JP2003060339A - Method for mounting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the optimum mounting method of electronic components, while taking into consideration mounting environment requested of the respective electronic parts is considered in a case, when multiple types of electronic parts are mounted on a circuit board. SOLUTION: In the mounting method of the electronic components, two types of electronic components, the first electronic component and the second electronic component are mounted on the circuit board. The first electronic component is mounted on the circuit board by a collective reflow mounting method or a local reflow mounting method, and the second electronic component is mounted on the circuit board, by ultrasonic wave mounting method.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting electronic components on a circuit board, and more particularly to a method for mounting a plurality of types of electronic components on a circuit board by different mounting methods.

[0002]

2. Description of the Related Art Conventionally, various methods for mounting electronic parts have been known. As an example of a conventional electronic component mounting method, after temporarily bonding a plurality of electronic components on a circuit board and then collectively reflowing solder to mount the electronic components (hereinafter, referred to as a collective reflow mounting method) Alternatively, there is a method (hereinafter referred to as a local reflow mounting method) in which the electronic components are mounted by individually reflowing the solder by heating the electronic components while abutting them on the circuit board.

First of all, the collective reflow mounting method is a method in which an electronic component is sucked and held by a head tool and then the head tool is lowered to apply solder bumps formed on a plurality of electrodes of the electronic component to a plurality of electrodes of a circuit board. When a plurality of electronic components are mounted on the circuit board by pressing, electronic components are mounted repeatedly on the circuit board. This is a mounting method of an electronic component in which each solder bump of the electronic component is heated and melted, cooled and solidified to perform main bonding, and the electronic component is mounted on a circuit board.

The term "temporary joining" as used herein refers to joining in which the joining of the electronic component and the circuit board can be released without destroying the electronic component and the circuit board by applying an external force to the electronic component or the circuit board. The main joining is a joining performed by applying heat to the electronic component and the circuit board in the temporary joining state to melt and solidify the solder, and to apply an external force to the electronic component or the circuit board. Therefore, it is difficult to easily release the joined state.

In such a batch reflow mounting method, after a large number of electronic components are temporarily joined, the solder can be melted in a lump and the respective electronic components can be main joined and mounted on the circuit board. It is possible to provide an electronic component mounting method that suppresses the mounting cost of each electronic component on a circuit board when a large number of electronic components are mounted on the circuit board because the mounting work of can be efficiently performed. did it.

Next, the local reflow mounting method is a method in which an electronic component is sucked and held by a head tool, and then the head tool is lowered to apply solder bumps having a plurality of electrodes of the electronic component to a plurality of electrodes of a circuit board. This is a mounting method of electronic components in which the solder bumps are melted by heating while being in contact with each other, and are cooled and solidified to individually mount the electronic components on the circuit board.

In such a local reflow mounting method, an electronic component is attracted and held by a head tool, and each solder bump of the electronic component is heated by abutting the electrode on the circuit board by the head tool, and then the solder is melted. Since the suction and holding of the electronic components by the head tool is released during the state, the self-alignment effect due to the surface tension of the molten solder can be obtained. As a result, it is possible to provide a mounting method of an electronic component that can obtain a bonding position accuracy that does not result in defective bonding.

[0008]

In recent years, various kinds of electronic parts have been developed by technological development, and each electronic part has various characteristics, so that the mounting environment of each of these electronic parts is limited. Is starting to appear. For example,
An electronic component such as a SAW filter is likely to be defective due to the influence of heat, and further, as the performance of the electronic component is improved, mounting in an environment less affected by heat has been desired.

However, when a plurality of electronic components include an electronic component that becomes defective due to the influence of such heat, the electronic components that are defective as described above are collectively packaged on the circuit board together with other electronic components. When mounted by the reflow mounting method or the local reflow mounting method, the electronic circuit becomes defective due to the influence of heat during solder reflow, and therefore cannot be mounted on one circuit board together with other electronic components. There was a problem.

On the other hand, there is an ultrasonic mounting method as a mounting method for electronic components that does not affect the mounted electronic components by heat. This is because each electrode of the electronic component and each electrode of the circuit board is subjected to ultrasonic vibration on the surface of the bonding base material, that is, each electrode of the electronic component, each electrode of the circuit board, or each surface of the bonding material. Alternatively, it is a method of mounting an electronic component in which friction is caused on a contact surface between each of the electrodes and the bonding material and the friction heat is used for bonding. This mounting method is used when a bare chip is joined to a base body and the joined bare chip is sealed to manufacture a packaged electronic component such as a CSP.

However, an electronic component such as a SAW filter is bonded to a base body by an ultrasonic mounting method, and then the base body is mounted on the circuit board by a collective reflow mounting method or a local reflow mounting method. It is said that the electronic circuit to be formed has a limit in size reduction and weight reduction because it is mounted via the base body, and there is a limit in size reduction and weight reduction of an electronic device incorporating such an electronic circuit. There were also problems.

[0012] Therefore, an object of the present invention is to solve the above problems, and in the case where a plurality of types of electronic components are mounted on a circuit board, an ultrasonic mounting method, a collective reflow mounting method, or a local reflow mounting method. By performing the methods in combination, it is possible to provide an optimal electronic component mounting method while considering the mounting environment required for each electronic component.

[0013]

In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, the electrode of the first electronic component is brought into contact with the electrode of the circuit board with the bonding material interposed therebetween, and the bonding material is heated and melted to form the first electronic component. The electrode is mounted on the electrode of the circuit board with the bonding material interposed, and then the electrode of the second electronic component is bonded with the bonding material on the electrode of the circuit board on which the first electronic component is mounted. And contacting them, and applying ultrasonic vibration to the bonding material to mount the electrodes of the second electronic component on the electrodes of the circuit board with the bonding material interposed therebetween. Provide an implementation method of.

According to a second aspect of the present invention, in the electronic component mounting method for mounting two types of electronic components, a first electronic component and a second electronic component, on a circuit board, the first electronic component is a bonding material. Is an electronic component mounted on the circuit board by heating and melting the second electronic component is an electronic component mounted on the circuit board by applying ultrasonic vibration to the bonding material, The first electronic component is sucked and held by a component holding member, and the plurality of electrodes of the first electronic component and the plurality of electrodes of the circuit board are aligned so that they can be brought into contact with each other with the bonding material interposed therebetween, The component holding member is moved down while the first electronic component is suction-held,
While the electrodes of the electronic component and the electrodes of the circuit board are brought into contact with each other with the bonding material interposed therebetween, the bonding material is melted by heating and solidified, whereby the first
The electrodes of the electronic component and the electrodes of the circuit board are mounted with the bonding material interposed, and then the second electronic component is sucked and held by a component holding member, and the plurality of electrodes of the second electronic component are attached. And a plurality of electrodes of the circuit board are aligned so as to be able to come in contact with each other with the bonding material interposed, and the component holding member is lowered while sucking and holding the second electronic component, and the second electronic component After contacting each of the electrodes with each of the electrodes of the circuit board with the bonding material interposed therebetween, ultrasonic vibration is applied to the bonding material, whereby each electrode of the second electronic component and Provided is a method for mounting an electronic component, which comprises mounting the electrodes on a circuit board with the bonding material interposed.

