JP3767812B2 - Electronic component manufacturing apparatus and electronic component manufacturing method - Google Patents

Electronic component manufacturing apparatus and electronic component manufacturing method Download PDF

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JP3767812B2
JP3767812B2 JP2002202469A JP2002202469A JP3767812B2 JP 3767812 B2 JP3767812 B2 JP 3767812B2 JP 2002202469 A JP2002202469 A JP 2002202469A JP 2002202469 A JP2002202469 A JP 2002202469A JP 3767812 B2 JP3767812 B2 JP 3767812B2
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electronic component
ultrasonic vibration
electrode
tool
propagating body
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JP2004047692A (en
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光範 石崎
洋一 北村
琢也 大賀
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H01L2224/75303—Shape of the pressing surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75313—Removable bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Description

【０００１】
【発明の属する技術分野】
本発明は、超音波振動を伝搬しながら突起電極と電極とを接合するフリップチップの実装方法およびその装置に関し、特に電子部品を破損させることなく安定した接合強度で電子部品を接合する電子部品製造装置および電子部品製造方法に関するものである。
【０００２】
【従来の技術】
多端子で狭ピッチの電極を有する電子部品を実装する手法として、電子部品に超音波振動を伝搬しながら電子部品の電極上に形成した突起電極と電極とを接合する、フリップチップ方式がよく用いられており、例えば"超音波振動によるフリップチップ実装技術の開発"（橋本他、6th Symposium on Microjoining and Assembly Technology in Electronics、175-178、2000）に記載されている。
【０００３】
図２１及び図２２は従来の電子部品の製造方法および製造装置を示す一部を断面とする側面図である。図２１及び図２２において、１は概略矩形平板状の第１の電子部品、１ｃは第１の電子部品１の表面としての第１の面１ａに設けられた電極、２は概略矩形平板状の第２の電子部品、２ｃは第２の電子部品２の表面としての第１の面２ａに設けられた電極、３は第１の電子部品１の電極１ｃ上に設けられた突起電極である。第１の電子部品１と第２の電子部品２の裏面である第２の面１ｂ，２ｂは平坦な面とされている。また、４は第１の電子部品１を吸着してこれを保持するとともに第１の電子部品１に超音波振動を伝搬する接合ツール、４ａは接合ツール４に設けられた真空吸着穴、６は接合ステージ、５は接合ステージ６に設けられた真空吸着穴である。
【０００４】
図２１は第１の電子部品１を真空吸着穴４ａで吸引して接合ツール４の電子部品保持部４ｂに真空吸着保持し、一方、第２の電子部品２を真空吸着穴５で吸引して第１の面２ａを外方に向けて接合ステージ６に固定し、第１の電子部品１の電極１ｃに形成された突起電極３と、接合ステージ６に真空吸着保持された第２の電子部品２の電極２ｃとが位置合わせされた状態を示す一部を断面とする側面図である。
【０００５】
図２２は突起電極３と第２の電子部品２の電極２ｃとを加圧するとともに、接合ツール４によって第１の電子部品１に矢印Ｉに示されるように超音波振動が伝搬された状態を示す一部を断面とする側面図である。
第１の電子部品１の突起電極３と第２の電子部品２の電極２ｃとが位置合わせされた後、接合ツール４が第２の電子部品２の方向であるＺ軸方向に移動し、突起電極３を所定の押圧力で電極２ｃに押圧しながら、接合ツール４が図中矢印Ｉに示されるように超音波振動を第１の電子部品１に伝搬する。Ｚ軸方向の所定の押圧力とこれに直行するＸＹ平面上の超音波振動によって突起電極３と電極２ｃとがこすれあい表面の汚れや膜が除去されて両者が固相接合される。
【０００６】
図２３は従来の電子部品の製造方法および製造装置の別の例を示し、突起電極３と第２の電子部品２の電極２ｃとを加圧するとともに、接合ツール１２によって第１の電子部品１に矢印Ｊに示されるように超音波振動が伝搬された状態を示す一部を断面とする側面図である。図２３において、１２は四辺に各々斜面１２ａが形成され図中下方向に行くにつれて開口部を広げるくぼみ形状の電子部品保持部が形成された内面角錐型の接合ツールである。１２ｂは接合ツール１２に設けられた真空吸着穴である。接合ツール１２は四辺に各々斜面１２ａを有する内面角錐型の電子部品保持部に第１の電子部品１を保持して超音波振動を第１の電子部品１に伝搬する。他の構成は図２１及び図２２に示される従来技術と同じである。
【０００７】
【発明が解決しようとする課題】
図２１及び図２２に示される従来技術では、突起電極３と電極２ｃとの接合が進行して両者間に働く接合力が増すと、第１の電子部品１に徐々に止まろうとする力が働くのに対して、接合ツール４はそのまま振動を続けるので、接合ツール４と第１の電子部品１の裏面との間で強制的な往復運動（位置ずれ）が生じ、第１の電子部品１の裏面が擦られて破損するといった問題があった。
【０００８】
また、第１の電子部品１の第２の面１ｂに電極等の複数の突起物が形成されている場合は、接合ツール４の電子部品保持面に突起の先端しか接触しないこととなり、接合ツール４と第１の電子部品１との接触面積が減少しすべりが生じやすくなるため、突起電極３に超音波振動を十分伝達することができずに適正な接合が行われないといった問題や、突起物により接合ツール４が磨耗して接合ツール４の寿命が短くなるといった問題があった。
【０００９】
これに対し、図２３に示される従来技術では、接合ツール１２と第１の電子部品１とのすべりは改善されている。しかしながら、図２３に示される従来技術においても、突起電極３と電極２ｃとの接合が進行して接合力が増した場合、第１の電子部品１に大きな超音波振動が伝搬され続けるので接合部が破損するといった問題があった。
【００１０】
さらに、電極数が多く、大きな超音波出力が必要となる場合には、接合中に第１の電子部品１と角錐型接合ツール１２の斜面１２ａとの接触部に過大な荷重が集中して第１の電子部品１を破損させる問題があり、特に化合物半導体のように脆弱な部品への適用には制限があった。
【００１１】
この発明は上述のような課題を解決するためになされたもので、電子部品を破損させることなく、突起電極と電極とを安定した状態で接合することができる電子部品製造装置および電子部品製造方法を得ることを目的とする。
【００１２】
【課題を解決するための手段】
この発明に係る電子部品製造装置は、第１の面に複数の電極が形成された第２の電子部品を、第１の面を外方に向けて電子部品固定部に固定する接合ステージと、接合ステージに対して移動可能に設けられ、第１の電子部品に超音波振動を伝搬する超音波振動伝搬体と、超音波振動伝搬体の振動伝達端に超音波振動方向と同じ方向に移動可能に支持され、超音波振動伝搬体と反対側の面に電子部品保持部が形成され、第１の面に複数の突起電極が形成され第１の面が第２の電子部品に対向するように電子部品保持部に配置された第１の電子部品を、電子部品保持部に設けられた電子部品吸着手段により吸着して保持する接合ツールとを備え、超音波振動伝搬体は、第１の電子部品の突起電極を第２の電子部品の電極に位置決めし、突起電極を電極に押圧しながら超音波振動伝搬体を振動させて超音波振動を第１の電子部品に伝搬するとともに、突起電極と電極との間に所定の接合力が生じたときに接合ツールを超音波振動方向にすべらせながら第２の電子部品に第１の電子部品を接続する。
【００１３】
また、超音波振動伝搬体は、接合ツール吸着手段によって振動伝達端に設けられたすべり面に接合ツールを吸着して超音波振動方向と同じ方向に移動可能に支持する。
【００１４】
また、超音波振動伝搬体は、振動伝達端に設けられた弾性体を介して接合ツールを超音波振動方向と同じ方向に移動可能に支持する。
【００１５】
また、接合ツールは、概略矩形の第１の電子部品の少なくとも対向する２辺を把持する電子部品把持手段を有し、電子部品吸着手段により吸着しながら電子部品把持手段によって把持して第１の電子部品を電子部品保持部に保持する。
【００１６】
また、超音波振動伝搬体に対向する対向面に接合ツールを位置決めする位置合せ爪を有する接合ツールステージをさらに備え、超音波振動伝搬体は、接合ツールステージによって位置決めされた接合ツールを接合ツール吸着手段によってすべり面に吸着する。
【００１７】
また、この発明に係る電子部品製造方法は、第１の電子部品に超音波振動を伝搬する超音波振動伝搬体と、超音波振動伝搬体の振動伝達端に超音波振動方向と同じ方向に移動可能に支持され、超音波振動伝搬体と反対側の面に電子部品保持部が形成され、電子部品保持部に設けられた電子部品吸着手段により電子部品保持部に第１の電子部品を保持する接合ツールと、電子部品保持部に対向する面に第２の電子部品を固定する電子部品固定部が設けられた接合ステージとを有する電子部品製造装置を使用する電子部品製造方法であって、第１の面に複数の電極が形成された第２の電子部品を、第１の面を外方に向けて電子部品固定部に固定する第２電子部品固定工程と、第１の面に複数の突起電極が形成された第１の電子部品を、第１の面が第２の電子部品に対向するように電子部品保持部に吸着する第１電子部品吸着工程と、第１の電子部品の突起電極を第２の電子部品の電極に位置決めし、突起電極を電極に押圧しながら超音波振動伝搬体を振動させて超音波振動を第１の電子部品に伝搬するとともに、突起電極と電極との間に所定の接合力が生じたときに接合ツールを超音波振動方向にすべらせながら第２の電子部品に第１の電子部品を接続する電子部品接続工程とを備えている。
【００１８】
また、接合ツールは超音波振動伝搬体に設けられた接合ツール吸着手段によって振動伝達端に設けられたすべり面に吸着されて支持され、接合ツールを振動伝達端のすべり面に吸着する接合ツール吸着工程をさらに備えている。
【００１９】
また、超音波振動伝搬体に対して接合ツールを所定の位置に位置決めする接合ツール位置決め工程をさらに備え、接合ツール吸着工程は、接合ツール位置決め工程によって位置決めされた接合ツールをすべり面に吸着する。
【００２０】
さらに、第１電子部品吸着工程は、概略矩形の第１の電子部品の少なくとも対向する２辺を把持しながら第１の電子部品を電子部品保持部に吸着する。
【００２１】
【発明の実施の形態】
実施の形態１．
図１から図８はこの発明の実施の形態１による電子部品製造装置および電子部品製造方法を示す一部を断面とする側面図である。図３において、１は概略矩形の平板状をなし図中下側の第１の面１ａに複数の電極１ｃが形成された第１の電子部品である。第１の電子部品１の各電極１ｃには後で詳しく述べる突起電極３が設けられている。２は概略矩形の平板状をなし図中上側の第１の面２ａに複数の電極２ｃが形成された第２の電子部品である。第２の電子部品２は電極２ｃが形成された第１の面２ａを外方に向けて接合ステージ６上の電子部品固定部６ａに固定されている。接合ステージ６の電子部品固定部６ａには、第２の電子部品２を吸着する真空吸着穴５が設けられている。
【００２２】
図１において、８は図示しない超音波振動伝搬装置の超音波振動伝搬体である。超音波振動伝搬体８は、接合ツールステージ９及び接合ステージ６に対してＸ軸、Ｙ軸およびＺ軸方向に移動可能とされ且つ第１の電子部品１に超音波振動を伝搬するために例えば片側１μｍの振幅の超音波振動をする。超音波振動伝搬体８の図１の下端の振動伝達端には、平坦なすべり面８ｃが形成されている。また、超音波振動伝搬体８には、第１の電子部品１を吸着する接合ツール吸着手段として真空吸着穴８ａ、及び後述する接合ツール４を吸着する接合ツール吸着手段として真空吸着穴８ｂが軸方向に貫通して設けられている。
【００２３】
図２において、４は超音波振動伝搬体８の振動伝達端のすべり面８ｃに真空吸着穴８ｂによって空気を吸引されて吸着された接合ツールである。接合ツール４の超音波振動伝搬体８に吸着される面と反対側の面には、第１の電子部品１を保持するための電子部品保持部４ｂが形成されている。電子部品保持部４ｂは四辺に各々斜面が形成され図中下方向に行くにつれて開口部を広げるくぼみ形状、すなわち、内面角錐型をなしている。接合ツール４の中央部には、真空吸着穴８ａに連通して空気を吸引して第１の電子部品１を吸着する電子部品吸着手段としての真空吸着穴４ａが穿孔されている。
本実施の形態では、接合ツール４はステンレス鋼にて作製されている。しかしながら、接合ツール４はステンレス鋼に限られるものではなく、例えばセラミックス材料で作製されてもよい。
【００２４】
また、図２において、９は接合ツール４を位置決めするための接合ツールステージである。接合ツールステージ９の超音波振動伝搬体８に対向する対向面には、接合ツール４を位置決めするための位置合せ爪１０が設けられている。
【００２５】
図１は接合ツールステージ９上の接合ツール４と超音波振動伝搬体８とが位置合わせされた状態を示す一部を断面とする側面図である。一連の工程において、まず、接合ツール４が、後で詳しく説明するように、接合ツールステージ９上で超音波振動伝搬体８に対して位置合わせされる。
【００２６】
図２は超音波振動伝搬体８の振動伝達端のすべり面８ｃに接合ツール４が真空吸着穴８ｂによって吸着される接合ツール吸着工程を示す一部を断面とする側面図である。接合ツール吸着工程においては、接合ツールステージ９上で超音波振動伝搬体８に対して位置合わせされた接合ツール４は、図中下方向であるＺ軸方向に移動した超音波振動伝搬体８のすべり面８ｃに、真空吸着穴８ｂによって真空吸着保持される。
【００２７】
図３は第１の電子部品１を真空吸着穴８ａで吸引して接合ツール４の電子部品保持部４ｂに真空吸着保持する第１電子部品吸着工程と、第２の電子部品２を第１の面２ａを外方に向けて電子部品固定部６ａに固定する第２電子部品固定工程とを示すとともに、第１の電子部品１の電極１ｃに形成された突起電極３と、接合ステージ６に真空吸着保持された第２の電子部品２の電極２ｃとが位置合わせされた状態を示す一部を断面とする側面図である。
【００２８】
第１電子部品吸着工程においては、振動伝達端のすべり面８ｃに接合ツール４を吸着した超音波振動伝搬体８が、例えば接合ステージ６に対して水平方向であるＸＹ平面に移動して、図示しない載置台等に置かれた第１の電子部品１を真空吸着穴８ａで吸引して接合ツール４の電子部品保持部４ｂに真空吸着保持する。
【００２９】
第２電子部品固定工程においては、接合ステージ６の電子部品固定部６ａに図示しない電子部品載置装置等によって第２の電子部品２が第１の面２ａを外方に向けて載置され、真空吸着穴５によって真空吸着されて固定される。
その後、図３に示されるように第１の電子部品１の電極１ｃに形成された突起電極３と、接合ステージ６に真空吸着保持された第２の電子部品２の電極２ｃとが位置合わせされる。
【００３０】
本実施の形態では、第１の電子部品１としてシリコン材料の半導体素子を用いている。しかしながら、第１の電子部品１として適用される部品は、シリコン材料の半導体素子に限られるものではなく、シリコン・ゲルマニュウムの合体、ヒ化ガリュウム、あるいはリン化インジューム等を材料とする他の半導体素子でもよい。そしてさらには、セラミックス配線基板や樹脂配線基板も適用することができる。
【００３１】
本実施の形態で用いたシリコン材料の半導体素子には、直径２５μｍの金ワイヤの先端を溶融凝固させて直径７５μｍの金ボールを形成した後、金ボールを電極に接合し、金ボールから金ワイヤを所定の長さ切り離すことで、直径の平均値が９７μｍの金の突起電極３を１２個形成した。ここで、突起電極３は金に限らず、例えば、銅や銀あるいは金合金、銅合金、銀合金で形成してもよい。
【００３２】
