JP2004047692A - Device and method for manufacturing electronic parts - Google Patents

Device and method for manufacturing electronic parts Download PDF

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Publication number
JP2004047692A
JP2004047692A JP2002202469A JP2002202469A JP2004047692A JP 2004047692 A JP2004047692 A JP 2004047692A JP 2002202469 A JP2002202469 A JP 2002202469A JP 2002202469 A JP2002202469 A JP 2002202469A JP 2004047692 A JP2004047692 A JP 2004047692A
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electronic component
ultrasonic vibration
electrode
tool
joining tool
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JP3767812B2 (en
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Mitsunori Ishizaki
石崎　光範
Yoichi Kitamura
北村　洋一
Takuya Oga
大賀　琢也
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H01L2224/75303—Shape of the pressing surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75313—Removable bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Abstract

<P>PROBLEM TO BE SOLVED: To provide electronic part manufacturing device/method for bonding a salient electrode and an electrode in a stable state without damaging electronic parts. <P>SOLUTION: The device is provided with a bonding stage 6 to which a second electronic part 2 is fixed, an ultrasonic vibration propagation body 8 propagating ultrasonic vibration to a first electronic part 1 and a bonding tool 4 which is movably supported by a vibration transmission end of the ultrasonic vibration propagation body 8 in a direction similar to an ultrasonic vibration direction, in which an electronic part holding part 4b is formed and the first electronic part 4 is adsorbed and held by an electronic part suction means 4a. The ultrasonic vibration propagation body 8 vibrates the ultrasonic vibration propagation body 8 while the salient electrode 3 is pressed to the electrode 2c, propagates ultrasonic vibration to the first electronic part 1 and connects the second electronic part 2 to the first electronic part 1 while the bonding tool 4 is made to slide in the ultrasonic vibration direction when prescribed bonding power occurs between the salient electrode 3 and the electrode 2c. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は、超音波振動を伝搬しながら突起電極と電極とを接合するフリップチップの実装方法およびその装置に関し、特に電子部品を破損させることなく安定した接合強度で電子部品を接合する電子部品製造装置および電子部品製造方法に関するものである。
【０００２】
【従来の技術】
多端子で狭ピッチの電極を有する電子部品を実装する手法として、電子部品に超音波振動を伝搬しながら電子部品の電極上に形成した突起電極と電極とを接合する、フリップチップ方式がよく用いられており、例えば”超音波振動によるフリップチップ実装技術の開発”（橋本他、６ｔｈ　Ｓｙｍｐｏｓｉｕｍ　ｏｎ　Ｍｉｃｒｏｊｏｉｎｉｎｇ　ａｎｄ　　Ａｓｓｅｍｂｌｙ　Ｔｅｃｈｎｏｌｏｇｙ　ｉｎ　Ｅｌｅｃｔｒｏｎｉｃｓ、１７５−１７８、２０００）に記載されている。
【０００３】
図２１及び図２２は従来の電子部品の製造方法および製造装置を示す一部を断面とする側面図である。図２１及び図２２図において、１は概略矩形平板状の第１の電子部品、１ｃは第１の電子部品１の表面としての第１の面１ａに設けられた電極、２は概略矩形平板状の第２の電子部品、２ｃは第２の電子部品２の表面としての第１の面２ａに設けられた電極、３は第１の電子部品１の電極１ｃ上に設けられた突起電極である。第１の電子部品１と第２の電子部品２の裏面である第２の面１ｂ，２ｂは平坦な面とされている。また、４は第１の電子部品１を吸着してこれを保持するとともに第１の電子部品１に超音波振動を伝搬する接合ツール、４ａは接合ツール４に設けられた真空吸着穴、６は接合ステージ、５は接合ステージ６に設けられた真空吸着穴である。
【０００４】
図２１は第１の電子部品１を真空吸着穴４ａで吸引して接合ツール４の電子部品保持部４ｂに真空吸着保持し、一方、第２の電子部品２を真空吸着穴５で吸引して第１の面２ａを外方に向けて接合ステージ６に固定し、第１の電子部品１の電極１ｃに形成された突起電極３と、接合ステージ６に真空吸着保持された第２の電子部品２の電極２ｃとが位置合わせされた状態を示す一部を断面とする側面図である。
【０００５】
図２２は突起電極３と第２の電子部品２の電極２ｃとを加圧するとともに、接合ツール４によって第１の電子部品１に矢印Ｉに示されるように超音波振動が伝搬された状態を示す一部を断面とする側面図である。
第１の電子部品１の突起電極３と第２の電子部品２の電極２ｃとが位置合わせされた後、接合ツール４が第２の電子部品２の方向であるＺ軸方向に移動し、突起電極３を所定の押圧力で電極２ｃに押圧しながら、接合ツール４が図中矢印Ｉに示されるように超音波振動を第１の電子部品１に伝搬する。Ｚ軸方向の所定の押圧力とこれに直行するＸＹ平面上の超音波振動によって突起電極３と電極２ｃとがこすれあい表面の汚れや膜が除去されて両者が固相接合される。
【０００６】
図２３は従来の電子部品の製造方法および製造装置の別の例を示し、突起電極３と第２の電子部品２の電極２ｃとを加圧するとともに、接合ツール１２によって第１の電子部品１に矢印Ｊに示されるように超音波振動が伝搬された状態を示す一部を断面とする側面図である。図２３において、１２は四辺に各々斜面１２ａが形成され図中下方向に行くにつれて開口部を広げるくぼみ形状の電子部品保持部が形成された内面角錐型の接合ツールである。１２ｂは接合ツール１２に設けられた真空吸着穴である。接合ツール１２は四辺に各々斜面１２ａを有する内面角錐型の電子部品保持部に第１の電子部品１を保持して超音波振動を第１の電子部品１に伝搬する。他の構成は図２１及び図２２に示される従来技術と同じである。
【０００７】
【発明が解決しようとする課題】
図２１及び図２２に示される従来技術では、突起電極３と電極２ｃとの接合が進行して両者間に働く接合力が増すと、第１の電子部品１に徐々に止まろうとする力が働くのに対して、接合ツール４はそのまま振動を続けるので、接合ツール４と第１の電子部品１の裏面との間で強制的な往復運動（位置ずれ）が生じ、第１の電子部品１の裏面が擦られて破損するといった問題があった。
【０００８】
また、第１の電子部品１の第２の面１ｂに電極等の複数の突起物が形成されている場合は、接合ツール４の電子部品保持面に突起の先端しか接触しないこととなり、接合ツール４と第１の電子部品１との接触面積が減少しすべりが生じやすくなるため、突起電極３に超音波振動を十分伝達することができずに適正な接合強が行われないといった問題や、突起物により接合ツール４が磨耗して接合ツール４の寿命が短くなるといった問題があった。
【０００９】
これに対し、図２３に示される従来技術では、接合ツール１２と第１の電子部品１とのすべりは改善されている。しかしながら、図２３に示される従来技術においても、突起電極３と電極２ｃとの接合が進行して接合力が増した場合、第１の電子部品１に大きな超音波振動が伝搬され続けるので接合部が破損するといった問題があった。
【００１０】
さらに、電極数が多く、大きな超音波出力が必要となる場合には、接合中に第１の電子部品１と角錐型接合ツール１２の斜面１２ａとの接触部に過大な荷重が集中して第１の電子部品１を破損させる問題があり、特に化合物半導体のように脆弱な部品への適用には制限があった。
【００１１】
この発明は上述のような課題を解決するためになされたもので、電子部品を破損させることなく、突起電極と電極とを安定した状態で接合することができる電子部品製造装置および電子部品製造方法を得ることを目的とする。
【００１２】
【課題を解決するための手段】
この発明に係る電子部品製造装置は、第１の面に複数の電極が形成された第２の電子部品を、第１の面を外方に向けて電子部品固定部に固定する接合ステージと、接合ステージに対して移動可能に設けられ、第１の電子部品に超音波振動を伝搬する超音波振動伝搬体と、超音波振動伝搬体の振動伝達端に超音波振動方向と同じ方向に移動可能に支持され、超音波振動伝搬体と反対側の面に電子部品保持部が形成され、第１の面に複数の突起電極が形成され第１の面が第２の電子部品に対向するように電子部品保持部に配置された第１の電子部品を、電子部品保持部に設けられた電子部品吸着手段により吸着して保持する接合ツールとを備え、超音波振動伝搬体は、第１の電子部品の突起電極を第２の電子部品の電極に位置決めし、突起電極を電極に押圧しながら超音波振動伝搬体を振動させて超音波振動を第１の電子部品に伝搬するとともに、突起電極と電極との間に所定の接合力が生じたときに接合ツールを超音波振動方向にすべらせながら第２の電子部品に第１の電子部品を接続する。
【００１３】
また、超音波振動伝搬体は、接合ツール吸着手段によって振動伝達端に設けられたすべり面に接合ツールを吸着して超音波振動方向と同じ方向に移動可能に支持する。
【００１４】
また、超音波振動伝搬体は、振動伝達端に設けられた弾性体を介して接合ツールを超音波振動方向と同じ方向に移動可能に支持する。
【００１５】
また、接合ツールは、概略矩形の第１の電子部品の少なくとも対向する２辺を把持する電子部品把持手段を有し、電子部品吸着手段により吸着しながら電子部品把持手段によって把持して第１の電子部品を電子部品保持部に保持する。
【００１６】
また、超音波振動伝搬体に対向する対向面に接合ツールを位置決めする位置合せ爪を有する接合ツールステージをさらに備え、超音波振動伝搬体は、接合ツールステージによって位置決めされた接合ツールを接合ツール吸着手段によってすべり面に吸着する。
【００１７】
また、この発明に係る電子部品製造方法は、第１の電子部品に超音波振動を伝搬する超音波振動伝搬体と、超音波振動伝搬体の振動伝達端に超音波振動方向と同じ方向に移動可能に支持され、超音波振動伝搬体と反対側の面に電子部品保持部が形成され、電子部品保持部に設けられた電子部品吸着手段により電子部品保持部に第１の電子部品を保持する接合ツールと、電子部品保持部に対向する面に第２の電子部品を固定する電子部品固定部が設けられた接合ステージとを有する電子部品製造装置を使用する電子部品製造方法であって、第１の面に複数の電極が形成された第２の電子部品を、第１の面を外方に向けて電子部品固定部に固定する第２電子部品固定工程と、第１の面に複数の突起電極が形成された第１の電子部品を、第１の面が第２の電子部品に対向するように電子部品保持部に吸着する第１電子部品吸着工程と、第１の電子部品の突起電極を第２の電子部品の電極に位置決めし、突起電極を電極に押圧しながら超音波振動伝搬体を振動させて超音波振動を第１の電子部品に伝搬するとともに、突起電極と電極との間に所定の接合力が生じたときに接合ツールを超音波振動方向にすべらせながら第２の電子部品に第１の電子部品を接続する電子部品接続工程とを備えている。
【００１８】
また、接合ツールは超音波振動伝搬体に設けられた接合ツール吸着手段によって振動伝達端に設けられたすべり面に吸着されて支持され、接合ツールを振動伝達端のすべり面に吸着する接合ツール吸着工程をさらに備えている。
【００１９】
また、超音波振動伝搬体に対して接合ツールを所定の位置に位置決めする接合ツール位置決め工程をさらに備え、接合ツール吸着工程は、接合ツール位置決め工程によって位置決めされた接合ツールをすべり面に吸着する。
【００２０】
さらに、第１電子部品吸着工程は、概略矩形の第１の電子部品の少なくとも対向する２辺を把持しながら第１の電子部品を電子部品保持部に吸着する。
【００２１】
【発明の実施の形態】
実施の形態１．
図１から図８はこの発明の実施の形態１による電子部品製造装置および電子部品製造方法を示す一部を断面とする側面図である。図３において、１は概略矩形の平板状をなし図中下側の第１の面１ａに複数の電極１ｃが形成された第１の電子部品である。第１の電子部品１の各電極１ｃには後で詳しく述べる突起電極３が設けられている。２は概略矩形の平板状をなし図中上側の第１の面２ａに複数の電極２ｃが形成された第２の電子部品である。第２の電子部品２は電極２ｃが形成された第１の面２ａを外方に向けて接合ステージ６上の電子部品固定部６ａに固定されている。接合ステージ６の電子部品固定部６ａには、第２の電子部品２を吸着する真空吸着穴５が設けられている。
【００２２】
図１において、８は図示しない超音波振動伝搬装置の超音波振動伝搬体である。超音波振動伝搬体８は、接合ツールステージ９及び接合ステージ６に対してＸ軸、Ｙ軸およびＺ軸方向に移動可能とされ且つ第１の電子部品１に超音波振動を伝搬するために例えば片側１μｍの振幅の超音波振動をする。超音波振動伝搬体８の図１の下端の振動伝達端には、平坦なすべり面８ｃが形成されている。また、超音波振動伝搬体８には、第１の電子部品１を吸着する接合ツール吸着手段として真空吸着穴８ａ、及び後述する接合ツール４を吸着する接合ツール吸着手段として真空吸着穴８ｂが軸方向に貫通して設けられている。
【００２３】
図２において、４は超音波振動伝搬体８の振動伝達端のすべり面８ｃに真空吸着穴８ｂによって空気を吸引されて吸着された接合ツールである。接合ツール４の超音波振動伝搬体８に吸着される面と反対側の面には、第１の電子部品１を保持するための電子部品保持部４ｂが形成されている。電子部品保持部４ｂは四辺に各々斜面が形成され図中下方向に行くにつれて開口部を広げるくぼみ形状、すなわち、内面角錐型をなしている。接合ツール４の中央部には、真空吸着穴８ａに連通して空気を吸引して第１の電子部品１を吸着する電子部品吸着手段としての真空吸着穴４ａが穿孔されている。
本実施の形態では、接合ツール４はステンレス鋼にて作製されている。しなしながら、接合ツール４はステンレス鋼に限られるものではなく、例えばセラミックス材料で作製されてもよい。
【００２４】
また、図２において、９は接合ツール４を位置決めするための接合ツールステージである。接合ツールステージ９の超音波振動伝搬体８に対向する対向面には、接合ツール４を位置決めするための位置合せ爪１０が設けられている。
【００２５】
図１は接合ツールステージ９上の接合ツール４と超音波振動伝搬体８とが位置合わせされた状態を示す一部を断面とする側面図である。一連の工程において、まず、接合ツール４が、後で詳しく説明するように、接合ツールステージ９上で超音波振動伝搬体８に対して位置合わせされる。
