TWI435850B - Scribing device and scribing method - Google Patents

Description

Scribing device and scribing method

The present invention relates to a scribing device for scribing a brittle material panel substrate such as a panel substrate of an FPD (Flat Panel Display or flat panel display) represented by a liquid crystal display, and a scribing method using the scribing device.

A panel substrate for an FPD such as a liquid crystal display is usually formed by scribing a large mother substrate and simultaneously forming a plurality of individual single-chip display substrates. A scribing device used for scribing a panel substrate is disclosed, for example, in Patent Document 1 (JP-A-2002-20133).

A scribing device disclosed in the publication is shown in Fig. 7. The scribing device shown in FIG. 7 has a mounting table 81 for holding the panel substrate 70 to be formed with a scribe line in a horizontal state, and a plurality of scribing heads 82 respectively attached to the mounting table 81. The scribing wheel of the panel substrate 70 is scribed; and the bridge portion 83 is provided with a guide rail 83a that mounts the scribing heads 82 so as to be independently slidable.

The mounting table 81 of the panel substrate 70 is held in a horizontal state, and the panel substrate 70 is held in a horizontal state about the vertical axis, that is, in the θ direction shown in FIG. The bridge portion 83 is placed across the mounting table 81 and the guide rail 83a is placed horizontally above the mounting table 81. Each of the scribing heads 82 attached to the bridge portion 83 is slidable in the X direction of the longitudinal direction of the guide rail 83a by a linear motor mechanism. Further, the bridge portion 83 can slide in the Y direction orthogonal to the guide rail 83a.

A scribing wheel (cutter wheel) 82a capable of lifting and lowering is provided at a lower portion of each of the scribing heads 82. Each of the scribing wheels 82a is pressed against the panel substrate 70 held by the mounting table 81, and the predetermined portion of the panel substrate 70 is scribed by relatively moving the panel substrate 70. Thereby, a scribe line is formed on the panel substrate 70.

Further, in the scribing apparatus shown in FIG. 7, an image display device 85 or the like for displaying an image is provided which is photographed by the camera 84 and photographed by each of the cameras 84 by photographing one of the alignment marks provided on the panel substrate 70. The winner.

In the scribing device configured as described above, after the panel substrate 70 is held on the mounting table 81, the mounting table 81 is rotated in the θ direction based on the alignment marks photographed by the pair of cameras 84, and the panel substrate held on the mounting table 81 is held. 70 is positioned relative to the guide rail 83a of the bridge portion 83. Then, each of the scribing heads 82 is slid in the X direction so that the scribing wheel 82a of each scribing head 82 faces the predetermined Y-direction scribing start position of the panel substrate 70. When the scribing wheel 82a of each scribing head 82 faces the Y-direction starting position of the panel substrate 70, the scribing wheels 82a are lowered, and the Y-direction scribing start position of the panel substrate 70 is pressed. .

In this state, by moving the entire bridge portion 83 in the Y direction, the scribing wheel 82a of each scribing head 82 simultaneously forms a plurality of scribe lines in the Y direction.

As described above, by providing a plurality of scribing heads 82, for example, a plurality of scribing lines can be simultaneously formed in the Y direction. Therefore, the scribe line for disconnecting the plurality of panel substrates from the mother panel substrate can be efficiently implemented.

On the other hand, there is a tendency for FPD manufacturers to use larger-sized panel substrates as mother substrates, and this trend also requires an increase in the size of the mounting table of the scribing device. However, if the size of the mounting table is increased, it is more difficult to maintain the accuracy of the scribing position at both ends of the mother substrate by rotating the mounting table. That is, since the mechanism for rotating the mounting table by the motor around the rotating shaft is employed, there is a certain degree of mechanical limit in order to increase the decomposition energy of the rotating angle. Further, if the size of the mounting table is increased, the mounting table itself becomes heavy, and as a result, the rotating mechanism also needs to be large. For the above reasons, the mounting table for the scribing device for the large-sized mother substrate does not employ a machine design in which the rotating mechanism is mounted.

When the mounting table of the scribing device is not rotated, if the mother substrate is placed on the mounting table with a slight inclination, the scribing is performed, and even if the scribing device of FIG. 7 is mounted with only a single scribing head, the following problems occur. In other words, when the scribing head is moved in the X direction and the scribing is formed from the predetermined X position toward the Y direction, the scribing line also forms the amount of inclination of the mother substrate formed after the inclination.

In order to solve the above-mentioned problem, the method of linear interpolation disclosed in Patent Document 2 (Japanese Patent Publication No. 6-2597) or the like is used.

In the case of the scribing device of Fig. 7 in which a single scribing head is mounted, the relative positional relationship between the panel substrate 70 held on the mounting table 81 and the guide rail 83a of the bridge portion 83 is based on the alignment marks photographed by the pair of cameras 84. The calculation is performed in advance by image processing, and linear interpolation is performed based on the calculation result so that the scribing wheel 82a attached directly below the scribing head 82 moves in the Y direction of the panel substrate 70 (along a predetermined line along each scribe line). This linear interpolation is performed by moving only a predetermined small distance in the Y direction as a whole in the bridge portion 83, and moving each of the scribing wheels 82a by a predetermined small distance in the X direction.

Further, although the upper and lower sides of the FPD mother substrate are simultaneously scribed and separated from the upper and lower disconnecting means, the mother substrate is directly scribed by the substrate in the state of being transported by the substrate. Therefore, the linear interpolation method described above is employed.