また、本実施の形態では、第２の電子部品２としてアルミナ配線基板を用いたが、アルミナ配線基板に限らずガラスセラミックスや窒化アルミ等を材料とするセラミックス基板や樹脂基板でもよく、さらにはシリコン，シリコン・ゲルマニュウム，ガリュウム・ヒ素，インジューム・リン等を材料とする半導体素子も適用することができる。
【００３３】
図４は突起電極３と第２の電子部品２の電極２ｃとを加圧するとともに、超音波振動伝搬体８によって接合ツール４に超音波振動が伝搬された状態を示す一部を断面とする側面図である。
第１の電子部品１の突起電極３と第２の電子部品２の電極２ｃとが位置合わせされた後、超音波振動伝搬体８がＺ軸方向に移動し、突起電極３を所定の押圧力で電極２ｃに押圧しながら、超音波振動伝搬体８が図中矢印Ａに示されるように超音波振動を第１の電子部品１に伝搬する。所定の押圧力と超音波振動によって突起電極３と電極２ｃとがこすれあい表面の汚れや膜が除去されて両者は固相接合される。
【００３４】
本実施の形態においては、接合ステージ６を１５０℃に加熱した状態で、第１の電子部品１であるシリコン材料の半導体素子と第２の電子部品２であるアルミナ配線基板とを１２００ｇｆの押圧力で加圧するとともに片側１μｍの振幅で６０ＫＨｚの超音波振動を伝搬した。
【００３５】
図５は第１の電子部品１の突起電極３と第２の電子部品の電極２ｃとの接合が進行した電子部品接続工程を示すとともに、突起電極３と電極２ｃとの接合力が増加し、接合ツール４に対して超音波振動伝搬体８が矢印Ｂ方向にすべった状態を示す一部を断面とする側面図である。
【００３６】
電子部品接続工程においては、突起電極３が電極２ｃに押圧されながら超音波振動が伝搬され、所定の押圧力と超音波振動によって突起電極３と電極２ｃとが固相接合される。そして、突起電極３と電極２ｃにとの接合が進行し、突起電極３と電極２ｃとの接合力が増加し所定の大きさ以上になったとき、接合ツール４は超音波振動伝搬体８のすべり面８ｃに対してすべり始める。突起電極３と電極２ｃとの接合力に対してすべり始める摩擦抵抗を調節するには、すべり面８ｃ及びこれに対面して接触する接合ツール４の接触面の滑らかさを適正なものにするとともに、真空吸着穴８ｂによる真空吸着力を適度に変化させて調節する。
【００３７】
本実施の形態においては、片側１μｍの振幅で６０ＫＨｚの超音波振動を０．３秒間伝搬し、金の突起電極３と金の電極２ｃとをせん断破断荷重７０ｇｆ／バンプ以上で接合した。このとき、突起電極３と電極２ｃとの接合が進行して、両者間に働く接合力が所定の値まで増した場合、超音波振動伝搬体８に対して接合ツール４がすべり始め、第１の電子部品１の裏面は破損することがなかった。なお、接合ツール４とすべり面８ｃとの摩擦抵抗を所定の値とするために、超音波振動の伝搬中は真空吸着穴８ｂによる接合ツール４の真空吸着を停止した。
【００３８】
一方、同じ対象物、すなわち、第１の電子部品１にシリコン材料の半導体素子、第２の電子部品２にアルミナ配線基板を適用して、図５に示す従来の方法で接合した場合、超音波振動の伝搬時間が０．１秒以下では第１の電子部品１の裏面に破損は生じなかったものの、最小のせん断破断荷重が２５ｇｆ／バンプとなり十分な接合力が得られなかった。また、超音波振動の伝搬時間を０．１秒より長くしてゆくとそれにともない接合力は増したが、第１の電子部品１と接合ツール４の間に位置ずれが生じ第１の電子部品１の裏面が破損した。
【００３９】
図６は真空吸着穴８ａの真空吸着を停止するとともに真空吸着穴８ｂで再び接合ツール４を真空吸着保持し、超音波振動伝搬体８を上方に移動させて第１の電子部品１と接合ツール４とを離間させた状態を示す一部を断面とする側面図である。図７は接合ツール４を接合ツールステージ９に置く状態を示す一部を断面とする側面図である。
【００４０】
第１の電子部品１の突起電極３と第２の電子部品の電極２ｃとの接合が終了すると、超音波振動伝搬体８がＺ軸で第１の電子部品１と離れる上方向に移動し、その後ＸＹ平面内で移動して接合ツールステージ９に向かう、そして再び下降して接合ツールステージ９の所定の位置に接合ツール４を置く、そして真空吸着穴８ｂの真空吸着を停止し超音波振動伝搬体８は上方に逃げる。
【００４１】
図８は両側から位置合せ爪１０で接合ツール４を押し、接合ツール４を接合ステージ９の所定の位置に移動させる接合ツール位置決め工程を示す一部を断面とする側面図である。
接合ツール位置決め工程においては、接合ツールステージ９の所定の位置に置かれた接合ツール４は、四方から図中矢印Ｃのようにスライドして接合ツール４の各面を押す位置合せ爪１０によって所定の位置に位置決めされる。その後、工程は図１に示される状態に戻るが、接合ツール４は、超音波振動伝搬体８に対して正確に位置決めされた位置にあり、図２に示される接合ツール吸着工程では、接合ツール４は超音波振動伝搬体８の所定の位置に正確に吸着される。
【００４２】
以上のように本実施の形態の電子部品製造装置および電子部品製造方法においては、突起電極３と電極２ｃとの接合が進行して両者間の接合力が増加しても、接合ツール４と第１の電子部品１の裏面との間で位置ずれが生じないので、第１の電子部品１の裏面が破損することがない。
【００４３】
また、さらに、接合ツール４と超音波振動伝搬体８との間にすべりが生じるため、突起電極３と電極２ｃとの接合がさらに進行して両者間の接合部に大きな超音波振動が加わり続けても接合部が破損することもない。
【００４４】
なお、接合ツール４と超音波振動伝搬体８のすべり面８ｃとの摩擦抵抗をすくなくしてすべりを生じやすくするため、接合ツール４の裏面に凹部を設けてすべり面８ｃとの接触面積を低減してもよい。さらには、接合中に真空吸着穴８ｂから逆に空気を吹き付けて接合ツール４と超音波振動伝搬体８との摩擦抵抗を低減してもよい。
【００４５】
実施の形態２．
図９から図１６はこの発明の実施の形態２による電子部品製造装置および電子部品製造方法を示す一部を断面とする側面図である。図９から図１６において、実施の形態１と同一または相当部分には同一符号を付し、その説明を省略する。本実施の形態においては、実施の形態１に対して、接合ツール４が異なったものとなっている。図９から図１６において、４ｄは接合ツール４のスライド部、４ｃは接合ツール４の真空吸着穴、４ｆは接合ツール４に設けられた電子部品把持手段としての把持爪、８ｄは超音波振動伝搬体８の真空吸着穴である。その他の構成は実施の形態１と概略同様である。
【００４６】
図９は接合ツールステージ９上の接合ツール４と超音波振動伝搬体８とが位置合わせされた状態を示す一部を断面とする側面図である。接合ツール４は、第１の電子部品１を真空吸着する真空吸着穴４ａと、真空吸着穴４ｃ内部の空気圧を可変させることでスライドするスライド部４ｄを備えている。スライド部４ｄは接合ツール本体４ｅに対して進退動可能に設けられている。スライド部４ｄと接合ツール本体４ｅの間には、図示しない弾性体が縮設されている。この弾性体により、スライド部４ｄは、常時は接合ツール本体４ｅと離れるように付勢されている。そして、真空吸着穴４ｃによって内部を減圧されて接合ツール本体４ｅに近づく方向に移動する。接合ツール本体４ｅとスライド部４ｄには、それぞれ把持爪４ｆ，４ｆが突設されている。２つの把持爪４ｆ，４ｆは互いに近づく方向に移動することで第１の電子部品１を挟んで挟持する。
本実施の形態では、接合ツール４はステンレス鋼で作製されているが、ステンレス鋼に限定されることはなく、例えばセラミックス材料が用いられてもよい。
【００４７】
図１０は超音波振動伝搬体８の振動伝達端のすべり面８ｃに接合ツール４が真空吸着穴８ｂによって吸着される接合ツール吸着工程を示す一部を断面とする側面図である。図１１は第１の電子部品１を真空吸着穴８ａで吸引して接合ツール４の電子部品保持部４ｂに真空吸着するとともに、真空吸着穴８ｄを真空吸引して接合ツール４のスライド部４ｄをスライドさせ、第１の電子部品１の対向する１対の側面を挟み込んで保持する第１電子部品吸着工程と、第２の電子部品２を第１の面２ａを外方に向けて電子部品固定部６ａに固定する第２電子部品固定工程とを示すとともに、第１の電子部品１の電極１ｃに形成された突起電極３と、接合ステージ６に真空吸着保持された第２の電子部品２の電極２ｃとが位置合わせされた状態を示す一部を断面とする側面図である。
【００４８】
第１電子部品吸着工程においては、振動伝達端のすべり面８ｃに接合ツール４を吸着した超音波振動伝搬体８が、例えば接合ステージ６に対して水平方向であるＸＹ平面内で移動して、図示しない載置台等に置かれた第１の電子部品１を真空吸着穴８ａで吸引して接合ツール４の電子部品保持部４ｂに真空吸着保持する。このとき、同時に真空吸着穴８ｄから空気を吸引して接合ツール４のスライド部４ｄをスライドさせ、第１の電子部品１の対向する１対の側面を把持爪４ｆ，４ｆで挟み込んで保持する。
【００４９】
第２電子部品固定工程においては、接合ステージ６の電子部品固定部６ａに図示しない電子部品載置装置によって第２の電子部品２が第１の面２ａを外方に向けて載置され、真空吸着穴５によって真空吸着されて固定される。
その後、図１１に示されるように第１の電子部品１の電極１ｃに形成された突起電極３と、接合ステージ６に真空吸着保持された第２の電子部品２の電極２ｃとが位置合わせされる。
【００５０】
本実施の形態では、第１の電子部品１としてヒ化ガリュウム材料の半導体素子を用いている。しかしながら、第１の電子部品１として適用される部品は、ヒ化ガリュウム材料の半導体素子に限られるものではなく、シリコン、シリコン・ゲルマニュウムの合体、あるいはリン化インジューム等を材料とする他の半導体素子でもよい。そしてさらには、セラミックス配線基板や樹脂配線基板も適用することができる。
【００５１】
本実施の形態で用いたヒ化ガリュウム材料の半導体素子には、直径２５μｍの金ワイヤの先端を溶融凝固させて直径７５μｍの金ボールを形成した後、金ボールを電極に接合し、金ボールから金ワイヤを所定の長さ切り離すことで、直径の平均値が９７μｍの金の突起電極３を３０個形成した。ここで、突起電極３は金に限らず、例えば、銅や銀あるいは金合金、銅合金、銀合金で形成してもよい。
【００５２】
また、本実施の形態では、第２の電子部品２としてアルミナ配線基板を用いたが、アルミナ配線基板に限らずガラスセラミックスや窒化アルミ等を材料とするセラミックス基板や樹脂基板でもよく、さらにはシリコン，シリコン・ゲルマニュウム，ガリュウム・ヒ素，インジューム・リン等を材料とする半導体素子も適用することができる。
【００５３】
図１２は突起電極３と第２の電子部品の電極２ｃとを加圧するとともに、接合ツール４とスライド部４ｄに挟み込まれた第１の電子部品１に挟持する１対の側面に垂直な方向に超音波振動が伝搬された状態を示す一部を断面とする側面図である。
【００５４】
第１の電子部品１の突起電極３と第２の電子部品２の電極２ｃとが位置合わせされた後、超音波振動伝搬体８がＺ軸方向に移動し、突起電極３を所定の押圧力で電極２ｃに押圧しながら、超音波振動伝搬体８が図中矢印Ｄに示されるように超音波振動を第１の電子部品１に伝搬する。所定の押圧力と超音波振動によって突起電極３と電極２ｃとがこすれあい表面の汚れや膜が除去されて固相接合される。
【００５５】
本実施の形態においては、超音波振動方向に垂直な２つの側面を接合ツール４で挟み込むことで、突起電極３の数が増して接合に大きな超音波出力が必要となる場合でも、角錐型接合ツールのように第１の電子部品１と接合ツール４との接触部に過大な荷重集中が生じることがなく、化合物半導体のように脆弱な部品でも破損することがない。
【００５６】
本実施の形態においては、接合ステージ６を１５０℃に加熱した状態で、第１の電子部品１であるヒ化ガリュウム材料の半導体素子と第２の電子部品２であるアルミナ配線基板とを２７００ｇｆの押圧力で加圧するとともに片側２μｍの振幅で６０ＫＨｚの超音波振動を伝搬した。
【００５７】
図１３は第１の電子部品１の突起電極３と第２の電子部品の電極２ｃとの接合が進行した電子部品接続工程を示すとともに、突起電極３と電極２ｃとの接合力が増加し、接合ツール４に対して超音波振動伝搬体８が矢印Ｅ方向にすべった状態を示す一部を断面とする側面図である。
電子部品接続工程においては、突起電極３が電極２ｃに押圧されながら超音波振動が伝搬され、所定の押圧力と超音波振動によって突起電極３と電極２ｃとが固相接続される。そして、突起電極３と電極２ｃにとの接合が進行し、突起電極３と電極２ｃとの接合力が増加し所定の大きさ以上になったとき、接合ツール４は超音波振動伝搬体８のすべり面８ｃに対してすべり始める。突起電極３と電極２ｃとの接合力に対してすべり始める摩擦抵抗を調節するには、すべり面８ｃ及びこれに対向して接触する接合ツール４の接触面の滑らかさを適正なものにするとともに、真空吸着穴８ｂによる真空吸着力を適度に変化させて調節する。
【００５８】
本実施の形態においては、突起電極３を３０個形成したが、突起電極３の数が増加すると、これに伴い突起電極３と電極２ｃとの間に生じる接合力が大きくなる。そのため、両者の接合が十分に進行する前に接合ツール４とすべり面８ｃとの間ですべりが生じてしまう場合がある。接合が十分に進行する前に接合ツール４がすべり面８ｃに対してすべると超音波振動が接合部に伝わらず接合が完全に行われない問題が生じる。
【００５９】
そこで、本実施の形態では、超音波振動伝搬開始から０．１秒間は真空吸着穴８ｂで接合ツール４を真空吸着したままとし、超音波振動伝搬体８と接合ツール４とのすべりを防止して接合を進ませた。その後、真空吸着を停止してさらに超音波振動を０．４秒間伝搬した。これにより、素子裏面の破損を生じさせることなく、金の突起電極３とアルミナ配線板の厚さ３μｍの金の電極２ｃとをせん断破断荷重７５ｇｆ／バンプ以上で接合することができた。
【００６０】
本実施の形態では、真空吸着の停止のタイミングは、超音波振動の伝搬時間で得ている。このタイミングは、接合中の超音波振幅，超音波振動子のインピーダンス，荷重等を測定してタイミングを得ることもできる。すなわち、接合が進行するにつれて超音波振幅はしだいに小さくなるので、これを検出しながら接合を行い所定の大きさ以下になったときに、真空吸着を停止するあるいは逆に空気を吹き付けることで接合ツール４と超音波振動伝搬体８との摩擦抵抗を低減してもよい。
また、接合が進行するにつれて超音波インピーダンスがしだいに大きくなるので、これを検出しながら接合を行い所定の大きさ以上になったときに、真空吸着を停止するあるいは逆に空気を吹き付けることで接合ツール４と超音波振動伝搬体８との摩擦抵抗を低減してもよい。
さらには、接合が進行するにつれて超音波振動伝搬体８に作用する荷重はしだいに大きくなるので同様の方法でタイミングの制御に用いることができる。
【００６１】
図１４は真空吸着穴８ａの真空吸着を停止するとともに真空吸着穴８ｂで再び接合ツール４を真空吸着保持し、超音波振動伝搬体８を上方に移動させて第１の電子部品１と接合ツール４とを離間させた状態を示す一部を断面とする側面図である。図１５は接合ツール４を接合ツールステージ９に置く状態を示す一部を断面とする側面図である。
【００６２】
第１の電子部品１の突起電極３と第２の電子部品の電極２ｃとの接合が終了すると、超音波振動伝搬体８がＺ軸で第１の電子部品１と離れる上方向に移動し、その後ＸＹ平面内で移動して接合ツールステージ９に向かう、そして再びＺ軸方向に下降して接合ツールステージ９の所定の位置に接合ツール４を置く、そして真空吸着穴８ｂの真空吸着を停止し超音波振動伝搬体８は上方に逃げる。
【００６３】
図１６は両側から位置合せ爪１０で接合ツール４を押し、接合ツール４を接合ステージ９の所定の位置に移動させる接合ツール位置決め工程を示す一部を断面とする側面図である。
接合ツール位置決め工程においては、接合ツールステージ９の所定の位置に置かれた接合ツール４は、四方から図中矢印Ｆのようにスライドして接合ツール４の各面を押す位置合せ爪１０にて所定の位置に位置決めされる。その後、工程は図９に示される状態に戻るが、接合ツール４は、超音波振動伝搬体８に対して位置決めされた位置にあり、図１０に示される接合ツール吸着工程では、接合ツール４は超音波振動伝搬体８の所定の位置に正確に吸着される。
【００６４】
以上のように本実施の形態の電子部品製造装置および電子部品製造方法においては、接合ツール４は、概略矩形平板状の第１の電子部品１の対向する２辺を把持する電子部品把持手段としての２つの把持爪４ｆ，４ｆを有し、真空吸着穴８ａによって吸着しながら把持爪４ｆ，４ｆで把持して第１の電子部品１を電子部品保持部４ｂに保持する。そのため、接合ツール４と第１の電子部品１の裏面との間に発生する位置ずれをさらに抑制することができ、さらに第１の電子部品１の裏面の破損を防止することがなくなる。
【００６５】