According to the third aspect of the present invention, the electrode of the second electronic component is brought into contact with the electrode of the circuit board with the bonding material interposed therebetween, and ultrasonic vibration is applied to the bonding material to apply the second vibration. The electrode of the electronic component is mounted on the electrode of the circuit board with the bonding material interposed, and then the electrode of the first electronic component is bonded to the electrode of the circuit board on which the second electronic component is mounted. An electronic component, characterized in that the material is brought into contact with each other, the bonding material is heated and melted, and the electrode of the first electronic component is mounted on the electrode of the circuit board with the bonding material interposed. Provide an implementation method of.

According to a fourth aspect of the present invention, in the electronic component mounting method for mounting two types of electronic components, a first electronic component and a second electronic component, on a circuit board, the first electronic component is a bonding material. Is an electronic component mounted on the circuit board by heating and melting the second electronic component is an electronic component mounted on the circuit board by applying ultrasonic vibration to the bonding material, The second electronic component is sucked and held by a component holding member, and the plurality of electrodes of the second electronic component and the plurality of electrodes of the circuit board are aligned so that they can be brought into contact with each other with the bonding material interposed therebetween. The component holding member is lowered while the second electronic component is sucked and held,
After each electrode of the electronic component and each electrode of the circuit board are brought into contact with each other with the bonding material interposed therebetween, ultrasonic vibration is applied to the bonding material to thereby each electrode of the second electronic component. And the electrodes of the circuit board are mounted with the bonding material interposed, and then the first electronic component is suction-held by a component holding member, and the plurality of electrodes of the first electronic component and the plurality of circuit boards are attached. And the electrodes of the first electronic component are brought into contact with each other via the bonding material, and the component holding member is lowered while the first electronic component is suction-held, and the electrodes of the first electronic component and the While the electrodes of the circuit board are brought into contact with each other with the bonding material interposed therebetween, the bonding material is melted and solidified by heating, so that the electrodes of the first electronic component and the respective electrodes of the circuit board. The electrode with the bonding material Provides a method of mounting an electronic component, characterized by wear.

According to a fifth aspect of the present invention, in a method of mounting an electronic component, wherein two types of electronic components, a first electronic component and a second electronic component, are mounted on a circuit board, the first electronic component is a bonding material. Is an electronic component mounted on the circuit board by heating and melting the second electronic component is an electronic component mounted on the circuit board by applying ultrasonic vibration to the bonding material, The first electronic component is sucked and held by a component holding member, and the plurality of electrodes of the first electronic component and the plurality of electrodes of the circuit board are aligned so that they can be joined with the joining material interposed therebetween, While holding the first electronic component by suction, the component holding member is moved down to
The electrodes of the electronic component and the electrodes of the circuit board are pressed together by interposing the bonding material to perform temporary bonding, and then the electrodes of the first electronic component that are temporarily bonded and the circuit board. Of each of the above-mentioned bonding materials between each of the electrodes is heated and melted, cooled and solidified to perform main bonding, and each of the electrodes of the first electronic component and each of the electrodes of the circuit board are connected to each other. The second electronic component is attached by suction with a component holding member, and the plurality of electrodes of the second electronic component and the plurality of electrodes of the circuit board are interposed with the joining material interposed. Position so that they can come into contact with each other, and the component holding member is lowered with the second electronic component adsorbed and held, and the electrodes of the second electronic component and the electrodes of the circuit board are joined with the bonding material. After abutting with the interposition of By applying a dynamic, the second
Provided is a method for mounting an electronic component, which comprises mounting the electrodes of the electronic component and the electrodes of the circuit board with the bonding material interposed therebetween.

According to a sixth aspect of the present invention, the bonding material for mounting the electrodes of the first electronic component to the electrodes of the circuit board by interposing the bonding material is the same as that of the first electronic component. The bonding is pre-supplied on at least one of the electrodes or the electrodes of the circuit board, and the electrodes of the second electronic component are mounted on the electrodes of the circuit board by interposing the bonding. The material is the second
A method for mounting an electronic component according to any one of the first to fifth aspects, which is previously supplied to at least one of the electrodes of the electronic component or the electrodes of the circuit board. To do.

According to a seventh aspect of the present invention, there is provided a method for mounting an electronic component according to any one of the first to sixth aspects, wherein the joining material is solder.

According to an eighth aspect of the present invention, the flux is previously supplied to the electrodes of the first electronic component, the electrodes of the circuit board, or the bonding material. A method for mounting an electronic component according to any one of the seventh aspects is provided.

According to the ninth aspect of the present invention, the joining material for mounting the electrodes of the first electronic component to the electrodes of the circuit board by interposing the bonding material is the adhesive material of the first electronic component. The solder bumps formed on the electrodes, or the solder bumps formed on the electrodes of the first electronic component and the electrodes of the circuit board, and the solder bumps formed on the electrodes of the circuit board. Any one of the first to sixth aspects, wherein the bonding material for mounting the electrodes of the component to the electrodes of the circuit board is an Au bump formed on the electrodes of the second electronic component. Alternatively, a method of mounting the electronic component according to the eighth aspect is provided.

According to a tenth aspect of the present invention, the second electronic component is an IC chip component, and the first electronic component is an electronic component other than the IC chip component. A method for mounting an electronic component according to any one of the above is provided.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below in detail with reference to the drawings.

A method of mounting electronic components according to the first embodiment of the present invention will be described in detail with reference to the drawings.

As shown in FIG. 1, the electronic component mounting apparatus 10
1, a head tool 3 which is an example of a component holding member for mounting electronic components by a local reflow mounting method.
The ultrasonic tool 33, which is an example of a component holding member that mounts electronic components by the ultrasonic mounting method, is fixed to the nut portion of the X-direction moving mechanism 22.
A head tool 3 and an ultrasonic tool 33, which are respectively fixed to nuts screwed onto the ball screw shaft, are moved to the X1 direction to the right in the X direction or the X2 direction to the left by rotating the ball screw shaft by a motor. Let
Further, the electronic component mounting apparatus 101 includes an elevating unit 21 that is an example of an elevating mechanism that lowers or raises the head tool 3,
The ultrasonic tool 33 is configured to include an elevating unit 51 which is an example of an elevating mechanism for lowering or raising the ultrasonic tool 33. Further, the head tool 3 has a suction nozzle 11 that is an example of a suction holding mechanism that sucks and holds an electronic component at its tip, and a heating that heats the suction nozzle 11 to heat the electronic component suction-held by the suction nozzle 11. A ceramic heater 12 that is an example of a mechanism and a cooling blow nozzle 19 that is an example of a cooling mechanism that cools an electronic component heated by the ceramic heater 12 are provided. Further, the ultrasonic tool 22 has a suction nozzle 41 which is an example of a suction holding mechanism for sucking and holding an electronic component at its tip, and an ultrasonic vibration for applying ultrasonic vibration to the electronic component sucked and held by the suction nozzle 41. A section 42 is provided. Here, as an example, the heating mechanism is the ceramic heater 12 provided in the head tool 3. However, instead of the ceramic heater 12, a heating unit provided in a pedestal section on which a circuit board is arranged, or an electronic unit The electronic component mounting apparatus may include a heating unit that heats the components and the circuit board by blowing hot air.