【００２６】
図２は超音波振動伝搬体８の振動伝達端のすべり面８ｃに接合ツール４が真空吸着穴８ｂによって吸着される接合ツール吸着工程を示す一部を断面とする側面図である。接合ツール吸着工程においては、接合ツールステージ９上で超音波振動伝搬体８に対して位置合わせされた接合ツール４は、図中下方向であるＺ軸方向に移動した超音波振動伝搬体８のすべり面８ｃに、真空吸着穴８ｂによって真空吸着保持される。
【００２７】
図３は第１の電子部品１を真空吸着穴８ａで吸引して接合ツール４の電子部品保持部４ｂに真空吸着保持する第１電子部品吸着工程と、第２の電子部品２を第１の面２ａを外方に向けて電子部品固定部６ａに固定する第２電子部品固定工程とを示すとともに、第１の電子部品１の電極１ｃに形成された突起電極３と、接合ステージ６に真空吸着保持された第２の電子部品２の電極２ｃとが位置合わせされた状態を示す一部を断面とする側面図である。
【００２８】
第１電子部品吸着工程においては、振動伝達端のすべり面８ｃに接合ツール４を吸着した超音波振動伝搬体８が、例えば接合ステージ６に対して水平方向であるＸＹ平面に移動して、図示しない載置台等に置かれた第１の電子部品１を真空吸着穴８ａで吸引して接合ツール４の電子部品保持部４ｂに真空吸着保持する。
【００２９】
第２電子部品固定工程においては、接合ステージ６の電子部品固定部６ａに図示しない電子部品載置装置等によって第２の電子部品２が第１の面２ａを外方に向けて載置され、真空吸着穴５によって真空吸着されて固定される。
その後、図３に示されるように第１の電子部品１の電極１ｃに形成された突起電極３と、接合ステージ６に真空吸着保持された第２の電子部品２の電極２ｃとが位置合わせされる。
【００３０】
本実施の形態では、第１の電子部品１としてシリコン材料の半導体素子を用いている。しかしながら、第１の電子部品１として適用される部品は、シリコン材料の半導体素子に限られるものではなく、シリコン・ゲルマニュウムの合体、ヒ化ガリュウム、あるいはリン化インジューム等を材料とする他の半導体素子でもよい。そしてさらには、セラミックス配線基板や樹脂配線基板も適用することができる。
【００３１】
本実施の形態で用いたシリコン材料の半導体素子には、直径２５μｍの金ワイヤの先端を溶融凝固させて直径７５μｍの金ボールを形成した後、金ボールを電極に接合し、金ボールから金ワイヤを所定の長さ切り離すことで、直径の平均値が９７μｍの金の突起電極３を１２個形成した。ここで、突起電極３は金に限らず、例えば、銅や銀あるいは金合金、銅合金、銀合金で形成してもよい。
【００３２】
また、本実施の形態では、第２の電子部品２としてアルミナ配線基板を用いたが、アルミナ配線基板に限らずガラスセラミックスや窒化アルミ等を材料とするセラミックス基板や樹脂基板でもよく、さらにはシリコン，シリコン・ゲルマニュウム，ガリュウム・ヒ素，インジューム・リン等を材料とする半導体素子も適用することができる。
【００３３】
図４は突起電極３と第２の電子部品２の電極２ｃとを加圧するとともに、超音波振動伝搬体８によって接合ツール４に超音波振動が伝搬された状態を示す一部を断面とする側面図である。
第１の電子部品１の突起電極３と第２の電子部品２の電極２ｃとが位置合わせされた後、超音波振動伝搬体８がＺ軸方向に移動し、突起電極３を所定の押圧力で電極２ｃに押圧しながら、超音波振動伝搬体８が図中矢印Ａに示されるように超音波振動を第１の電子部品１に伝搬する。所定の押圧力と超音波振動によって突起電極３と電極２ｃとがこすれあい表面の汚れや膜が除去されて両者は固相接合される。
【００３４】
本実施の形態においては、接合ステージ６を１５０℃に加熱した状態で、第１の電子部品１であるシリコン材料の半導体素子と第２の電子部品２であるアルミナ配線基板とを１２００ｇｆの押圧力で加圧するとともに片側１μｍの振幅で６０ＫＨｚの超音波振動を伝搬した。
【００３５】
図５は第１の電子部品１の突起電極３と第２の電子部品の電極２ｃとの接合が進行した電子部品接続工程を示すとともに、突起電極３と電極２ｃとの接合力が増加し、接合ツール４に対して超音波振動伝搬体８が矢印Ｂ方向にすべった状態を示す一部を断面とする側面図である。
【００３６】
電子部品接続工程においては、突起電極３が電極２ｃに押圧されながら超音波振動が伝搬され、所定の押圧力と超音波振動によって突起電極３と電極２ｃとが固相接合される。そして、突起電極３と電極２ｃにとの接合が進行し、突起電極３と電極２ｃとの接合力が増加し所定の大きさ以上になったとき、接合ツール４は超音波振動伝搬体８のすべり面８ｃに対してすべり始める。突起電極３と電極２ｃとの接合力に対してすべり始める摩擦抵抗を調節するには、すべり面８ｃ及びこれに対面して接触する接合ツール４の接触面の滑らかさを適正なものにするとともに、真空吸着穴８ｂによる真空吸着力を適度に変化させて調節する。
【００３７】
本実施の形態においては、片側１μｍの振幅で６０ＫＨｚの超音波振動を０．３秒間伝搬し、金の突起電極３と金の電極２ｃとをせん断破断荷重７０ｇｆ／バンプ以上で接合した。このとき、突起電極３と電極２ｃとの接合が進行して、両者間に働く接合力が所定の値まで増した場合、超音波振動伝搬体８に対して接合ツール４がすべり始め、第１の電子部品１の裏面は破損することがなかった。なお、接合ツール４とすべり面８ｃとの摩擦抵抗を所定の値とするために、超音波振動の伝搬中は真空吸着穴８ｂによる接合ツール４の真空吸着を停止した。
【００３８】
一方、同じ対象物、すなわち、第１の電子部品１にシリコン材料の半導体素子、第２の電子部品２にアルミナ配線基板を適用して、図５に示す従来の方法で接合した場合、超音波振動の伝搬時間が０．１秒以下では第１の電子部品１の裏面に破損は生じなかったものの、最小のせん断破断荷重が２５ｇｆ／バンプとなり十分な接合力が得られなかった。また、超音波振動の伝搬時間を０．１秒より長くしてゆくとそれにともない接合力は増したが、第１の電子部品１と接合ツール４の間に位置ずれが生じ第１の電子部品１の裏面が破損した。
【００３９】
図６は真空吸着穴８ａの真空吸着を停止するとともに真空吸着穴８ｂで再び接合ツール４を真空吸着保持し、超音波振動伝搬体８を上方に移動させて第１の電子部品１と接合ツール４とを離間させた状態を示す一部を断面とする側面図である。図７は接合ツール４を接合ツールステージ９に置く状態を示す一部を断面とする側面図である。
【００４０】
第１の電子部品１の突起電極３と第２の電子部品の電極２ｃとの接合が終了すると、超音波振動伝搬体８がＺ軸で第１の電子部品１と離れる上方向に移動し、その後ＸＹ平面内で移動して接合ツールステージ９に向かう、そして再び下降して接合ツールステージ９の所定の位置に接合ツール４を置く、そして真空吸着穴８ｂの真空吸着を停止し超音波振動伝搬体８は上方に逃げる。
【００４１】
図８は両側から位置合せ爪１０で接合ツール４を押し、接合ツール４を接合ステージ９の所定の位置に移動させる接合ツール位置決め工程を示す一部を断面とする側面図である。
接合ツール位置決め工程においては、接合ツールステージ９の所定の位置に置かれた接合ツール４は、四方から図中矢印Ｃのようにスライドして接合ツール４の各面を押す位置合せ爪１０によって所定の位置に位置決めされる。その後、工程は図１に示される状態に戻るが、接合ツール４は、超音波振動伝搬体８に対して正確に位置決めされた位置にあり、図２に示される接合ツール吸着工程では、接合ツール４は超音波振動伝搬体８の所定の位置に正確に吸着される。
【００４２】
以上のように本実施の形態の電子部品製造装置および電子部品製造方法においては、突起電極３と電極２ｃとの接合が進行して両者間の接合力が増加しても、接合ツール４と第１の電子部品１の裏面との間で位置ずれが生じないので、第１の電子部品１の裏面が破損することがない。
【００４３】
また、さらに、接合ツール４と超音波振動伝搬体８との間にすべりが生じるため、突起電極３と電極２ｃとの接合がさらに進行して両者間の接合部に大きな超音波振動が加わり続けても接合部が破損することもない。
【００４４】
なお、接合ツール４と超音波振動伝搬体８のすべり面８ｃとの摩擦抵抗をすくなくしてすべりを生じやすくするため、接合ツール４の裏面に凹部を設けてすべり面８ｃとの接触面積を低減してもよい。さらには、接合中に真空吸着穴８ｂから逆に空気を吹き付けて接合ツール４と超音波振動伝搬体８との摩擦抵抗を低減してもよい。
【００４５】
実施の形態２．
図９から図１６はこの発明の実施の形態２による電子部品製造装置および電子部品製造方法を示す一部を断面とする側面図である。図９から図１６において、実施の形態１と同一または相当部分には同一符号を付し、その説明を省略する。本実施の形態においては、実施の形態１に対して、接合ツール４が異なったものとなっている。図９から図１６において、４ｄは接合ツール４のスライド部、４ｃは接合ツール４の真空吸着穴、４ｆは接合ツール４に設けられた電子部品把持手段としての把持爪、８ｄは超音波振動伝搬体８の真空吸着穴である。その他の構成は実施の形態１と概略同様である。
【００４６】
図９は接合ツールステージ９上の接合ツール４と超音波振動伝搬体８とが位置合わせされた状態を示す一部を断面とする側面図である。接合ツール４は、第１の電子部品１を真空吸着する真空吸着穴４ａと、真空吸着穴４ｃ内部の空気圧を可変させることでスライドするスライド部４ｄを備えている。スライド部４ｄは接合ツール本体４ｅに対して進退動可能に設けられている。スライド部４ｄと接合ツール本体４ｅの間には、図示しない弾性体が縮設されている。この弾性体により、スライド部４ｄは、常時は接合ツール本体４ｅと離れるように付勢されている。そして、真空吸着穴４ｃによって内部を減圧されて接合ツール本体４ｅに近づく方向に移動する。接合ツール本体４ｅとスライド部４ｄには、それぞれ把持爪４ｆ，４ｆが突設されている。２つの把持爪４ｆ，４ｆは互いに近づく方向に移動することで第１の電子部品１を挟んで挟持する。
本実施の形態では、接合ツール４はステンレス鋼で作製されているが、ステンレス鋼に限定されることはなく、例えばセラミックス材料が用いられてもよい。
【００４７】
図１０は超音波振動伝搬体８の振動伝達端のすべり面８ｃに接合ツール４が真空吸着穴８ｂによって吸着される接合ツール吸着工程を示す一部を断面とする側面図である。図１１は第１の電子部品１を真空吸着穴８ａで吸引して接合ツール４の電子部品保持部４ｂに真空吸着するとともに、真空吸着穴８ｄを真空吸引して接合ツール４のスライド部４ｄをスライドさせ、第１の電子部品１の対向する１対の側面を挟み込んで保持する第１電子部品吸着工程と、第２の電子部品２を第１の面２ａを外方に向けて電子部品固定部６ａに固定する第２電子部品固定工程とを示すとともに、第１の電子部品１の電極１ｃに形成された突起電極３と、接合ステージ６に真空吸着保持された第２の電子部品２の電極２ｃとが位置合わせされた状態を示す一部を断面とする側面図である。
【００４８】
第１電子部品吸着工程においては、振動伝達端のすべり面８ｃに接合ツール４を吸着した超音波振動伝搬体８が、例えば接合ステージ６に対して水平方向であるＸＹ平面内で移動して、図示しない載置台等に置かれた第１の電子部品１を真空吸着穴８ａで吸引して接合ツール４の電子部品保持部４ｂに真空吸着保持する。このとき、同時に真空吸着穴８ｄから空気を吸引して接合ツール４のスライド部４ｄをスライドさせ、第１の電子部品１の対向する１対の側面を把持爪４ｆ，４ｆで挟み込んで保持する。
【００４９】
第２電子部品固定工程においては、接合ステージ６の電子部品固定部６ａに図示しない電子部品載置装置によって第２の電子部品２が第１の面２ａを外方に向けて載置され、真空吸着穴５によって真空吸着されて固定される。
その後、図１１に示されるように第１の電子部品１の電極１ｃに形成された突起電極３と、接合ステージ６に真空吸着保持された第２の電子部品２の電極２ｃとが位置合わせされる。
【００５０】
本実施の形態では、第１の電子部品１としてヒ化ガリュウム材料の半導体素子を用いている。しかしながら、第１の電子部品１として適用される部品は、ヒ化ガリュウム材料の半導体素子に限られるものではなく、シリコン、シリコン・ゲルマニュウムの合体、あるいはリン化インジューム等を材料とする他の半導体素子でもよい。そしてさらには、セラミックス配線基板や樹脂配線基板も適用することができる。
【００５１】
本実施の形態で用いたヒ化ガリュウム材料の半導体素子には、直径２５μｍの金ワイヤの先端を溶融凝固させて直径７５μｍの金ボールを形成した後、金ボールを電極に接合し、金ボールから金ワイヤを所定の長さ切り離すことで、直径の平均値が９７μｍの金の突起電極３を３０個形成した。ここで、突起電極３は金に限らず、例えば、銅や銀あるいは金合金、銅合金、銀合金で形成してもよい。
【００５２】
また、本実施の形態では、第２の電子部品２としてアルミナ配線基板を用いたが、アルミナ配線基板に限らずガラスセラミックスや窒化アルミ等を材料とするセラミックス基板や樹脂基板でもよく、さらにはシリコン，シリコン・ゲルマニュウム，ガリュウム・ヒ素，インジューム・リン等を材料とする半導体素子も適用することができる。
【００５３】
図１２は突起電極３と第２の電子部品の電極２ｃとを加圧するとともに、接合ツール４とスライド部４ｄに挟み込まれた第１の電子部品１に挟持する１対の側面に垂直な方向に超音波振動が伝搬された状態を示す一部を断面とする側面図である。
【００５４】
第１の電子部品１の突起電極３と第２の電子部品２の電極２ｃとが位置合わせされた後、超音波振動伝搬体８がＺ軸方向に移動し、突起電極３を所定の押圧力で電極２ｃに押圧しながら、超音波振動伝搬体８が図中矢印Ｄに示されるように超音波振動を第１の電子部品１に伝搬する。所定の押圧力と超音波振動によって突起電極３と電極２ｃとがこすれあい表面の汚れや膜が除去されて固相接合される。
【００５５】
本実施の形態においては、超音波振動方向に垂直な２つの側面を接合ツール４で挟み込むことで、突起電極３の数が増して接合に大きな超音波出力が必要となる場合でも、角錐型接合ツールのように第１の電子部品１と接合ツール４との接触部に過大な荷重集中が生じることがなく、化合物半導体のように脆弱な部品でも破損することがない。
【００５６】
本実施の形態においては、接合ステージ６を１５０℃に加熱した状態で、第１の電子部品１であるヒ化ガリュウム材料の半導体素子と第２の電子部品２であるアルミナ配線基板とを２７００ｇｆの押圧力で加圧するとともに片側２μｍの振幅で６０ＫＨｚの超音波振動を伝搬した。
【００５７】
図１３は第１の電子部品１の突起電極３と第２の電子部品の電極２ｃとの接合が進行した電子部品接続工程を示すとともに、突起電極３と電極２ｃとの接合力が増加し、接合ツール４に対して超音波振動伝搬体８が矢印Ｅ方向にすべった状態を示す一部を断面とする側面図である。
電子部品接続工程においては、突起電極３が電極２ｃに押圧されながら超音波振動が伝搬され、所定の押圧力と超音波振動によって突起電極３と電極２ｃとが固相接続される。そして、突起電極３と電極２ｃにとの接合が進行し、突起電極３と電極２ｃとの接合力が増加し所定の大きさ以上になったとき、接合ツール４は超音波振動伝搬体８のすべり面８ｃに対してすべり始める。突起電極３と電極２ｃとの接合力に対してすべり始める摩擦抵抗を調節するには、すべり面８ｃ及びこれに対向して接触する接合ツール４の接触面の滑らかさを適正なものにするとともに、真空吸着穴８ｂによる真空吸着力を適度に変化させて調節する。
【００５８】
本実施の形態においては、突起電極３を３０個形成したが、突起電極３の数が増加すると、これに伴い突起電極３と電極２ｃとの間に生じる接合力が大きくなる。そのため、両者の接合が十分に進行する前に接合ツール４とすべり面８ｃとの間ですべりが生じてしまう場合がある。接合が十分に進行する前に接合ツール４がすべり面８ｃに対してすべると超音波振動が接合部に伝わらず接合が完全に行われない問題が生じる。
【００５９】
そこで、本実施の形態では、超音波振動伝搬開始から０．１秒間は真空吸着穴８ｂで接合ツール４を真空吸着したままとし、超音波振動伝搬体８と接合ツール４とのすべりを防止して接合を進ませた。その後、真空吸着を停止してさらに超音波振動を０．４秒間伝搬した。これにより、素子裏面の破損を生じさせることなく、金の突起電極３とアルミナ配線板の厚さ３μｍの金の電極２ｃとをせん断破断荷重７５ｇｆ／バンプ以上で接合することができた。
【００６０】
本実施の形態では、真空吸着の停止のタイミングは、超音波振動の伝搬時間で得ている。このタイミングは、接合中の超音波振幅，超音波振動子のインピーダンス，荷重等を測定してタイミングを得ることもできる。すなわち、接合が進行するにつれて超音波振幅はしだいに小さくなるので、これを検出しながら接合を行い所定の大きさ以下になったときに、真空吸着を停止するあるいは逆に空気を吹き付けることで接合ツール４と超音波振動伝搬体８との摩擦抵抗を低減してもよい。
また、接合が進行するにつれて超音波インピーダンスしだいに大きくなるので、これを検出しながら接合を行い所定の大きさ以上になったときに、真空吸着を停止するあるいは逆に空気を吹き付けることで接合ツール４と超音波振動伝搬体８との摩擦抵抗を低減してもよい。