(Patent Document 1) Japanese Patent Laid-Open Publication No. 2002-20133

(Patent Document 2) Japanese Special Fair 6-2597

In the scribing device shown in Fig. 7, a plurality of scribing heads 82 are placed. Therefore, at the start of the scribing, it is necessary to arrange the scribing wheel 82a attached to each scribing head to the position where the scribing wheel 82a is correctly positioned on the same straight line. However, since all the scribing heads 82 are attached to the bridge portion 83, when the panel substrate 70 and the bridge portion 83 are not aligned with each other and are placed at an angle, the scribing start positions cannot be aligned.

The present invention has been made to solve the above problems, and an object thereof is to provide a scribing means for accurately positioning each scribing means of a plurality of scribing heads at a predetermined scribing start position of a brittle material substrate such as a panel substrate. Device and scribing method. Another object of the present invention is to provide a scribing device and a scribing method capable of linearly interpolating linear scribing means for each of a plurality of scribing heads.

A scribing device according to the present invention includes: a substrate holding means for holding a brittle material substrate in a horizontal state; and a plurality of scribing heads each having a scribing line for the brittle material substrate held by the substrate holding means And the guide rail, the plurality of scribing heads are respectively held to be slidable in the X direction of the longitudinal direction; the brittle material substrate held by the substrate holding means and the guide rail are orthogonal to the X direction The Y direction is relatively moved, and each of the scribing heads has a sliding means for sliding the separately provided scribing means in the Y direction.

Preferably, the substrate holding means can transport the held brittle material substrate in the Y direction.

Preferably, the guide rail is disposed above the brittle material substrate held by the substrate holding means.

Preferably, the brittle material substrate is a single panel substrate.

Preferably, the guide rails are respectively disposed above and below the brittle material substrate held by the substrate holding means, and the plurality of scribing heads are respectively disposed on the respective guide rails.

Preferably, the brittle material substrate is a bonded panel substrate obtained by bonding a pair of panel substrates.

Preferably, any one of the scribing heads of the guide rail disposed above the brittle material substrate is provided with a roller that is pressed against the upper surface of the brittle material substrate.

Preferably, the scribing means is a scribing wheel.

Preferably, each of the scribing heads further has means for crimping the scribing wheel to the brittle material substrate.

Further, in the scribing method of the present invention, the brittle material substrate is scribed by the scribing device, and includes a step of positioning the brittle material substrate held by the substrate holding means to position the guide rail; and then, The scribing heads are moved along the guide rail in the X direction, and the scribing means of the scribing heads are moved in the Y direction, so that each scribing means is opposite to the scribing of the brittle material substrate. The steps of the location.

Preferably, the method further includes: pressing the respective scribing heads respectively facing the starting positions of the scribing lines to the starting positions of the scribing lines, and the brittle material substrate held by the substrate holding means; The guide rail moves relative to the Y direction.

Preferably, the method further includes: pressing the respective scribing heads respectively facing the starting positions of the scribing lines to the starting positions of the scribing lines, and moving the scribing heads along the guide rails in the X direction; The steps.

Preferably, each of the scribing heads is moved in the X direction along the guide rail, and the scribing means is moved in the Y direction to perform linear interpolation.

In the scribing device and the scribing method of the present invention, even if the guide rail (the plurality of scribing heads arranged in the longitudinal direction are held to be slidable in the longitudinal direction), the scribed line of the brittle material substrate is laid. In the case of being disposed in the oblique direction (the direction other than the parallel or the vertical direction), by means of a plurality of scribing heads, respectively, a sliding means for independently moving the scribing means in the Y direction is provided, so that the scribing means of each scribing head can be correctly Positioned at the starting position of each scribe line of the brittle material substrate. In other words, when a plurality of scribe lines in the Y direction are simultaneously formed by a plurality of scribe lines for the brittle material substrate, the start positions of the scribe lines of the scribe lines can be aligned in the X direction (straight to the predetermined line of the scribe line). ). Further, when the shard line in the X direction is broken by the scribe line in the X direction (or a plurality of scribe lines arranged on one line in the X direction) is simultaneously formed by a plurality of scribe lines, the scribe line means can be formed. The start position of the scribe line is neatly arranged in the X direction (the line on the scribe line). Therefore, the time required to cut the substrate from the brittle material substrate (mother substrate) in a long square shape can be shortened.

Embodiments of the present invention will be described below based on the drawings.

Fig. 1 is a perspective view showing a schematic configuration of a scribing device of the present invention, and Fig. 2 is a perspective view showing an enlarged main portion thereof. This scribing device is used, for example, to break the bonded panel substrate 90 used for the liquid crystal display panel to a predetermined size. The panel substrate 90 is bonded to each other with a pair of panel substrates interposed therebetween at a predetermined interval in order to fill the liquid crystal. As shown in FIG. 1, the scribing apparatus of the present invention includes a pair of substrate supporting mechanisms 10 for placing the bonded panel substrate 90 to be disconnected in a horizontal state, and a scribing unit 30 disposed on the two substrate supporting mechanisms. between.

Each of the substrate supporting mechanisms 10 transports the panel substrate 90 placed in a horizontal state in a horizontal state, and the scribing unit 30 disconnects the bonded panel substrate 90 held in a horizontal state by the two substrate supporting mechanisms.

In the pair of substrate supporting mechanisms 10, the laminated panel substrate 90 placed in a horizontal state by a plurality of belt conveyors 11 is horizontally oriented in a predetermined direction (orthogonal to the longitudinal direction of the scribe unit 30) Direction)).

Hereinafter, as shown in FIG. 1, the direction in which the panel substrate 90 is transported by the substrate supporting mechanism 10 is set to the Y direction, and the horizontal direction orthogonal to the Y direction (longitudinal direction of the scribe line unit 30) is referred to as the X direction. The upper and lower directions orthogonal to the Y direction and the X direction are set to the Z direction.