尚、本実施の形態においては、把持爪４ｆ，４ｆを動かす駆動力として気体の圧力を利用したが、他に液体による圧力や電磁力あるいはバネや圧電素子やネジによる圧力を用いても同様の効果が得られる。また、第１の電子部品１の２辺を挟み込んでいるが、電子部品把持手段は、第１の電子部品１と接合ツール４とのすべりを防止することが目的であり、３辺あるいは４辺を把持してもよいことは言うまでもない。
【００６６】
実施の形態３．
図１７から図２０はこの発明の実施の形態３による電子部品製造装置および電子部品製造方法を示す一部を断面とする側面図である。図１７から図２０において、実施の形態１と同一または相当部分には同一符号を付し、その説明を省略する。図１７から図２０において、１１は超音波振動伝搬体８の振動伝達端に設けられ接合ツール４を超音波振動方向と同じ方向に移動可能に支持する弾性体としてのバネである。バネ１１は超音波振動伝搬体８と接合ツール４との間で２方向から接合ツール４を押圧して接合ツール４を所定の位置に配置する。その他の構成は実施の形態１と概略同様である。
【００６７】
図１７は第１の電子部品１を真空吸着穴８ａで吸引して接合ツール４の電子部品保持部４ｂに真空吸着保持する第１電子部品吸着工程と、第２の電子部品２を第１の面２ａを外方に向けて電子部品固定部６ａに固定する第２電子部品固定工程とを示すとともに、第１の電子部品１の電極１ｃに形成された突起電極３と、接合ステージ６に真空吸着保持された第２の電子部品２の電極２ｃとが位置合わせされた状態を示す一部を断面とする側面図である。
【００６８】
第１電子部品吸着工程においては、振動伝達端に接合ツール４を移動可能に支持した超音波振動伝搬体８が接合ステージ６に対して水平方向であるＸＹ平面内で移動して、図示しない載置台に置かれた第１の電子部品１を真空吸着穴８ａで吸引して接合ツール４の電子部品保持部４ｂに真空吸着保持する。
【００６９】
第２電子部品固定工程においては、接合ステージ６の電子部品固定部６ａに図示しない電子部品載置装置によって第２の電子部品２が第１の面２ａを外方に向けて載置され、真空吸着穴５によって真空吸着されて固定される。
その後、図１７に示されるように第１の電子部品１の電極１ｃに形成された突起電極３と、接合ステージ６に真空吸着保持された第２の電子部品２の電極２ｃとが位置合わせされる。
【００７０】
本実施の形態では、接合ツール４はステンレス鋼で作製されている。しなしながら、ステンレス鋼に限られるものではなく、例えばセラミックス材料で作製されてもよい。さらには、実施の形態２のように第１の電子部品１の対向する２辺を把持する手段を有する接合ツールを用いてもよい。
【００７１】
本実施の形態では、第１の電子部品１としてヒ化ガリュウム材料の半導体素子を用いている。しかしながら、第１の電子部品１として適用される部品は、ヒ化ガリュウム材料の半導体素子に限られるものではなく、シリコン、シリコン・ゲルマニュウムの合体、あるいはリン化インジューム等を材料とする他の半導体素子でもよい。そしてさらには、セラミックス配線基板や樹脂配線基板も適用することができる。
【００７２】
本実施の形態で用いたヒ化ガリュウム材料の半導体素子には、直径２５μｍの金ワイヤの先端を溶融凝固させて直径７５μｍの金ボールを形成した後、金ボールを電極に接合し、金ボールから金ワイヤを所定の長さ切り離すことで、直径の平均値が９７μｍの金の突起電極３を８個形成した。ここで、突起電極３は金に限らず、例えば、銅や銀あるいは金合金、銅合金、銀合金で形成してもよい。
【００７３】
また、本実施の形態では、第２の電子部品２としてアルミナ配線基板を用いたが、アルミナ配線基板に限らずガラスセラミックスや窒化アルミ等を材料とするセラミックス基板や樹脂基板でもよく、さらにはシリコン，シリコン・ゲルマニュウム，ガリュウム・ヒ素，インジューム・リン等を材料とする半導体素子も適用することができる。
【００７４】
図１８は突起電極３と第２の電子部品２の電極２ｃとを加圧するとともに、超音波振動伝搬体８によって接合ツール４に超音波振動が伝搬された状態を示す一部を断面とする側面図である。
【００７５】
第１の電子部品１の突起電極３と第２の電子部品２の電極２ｃとが位置合わせされた後、超音波振動伝搬体８がＺ軸方向に移動し、突起電極３を所定の押圧力で電極２ｃに押圧しながら、超音波振動伝搬体８が図中矢印Ｇに示されるように超音波振動を第１の電子部品１に伝搬する。所定の押圧力と超音波振動によって突起電極３と電極２ｃとはこすれあい表面の汚れや膜が除去されて固相接合される。
【００７６】
本実施の形態においては、接合ステージ６を１５０℃に加熱した状態で、第１の電子部品１であるヒ化ガリュウム材料の半導体素子と第２の電子部品２であるアルミナ配線基板とを８００ｇｆの押圧力で加圧するとともに片側０．８μｍの振幅で６０ＫＨｚの超音波振動を伝搬した。
【００７７】
図１９は第１の電子部品１の突起電極３と第２の電子部品の電極２ｃとの接合が進行した電子部品接続工程を示すとともに、突起電極３と電極２ｃとの接合力が増加し、接合ツール４に対して超音波振動伝搬体８が矢印Ｈ方向にすべった状態を示す一部を断面とする側面図である。
【００７８】
電子部品接続工程においては、突起電極３が電極２ｃに押圧されながら超音波振動が伝搬され、所定の押圧力と超音波振動によって突起電極３と電極２ｃとが固相接続される。そして、突起電極３と電極２ｃにとの接合が進行し、突起電極３と電極２ｃとの接合力が増加し所定の大きさ以上になったとき、接合ツール４は超音波振動伝搬体８のすべり面８ｃに対してすべり始める。突起電極３と電極電極２ｃとの接合力に対してすべり始める摩擦抵抗を調節するには、すべり面８ｃ及びこれに対向して接触する接合ツール４の接触面の滑らかさを適正なものにする。
【００７９】
本実施の形態においては、接合ステージ６を１５０℃に加熱した状態で、第１の電子部品１であるヒ化ガリュウム材料の半導体素子と第２の電子部品２であるアルミナ配線基板とを８００ｇｆの押圧力で加圧するとともに片側０．８μｍの振幅で６０ＫＨｚの超音波振動を伝搬した。
【００８０】
図２０は真空吸着穴８ａの真空吸着を停止し、超音波振動伝搬体８を上方に移動させて第１の電子部品１と接合ツール４とを分離した状態を示す一部を断面とする側面図である。
【００８１】
以上のように本実施の形態の電子部品製造装置および電子部品製造方法においては、接合ツール４は、弾性体としてのバネ１１により支持されて超音波振動伝搬体８の振動伝達端に常時設けられている。そのため、超音波振動伝搬体８に接合ツール４を吸着する接合ツール吸着工程や超音波振動伝搬体８に対して接合ツール４の位置決めを行う接合ツール位置決め工程がなくなり、全体として加工時間が削減され、生産性が向上しコストをさげることができる。
尚、本実施の形態においては、接合条件によって適度な弾性力を有するバネ１１を選択することにより適正な接合を行うことができる。
【００８２】
【発明の効果】
この発明に係る電子部品製造装置は、第１の面に複数の電極が形成された第２の電子部品を、第１の面を外方に向けて電子部品固定部に固定する接合ステージと、接合ステージに対して移動可能に設けられ、第１の電子部品に超音波振動を伝搬する超音波振動伝搬体と、超音波振動伝搬体の振動伝達端に超音波振動方向と同じ方向に移動可能に支持され、超音波振動伝搬体と反対側の面に電子部品保持部が形成され、第１の面に複数の突起電極が形成され第１の面が第２の電子部品に対向するように電子部品保持部に配置された第１の電子部品を、電子部品保持部に設けられた電子部品吸着手段により吸着して保持する接合ツールとを備え、超音波振動伝搬体は、第１の電子部品の突起電極を第２の電子部品の電極に位置決めし、突起電極を電極に押圧しながら超音波振動伝搬体を振動させて超音波振動を第１の電子部品に伝搬するとともに、突起電極と電極との間に所定の接合力が生じたときに接合ツールを超音波振動方向にすべらせながら第２の電子部品に第１の電子部品を接続する。そのため、第１の電子部品と第２の電子部品の接合中に、接合ツールに対して第１の電子部品が位置ずれを発生することがなくなる。その結果、第１の電子部品を破損させることなく、第１の電子部品と第２の電子部品とを安定した状態で接合することができる。
【００８３】
また、超音波振動伝搬体は、接合ツール吸着手段によって振動伝達端に設けられたすべり面に接合ツールを吸着して超音波振動方向と同じ方向に移動可能に支持する。そのため、電子部品吸着手段と同じ駆動源を用いて接合ツールをすべり面に吸着することができ、簡単な構成とすることができるので、コストダウンをすることができる。
【００８４】
また、超音波振動伝搬体は、振動伝達端に設けられた弾性体を介して接合ツールを超音波振動方向と同じ方向に移動可能に支持する。そのため、接合ツールに力が働かなくなったとき、弾性体は接合ツールを所定の位置に支持するので、超音波振動伝搬体に対して接合ツールを位置決めする動作は、第１の電子部品から接合ツールを離間させるのみの動作でよく、製造時間を短縮することができるので、コストダウンをすることができる。
【００８５】
また、接合ツールは、概略矩形の第１の電子部品の少なくとも対向する２辺を把持する電子部品把持手段を有し、電子部品吸着手段により吸着しながら電子部品把持手段によって把持して第１の電子部品を電子部品保持部に保持する。そのため、第１の電子部品が安定して保持され、接合ツールに対して第１の電子部品がさらに位置ずれを発生することがなくなり、第１の電子部品と第２の電子部品とをさらに安定した状態で接合することができる。
【００８６】
また、超音波振動伝搬体に対向する対向面に接合ツールを位置決めする位置合せ爪を有する接合ツールステージをさらに備え、超音波振動伝搬体は、接合ツールステージによって位置決めされた接合ツールを接合ツール吸着手段によってすべり面に吸着する。そのため、超音波振動伝搬体から離脱してしまう接合ツールを簡単な構成で位置決めすることができ、コストダウンをすることができる。
【００８７】
また、この発明に係る電子部品製造方法は、第１の電子部品に超音波振動を伝搬する超音波振動伝搬体と、超音波振動伝搬体の振動伝達端に超音波振動方向と同じ方向に移動可能に支持され、超音波振動伝搬体と反対側の面に電子部品保持部が形成され、電子部品保持部に設けられた電子部品吸着手段により電子部品保持部に第１の電子部品を保持する接合ツールと、電子部品保持部に対向する面に第２の電子部品を固定する電子部品固定部が設けられた接合ステージとを有する電子部品製造装置を使用する電子部品製造方法であって、第１の面に複数の電極が形成された第２の電子部品を、第１の面を外方に向けて電子部品固定部に固定する第２電子部品固定工程と、第１の面に複数の突起電極が形成された第１の電子部品を、第１の面が第２の電子部品に対向するように電子部品保持部に吸着する第１電子部品吸着工程と、第１の電子部品の突起電極を第２の電子部品の電極に位置決めし、突起電極を電極に押圧しながら超音波振動伝搬体を振動させて超音波振動を第１の電子部品に伝搬するとともに、突起電極と電極との間に所定の接合力が生じたときに接合ツールを超音波振動方向にすべらせながら第２の電子部品に第１の電子部品を接続する電子部品接続工程とを備えている。そのため、電子部品接続工程において、第１の電子部品と第２の電子部品の接合中に、接合ツールに対して第１の電子部品が位置ずれおこすことがなく、第１の電子部品が破損することがなくなり、第１の電子部品と第２の電子部品とが安定した状態で接合される。
【００８８】
また、接合ツールは超音波振動伝搬体に設けられた接合ツール吸着手段によって振動伝達端に設けられたすべり面に吸着されて支持され、接合ツールを振動伝達端のすべり面に吸着する接合ツール吸着工程をさらに備えている。そのため、接合ツール吸着工程では、第１電子部品吸着工程と同じ駆動源の電子部品吸着手段にて接合ツールをすべり面に吸着し、装置を簡単な構成とすることができるので、コストダウンをすることができる。
【００８９】
また、超音波振動伝搬体に対して接合ツールを所定の位置に位置決めする接合ツール位置決め工程をさらに備え、接合ツール吸着工程は、接合ツール位置決め工程によって位置決めされた接合ツールをすべり面に吸着する。そのため、超音波振動伝搬体から離脱してしまう接合ツールを簡単な動作にて位置決めすることができる。
【００９０】
さらに、第１電子部品吸着工程は、概略矩形の第１の電子部品の少なくとも対向する２辺を把持しながら第１の電子部品を電子部品保持部に吸着する。そのため、電子部品接続工程において、第１の電子部品と第２の電子部品の接合中に、接合ツールに対して第１の電子部品がさらに位置ずれをおこすことがなく、第１の電子部品がさらに破損することがなくなり、第１の電子部品と第２の電子部品とがさらに安定した状態で接合される。
【図面の簡単な説明】
【図１】 この発明の実施の形態１の接合ツールと超音波振動伝搬体とが位置合わせされた状態を示す一部を断面とする側面図である。
【図２】 この発明の実施の形態１のすべり面に接合ツールが吸着される接合ツール吸着工程を示す一部を断面とする側面図である。
【図３】 この発明の実施の形態１の第１の電子部品を接合ツールの電子部品保持部に真空吸着保持する第１電子部品吸着工程と、第２の電子部品２を電子部品固定部に固定する第２電子部品固定工程とを示すとともに、第１の電子部品と第２の電子部品とが位置合わせされた状態を示す一部を断面とする側面図である。
【図４】 この発明の実施の形態１の突起電極と電極とを加圧するとともに接合ツールに超音波振動が伝搬された状態を示す一部を断面とする側面図である。
【図５】 この発明の実施の形態１の突起電極と電極との接合力が増加し接合ツールに対して超音波振動伝搬体がすべった状態を示す一部を断面とする側面図である。
【図６】 この発明の実施の形態１の超音波振動伝搬体を上方に移動させて第１の電子部品と接合ツールとを離間させた状態を示す一部を断面とする側面図である。
【図７】 この発明の実施の形態１の接合ツールを接合ツールステージに置く状態を示す一部を断面とする側面図である。
【図８】 この発明の実施の形態１の位置合せ爪にて接合ツールを位置決めする接合ツール位置決め工程を示す一部を断面とする側面図である。
【図９】 この発明の実施の形態２の接合ツールと超音波振動伝搬体とが位置合わせされた状態を示す一部を断面とする側面図である。
【図１０】 この発明の実施の形態２のすべり面に接合ツールが吸着される接合ツール吸着工程を示す一部を断面とする側面図である。
【図１１】 この発明の実施の形態２の第１の電子部品を接合ツールの電子部品保持部に真空吸着するとともに第１の電子部品１の対向する１対の側面を挟み込んで保持する第１電子部品吸着工程と、第２の電子部品２を電子部品固定部に固定する第２電子部品固定工程とを示すとともに、第１の電子部品と第２の電子部品とが位置合わせされた状態を示す一部を断面とする側面図である。
【図１２】 この発明の実施の形態２の突起電極と電極とを加圧するとともに接合ツールに超音波振動が伝搬された状態を示す一部を断面とする側面図である。
【図１３】 この発明の実施の形態２の突起電極と電極との接合力が増加し接合ツールに対して超音波振動伝搬体がすべった状態を示す一部を断面とする側面図である。
【図１４】 この発明の実施の形態２の超音波振動伝搬体を上方に移動させて第１の電子部品と接合ツールとを離間させた状態を示す一部を断面とする側面図である。
【図１５】 この発明の実施の形態２の接合ツールを接合ツールステージに置く状態を示す一部を断面とする側面図である。
【図１６】 この発明の実施の形態２の位置合せ爪にて接合ツールを位置決めする接合ツール位置決め工程を示す一部を断面とする側面図である。
【図１７】 この発明の実施の形態３の第１の電子部品を接合ツールの電子部品保持部に真空吸着保持する第１電子部品吸着工程と、第２の電子部品２を電子部品固定部に固定する第２電子部品固定工程とを示すとともに、第１の電子部品と第２の電子部品とが位置合わせされた状態を示す一部を断面とする側面図である。
【図１８】 この発明の実施の形態３の突起電極と電極とを加圧するとともに接合ツールに超音波振動が伝搬された状態を示す一部を断面とする側面図である。
【図１９】 この発明の実施の形態３の突起電極と電極との接合力が増加し接合ツールに対して超音波振動伝搬体がすべった状態を示す一部を断面とする側面図である。
【図２０】 この発明の実施の形態３の超音波振動伝搬体を上方に移動させて第１の電子部品と接合ツールとを離間させた状態を示す一部を断面とする側面図である。
【図２１】 従来の電子部品の製造方法および製造装置を示し、特に第１の電子部品を真空吸着保持し、第２の電子部品を接合ステージに固定し、さらに両者が位置合わせされた状態を示す一部を断面とする側面図である。
【図２２】 従来の電子部品の製造方法および製造装置を示し、特に突起電極が電極に加圧されるとともに超音波振動が伝搬された状態を示す一部を断面とする側面図である。
【図２３】 従来の電子部品の製造方法および製造装置の別の例を示し、特に突起電極が電極に加圧されるとともに超音波振動が伝搬された状態を示す一部を断面とする側面図である。
【符号の説明】