In FIG. 1, the slide base 6 is fixed to a nut portion of a Y-direction moving mechanism 23, and the Y-direction moving mechanism 23 rotates a ball screw shaft by a motor, so that the nut screwed on the ball screw shaft. The slide base 6 fixed to the section is moved in the Y direction shown in the Y direction to the right or the Y2 direction to the left. Also, slide base 3
6 is fixed to the nut portion of the Y-direction moving mechanism 53,
The Y-direction moving mechanism 53 rotates the ball screw shaft by a motor to move the slide base 36 fixed to the nut portion screwed to the ball screw shaft in the Y1 direction or Y2 direction in the drawing.
Move in the direction. The X direction and the Y direction in FIG. 1 are orthogonal to each other.

A plurality of general-purpose electronic components such as a chip component, which is an example of the first electronic component, in which the electrodes of the electronic component and the electrodes of the circuit board are mounted by interposing the bonding component by heating and melting the bonding component. 1 is housed in a parts tray 5 fixed on a slide base 6 and arranged so as to be supplied, and a circuit board 4 is positioned and fixed on a stage 7 which is an example of a pedestal part fixed on the slide base 6. Has been done. Further, a plurality of IC chips 31 such as an IC chip component, which is an example of a second electronic component, in which the electrodes of the electronic component and the electrodes of the circuit board are mounted with the bonding material interposed by applying ultrasonic vibration to the bonding material. Are formed in a lattice on the wafer and are arranged so that they can be supplied to the IC chip supply unit 35.
The IC chip supply unit 35 is fixed on the slide base 36.

Further, a plurality of circuit boards 4 on which the electronic component 1 and the IC chip 31 are mounted are housed in the circuit board supply section 26 so that they can be supplied, and a moving operation is performed by suction holding the circuit board 4. The loader 27 makes it possible to take out the circuit board 4 from the circuit board supply unit 26 and supply the circuit board 4 to the stage 7, and further, to remove the circuit board 4 from the stage 7 of the circuit board 4 on which each electronic component is mounted. It is also possible to take out and eject the circuit board 4 to the circuit board ejecting section 28.

Further, the IC chip 31 arranged in the IC chip supply section 35 is arranged such that the surface having the respective electrodes is arranged on the upper surface, and the surface having the respective electrodes is adsorbed and held by the adsorption reversing section 25, and the IC chip The suction reversing unit 25 is rotated by the motor of the suction reversing unit 25 while the suction holding unit 31 is held, and the back surface of the IC chip 31, which is a surface without electrodes, is set as the upper surface. The back surface can be held by suction by the head tool 33.

Further, the electronic component mounting apparatus 101 is provided with a control section 9 which is a control section for controlling each component of the electronic component mounting apparatus 101, and the moving operation of the elevating section 21 and the elevating section 51 in the X direction. Moving operation of moving mechanism 22, moving operation of Y direction moving mechanism 23 and Y direction moving mechanism 53, suction holding operation of suction nozzle 11 of head tool 3 and suction nozzle 41 of ultrasonic tool 33, suction holding of suction reversing section 25 Operation and moving operation, heating operation of the ceramic heater 12 of the head tool 3, cooling operation of the cooling blow nozzle 19 of the head tool 3, ultrasonic vibration part 4 of the ultrasonic tool 33
The vibration operation 2 and the movement operation of the loader 27 are performed by the control unit 9
Is controlled by.

Next, in the electronic component mounting apparatus 101 having such a configuration, after mounting the general-purpose electronic component 1 on the circuit board 4 by the local reflow mounting method, the general-purpose electronic component 1 is mounted on the circuit board 4. The electronic component mounting method according to the first embodiment in which the IC chip 31 is mounted by the ultrasonic mounting method will be described in detail.

2 and 3 are cross-sectional views of the general-purpose electronic component 1, the IC chip 31, and the circuit board 4 schematically showing the mounting method of the electronic component in the first embodiment. As shown in FIG. 2B, the quadrangular plate-shaped general-purpose electronic component 1 has a large number of electrodes 1a on the bonding surface, and solder bumps 1b, which are an example of a bonding material, are previously formed on each electrode 1a. Has been done. In addition, as shown in FIG.
The rectangular plate-shaped IC chip 31 has a large number of electrodes 31a on the bonding surface, and Au bumps 31b, which are an example of a bonding material, are formed in advance on each of the electrodes 31a. Further, as shown in FIG. 2A, the rectangular plate-shaped circuit board 4 has pads 4a and 4b, which are a plurality of electrodes, on the upper surface, and each pad 4a is an electrode 1 of the general-purpose electronic component 1.
Each pad 4a of the circuit board 4 is arranged at a position corresponding to each electrode 1a of the general-purpose electronic component 1 so as to be able to contact a.
Each pad 4b of the circuit board 4 is arranged at a position corresponding to each electrode 31a of the IC chip 31 so that each pad 4b can come into contact with each electrode 31a of the IC chip 31.

Next, a method of mounting the general-purpose electronic component 1 and the IC chip 31 on the circuit board 4 using the electronic component mounting apparatus 101 will be described.

First, in FIG. 1, the loader 27 is moved above the circuit board supply unit 26 in which a plurality of circuit boards 4 can be supplied, and the loader 27 sucks and holds one circuit board 4. The circuit board 4 is taken out from the circuit board supply unit 26, the loader 27 is moved above the stage 7, the circuit board 4 is supplied to the stage 7, and the adsorption and holding of the circuit board 4 by the loader 27 is released to the stage 7. To fix.

