 is inserted is formed at a position facing the screw hole 84 of the horn 31B at a substantially central portion of the horn support arm 82. Therefore, the ultrasonic mounting tool 61 vibrates via the support screw 83 and the horn support arm 82 by passing the support screw 83 from the upper side of the horn support arm 82 to the horn 31B side and screwing the support screw to the screw 84. It is supported with respect to the apparatus support rod 10.

  A protrusion 86 is formed on the upper surface of the horn 31 </ b> B opposite to the welding tool part 3 at a position facing the welding tool part 3. The upper surface of the protrusion 86 is formed in a rectangular plane. The width in the front-rear direction of the upper surface of the protrusion 86 is the same as the width in the front-rear direction of the horn 31B. That is, the front-rear width of the upper surface of the protrusion 86 is formed to be full of the front-rear width of the horn 31B.

  A bearing member 87 is disposed between the protrusion 86 and the horn support arm 82. The joining tool receiver 87 is fixed to the horn support arm 82 and is not fixed to the protrusion 86. The ultrasonic mounting tool 61 is supported by the support screw 83 with respect to the horn support arm 82 in a state where the bearing member 87 is sandwiched between the protrusion 86 and the horn support arm 82.

  Since the protrusion 86 and the joining tool receiver 87 are not fixed as described above, when the horn 31B vibrates in the left-right direction due to the vibration generated by the vibration element 8, the horn 31B Slid with respect to the joining tool receiver 87.

  In the vibration device 80, the joining tool portion 3 is provided with a pedestal portion 3E having a rectangular flat portion 3D that is long in the front-rear direction, and the IC chip 100 is held on the flat portion 3D of the pedestal portion 3E. Since the flat portion 3D is long in the front-rear direction, it is suitable for holding the IC chip 100 that is long in the front-rear direction.

  The suction hole 3 </ b> A vertically penetrates the welding tool receiver 87 and the horn support arm 82, passes through the vibration device support rod 10, and penetrates the side surface of the vibration device support rod 10. An air suction device (not shown) is connected to the suction hole 3 </ b> A that has come to the side.

  In the horn 31B, a heater insertion hole 89 is formed on the opposite side of the suction hole 3A across the screw hole 84. A heater support plate 90 is provided on the horn support arm 82. The heater support plate 90 is provided on the horn support arm 82 so as to be positioned before and after the horn 31B. The heater 81 is passed through the heater support hole 91 formed in the heater support plate 90 in a state of being inserted through the heater insertion hole 89 and is supported by the heater support plate 90. The heater 81 and the heater support plate 90 fix the space between the heater 81 and the heater support hole 91 with a heat resistant adhesive or the like.

  Since the heater insertion hole 89 is formed on the opposite side of the suction hole 3A across the screw hole 84, that is, on the free end side of the vibration of the horn 31B, there is sufficient space between the suction hole 3A, the screw hole 84, and the heater insertion hole 89. Can be secured. By configuring the ultrasonic vibration bonding apparatus 30 in such a configuration, the holding unit 3 and the heater 81 can be arranged so that the structure of the horn 31B is not complicated. Therefore, it is possible to easily perform the drilling process of each hole, and it is possible to secure the strength against the stress due to the vibration of the horn 31B acting on the partition wall between the holes.

  A thermocouple 79 is provided at the right end of the welding tool part 3 in the same manner as in the first modification described above, and detects the temperature of the welding tool part 3. Based on the temperature detected by the thermocouple 79, the temperature of the heater 91 is controlled. By providing the thermocouple 79 in the joining tool part 3 in the vicinity of the joining part of the IC chip 100 that is the joining target and the flexible substrate 101 that is the joining target, the detection accuracy of the joining temperature of the joining part is increased. can do.

  Although the shape of the heaters 12A, 12B, 81 is illustrated as a cylindrical shape, the shape of the heaters 12A, 12B, 81 may be a plate shape. By making the heaters 12A, 12B, 81 into a plate shape or a strip shape, the heater insertion holes 16A, 16B, 89 are rectangular. A plate-like heater whose cross-sectional shape orthogonal to the heater length direction is a rectangle (for example, a thickness of 3 mm and a width of 10 mm), and the long side of the rectangle is the propagation direction of vibration, that is, the heater thickness direction is the vertical direction. By doing so, the reflection of the vibration by the heater insertion hole is reduced, and the reduction of the vibration and the generation of the secondary vibration can be reduced. The heating capacity of this shape of the heater is roughly equivalent to a cylindrical heater having a diameter of 6 mm. And the reflection of vibration and the secondary vibration are reduced to about half. The plate heater can be arranged as long as the width is 25 mm or less. Further, the thickness of the heater has been increased to 2 mm or less at 1/2 or less of the width because the heating capacity of the heater is roughly proportional to the cross-sectional area.

