JP2017059736A - Semiconductor chip mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor chip mounting device capable of removing a foreign matter surely without scattering, even when the foreign matter adheres to a preciser stage.SOLUTION: A semiconductor chip T taken out from a wafer stage 2 by means of a suction nozzle 3 is placed on a preciser stage 4, and then it is taken out by means of a mounting tool 6 and mounted on a substrate S. A cleaning device 7 includes a suction member 71 provided movably along the placing surface 41 of the precise stage 4, having a suction opening 71b in the surface facing the placing surface 41, and movable in a direction for narrowing the interval between the placing surface 41, by a suction force acting on this suction opening 71b.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a semiconductor chip mounting apparatus.

  As a mounting apparatus for mounting a semiconductor chip on a substrate such as a lead frame or a carrier tape, a die bonder, an inner lead bonder, a flip chip bonder, or the like is known. Such a mounting apparatus picks up a semiconductor chip divided and divided into semiconductor wafers from a semiconductor wafer attached to a resin sheet, a supply tray or the like, and mounts it on a substrate.

  In recent years, semiconductor chips have been thinned due to advances in three-dimensional mounting technology and demands for thinning integrated circuits. When the semiconductor chip is thinned, the semiconductor chip is likely to be warped, and the warped semiconductor chip has a problem that the position detection accuracy when mounted on the substrate is lowered. For this reason, in mounting such a thin semiconductor chip, it is possible to improve the mounting accuracy by correcting the warp by adsorbing and holding the semiconductor chip on an intermediate stage called a precursor stage and detecting the position in this state. Effective above.

  On the other hand, the semiconductor chip is divided by cutting a semiconductor wafer with a disk-shaped cutter called a dicing saw in a state where the semiconductor wafer is stuck to a resin sheet called a dicing sheet. For this reason, foreign materials such as chips and cut pieces generated during cutting, and adhesive foreign materials generated from the resin sheet are formed on the grooves formed on the semiconductor wafer by the dicing saw or on the surface of the semiconductor chip, particularly on the side surface. May remain.

  When such a semiconductor chip is mounted on a substrate, foreign matter adhering to the semiconductor chip may adhere to the precursor stage and accumulate. If the semiconductor chip is placed on such a foreign substance, the semiconductor chip may be damaged, or the semiconductor chip may cause a problem that an inclination detection position error occurs.

  Therefore, the mounting surface of the semiconductor chip provided on the precursor stage is cleaned with a brush (see Patent Document 1) to keep the mounting surface of the precursor stage in a clean state.

Japanese Patent No. 4992881

  However, cleaning with a brush may cause the removed foreign matter to scatter and adhere and accumulate around the precursor stage and inside the mounting apparatus. Even if a mechanism for sucking and collecting scattered foreign matter is provided, the foreign matter cannot be reliably prevented from scattering unless the mechanism is very large.

  An object of the present invention is to provide a semiconductor chip mounting apparatus that can reliably remove foreign matters attached to an intermediate stage while preventing them from scattering.

A semiconductor chip mounting apparatus according to an embodiment of the present invention includes:
After mounting the semiconductor chip taken out from the supply unit by the pickup tool on the intermediate stage, the semiconductor chip placed on the intermediate stage is taken out with a mounting tool, and mounted on the substrate in the semiconductor chip mounting apparatus,
The intermediate stage is provided so as to be movable along a mounting surface on which the semiconductor chip is mounted, and has a suction portion on a surface facing the mounting surface. A cleaning device for cleaning the mounting surface is provided, which includes a suction member that can move in a direction that narrows the distance between the surface and the surface.

  According to this invention, the foreign matter adhering to the intermediate stage can be reliably removed while preventing scattering. Therefore, the semiconductor chip is prevented from being damaged and the detection position is shifted due to the foreign matter attached to the mounting surface of the intermediate stage, and the quality of the mounting substrate on which the semiconductor chip is mounted can be improved.