Next, in FIG. 1, the slide base 6 to which the parts tray 5 on which a plurality of general-purpose electronic components 1 are arranged is fixed is moved in the Y1 or Y2 direction by the Y-direction moving mechanism 23, and X By the direction moving mechanism 22, the head tool 3 is moved in the X1 or X2 direction,
The head tool 3 is aligned with the general-purpose electronic component 1 so that the single general-purpose electronic component 1 arranged in the parts tray 5 can be sucked and held by the suction nozzle 11 at the tip of the head tool 3. I do. After that, the lifting unit 2
1, the head tool 3 is lowered, the suction nozzle 11 of the head tool 3 sucks and holds the back surface of the general-purpose electronic component 1 which is a surface without each electrode, and the elevating part 21 raises the head tool 3 to raise the parts tray. The general-purpose electronic component 1 is taken out from 5. Here, the case where the general-purpose electronic component 1 is arranged on the parts tray 5 with the back surface facing upward has been described. However, even when the general-purpose electronic component 1 is arranged with the back surface facing downward, the general-purpose electronic component 1 is arranged. By providing a reversing mechanism for reversing the general-purpose electronic component 1 before the suction-holding of the head tool 3 of No. 1 by the suction nozzle 11, the suction-holding of the back surface of the general-purpose electronic component 1 by the suction nozzle 11 is possible. .

Next, referring to FIG. 1, the slide base 6 fixing the stage 7 to which the circuit board 4 is fixed.
Is moved in the Y1 or Y2 direction by the Y-direction moving mechanism 23, and the head tool 3 holding the general-purpose electronic component 1 by suction is moved by the X-direction moving mechanism 22 in the X1 or X2 direction.
2B, so that the solder bumps 1b formed on the electrodes 1a of the general-purpose electronic component 1 can contact the pads 4a of the circuit board 4 as shown in FIG. The component 1 and the circuit board 4 are aligned.

After that, the head tool 3 is lowered by the elevating part 21, and the solder bumps 1b of the general-purpose electronic component 1 sucked and held by the suction nozzle 11 are connected to the pads 4a of the circuit board 4 fixed to the stage 7. Head tool 3
While contacting the adsorption nozzle 11 with the ceramic heater 12 of FIG. As a result, the suction nozzle 1
Each of the solder bumps 1b of the general-purpose electronic component 1 that is adsorbed and held by 1 is heated. Further, the heating temperature of the suction nozzle 11 by the ceramic heater 12 is raised to a temperature equal to or higher than the melting point of the solder forming each solder bump 1b, and each solder bump 1b is melted. After that, as shown in FIG. 2C, after the heating by the ceramic heater 12 is stopped,
The molten solder is cooled by blowing from the cooling blow nozzle 19. Instead of forcibly cooling the molten solder by the cooling blow nozzle 19, the molten solder may be naturally cooled to solidify the solder.

Before the molten solder is solidified by cooling, the suction holding of the head tool 3 to the general-purpose electronic component 1 by the suction nozzle 11 is released, and the head tool 3 is raised by the elevating part 21. After that, as shown in FIG. 2D, the solder is solidified, and the electrodes 1a of the general-purpose electronic component 1 and the pads 4a of the circuit board 4 are mounted with the solder interposed. When a plurality of general-purpose electronic components 1 are mounted on the circuit board 4, these operations are repeated for each general-purpose electronic component 1 and each general-purpose electronic component 1 is individually mounted on the circuit board 4.

In the above, the solder bumps 1b each having the bonding material previously formed on each electrode 1a of the general-purpose electronic component 1 are formed.
In the case where the bonding material is each solder bump 1b formed in advance on each electrode 1a of the general-purpose electronic component 1 and each solder portion formed in advance on each pad 4a of the circuit board 4, It may be.

Furthermore, on each electrode 1a of the general-purpose electronic component 1,
Alternatively, the wettability of the molten solder can be improved by removing the oxide film on the surface of each bonding portion on each pad 4a of the circuit board 4, each solder bump 1b as a bonding material, or each solder portion described above. The flux may be supplied by coating in advance. Depending on the type of flux applied and supplied, the general-purpose electronic component 1 may be mounted on the circuit board 4 and then the flux supplied and applied may be removed by cleaning.

Next, referring to FIG. 1, a plurality of IC chips 3
The slide base 36 to which the IC chip supply unit 35 in which 1 is arranged is fixed is moved by the Y-direction moving mechanism 53.
While moving in the Y1 or Y2 direction, the suction reversing unit 2
5 in the X1 or X2 direction to move the IC chip supply unit 3
The suction reversal unit 25 is aligned with the IC chip 31 so that one IC chip 31 in 5 can be suction-held by the tip of the suction reversal unit 25. After that, the suction reversal unit 25 is lowered, and the tip of the suction reversal unit 25 suction-holds the surface of the IC chip 31 having each electrode 31a, and then the suction reversal unit 25 is lifted and the IC chip supply unit 35 causes the IC The chip 31 is taken out.

After that, the suction reversing unit 25 is rotated by the motor of the suction reversing unit 25 to invert it so that the back surface of the IC chip 31 that is adsorbed and held by the suction reversing unit 25, which is a surface having no electrodes 31a, is removed. Make it the top surface. At the same time, the ultrasonic tool 33 is moved in the X1 or X2 direction by the X-direction moving mechanism 22, and the back surface of the IC chip 31 suction-held by the suction reversing unit 25 can be suction-held by the suction nozzle 41 of the ultrasonic tool 33. Align as you would. After that, the ultrasonic tool 33 is lowered by the elevating part 51, the IC chip 31 is suction-held by the suction nozzle 41, and the suction-holding to the IC chip 31 by the suction reversing part 25 is released.
Transfer from the suction reversal unit 25 of No. 1 to the ultrasonic tool 33.

Next, in FIG. 1, the slide base 6 which fixes the stage 7 to which the circuit board 4 on which the general-purpose electronic component 1 is mounted is fixed is moved in the Y1 or Y2 direction by the Y-direction moving mechanism 23. At the same time, the ultrasonic tool 33 holding the IC chip 31 by suction is moved in the X1 or X2 direction by the X-direction moving mechanism 22,
As shown in (e), the IC chip 31 and the circuit board 4 are aligned so that the Au bumps 31b formed on the electrodes 31a of the IC chip 31 can contact the pads 4b of the circuit board 4. I do.

After that, as shown in FIG. 3 (f), the ultrasonic tool 33 is lowered by the elevating part 51, and the suction nozzle 4
Each of the Au bumps 31b of the IC chip 31 suction-held on 1 is brought into contact with each pad 4b of the circuit board 4 fixed to the stage 7, and each of the IC chips 31 in contact with each other. Ultrasonic vibration is applied to the surface of the Au bump 31b and the surface of each pad 4b of the circuit board 4 by the ultrasonic vibrating section 42 of the ultrasonic tool 33 to cause friction on each of these contact surfaces. Due to the frictional heat generated by this friction, each Au bump 31b of the IC chip 31 is
And the pads 4b of the circuit board 4 are joined.

After that, as shown in FIG. 3G, the application of ultrasonic vibration by the ultrasonic vibrating section 42 of the ultrasonic tool 33 is stopped, and the suction holding of the IC chip 31 by the suction nozzle 41 is released. The ultrasonic tool 33 is operated by the elevating part 51.
And the IC chip 31 is mounted on the circuit board 4.

By the mounting method of electronic parts as described above,
The general-purpose electronic component 1 and the IC chip 31 will be mounted on the circuit board 4.