さらには、接合が進行するにつれて超音波振動伝搬体８に作用する荷重はしだいに大きくなるので同様の方法でタイミングの制御に用いることができる。
【００６１】
図１４は真空吸着穴８ａの真空吸着を停止するとともに真空吸着穴８ｂで再び接合ツール４を真空吸着保持し、超音波振動伝搬体８を上方に移動させて第１の電子部品１と接合ツール４とを離間させた状態を示す一部を断面とする側面図である。図１５は接合ツール４を接合ツールステージ９に置く状態を示す一部を断面とする側面図である。
【００６２】
第１の電子部品１の突起電極３と第２の電子部品の電極２ｃとの接合が終了すると、超音波振動伝搬体８がＺ軸で第１の電子部品１と離れる上方向に移動し、その後ＸＹ平面内で移動して接合ツールステージ９に向かう、そして再びＺ軸方向に下降して接合ツールステージ９の所定の位置に接合ツール４を置く、そして真空吸着穴８ｂの真空吸着を停止し超音波振動伝搬体８は上方に逃げる。
【００６３】
図１６は両側から位置合せ爪１０で接合ツール４を押し、接合ツール４を接合ステージ９の所定の位置に移動させる接合ツール位置決め工程を示す一部を断面とする側面図である。
接合ツール位置決め工程においては、接合ツールステージ９の所定の位置に置かれた接合ツール４は、四方から図中矢印Ｆのようにスライドして接合ツール４の各面を押す位置合せ爪１０にて所定の位置に位置決めされる。その後、工程は図９に示される状態に戻るが、接合ツール４は、超音波振動伝搬体８に対して位置決めされた位置にあり、図１０に示される接合ツール吸着工程では、接合ツール４は超音波振動伝搬体８の所定の位置に正確に吸着される。
【００６４】
以上のように本実施の形態の電子部品製造装置および電子部品製造方法においては、接合ツール４は、概略矩形平板状の第１の電子部品１の対向する２辺を把持する電子部品把持手段としての２つの把持爪４ｆ，４ｆを有し、真空吸着穴８ａによって吸着しながら把持爪４ｆ，４ｆで把持して第１の電子部品１を電子部品保持部４ｂに保持する。そのため、接合ツール４と第１の電子部品１の裏面との間に発生する位置ずれをさらに抑制することができ、さらに第１の電子部品１の裏面の破損を防止することがなくなる。
【００６５】
尚、本実施の形態においては、把持爪４ｆ，４ｆを動かす駆動力として気体の圧力を利用したが、他に液体による圧力や電磁力あるいはバネや圧電素子やネジによる圧力を用いても同様の効果が得られる。また、第１の電子部品１の２辺を挟み込んでいるが、電子部品把持手段は、第１の電子部品１と接合ツール４とのすべりを防止することが目的であり、３辺あるいは４辺を把持してもよいことは言うまでもない。
【００６６】
実施の形態３．
図１７から図２０はこの発明の実施の形態３による電子部品製造装置および電子部品製造方法を示す一部を断面とする側面図である。図１７から図２０において、実施の形態１と同一または相当部分には同一符号を付し、その説明を省略する。図１７から図２０において、１１は超音波振動伝搬体８の振動伝達端に設けられ接合ツール４を超音波振動方向と同じ方向に移動可能に支持する弾性体としてのバネである。バネ１１は超音波振動伝搬体８と接合ツール４との間で２方向から接合ツール４を押圧して接合ツール４を所定の位置に配置する。その他の構成は実施の形態１と概略同様である。
【００６７】
図１７は第１の電子部品１を真空吸着穴８ａで吸引して接合ツール４の電子部品保持部４ｂに真空吸着保持する第１電子部品吸着工程と、第２の電子部品２を第１の面２ａを外方に向けて電子部品固定部６ａに固定する第２電子部品固定工程とを示すとともに、第１の電子部品１の電極１ｃに形成された突起電極３と、接合ステージ６に真空吸着保持された第２の電子部品２の電極２ｃとが位置合わせされた状態を示す一部を断面とする側面図である。
【００６８】
第１電子部品吸着工程においては、振動伝達端に接合ツール４を移動可能に支持した超音波振動伝搬体８が接合ステージ６に対して水平方向であるＸＹ平面内で移動して、図示しない載置台に置かれた第１の電子部品１を真空吸着穴８ａで吸引して接合ツール４の電子部品保持部４ｂに真空吸着保持する。
【００６９】
第２電子部品固定工程においては、接合ステージ６の電子部品固定部６ａに図示しない電子部品載置装置によって第２の電子部品２が第１の面２ａを外方に向けて載置され、真空吸着穴５によって真空吸着されて固定される。
その後、図１７に示されるように第１の電子部品１の電極１ｃに形成された突起電極３と、接合ステージ６に真空吸着保持された第２の電子部品２の電極２ｃとが位置合わせされる。
【００７０】
本実施の形態では、接合ツール４はステンレス鋼で作製されている。しなしながら、ステンレス鋼に限られるものではなく、例えばセラミックス材料で作製されてもよい。さらには、実施の形態２のように第１の電子部品１の対向する２辺を把持する手段を有する接合ツールを用いてもよい。
【００７１】
本実施の形態では、第１の電子部品１としてヒ化ガリュウム材料の半導体素子を用いている。しかしながら、第１の電子部品１として適用される部品は、ヒ化ガリュウム材料の半導体素子に限られるものではなく、シリコン、シリコン・ゲルマニュウムの合体、あるいはリン化インジューム等を材料とする他の半導体素子でもよい。そしてさらには、セラミックス配線基板や樹脂配線基板も適用することができる。
【００７２】
本実施の形態で用いたヒ化ガリュウム材料の半導体素子には、直径２５μｍの金ワイヤの先端を溶融凝固させて直径７５μｍの金ボールを形成した後、金ボールを電極に接合し、金ボールから金ワイヤを所定の長さ切り離すことで、直径の平均値が９７μｍの金の突起電極３を８個形成した。ここで、突起電極３は金に限らず、例えば、銅や銀あるいは金合金、銅合金、銀合金で形成してもよい。
【００７３】
また、本実施の形態では、第２の電子部品２としてアルミナ配線基板を用いたが、アルミナ配線基板に限らずガラスセラミックスや窒化アルミ等を材料とするセラミックス基板や樹脂基板でもよく、さらにはシリコン，シリコン・ゲルマニュウム，ガリュウム・ヒ素，インジューム・リン等を材料とする半導体素子も適用することができる。
【００７４】
図１８は突起電極３と第２の電子部品２の電極２ｃとを加圧するとともに、超音波振動伝搬体８によって接合ツール４に超音波振動が伝搬された状態を示す一部を断面とする側面図である。
【００７５】
第１の電子部品１の突起電極３と第２の電子部品２の電極２ｃとが位置合わせされた後、超音波振動伝搬体８がＺ軸方向に移動し、突起電極３を所定の押圧力で電極２ｃに押圧しながら、超音波振動伝搬体８が図中矢印Ｇに示されるように超音波振動を第１の電子部品１に伝搬する。所定の押圧力と超音波振動によって突起電極３と電極２ｃとはこすれあい表面の汚れや膜が除去されて固相接合される。
【００７６】
本実施の形態においては、接合ステージ６を１５０℃に加熱した状態で、第１の電子部品１であるヒ化ガリュウム材料の半導体素子と第２の電子部品２であるアルミナ配線基板とを８００ｇｆの押圧力で加圧するとともに片側０．８μｍの振幅で６０ＫＨｚの超音波振動を伝搬した。
【００７７】
図１９は第１の電子部品１の突起電極３と第２の電子部品の電極２ｃとの接合が進行した電子部品接続工程を示すとともに、突起電極３と電極２ｃとの接合力が増加し、接合ツール４に対して超音波振動伝搬体８が矢印Ｈ方向にすべった状態を示す一部を断面とする側面図である。
【００７８】
電子部品接続工程においては、突起電極３が電極２ｃに押圧されながら超音波振動が伝搬され、所定の押圧力と超音波振動によって突起電極３と電極２ｃとが固相接続される。そして、突起電極３と電極２ｃにとの接合が進行し、突起電極３と電極２ｃとの接合力が増加し所定の大きさ以上になったとき、接合ツール４は超音波振動伝搬体８のすべり面８ｃに対してすべり始める。突起電極３と電極電極２ｃとの接合力に対してすべり始める摩擦抵抗を調節するには、すべり面８ｃ及びこれに対向して接触する接合ツール４の接触面の滑らかさを適正なものにする。
【００７９】
本実施の形態においては、接合ステージ６を１５０℃に加熱した状態で、第１の電子部品１であるヒ化ガリュウム材料の半導体素子と第２の電子部品２であるアルミナ配線基板とを８００ｇｆの押圧力で加圧するとともに片側０．８μｍの振幅で６０ＫＨｚの超音波振動を伝搬した。
【００８０】
図２０は真空吸着穴８ａの真空吸着を停止し、超音波振動伝搬体８を上方に移動させて第１の電子部品１と接合ツール４とを分離した状態を示す一部を断面とする側面図である。
【００８１】
以上のように本実施の形態の電子部品製造装置および電子部品製造方法においては、接合ツール４は、弾性体としてのバネ１１により支持されて超音波振動伝搬体８の振動伝達端に常時設けられている。そのため、超音波振動伝搬体８に接合ツール４を吸着する接合ツール吸着工程や超音波振動伝搬体８に対して接合ツール４の位置決めを行う接合ツール位置決め工程がなくなり、全体として加工時間が削減され、生産性が向上しコストをさげることができる。
尚、本実施の形態においては、接合条件によって適度な弾性力を有するバネ１１を選択することにより適正な接合を行うことができる。
【００８２】
【発明の効果】
この発明に係る電子部品製造装置は、第１の面に複数の電極が形成された第２の電子部品を、第１の面を外方に向けて電子部品固定部に固定する接合ステージと、接合ステージに対して移動可能に設けられ、第１の電子部品に超音波振動を伝搬する超音波振動伝搬体と、超音波振動伝搬体の振動伝達端に超音波振動方向と同じ方向に移動可能に支持され、超音波振動伝搬体と反対側の面に電子部品保持部が形成され、第１の面に複数の突起電極が形成され第１の面が第２の電子部品に対向するように電子部品保持部に配置された第１の電子部品を、電子部品保持部に設けられた電子部品吸着手段により吸着して保持する接合ツールとを備え、超音波振動伝搬体は、第１の電子部品の突起電極を第２の電子部品の電極に位置決めし、突起電極を電極に押圧しながら超音波振動伝搬体を振動させて超音波振動を第１の電子部品に伝搬するとともに、突起電極と電極との間に所定の接合力が生じたときに接合ツールを超音波振動方向にすべらせながら第２の電子部品に第１の電子部品を接続する。そのため、第１の電子部品と第２の電子部品の接合中に、接合ツールに対して第１の電子部品が位置ずれを発生することがなくなる。その結果、第１の電子部品を破損させることなく、第１の電子部品と第２の電子部品とを安定した状態で接合することができる。
【００８３】
また、超音波振動伝搬体は、接合ツール吸着手段によって振動伝達端に設けられたすべり面に接合ツールを吸着して超音波振動方向と同じ方向に移動可能に支持する。そのため、電子部品吸着手段と同じ駆動源を用いて接合ツールをすべり面に吸着することができ、簡単な構成とすることができるので、コストダウンをすることができる。
【００８４】
また、超音波振動伝搬体は、振動伝達端に設けられた弾性体を介して接合ツールを超音波振動方向と同じ方向に移動可能に支持する。そのため、接合ツールに力が働かなくなったとき、弾性体は接合ツールを所定の位置に支持するので、超音波振動伝搬体に対して接合ツールを位置決めする動作は、第１の電子部品から接合ツールを離間させるのみの動作でよく、製造時間を短縮することができるので、コストダウンをすることができる。
【００８５】
また、接合ツールは、概略矩形の第１の電子部品の少なくとも対向する２辺を把持する電子部品把持手段を有し、電子部品吸着手段により吸着しながら電子部品把持手段によって把持して第１の電子部品を電子部品保持部に保持する。そのため、第１の電子部品が安定して保持され、接合ツールに対して第１の電子部品がさらに位置ずれを発生することがなくなり、第１の電子部品と第２の電子部品とをさらに安定した状態で接合することができる。
【００８６】
また、超音波振動伝搬体に対向する対向面に接合ツールを位置決めする位置合せ爪を有する接合ツールステージをさらに備え、超音波振動伝搬体は、接合ツールステージによって位置決めされた接合ツールを接合ツール吸着手段によってすべり面に吸着する。そのため、超音波振動伝搬体から離脱してしまう接合ツールを簡単な構成で位置決めすることができ、コストダウンをすることができる。
【００８７】
また、この発明に係る電子部品製造方法は、第１の電子部品に超音波振動を伝搬する超音波振動伝搬体と、超音波振動伝搬体の振動伝達端に超音波振動方向と同じ方向に移動可能に支持され、超音波振動伝搬体と反対側の面に電子部品保持部が形成され、電子部品保持部に設けられた電子部品吸着手段により電子部品保持部に第１の電子部品を保持する接合ツールと、電子部品保持部に対向する面に第２の電子部品を固定する電子部品固定部が設けられた接合ステージとを有する電子部品製造装置を使用する電子部品製造方法であって、第１の面に複数の電極が形成された第２の電子部品を、第１の面を外方に向けて電子部品固定部に固定する第２電子部品固定工程と、第１の面に複数の突起電極が形成された第１の電子部品を、第１の面が第２の電子部品に対向するように電子部品保持部に吸着する第１電子部品吸着工程と、第１の電子部品の突起電極を第２の電子部品の電極に位置決めし、突起電極を電極に押圧しながら超音波振動伝搬体を振動させて超音波振動を第１の電子部品に伝搬するとともに、突起電極と電極との間に所定の接合力が生じたときに接合ツールを超音波振動方向にすべらせながら第２の電子部品に第１の電子部品を接続する電子部品接続工程とを備えている。そのため、電子部品接続工程において、第１の電子部品と第２の電子部品の接合中に、接合ツールに対して第１の電子部品が位置ずれおこすことがなく、第１の電子部品が破損することがなくなり、第１の電子部品と第２の電子部品とが安定した状態で接合される。
【００８８】
また、接合ツールは超音波振動伝搬体に設けられた接合ツール吸着手段によって振動伝達端に設けられたすべり面に吸着されて支持され、接合ツールを振動伝達端のすべり面に吸着する接合ツール吸着工程をさらに備えている。そのため、接合ツール吸着工程では、第１電子部品吸着工程と同じ駆動源の電子部品吸着手段にて接合ツールをすべり面に吸着し、装置を簡単な構成とすることができるので、コストダウンをすることができる。
【００８９】
また、超音波振動伝搬体に対して接合ツールを所定の位置に位置決めする接合ツール位置決め工程をさらに備え、接合ツール吸着工程は、接合ツール位置決め工程によって位置決めされた接合ツールをすべり面に吸着する。そのため、超音波振動伝搬体から離脱してしまう接合ツールを簡単な動作にて位置決めすることができる。
【００９０】
さらに、第１電子部品吸着工程は、概略矩形の第１の電子部品の少なくとも対向する２辺を把持しながら第１の電子部品を電子部品保持部に吸着する。そのため、電子部品接続工程において、第１の電子部品と第２の電子部品の接合中に、接合ツールに対して第１の電子部品がさらに位置ずれおこすことがなく、第１の電子部品がさらに破損することがなくなり、第１の電子部品と第２の電子部品とがさらに安定した状態で接合される。
【図面の簡単な説明】
【図１】この発明の実施の形態１の接合ツールと超音波振動伝搬体とが位置合わせされた状態を示す一部を断面とする側面図である。
【図２】この発明の実施の形態１のすべり面に接合ツールが吸着される接合ツール吸着工程を示す一部を断面とする側面図である。
【図３】この発明の実施の形態１の第１の電子部品を接合ツールの電子部品保持部に真空吸着保持する第１電子部品吸着工程と、第２の電子部品２を電子部品固定部に固定する第２電子部品固定工程とを示すとともに、第１の電子部品と第２の電子部品とが位置合わせされた状態を示す一部を断面とする側面図である。
【図４】この発明の実施の形態１の突起電極と電極とを加圧するとともに接合ツールに超音波振動が伝搬された状態を示す一部を断面とする側面図である。
【図５】この発明の実施の形態１の突起電極と電極との接合力が増加し接合ツールに対して超音波振動伝搬体がすべった状態を示す一部を断面とする側面図である。
【図６】この発明の実施の形態１の超音波振動伝搬体を上方に移動させて第１の電子部品と接合ツールとを離間させた状態を示す一部を断面とする側面図である。
【図７】この発明の実施の形態１の接合ツールを接合ツールステージに置く状態を示す一部を断面とする側面図である。
【図８】この発明の実施の形態１の位置合せ爪にて接合ツールを位置決めする接合ツール位置決め工程を示す一部を断面とする側面図である。
【図９】この発明の実施の形態２の接合ツールと超音波振動伝搬体とが位置合わせされた状態を示す一部を断面とする側面図である。
【図１０】この発明の実施の形態２のすべり面に接合ツールが吸着される接合ツール吸着工程を示す一部を断面とする側面図である。
【図１１】この発明の実施の形態２の第１の電子部品を接合ツールの電子部品保持部に真空吸着するとともに第１の電子部品１の対向する１対の側面を挟み込んで保持する第１電子部品吸着工程と、第２の電子部品２を電子部品固定部に固定する第２電子部品固定工程とを示すとともに、第１の電子部品と第２の電子部品とが位置合わせされた状態を示す一部を断面とする側面図である。