FIG. 1 is a perspective view showing a configuration of a main part of the semiconductor chip mounting apparatus according to the first embodiment. FIG. 2 is a schematic diagram showing the configuration of the cleaning device of the semiconductor chip mounting device according to the first embodiment. FIG. 3 is a schematic diagram illustrating the operation of the cleaning device of the semiconductor chip mounting apparatus according to the first embodiment. FIG. 4 is a schematic diagram illustrating a configuration of a precursor stage of the semiconductor chip mounting apparatus according to the second embodiment. FIG. 5 is a schematic diagram illustrating the operation of the cleaning device of the semiconductor chip mounting apparatus according to the second embodiment.

Embodiments of the present invention will be described with reference to the drawings.
[First Embodiment]
First, a first embodiment will be described with reference to FIGS.

  FIG. 1 is a perspective view showing a configuration of a main part of a die bonder as a semiconductor chip mounting apparatus according to a first embodiment of the present invention.

  As shown in FIG. 1, the die bonder 1 includes a wafer table 2 as a supply unit for supplying a semiconductor chip T, a suction nozzle 3 as a pick-up tool for taking out the semiconductor chips T from the wafer table 2 one by one, and a wafer table 2. A precursor stage 4 as an intermediate stage on which the semiconductor chip T taken out from the wafer is placed, and a transfer device for transferring and positioning the substrate S provided on the opposite side of the wafer table 2 across the precursor stage 4 5, a mounting tool 6 that takes out the semiconductor chip T placed on the precursor stage 4 and mounts it on the substrate S positioned by the transfer device 5, a cleaning device 7 that cleans the precursor stage 4, and a cleaning device 7 The control apparatus 8 which controls each component containing is provided. The substrate S is, for example, a lead frame.

  The wafer table 2 mounts an annular wafer ring 22 that supports an adhesive resin sheet 21. A semiconductor wafer W divided for each semiconductor chip T is attached to the resin sheet 21. The wafer ring 22 is supplied to and removed from the wafer table 2 by a wafer ring supply device (not shown).

  Further, the wafer table 2 is driven in the arrows X, Y axis direction and θ direction in the figure by a horizontal driving device and a θ direction driving device (not shown).

  The suction nozzle 3 is provided so as to be movable in the directions of the arrows X, Y, and Z in the drawing by a horizontal and vertical drive device (not shown), and moves between a pickup position on the wafer table 2 and the precursor stage 4. . The suction nozzle 3 sucks and holds the semiconductor chip T by vacuum suction.

  The precursor stage 4 can be driven in the direction of the arrow θ in the figure by a θ direction driving device (not shown), and the semiconductor chip T mounted on the mounting surface 41 is rotated in accordance with the mounting direction with respect to the substrate S. Let

  Further, the mounting surface 41 of the precursor stage 4 is subjected to processing such that the surface roughness is 10 μm or less, for example, polishing or resin coating. Further, as shown in FIG. 2, a plurality (five in this embodiment) of suction holes 41 b for sucking and holding the semiconductor chip T are formed in the chip placement region 41 a on the placement surface 41. .

  The transfer device 5 includes a pair of guide rails 51 and 52 that support the substrate S and a substrate transfer device (not shown), and the substrate mounting unit m on the substrate S is sequentially positioned at the mounting position of the semiconductor chip T. S is intermittently conveyed.

  The mounting tool 6 is provided so as to be movable in the directions of the arrows X, Y, and Z in the drawing by a horizontal and vertical driving device (not shown), and between the precursor stage 4 and the mounting position on the substrate S on the transport device 5. To move. The mounting tool 6 sucks and holds the semiconductor chip T by vacuum suction.

  The cleaning device 7 includes a suction member 71 that cleans the placement surface 41 of the precursor stage 4, and an X-axis movement that moves the suction member 71 in a direction along the placement surface 41 (in this embodiment, the X-axis direction). One end portion of the movable base 72a of the X-axis moving device 72 is set so that the opposing distance between the device 72 and the suction surface 71a of the suction member 71 (see FIG. 2B) and the mounting surface 41 is a predetermined distance d. And a suction pipe 74 connected to a suction opening 71b as a suction portion formed on the suction surface 71a of the suction member 71; A suction pump 75 connected to the suction pipe 74, an open / close valve 76 provided in the middle of the suction pipe 74, and a filter member 77 provided in the middle of the open / close valve 76 and the suction opening 71b. And comprising.

