JP6408269B2 - Semiconductor chip mounting equipment - Google Patents

Description

  The present invention relates to a semiconductor chip mounting apparatus for mounting a semiconductor chip divided from a semiconductor wafer on a substrate.

  Mounting devices such as die bonders, inner lead bonders and flip chip bonders for mounting semiconductor chips on a substrate pick up the semiconductor chips divided from the semiconductor wafer from a resin sheet or supply tray to which the semiconductor wafer is attached and onto the substrate. Implemented.

  The semiconductor chip is divided by cutting with a dicing saw in a state where the semiconductor wafer is bonded to a resin sheet or a base plate.

  For this reason, chips and cut pieces generated at the time of cutting, sticky foreign matters resulting from the resin sheet, etc. remain on the grooves formed on the semiconductor wafer by the dicing saw or the surface of the semiconductor chip. There is.

  When the semiconductor chip is mounted by holding it with a collet provided at the tip of the mounting tool, if the foreign matter adheres to the collet, the foreign matter adheres to the semiconductor chip or the substrate, or the semiconductor chip and the collet. The surface of the semiconductor chip may be damaged, or the surface may be damaged, or the surface may not be pressed on average, which may cause a positional shift during mounting, thereby hindering the mounting of the semiconductor chip.

  Therefore, in the process of mounting the semiconductor chip, the tip of the collet is cleaned with a brush (see Patent Document 1), or the collet is rubbed against a cleaning member provided with an adhesive layer (see Patent Document 2). It is performed to keep the tip in a normal state.

JP 2008-135455 A JP 2004-342847 A

  However, in cleaning with a brush, the removed foreign matter may scatter and adhere to the semiconductor chip, semiconductor wafer, or collet again.

  On the other hand, the semiconductor chip has various sizes, and a collet adapted to the size is used so that the semiconductor chip can be securely sucked and held.

  As shown in FIG. 5, there is a collet that is held only by being inserted into the tip of the mounting tool so that an operator can easily attach it to the mounting tool.

  In order to clean such a collet, if the collet is rubbed against a cleaning member provided with an adhesive layer, the collet is held only by being inserted into the tip of the mounting tool, and the entire lower surface of the collet Therefore, when the mounting tool is separated from the cleaning member, the collet adheres to the cleaning member and easily comes off the mounting tool.

  When cleaning the collet mounted on the mounting tool, the present invention reliably removes the adhered foreign matter so that it does not reattach to the collet, the substrate, etc. It is an object of the present invention to provide a semiconductor chip mounting apparatus having a semiconductor chip suction collet cleaning mechanism in which a collet held by simply being inserted into the mounting tool does not easily come off the mounting tool.

The present invention is a mounting apparatus for mounting a semiconductor chip on a substrate,
A supply unit for supplying the semiconductor chip;
A mounting tool that sucks and holds the semiconductor chip from the supply unit and mounts it on the substrate;
An elastic collet to be inserted and fitted to the tip of the mounting tool;
Comprising a rotatably supported adhesive roller, wherein contacting the lower surface and the adhesive roller in contact with the semiconductor chip of the collet, causing relative movement of said adhesive roller and the collet to the lower parallel direction of the collet And a cleaning means for cleaning the lower surface of the collet ,
In the semiconductor chip mounting apparatus, the collet moves away in a direction perpendicular to the lower surface of the collet after the collet and the adhesive roller are separated by the relative movement in the parallel direction. .

According to the present invention, the foreign matter adhering to the lower surface of the collet mounted on the mounting tool is removed by the adhesive roller, so that the adhering foreign matter is surely removed so that it does not reattach to the collet or the substrate. while, the ease of mounting to the mounting tool, thereby preventing the collet held simply by inserting the mounting tool tip will readily escape from the mounting tool. Therefore, it is possible to suppress the occurrence of a defect that damages the semiconductor chip or the substrate or the mounting position shifts , and the reduction of the movable rate due to the production stop or the like.

The perspective view of the principal part of the mounting apparatus of embodiment Top view of the cleaning unit Side view of the cleaning unit at the start of cleaning Side view showing movement of collet during cleaning Cross section of collet to be inserted into mounting tool

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a perspective view showing a main part of a die bonder as a mounting apparatus for mounting a semiconductor chip on a substrate according to an embodiment of the present invention. This die bonder includes a pair of guide rails 51 as a means for conveying and supporting the substrate 5 such as a lead frame and a resin sheet, a wafer table 52 that is a supply unit that holds the semiconductor wafer 1 and supplies the semiconductor chip 2, and a supply unit. Precise stage 40 as an intermediate stage on which the extracted semiconductor chip 2 is temporarily placed, and a mounting tool for picking up the semiconductor chip 2 by suction and holding it from the semiconductor wafer 1 of the supply unit and placing it on the precursor stage 40 And a mounting tool 10 as a mounting tool for mounting the semiconductor chip 2 mounted on the precursor stage 40 on the substrate 5 and the mounting tool 10 or the tip of the suction nozzle 30 and mounted. Consists of a cleaning unit 100 for cleaning the collet 20, etc. It is generally controlled by a control means but not shown.