１ 第１の電子部品、２ 第２の電子部品、２ｃ 電極、３ 突起電極、４ 接合ツール、４ａ 真空吸着穴（電子部品吸着手段）、４ｂ 電子部品保持部、４ｅ 接合ツール本体、４ｄ スライド部、４ｆ 把持爪（電子部品把持手段）、６ 接合ステージ、６ａ 電子部品固定部、８ 超音波振動伝搬体、８ａ 真空吸着穴（電子部品吸着手段）、８ｂ 真空吸着穴（接合ツール吸着手段）、８ｃ すべり面、９ 接合ツールステージ、１０ 位置合せ爪、１１ バネ（弾性体）。[0001]
BACKGROUND OF THE INVENTION
TECHNICAL FIELD The present invention relates to a flip chip mounting method and apparatus for bonding a protruding electrode and an electrode while propagating ultrasonic vibrations, and more particularly to manufacturing an electronic component that bonds an electronic component with stable bonding strength without damaging the electronic component. The present invention relates to an apparatus and an electronic component manufacturing method.
[0002]
[Prior art]
As a technique for mounting electronic components with multi-terminal, narrow-pitch electrodes, a flip-chip method is often used, in which ultrasonic vibration is propagated to the electronic components and the protruding electrodes formed on the electrodes of the electronic components are joined to the electrodes. For example, it is described in "Development of flip chip mounting technology by ultrasonic vibration" (Hashimoto et al., 6th Symposium on Microjoining and Assembly Technology in Electronics, 175-178, 2000).
[0003]
21 and 22 are side views, partly in section, showing a conventional method and apparatus for manufacturing an electronic component. 21 and FIG. 1 is a first electronic component having a substantially rectangular flat plate shape, 1c is an electrode provided on the first surface 1a as a surface of the first electronic component 1, and 2 is a second electronic component having a substantially rectangular flat plate shape. Reference numeral 2 c denotes an electrode provided on the first surface 2 a as the surface of the second electronic component 2, and reference numeral 3 denotes a protruding electrode provided on the electrode 1 c of the first electronic component 1. The second surfaces 1b and 2b which are the back surfaces of the first electronic component 1 and the second electronic component 2 are flat surfaces. Reference numeral 4 denotes a bonding tool that sucks and holds the first electronic component 1 and propagates ultrasonic vibrations to the first electronic component 1. Reference numeral 4 a denotes a vacuum suction hole provided in the bonding tool 4. The joining stage 5 is a vacuum suction hole provided in the joining stage 6.
[0004]
In FIG. 21, the first electronic component 1 is sucked through the vacuum suction hole 4a and held in the electronic component holding portion 4b of the welding tool 4 while the second electronic component 2 is sucked through the vacuum suction hole 5. The first surface 2a is fixed to the bonding stage 6 with the outer side facing outward, the protruding electrode 3 formed on the electrode 1c of the first electronic component 1, and the second electronic component held by vacuum bonding on the bonding stage 6 It is a side view which makes a cross section a part which shows the state with which the electrode 2c of 2 was aligned.
[0005]
FIG. 22 shows a state in which ultrasonic vibration is propagated to the first electronic component 1 by the bonding tool 4 as indicated by an arrow I while pressurizing the protruding electrode 3 and the electrode 2c of the second electronic component 2. It is a side view which makes a part a cross section.
After the protruding electrode 3 of the first electronic component 1 and the electrode 2c of the second electronic component 2 are aligned, the welding tool 4 moves in the Z-axis direction, which is the direction of the second electronic component 2, and the protruding While pressing the electrode 3 against the electrode 2c with a predetermined pressing force, the welding tool 4 propagates ultrasonic vibration to the first electronic component 1 as indicated by an arrow I in the figure. The projection electrode 3 and the electrode 2c are rubbed with each other by a predetermined pressing force in the Z-axis direction and ultrasonic vibration on the XY plane perpendicular to the Z-axis direction, and the surface dirt and film are removed, and both are solid-phase bonded.
[0006]
FIG. 23 shows another example of a conventional method and apparatus for manufacturing an electronic component, in which the protruding electrode 3 and the electrode 2c of the second electronic component 2 are pressurized and the first electronic component 1 is applied to the first electronic component 1 by the joining tool 12. It is a side view which makes a section a part which shows the state where ultrasonic vibration was propagated as shown by arrow J. In FIG. 23, reference numeral 12 denotes an inner surface pyramid-shaped joining tool in which inclined surfaces 12a are formed on each of the four sides, and a hollow-shaped electronic component holding portion is formed to widen the opening as it goes downward in the drawing. Reference numeral 12 b denotes a vacuum suction hole provided in the joining tool 12. The welding tool 12 holds the first electronic component 1 in an electronic pyramid-shaped electronic component holding portion having inclined surfaces 12 a on four sides, and propagates ultrasonic vibration to the first electronic component 1. Other configurations are the same as those of the prior art shown in FIGS.
[0007]
[Problems to be solved by the invention]
In the prior art shown in FIG. 21 and FIG. 22, when the bonding between the protruding electrode 3 and the electrode 2 c progresses and the bonding force acting between the two increases, a force that gradually stops the first electronic component 1 works. On the other hand, since the welding tool 4 continues to vibrate as it is, a forced reciprocating motion (position shift) occurs between the welding tool 4 and the back surface of the first electronic component 1. There was a problem that the back surface was rubbed and damaged.
[0008]
Further, when a plurality of protrusions such as electrodes are formed on the second surface 1b of the first electronic component 1, only the tip of the protrusion comes into contact with the electronic component holding surface of the bonding tool 4. Since the contact area between the first electronic component 1 and the first electronic component 1 is reduced and slippage is likely to occur, the ultrasonic vibration cannot be sufficiently transmitted to the protruding electrode 3 and the No joining There is a problem that the joining tool 4 is worn by the projection and the life of the joining tool 4 is shortened.
[0009]
On the other hand, in the prior art shown in FIG. 23, the slip between the joining tool 12 and the first electronic component 1 is improved. However, also in the prior art shown in FIG. 23, when the joining between the protruding electrode 3 and the electrode 2c proceeds and the joining force increases, a large ultrasonic vibration continues to be propagated to the first electronic component 1, so that the joining portion There was a problem that was damaged.
[0010]
Furthermore, when the number of electrodes is large and a large ultrasonic output is required, an excessive load is concentrated on the contact portion between the first electronic component 1 and the inclined surface 12a of the pyramid-shaped joining tool 12 during joining. There is a problem that one electronic component 1 is damaged, and there is a limitation in application to a fragile component such as a compound semiconductor.