As shown in FIG. 2, the scribe line unit 30 disposed between the pair of substrate supporting mechanisms 10 has an upper rail 31 and a lower rail 32 in a direction orthogonal to the direction in which the panel supporting mechanism 10 is bonded to the panel substrate 90 ( The X direction) is configured in a horizontal state. The upper rail 31 and the lower rail 32 are integrally formed in a state of being vertically spaced apart from each other. The bonding panel substrate 90 that is transported in the +Y direction by the substrate supporting mechanism 10 passes through the gap between the upper rail 31 and the lower rail 32.

A pair of upper scribing heads 33 are provided on the upper rail 31 so as to be slidable along the upper rails 31, respectively. Each of the upper scribing heads 33 has an upper slider head 34 that slides in the X direction of the upper rail 31, respectively. Each of the upper slider heads 34 is slid in the X direction by a linear motor mechanism, and a slider 31a of a linear motor mechanism slidable along the upper rails 31 is provided on the upper rails 31, respectively. The connecting plates 31b are attached to the respective sliding members 31a in a vertical state, and the upper slider heads 34 are attached to the connecting plates 31b. A pair of upper scribing heads 33 can simultaneously form one parallel scribe line in the Y direction across the X direction with a predetermined interval on the upper surface of the panel substrate 90. Further, it is possible to simultaneously form a plurality of scribe lines on one line in the X direction (or divide one scribe line into two).

Further, a camera head 37 that slides along the upper rail 31 integrally with each of the upper slider heads 34 is attached to each of the connecting plates 31b. A camera for photographing the alignment marks provided on the bonded panel substrate 90 is provided in each of the camera heads 37, and the bonded panel substrate 90 is conveyed between the upper rail 31 and the lower rail 32, and each camera is photographed. An alignment mark is provided on the laminated panel substrate 90.

Further, an upper cutter head 35 and a roller head 36 are attached to the respective upper slider heads 34, respectively. The roller head portion 36 is a structure that replaces the scribing wheel of the tool head and has the same structure as the tool head except that a roller that does not form a scribe line even if pressed against the substrate is attached.

A pair of lower scribing heads 40 are provided on the lower rail 32 so as to be slidable in the X direction along the lower rails 32, respectively. A lower slider head 38 is provided for each of the lower scribing heads 40. Each of the lower slider heads 38 is attached to a slider (not shown) of a linear motor that is slidable along the longitudinal direction of the lower rail 32. A lower cutter head 39 is attached to each of the lower slider heads 38, respectively.

A pair of lower scribing heads 40 can simultaneously form one of the parallel scribe lines in the Y direction with a predetermined interval in the X direction on the lower surface of the bonded panel substrate 90. Further, it is possible to simultaneously form a plurality of scribe lines on one line in the X direction (or divide one scribe line into two).

Further, by the upper scribing head 33 and the lower scribing head 40, the scribing can be simultaneously formed on the upper surface and the lower surface of the bonding panel substrate 90. In this case, the cutter head 35 attached to the upper portion of the upper scribing head 33 and the cutter head portion 39 attached to the lower portion of the lower scribing head 40 are opposed to the mating panel substrate 90.

When the roller head portion 36 attached to the upper scribing head 33 is formed only on the lower surface of the bonding panel substrate 90, the bonding panel panel 90 and the lower cutter head 39 are pressed against each other to press the bonding panel. The state above the substrate is used. By using the roller head portion 36, the upper cutter head portion 35 and the lower cutter head 39 are opposed to each other through the bonding panel substrate 90, and the same manner is applied to the upper surface and the lower surface of the bonding panel substrate 90. Can form a line below.

3 is a perspective view of the upper slider head portion 34 disposed on one of the upper scribs 33 of the upper rail 31 (disposed on the -X direction side opposite to the +X direction shown in FIG. 1), and FIG. 4 is the upper portion. A front view of the slider head 34. The upper slider head portion 34 is disposed on the upper side block portion 34a and the lower block portion 34b in the vertical direction with an appropriate interval therebetween. The upper block portion 34a and the lower block portion 34b are attached to the slider mounted on the linear motor mechanism. The connecting plate 31b of the piece 31a. Sliding guides 34c extending in the horizontal direction in the Y direction are respectively provided on both sides in the X direction of the sliding direction of the upper block portion 34a, and slidable upper guiding blocks 34d are respectively provided in the respective sliding guides 34c. Sliding guides 34e extending in the horizontal direction in the Y direction are respectively provided on both sides in the X direction of the sliding direction of the lower block portion 34b, and slidable lower guiding blocks 34f are respectively provided in the respective sliding guides 34e.

The upper guide block 34d and the lower side guide block 34f are disposed on both sides of the upper slider head portion 34, and the mounting plate 34g is assembled in a vertical state. Further, the upper cutter head 35 (see FIG. 2) is attached to the attachment plate 34g disposed on the opposite side (the +X direction side of FIG. 2) of the upper slider head 34. The roller head 36 (see FIG. 2) is attached to the mounting plate 34g disposed on the far side of the other slider head 34 (the X-direction side opposite to the +X direction side of FIG. 2).

Between the upper block portion 34a and the lower block portion 34b, the ball screw 34h is disposed in a horizontal state in the Y direction, and the ball screw 34h is screwed to the slide block 34i which is integrated with each of the mounting plates 34g. The slide block 34i integrally attached to each of the attachment plates 34g slides in the Y direction by the forward rotation and the reverse rotation of the ball screw 34h, and follows the sliding of the slide block 34i in the Y direction to slide the attachment plates 34g. Thereby, the upper cutter head 35 and the roller head 36 attached to the upper portions of the respective attachment plates 34g are integrally slid in the Y direction.