After that, the loader 27 is moved to above the stage 7, and the general-purpose electronic component 1 and the IC chip 3 are moved.
The circuit board 4 on which No. 1 is mounted is sucked and held by the loader 27, so that the circuit board 4 is taken out from the stage 7, the loader 27 is moved above the circuit board discharge unit 28, and the loader 27 moves the circuit board 4 to the circuit board 4. The suction holding is released, and the circuit board 4 is discharged to the circuit board discharge portion 28.

For each of the plurality of circuit boards 4, each circuit board 4
The above-described work is repeated every time, and the general-purpose electronic component 1 and the IC chip 31 are mounted on each circuit board 4.

In the above, the bonding material is each Au bump 3 formed in advance on each electrode 31a of the IC chip 31.
Although the case of 1b has been described, the bonding material may be another metal material including solder.

Although the circuit board 4 is a plate-shaped board in the above description, the circuit board 4 is a sheet-shaped film board instead of the plate-shaped board, and the film board is a roll-shaped board. The film substrate or the strip-shaped film substrate cut into individual pieces may be used. The same applies to each embodiment of the present invention described below.

According to the first embodiment, the electronic component mounting apparatus 101 is provided with the head tool 3 capable of carrying out the local reflow mounting method and the ultrasonic tool 33 capable of carrying out the ultrasonic mounting method. Since the general-purpose electronic component 1 is mounted on the circuit board 4 by the local reflow mounting method and then the IC chip 31 can be mounted by the ultrasonic mounting method, for example, the IC chip 31 is prevented from being affected by heat. In the case of an electronic component that is required to be processed, for example, an electronic component such as a SAW filter, the influence of heat due to solder melting heating during mounting of the general-purpose electronic component 1 can be given to the IC chip 31. IC chip 3 without being affected by heat
1 can be mounted on the circuit board 4.

Further, for example, in the case where flux is supplied to each solder bump 1b of the general-purpose electronic component 1 or each pad 4a of the circuit board 4, and the flux is removed after the general-purpose electronic component 1 is mounted. If you need
After mounting the general-purpose electronic component 1 on the circuit board 4 by the above-mentioned local reflow mounting method, the supplied flux is removed by flux cleaning, and then the IC chip 31 can be mounted by the ultrasonic mounting method. Therefore, during flux cleaning, it is necessary to consider the effect of the flux cleaning liquid on the IC chip 31 mounted by the ultrasonic mounting method, or the effect of reattachment of fine chips or the like washed off during the flux cleaning to the IC chip 31. Can be eliminated.

Therefore, when mounting electronic parts, it is necessary to consider the above influences on the IC chip 31,
For example, an electronic component that requires a heat-proof environment or waterproof environment at the time of mounting can be mixedly mounted on a circuit board together with general-purpose electronic components that are mounted by heating and melting solder by the ultrasonic mounting method. Becomes

The present invention is not limited to the above embodiment, but can be implemented in various other modes. For example, in the electronic component mounting method according to the second embodiment of the present invention, after mounting the IC chip 31 by the ultrasonic mounting method using the electronic component mounting apparatus 101 of the first embodiment, To the circuit board 4 on which the IC chip 31 is mounted,
The general-purpose electronic component 1 is mounted by the local reflow mounting method. In other words, the mounting method is the reverse of the mounting method of the electronic component according to the first embodiment. The IC chip 31 manufactured by the ultrasonic mounting method is used.
And the detailed procedure of the mounting procedure of the general-purpose electronic component 1 by the local reflow mounting method and the supply and discharge procedure of the circuit board 4 to the stage 7 are the same as the mounting method of the electronic component in the first embodiment. Therefore, the description is omitted.

According to the second embodiment, after the IC chip 31 is mounted on the circuit board 4 by the ultrasonic mounting method, the IC chip 31 is mounted on the circuit board 4.
Since the general-purpose electronic component 1 is mounted by the local reflow mounting method, it is possible to eliminate the need to consider the influence of the ultrasonic vibration generated during ultrasonic mounting on the joint between the general-purpose electronic component 1 and the circuit board 4. Therefore, it is necessary to consider the influence of the general-purpose electronic component on vibration, for example, the influence of destroying the joint portion by ultrasonic vibration or reducing the joint strength of the joint portion. In this case, it is possible to mix and mount together with the electronic component mounted by the ultrasonic mounting method on the circuit board.

Next, in the mounting method for electronic components according to the third embodiment of the present invention, first, the general-purpose electronic component 1 is mounted on the circuit board 4 by the collective reflow mounting method, and then the general-purpose electronic component 1 is mounted. The IC chip 31 is mounted on the mounted circuit board 4 by the ultrasonic mounting method. The mounting method of the electronic component according to the third embodiment will be described in detail.

FIG. 4 and FIG. 5 are cross-sectional views of the general-purpose electronic component 1, the IC chip 31, and the circuit board 64, which schematically show the mounting method of the electronic component in the third embodiment. The general-purpose electronic component 1 and the IC chip 31 are the same as the general-purpose electronic component 1 and the IC chip 31 in the electronic component mounting method of the first embodiment. Also, FIG.
As shown in (a), a rectangular plate-shaped circuit board 64
Has a plurality of pads 64a and 64b as electrodes on the upper surface, and each pad 64a is an electrode 1 of the general-purpose electronic component 1.
Each pad 64a of the circuit board 64 is arranged at a position corresponding to each electrode 1a of the general-purpose electronic component 1 so that it can be bonded to a, and each pad 64b can be bonded to each electrode 31a of the IC chip 31. The pads 64b of the circuit board 64 are arranged at positions corresponding to the electrodes 31a of the IC chip 31.

First, the back surface of the general-purpose electronic component 1 which is the surface without the electrodes 1a is adsorbed and held by the adsorption nozzle 71 at the tip of the head tool 63, and the solder bumps 1b of the general-purpose electronic component 1 are connected to the circuit board. The general-purpose electronic component 1 is aligned with the circuit board 64 so that it can be bonded to each pad 64a of 64.

After that, as shown in FIG. 4B, the head tool 63 holding the general-purpose electronic component 1 by suction is lowered, and the solder bumps 1b of the general-purpose electronic component 1 are connected to the circuit board 64.
The pads 64a are pressed to temporarily bond them. Circuit board 6
When mounting a plurality of general-purpose electronic components 1 on 4, the above-described work is repeated for each general-purpose electronic component 1, and each general-purpose electronic component 1 is temporarily joined to the circuit board 64. To do.

Next, as shown in FIG. 4C, the circuit board 64 to which each general-purpose electronic component 1 is temporarily joined is conveyed to the solder reflow working unit, and in the solder reflow working unit, each general-purpose electronic component 1 is transferred. The circuit board 64 is heated by the heat source, and the solder bumps 1b of the general-purpose electronic component 1 are melted. Thereafter, the heated general-purpose electronic components 1 and the circuit board 4 are cooled, and the solder bumps 1b of the melted general-purpose electronic components 1 are obtained.
Is solidified, and as shown in FIG. 4D, the electrodes 1a of the general-purpose electronic component 1 are permanently joined to the pads 64a of the circuit board 64 via the solder bumps 1b and mounted.