  The collet used in the embodiment of the present invention is an elastic body such as rubber that hardly damages the semiconductor chip 2 when the semiconductor chip 2 is held by suction, and the size of the bottom surface is, for example, 20 mm square. .

  The pair of guide rails 51 are arranged along the X-axis direction in the figure, and the substrate 5 is configured to be pitch-fed by a transport mechanism (not shown).

  A wafer ring 50 is supplied to the wafer table 52 by a wafer ring supply device (not shown). The supplied wafer ring 50 is held by the wafer table 52 and is shown by X in the drawing by a horizontal drive mechanism and a θ direction drive mechanism (not shown). , Driven in the Y-axis direction and the θ-axis direction.

  A resin sheet is stretched on the wafer ring 50, and the semiconductor wafer 1 is adhered to the resin sheet. For example, the resin sheet is adhered to the back surface of the semiconductor wafer 1 through an adhesive material or the like. A large number of semiconductor chips 2 are formed on the semiconductor wafer 1 and are divided into a grid pattern.

  A push-up device having push-up pins (not shown) is disposed below the portion of the wafer table 52 where the wafer ring 50 is held.

  The push-up pin is driven in the vertical direction. Thereby, one of a large number of semiconductor chips 2 formed on the semiconductor wafer 1 bonded to the wafer ring 50 with a resin sheet is pushed up by the push-up pin through the resin sheet.

  The semiconductor chip 2 pushed up by the push-up pin is sucked and held (pick-up) by driving the suction nozzle 30 in the vertical and forward / backward / left / right directions or the rotation direction by a driving device (not shown), and placed on the precursor stage 40.

  The semiconductor chip 2 placed on the precursor stage 40 is imaged by a camera (not shown) provided above the precursor stage 40, and the posture is corrected and the placement position information is acquired based on the image information. .

  The semiconductor chip 2 is sucked and held by the mounting tool 10 from the precursor stage 40. The mounting tool 10 can be driven in the X, Y, and Z axis directions by a driving device (not shown), and the semiconductor chip 2 is adsorbed by a collet 15 attached to the tip of the mounting tool 10 and held on the guide rail 51. It is positioned at a mounting position above the substrate 5 that has been formed. Then, the mounting tool 10 is driven in the downward direction to mount the semiconductor chip 2 on the substrate 5.

  As described above, the semiconductor chip 2 is mounted on the substrate 5. In the embodiment of the present invention, when the semiconductor chip 2 is mounted, the cleaning unit 100 as a cleaning unit performs a predetermined period or an arbitrary timing. Then, the tip of the collet 20 attached to the mounting tool 10 is cleaned.

  As shown in FIGS. 1, 2, and 3, the cleaning unit 100 is disposed between the wafer table 52 and the guide rail 51 and has four adhesive rollers 62. An adhesive layer is formed on the surface of each adhesive roller 62, and the adhesive roller support base 61 is configured such that its axis is perpendicular to the guide rail 51 and is rotatable at intervals that do not contact each adhesive roller 62. It is supported by.

  As shown in FIGS. 2 and 3, the adhesive roller support base 61 is formed in a substantially U-shaped cross section and is fixed on the cleaning stage 60. On the upper surface of the substantially U-shaped portion of the adhesive roller support base 61, for example, when the dirty adhesive roller 62 is replaced, the shaft of the adhesive roller 62 is removably held from above. A groove is formed.

  The cleaning stage 60 is driven by a driving device (not shown) so that the adhesive roller support base 61 slides in the X-axis direction in the drawing.

  Further, as shown in the figure, a precursor stage 40 is provided in the X-axis direction of the adhesive roller support base 61 fixed on the cleaning stage 60.

  The cleaning of the collet 20 by the cleaning unit 100 is performed as follows at a predetermined period or at an arbitrary timing.

  When mounting the semiconductor chip 2, the mounting tool 10 moves onto the precursor stage 40 without holding the semiconductor chip 2, and the lower surface of the collet 20 mounted on the mounting tool 10 is the cylinder of the adhesive roller 62. Positioned down to the height of the tip of the surface.