[0011]
The present invention has been made to solve the above-described problems, and an electronic component manufacturing apparatus and an electronic component manufacturing method capable of stably joining a protruding electrode and an electrode without damaging the electronic component. The purpose is to obtain.
[0012]
[Means for Solving the Problems]
The electronic component manufacturing apparatus according to the present invention includes a joining stage for fixing the second electronic component having a plurality of electrodes formed on the first surface to the electronic component fixing portion with the first surface facing outward, An ultrasonic vibration propagating body that is provided so as to be movable with respect to the joining stage and propagates ultrasonic vibration to the first electronic component, and can be moved in the same direction as the ultrasonic vibration direction at the vibration transmission end of the ultrasonic vibration propagating body. The electronic component holding portion is formed on the surface opposite to the ultrasonic vibration propagating body, the plurality of protruding electrodes are formed on the first surface, and the first surface faces the second electronic component. A joining tool that holds and holds the first electronic component disposed in the electronic component holding unit by an electronic component suction unit provided in the electronic component holding unit, and the ultrasonic vibration propagating body includes the first electronic component Position the protruding electrode of the component on the electrode of the second electronic component, The ultrasonic vibration propagating body is vibrated while being pressed against the pole to propagate the ultrasonic vibration to the first electronic component, and when a predetermined bonding force is generated between the protruding electrode and the electrode, The first electronic component is connected to the second electronic component while sliding in the vibration direction.
[0013]
Further, the ultrasonic vibration propagating body adsorbs the bonding tool to a sliding surface provided at the vibration transmission end by the bonding tool suction means and supports it so as to be movable in the same direction as the ultrasonic vibration direction.
[0014]
Further, the ultrasonic vibration propagating body supports the joining tool so as to be movable in the same direction as the ultrasonic vibration direction via an elastic body provided at the vibration transmitting end.
[0015]
The joining tool has electronic component gripping means for gripping at least two opposing sides of the first electronic component having a substantially rectangular shape, and is gripped by the electronic component gripping means while being suctioned by the electronic component suction means. The electronic component is held in the electronic component holding unit.
[0016]
The ultrasonic vibration propagator further includes a bonding tool stage having an alignment claw for positioning the bonding tool on a surface facing the ultrasonic vibration propagating body, and the ultrasonic vibration propagating body absorbs the bonding tool positioned by the bonding tool stage. Adsorb to the sliding surface by means.
[0017]
The electronic component manufacturing method according to the present invention includes an ultrasonic vibration propagating body that propagates ultrasonic vibrations to the first electronic component, and the ultrasonic vibration propagating body that moves in the same direction as the ultrasonic vibration direction. An electronic component holding portion is formed on the surface opposite to the ultrasonic vibration propagating body, and the first electronic component is held on the electronic component holding portion by the electronic component suction means provided on the electronic component holding portion. An electronic component manufacturing method using an electronic component manufacturing apparatus having a bonding tool and a bonding stage provided with an electronic component fixing portion that fixes a second electronic component on a surface facing the electronic component holding portion. A second electronic component fixing step in which a second electronic component having a plurality of electrodes formed on one surface is fixed to the electronic component fixing portion with the first surface facing outward; and a plurality of electrodes are formed on the first surface. The first surface on which the protruding electrode is formed has the first surface 1st electronic component adsorption | suction process attracted | sucked to an electronic component holding part so as to oppose 2 electronic components, and the protruding electrode of a 1st electronic component is positioned to the electrode of a 2nd electronic component, and a protruding electrode is pressed on an electrode The ultrasonic vibration propagating body is vibrated while propagating the ultrasonic vibration to the first electronic component, and when a predetermined bonding force is generated between the protruding electrode and the electrode, the bonding tool is moved in the ultrasonic vibration direction. An electronic component connecting step of connecting the first electronic component to the second electronic component while sliding.
[0018]
In addition, the welding tool is sucked and supported by the sliding surface provided at the vibration transmission end by the bonding tool suction means provided on the ultrasonic vibration propagating body, and the welding tool is sucked to the sliding surface at the vibration transmission end. The method further includes a process.
[0019]
The bonding tool positioning step of positioning the bonding tool at a predetermined position with respect to the ultrasonic vibration propagating body is further provided, and the bonding tool suction step sucks the bonding tool positioned by the bonding tool positioning step onto the sliding surface.
[0020]
Further, in the first electronic component adsorption step, the first electronic component is adsorbed to the electronic component holding unit while gripping at least two opposite sides of the substantially rectangular first electronic component.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1 FIG.
1 to 8 are side views, partly in section, showing an electronic component manufacturing apparatus and an electronic component manufacturing method according to Embodiment 1 of the present invention. In FIG. 3, reference numeral 1 denotes a first electronic component having a substantially rectangular flat plate shape and having a plurality of electrodes 1c formed on the lower first surface 1a. Each electrode 1c of the first electronic component 1 is provided with a protruding electrode 3 described in detail later. Reference numeral 2 denotes a second electronic component having a substantially rectangular flat plate shape in which a plurality of electrodes 2c are formed on the first surface 2a on the upper side in the drawing. The second electronic component 2 is fixed to the electronic component fixing portion 6a on the joining stage 6 with the first surface 2a on which the electrode 2c is formed facing outward. A vacuum suction hole 5 for sucking the second electronic component 2 is provided in the electronic component fixing portion 6 a of the joining stage 6.
[0022]
In FIG. 1, 8 is an ultrasonic vibration propagating body of an ultrasonic vibration propagating apparatus (not shown). The ultrasonic vibration propagating body 8 is movable in the X-axis, Y-axis, and Z-axis directions with respect to the bonding tool stage 9 and the bonding stage 6 and transmits ultrasonic vibration to the first electronic component 1, for example. Ultrasonic vibration with an amplitude of 1 μm on one side is performed. A flat sliding surface 8c is formed at the vibration transmitting end of the ultrasonic vibration propagating body 8 at the lower end in FIG. Further, the ultrasonic vibration propagating body 8 has a vacuum suction hole 8a as a bonding tool suction means for sucking the first electronic component 1 and a vacuum suction hole 8b as a bonding tool suction means for sucking a welding tool 4 described later. It is provided penetrating in the direction.
[0023]
In FIG. 2, 4 is a joining tool in which air is sucked and sucked by the vacuum suction hole 8b on the sliding surface 8c of the vibration transmitting end of the ultrasonic vibration propagating body 8. An electronic component holding portion 4 b for holding the first electronic component 1 is formed on the surface of the bonding tool 4 opposite to the surface attracted by the ultrasonic vibration propagating body 8. The electronic component holding part 4b is formed in a concave shape in which slopes are formed on each of the four sides and the opening is expanded in the downward direction in the figure, that is, an inner side pyramid shape. A vacuum suction hole 4a serving as an electronic component suction means for sucking air and sucking the first electronic component 1 through the vacuum suction hole 8a is formed in the center of the welding tool 4.
In the present embodiment, the joining tool 4 is made of stainless steel. Shi Or However, the joining tool 4 is not limited to stainless steel, and may be made of, for example, a ceramic material.
[0024]
In FIG. 2, reference numeral 9 denotes a joining tool stage for positioning the joining tool 4. An alignment claw 10 for positioning the welding tool 4 is provided on the surface of the welding tool stage 9 facing the ultrasonic vibration propagating body 8.
[0025]
FIG. 1 is a side view, partly in section, showing a state in which the welding tool 4 and the ultrasonic vibration propagating body 8 on the welding tool stage 9 are aligned. In the series of steps, first, the welding tool 4 is aligned with the ultrasonic vibration propagating body 8 on the welding tool stage 9 as described in detail later.
[0026]
FIG. 2 is a side view, partly in section, showing a bonding tool suction step in which the welding tool 4 is sucked by the vacuum suction hole 8b on the sliding surface 8c of the vibration transmitting end of the ultrasonic vibration propagating body 8. In the bonding tool adsorption step, the bonding tool 4 aligned with the ultrasonic vibration propagating body 8 on the bonding tool stage 9 is moved by the ultrasonic vibration propagating body 8 moved in the Z-axis direction, which is the downward direction in the figure. The sliding surface 8c is vacuum-sucked and held by the vacuum suction hole 8b.
[0027]
FIG. 3 shows a first electronic component suction step for sucking the first electronic component 1 through the vacuum suction hole 8a and holding it in the electronic component holding portion 4b of the welding tool 4, and the second electronic component 2 in the first electronic component holding portion 4b. The second electronic component fixing step of fixing the surface 2a to the electronic component fixing portion 6a with the surface 2a facing outward is shown, and the protruding electrode 3 formed on the electrode 1c of the first electronic component 1 and the bonding stage 6 are vacuumed It is a side view which makes a cross section a part which shows the state in which the electrode 2c of the 2nd electronic component 2 attracted | sucked and held was aligned.
[0028]
In the first electronic component adsorption process, the ultrasonic vibration propagating body 8 that adsorbs the welding tool 4 to the sliding surface 8c of the vibration transmission end moves to an XY plane that is horizontal to the bonding stage 6, for example, The first electronic component 1 placed on the mounting table or the like that is not to be sucked is sucked through the vacuum suction hole 8 a and held by vacuum suction in the electronic component holding portion 4 b of the bonding tool 4.
[0029]
In the second electronic component fixing step, the second electronic component 2 is placed on the electronic component fixing portion 6a of the joining stage 6 by an electronic component placing device or the like (not shown) with the first surface 2a facing outward, The vacuum suction hole 5 is vacuum-sucked and fixed.
Thereafter, as shown in FIG. 3, the protruding electrode 3 formed on the electrode 1 c of the first electronic component 1 and the electrode 2 c of the second electronic component 2 held by vacuum suction on the bonding stage 6 are aligned. The
[0030]
In the present embodiment, a semiconductor element made of silicon material is used as the first electronic component 1. However, the component applied as the first electronic component 1 is not limited to the semiconductor element made of silicon material, but other semiconductors using silicon-germanium coalescence, gallium arsenide, phosphide indium, or the like. An element may be sufficient. Further, a ceramic wiring board or a resin wiring board can also be applied.
[0031]
In the silicon element semiconductor element used in this embodiment, the tip of a gold wire with a diameter of 25 μm is melted and solidified to form a gold ball with a diameter of 75 μm, and then the gold ball is joined to an electrode. Were separated by a predetermined length to form 12 gold protruding electrodes 3 having an average diameter of 97 μm. Here, the protruding electrode 3 is not limited to gold, and may be formed of, for example, copper, silver, a gold alloy, a copper alloy, or a silver alloy.
[0032]
In the present embodiment, an alumina wiring board is used as the second electronic component 2. However, the present invention is not limited to an alumina wiring board, and may be a ceramic substrate or a resin substrate made of glass ceramics, aluminum nitride, or the like, and silicon. A semiconductor element made of silicon, germanium, gallium arsenic, indium phosphorus, or the like can also be applied.
[0033]
FIG. 4 is a side view in which a part of the projection electrode 3 and the electrode 2c of the second electronic component 2 are pressurized and the ultrasonic vibration is propagated to the welding tool 4 by the ultrasonic vibration propagating body 8 in a cross section. FIG.
After the protruding electrode 3 of the first electronic component 1 and the electrode 2c of the second electronic component 2 are aligned, the ultrasonic vibration propagating body 8 moves in the Z-axis direction, and the protruding electrode 3 is moved to a predetermined pressing force. The ultrasonic vibration propagating body 8 propagates the ultrasonic vibration to the first electronic component 1 as indicated by an arrow A in FIG. The projection electrode 3 and the electrode 2c are rubbed with each other by a predetermined pressing force and ultrasonic vibration to remove the dirt and film on the surface, and both are solid-phase bonded.
[0034]
In the present embodiment, a pressure of 1200 gf is applied between the silicon material semiconductor element as the first electronic component 1 and the alumina wiring substrate as the second electronic component 2 in a state where the bonding stage 6 is heated to 150 ° C. And ultrasonic vibration of 60 KHz was propagated with an amplitude of 1 μm on one side.
[0035]
FIG. 5 shows an electronic component connecting process in which the bonding between the protruding electrode 3 of the first electronic component 1 and the electrode 2c of the second electronic component has progressed, and the bonding force between the protruding electrode 3 and the electrode 2c increases. FIG. 4 is a side view with a part in cross section showing a state in which an ultrasonic vibration propagating body 8 slides in the direction of arrow B with respect to the welding tool 4.
[0036]
In the electronic component connecting step, ultrasonic vibration is propagated while the protruding electrode 3 is pressed against the electrode 2c, and the protruding electrode 3 and the electrode 2c are solid-phase bonded by a predetermined pressing force and ultrasonic vibration. Then, when the bonding between the protruding electrode 3 and the electrode 2c proceeds and the bonding force between the protruding electrode 3 and the electrode 2c increases and becomes greater than a predetermined size, the bonding tool 4 moves the ultrasonic vibration propagating body 8 The sliding starts on the sliding surface 8c. In order to adjust the frictional resistance that starts to slide with respect to the bonding force between the protruding electrode 3 and the electrode 2c, the smoothness of the sliding surface 8c and the contact surface of the bonding tool 4 that contacts and contacts the sliding surface 8c is made appropriate. The vacuum suction force by the vacuum suction hole 8b is adjusted by changing it appropriately.
[0037]
In this embodiment, ultrasonic vibration of 60 KHz with an amplitude of 1 μm on one side was propagated for 0.3 seconds, and the gold protruding electrode 3 and the gold electrode 2c were joined at a shear breaking load of 70 gf / bump or more. At this time, when the bonding between the protruding electrode 3 and the electrode 2c proceeds and the bonding force acting between the two increases to a predetermined value, the bonding tool 4 starts to slide against the ultrasonic vibration propagating body 8, and the first The back surface of the electronic component 1 was not damaged. In order to set the frictional resistance between the welding tool 4 and the sliding surface 8c to a predetermined value, the vacuum suction of the welding tool 4 by the vacuum suction hole 8b was stopped during the propagation of the ultrasonic vibration.
[0038]
On the other hand, when the same object, i.e., a semiconductor element made of silicon material is applied to the first electronic component 1 and an alumina wiring substrate is applied to the second electronic component 2 and bonded by the conventional method shown in FIG. When the vibration propagation time was 0.1 seconds or less, the back surface of the first electronic component 1 was not damaged, but the minimum shear fracture load was 25 gf / bump, and a sufficient bonding force was not obtained. Further, when the propagation time of the ultrasonic vibration is made longer than 0.1 seconds, the bonding force increases accordingly, but a positional shift occurs between the first electronic component 1 and the bonding tool 4 and the first electronic component. 1 was damaged.