1 shows an entire ultrasonic vibration bonding apparatus according to a first embodiment of the present invention and a supply apparatus that supplies an IC chip to the ultrasonic vibration bonding apparatus, and is an object to be bonded using the ultrasonic vibration bonding apparatus. It is a figure for demonstrating the outline of the process of joining an IC chip to a flexible substrate. It is a figure which shows the structure of the vibration apparatus with which the ultrasonic vibration joining apparatus shown in FIG. 1 is equipped, (A) is a front view of a vibration apparatus, (B) is a bottom view of a vibration apparatus, (C) These are figures which show the relationship between the position in a horn and the amplitude of the vibration which propagates a horn. It is a figure which shows the structure of the flexible circuit board with which an IC chip is joined by the ultrasonic vibration joining apparatus shown in FIG. The ultrasonic vibration joining apparatus concerning the 2nd Embodiment of this invention and the supply apparatus which supplies an IC chip to this ultrasonic vibration joining apparatus are shown whole, and it is a joining target object using an ultrasonic vibration joining apparatus. It is a figure for demonstrating the outline of the process of joining an IC chip to a flexible substrate. It is a figure which shows the structure of the vibration apparatus with which the ultrasonic vibration joining apparatus shown in FIG. 4 is equipped, (A) is a front view of a vibration apparatus, (B) is a bottom view of a vibration apparatus, (C) These are figures which show the relationship between the position in a horn and the amplitude of the vibration which propagates a horn. It is a figure which shows the modification of the part of the vibration apparatus in the ultrasonic vibration joining apparatus which concerns on the 1st Embodiment of this invention. It is a figure which shows the modification of the part of the vibration apparatus in the ultrasonic vibration joining apparatus which concerns on the 2nd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Ultrasonic vibration welding apparatus 3 ... Joining tool part (holding part)
3A ... Suction hole 9A ... Vibrators 9B, 31B ... Horn 11, 63, 82 ... Horn support arm (support member)
12A, 12B, 81 ... heaters 14A, 14B, 64, 65, 83 ... screws (mounting members)
16A, 16B, 89 ... Heater insertion hole 60 ... Ultrasonic mounting tool 100 ... IC chip (object to be joined)
101 ... Flexible circuit board (object to be joined)

Claims (5)

An ultrasonic mounting tool including a vibrator that generates ultrasonic vibrations, a horn, and a holding unit that is provided in the horn and holds an object to be joined;
A heater passed through a heater insertion hole formed in the horn;
A support member for supporting the ultrasonic mounting tool;
With
In the ultrasonic vibration bonding apparatus for bonding the bonding target object to the bonding target object by vibrating the horn while pressing the bonding target object held by the holding unit against the bonding target object,
The heater insertion hole is formed between a position supported by the support member of the horn and the holding portion.
An ultrasonic vibration bonding apparatus characterized by that. The holding part is disposed on the abdomen of vibration of the horn,
The support member is a node of vibration of the horn, and supports the ultrasonic mounting tool at a node adjacent to the abdomen where the holding unit is disposed.
The ultrasonic vibration bonding apparatus according to claim 1.   The ultrasonic vibration bonding apparatus according to claim 1, wherein the heater insertion hole has a gap with respect to a portion of the heater that is passed through the heater insertion hole. The horn is formed with an attachment member insertion hole through which an attachment member for attaching the horn to the support member and a suction hole formed in the holding portion for sucking the object to be joined to the holding portion,
4. The ultrasonic vibration bonding apparatus according to claim 1, wherein the heater insertion hole is formed at a substantially center between the attachment member insertion hole and the suction hole. An ultrasonic mounting tool including a vibrator that generates ultrasonic vibrations, a horn, and a holding unit that is provided in the horn and holds an object to be joined;
A heater passed through a heater insertion hole formed in the horn;
A support member for supporting the ultrasonic mounting tool;
With
In the ultrasonic vibration bonding apparatus for bonding the bonding target object to the bonding target object by vibrating the horn while pressing the bonding target object held by the holding unit against the bonding target object,
The heater insertion hole is formed between a position supported by the support member of the horn and a free end of the horn.
An ultrasonic vibration bonding apparatus characterized by that.

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