A servo motor 34m is provided above the upper block portion 34a. The rotation shaft of the servo motor 34m extends horizontally in a direction opposite to the +Y direction (-Y direction) shown in FIG. 2, and the timing pulley 34n is integrally attached to the front end portion thereof, and is disposed under the timing pulley 34n and mounted on the ball screw. Timing pulley 34p on the driven side of the end before 34h. Further, the fixed belt 34q is wound around the timing pulleys 34n and 34p so as to be rotatable.

The servo motor 34m can rotate forward and reverse, and the servo motor 34m rotates, and the timing belt pulley 34n is transmitted from the upper timing pulley 34n to the lower timing pulley 34p by the fixed belt 34q so as to be integrally attached to the lower timing pulley 34p. The ball screw 34h rotates. Further, by rotating the ball screw 34h, the slider 34i is slid in the Y direction, and each of the attachment plates 34g attached to the slider 34i slides in the Y direction. Thereby, the cutter head 35 and the roller head 36 provided on the upper portions of the respective attachment plates 34g are slid in the Y direction.

FIG. 5 is a perspective view of the upper cutter head 35. In the upper cutter head 35, a servo motor 35a is attached to an upper portion of a mounting plate 34g provided on one of the slider heads 34. The servo motor 35a is attached to the mounting plate 34g in an inverted state (extending the rotating shaft in a vertical state toward the lower side). The cylindrical cam 35b is mounted to rotate integrally with the rotating shaft on the rotating shaft of the servo motor 35a. Below the cylindrical cam 35b, a cam surface 35c that is inclined to the horizontal state is formed.

Further, the upper cutter head 35 has a linear bearing 35k provided at a lower portion of the attachment plate 34g, and the linear bearing 35k holds the holder member 35n slidable in the vertical direction holder. At the lower end portion of the holder member 35n, the cutter member 35m for forming the scribe line on the bonded panel substrate 90 is held. A scribing wheel 35p is provided at the lower end of the cutter member 35m. The holder member 35n holds the cutter member 35m provided at the lower end portion of the scribing wheel 35p so as to be rotatable about the vertical axis. A coil spring 35s is provided between the holder member 35n and the attachment plate 34g as an elastic body for biasing the holder member 35n toward the attachment plate 34g.

Further, the cutter member 35m having the scribing wheel 35p at the lower end portion can be detached from the holder member 35n. For example, as disclosed in WO2007/063979, the cutter member 35m can also constitute a magnet for the holder member 35n. Easy to install and disassemble. Further, the scribing wheel 35p may be a cutter wheel disclosed in Japanese Patent No. 3074143, a scribing wheel disclosed in WO2007/063979, or the like.

On the upper portion of the holder member 35n, the cam follower 35d that abuts against the cam surface 35c of the cylindrical cam 35b is integrally provided with the holder member 35n. The cam follower wheel 35d is formed in a rotatable roller shape, and is pressed against the cam surface 35c by biasing the holder member 35n upward by the coil spring 35s.

In the other mounting plate 34g of the upper slider head 34, as shown in FIG. 2, although the roller head 36 is provided, the roller head 36 is attached to the upper cutter head 35 (the holder member 35n holds the cutter member 35m). In the configuration, only the holding member 35n holds the structure of the roller member, and the other configuration is the same as that of the upper cutter head 35. For example, when the scribe line is formed only on the lower surface of the panel substrate, the roller member applies pressure to the upper surface of the panel substrate so as to face the lower cutter head 39 through the panel substrate.

As shown in FIG. 2, a lower slider head 38 is provided for each of the lower scribing heads 40 slidable along the lower rail 32. Each of the lower slider heads 38 has the same configuration as the upper slider head 34 except that the upper slider head 34 is opposed to the vertical direction.

Further, in each of the lower slider heads 38, only the lower cutter heads 39 are attached to the respective outer sides (to the far side of the other lower slider head 38). Each of the lower cutter heads 39 is configured similarly to the upper cutter head 35 except for the up-and-down direction.

The sliding of each upper slider head 34 and each lower slider head 38 of the linear motor mechanism, the servo motor 34m of each upper slider head 34, and the servo motor of each lower slider head 38, and the upper cutter head 35 The control of the servo motor 35m, the drive of the servo motor of each of the roller heads 36 and the lower cutter heads 39, and the driving of the substrate holding mechanism are performed by an arithmetic control unit (not shown).

The operation of scribing the bonded panel substrate by the scribing device of the present invention configured as described above will be described. In the following, as shown in FIGS. 6(a) and 6(b), a scribing method in which eight sheets of the laminated panel substrate 90 are separated from each other and the laminated panel substrate 91 is disconnected is described. . As shown in Fig. 6 (a), the laminated panel substrate 90 is cut into four pieces along the longitudinal direction (Y direction) of the bonded panel substrate 90, and two pieces are separated in the width direction (X direction). The laminated panel substrate 91 is broken. In this case, the side panel substrate and the lower panel substrate above the panel substrate 90 are bonded, and as shown in FIG. 6(a), the predetermined lines 90a, 90b, 90c, and 90d are cut off in the Y direction in the longitudinal direction. . Further, the four predetermined line lines are sequentially formed from the -X direction side, and the first scribe line predetermined line 90a, the second scribe line predetermined line 90b, the third scribe line predetermined line 90c, and the fourth scribe line predetermined line 90d are formed. .

Moreover, the position of the first scribe line predetermined line 90a and the third scribe line predetermined line 90c of the upper side panel substrate of the panel substrate 90 is bonded to the first scribe line predetermined line 90a and the third scribe line of the lower panel substrate. The location of 90c is different. The position of the first scribe line predetermined line 90a of the lower panel substrate is further inside (+X direction side) than the position of the first scribe line 90a of the upper panel substrate, and the third row of the lower panel substrate The position of the line planned line 90c is located on the inner side (+X direction side) from the position of the third scribe line predetermined line 90c of the upper side panel substrate. In this case, since one side edge portion of the side panel substrate above the bonding panel substrate 91 is disconnected, it is necessary to provide a terminal or the like provided on the electrode line of the upper panel substrate, so that the area of the upper panel substrate is increased. Further, in FIGS. 6(a) and 6(b), the predetermined line of the scribe lines of the upper side panel substrate and the lower side panel substrate are shown to be uniform.