[0039]
FIG. 6 shows that the vacuum suction of the vacuum suction hole 8a is stopped and the welding tool 4 is held again by vacuum suction in the vacuum suction hole 8b, and the ultrasonic vibration propagating body 8 is moved upward to move the first electronic component 1 and the welding tool. It is a side view which makes a part the cross section which shows the state which separated 4 from. FIG. 7 is a side view, partly in section, showing a state in which the welding tool 4 is placed on the welding tool stage 9.
[0040]
When the joining of the protruding electrode 3 of the first electronic component 1 and the electrode 2c of the second electronic component is completed, the ultrasonic vibration propagating body 8 moves in the upward direction away from the first electronic component 1 along the Z axis, After that, it moves in the XY plane and moves toward the welding tool stage 9, and descends again to place the welding tool 4 at a predetermined position of the welding tool stage 9, and stops the vacuum suction of the vacuum suction hole 8b to propagate ultrasonic vibration. The body 8 escapes upward.
[0041]
FIG. 8 is a side view, partly in section, showing a joining tool positioning step in which the joining tool 4 is pushed from both sides with the alignment claw 10 and the joining tool 4 is moved to a predetermined position on the joining stage 9.
In the joining tool positioning step, the joining tool 4 placed at a predetermined position on the joining tool stage 9 is slid from four directions as indicated by an arrow C in the figure and is aligned by an alignment claw 10 that presses each surface of the joining tool 4. It is positioned at the position. Thereafter, the process returns to the state shown in FIG. 1, but the welding tool 4 is at a position accurately positioned with respect to the ultrasonic vibration propagating body 8. In the welding tool adsorption process shown in FIG. 4 is accurately attracted to a predetermined position of the ultrasonic vibration propagating body 8.
[0042]
As described above, in the electronic component manufacturing apparatus and the electronic component manufacturing method of the present embodiment, even if the bonding between the protruding electrode 3 and the electrode 2c proceeds and the bonding force between the two increases, Since no displacement occurs between the back surface of the first electronic component 1, the back surface of the first electronic component 1 is not damaged.
[0043]
Furthermore, since slip occurs between the bonding tool 4 and the ultrasonic vibration propagating body 8, the bonding between the protruding electrode 3 and the electrode 2c further proceeds, and large ultrasonic vibration continues to be applied to the bonding portion between the two. However, the joint is not damaged.
[0044]
In addition, in order to reduce the frictional resistance between the welding tool 4 and the sliding surface 8c of the ultrasonic vibration propagating body 8 and easily cause the sliding, a recess is provided on the back surface of the welding tool 4 to reduce the contact area with the sliding surface 8c. May be. Further, the frictional resistance between the welding tool 4 and the ultrasonic vibration propagating body 8 may be reduced by blowing air from the vacuum suction hole 8b during the bonding.
[0045]
Embodiment 2. FIG.
9 to 16 are side views, partly in section, showing an electronic component manufacturing apparatus and electronic component manufacturing method according to Embodiment 2 of the present invention. 9 to 16, the same reference numerals are given to the same or corresponding parts as those in the first embodiment, and the description thereof is omitted. In the present embodiment, the welding tool 4 is different from the first embodiment. 9 to 16, 4d is a slide portion of the welding tool 4, 4c is a vacuum suction hole of the welding tool 4, 4f is a gripping claw as an electronic component gripping means provided in the welding tool 4, and 8d is ultrasonic vibration propagation. It is a vacuum suction hole of the body 8. Other configurations are substantially the same as those in the first embodiment.
[0046]
FIG. 9 is a side view, partly in section, showing a state in which the welding tool 4 and the ultrasonic vibration propagating body 8 on the welding tool stage 9 are aligned. The joining tool 4 includes a vacuum suction hole 4a that vacuum-sucks the first electronic component 1 and a slide portion 4d that slides by changing the air pressure inside the vacuum suction hole 4c. The slide part 4d is provided so as to be movable back and forth with respect to the welding tool body 4e. An elastic body (not shown) is provided between the slide portion 4d and the joining tool body 4e. Due to this elastic body, the slide portion 4d is normally urged away from the welding tool body 4e. Then, the inside is depressurized by the vacuum suction hole 4c and moves in a direction approaching the welding tool body 4e. Holding claws 4f and 4f project from the joining tool main body 4e and the slide portion 4d, respectively. The two gripping claws 4f and 4f move in a direction approaching each other to sandwich the first electronic component 1 therebetween.
In the present embodiment, the joining tool 4 is made of stainless steel, but is not limited to stainless steel, and for example, a ceramic material may be used.
[0047]
FIG. 10 is a side view, partly in section, showing a bonding tool suction step in which the welding tool 4 is sucked by the vacuum suction hole 8b on the sliding surface 8c at the vibration transmitting end of the ultrasonic vibration propagating body 8. FIG. 11 shows that the first electronic component 1 is sucked by the vacuum suction hole 8a and vacuum-sucked to the electronic component holding part 4b of the bonding tool 4, and the vacuum suction hole 8d is vacuum-sucked so that the slide part 4d of the bonding tool 4 is pulled. A first electronic component adsorption step of sliding and holding a pair of opposing side surfaces of the first electronic component 1 and fixing the second electronic component 2 with the first surface 2a facing outward The second electronic component fixing step for fixing to the part 6a is shown, and the protruding electrode 3 formed on the electrode 1c of the first electronic component 1 and the second electronic component 2 held by vacuum bonding on the joining stage 6 are shown. It is a side view which makes a section a part which shows the state where electrode 2c was aligned.
[0048]
In the first electronic component adsorption process, the ultrasonic vibration propagating body 8 that adsorbs the welding tool 4 to the sliding surface 8c of the vibration transmission end moves in an XY plane that is horizontal to the bonding stage 6, for example, The first electronic component 1 placed on a mounting table or the like (not shown) is sucked through the vacuum suction hole 8a and held by vacuum suction on the electronic component holding portion 4b of the welding tool 4. At this time, air is simultaneously sucked from the vacuum suction hole 8d to slide the slide portion 4d of the bonding tool 4, and the pair of opposing side surfaces of the first electronic component 1 are sandwiched and held by the gripping claws 4f and 4f.
[0049]
In the second electronic component fixing step, the second electronic component 2 is placed on the electronic component fixing portion 6a of the joining stage 6 by an electronic component placing device (not shown) with the first surface 2a facing outward, and is vacuumed. The suction holes 5 are vacuum-sucked and fixed.
After that, as shown in FIG. 11, the protruding electrode 3 formed on the electrode 1 c of the first electronic component 1 and the electrode 2 c of the second electronic component 2 held by vacuum suction on the bonding stage 6 are aligned. The
[0050]
In the present embodiment, a semiconductor element made of a gallium arsenide material is used as the first electronic component 1. However, the component applied as the first electronic component 1 is not limited to a semiconductor element made of gallium arsenide material, but other semiconductors made of silicon, silicon-germanium coalescence, phosphide indium, or the like. An element may be sufficient. Further, a ceramic wiring board or a resin wiring board can also be applied.
[0051]
In the semiconductor element of the gallium arsenide material used in this embodiment, the tip of a gold wire with a diameter of 25 μm is melted and solidified to form a gold ball with a diameter of 75 μm, and then the gold ball is joined to an electrode. Thirty gold protruding electrodes 3 having an average diameter of 97 μm were formed by cutting the gold wire by a predetermined length. Here, the protruding electrode 3 is not limited to gold, and may be formed of, for example, copper, silver, a gold alloy, a copper alloy, or a silver alloy.
[0052]
In the present embodiment, an alumina wiring board is used as the second electronic component 2. However, the present invention is not limited to an alumina wiring board, and may be a ceramic substrate or a resin substrate made of glass ceramics, aluminum nitride, or the like, and silicon. A semiconductor element made of silicon, germanium, gallium arsenic, indium phosphorus, or the like can also be applied.
[0053]
12 pressurizes the protruding electrode 3 and the electrode 2c of the second electronic component, and in a direction perpendicular to the pair of side surfaces sandwiched between the first electronic component 1 sandwiched between the joining tool 4 and the slide portion 4d. It is a side view which makes a part a section which shows the state where ultrasonic vibration was propagated.
[0054]
After the protruding electrode 3 of the first electronic component 1 and the electrode 2c of the second electronic component 2 are aligned, the ultrasonic vibration propagating body 8 moves in the Z-axis direction, and the protruding electrode 3 is moved to a predetermined pressing force. The ultrasonic vibration propagating body 8 propagates the ultrasonic vibration to the first electronic component 1 as indicated by the arrow D in FIG. The projection electrode 3 and the electrode 2c are rubbed with each other by a predetermined pressing force and ultrasonic vibration, and the surface dirt and film are removed and solid phase bonding is performed.
[0055]
In the present embodiment, the two side surfaces perpendicular to the ultrasonic vibration direction are sandwiched between the bonding tools 4, so that even when the number of protruding electrodes 3 increases and a large ultrasonic output is required for bonding, pyramid bonding is performed. An excessive load concentration does not occur at the contact portion between the first electronic component 1 and the joining tool 4 as in the tool, and even a fragile component such as a compound semiconductor is not damaged.
[0056]
In the present embodiment, 2700 gf of the semiconductor element of the gallium arsenide material that is the first electronic component 1 and the alumina wiring substrate that is the second electronic component 2 in a state where the bonding stage 6 is heated to 150 ° C. While pressing with a pressing force, ultrasonic vibration of 60 KHz was propagated with an amplitude of 2 μm on one side.
[0057]
FIG. 13 shows an electronic component connecting step in which the bonding between the protruding electrode 3 of the first electronic component 1 and the electrode 2c of the second electronic component has progressed, and the bonding force between the protruding electrode 3 and the electrode 2c increases. FIG. 5 is a side view with a part in cross section showing a state in which an ultrasonic vibration propagating body 8 slides in the direction of arrow E with respect to the welding tool 4.
In the electronic component connecting step, ultrasonic vibration is propagated while the protruding electrode 3 is pressed against the electrode 2c, and the protruding electrode 3 and the electrode 2c are solid-phase connected by a predetermined pressing force and ultrasonic vibration. Then, when the bonding between the protruding electrode 3 and the electrode 2c proceeds and the bonding force between the protruding electrode 3 and the electrode 2c increases and becomes greater than a predetermined size, the bonding tool 4 moves the ultrasonic vibration propagating body 8 The sliding starts on the sliding surface 8c. In order to adjust the frictional resistance that starts to slide with respect to the bonding force between the protruding electrode 3 and the electrode 2c, the smoothness of the sliding surface 8c and the contact surface of the bonding tool 4 that faces the sliding surface 8c is made appropriate. The vacuum suction force by the vacuum suction hole 8b is adjusted by changing it appropriately.
[0058]
In the present embodiment, 30 protruding electrodes 3 are formed. However, as the number of protruding electrodes 3 increases, the bonding force generated between the protruding electrodes 3 and the electrodes 2c increases accordingly. Therefore, there is a case where slip occurs between the joining tool 4 and the sliding surface 8c before the joining of the two sufficiently proceeds. If the welding tool 4 slides with respect to the sliding surface 8c before the bonding is sufficiently advanced, there arises a problem that the ultrasonic vibration is not transmitted to the bonded portion and the bonding is not performed completely.
[0059]
Therefore, in the present embodiment, the welding tool 4 remains vacuum-sucked by the vacuum suction hole 8b for 0.1 second from the start of ultrasonic vibration propagation to prevent the ultrasonic vibration propagating body 8 and the welding tool 4 from slipping. And joined. Then, vacuum adsorption was stopped and ultrasonic vibration was further propagated for 0.4 seconds. As a result, the gold protruding electrode 3 and the gold electrode 2c having a thickness of 3 μm on the alumina wiring board could be joined at a shear breaking load of 75 gf / bump or more without causing damage to the back surface of the element.
[0060]
In the present embodiment, the vacuum suction stop timing is obtained by the propagation time of the ultrasonic vibration. This timing can also be obtained by measuring the ultrasonic amplitude during bonding, the impedance of the ultrasonic transducer, the load, and the like. That is, as the welding progresses, the ultrasonic amplitude gradually decreases, and when joining is performed while detecting this, the vacuum suction is stopped or the air is blown on the contrary when the joining becomes below a predetermined size. The frictional resistance between the tool 4 and the ultrasonic vibration propagating body 8 may be reduced.
Also, as the bonding progresses, the ultrasonic impedance But Since it gradually increases, when joining is performed while detecting this, and when the size exceeds a predetermined size, the vacuum suction is stopped or air is blown in reverse, so that the joining tool 4 and the ultrasonic vibration propagating body 8 The frictional resistance may be reduced.
Furthermore, since the load acting on the ultrasonic vibration propagating body 8 gradually increases as the joining proceeds, it can be used for timing control in the same manner.
[0061]
FIG. 14 shows that the vacuum suction of the vacuum suction hole 8a is stopped and the welding tool 4 is held again by vacuum suction in the vacuum suction hole 8b, and the ultrasonic vibration propagating body 8 is moved upward to move the first electronic component 1 and the welding tool. It is a side view which makes a part the cross section which shows the state which separated 4 from. FIG. 15 is a side view, partly in section, showing a state in which the welding tool 4 is placed on the welding tool stage 9.
[0062]
When the joining of the protruding electrode 3 of the first electronic component 1 and the electrode 2c of the second electronic component is completed, the ultrasonic vibration propagating body 8 moves in the upward direction away from the first electronic component 1 along the Z axis, After that, it moves in the XY plane and moves toward the welding tool stage 9, and descends again in the Z-axis direction to place the welding tool 4 at a predetermined position of the welding tool stage 9, and stops vacuum suction of the vacuum suction hole 8b. The ultrasonic vibration propagating body 8 escapes upward.
[0063]
FIG. 16 is a side view, partly in section, showing a joining tool positioning step in which the joining tool 4 is pushed from both sides with the alignment claw 10 and the joining tool 4 is moved to a predetermined position on the joining stage 9.
In the joining tool positioning step, the joining tool 4 placed at a predetermined position of the joining tool stage 9 is slid from four directions as indicated by an arrow F in the figure by the alignment claws 10 that press each surface of the joining tool 4. It is positioned at a predetermined position. Thereafter, the process returns to the state shown in FIG. 9, but the welding tool 4 is in a position positioned with respect to the ultrasonic vibration propagating body 8. In the welding tool adsorption process shown in FIG. 10, the welding tool 4 is The ultrasonic vibration propagating body 8 is accurately adsorbed at a predetermined position.