  Subsequently, the cleaning stage 60 is driven to slide in the X-axis direction by a driving device (not shown), so that the lower surface of the collet 20 comes into contact with the cylindrical surfaces of the four adhesive rollers 62 in order. Due to the contact of the collet 20, the adhesive roller 62 rotates and moves on the lower surface of the collet, and the foreign matter attached to the lower surface of the collet 20 is transferred to the adhesive roller 62 and removed from the lower surface of the collet 20.

  Then, as shown by the arrow in FIG. 4, when the collet 20 moves away from the last adhesive roller 62z by the slide of the cleaning stage 60 in the X-axis direction, the mounting tool 10 is raised, and the cleaning of the collet 20 is finished.

  Then, the cleaning stage 60 is slid in the reverse direction, the precursor stage 40 is positioned at a predetermined position, and the next mounting cycle of the semiconductor chip 2 is performed.

  According to the embodiment of the present invention described above, the foreign matter adhering to the collet 20 is transferred to the adhesive roller 62 and removed, so that it bites into the surface of the collet 20 or scratches the surface of the semiconductor chip or the substrate by the foreign matter. There is no sticking and no foreign matter is scattered.

  Further, when the collet 20 is in contact with the cylindrical surface of the adhesive roller 62, a force that causes the collet 20 to come off the mounting tool does not act on the collet 20, and the collet 20 is completely removed from the adhesive roller 62 in the X-axis direction. Since the mounting tool 10 rises at the time of separation, the attached collet 20 is not detached from the mounting tool 10 simply by being inserted into the tip of the mounting tool.

  That is, in a state where the collet 20 is in contact with the cylindrical surface of the adhesive roller 62, the adhesive roller 62 rotates with movement and the contact position moves. The contact portion has a small area, and in the state where the collet 20 is sandwiched between the mounting tool 10 and the adhesive roller 62, the adhesive portion which is the cylindrical surface of the adhesive roller 62 is peeled off and comes off from the mounting tool 10. There is nothing.

  In this case, if the thickness of the collet 20 is thinner than the diameter of the adhesive roller 62, the collet 20 may be wound and pulled out by the adhesive force of the adhesive roller 62. However, even with a relatively thin collet, it is possible to avoid the contact portion from being reduced by reducing the diameter of the adhesive roller 62 and being wound around the adhesive roller 62 and coming off. For example, in the embodiment, the diameter of the adhesive roller 62 is 10 mm.

  Furthermore, according to the embodiment of the present invention, by providing the plurality of adhesive rollers 62, the collet 20 sequentially contacts the plurality of adhesive rollers 62. Therefore, the cleaning stages can be set in the contact order. it can. That is, for example, the first contact adhesive roller 62a can be roughly cleaned, and the last contact adhesive roller 62z can be finished. Therefore, since the cleaning is completed by the sliding operation of the cleaning stage 60, the mounting efficiency can be increased in addition to the simplification and speeding up of the cleaning.

  Also, since the first contacting adhesive roller 62a has a larger foreign matter than the other adhesive rollers 62, the holding height of the first contacting adhesive roller 62a is lower than the holding height of the other adhesive rollers 62. If held, the impact applied to the collet 20 by a large foreign object can be reduced, so that damage to the collet 20 can be suppressed.

  Furthermore, in the embodiment of the present invention described above, the cleaning roller 60 is slid in the X-axis direction so that the adhesive roller 62 rolls on the lower surface of the collet 20 to remove foreign matter. However, the mounting tool 10 is moved in the X-axis direction. You may move. In this case, since the drive mechanism of the mounting tool 10 can be used, the device configuration can be simplified.

  Further, the mounting tool 10 may be moved in the Y-axis direction simultaneously with the slide of the cleaning stage 60 in the X-axis direction. In this case, since the adhesive roller 62 rolls on the lower surface of the collet 20 in the X-axis direction and rubs and moves in the Y-axis direction, the foreign matter removal efficiency can be increased. At this time, the collet 20 may be rubbed with a large foreign object by the adhesive roller 62a that comes into contact first. In that case, when the collet 20 is in contact with the first adhesive roller 62a, only the X-axis direction slide of the cleaning stage 60 is performed and the lower surface of the collet 20 is simply rolled. Then, the mounting tool 10 is moved in the Y-axis direction so that the lower surface of the collet 20 is rubbed. By doing so, it is possible to increase the removal efficiency of the foreign matter and suppress damage to the collet 20.

  As described above, the cleaning of the collet 20 is optimally performed by appropriately changing the holding height of the adhesive roller 62, the movement of the cleaning stage 60, and the mounting tool 10 depending on the state of foreign matter attached to the collet 20 and the state of the collet 20. Can be

  Further, in the above-described embodiment of the present invention, the semiconductor chip 2 formed by dividing the semiconductor wafer 1 into the shape of a ridge is picked up and mounted. However, when the semiconductor chip, the electronic component to be mounted, etc. are supplied by a tray However, the collet 20 can be similarly cleaned. In this case, the tray is also a semiconductor chip supply unit.