Moreover, the predetermined line of the scribe line which is located on the +Y direction side in the width direction (X direction) of the bonded panel substrate 90 is set as the fifth scribe line predetermined line 90e from the -X direction side. And the sixth scribe line 90f, and the scribe lines 90e and 90f for the fifth and sixth scribe lines are respectively arranged on the -Y direction side, and the scribe lines are respectively set as the seventh scribe line 90g and The eighth scribe line is 90h.

In the scribing device of the present invention, each of the scribing wheels (cutter wheel tips) 35p of each of the upper cutter heads 35 of the pair of upper scribing heads 33 is along the first scribing line 90a of the upper side panel substrate and The scribe line 90c is simultaneously formed with a scribe line, and each of the scribe lines of the lower cutter heads 39 of the pair of lower scribe heads 40 is along the first scribe line 90a and the third line with the upper side panel substrate. The scribe line 90c is simultaneously formed with a scribe line on two lines (not shown) on the lower surface of the lower side panel substrate.

Then, each of the scribing wheels 35p of the lower cutter heads 39 of the pair of lower scribing heads 40 simultaneously forms a scribe line along the first scribe line 90a and the third scribe line 90c of the lower panel substrate. . At this time, the rollers of the respective roller heads 36 are rotated in such a manner as to be pressed from the upper surface side of the upper panel substrate so as to face the respective scribing wheels 35p of the respective lower cutter heads 39 through the bonded panel substrate. .

Then, by the respective scribing wheels 35p of the upper cutter head 35, the second scribing line 90b and the fourth scribing line 90d of the upper panel substrate are simultaneously formed with a scribe line, and by a pair of lower cutter heads Each of the scribing wheels of 39 forms a scribe line along the second scribe line predetermined line 90b and the fourth scribe line predetermined line 90d of the lower side panel substrate. Further, after each of the scribing wheels 35p of the pair of upper cutter heads 35, the scribe lines are simultaneously formed along the fifth scribe line 90e and the sixth scribe line 90f of the upper panel substrate, and For each scribing wheel of the lower cutter head 39, a scribe line is simultaneously formed along the fifth scribe line predetermined line 90e and the sixth scribe line predetermined line 90f of the lower side panel substrate. Thereafter, a scribe line is formed along the seventh scribe line predetermined line 90g and the seventh scribe line predetermined line 90h (in the X direction adjacent to the -N scribe line 90e and the sixth scribe line predetermined line 90f in the -Y direction). Hereinafter, a scribe line is sequentially formed along a predetermined line of scribe lines (in the X direction adjacent to the -Y direction in the scribe line formed).

This scribing method will be described in further detail. First, the bonding panel substrate 90 is placed on the substrate supporting mechanism 10 positioned in the -Y direction, and the substrate supporting mechanism 10 holds the bonding panel substrate 90 in a horizontal state. In this case, the substrate supporting mechanism 10 is held by the panel substrate 90, and is not positioned correctly in the X direction and the Y direction, and the longitudinal direction of the bonding panel substrate 90 is substantially in the Y direction. Thereafter, the substrate supporting mechanism 10 transports the held bonded panel substrate 90 in the +Y direction, and the end portion on the +Y direction side is inserted between the upper rail 31 and the lower rail 32.

After forming such a state, in order to photograph the alignment marks provided at the predetermined positions of the bonding panel substrate 90 by the cameras provided on the respective camera heads 37, the respective scribing heads 33 provided on the upper rails 31 are respectively Slides along the longitudinal direction of the upper rail 31. In this case, if necessary, the bonding panel substrate 90 is moved in the Y direction by the substrate supporting mechanism 10 to photograph the alignment marks provided on the bonding panel substrate 90.

Thereafter, the alignment marks provided on the bonding panel substrate 90 are respectively photographed by the cameras provided on the respective camera heads 37 of the scribing heads 33, and then supported by the substrate according to the aligned alignment marks. The mechanism 10 moves the bonding panel substrate 90 such that the bonding panel substrate 90 is positioned at a predetermined position with respect to the scribing unit 30. Next, after the bonding panel substrate 90 is placed at a predetermined position with respect to the scribing unit 30, the movement of the bonding panel substrate 90 is stopped.

In this state, the calculation control unit performs calculation of the inclination direction of the longitudinal direction of the panel substrate 90 and the X direction of the longitudinal direction of the upper rail 31 and the lower rail 32, and the laminated panel substrate 90 is bonded. Refer to FIG. 6(a) for the positions of the scribe start positions S1 and S2 of the upper side panel substrate and the lower side panel substrate (the end portions of the first scribe line predetermined line 90a and the third scribe line predetermined line 90c in the +Y direction). ) The operation. Then, according to the calculation result, the scribing wheels 35p of the upper tool heads 35 are positioned above the scribing start positions S1 and S2 of the upper panel substrate, and the upper scribing heads 33 required for the calculation are respectively in the X direction and The moving distance in the Y direction is such that the scribing wheels of the lower tool heads 39 are respectively positioned below the scribing start positions S1 and S2 of the lower panel substrate, and the lower scribing heads 40 required for the calculation are respectively in the X direction and The moving distance in the Y direction.