【図１２】この発明の実施の形態２の突起電極と電極とを加圧するとともに接合ツールに超音波振動が伝搬された状態を示す一部を断面とする側面図である。
【図１３】この発明の実施の形態２の突起電極と電極との接合力が増加し接合ツールに対して超音波振動伝搬体がすべった状態を示す一部を断面とする側面図である。
【図１４】この発明の実施の形態２の超音波振動伝搬体を上方に移動させて第１の電子部品と接合ツールとを離間させた状態を示す一部を断面とする側面図である。
【図１５】この発明の実施の形態２の接合ツールを接合ツールステージに置く状態を示す一部を断面とする側面図である。
【図１６】この発明の実施の形態２の位置合せ爪にて接合ツールを位置決めする接合ツール位置決め工程を示す一部を断面とする側面図である。
【図１７】この発明の実施の形態３の第１の電子部品を接合ツールの電子部品保持部に真空吸着保持する第１電子部品吸着工程と、第２の電子部品２を電子部品固定部に固定する第２電子部品固定工程とを示すとともに、第１の電子部品と第２の電子部品とが位置合わせされた状態を示す一部を断面とする側面図である。
【図１８】この発明の実施の形態３の突起電極と電極とを加圧するとともに接合ツールに超音波振動が伝搬された状態を示す一部を断面とする側面図である。
【図１９】この発明の実施の形態３の突起電極と電極との接合力が増加し接合ツールに対して超音波振動伝搬体がすべった状態を示す一部を断面とする側面図である。
【図２０】この発明の実施の形態３の超音波振動伝搬体を上方に移動させて第１の電子部品と接合ツールとを離間させた状態を示す一部を断面とする側面図である。
【図２１】従来の電子部品の製造方法および製造装置を示し、特に第１の電子部品を真空吸着保持し、第２の電子部品を接合ステージに固定し、さらに両者が位置合わせされた状態を示す一部を断面とする側面図である。
【図２２】従来の電子部品の製造方法および製造装置を示し、特に突起電極が電極に加圧されるとともに超音波振動が伝搬された状態を示す一部を断面とする側面図である。
【図２３】従来の電子部品の製造方法および製造装置の別の例を示し、特に突起電極が電極に加圧されるとともに超音波振動が伝搬された状態を示す一部を断面とする側面図である。
【符号の説明】
１　第１の電子部品、２　第２の電子部品、２ｃ　電極、３　突起電極、４　接合ツール、４ａ　真空吸着穴（電子部品吸着手段）、４ｂ　電子部品保持部、４ｅ　接合ツール本体、４ｄ　スライド部、４ｆ　把持爪（電子部品把持手段）、６　接合ステージ、６ａ　電子部品固定部、８　超音波振動伝搬体、８ａ　真空吸着穴（電子部品吸着手段）、８ｂ　真空吸着穴（接合ツール吸着手段）、８ｃ　すべり面、９　接合ツールステージ、１０　位置合せ爪、１１　バネ（弾性体）。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method and an apparatus for mounting a flip chip for bonding a protruding electrode to an electrode while propagating ultrasonic vibration, and particularly to manufacturing an electronic component for bonding an electronic component with a stable bonding strength without damaging the electronic component. The present invention relates to an apparatus and an electronic component manufacturing method.
[0002]
[Prior art]
As a method of mounting an electronic component having a multi-terminal, narrow-pitch electrode, a flip-chip method, in which a projection electrode formed on an electrode of the electronic component is joined to the electrode while transmitting ultrasonic vibration to the electronic component, is often used. For example, it is described in "Development of flip chip mounting technology by ultrasonic vibration" (Hashimoto et al., 6th Symposium on Microjoining and Assembly Technology in Electronics in Electronics, 175-178, 2000).
[0003]
FIG. 21 and FIG. 22 are side views, partly in section, showing a conventional method and apparatus for manufacturing an electronic component. 21 and 22, reference numeral 1 denotes a first electronic component having a substantially rectangular flat plate shape, 1c denotes an electrode provided on a first surface 1a as a surface of the first electronic component 1, and 2 denotes a substantially rectangular flat plate shape. The second electronic component 2c is an electrode provided on the first surface 2a as a surface of the second electronic component 2, and 3 is a protruding electrode provided on the electrode 1c of the first electronic component 1. . The second surfaces 1b and 2b, which are the back surfaces of the first electronic component 1 and the second electronic component 2, are flat surfaces. Reference numeral 4 denotes a joining tool that sucks and holds the first electronic component 1 and propagates ultrasonic vibrations to the first electronic component 1, 4a denotes a vacuum suction hole provided in the joining tool 4, and 6 denotes The joining stages 5 and 5 are vacuum suction holes provided in the joining stage 6.
[0004]
FIG. 21 shows a state in which the first electronic component 1 is sucked by the vacuum suction hole 4a and held in the electronic component holding portion 4b of the joining tool 4 by vacuum suction, while the second electronic component 2 is sucked by the vacuum suction hole 5. The first surface 2a is fixed to the joining stage 6 with the outer surface facing outward, the protruding electrode 3 formed on the electrode 1c of the first electronic component 1, and the second electronic component held by the joining stage 6 by vacuum suction. It is a side view which has a part and which shows the state where 2 electrodes 2c were aligned.
[0005]
FIG. 22 shows a state where the protruding electrode 3 and the electrode 2c of the second electronic component 2 are pressurized, and the ultrasonic vibration is propagated to the first electronic component 1 by the joining tool 4 as shown by an arrow I. It is a side view which makes a part into a cross section.
After the projection electrode 3 of the first electronic component 1 is aligned with the electrode 2c of the second electronic component 2, the joining tool 4 moves in the Z-axis direction which is the direction of the second electronic component 2, and While pressing the electrode 3 against the electrode 2c with a predetermined pressing force, the joining tool 4 propagates the ultrasonic vibration to the first electronic component 1 as shown by the arrow I in the figure. The protruding electrode 3 and the electrode 2c are rubbed by a predetermined pressing force in the Z-axis direction and ultrasonic vibration on the XY plane orthogonal thereto, thereby removing dirt and film on the surface and solid-phase bonding the two.
[0006]
FIG. 23 shows another example of a conventional method and apparatus for manufacturing an electronic component, in which the projecting electrode 3 and the electrode 2c of the second electronic component 2 are pressurized, and the first electronic component 1 is joined to the first electronic component 1 by the joining tool 12. It is a side view which has a part which shows the state where the ultrasonic vibration was propagated as shown by arrow J. In FIG. 23, reference numeral 12 denotes an inner-surface pyramid-type joining tool in which a slope 12a is formed on each of four sides, and a concave-shaped electronic component holding portion is formed, the opening of which is widened downward in the figure. 12b is a vacuum suction hole provided in the joining tool 12. The joining tool 12 holds the first electronic component 1 in an inner-side pyramid-shaped electronic component holding portion having slopes 12 a on four sides, and propagates ultrasonic vibrations to the first electronic component 1. Other configurations are the same as those of the related art shown in FIGS. 21 and 22.
[0007]
[Problems to be solved by the invention]
In the prior art shown in FIGS. 21 and 22, when the bonding between the protruding electrode 3 and the electrode 2c progresses and the bonding force acting between them increases, a force to gradually stop the first electronic component 1 is applied. On the other hand, since the joining tool 4 continues to vibrate as it is, a forced reciprocating motion (position shift) occurs between the joining tool 4 and the back surface of the first electronic component 1, and the first electronic component 1 There was a problem that the back surface was rubbed and damaged.
[0008]
When a plurality of projections such as electrodes are formed on the second surface 1b of the first electronic component 1, only the tips of the projections come into contact with the electronic component holding surface of the joining tool 4, and the joining tool Since the contact area between the first electronic component 4 and the first electronic component 1 is reduced and slippage is likely to occur, there is a problem that ultrasonic vibration cannot be sufficiently transmitted to the protruding electrode 3 and an appropriate bonding strength is not performed. There was a problem that the joining tool 4 was worn by the projections and the life of the joining tool 4 was shortened.