  Further, in the above-described embodiment of the present invention, the axis of the adhesive roller 62 is provided in a direction orthogonal to the guide rail 51. However, for example, the direction parallel to the guide rail 51 may be appropriately set according to the apparatus configuration. It may be changed.

  Further, in the above-described embodiment of the present invention, the mounting tool 10 moves on the precursor stage 40 to position in the Y-axis direction, slide the cleaning stage 60 in the X-axis direction, and clean the collet 20. However, the position in the Y-axis direction for positioning may be changed each time cleaning is performed. That is, the position of the cylindrical surface of the adhesive roller 62 with which the collet 20 contacts may be changed at every cleaning. More specifically, for example, after cleaning is performed five times, or each time cleaning is performed, the Y-axis position is moved by 1 mm from the previously cleaned position to perform cleaning. That is, in consideration of the size of the collet 20 and the adhesive roller 62, the Y axis is positioned so that the collet 20 contacts the cylindrical surface of the adhesive roller 62 that is not yet in contact as much as possible. By doing so, the adhesive force of the adhesive roller 62 is maintained, the replacement time of the adhesive roller 62 is lengthened, and the mounting efficiency can be increased.

  Furthermore, in the embodiment of the present invention described above, the cleaning stage 60 is slid once to perform cleaning. However, the cleaning stage 60 may be moved back and forth for cleaning. By doing so, a larger removal efficiency can be obtained with a limited number of adhesive rollers, and the Z-axis is not driven every time the cleaning stage 60 slides, which is efficient.

  At that time, in addition to the reciprocation of the X axis, the Y axis may be driven. By doing so, the movement of rubbing the lower surface of the collet 20 is added as described above, so that the foreign matter removal efficiency can be increased.

  Further, the reciprocal movement may be performed between the roller next to the adhesive roller 62a that has first contacted and the adhesive roller 62z that has finally contacted. Since many or large foreign substances are attached to the first contacted adhesive roller 62a, the removal of the first contacted adhesive roller 62a increases the removal efficiency of the foreign matter and suppresses damage to the collet 20. it can.

  In the above-described embodiment of the present invention, the cleaning unit 100 is disposed between the wafer table 52 and the guide rail and cleans the collet 20 mounted on the mounting tool 10. You may clean similarly. At that time, as in the embodiment, the precursor stage 40 is provided on the cleaning stage 60, and the cleaning unit 100 is disposed between the wafer table 52 and the guide rail, whereby the mounting tool 10 and the suction nozzle 30 are cleaned together. The mounting apparatus itself can be made compact.

  Further, even when the mounting tool 10 directly picks up from the semiconductor wafer 1 or the tray without mounting the precursor stage 40 and mounts it on the substrate, the cleaning unit 100 is provided between the moving paths, so that unnecessary movement is achieved. Efficient cleaning can be done. However, the arrangement location of the cleaning unit 100 can be changed as appropriate.

  In the above embodiment, a die bonder is used as an example of a mounting apparatus. However, the mounting apparatus is not limited to a die bonder, and the present invention can be applied to a mounting apparatus using a collet such as a flip chip bonder or an inner lead bonder.

DESCRIPTION OF SYMBOLS 1 ... Semiconductor wafer 2 ... Semiconductor chip 5 ... Substrate 10 ... Mounting tool 20 ... Collet 30 ... Adsorption nozzle 50 ... Wafer ring 51 ... Guide rail 52 ... Wafer table 60 ... Cleaning stage 62 ... Adhesive roller 100 ... Cleaning unit

Claims (2)

A mounting device for mounting a semiconductor chip on a substrate,
A supply unit for supplying the semiconductor chip;
A mounting tool that sucks and holds the semiconductor chip from the supply unit and mounts it on the substrate;
An elastic collet to be inserted and fitted to the tip of the mounting tool;
Comprising a rotatably supported adhesive roller, wherein contacting the lower surface and the adhesive roller in contact with the semiconductor chip of the collet, causing relative movement of said adhesive roller and the collet to the lower parallel direction of the collet And a cleaning means for cleaning the lower surface of the collet ,
2. The semiconductor chip mounting apparatus according to claim 1, wherein the collet moves away in a direction perpendicular to a lower surface of the collet after the collet and the adhesive roller are separated by the relative movement in the parallel direction . The cleaning means has a plurality of adhesive rollers,
2. The semiconductor chip mounting apparatus according to claim 1 , wherein the plurality of adhesive rollers are sequentially brought into contact with the lower surface of the collet for cleaning.

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