Then, based on the respective calculation results, the servo motor 34m provided in the upper slider head 34 is rotationally driven by each of the upper scribing heads 33 by the linear motor mechanism to move only in the X direction along the upper rail 31. The moving distance is calculated, and the upper tool heads 35 attached to the respective upper slider heads 34 are moved only in the Y direction by the calculated moving distance. The rotation of the servo motor 34m is transmitted to the ball screw 34h by the pair of timing pulleys 34n and 34p, whereby the ball screw 34h is rotated. Thereby, the upper cutter heads 35 attached to the respective upper slider heads 34 are moved in the Y direction.

In this manner, the upper scribing heads 33 are moved in the X direction by the linear motor mechanism, and the upper cutter heads 35 are moved in the Y direction by the upper scribing heads 33, thereby making the upper cutter heads 35 stroked. The reels 35p are respectively correctly aligned above the scribing start positions S1 and S2 of the upper panel substrate.

Similarly, each lower scribing head 40 is moved along the lower rail 32 by a linear motor mechanism, and the lower cutter head 39 is moved in the Y direction in the lower portion of the lower scribing head 40, whereby the lower cutter head 39 is moved. The scribing wheels are respectively correctly aligned below the scribing start positions S1 and S2 of the lower panel substrate.

After the state described above is formed, the servo motor 35a of each upper cutter head 35 is rotated to rotate the cylindrical cam 35b, and the cam follower 35d that is pressed against the cam surface 35c of the cylindrical cam 35b is lowered. Thereby, the holder member 35n moves below the elastic pressure of the coil spring 35s. Moreover, each of the scribing wheels 35p is pressed against the scribing start positions S1 and S2 of the upper side panel substrate of the bonding panel substrate 90 by a predetermined pressure by lowering the holder member 35n.

Similarly, in the lower cutter head portion 38, the servo motor is rotated to move the holder member upward, and each of the scribing wheels is pressed against the lower side panel substrate of the laminated panel substrate 90 at a predetermined pressure. The scribing start positions S1 and S2.

After the state as described above, the bonded panel substrate 90 is moved in the +Y direction by the substrate supporting mechanism, and the first side of the panel substrate 90 is bonded to the upper side of the panel substrate 90 by the scribing wheel 35p of each upper cutter head 35. The scribe line 90a and the third scribe line 90c form a scribe line. Similarly, the lower side panel substrate facing the first scribe line 90a and the third scribe line 90c of the side panel substrate on the upper side of the panel substrate 90 is joined by the scribe wheel of each lower cutter head 39. The two lines (not shown) below form a scribe line.

In this case, since the calculation control unit calculates the inclination angle of the longitudinal direction of the bonded panel substrate 90 and the X direction of the longitudinal direction of the upper rail 31 and the lower rail 32 in advance, the calculation is performed based on the tilt angle obtained by the calculation. The inclination angle of the first scribe line 90a and the third scribe line 90c in the Y direction is only a predetermined distance in the +Y direction on the bonding panel substrate 90, and each of the upper scribers 33 is moved only in the X direction. The predetermined distance is such that the scribing wheel 35p of each upper cutter head 35 moves along the first scribe line 90a and the third scribe line 90c, respectively. Thereby, during the movement of the bonded panel substrate 90 in the Y direction by the substrate supporting mechanism 10, the scribing wheel 35p of each upper cutter head 35 is along the first scribe line 90a and the third scribe line. 90c is linearly interpolated in a manner of moving separately. As a result, the scribing wheel 35p of each upper cutter head 35 can accurately form a scribe line along the first scribe line 90a and the third scribe line 90c.

Similarly, the scribing wheel of each lower cutter head 39 is also moved in the X direction by the linear motor mechanism during the transfer of the bonded panel substrate 90 in the Y direction by the substrate support mechanism 10, and the upper side panel Linear interpolation is performed by moving the two lines (not shown) on the lower surface of the lower panel substrate opposite to the first scribe line 90a and the third scribe line 90c of the substrate. Thereby, the scribing wheels of the lower cutter heads 39 can also accurately form the scribe lines along the two lines of the lower side panel substrate.

Next, when the scribing wheel of each lower cutter head 39 is scribed along the first scribe line 90a of the lower panel substrate, the roller of the roller head 36 is pressed against the predetermined first scribe line 90a. The upper position of the upper side panel substrate. In this case, each of the upper scribing heads 33 is moved by a predetermined distance in the X direction and the Y direction, and the roller head portions 36 of the respective upper scribing heads 33 are also moved by a predetermined distance in the X direction and the Y direction, respectively. Thereby, the roller of each roller head 36 passes through the upper side panel substrate and the lower side panel substrate, and forms a state facing the scribing wheel of each lower cutter head 39. When the scribing wheel 35p of the lower cutter head 39 is pressed against the +Y-direction end of the first scribe line 90a of the lower panel substrate, the roller head 36 is also rotated by the servo motor. The holder member is moved below, and the roller held by the holder member is pressed against the upper surface of the bonding panel substrate 90. In this case, the rollers are respectively pressed against the upper side panel substrate opposite to the scribing start position of the lower side panel substrate by a predetermined pressure.

As described above, in the upper panel substrate and the lower panel substrate, the first scribing line 90a and the third scribing line 90c in the longitudinal direction are formed with scribe lines, and the scribing wheels 35p of the upper cutter heads 35 are respectively Moves upward to form a state of being separated from the upper surface of the upper side panel substrate. Similarly, the scribing wheels of the lower cutter heads 39 are respectively moved downward to form a state of being separated from the lower surface of the lower panel substrate. Then, in order to make the scribing wheel 35p of each upper cutter head 35 and the scribing wheel of each lower cutter head 39, respectively, the second scribe line 90b and the fourth scribe line of each of the bonded panel substrates 90 are aligned. At the scribing start positions S3 and S4 of the predetermined line 90d, the bonded panel substrate 90 is transported in the Y direction by the substrate supporting mechanism 10, and the upper scribing heads 33 and the lower scribing heads 40 are moved in the X direction.