[0064]
As described above, in the electronic component manufacturing apparatus and the electronic component manufacturing method of the present embodiment, the joining tool 4 serves as an electronic component gripping unit that grips two opposing sides of the first electronic component 1 having a substantially rectangular flat plate shape. The first electronic component 1 is held by the electronic component holding portion 4b by being gripped by the gripping claws 4f and 4f while being sucked by the vacuum suction hole 8a. Therefore, it is possible to further suppress the positional deviation that occurs between the welding tool 4 and the back surface of the first electronic component 1, and further prevent the back surface of the first electronic component 1 from being damaged.
[0065]
In this embodiment, the gas pressure is used as the driving force for moving the gripping claws 4f, 4f. However, the same applies even if pressure by liquid, electromagnetic force, or pressure by spring, piezoelectric element or screw is used. An effect is obtained. Further, although the two sides of the first electronic component 1 are sandwiched, the purpose of the electronic component gripping means is to prevent the first electronic component 1 and the welding tool 4 from slipping, and the three sides or four sides. Needless to say, it may be held.
[0066]
Embodiment 3 FIG.
17 to 20 are side views, partly in section, showing an electronic component manufacturing apparatus and electronic component manufacturing method according to Embodiment 3 of the present invention. 17 to 20, the same or corresponding parts as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted. 17 to 20, reference numeral 11 denotes a spring as an elastic body that is provided at the vibration transmission end of the ultrasonic vibration propagating body 8 and supports the welding tool 4 so as to be movable in the same direction as the ultrasonic vibration direction. The spring 11 presses the joining tool 4 from two directions between the ultrasonic vibration propagating body 8 and the joining tool 4 to place the joining tool 4 at a predetermined position. Other configurations are substantially the same as those in the first embodiment.
[0067]
FIG. 17 shows a first electronic component suction step for sucking the first electronic component 1 through the vacuum suction hole 8a and holding it by vacuum suction in the electronic component holding portion 4b of the welding tool 4, and the second electronic component 2 as the first electronic component. The second electronic component fixing step of fixing the surface 2a to the electronic component fixing portion 6a with the surface 2a facing outward is shown, and the protruding electrode 3 formed on the electrode 1c of the first electronic component 1 and the bonding stage 6 are vacuumed It is a side view which makes a cross section a part which shows the state in which the electrode 2c of the 2nd electronic component 2 attracted | sucked and held was aligned.
[0068]
In the first electronic component adsorption step, the ultrasonic vibration propagating body 8 that supports the welding tool 4 so as to be movable at the vibration transmission end moves in an XY plane that is horizontal with respect to the bonding stage 6, and is not shown. The first electronic component 1 placed on the pedestal is sucked through the vacuum suction hole 8a and held by vacuum suction on the electronic component holding portion 4b of the welding tool 4.
[0069]
In the second electronic component fixing step, the second electronic component 2 is placed on the electronic component fixing portion 6a of the joining stage 6 by an electronic component placing device (not shown) with the first surface 2a facing outward, and is vacuumed. The suction holes 5 are vacuum-sucked and fixed.
After that, as shown in FIG. 17, the protruding electrode 3 formed on the electrode 1 c of the first electronic component 1 and the electrode 2 c of the second electronic component 2 held in vacuum by the bonding stage 6 are aligned. The
[0070]
In the present embodiment, the joining tool 4 is made of stainless steel. However, it is not limited to stainless steel, and may be made of a ceramic material, for example. Furthermore, a joining tool having means for gripping two opposing sides of the first electronic component 1 as in the second embodiment may be used.
[0071]
In the present embodiment, a semiconductor element made of a gallium arsenide material is used as the first electronic component 1. However, the component applied as the first electronic component 1 is not limited to a semiconductor element made of gallium arsenide material, but other semiconductors made of silicon, silicon-germanium coalescence, phosphide indium, or the like. An element may be sufficient. Further, a ceramic wiring board or a resin wiring board can also be applied.
[0072]
In the semiconductor element of the gallium arsenide material used in this embodiment, the tip of a gold wire with a diameter of 25 μm is melted and solidified to form a gold ball with a diameter of 75 μm, and then the gold ball is joined to an electrode. Eight gold protruding electrodes 3 having an average diameter of 97 μm were formed by cutting the gold wire by a predetermined length. Here, the protruding electrode 3 is not limited to gold, and may be formed of, for example, copper, silver, a gold alloy, a copper alloy, or a silver alloy.
[0073]
In the present embodiment, an alumina wiring board is used as the second electronic component 2. However, the present invention is not limited to an alumina wiring board, and may be a ceramic substrate or a resin substrate made of glass ceramics, aluminum nitride, or the like, and silicon. A semiconductor element made of silicon, germanium, gallium arsenic, indium phosphorus, or the like can also be applied.
[0074]
FIG. 18 is a side view in which a part of the projection electrode 3 and the electrode 2 c of the second electronic component 2 are pressed and a part of the ultrasonic vibration propagating body 8 is propagated to the welding tool 4 by the ultrasonic vibration propagating body 8. FIG.
[0075]
After the protruding electrode 3 of the first electronic component 1 and the electrode 2c of the second electronic component 2 are aligned, the ultrasonic vibration propagating body 8 moves in the Z-axis direction, and the protruding electrode 3 is moved to a predetermined pressing force. The ultrasonic vibration propagating body 8 propagates the ultrasonic vibration to the first electronic component 1 as indicated by the arrow G in FIG. The protruding electrode 3 and the electrode 2c are rubbed with each other with a predetermined pressing force and ultrasonic vibration, and the dirt and film on the surface are removed and solid phase bonding is performed.
[0076]
In the present embodiment, 800 gf of the semiconductor element of the gallium arsenide material that is the first electronic component 1 and the alumina wiring board that is the second electronic component 2 in a state where the bonding stage 6 is heated to 150 ° C. While being pressurized with a pressing force, 60 KHz ultrasonic vibration was propagated with an amplitude of 0.8 μm on one side.
[0077]
FIG. 19 shows an electronic component connecting step in which the bonding between the protruding electrode 3 of the first electronic component 1 and the electrode 2c of the second electronic component has progressed, and the bonding force between the protruding electrode 3 and the electrode 2c increases. FIG. 6 is a side view in which a part of the ultrasonic vibration propagating body 8 is slid in the direction of an arrow H with respect to the welding tool 4 with a cross section as a part.
[0078]
In the electronic component connecting step, ultrasonic vibration is propagated while the protruding electrode 3 is pressed against the electrode 2c, and the protruding electrode 3 and the electrode 2c are solid-phase connected by a predetermined pressing force and ultrasonic vibration. Then, when the bonding between the protruding electrode 3 and the electrode 2c proceeds and the bonding force between the protruding electrode 3 and the electrode 2c increases and becomes greater than a predetermined size, the bonding tool 4 moves the ultrasonic vibration propagating body 8 The sliding starts on the sliding surface 8c. In order to adjust the frictional resistance that starts to slide with respect to the bonding force between the protruding electrode 3 and the electrode electrode 2c, the smoothness of the sliding surface 8c and the contact surface of the bonding tool 4 that faces the sliding surface 8c is made appropriate. .
[0079]
In the present embodiment, 800 gf of the semiconductor element of the gallium arsenide material that is the first electronic component 1 and the alumina wiring board that is the second electronic component 2 in a state where the bonding stage 6 is heated to 150 ° C. While being pressurized with a pressing force, 60 KHz ultrasonic vibration was propagated with an amplitude of 0.8 μm on one side.
[0080]
FIG. 20 is a side view with a partial cross section showing a state in which the vacuum suction of the vacuum suction hole 8a is stopped and the ultrasonic vibration propagating body 8 is moved upward to separate the first electronic component 1 and the welding tool 4. FIG.
[0081]
As described above, in the electronic component manufacturing apparatus and the electronic component manufacturing method of the present embodiment, the joining tool 4 is supported by the spring 11 as an elastic body and is always provided at the vibration transmitting end of the ultrasonic vibration propagating body 8. ing. Therefore, there is no bonding tool adsorption process for adsorbing the bonding tool 4 to the ultrasonic vibration propagating body 8 and the bonding tool positioning process for positioning the bonding tool 4 with respect to the ultrasonic vibration propagating body 8, and the processing time is reduced as a whole. , Productivity can be improved and costs can be reduced.
In the present embodiment, proper joining can be performed by selecting the spring 11 having an appropriate elastic force depending on the joining conditions.
[0082]
【The invention's effect】
The electronic component manufacturing apparatus according to the present invention includes a joining stage for fixing the second electronic component having a plurality of electrodes formed on the first surface to the electronic component fixing portion with the first surface facing outward, An ultrasonic vibration propagating body that is provided so as to be movable with respect to the joining stage and propagates ultrasonic vibration to the first electronic component, and can be moved in the same direction as the ultrasonic vibration direction at the vibration transmission end of the ultrasonic vibration propagating body. The electronic component holding portion is formed on the surface opposite to the ultrasonic vibration propagating body, the plurality of protruding electrodes are formed on the first surface, and the first surface faces the second electronic component. A joining tool that holds and holds the first electronic component disposed in the electronic component holding unit by an electronic component suction unit provided in the electronic component holding unit, and the ultrasonic vibration propagating body includes the first electronic component Position the protruding electrode of the component on the electrode of the second electronic component, The ultrasonic vibration propagating body is vibrated while being pressed against the pole to propagate the ultrasonic vibration to the first electronic component, and when a predetermined bonding force is generated between the protruding electrode and the electrode, The first electronic component is connected to the second electronic component while sliding in the vibration direction. Therefore, during the joining of the first electronic component and the second electronic component, the first electronic component will not be displaced with respect to the joining tool. As a result, the first electronic component and the second electronic component can be joined in a stable state without damaging the first electronic component.
[0083]
Further, the ultrasonic vibration propagating body adsorbs the bonding tool to a sliding surface provided at the vibration transmission end by the bonding tool suction means and supports it so as to be movable in the same direction as the ultrasonic vibration direction. For this reason, the joining tool can be sucked onto the sliding surface using the same drive source as the electronic component sucking means, and the structure can be simplified, so that the cost can be reduced.
[0084]
Further, the ultrasonic vibration propagating body supports the joining tool so as to be movable in the same direction as the ultrasonic vibration direction via an elastic body provided at the vibration transmitting end. Therefore, when the force is not applied to the joining tool, the elastic body supports the joining tool at a predetermined position. Therefore, the operation of positioning the joining tool with respect to the ultrasonic vibration propagating body is performed from the first electronic component to the joining tool. The operation can be performed only by separating them, and the manufacturing time can be shortened, so that the cost can be reduced.
[0085]
The joining tool has electronic component gripping means for gripping at least two opposing sides of the first electronic component having a substantially rectangular shape, and is gripped by the electronic component gripping means while being suctioned by the electronic component suction means. The electronic component is held in the electronic component holding unit. Therefore, the first electronic component is stably held, the first electronic component is not further displaced with respect to the joining tool, and the first electronic component and the second electronic component are further stabilized. It can be joined in the state.
[0086]
The ultrasonic vibration propagator further includes a bonding tool stage having an alignment claw for positioning the bonding tool on a surface facing the ultrasonic vibration propagating body, and the ultrasonic vibration propagating body absorbs the bonding tool positioned by the bonding tool stage. Adsorb to the sliding surface by means. Therefore, it is possible to position the joining tool that is detached from the ultrasonic vibration propagating body with a simple configuration, and to reduce the cost.
[0087]
The electronic component manufacturing method according to the present invention includes an ultrasonic vibration propagating body that propagates ultrasonic vibrations to the first electronic component, and the ultrasonic vibration propagating body that moves in the same direction as the ultrasonic vibration direction. An electronic component holding portion is formed on the surface opposite to the ultrasonic vibration propagating body, and the first electronic component is held on the electronic component holding portion by the electronic component suction means provided on the electronic component holding portion. An electronic component manufacturing method using an electronic component manufacturing apparatus having a bonding tool and a bonding stage provided with an electronic component fixing portion that fixes a second electronic component on a surface facing the electronic component holding portion. A second electronic component fixing step in which a second electronic component having a plurality of electrodes formed on one surface is fixed to the electronic component fixing portion with the first surface facing outward; and a plurality of electrodes are formed on the first surface. The first surface on which the protruding electrode is formed has the first surface 1st electronic component adsorption | suction process attracted | sucked to an electronic component holding part so as to oppose 2 electronic components, and the protruding electrode of a 1st electronic component is positioned to the electrode of a 2nd electronic component, and a protruding electrode is pressed on an electrode The ultrasonic vibration propagating body is vibrated while propagating the ultrasonic vibration to the first electronic component, and when a predetermined bonding force is generated between the protruding electrode and the electrode, the bonding tool is moved in the ultrasonic vibration direction. An electronic component connecting step of connecting the first electronic component to the second electronic component while sliding. Therefore, in the electronic component connecting step, the first electronic component is not displaced with respect to the bonding tool during the bonding of the first electronic component and the second electronic component, and the first electronic component is damaged. The first electronic component and the second electronic component are joined in a stable state.
[0088]
In addition, the welding tool is sucked and supported by the sliding surface provided at the vibration transmission end by the bonding tool suction means provided on the ultrasonic vibration propagating body, and the welding tool is sucked to the sliding surface at the vibration transmission end. The method further includes a process. Therefore, in the joining tool suction step, the joining tool can be sucked to the sliding surface by the electronic component suction means of the same drive source as in the first electronic component suction step, and the apparatus can be configured in a simple manner, thereby reducing the cost. be able to.
[0089]
The bonding tool positioning step of positioning the bonding tool at a predetermined position with respect to the ultrasonic vibration propagating body is further provided, and the bonding tool suction step sucks the bonding tool positioned by the bonding tool positioning step onto the sliding surface. Therefore, it is possible to position the joining tool that is detached from the ultrasonic vibration propagating body with a simple operation.
[0090]
Further, in the first electronic component adsorption step, the first electronic component is adsorbed to the electronic component holding unit while gripping at least two opposite sides of the substantially rectangular first electronic component. Therefore, in the electronic component connecting step, the first electronic component is further displaced with respect to the bonding tool during the bonding of the first electronic component and the second electronic component. The The first electronic component is not damaged further, and the first electronic component and the second electronic component are joined in a more stable state.
[Brief description of the drawings]
FIG. 1 is a side view, partly in section, showing a state in which a welding tool and an ultrasonic vibration propagating body according to Embodiment 1 of the present invention are aligned.