[0009]
On the other hand, in the related art shown in FIG. 23, the slip between the joining tool 12 and the first electronic component 1 is improved. However, also in the prior art shown in FIG. 23, when the bonding between the protruding electrode 3 and the electrode 2c progresses and the bonding force increases, a large ultrasonic vibration continues to be propagated to the first electronic component 1, so that the bonding portion There was a problem that it was damaged.
[0010]
Further, when the number of electrodes is large and a large ultrasonic output is required, an excessive load is concentrated on a contact portion between the first electronic component 1 and the slope 12a of the pyramid-shaped joining tool 12 during joining, and the However, there is a problem that the electronic component 1 may be damaged, and there is a limitation in application to a fragile component such as a compound semiconductor.
[0011]
The present invention has been made to solve the above-described problems, and an electronic component manufacturing apparatus and an electronic component manufacturing method capable of joining a protruding electrode and an electrode in a stable state without damaging the electronic component. The purpose is to obtain.
[0012]
[Means for Solving the Problems]
An electronic component manufacturing apparatus according to the present invention includes: a joining stage for fixing a second electronic component having a plurality of electrodes formed on a first surface to an electronic component fixing portion with the first surface facing outward; An ultrasonic vibration propagator that is provided movably with respect to the bonding stage and propagates ultrasonic vibration to the first electronic component, and is movable in the same direction as the ultrasonic vibration direction to a vibration transmitting end of the ultrasonic vibration propagator. , An electronic component holding portion is formed on a surface opposite to the ultrasonic vibration propagation body, a plurality of protruding electrodes are formed on the first surface, and the first surface is opposed to the second electronic component. A bonding tool for holding the first electronic component disposed in the electronic component holding unit by suction by an electronic component suction unit provided in the electronic component holding unit; Position the projecting electrode of the component on the electrode of the second electronic component, and The ultrasonic vibration propagating body is vibrated while being pressed against the pole to propagate the ultrasonic vibration to the first electronic component, and when a predetermined bonding force is generated between the protruding electrode and the electrode, the bonding tool is ultrasonically driven. The first electronic component is connected to the second electronic component while sliding in the vibration direction.
[0013]
Further, the ultrasonic vibration propagating member adsorbs the joining tool to the slip surface provided at the vibration transmitting end by the joining tool adsorbing means and supports the joining tool so as to be movable in the same direction as the ultrasonic vibration direction.
[0014]
Further, the ultrasonic vibration propagation body supports the joining tool via an elastic body provided at the vibration transmission end so as to be movable in the same direction as the ultrasonic vibration direction.
[0015]
Further, the joining tool has electronic component gripping means for gripping at least two opposing sides of the first electronic component having a substantially rectangular shape. The electronic component is held in the electronic component holding unit.
[0016]
The ultrasonic vibration propagation body further includes a joining tool stage having an alignment claw for positioning the joining tool on a surface facing the ultrasonic vibration propagation body, and the ultrasonic vibration propagation body sucks the joining tool positioned by the welding tool stage. Adsorb to the slip surface by means.
[0017]
Also, in the electronic component manufacturing method according to the present invention, the ultrasonic vibration propagation body that propagates the ultrasonic vibration to the first electronic component, and the vibration transmission end of the ultrasonic vibration propagation body is moved in the same direction as the ultrasonic vibration direction. An electronic component holding portion is formed on the surface opposite to the ultrasonic vibration propagating member, and the first electronic component is held on the electronic component holding portion by electronic component suction means provided on the electronic component holding portion. An electronic component manufacturing method using an electronic component manufacturing apparatus having a joining tool and a joining stage provided with an electronic component fixing portion for fixing a second electronic component on a surface facing the electronic component holding portion, comprising: A second electronic component fixing step of fixing a second electronic component having a plurality of electrodes formed on one surface to an electronic component fixing portion with the first surface facing outward; The first electronic component on which the protruding electrodes are formed is A first electronic component adsorption step of adsorbing the electronic component holding portion so as to face the second electronic component, positioning the protruding electrode of the first electronic component on the electrode of the second electronic component, and pressing the protruding electrode against the electrode While propagating the ultrasonic vibration to the first electronic component by vibrating the ultrasonic vibration propagating body, the joining tool is moved in the ultrasonic vibration direction when a predetermined joining force is generated between the protruding electrode and the electrode. An electronic component connecting step of connecting the first electronic component to the second electronic component while sliding.
[0018]
In addition, the welding tool is sucked and supported on the slip surface provided on the vibration transmitting end by the welding tool sucking means provided on the ultrasonic vibration propagation body, and the welding tool is sucked onto the slip surface of the vibration transmitting end. The method further includes a step.
[0019]
Further, the method further includes a welding tool positioning step of positioning the welding tool at a predetermined position with respect to the ultrasonic vibration propagation body, and the welding tool suction step suctions the welding tool positioned in the welding tool positioning step to the slip surface.
[0020]
Further, in the first electronic component suction step, the first electronic component is suctioned to the electronic component holding portion while holding at least two opposing sides of the substantially rectangular first electronic component.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
Embodiment 1 FIG.
1 to 8 are side views showing a part of a cross section showing an electronic component manufacturing apparatus and an electronic component manufacturing method according to a first embodiment of the present invention. In FIG. 3, reference numeral 1 denotes a first electronic component having a substantially rectangular flat plate shape and a plurality of electrodes 1c formed on a first surface 1a on the lower side in the figure. Each electrode 1c of the first electronic component 1 is provided with a protruding electrode 3, which will be described in detail later. Reference numeral 2 denotes a second electronic component which has a substantially rectangular flat plate shape and has a plurality of electrodes 2c formed on an upper first surface 2a in the figure. The second electronic component 2 is fixed to the electronic component fixing portion 6a on the bonding stage 6 with the first surface 2a on which the electrode 2c is formed facing outward. A vacuum suction hole 5 for sucking the second electronic component 2 is provided in the electronic component fixing portion 6 a of the joining stage 6.
[0022]
In FIG. 1, reference numeral 8 denotes an ultrasonic vibration propagation body of an ultrasonic vibration propagation device (not shown). The ultrasonic vibration propagation body 8 is movable in the X-axis, Y-axis, and Z-axis directions with respect to the welding tool stage 9 and the welding stage 6, and transmits ultrasonic vibration to the first electronic component 1. Ultrasonic vibration with an amplitude of 1 μm on one side is performed. A flat sliding surface 8c is formed at the vibration transmission end at the lower end in FIG. 1 of the ultrasonic vibration propagation body 8. The ultrasonic vibration propagating member 8 has a vacuum suction hole 8a as a joining tool suction means for sucking the first electronic component 1 and a vacuum suction hole 8b as a joining tool suction means for sucking a joining tool 4 described later. It is provided penetrating in the direction.
[0023]
In FIG. 2, reference numeral 4 denotes a joining tool in which air is sucked and sucked by a vacuum suction hole 8b on a slip surface 8c of a vibration transmitting end of the ultrasonic vibration propagation body 8. An electronic component holding portion 4b for holding the first electronic component 1 is formed on a surface of the joining tool 4 opposite to a surface that is attracted to the ultrasonic vibration propagation body 8. The electronic component holding portion 4b has a concave shape in which the slope is formed on each of the four sides and the opening is widened downward in the drawing, that is, an inner surface pyramid shape. At the center of the joining tool 4, a vacuum suction hole 4a as an electronic component suction means for sucking air and sucking the first electronic component 1 by communicating with the vacuum suction hole 8a is formed.
In the present embodiment, the joining tool 4 is made of stainless steel. However, the joining tool 4 is not limited to stainless steel, and may be made of, for example, a ceramic material.
[0024]
In FIG. 2, reference numeral 9 denotes a joining tool stage for positioning the joining tool 4. An alignment claw 10 for positioning the welding tool 4 is provided on a surface of the welding tool stage 9 facing the ultrasonic vibration propagation body 8.
[0025]
FIG. 1 is a side view, partly in section, showing a state where the joining tool 4 on the joining tool stage 9 and the ultrasonic vibration propagation body 8 are aligned. In a series of steps, first, the welding tool 4 is positioned on the welding tool stage 9 with respect to the ultrasonic vibration propagation body 8 as described in detail later.
[0026]
FIG. 2 is a side view in partial section showing a joining tool suction step in which the joining tool 4 is sucked by the vacuum suction hole 8b on the slip surface 8c of the vibration transmitting end of the ultrasonic vibration propagation body 8. In the joining tool suction step, the joining tool 4 positioned on the joining tool stage 9 with respect to the ultrasonic vibration propagating member 8 moves the ultrasonic vibration propagating member 8 moved in the Z-axis direction, which is a downward direction in the drawing. The slide surface 8c is held by vacuum suction through a vacuum suction hole 8b.
[0027]
FIG. 3 shows a first electronic component suction step of sucking the first electronic component 1 through the vacuum suction hole 8a and holding the first electronic component 1 in the electronic component holding section 4b of the joining tool 4 by vacuum suction, and a first electronic component suction process. A second electronic component fixing step of fixing the electronic component fixing portion 6a with the surface 2a facing outward is shown, and a vacuum is applied to the projecting electrode 3 formed on the electrode 1c of the first electronic component 1 and the bonding stage 6. FIG. 4 is a side view showing a part of a cross section showing a state in which an electrode 2c of a second electronic component 2 held by suction is aligned.
[0028]
In the first electronic component suctioning step, the ultrasonic vibration propagating body 8 having the bonding tool 4 suctioned to the slip surface 8c of the vibration transmitting end moves to, for example, an XY plane that is horizontal with respect to the bonding stage 6, and is illustrated in FIG. The first electronic component 1 placed on a mounting table or the like that is not to be suctioned is sucked by the vacuum suction hole 8a and held in the electronic component holding portion 4b of the joining tool 4 by vacuum suction.
[0029]
In the second electronic component fixing step, the second electronic component 2 is mounted on the electronic component fixing unit 6a of the bonding stage 6 with the first surface 2a facing outward by an electronic component mounting device (not shown) or the like. Vacuum suction is performed by the vacuum suction hole 5 and fixed.
Thereafter, as shown in FIG. 3, the protruding electrode 3 formed on the electrode 1c of the first electronic component 1 is aligned with the electrode 2c of the second electronic component 2 held by vacuum on the bonding stage 6. You.
[0030]
In the present embodiment, a semiconductor element made of a silicon material is used as the first electronic component 1. However, the component applied as the first electronic component 1 is not limited to a semiconductor element made of a silicon material, and other semiconductors made of a combination of silicon-germanium, gallium arsenide, or indium phosphide are used. An element may be used. Further, a ceramic wiring substrate or a resin wiring substrate can also be applied.
[0031]
In the semiconductor element made of a silicon material used in the present embodiment, the tip of a gold wire having a diameter of 25 μm is melted and solidified to form a gold ball having a diameter of 75 μm. Was cut off by a predetermined length, thereby forming 12 gold projecting electrodes 3 having an average diameter of 97 μm. Here, the protruding electrode 3 is not limited to gold, and may be formed of, for example, copper, silver, a gold alloy, a copper alloy, or a silver alloy.
[0032]
Further, in the present embodiment, an alumina wiring substrate is used as the second electronic component 2. However, the present invention is not limited to the alumina wiring substrate, but may be a ceramic substrate or a resin substrate made of glass ceramics, aluminum nitride, or the like. Semiconductor elements made of silicon, germanium, gallium arsenic, indium phosphorus, or the like can also be applied.
[0033]
FIG. 4 is a side view showing a state in which the ultrasonic vibration is propagated to the joining tool 4 by the ultrasonic vibration propagation body 8 while pressing the protruding electrode 3 and the electrode 2 c of the second electronic component 2. FIG.
After the projection electrode 3 of the first electronic component 1 and the electrode 2c of the second electronic component 2 are aligned, the ultrasonic vibration propagating member 8 moves in the Z-axis direction and presses the projection electrode 3 with a predetermined pressing force. The ultrasonic vibration propagating body 8 propagates the ultrasonic vibration to the first electronic component 1 while pressing the electrode 2c with as shown in FIG. The projection electrode 3 and the electrode 2c are rubbed by a predetermined pressing force and ultrasonic vibration to remove dirt and film on the surface, and the two are solid-phase bonded.
[0034]
In the present embodiment, while the bonding stage 6 is heated to 150 ° C., a pressing force of 1200 gf is applied between the semiconductor element made of a silicon material as the first electronic component 1 and the alumina wiring substrate as the second electronic component 2. And ultrasonic vibration of 60 KHz was propagated at an amplitude of 1 μm on one side.
[0035]
FIG. 5 shows an electronic component connection step in which the joining between the projecting electrode 3 of the first electronic component 1 and the electrode 2c of the second electronic component has progressed, and the joining force between the projecting electrode 3 and the electrode 2c has increased. It is a side view which has a part which shows the state where the ultrasonic vibration propagation body 8 slipped to the joining tool 4 in the arrow B direction.
[0036]
In the electronic component connecting step, ultrasonic vibration is propagated while the protruding electrode 3 is pressed by the electrode 2c, and the protruding electrode 3 and the electrode 2c are solid-phase bonded by a predetermined pressing force and ultrasonic vibration. Then, when the bonding between the protruding electrode 3 and the electrode 2c progresses and the bonding force between the protruding electrode 3 and the electrode 2c increases to a predetermined size or more, the bonding tool 4 moves the ultrasonic vibration propagation body 8 It starts to slide against the slip surface 8c. In order to adjust the frictional resistance at which the protrusion electrode 3 and the electrode 2c start to slide with respect to the bonding force, the slip surface 8c and the smoothness of the contact surface of the welding tool 4 that comes into contact with the slip surface 8c are adjusted. The vacuum suction force of the vacuum suction hole 8b is adjusted by appropriately changing the vacuum suction force.
[0037]
In the present embodiment, the ultrasonic vibration of 60 KHz was propagated at an amplitude of 1 μm on one side for 0.3 seconds, and the gold protruding electrode 3 and the gold electrode 2c were joined with a shear breaking load of 70 gf / bump or more. At this time, when the joining between the protruding electrode 3 and the electrode 2c progresses and the joining force acting between the two increases to a predetermined value, the joining tool 4 starts sliding against the ultrasonic vibration propagation body 8, and the first The back surface of the electronic component 1 was not damaged. In order to set the frictional resistance between the welding tool 4 and the slip surface 8c to a predetermined value, the vacuum suction of the welding tool 4 by the vacuum suction holes 8b was stopped during the propagation of the ultrasonic vibration.