  Here, the length in the Y-axis direction that is the width of the suction member 71 that cleans the placement surface 41 of the precursor stage 4 is set in the X-axis direction by the X-axis moving device 72 as shown in FIG. The length is such that the entire surface 41 of the precursor stage 4 can be cleaned by one movement.

  The support member 73 is formed using an elastically deformable member, for example, a material such as spring steel or resin. In this way, when the suction member 71 is positioned at a position facing the mounting surface 41 and the suction force by the suction pump 75 is applied to the suction opening 71b, the suction member 71 is supported by the suction force. The member 73 is bent and deformed, the suction member 71 is drawn to the placement surface 41, the facing distance d is narrowed, and the suction member 71 is inclined to the placement surface 41 as shown in FIG. It comes to contact.

  At this time, the magnitude of the force with which the suction member 71 abuts on the placement surface 41 (hereinafter referred to as “abutment force”) is the distance d between the suction surface 71a of the suction member 71 and the placement surface 41 described above. It is set by adjusting the magnitude of the suction force acting on the suction opening 71b and the rigidity of the support member 73.

  More specifically, the support member 73 is rigid so that at least the suction surface 71a of the suction member 71 is kept parallel to the placement surface 41 of the precursor stage 4 in a state where no suction force is applied to the suction opening 71b. And When the force that attracts the suction member 71 to the mounting surface 41 is applied to the facing distance d and the suction opening 71b, the support member 73 is bent and deformed by the force. Thus, the suction member 71 is set so as to be in contact with the placement surface 41 so that the placement surface 41 is not damaged.

  On the other hand, on the suction surface 71a of the suction member 71, the contact portion that comes into contact with the placement surface 41 is inclined so that the contact with the placement surface 41 becomes a surface contact when it comes into contact with the placement surface 41. It is formed on the surface 71c. Specifically, as shown in FIG. 2 (A) by hatching with imaginary lines, the suction surface 71a of the suction member 71 is supported from the side 71d opposite to the support member 73 in the suction opening 71b. The region up to the edge 71e opposite to the member 73 extends over the entire lengthwise direction of the suction member 71 and has an angle θ from the side 71d of the support member 73 toward the edge 71e of the suction opening 71b in a side view. It is formed on a flat inclined surface 71c that is downwardly inclined.

  Note that the surface of the inclined surface 71 c is processed so that the surface roughness is smoother than the surface roughness of the mounting surface 41 of the precursor stage 4.

  In such a state that the inclined surface 71c is in contact with the mounting surface 41, the side wall formed perpendicular to the suction surface 71a of the suction member 71 and connected to the edge 71e of the suction opening 71b is the mounting surface. The angle formed by 41 is an acute angle.

  The suction opening 71b formed on the suction surface 71a of the suction member 71 has a direction perpendicular to the moving direction by the X-axis moving device 72, that is, the length in the Y-axis direction of the chip mounting area 41a. The length is larger than the length in the Y-axis direction.

  The X-axis moving device 72 enables the movable base 72a to move in the X-axis direction by a ball screw mechanism using a motor as a drive source, a linear motor, an air cylinder, or the like. Then, the X-axis moving device 72 has the suction member 71 as shown in FIG. 2, the retracted position where the suction member 71 is retracted from the placement surface 41 of the precursor stage 4, and the suction shown in FIG. The edge 71e of the suction opening 71b of the member 71 is positioned on the end of the mounting surface 41 opposite to the cleaning device 7 (the state where the edge 71e of the suction opening 71b does not exceed the mounting surface 41). It has a stroke that can be moved between the cleaning start position.

  The suction pump 75 acts as a supply source of suction force that acts on the suction opening 71 b, and its driving is controlled by the control device 8. In the present embodiment, the suction pump 75 is always driven during the operation related to the mounting of the semiconductor chip T by the die bonder 1, and the supply / stop of the suction force to the suction opening 71 b is performed by the control device 8. This is performed by opening / closing control of the opening / closing valve 76.

  The filter member 77 captures foreign matter sucked from the suction opening 71b.