FIG. 2 is a side view, partly in cross section, showing a joining tool suction step in which the joining tool is sucked onto the sliding surface according to the first embodiment of the present invention.
FIG. 3 shows a first electronic component suction step in which the first electronic component according to the first embodiment of the present invention is vacuum-sucked and held in the electronic component holding part of the joining tool; and the second electronic component 2 is used as the electronic part fixing part. It is a side view which makes the cross section a part which shows the state where the 1st electronic component and the 2nd electronic component were aligned while showing the 2nd electronic component fixing process to fix.
FIG. 4 is a side view, partly in section, showing a state in which ultrasonic waves are propagated to the welding tool while pressing the protruding electrodes and electrodes according to the first embodiment of the present invention.
FIG. 5 is a side view, partly in section, showing a state where the bonding force between the protruding electrode and the electrode according to the first embodiment of the present invention is increased and the ultrasonic vibration propagating body has slipped with respect to the bonding tool.
FIG. 6 is a side view, partly in section, showing a state where the ultrasonic vibration propagating body according to the first embodiment of the present invention is moved upward to separate the first electronic component and the welding tool.
FIG. 7 is a side view, partly in section, showing a state where the welding tool according to the first embodiment of the present invention is placed on the welding tool stage.
FIG. 8 is a side view, partly in section, showing a joining tool positioning step for positioning the joining tool with the alignment pawl according to the first embodiment of the present invention.
FIG. 9 is a side view, partly in cross section, showing a state in which a welding tool and an ultrasonic vibration propagating body according to Embodiment 2 of the present invention are aligned.
FIG. 10 is a side view, partly in section, showing a welding tool suction process in which a welding tool is sucked onto a sliding surface according to a second embodiment of the present invention.
11 is a view showing a first electronic component according to a second embodiment of the present invention, in which a first electronic component is vacuum-sucked to an electronic component holding portion of a welding tool and a pair of opposing side surfaces of the first electronic component 1 are sandwiched and held. The electronic component adsorption step and the second electronic component fixing step for fixing the second electronic component 2 to the electronic component fixing portion are shown, and the first electronic component and the second electronic component are aligned. It is a side view which makes a part to show a section.
FIG. 12 is a side view, partly in section, showing a state where ultrasonic waves are propagated to the welding tool while pressing the protruding electrodes and electrodes according to the second embodiment of the present invention.
FIG. 13 is a side view, partly in section, showing a state where the bonding force between the protruding electrode and the electrode according to Embodiment 2 of the present invention is increased and the ultrasonic vibration propagating body has slipped with respect to the bonding tool.
FIG. 14 is a side view, partly in section, showing a state in which the ultrasonic vibration propagating body according to Embodiment 2 of the present invention is moved upward to separate the first electronic component and the welding tool.
FIG. 15 is a side view, partly in section, showing a state in which the welding tool according to the second embodiment of the present invention is placed on the welding tool stage.
FIG. 16 is a side view, partly in section, showing a joining tool positioning step for positioning the joining tool with the alignment claws of Embodiment 2 of the present invention.
FIG. 17 shows a first electronic component suction step in which the first electronic component according to the third embodiment of the present invention is vacuum-sucked and held in the electronic component holding part of the joining tool; and the second electronic component 2 is used as the electronic part fixing part. It is a side view which makes the cross section a part which shows the state where the 1st electronic component and the 2nd electronic component were aligned while showing the 2nd electronic component fixing process to fix.
FIG. 18 is a side view, partly in section, showing a state where ultrasonic waves are propagated to the welding tool while pressing the protruding electrodes and electrodes according to the third embodiment of the present invention.
FIG. 19 is a side view, partly in section, showing a state where the bonding force between the protruding electrode and the electrode according to Embodiment 3 of the present invention has increased and the ultrasonic vibration propagating body has slipped with respect to the bonding tool.
FIG. 20 is a side view, partly in cross section, showing a state where the ultrasonic vibration propagating body of Embodiment 3 of the present invention is moved upward to separate the first electronic component and the welding tool.
FIG. 21 shows a conventional method and apparatus for manufacturing an electronic component, in particular, a state in which the first electronic component is held by vacuum suction, the second electronic component is fixed to the joining stage, and both are aligned. It is a side view which makes a part to show a section.
FIG. 22 is a side view showing a conventional electronic component manufacturing method and apparatus, and in particular, a cross-sectional view partially showing a state in which a protruding electrode is pressed against an electrode and ultrasonic vibration is propagated.
FIG. 23 shows another example of a conventional method and apparatus for manufacturing an electronic component, and in particular, a side view with a part in cross section showing a state in which a protruding electrode is pressed against the electrode and ultrasonic vibration is propagated It is.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 1st electronic component, 2nd 2nd electronic component, 2c electrode, 3 protruding electrode, 4 joining tool, 4a vacuum suction hole (electronic component adsorption means), 4b electronic component holding part, 4e joining tool main body, 4d slide part 4f gripping claws (electronic component gripping means), 6 joining stage, 6a electronic component fixing part, 8 ultrasonic vibration propagating body, 8a vacuum suction hole (electronic component suction means), 8b vacuum suction hole (joining tool suction means), 8c Sliding surface, 9 Joining tool stage, 10 Alignment claw, 11 Spring (elastic body).

Claims (9)

第１の面に複数の電極が形成された第２の電子部品を、該第１の面を外方に向けて電子部品固定部に固定する接合ステージと、
前記接合ステージに対して移動可能に設けられ、第１の電子部品に超音波振動を伝搬する超音波振動伝搬体と、
前記超音波振動伝搬体の振動伝達端に超音波振動方向と同じ方向に移動可能に支持され、前記超音波振動伝搬体と反対側の面に電子部品保持部が形成され、第１の面に複数の突起電極が形成され該第１の面が前記第２の電子部品に対向するように前記電子部品保持部に配置された前記第１の電子部品を、該電子部品保持部に設けられた電子部品吸着手段により吸着して保持する接合ツールとを備え、 前記超音波振動伝搬体は、前記第１の電子部品の前記突起電極を前記第２の電子部品の前記電極に位置決めし、前記突起電極を前記電極に押圧しながら前記超音波振動伝搬体を振動させて超音波振動を前記第１の電子部品に伝搬するとともに、前記突起電極と前記電極との間に所定の接合力が生じたときに前記接合ツールを超音波振動方向にすべらせながら前記第２の電子部品に前記第１の電子部品を接続する
ことを特徴とする電子部品製造装置。A bonding stage for fixing the second electronic component having a plurality of electrodes formed on the first surface to the electronic component fixing portion with the first surface facing outward;
An ultrasonic vibration propagating body that is movably provided with respect to the joining stage and propagates ultrasonic vibration to the first electronic component;
The ultrasonic vibration propagating body is supported at the vibration transmission end so as to be movable in the same direction as the ultrasonic vibration direction, and an electronic component holding portion is formed on the surface opposite to the ultrasonic vibration propagating body. The electronic component holding portion is provided with the first electronic component disposed on the electronic component holding portion such that a plurality of protruding electrodes are formed and the first surface faces the second electronic component. A bonding tool that is sucked and held by an electronic component suction means, wherein the ultrasonic vibration propagating body positions the protruding electrode of the first electronic component on the electrode of the second electronic component, and The ultrasonic vibration propagating body is vibrated while pressing the electrode against the electrode to propagate the ultrasonic vibration to the first electronic component, and a predetermined bonding force is generated between the protruding electrode and the electrode. Sometimes the welding tool is in the direction of ultrasonic vibration The electronic component manufacturing apparatus, wherein the first electronic component is connected to the second electronic component while sliding. 前記超音波振動伝搬体は、接合ツール吸着手段によって前記振動伝達端に設けられたすべり面に前記接合ツールを吸着して超音波振動方向と同じ方向に移動可能に支持する
ことを特徴とする請求項１に記載の電子部品製造装置。The ultrasonic vibration propagating body adsorbs the bonding tool to a sliding surface provided at the vibration transmission end by a bonding tool suction means and supports the ultrasonic wave propagation body so as to be movable in the same direction as the ultrasonic vibration direction. Item 2. The electronic component manufacturing apparatus according to Item 1. 前記超音波振動伝搬体は、前記振動伝達端に設けられた弾性体を介して前記接合ツールを超音波振動方向と同じ方向に移動可能に支持する
ことを特徴とする請求項１に記載の電子部品製造装置。2. The electron according to claim 1, wherein the ultrasonic vibration propagating body supports the joining tool so as to be movable in the same direction as the ultrasonic vibration direction via an elastic body provided at the vibration transmitting end. Parts manufacturing equipment. 前記接合ツールは、概略矩形の前記第１の電子部品の少なくとも対向する２辺を把持する電子部品把持手段を有し、前記電子部品吸着手段により吸着しながら前記電子部品把持手段によって把持して前記第１の電子部品を前記電子部品保持部に保持する
ことを特徴とする請求項１から３のいずれかに記載の電子部品製造装置。The joining tool has electronic component gripping means for gripping at least two opposing sides of the first electronic component having a substantially rectangular shape, and is gripped by the electronic component gripping means while being suctioned by the electronic component suction means. The electronic component manufacturing apparatus according to any one of claims 1 to 3, wherein the first electronic component is held by the electronic component holding unit. 前記超音波振動伝搬体に対向する対向面に前記接合ツールを位置決めする位置合せ爪を有する接合ツールステージをさらに備え、
前記超音波振動伝搬体は、前記接合ツールステージによって位置決めされた前記接合ツールを前記接合ツール吸着手段によって前記すべり面に吸着する
ことを特徴とする請求項１，２又は４のいずれかに記載の電子部品製造装置。A bonding tool stage having an alignment claw for positioning the bonding tool on a surface facing the ultrasonic vibration propagating body;
The ultrasonic vibration propagating body adsorbs the bonding tool positioned by the bonding tool stage to the sliding surface by the bonding tool adsorption means. Electronic component manufacturing equipment. 第１の電子部品に超音波振動を伝搬する超音波振動伝搬体と、
前記超音波振動伝搬体の振動伝達端に超音波振動方向と同じ方向に移動可能に支持され、前記超音波振動伝搬体と反対側の面に電子部品保持部が形成され、該電子部品保持部に設けられた電子部品吸着手段により該電子部品保持部に第１の電子部品を保持する接合ツールと、
前記電子部品保持部に対向する面に第２の電子部品を固定する電子部品固定部が設けられた接合ステージと
を有する電子部品製造装置を使用する電子部品製造方法であって、
第１の面に複数の電極が形成された前記第２の電子部品を、該第１の面を外方に向けて前記電子部品固定部に固定する第２電子部品固定工程と、
第１の面に複数の突起電極が形成された前記第１の電子部品を、該第１の面が前記第２の電子部品に対向するように前記電子部品保持部に吸着する第１電子部品吸着工程と、
前記第１の電子部品の前記突起電極を前記第２の電子部品の前記電極に位置決めし、前記突起電極を前記電極に押圧しながら前記超音波振動伝搬体を振動させて超音波振動を前記第１の電子部品に伝搬するとともに、前記突起電極と前記電極との間に所定の接合力が生じたときに前記接合ツールを超音波振動方向にすべらせながら前記第２の電子部品に前記第１の電子部品を接続する電子部品接続工程と
を備えたことを特徴とする電子部品製造方法。An ultrasonic vibration propagating body that propagates ultrasonic vibration to the first electronic component;
The ultrasonic vibration propagating body is supported at the vibration transmission end so as to be movable in the same direction as the ultrasonic vibration direction, and an electronic component holding portion is formed on the surface opposite to the ultrasonic vibration propagating body. A joining tool for holding the first electronic component in the electronic component holding portion by the electronic component suction means provided in
An electronic component manufacturing method using an electronic component manufacturing apparatus, comprising: a joining stage provided with an electronic component fixing portion that fixes a second electronic component on a surface facing the electronic component holding portion;
A second electronic component fixing step of fixing the second electronic component having a plurality of electrodes formed on the first surface to the electronic component fixing portion with the first surface facing outward;
A first electronic component that adsorbs the first electronic component having a plurality of protruding electrodes formed on the first surface to the electronic component holding portion so that the first surface faces the second electronic component. An adsorption process;
The protruding electrode of the first electronic component is positioned on the electrode of the second electronic component, and the ultrasonic vibration propagating body is vibrated while pressing the protruding electrode against the electrode, thereby causing ultrasonic vibration to occur. The first electronic component is transmitted to the second electronic component while sliding to the ultrasonic vibration direction when a predetermined bonding force is generated between the protruding electrode and the electrode. An electronic component manufacturing method comprising: an electronic component connecting step for connecting the electronic components. 前記接合ツールは前記超音波振動伝搬体に設けられた接合ツール吸着手段によって前記振動伝達端に設けられたすべり面に吸着されて支持され、前記接合ツールを前記振動伝達端の前記すべり面に吸着する接合ツール吸着工程をさらに備えた
ことを特徴とする請求項６に記載の電子部品製造方法。The welding tool is sucked and supported by a sliding surface provided at the vibration transmission end by a bonding tool suction means provided at the ultrasonic vibration propagating body, and the welding tool is sucked by the sliding surface at the vibration transmission end. The electronic component manufacturing method according to claim 6, further comprising a bonding tool suction step. 前記超音波振動伝搬体に対して前記接合ツールを所定の位置に位置決めする接合ツール位置決め工程をさらに備え、
前記接合ツール吸着工程は、前記接合ツール位置決め工程によって位置決めされた前記接合ツールを前記すべり面に吸着する
ことを特徴とする請求項７に記載の電子部品製造方法。A bonding tool positioning step of positioning the bonding tool at a predetermined position with respect to the ultrasonic vibration propagating body,
The electronic component manufacturing method according to claim 7, wherein the bonding tool adsorption step adsorbs the bonding tool positioned by the bonding tool positioning step to the sliding surface. 前記第１電子部品吸着工程は、概略矩形の前記第１の電子部品の少なくとも対向する２辺を把持しながら前記第１の電子部品を前記電子部品保持部に吸着する
ことを特徴とする請求項６から８のいずれかに記載の電子部品製造方法。The said 1st electronic component adsorption | suction process adsorb | sucks the said 1st electronic component to the said electronic component holding | maintenance part, hold | gripping at least 2 sides which the said 1st electronic component of a substantially rectangular shape opposes. The electronic component manufacturing method according to any one of 6 to 8.
JP2002202469A 2002-07-11 2002-07-11 Electronic component manufacturing apparatus and electronic component manufacturing method Expired - Fee Related JP3767812B2 (en)

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