[0038]
On the other hand, when the same object, that is, a semiconductor element made of a silicon material is applied to the first electronic component 1 and an alumina wiring board is applied to the second electronic component 2 and bonded by the conventional method shown in FIG. When the vibration propagation time was 0.1 second or less, no damage occurred on the back surface of the first electronic component 1, but the minimum shear rupture load was 25 gf / bump, and a sufficient bonding force could not be obtained. Further, if the propagation time of the ultrasonic vibration is made longer than 0.1 second, the joining force increases accordingly. However, a displacement occurs between the first electronic component 1 and the joining tool 4 to cause the first electronic component to be displaced. The back of 1 was damaged.
[0039]
FIG. 6 shows that the vacuum suction of the vacuum suction hole 8a is stopped, the joining tool 4 is again vacuum-sucked and held in the vacuum suction hole 8b, and the ultrasonic vibration propagation body 8 is moved upward to join the first electronic component 1 and the joining tool. FIG. 4 is a side view showing a part of a cross section showing a state in which the device is separated from the device; FIG. 7 is a side view partially in section showing a state where the welding tool 4 is placed on the welding tool stage 9.
[0040]
When the joining between the protruding electrode 3 of the first electronic component 1 and the electrode 2c of the second electronic component is completed, the ultrasonic vibration propagation body 8 moves upward in the Z-axis away from the first electronic component 1, After that, the welding tool 4 moves in the XY plane toward the welding tool stage 9 and descends again to place the welding tool 4 at a predetermined position on the welding tool stage 9. Then, the vacuum suction of the vacuum suction hole 8 b is stopped and the ultrasonic vibration is propagated. The body 8 escapes upward.
[0041]
FIG. 8 is a side view partially in section showing a welding tool positioning step of pressing the welding tool 4 from both sides with the positioning claws 10 and moving the welding tool 4 to a predetermined position on the welding stage 9.
In the joining tool positioning step, the joining tool 4 placed at a predetermined position on the joining tool stage 9 is slid from four directions as indicated by an arrow C in the figure to a predetermined position by an alignment claw 10 pushing each surface of the joining tool 4. Is positioned at the position. Thereafter, the process returns to the state shown in FIG. 1, but the joining tool 4 is at a position accurately positioned with respect to the ultrasonic vibration propagation body 8, and in the joining tool suction step shown in FIG. 4 is accurately attracted to a predetermined position of the ultrasonic vibration propagation body 8.
[0042]
As described above, in the electronic component manufacturing apparatus and the electronic component manufacturing method according to the present embodiment, even when the bonding between the protruding electrode 3 and the electrode 2c progresses and the bonding force therebetween increases, the bonding tool 4 and the Since no displacement occurs between the back surface of the first electronic component 1 and the back surface of the first electronic component 1, the back surface of the first electronic component 1 is not damaged.
[0043]
Further, since a slip occurs between the welding tool 4 and the ultrasonic vibration propagating member 8, the bonding between the protruding electrode 3 and the electrode 2c further proceeds, and large ultrasonic vibration continues to be applied to the bonding portion between the two. However, the joint is not damaged.
[0044]
In order to reduce the frictional resistance between the welding tool 4 and the sliding surface 8c of the ultrasonic vibration propagation body 8 and facilitate slipping, a concave portion is provided on the back surface of the welding tool 4 to reduce the contact area with the sliding surface 8c. May be. Furthermore, the frictional resistance between the welding tool 4 and the ultrasonic vibration propagation body 8 may be reduced by blowing air from the vacuum suction hole 8b in reverse during the welding.
[0045]
Embodiment 2 FIG.
9 to 16 are side views, partly in section, showing an electronic component manufacturing apparatus and an electronic component manufacturing method according to Embodiment 2 of the present invention. 9 to 16, the same or corresponding parts as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. In the present embodiment, the joining tool 4 is different from the first embodiment. 9 to 16, reference numeral 4d denotes a sliding portion of the joining tool 4; 4c, a vacuum suction hole of the joining tool 4; 4f, a grasping claw as an electronic component grasping means provided on the joining tool 4; It is a vacuum suction hole of the body 8. Other configurations are substantially the same as those of the first embodiment.
[0046]
FIG. 9 is a side view showing a state in which the joining tool 4 and the ultrasonic vibration propagation body 8 on the joining tool stage 9 are aligned with each other with a part in section. The joining tool 4 includes a vacuum suction hole 4a for vacuum-sucking the first electronic component 1, and a slide portion 4d for sliding by changing the air pressure inside the vacuum suction hole 4c. The slide portion 4d is provided so as to be able to move forward and backward with respect to the welding tool body 4e. An elastic body (not shown) is contracted between the slide portion 4d and the joining tool main body 4e. By this elastic body, the slide portion 4d is normally urged away from the joining tool main body 4e. Then, the inside is decompressed by the vacuum suction hole 4c and moves in a direction approaching the joining tool main body 4e. Gripping claws 4f, 4f are provided on the joining tool body 4e and the slide portion 4d, respectively. The two gripping claws 4f, 4f move in a direction approaching each other to sandwich the first electronic component 1 therebetween.
In the present embodiment, the joining tool 4 is made of stainless steel, but is not limited to stainless steel, and for example, a ceramic material may be used.
[0047]
FIG. 10 is a side view in partial section showing a joining tool suction step in which the joining tool 4 is sucked by the vacuum suction hole 8b on the slip surface 8c of the vibration transmission end of the ultrasonic vibration propagation body 8. FIG. 11 shows that the first electronic component 1 is sucked by the vacuum suction hole 8a and vacuum-sucked to the electronic component holding portion 4b of the joining tool 4, and the vacuum portion 8d is vacuum-sucked to slide the slide portion 4d of the joining tool 4. A first electronic component suction step of sliding and holding a pair of opposed side surfaces of the first electronic component 1 therebetween, and fixing the second electronic component 2 with the first surface 2a facing outward; FIG. 4 shows a second electronic component fixing step of fixing to the portion 6 a, and shows a projection electrode 3 formed on the electrode 1 c of the first electronic component 1 and a second electronic component 2 held by vacuum suction on the bonding stage 6. It is a side view which makes a part which shows the state where the electrode 2c was aligned with a cross section.
[0048]
In the first electronic component suctioning step, the ultrasonic vibration propagating member 8 having the bonding tool 4 suctioned to the slip surface 8c of the vibration transmitting end moves in, for example, an XY plane that is horizontal with respect to the bonding stage 6, and The first electronic component 1 placed on a mounting table or the like (not shown) is suctioned by the vacuum suction hole 8a and held in the electronic component holding portion 4b of the joining tool 4 by vacuum suction. At this time, air is simultaneously sucked from the vacuum suction hole 8d to slide the slide portion 4d of the joining tool 4, and the pair of opposing side surfaces of the first electronic component 1 are sandwiched and held by the holding claws 4f, 4f.
[0049]
In the second electronic component fixing step, the second electronic component 2 is mounted on the electronic component fixing unit 6a of the joining stage 6 with the first surface 2a facing outward by an electronic component mounting device (not shown), and the vacuum It is sucked and fixed by the suction hole 5 in vacuum.
Then, as shown in FIG. 11, the protruding electrode 3 formed on the electrode 1c of the first electronic component 1 is aligned with the electrode 2c of the second electronic component 2 held by vacuum on the bonding stage 6. You.
[0050]
In the present embodiment, a gallium arsenide semiconductor element is used as the first electronic component 1. However, the component applied as the first electronic component 1 is not limited to a semiconductor element made of gallium arsenide material, but is a semiconductor made of silicon, a combination of silicon-germanium, or another semiconductor made of phosphide indium or the like. An element may be used. Further, a ceramic wiring substrate or a resin wiring substrate can also be applied.
[0051]
In the semiconductor element of the gallium arsenide material used in the present embodiment, the tip of a gold wire having a diameter of 25 μm is melted and solidified to form a gold ball having a diameter of 75 μm, and the gold ball is joined to an electrode. By cutting the gold wire by a predetermined length, 30 gold projecting electrodes 3 having an average diameter of 97 μm were formed. Here, the protruding electrode 3 is not limited to gold, and may be formed of, for example, copper, silver, a gold alloy, a copper alloy, or a silver alloy.
[0052]
Further, in the present embodiment, an alumina wiring substrate is used as the second electronic component 2. However, the present invention is not limited to the alumina wiring substrate, but may be a ceramic substrate or a resin substrate made of glass ceramics, aluminum nitride, or the like. Semiconductor elements made of silicon, germanium, gallium arsenic, indium phosphorus, or the like can also be applied.
[0053]
FIG. 12 shows a state in which the protruding electrode 3 and the electrode 2c of the second electronic component are pressurized, and a direction perpendicular to a pair of side surfaces sandwiched by the first electronic component 1 sandwiched between the joining tool 4 and the slide portion 4d. It is a side view which has a part which shows the state where the ultrasonic vibration was propagated as a cross section.
[0054]
After the projection electrode 3 of the first electronic component 1 and the electrode 2c of the second electronic component 2 are aligned, the ultrasonic vibration propagating member 8 moves in the Z-axis direction and presses the projection electrode 3 with a predetermined pressing force. The ultrasonic vibration propagating body 8 propagates the ultrasonic vibration to the first electronic component 1 while pressing the electrode 2c with as shown in FIG. The projection electrode 3 and the electrode 2c are rubbed by a predetermined pressing force and ultrasonic vibration, so that dirt and a film on the surface are removed and solid-phase bonding is performed.
[0055]
In the present embodiment, the two side surfaces perpendicular to the ultrasonic vibration direction are sandwiched by the joining tool 4, so that even when the number of the protruding electrodes 3 increases and a large ultrasonic output is required for the joining, the pyramid-shaped joining is performed. Excessive load concentration does not occur at the contact portion between the first electronic component 1 and the joining tool 4 like a tool, and even a fragile component like a compound semiconductor does not break.
[0056]
In the present embodiment, the semiconductor element of the gallium arsenide material as the first electronic component 1 and the alumina wiring substrate as the second electronic component 2 are heated to 2700 gf while the bonding stage 6 is heated to 150 ° C. Ultrasonic vibration of 60 KHz was propagated with an amplitude of 2 μm on one side while applying pressure with a pressing force.
[0057]
FIG. 13 shows an electronic component connection step in which the joining between the projecting electrode 3 of the first electronic component 1 and the electrode 2c of the second electronic component has progressed, and the joining force between the projecting electrode 3 and the electrode 2c has increased. It is a side view which has a part which shows the state where the ultrasonic vibration propagation body 8 slipped to the joining tool 4 in the arrow E direction.
In the electronic component connecting step, ultrasonic vibration is propagated while the protruding electrode 3 is pressed by the electrode 2c, and the protruding electrode 3 and the electrode 2c are solid-phase-connected by a predetermined pressing force and ultrasonic vibration. Then, when the bonding between the protruding electrode 3 and the electrode 2c progresses and the bonding force between the protruding electrode 3 and the electrode 2c increases to a predetermined size or more, the bonding tool 4 moves the ultrasonic vibration propagation body 8 It starts to slide against the slip surface 8c. In order to adjust the frictional resistance at which the protrusion electrode 3 and the electrode 2c start sliding with respect to the bonding force, the slip surface 8c and the smoothness of the contact surface of the welding tool 4 which comes into contact with the slip surface 8c are made appropriate. The vacuum suction force of the vacuum suction hole 8b is adjusted by appropriately changing the vacuum suction force.
[0058]
In the present embodiment, thirty projecting electrodes 3 are formed. However, as the number of projecting electrodes 3 increases, the joining force generated between projecting electrode 3 and electrode 2c increases. Therefore, slip may occur between the joining tool 4 and the slip surface 8c before the joining of the two is sufficiently advanced. If the welding tool 4 slides on the slip surface 8c before the welding is sufficiently advanced, a problem arises in that the ultrasonic vibration is not transmitted to the welding portion and the welding is not completely performed.
[0059]
Therefore, in the present embodiment, the joining tool 4 is kept in vacuum suction at the vacuum suction hole 8b for 0.1 second from the start of ultrasonic vibration propagation, and slip between the ultrasonic vibration propagation body 8 and the joining tool 4 is prevented. And proceeded with joining. Thereafter, the vacuum suction was stopped and ultrasonic vibration was further propagated for 0.4 seconds. As a result, the gold protruding electrode 3 and the 3 μm-thick gold electrode 2c of the alumina wiring board could be joined at a shear breaking load of 75 gf / bump or more without causing damage to the back surface of the element.
[0060]
In the present embodiment, the timing for stopping the vacuum suction is obtained by the propagation time of the ultrasonic vibration. This timing can be obtained by measuring the ultrasonic amplitude during bonding, the impedance of the ultrasonic transducer, the load, and the like. In other words, as the welding progresses, the amplitude of the ultrasonic wave gradually decreases, so the welding is performed while detecting this, and when the ultrasonic wave becomes smaller than a predetermined size, the vacuum suction is stopped or, conversely, the air is blown to join. The frictional resistance between the tool 4 and the ultrasonic vibration propagation body 8 may be reduced.
In addition, since the ultrasonic impedance gradually increases as the welding progresses, welding is performed while detecting the impedance, and when the size exceeds a predetermined value, the vacuum suction is stopped or conversely, air is blown to the welding tool. The frictional resistance between the ultrasonic vibration propagating member 4 and the ultrasonic vibration propagation body 8 may be reduced.
Furthermore, the load acting on the ultrasonic vibration propagation body 8 gradually increases as the welding proceeds, so that the same method can be used to control the timing.
[0061]
FIG. 14 shows that the vacuum suction of the vacuum suction hole 8a is stopped, the joining tool 4 is again vacuum-sucked and held in the vacuum suction hole 8b, and the ultrasonic vibration propagation body 8 is moved upward to connect the first electronic component 1 and the joining tool. FIG. 4 is a side view showing a part of a cross section showing a state in which the device is separated from the device; FIG. 15 is a side view, partly in section, showing a state where the welding tool 4 is placed on the welding tool stage 9.
[0062]
When the joining between the protruding electrode 3 of the first electronic component 1 and the electrode 2c of the second electronic component is completed, the ultrasonic vibration propagation body 8 moves upward in the Z-axis away from the first electronic component 1, Thereafter, the welding tool 4 is moved in the XY plane toward the welding tool stage 9, and is again lowered in the Z-axis direction to place the welding tool 4 at a predetermined position on the welding tool stage 9, and the vacuum suction of the vacuum suction hole 8 b is stopped. The ultrasonic vibration propagation body 8 escapes upward.
[0063]
FIG. 16 is a partial cross-sectional side view showing a joining tool positioning step of pressing the joining tool 4 from both sides with the alignment claws 10 and moving the joining tool 4 to a predetermined position on the joining stage 9.