As described in the first embodiment, the solder bumps 1b in which the bonding material is formed in advance on the electrodes 1a of the general-purpose electronic component 1 and the pads 4 on the circuit board 4 are used.
It may be a case where each solder portion is formed in advance on a.

Furthermore, on each electrode 1a of the general-purpose electronic component 1,
Alternatively, the wettability of the molten solder can be improved by removing the oxide film on the surface of each bonding portion on each pad 4a of the circuit board 4, each solder bump 1b as a bonding material, or each solder portion described above. The flux may be supplied by coating in advance. Depending on the type of flux supplied and applied, the general-purpose electronic component 1 may be mounted on the circuit board 64 and then the flux supplied and supplied may be removed by cleaning.

Next, as shown in FIG. 5E, the back surface of the IC chip 31, which is a surface not having the electrodes 31a, is sucked and held by the suction nozzle 41 of the ultrasonic tool 33, and then the IC
Each Au bump 31b formed on each electrode 31a of the chip 31 has a circuit board 64 on which the general-purpose electronic component 1 is mounted.
Of the IC chip 31 so that the pads 64b of the
The circuit board 64 is aligned.

After that, as shown in FIG. 5F, the ultrasonic tool 33 is lowered so that the Au bumps 31b of the IC chip 31 suction-held by the suction nozzle 41 are brought into contact with the pads 64b of the circuit board 64. The Au bumps 31b of the IC chip 31 that are in contact with each other while contacting each other
Ultrasonic vibrations are applied to the surface of each of the pads and the surface of each pad 64b of the circuit board 64 by the ultrasonic vibration part 42 of the ultrasonic tool 33 to cause friction on each of these contact surfaces. The frictional heat generated by this friction bonds the Au bumps 31b of the IC chip 31 to the pads 64b of the circuit board 64.

Thereafter, as shown in FIG. 5G, the application of ultrasonic vibration by the ultrasonic vibrating portion 42 of the ultrasonic tool 33 is stopped, and the suction holding of the IC chip 31 by the suction nozzle 41 is released. Raise the ultrasonic tool 33, and
The chip 31 is mounted on the circuit board 64.

According to the electronic component mounting method as described above,
The general-purpose electronic component 1 and the IC chip 31 will be mounted on the circuit board 64.

According to the third embodiment, in addition to the effects of the first embodiment, when there are a large number of general-purpose electronic components 1 mounted on one circuit board 64, they can be collectively packaged. Since a large number of general-purpose electronic components 1 are temporarily joined to the circuit board 64 by the reflow mounting method, the solder can be melted in a lump so that the general-purpose electronic components 1 can be main-joined and mounted on the circuit board 64. The mounting cost of each general-purpose electronic component 1 on the circuit board 64 can be suppressed. Therefore, in addition to the effect of the first embodiment, while suppressing the mounting cost of the general-purpose electronic component mounted by heating and melting the solder, for example, an electronic device that requires a heatproof environment or a waterproof environment at the time of mounting By the ultrasonic mounting method, it becomes possible to mount the parts together with the general-purpose electronic parts on the circuit board.

By properly combining the arbitrary embodiments of the aforementioned various embodiments, the effects possessed by them can be produced.

[0070]

According to the first or second aspect of the present invention, there is provided an electronic component mounting method for mounting two types of electronic components, a first electronic component and a second electronic component, on a circuit board. The plurality of electrodes of the first electronic component and the plurality of electrodes of the circuit board are melted by heating while being in contact with each other with a bonding material interposed therebetween to be solidified, whereby the respective electrodes of the first electronic component and the circuit. After mounting the electrodes on the substrate with the bonding material interposed, that is, after mounting by the local reflow mounting method, the bonding materials are bonded to the plurality of electrodes of the second electronic component and the plurality of electrodes of the circuit board. By interposing and abutting and applying ultrasonic vibration to the bonding material, the electrodes of the second electronic component and the electrodes of the circuit board are mounted with the bonding material interposed, that is, For ultrasonic mounting method By implementing Ri, for example, electronic components, such as the second electronic component can be prevented the influence of heat is required during the mounting, for example, SAW
In the case of an electronic component such as a filter, the influence of the heat due to the solder melting heating at the time of mounting the first electronic component by the local reflow mounting method does not affect the second electronic component, and thus the influence of the heat is exerted. It is possible to mount the second electronic component on the circuit board without receiving it.

Further, for example, in the case where the flux is previously supplied to the electrodes of the first electronic component, the electrodes of the circuit board, or the bonding material, and the flux is supplied to the first electronic component. When the electronic component needs to be removed after mounting, the first electronic component is mounted on the circuit board by the above-mentioned local reflow mounting method, and then the supplied flux is removed by flux cleaning, and then the ultrasonic wave is removed. Since the second electronic component can be mounted by the mounting method, when cleaning the flux,
Eliminating the need to consider the effect of the flux cleaning liquid on the second electronic component mounted by the ultrasonic mounting method, or the effect of reattachment of fine debris or the like washed off during flux cleaning to the second electronic component. It becomes possible.

Therefore, when a plurality of types of electronic components are mounted on the circuit board, there is a need to consider the above influences on the second electronic component, such as a heatproof environment or a waterproof environment at the time of mounting. By the ultrasonic mounting method, it is possible to mount the required electronic component together with the first electronic component mounted by heating and melting the solder on the circuit board.

According to the third or fourth aspect of the present invention, in the electronic component mounting method for mounting two types of electronic components, a first electronic component and a second electronic component, on a circuit board,
After mounting the second electronic component on the circuit board by the ultrasonic mounting method described in the effect of the first aspect, the first electronic component is mounted by the local reflow mounting method in the effect of the first aspect. By mounting on the circuit board, when the ultrasonic mounting method is performed, other electronic components are not yet mounted on the circuit board. Therefore, the first vibration caused by the ultrasonic vibration generated during the ultrasonic mounting is performed. It is possible to eliminate the need to consider the influence on the joint portion between the electronic component and the circuit board. Therefore,
An electronic component in which the first electronic component needs to consider an influence on vibration, for example, an influence that the bonding portion is destroyed by ultrasonic vibration or the bonding strength of the bonding portion is reduced. In this case, the second electronic component mounted by the ultrasonic mounting method can be mixed and mounted on the circuit board.