Further, the scribing wheel 35p of each upper cutter head 35 and the scribing wheel of each lower cutter head 39 respectively face the second scribe line 90b and the fourth scribe line which are bonded to the panel substrate 90. After the 90d scribing start positions S3 and S4, the scribing wheel 35p of each upper cutter head 35 and the scribing wheel of each lower cutter head 39 are along the upper panel substrate and the scribing wheel of each upper cutter head 35. The second scribe line predetermined line 90b and the fourth scribe line predetermined line 90d of the lower side panel substrate are moved (rotated) in a pressure contact state to simultaneously form each of the second scribe line predetermined line 90b and the fourth scribe line predetermined line 90d. Dash.

After the completion of all the scribe lines in the longitudinal direction of the bonded panel substrate 90, the bonded panel substrate 90 is conveyed, and the scribing wheels 35p of the upper cutter heads 35 are respectively opposed to the bonded panel substrate 90. S1 of the scribing start position of the fifth scribe line 90e, and S2 of the scribing start position of the sixth scribe line 90f, and the scribing wheels of the lower cutter heads 39 are also oriented in the same manner. At the line start positions S1 and S2, the upper scribing heads 33 and the lower scribing heads 40 are moved in the X direction, and the upper cutter heads 35 and the lower cutter heads 39 are moved in the Y direction.

Thereafter, the scribing wheel 35p of each upper cutter head 35 and the scribing wheel of each lower cutter head 39 are respectively pressed to S1 and S2 at the start positions of the scribing lines, and the predetermined line 90e along the fifth scribing line And the sixth scribe line 90f moves separately. In this case, the linear interpolation of the X-direction of the scribing wheel 35p of the upper cutter head 35 and the scribing wheel of each of the lower cutter heads 39 by the transfer of the bonded panel substrate 90 of the substrate support mechanism 10 is performed. When the upper scribing head 33 and each of the lower scribing heads 40 are moved by a predetermined distance in the X direction, the substrate supporting mechanism 10 moves the bonding panel substrate 90 in the Y direction by a predetermined distance or is provided in each of the upper scribing heads 33. The upper cutter heads 35 and the lower cutter heads 39 of the lower scribing heads 40 are moved by a predetermined distance in the Y direction. Thereby, the scribing wheel 35p of each of the upper tool heads 35 and the scribing wheel of each of the lower tool heads 39 are linearly interpolated, and the predetermined line along the fifth scribe line 90e and the line 6d scribe line 90f can be accurately formed. Dash.

When the scribe lines are formed along the respective scribe line lines 90e and 90f of the upper side panel substrate and the lower side panel substrate, the transport of the bonded panel substrate 90, the upper scribe line 33, and the lower scribe line 40 are controlled in the X direction. Movement, movement of each of the upper cutter head 35 and the lower cutter head 39 in the Y direction, so that the scribing wheel 35p of each upper cutter head 35 and the scribing wheel of each lower cutter head 39 are respectively aligned and aligned The seventh scribe line predetermined line 90g in the width direction of the panel substrate 90 and the scribe line start positions S5 and S6 of the eighth scribe line predetermined line 90h.

Thereafter, the scribing wheel 35p of each upper cutter head 35 and the scribing wheel of each lower cutter head 39 are respectively pressed against the scribing start positions S5 and S6, along the seventh scribing line 90g and the eighth scribing line. The predetermined line 90h moves separately. The scribing operation in this case is the same as the scribing operation along the fifth scribe line 90e and the sixth scribe line 90f.

Thereafter, by repeating the same operation, the bonding panel substrate 90 is subjected to a scribing operation along a predetermined line extending in the width direction. Further, the scribing step is completed by forming a scribe line on the bonding panel substrate 90 along a predetermined line of all scribe lines extending in the width direction.

As described above, when the scribe lines are formed along all the scribe lines of the bonded panel substrate 90, the bonded panel substrate 90 is transported to a predetermined breaking step, and each of the broken laminated panel substrates 91 is disconnected.

In this case, the scribe line formed along the first scribe line predetermined line 90a and the third scribe line predetermined line 90c of the lower side panel substrate is predetermined to be along the first scribe line 90a and the third scribe line along the upper side panel substrate. Since the scribe line formed by the line 90c is formed on the inner side (+X direction), it can be lifted upward by holding it from the upper side of the upper side of the panel substrate on the side of the panel substrate, for example, so that no part remains. It is on the substrate holding means 10 and is accommodated for removal.

As described above, the scribing device of the present invention can be formed by simultaneously forming a pair of upper scribing heads 33 and a pair of lower scribing heads 40 on the upper side panel substrate and the lower side panel substrate. A pair of scribe lines can significantly improve the efficiency of the scribe line.

Further, each of the pair of upper scribing heads 33 and the pair of lower scribing heads 40 is provided with means for moving each of the upper cutter heads 35 and the lower cutter heads 39 in the Y direction, and is disposed in the longitudinal direction ( One of the X directions) holds the upper scribing head 33 in the longitudinal direction (X direction) of the guide rail that can slide in the X direction, and holds the lower scribing head 40 in one of the longitudinal direction (X direction). The longitudinal direction (X direction) of the guide rail that can slide in the X direction allows the tool head to be placed correctly so that the upper cutter head and each lower cutter head are correctly aligned even when the laminated panel substrate is placed obliquely The scribe start position of the panel substrate 90 is bonded. Therefore, the scribe lines along the predetermined lines of the scribe lines can be correctly formed. Further, when the upper tool heads 35 and the lower tool heads 39 are moved in the X direction to form a linear interpolation in the scribe line, only the upper tool heads 35 and the lower tool heads 39 are moved in the Y direction. The linear interpolation in the X direction can be performed quickly and accurately without moving the upper rail 31 and the lower rail 32 as a whole in the Y direction or without moving the bonded panel substrate, and an appropriate linear interpolation can be selected depending on the situation. .