In the joining tool positioning step, the joining tool 4 placed at a predetermined position on the joining tool stage 9 is slid from four directions as indicated by the arrow F in the drawing, and the positioning claw 10 pushing each surface of the joining tool 4 is used. It is positioned at a predetermined position. Thereafter, the process returns to the state shown in FIG. 9, but the joining tool 4 is located at a position positioned with respect to the ultrasonic vibration propagation body 8, and in the joining tool suction step shown in FIG. The ultrasonic vibration propagating member 8 is accurately attracted to a predetermined position.
[0064]
As described above, in the electronic component manufacturing apparatus and the electronic component manufacturing method according to the present embodiment, the joining tool 4 serves as an electronic component gripping unit that grips two opposing sides of the first electronic component 1 having a substantially rectangular flat plate shape. The first electronic component 1 is held by the electronic component holding portion 4b by being held by the holding claws 4f, 4f while being sucked by the vacuum suction holes 8a. For this reason, it is possible to further suppress the displacement that occurs between the joining tool 4 and the back surface of the first electronic component 1, and it is not necessary to prevent the back surface of the first electronic component 1 from being damaged.
[0065]
In this embodiment, the pressure of gas is used as the driving force for moving the gripping claws 4f, 4f. However, the same applies to the use of pressure by a liquid, electromagnetic force, or pressure by a spring, a piezoelectric element, or a screw. The effect is obtained. Although the two sides of the first electronic component 1 are sandwiched between them, the purpose of the electronic component gripping means is to prevent the first electronic component 1 from slipping between the joining tool 4 and the three or four sides. It is needless to say that the user may grasp the object.
[0066]
Embodiment 3 FIG.
17 to 20 are side views, partly in section, showing an electronic component manufacturing apparatus and an electronic component manufacturing method according to Embodiment 3 of the present invention. 17 to 20, the same or corresponding parts as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. 17 to 20, reference numeral 11 denotes a spring as an elastic body provided at the vibration transmitting end of the ultrasonic vibration propagation body 8 and supporting the joining tool 4 so as to be movable in the same direction as the ultrasonic vibration direction. The spring 11 presses the joining tool 4 from two directions between the ultrasonic vibration propagation body 8 and the joining tool 4 to dispose the joining tool 4 at a predetermined position. Other configurations are substantially the same as those of the first embodiment.
[0067]
FIG. 17 shows a first electronic component suction step in which the first electronic component 1 is sucked through the vacuum suction hole 8a and held in the electronic component holding portion 4b of the joining tool 4 by vacuum suction, and the second electronic component 2 is held in the first electronic component holding step. A second electronic component fixing step of fixing the electronic component fixing portion 6a with the surface 2a facing outward is shown, and a vacuum is applied to the projecting electrode 3 formed on the electrode 1c of the first electronic component 1 and the bonding stage 6. FIG. 4 is a side view showing a part of a cross section showing a state in which an electrode 2c of a second electronic component 2 held by suction is aligned.
[0068]
In the first electronic component suction step, the ultrasonic vibration propagating member 8 movably supporting the joining tool 4 at the vibration transmitting end is moved in the XY plane which is horizontal with respect to the joining stage 6, and is mounted on a not-shown mounting stage. The first electronic component 1 placed on the mounting table is sucked by the vacuum suction hole 8a and held by the electronic component holding portion 4b of the joining tool 4 by vacuum suction.
[0069]
In the second electronic component fixing step, the second electronic component 2 is mounted on the electronic component fixing unit 6a of the joining stage 6 with the first surface 2a facing outward by an electronic component mounting device (not shown), and the vacuum It is sucked and fixed by the suction hole 5 in vacuum.
Thereafter, as shown in FIG. 17, the protruding electrode 3 formed on the electrode 1c of the first electronic component 1 is aligned with the electrode 2c of the second electronic component 2 vacuum-held on the bonding stage 6. You.
[0070]
In the present embodiment, the joining tool 4 is made of stainless steel. However, the material is not limited to stainless steel, and may be made of, for example, a ceramic material. Further, a joining tool having means for gripping two opposing sides of the first electronic component 1 as in the second embodiment may be used.
[0071]
In the present embodiment, a gallium arsenide semiconductor element is used as the first electronic component 1. However, the component applied as the first electronic component 1 is not limited to a semiconductor element made of gallium arsenide material, but is a semiconductor made of silicon, a combination of silicon-germanium, or another semiconductor made of phosphide indium or the like. An element may be used. Further, a ceramic wiring substrate or a resin wiring substrate can also be applied.
[0072]
In the semiconductor element of the gallium arsenide material used in the present embodiment, the tip of a gold wire having a diameter of 25 μm is melted and solidified to form a gold ball having a diameter of 75 μm, and the gold ball is joined to an electrode. By cutting the gold wire to a predetermined length, eight gold projecting electrodes 3 having an average diameter of 97 μm were formed. Here, the protruding electrode 3 is not limited to gold, and may be formed of, for example, copper, silver, a gold alloy, a copper alloy, or a silver alloy.
[0073]
Further, in the present embodiment, an alumina wiring substrate is used as the second electronic component 2. However, the present invention is not limited to the alumina wiring substrate, but may be a ceramic substrate or a resin substrate made of glass ceramics, aluminum nitride, or the like. Semiconductor elements made of silicon, germanium, gallium arsenic, indium phosphorus, or the like can also be applied.
[0074]
FIG. 18 is a side view showing a state in which the ultrasonic vibration is propagated to the joining tool 4 by the ultrasonic vibration propagation body 8 while applying pressure to the protruding electrode 3 and the electrode 2 c of the second electronic component 2. FIG.
[0075]
After the projection electrode 3 of the first electronic component 1 and the electrode 2c of the second electronic component 2 are aligned, the ultrasonic vibration propagating member 8 moves in the Z-axis direction and presses the projection electrode 3 with a predetermined pressing force. The ultrasonic vibration propagating body 8 propagates the ultrasonic vibration to the first electronic component 1 while pressing the electrode 2c with as shown in FIG. The projection electrode 3 and the electrode 2c are rubbed by a predetermined pressing force and ultrasonic vibration, so that dirt and a film on the surface are removed and solid-phase bonding is performed.
[0076]
In the present embodiment, with the bonding stage 6 heated to 150 ° C., the gallium arsenide semiconductor device as the first electronic component 1 and the alumina wiring substrate as the second electronic component 2 are weighed 800 gf. Ultrasonic vibration of 60 KHz was propagated with an amplitude of 0.8 μm on one side while applying pressure with a pressing force.
[0077]
FIG. 19 shows an electronic component connection step in which the joining between the projecting electrode 3 of the first electronic component 1 and the electrode 2c of the second electronic component has progressed, and the joining force between the projecting electrode 3 and the electrode 2c has increased. It is a side view which has a part which shows the state where the ultrasonic vibration propagation body 8 slipped in the arrow H direction with respect to the joining tool 4.
[0078]
In the electronic component connecting step, ultrasonic vibration is propagated while the protruding electrode 3 is pressed by the electrode 2c, and the protruding electrode 3 and the electrode 2c are solid-phase-connected by a predetermined pressing force and ultrasonic vibration. Then, when the bonding between the protruding electrode 3 and the electrode 2c progresses and the bonding force between the protruding electrode 3 and the electrode 2c increases to a predetermined size or more, the bonding tool 4 moves the ultrasonic vibration propagation body 8 It starts to slide against the slip surface 8c. In order to adjust the frictional resistance at which slipping starts with respect to the joining force between the protruding electrode 3 and the electrode electrode 2c, the slip surface 8c and the smoothness of the contact surface of the joining tool 4 which comes into contact with the slip surface 8c are made appropriate. .
[0079]
In the present embodiment, with the bonding stage 6 heated to 150 ° C., the gallium arsenide semiconductor device as the first electronic component 1 and the alumina wiring substrate as the second electronic component 2 are weighed 800 gf. Ultrasonic vibration of 60 KHz was propagated with an amplitude of 0.8 μm on one side while applying pressure with a pressing force.
[0080]
FIG. 20 is a partially cutaway side view showing a state where the first electronic component 1 and the joining tool 4 are separated by stopping the vacuum suction of the vacuum suction hole 8a and moving the ultrasonic vibration propagation body 8 upward. FIG.
[0081]
As described above, in the electronic component manufacturing apparatus and the electronic component manufacturing method according to the present embodiment, the joining tool 4 is always provided at the vibration transmission end of the ultrasonic vibration propagation body 8 while being supported by the spring 11 as an elastic body. ing. Therefore, there is no need for a joining tool suction step of attracting the welding tool 4 to the ultrasonic vibration propagation body 8 or a joining tool positioning step of positioning the welding tool 4 with respect to the ultrasonic vibration propagation body 8, thereby reducing the processing time as a whole. Therefore, productivity can be improved and costs can be reduced.
In this embodiment, proper joining can be performed by selecting a spring 11 having an appropriate elastic force according to joining conditions.
[0082]
【The invention's effect】
An electronic component manufacturing apparatus according to the present invention includes: a joining stage for fixing a second electronic component having a plurality of electrodes formed on a first surface to an electronic component fixing portion with the first surface facing outward; An ultrasonic vibration propagator that is provided movably with respect to the bonding stage and propagates ultrasonic vibration to the first electronic component, and is movable in the same direction as the ultrasonic vibration direction to a vibration transmitting end of the ultrasonic vibration propagator. , An electronic component holding portion is formed on a surface opposite to the ultrasonic vibration propagation body, a plurality of protruding electrodes are formed on the first surface, and the first surface is opposed to the second electronic component. A bonding tool for holding the first electronic component disposed in the electronic component holding unit by suction by an electronic component suction unit provided in the electronic component holding unit; Position the projecting electrode of the component on the electrode of the second electronic component, and The ultrasonic vibration propagating body is vibrated while being pressed against the pole to propagate the ultrasonic vibration to the first electronic component, and when a predetermined bonding force is generated between the protruding electrode and the electrode, the bonding tool is ultrasonically driven. The first electronic component is connected to the second electronic component while sliding in the vibration direction. Therefore, during the joining of the first electronic component and the second electronic component, the first electronic component does not shift in position with respect to the joining tool. As a result, the first electronic component and the second electronic component can be joined in a stable state without damaging the first electronic component.
[0083]
Further, the ultrasonic vibration propagating member adsorbs the joining tool to the slip surface provided at the vibration transmitting end by the joining tool adsorbing means and supports the joining tool so as to be movable in the same direction as the ultrasonic vibration direction. Therefore, the joining tool can be attracted to the slip surface by using the same drive source as the electronic component attracting means, and the configuration can be simplified, so that the cost can be reduced.
[0084]
Further, the ultrasonic vibration propagation body supports the joining tool via an elastic body provided at the vibration transmission end so as to be movable in the same direction as the ultrasonic vibration direction. Therefore, when the force is no longer applied to the joining tool, the elastic body supports the joining tool at a predetermined position. Therefore, the operation of positioning the joining tool with respect to the ultrasonic vibration propagation body is performed by first joining the joining tool from the first electronic component. In this case, only an operation of separating the first and the second is sufficient, and the manufacturing time can be reduced, so that the cost can be reduced.
[0085]
Further, the joining tool has electronic component gripping means for gripping at least two opposing sides of the first electronic component having a substantially rectangular shape. The electronic component is held in the electronic component holding unit. Therefore, the first electronic component is stably held, and the first electronic component does not further displace with respect to the joining tool, and the first electronic component and the second electronic component are further stabilized. It can be joined in the state where it was done.
[0086]
The ultrasonic vibration propagation body further includes a joining tool stage having an alignment claw for positioning the joining tool on a surface facing the ultrasonic vibration propagation body, and the ultrasonic vibration propagation body sucks the joining tool positioned by the welding tool stage. Adsorb to the slip surface by means. Therefore, it is possible to position the joining tool which is separated from the ultrasonic vibration propagation body with a simple configuration, and it is possible to reduce the cost.
[0087]
Also, in the electronic component manufacturing method according to the present invention, the ultrasonic vibration propagation body that propagates the ultrasonic vibration to the first electronic component, and the vibration transmission end of the ultrasonic vibration propagation body is moved in the same direction as the ultrasonic vibration direction. An electronic component holding portion is formed on the surface opposite to the ultrasonic vibration propagating member, and the first electronic component is held on the electronic component holding portion by electronic component suction means provided on the electronic component holding portion. An electronic component manufacturing method using an electronic component manufacturing apparatus having a joining tool and a joining stage provided with an electronic component fixing portion for fixing a second electronic component on a surface facing the electronic component holding portion, comprising: A second electronic component fixing step of fixing a second electronic component having a plurality of electrodes formed on one surface to an electronic component fixing portion with the first surface facing outward; The first electronic component on which the protruding electrodes are formed is A first electronic component adsorption step of adsorbing the electronic component holding portion so as to face the second electronic component, positioning the protruding electrode of the first electronic component on the electrode of the second electronic component, and pressing the protruding electrode against the electrode While propagating the ultrasonic vibration to the first electronic component by vibrating the ultrasonic vibration propagating body, the joining tool is moved in the ultrasonic vibration direction when a predetermined joining force is generated between the protruding electrode and the electrode. An electronic component connecting step of connecting the first electronic component to the second electronic component while sliding. Therefore, in the electronic component connecting step, the first electronic component is not displaced with respect to the joining tool during the joining of the first electronic component and the second electronic component, and the first electronic component is damaged. The first electronic component and the second electronic component are joined in a stable state.
[0088]
In addition, the welding tool is sucked and supported on the slip surface provided on the vibration transmitting end by the welding tool sucking means provided on the ultrasonic vibration propagation body, and the welding tool is sucked onto the slip surface of the vibration transmitting end. The method further includes a step. Therefore, in the bonding tool suction step, the bonding tool is suctioned to the slip surface by the electronic component suction means of the same drive source as in the first electronic component suction step, so that the apparatus can have a simple configuration, thereby reducing costs. be able to.
[0089]
Further, the method further includes a welding tool positioning step of positioning the welding tool at a predetermined position with respect to the ultrasonic vibration propagation body, and the welding tool suction step suctions the welding tool positioned in the welding tool positioning step to the slip surface. Therefore, the joining tool that separates from the ultrasonic vibration propagation body can be positioned by a simple operation.
[0090]
Further, in the first electronic component suction step, the first electronic component is suctioned to the electronic component holding portion while holding at least two opposing sides of the substantially rectangular first electronic component. Therefore, in the electronic component connecting step, during the joining of the first electronic component and the second electronic component, the first electronic component is not further displaced with respect to the joining tool, and the first electronic component is further moved. No damage is caused, and the first electronic component and the second electronic component are joined in a more stable state.
[Brief description of the drawings]
FIG. 1 is a side view, partly in section, showing a state where a joining tool and an ultrasonic vibration propagation body according to Embodiment 1 of the present invention are aligned.