According to the fifth aspect of the present invention, there is provided an electronic component mounting method for mounting two types of electronic components, a first electronic component and a second electronic component, on a circuit board. In addition to the effect of the aspect, when there are a large number of first electronic components mounted on one circuit board, the first electronic components are temporarily joined to the circuit board and then collectively heated. By melting the bonding material and permanently bonding and mounting the first electronic components on the circuit board, it is possible to suppress the mounting cost of the first electronic components on the circuit board. Therefore, in addition to the effect of the first aspect, while suppressing the mounting cost of the first electronic component mounted by heating and melting the solder, for example, a heatproof environment or a waterproof environment is required at the time of mounting. Na first Electronic components by the ultrasonic mounting process, it is possible to mount and mixed to the circuit board with the first electronic component.

According to the sixth to ninth aspects of the present invention, the joining material supply method, the joining material constituent material, or the flux supply method used in the conventional electronic component mounting method is applied. Therefore, it is possible to provide a mounting method of electronic components having general versatility.

According to the tenth aspect of the present invention, when the second electronic component is an IC chip component and the first electronic component is an electronic component other than the IC chip component, each of these electronic components is used. When the component is mounted on the circuit board according to each of the above aspects, the effects of each of the above aspects can be obtained.

[Brief description of drawings]

FIG. 1 is an overall perspective view of an electronic component mounting apparatus that carries out an electronic component mounting method according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a method of mounting the electronic component according to the first embodiment, in which (a) is a cross-sectional view of a circuit board;
(B) is a sectional view of the general-purpose electronic component and the circuit board in a state where the general-purpose electronic component is aligned with the circuit board, and (c) is a sectional view of the general-purpose electronic component and the circuit board in a state in which the melted solder is being cooled. , (D) are cross-sectional views of the circuit board in the state where general-purpose electronic components are mounted.

FIG. 3 is a diagram showing a mounting method of an electronic component according to the first embodiment, and FIG. 3 (e) is a cross-sectional view of a general-purpose electronic component, an IC chip and a circuit substrate in a state where an IC chip is aligned with a circuit substrate. , (F) is a cross-sectional view of a general-purpose electronic component, an IC chip and a circuit board when ultrasonic vibration is applied,
(G) is a cross-sectional view of a general-purpose electronic component, an IC chip and a circuit board in a state where an IC chip is mounted.

FIG. 4 is a diagram showing a method of mounting an electronic component according to a third embodiment of the present invention, in which (a) is a cross-sectional view of a circuit board;
(B) is a cross-sectional view of the general-purpose electronic component and the circuit board when the general-purpose electronic component is temporarily joined to the circuit board, (c) is a cross-sectional view of the general-purpose electronic component and the circuit board during collective reflow,
(D) is sectional drawing of the circuit board in the state by which the general purpose electronic component was mounted.

FIG. 5 is a diagram showing a mounting method of an electronic component according to the third embodiment, and FIG. 5 (e) is a cross-sectional view of a general-purpose electronic component, an IC chip and a circuit substrate in a state where an IC chip is aligned with a circuit substrate. , (F) is a cross-sectional view of a general-purpose electronic component, an IC chip and a circuit board when ultrasonic vibration is applied,
(G) is a cross-sectional view of a general-purpose electronic component, an IC chip and a circuit board in a state where an IC chip is mounted.

[Explanation of symbols]

1 ... General-purpose electronic component, 1a ... Electrode, 1b ... Solder bump, 3
... head tool, 4 ... circuit board, 4a ... pad, 4b ...
Pads, 5 ... Parts tray, 6 ... Slide base, 7 ...
Stage, 9 ... Control unit, 11 ... Adsorption nozzle, 12 ... Ceramic heater, 19 ... Cooling blow nozzle, 21 ... Lifting unit, 22 ... X-direction moving mechanism, 23 ... Y-direction moving mechanism, 2
5 ... adsorption reversal unit, 26 ... circuit board supply unit, 27 ... loader, 28 ... circuit board discharge unit, 31 ... IC chip, 31a
… Pads, 31b… Au bumps, 33… Ultrasonic tools,
35 ... IC chip supply unit, 36 ... Slide base, 41
... Suction nozzle, 42 ... Ultrasonic vibrating section, 51 ... Elevating section, 5
3 ... Y-direction moving mechanism, 63 ... Head tool, 64 ... Circuit board, 64a ... Pad, 64b ... Pad, 71 ... Suction nozzle, 101 ... Electronic component mounting apparatus.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Shozo Minatani             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Akira Yamada             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Takaharu Mae             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Mikiya Nakata             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F-term (reference) 5E319 AA03 AB05 BB04 CC11 CC33                       CC47 CC49 GG11                 5F044 LL01 LL15 PP15

Claims (10)