Further, in the above-described embodiment, the upper rail 31 and the lower rail 32 are provided with a pair of upper scribing heads 33 and a pair of lower scribing heads 40, respectively, but three or more of the upper rails 31 and the lower rails 32 may be provided. Dash head. Further, two or more scribe lines may be provided only on the upper rail 31, and a scribe line for disconnecting the plurality of panel substrates from the one large mother panel substrate may be formed.

Further, only the upper rail 31 or only the lower rail 32 may be provided, and a plurality of upper scribing heads 33 may be provided on the upper rail 31 or the lower rail 32.

Further, the brittle material substrate on which the scribe line is formed is not limited to the laminated panel substrate, and may be one panel substrate or may be a panel substrate.

As described above, the preferred embodiments of the present invention are used to exemplify the invention, but the invention should not be construed as being limited to the embodiment. It is to be understood that the invention is to be construed as limited only by the scope of the claims. It will be understood by those skilled in the art that <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; It is to be understood that the patents, patent applications, and documents cited in the specification are the same as those specifically described in the specification, and the contents thereof are referred to as references to the present specification.

According to the present invention, a scribing device and a scribing method for scribing a brittle material substrate such as a panel substrate such as a liquid crystal panel can easily position the scribing means of a plurality of scribing heads in a predetermined manner. The starting position of the line.

10. . . Transport support mechanism

30. . . Line unit

31. . . Upper rail

32. . . Lower rail

33. . . Upper scribing head

34. . . Upper slider head

34m‧‧‧Servo motor

34n‧‧‧timed pulley

34p‧‧‧timed pulley

34q‧‧‧Real belt

35‧‧‧Upper tool head

35a‧‧‧Servo motor

35m‧‧‧tool components

35n‧‧‧ Keeping components

35p‧‧‧marking wheel

36‧‧‧Roller head

37‧‧‧ camera head

38‧‧‧ Lower slider head

39‧‧‧ Lower cutter head

40‧‧‧Underlined head

Fig. 1 is a perspective view showing a schematic configuration of a scribing device of the present invention.

Fig. 2 is a perspective view showing an enlarged schematic configuration of a main part of a scribing apparatus according to the present invention.

Figure 3 is a perspective view of a slider head used in the scribing device of the present invention.

Figure 4 is a front elevational view of the slider head used in the scribing device of the present invention.

Figure 5 is a perspective view of a cutter head used in the scribing apparatus of the present invention.

6(a) and 6(b) are plan views each showing a laminated panel substrate for explaining the operation of the scribing apparatus of the present invention.

Fig. 7 is a perspective view showing a schematic configuration of a conventional scribing apparatus.

10. . . Transport support mechanism

11. . . Belt conveyor

30. . . Line unit

31. . . Upper rail

32. . . Lower rail

33. . . Upper scribing head

40. . . Lower scribing head

Claims (13)

A scribing device comprising: a substrate holding means for holding a brittle material substrate in a horizontal state; and a plurality of scribing heads each having a scribing means for scribing the brittle material substrate held by the substrate holding means; And the guide rail, the plurality of scribing heads are respectively held to be slidable in the X direction of the longitudinal direction; the brittle material substrate held by the substrate holding means and the guide rail are aligned in the Y direction orthogonal to the X direction Relatively moving; each of the scribing heads has a sliding member that is slidable in the Y direction, and the scribing means is attached to the sliding member, and the scribing means can be arranged to move in the Y direction. Each of the plurality of scribing heads held by the rail is independently controlled. The scribing device of claim 1, wherein the substrate holding means can transport the held brittle material substrate in the Y direction. The scribing device of claim 1, wherein the guide rail is disposed above the brittle material substrate held by the substrate holding means. A scribing device according to claim 3, wherein the brittle material substrate is a single panel substrate. The scribing device of claim 1, wherein the guide rails are respectively disposed above and below the brittle material substrate held by the substrate holding means, and the plurality of scribing heads are respectively disposed on each of the guide rails. The scribe line device according to claim 5, wherein the brittle material substrate is a bonded panel substrate obtained by bonding a pair of panel substrates. The scribing device of claim 6, wherein any one of the scribing heads of the guide rail disposed above the brittle material substrate is provided with a roller that is pressed against the upper surface of the brittle material substrate. The scribing device of claim 1, wherein the scribing means is a scribing wheel. The scribing device of claim 8, wherein each of the scribing heads further has means for crimping the scribing wheel to the brittle material substrate. A scribing method for scribing the brittle material substrate by the scribing device of claim 1 includes: a step of positioning the brittle material substrate held by the substrate holding means; and then Moving the scribing heads along the guide rail in the X direction, and moving the scribing means of the scribing heads in the Y direction, so that each scribing means respectively faces the brittle material substrate The step of starting the line. The scribe method of claim 10, further comprising: pressing each of the scribe heads respectively facing the start positions of the scribe lines to the start positions of the scribe lines to make the substrate holding means The step of moving the brittle material substrate and the guide rail in the Y direction. The scribing method of claim 10, further comprising: pressing each of the scribing heads respectively facing the starting positions of the scribing lines to the starting positions of the scribing lines, so that the scribing lines are respectively The step of moving the head along the guide rail in the X direction. The scribing method of claim 12, wherein the scribing means is caused by moving the scribing heads along the guide rail in the X direction Move in the Y direction for linear interpolation.