FIG. 2 is a side view partially in section showing a welding tool suction step in which the welding tool is suctioned to a slip surface according to the first embodiment of the present invention;
FIG. 3 is a first electronic component suction step of vacuum-holding the first electronic component in the electronic component holding portion of the joining tool according to the first embodiment of the present invention, and the second electronic component 2 is mounted on the electronic component fixing portion. FIG. 10 is a side view showing a second electronic component fixing step of fixing, and a partial cross section showing a state where the first electronic component and the second electronic component are aligned.
FIG. 4 is a side view, partly in section, showing a state where ultrasonic waves are propagated to the joining tool while pressing the protruding electrode and the electrode according to the first embodiment of the present invention.
FIG. 5 is a side view, partly in section, showing a state in which the bonding force between the protruding electrode and the electrode according to Embodiment 1 of the present invention has increased and the ultrasonic vibration propagation body has slipped against the bonding tool.
FIG. 6 is a side view, partly in section, showing a state in which the ultrasonic vibration propagation body according to the first embodiment of the present invention has been moved upward to separate the first electronic component from the joining tool.
FIG. 7 is a side view partially in section showing a state where the welding tool according to the first embodiment of the present invention is placed on the welding tool stage.
FIG. 8 is a side view partially in section showing a joining tool positioning step of positioning the joining tool with the positioning claw according to the first embodiment of the present invention;
FIG. 9 is a side view, partly in section, showing a state where the joining tool and the ultrasonic vibration propagation body according to Embodiment 2 of the present invention are aligned.
FIG. 10 is a side view partially in section showing a welding tool suction step in which a welding tool is sucked on a slip surface according to Embodiment 2 of the present invention;
FIG. 11 illustrates a first electronic component according to a second embodiment of the present invention, in which a first electronic component is vacuum-sucked to an electronic component holding portion of a joining tool, and a pair of opposing side surfaces of the first electronic component 1 are sandwiched and held. An electronic component adsorption process and a second electronic component fixing process of fixing the second electronic component 2 to the electronic component fixing portion are shown, and a state where the first electronic component and the second electronic component are aligned is shown. It is a side view which makes a part shown into a cross section.
FIG. 12 is a side view, partly in section, showing a state where ultrasonic waves are propagated to a joining tool while pressing a protruding electrode and an electrode according to the second embodiment of the present invention.
FIG. 13 is a side view, partly in section, showing a state in which the joining force between the projecting electrode and the electrode according to the second embodiment of the present invention has increased and the ultrasonic vibration propagation body has slipped against the joining tool.
FIG. 14 is a side view, partly in section, showing a state in which an ultrasonic vibration propagation body according to Embodiment 2 of the present invention has been moved upward to separate a first electronic component from a joining tool.
FIG. 15 is a partial cross-sectional side view showing a state where the welding tool according to Embodiment 2 of the present invention is placed on a welding tool stage.
FIG. 16 is a side view partially in section showing a joining tool positioning step of positioning the joining tool with the positioning claw according to the second embodiment of the present invention;
FIG. 17 is a diagram illustrating a first electronic component suction step in which the first electronic component according to the third embodiment of the present invention is vacuum-adsorbed and held in the electronic component holding unit of the joining tool; FIG. 10 is a side view showing a second electronic component fixing step of fixing, and a partial cross section showing a state where the first electronic component and the second electronic component are aligned.
FIG. 18 is a side view, partly in section, showing a state in which ultrasonic waves are propagated to a joining tool while pressing a protruding electrode and an electrode according to the third embodiment of the present invention.
FIG. 19 is a side view, partly in section, showing a state in which the joining force between the protruding electrode and the electrode is increased and the ultrasonic vibration propagation body slides against the joining tool according to the third embodiment of the present invention.
FIG. 20 is a side view, partly in section, showing a state where the ultrasonic vibration propagation body according to Embodiment 3 of the present invention has been moved upward to separate the first electronic component from the joining tool.
FIG. 21 shows a conventional method and apparatus for manufacturing an electronic component, particularly showing a state in which a first electronic component is held by vacuum suction, a second electronic component is fixed to a joining stage, and both are aligned. It is a side view which makes a part shown into a cross section.
FIG. 22 is a side view illustrating a conventional method and apparatus for manufacturing an electronic component, particularly showing a state in which a protruding electrode is pressed against the electrode and ultrasonic vibration is propagated, and a part thereof is shown in cross section.
FIG. 23 is a side view showing another example of a conventional method and apparatus for manufacturing an electronic component, particularly showing a state in which a protruding electrode is pressed against the electrode and ultrasonic vibration is propagated, and a part thereof is shown in cross section. It is.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 first electronic component, 2 second electronic component, 2 c electrode, 3 protruding electrode, 4 joining tool, 4 a vacuum suction hole (electronic component suction means), 4 b electronic component holding section, 4 e joining tool body, 4 d slide section , 4f gripping claw (electronic component gripping means), 6 joining stage, 6a electronic component fixing portion, 8 ultrasonic vibration propagation body, 8a vacuum suction hole (electronic component suction means), 8b vacuum suction hole (joining tool suction means), 8c sliding surface, 9 joining tool stage, 10 positioning claw, 11 spring (elastic body).

Claims (9)

第１の面に複数の電極が形成された第２の電子部品を、該第１の面を外方に向けて前記電子部品固定部に固定する接合ステージと、
前記接合ステージに対して移動可能に設けられ、第１の電子部品に超音波振動を伝搬する超音波振動伝搬体と、
前記超音波振動伝搬体の振動伝達端に超音波振動方向と同じ方向に移動可能に支持され、前記超音波振動伝搬体と反対側の面に電子部品保持部が形成され、第１の面に複数の突起電極が形成され該第１の面が前記第２の電子部品に対向するように前記電子部品保持部に配置された前記第１の電子部品を、該電子部品保持部に設けられた電子部品吸着手段により吸着して保持する接合ツールとを備え、前記超音波振動伝搬体は、前記第１の電子部品の前記突起電極を前記第２の電子部品の前記電極に位置決めし、前記突起電極を前記電極に押圧しながら前記超音波振動伝搬体を振動させて超音波振動を前記第１の電子部品に伝搬するとともに、前記突起電極と前記電極との間に所定の接合力が生じたときに前記接合ツールを超音波振動方向にすべらせながら前記第２の電子部品に前記第１の電子部品を接続する
ことを特徴とする電子部品製造装置。A joining stage for fixing a second electronic component having a plurality of electrodes formed on a first surface to the electronic component fixing portion with the first surface facing outward;
An ultrasonic vibration propagator that is provided movably with respect to the bonding stage and propagates ultrasonic vibration to the first electronic component;
The vibration transmitting end of the ultrasonic vibration propagation body is movably supported in the same direction as the ultrasonic vibration direction, an electronic component holding portion is formed on a surface opposite to the ultrasonic vibration propagation body, and a first surface is formed. The first electronic component, which is provided in the electronic component holding unit such that a plurality of protruding electrodes are formed and the first surface faces the second electronic component, is provided in the electronic component holding unit. A bonding tool that sucks and holds the electronic component by suction means, wherein the ultrasonic vibration propagation body positions the protruding electrode of the first electronic component on the electrode of the second electronic component, and The ultrasonic vibration propagating body is vibrated while pressing the electrode against the electrode to propagate the ultrasonic vibration to the first electronic component, and a predetermined bonding force is generated between the protruding electrode and the electrode. Sometimes the welding tool is moved in the ultrasonic vibration direction. Electronic component manufacturing apparatus characterized by connecting the first electronic component on the second electronic component with racemate. 前記超音波振動伝搬体は、接合ツール吸着手段によって前記振動伝達端に設けられたすべり面に前記接合ツールを吸着して超音波振動方向と同じ方向に移動可能に支持する
ことを特徴とする請求項１に記載の電子部品製造装置。The said ultrasonic vibration propagation body adsorb | sucks the said joining tool to the slip surface provided at the said vibration transmission end by the joining tool adsorption | suction means, and supports so that it can move in the same direction as an ultrasonic vibration direction. Item 2. The electronic component manufacturing apparatus according to Item 1. 前記超音波振動伝搬体は、前記振動伝達端に設けられた弾性体を介して前記接合ツールを超音波振動方向と同じ方向に移動可能に支持する
ことを特徴とする請求項１に記載の電子部品製造装置。2. The electronic device according to claim 1, wherein the ultrasonic vibration propagation body supports the joining tool movably in the same direction as the ultrasonic vibration direction via an elastic body provided at the vibration transmission end. 3. Parts manufacturing equipment. 前記接合ツールは、概略矩形の前記第１の電子部品の少なくとも対向する２辺を把持する電子部品把持手段を有し、前記電子部品吸着手段により吸着しながら前記電子部品把持手段によって把持して前記第１の電子部品を前記電子部品保持部に保持する
ことを特徴とする請求項１から３のいずれかに記載の電子部品製造装置。The joining tool has electronic component gripping means for gripping at least two opposing sides of the first electronic component having a substantially rectangular shape. The electronic component manufacturing apparatus according to claim 1, wherein the first electronic component is held by the electronic component holding unit. 前記超音波振動伝搬体に対向する対向面に前記接合ツールを位置決めする位置合せ爪を有する接合ツールステージをさらに備え、
前記超音波振動伝搬体は、前記接合ツールステージによって位置決めされた前記接合ツールを前記接合ツール吸着手段によって前記すべり面に吸着する
ことを特徴とする請求項１，２又は４のいずれかに記載の電子部品製造装置。Further comprising a joining tool stage having an alignment claw for positioning the joining tool on a facing surface facing the ultrasonic vibration propagation body,
5. The ultrasonic vibration propagation body according to claim 1, wherein the welding tool positioned by the welding tool stage is attracted to the slip surface by the welding tool suction means. 6. Electronic component manufacturing equipment. 第１の電子部品に超音波振動を伝搬する超音波振動伝搬体と、
前記超音波振動伝搬体の振動伝達端に超音波振動方向と同じ方向に移動可能に支持され、前記超音波振動伝搬体と反対側の面に電子部品保持部が形成され、該電子部品保持部に設けられた電子部品吸着手段により該電子部品保持部に第１の電子部品を保持する接合ツールと、
前記電子部品保持部に対向する面に第２の電子部品を固定する電子部品固定部が設けられた接合ステージと
を有する電子部品製造装置を使用する電子部品製造方法であって、
第１の面に複数の電極が形成された前記第２の電子部品を、該第１の面を外方に向けて前記電子部品固定部に固定する第２電子部品固定工程と、
第１の面に複数の突起電極が形成された前記第１の電子部品を、該第１の面が前記第２の電子部品に対向するように前記電子部品保持部に吸着する第１電子部品吸着工程と、
前記第１の電子部品の前記突起電極を前記第２の電子部品の前記電極に位置決めし、前記突起電極を前記電極に押圧しながら前記超音波振動伝搬体を振動させて超音波振動を前記第１の電子部品に伝搬するとともに、前記突起電極と前記電極との間に所定の接合力が生じたときに前記接合ツールを超音波振動方向にすべらせながら前記第２の電子部品に前記第１の電子部品を接続する電子部品接続工程と
を備えたことを特徴とする電子部品製造方法。An ultrasonic vibration propagation body that propagates ultrasonic vibration to the first electronic component;
The vibration transmitting end of the ultrasonic vibration propagation body is movably supported in the same direction as the ultrasonic vibration direction, and an electronic component holding portion is formed on a surface opposite to the ultrasonic vibration propagation body, and the electronic component holding portion A joining tool for holding the first electronic component in the electronic component holding portion by electronic component suction means provided in
An electronic component manufacturing method using an electronic component manufacturing apparatus including: a bonding stage provided with an electronic component fixing unit for fixing a second electronic component on a surface facing the electronic component holding unit;
A second electronic component fixing step of fixing the second electronic component having a plurality of electrodes formed on a first surface to the electronic component fixing portion with the first surface facing outward;
A first electronic component that adsorbs the first electronic component having a plurality of protruding electrodes formed on a first surface to the electronic component holding unit such that the first surface faces the second electronic component; An adsorption step;
Positioning the protruding electrode of the first electronic component on the electrode of the second electronic component, and vibrating the ultrasonic vibration propagating body while pressing the protruding electrode against the electrode to generate ultrasonic vibration The first electronic component and the second electronic component while sliding the bonding tool in the ultrasonic vibration direction when a predetermined bonding force is generated between the protruding electrode and the electrode. And an electronic component connecting step of connecting the electronic components. 前記接合ツールは前記超音波振動伝搬体に設けられた接合ツール吸着手段によって前記振動伝達端に設けられたすべり面に吸着されて支持され、前記接合ツールを前記振動伝達端の前記すべり面に吸着する接合ツール吸着工程をさらに備えた
ことを特徴とする請求項６に記載の電子部品製造方法。The joining tool is attracted and supported on a slip surface provided at the vibration transmitting end by a joining tool attracting means provided on the ultrasonic vibration propagation body, and the joining tool is attracted to the slip surface of the vibration transmitting end. The electronic component manufacturing method according to claim 6, further comprising a joining tool suction step of performing the bonding tool. 前記超音波振動伝搬体に対して前記接合ツールを所定の位置に位置決めする接合ツール位置決め工程をさらに備え、
前記接合ツール吸着工程は、前記接合ツール位置決め工程によって位置決めされた前記接合ツールを前記すべり面に吸着する
ことを特徴とする請求項７に記載の電子部品製造方法。Further comprising a welding tool positioning step of positioning the welding tool at a predetermined position with respect to the ultrasonic vibration propagation body,
The method according to claim 7, wherein in the joining tool suction step, the joining tool positioned in the joining tool positioning step is attracted to the slip surface. 前記第１電子部品吸着工程は、概略矩形の前記第１の電子部品の少なくとも対向する２辺を把持しながら前記第１の電子部品を前記電子部品保持部に吸着する
ことを特徴とする請求項６から８のいずれかに記載の電子部品製造方法。The first electronic component suctioning step, wherein the first electronic component is suctioned to the electronic component holding portion while holding at least two opposing sides of the substantially rectangular first electronic component. An electronic component manufacturing method according to any one of items 6 to 8.
JP2002202469A 2002-07-11 2002-07-11 Electronic component manufacturing apparatus and electronic component manufacturing method Expired - Fee Related JP3767812B2 (en)

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US7424966B2 (en) 2004-11-09 2008-09-16 Fujitsu Limited Method of ultrasonic mounting and ultrasonic mounting apparatus using the same
JP2006186325A (en) * 2004-12-02 2006-07-13 Seiko Instruments Inc Ultrasonic vibration bonding device
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