[Claims] 1. An electrode (1a) of a first electronic component (1) is brought into contact with an electrode (4a) of a circuit board (4) with a bonding material (1b) interposed therebetween, and the bonding material (1b) is attached. After heating and melting, the electrode (1a) of the first electronic component (1) is mounted on the electrode (4a) of the circuit board (4) with the bonding material (1b) interposed, and then the The electrode (4a) of the circuit board (4) on which the first electronic component (1) is mounted is brought into contact with the electrode (31a) of the second electronic component (31) with the bonding material (31b) interposed therebetween. By applying ultrasonic vibration to the bonding material (31b), the second
A method of mounting an electronic component, comprising mounting the electrode (31a) of the electronic component (31) on the electrode (4b) of the circuit board (4) with the bonding material (31b) interposed. 2. A first electronic component (1) and a second electronic component (3)
1) In the electronic component mounting method of mounting two types of electronic components on a circuit board (4), the first electronic component (1) heats and melts a bonding material (1b) to form the circuit board (4). ), The second electronic component (31) is an electronic component mounted on the circuit board (4) by applying ultrasonic vibration to the bonding material (31b). And a plurality of electrodes (1a) of the first electronic component (1) and a plurality of electrodes (4a) of the circuit board (4) that hold the first electronic component (1) by a component holding member (3). And the above bonding material (1
b) is interposed so that the first electronic component (1) can be contacted with the first electronic component (1), and the component holding member (3) is lowered while the first electronic component (1) is suction-held. While the electrodes (1a) and the electrodes (4a) of the circuit board (4) are in contact with each other with the bonding material (1b) interposed therebetween, the bonding material (1b) is melted by heating and solidified. As a result, the electrodes (1a) of the first electronic component (1) and the electrodes (4) of the circuit board (4) are
a) is mounted with the joining material (1b) interposed, and then the second electronic component (31) is attached to the component holding member (3).
3) Adsorbing and holding, and contacting the plurality of electrodes (31a) of the second electronic component (31) and the plurality of electrodes (4b) of the circuit board (4) with the bonding material (31b) interposed. The components are aligned as much as possible, the component holding member (33) is lowered while the second electronic component (31) is suction-held, and the electrodes (31a) and the circuit of the second electronic component (31) are arranged. The electrodes (4b) of the substrate (4) are brought into contact with each other with the bonding material (31b) interposed therebetween, and then ultrasonic vibration is applied to the bonding material (31b), whereby the second electronic component ( 31) Each of the electrodes (31a)
And a method for mounting an electronic component, wherein the electrodes (4b) of the circuit board (4) are mounted with the bonding material (31b) interposed therebetween. 3. The electrode (31a) of the second electronic component (31)
The bonding material (31b) on the electrode (4b) of the circuit board (4)
And abutting them, and applying ultrasonic vibrations to the bonding material (31b),
The electrode (31a) of the electronic component (31) is mounted on the electrode (4b) of the circuit board (4) with the bonding material (31b) interposed, and then the second electronic component (31) is attached. The electrode (4a) of the mounted circuit board (4) is brought into contact with the electrode (1a) of the first electronic component (1) with the bonding material (1b) interposed therebetween, and the bonding material (1b) is heated. An electron characterized by melting and mounting the electrode (1a) of the first electronic component (1) on the electrode (4a) of the circuit board (4) with the bonding material (1b) interposed. How to mount parts. 4. A first electronic component (1) and a second electronic component (3)
1) In the electronic component mounting method of mounting two types of electronic components on a circuit board (4), the first electronic component (1) heats and melts a bonding material (1b) to form the circuit board (4). ), The second electronic component (31) is an electronic component mounted on the circuit board (4) by applying ultrasonic vibration to the bonding material (31b). The second electronic component (31) is suction-held by a component holding member (33), and the plurality of electrodes (31a) of the second electronic component (31) and the plurality of electrodes (4b) of the circuit board (4). Are aligned so that they can come into contact with each other with the bonding material (31b) interposed therebetween, and the component holding member (33) is lowered while the second electronic component (31) is suction-held, and the second electronic component The electrodes (31a) of the component (31) and the circuit board The electrodes (4b) of the plate (4) are brought into contact with each other with the bonding material (31b) interposed therebetween, and then ultrasonic vibration is applied to the bonding material (31b), whereby the second electronic component ( 31) Each of the electrodes (31a)
And the electrodes (4b) of the circuit board (4) are mounted with the bonding material (31b) interposed therebetween, and then the first electronic component (1) is attached to the component holding member (3).
The plurality of electrodes (1a) of the first electronic component (1) and the plurality of electrodes (4a) of the circuit board (4) are adsorbed and held by the bonding material (1).
b) is interposed so that the first electronic component (1) can be contacted with the first electronic component (1), and the component holding member (3) is lowered while the first electronic component (1) is suction-held. While the electrodes (1a) and the electrodes (4a) of the circuit board (4) are in contact with each other with the bonding material (1b) interposed therebetween, the bonding material (1b) is melted by heating and solidified. As a result, the electrodes (1a) of the first electronic component (1) and the electrodes (4) of the circuit board (4) are
A method of mounting an electronic component, characterized in that (a) is mounted with the bonding material (1b) interposed therebetween. 5. A first electronic component (1) and a second electronic component (3)
1) In the electronic component mounting method for mounting two types of electronic components on a circuit board (64), the first electronic component (1) heats and melts the bonding material (1b) to form the circuit board (64). ), The second electronic component (31) is an electronic component mounted on the circuit board (64) by applying ultrasonic vibration to the bonding material (31b). A plurality of electrodes (1a) of the first electronic component (1) and a plurality of electrodes (64a) of the circuit board (64), the first electronic component (1) being sucked and held by a component holding member (63). Are aligned so that they can be joined with the joining material (1b) interposed, and the component holding member (63) is lowered while the first electronic component (1) is suction-held, and the first electronic component is (1) Each of the electrodes (1a) and the circuit board ( After each electrode (64a) of 4) is pressure-bonded by interposing the bonding material (1b) to perform temporary bonding, each electrode (1a) of the temporarily bonded first electronic component (1). And the electrodes (64) of the circuit board (64).
Each of the above-mentioned joining materials (1b) between a) is heated and melted,
By carrying out the main joining by cooling and solidifying,
The electrodes (1a) of the electronic component (1) and the electrodes (64a) of the circuit board (64) are connected to each other by the bonding material (1b).
Then, the second electronic component (31) is mounted on the component holding member (3).
3) Adsorbed and held by the second electronic component (31) and contacted with the plurality of electrodes (31a) of the second electronic component (31) and the plurality of electrodes (64b) of the circuit board (64) with the bonding material (31b) interposed therebetween. The components are aligned as much as possible, the component holding member (33) is lowered while the second electronic component (31) is suction-held, and the electrodes (31a) and the circuit of the second electronic component (31) are arranged. The electrodes (64b) of the substrate (64) are brought into contact with each other with the bonding material (31b) interposed therebetween, and then ultrasonic vibration is applied to the bonding material (31b), whereby the second electronic component ( 31) Each of the electrodes (31a)
And a method for mounting an electronic component, wherein the circuit board (64) is mounted on the electrodes (64b) of the circuit board (64) with the bonding material (31b) interposed therebetween. 6. The electrodes (1a) of the first electronic component (1) are connected to each other by interposing the circuit board (4, 6).
The bonding material (1b) attached to the electrodes (4a, 64a) of 4) is provided on the electrodes (1a) of the first electronic component (1) or on the circuit board (4, 64). The electrode (31a) of the second electronic component (31) is supplied to at least one of the electrodes (4a, 64a) in advance, and the electrodes (31a) of the second electronic component (31) are connected to the circuit board (4, 64). The bonding material (31b) attached to each electrode (4b, 64b)
Are the electrodes (31a) of the second electronic component (31).
The electrodes (4) above or on the circuit board (4, 64)
b, 64b), the electronic component mounting method according to any one of claims 1 to 5, which is previously supplied to at least one of them. 7. The mounting method for an electronic component according to claim 1, wherein the joining material (1b, 31b) is solder. 8. The electrode (1a) of the first electronic component (1), the electrode (4a, 64a) of the circuit board (4, 64), or the bonding material (1b). The electronic component mounting method according to claim 1, wherein the flux is supplied in advance. 9. The circuit board (4, 6) is provided with the electrodes (1a) of the first electronic component (1) by interposing them.
4) The bonding material (1b) to be attached to the electrodes (4a, 64a) of the solder bumps (1b) formed on the electrodes (1a) of the first electronic component (1), or Solder bumps (1b) formed on the electrodes (1a) of the first electronic component (1) and solder portions formed on the electrodes (4a, 64a) of the circuit board (4, 64), The bonding material (31b) for mounting the electrodes (31a) of the second electronic component (31) to the electrodes (4b, 64b) of the circuit board (4, 64) by interposing them.
Is the electrodes (31a) of the second electronic component (31)
9. The electronic component mounting method according to claim 1, wherein the electronic bump is an Au bump (31b) formed on the substrate. 10. The electronic device according to claim 1, wherein the second electronic component (31) is an IC chip component, and the first electronic component (1) is an electronic component other than the IC chip component. How to mount the described electronic components.