  Next, the operation of the die bonder 1 will be described.

  When the mounting operation of the semiconductor chip T is started, first, the semiconductor chip T positioned at the pickup position among the semiconductor chips T is picked up from the wafer W on the wafer table 2 by the suction nozzle 3.

  The semiconductor chip T picked up by the suction nozzle 3 is placed on the placement surface 41 of the precursor stage 4.

  On the other hand, the board | substrate S is conveyed by the conveying apparatus 5, and the predetermined mounting part m is located in a mounting position.

  In FIG. 1, the mounting of the semiconductor chip T on the first mounting portion m of the three mounting portions m provided on the substrate S is completed, and the second mounting portion m is positioned at the mounting position. 3 shows a state where the semiconductor chip T to be mounted on the second mounting portion m is picked up.

  The position of the semiconductor chip T mounted on the precursor stage 4 is detected using a position detection camera (not shown), and rotated in accordance with the mounting direction on the mounting portion m by the rotation of the precursor stage. The position of is adjusted.

  Thereafter, the semiconductor chip T is sucked and held by the mounting tool 6 and mounted on the mounting portion m positioned at the mounting position.

  By repeating the mounting operation of the semiconductor chip T as described above, the semiconductor chips T on the wafer W are sequentially mounted on the mounting portions m of the substrate S. In the present embodiment, the mounting operation is performed in advance during the mounting operation. The cleaning of the precursor stage 4 by the cleaning device 7 is executed at the set timing.

  The preset timing means that every time one semiconductor chip T is mounted, every time the mounting of the semiconductor chip T on one substrate S is completed, the pickup of all the semiconductor chips T from one wafer W is completed. For example, every time a set number of semiconductor chips T have been picked up. This timing is set in the storage unit built in or connected to the control device 8 by an input by an operator or the like.

  In this embodiment, cleaning is performed every time a set number of semiconductor chips T have been picked up, and the set number is the number of semiconductor chips T mounted on one substrate S ( In this embodiment, an example in which 3) is used will be described.

  In the mounting operation of the semiconductor chip T described above, the cleaning of the precursor stage 4 by the cleaning device 7 is performed every time the pickup of the three semiconductor chips T is completed.

  That is, when the suction nozzle 3 places the third semiconductor chip T on the placement surface 41 of the precursor stage 4 and then moves onto the wafer ring 22, the controller 8 moves the suction nozzle 3. Stop operation. The suction nozzle 3 may be stopped when the fourth semiconductor chip T is picked up. However, dust or the like is present on the back surface of the picked-up semiconductor chip T, that is, the surface mounted on the substrate S. Considering the possibility of adhesion, it is preferable to stop the fourth semiconductor chip T before picking it up.

  In addition, the control device 8 mounts the mounting tool 6 on the mounting portion m of the substrate S after mounting the third semiconductor chip T mounted on the precursor stage 4, as shown in FIG. Wait at the top.

  If the operation of the suction nozzle 3 is stopped, the control device 8 operates the cleaning device 7.

  First, the X-axis moving device 72 is driven to move the suction member 71 located at the retracted position to the cleaning start position shown in FIG. Next, the opening / closing valve 76 is opened to apply a suction force to the suction opening 71 b of the suction member 71.

  When a suction force is applied to the suction opening 71b, as shown in FIG. 3B, the support member 73 is bent and deformed by the suction force, and the inclined surface 71c of the suction member 71 is placed on the precise stage 4. Abuts on the surface 41.

  In this state, the X-axis moving device 72 is driven to move the suction member 71 toward the retracted position. During this movement, the foreign matter g adhering to the mounting surface 41 is removed by suction by the suction force acting on the suction opening 71b.

  Even if the foreign matter g adheres to the mounting surface 41 with such a strength that it cannot be removed by the suction force, the foreign matter g is moved by the suction member 71 as shown in FIG. The edge 71e of the suction opening 71b that is located rearward in the direction and moves in contact with the placement surface 41, and the suction opening 71b that is connected to the edge 71e and forms an acute angle with the placement surface 41 It is cut out and removed by the side wall.

  Further, during this movement, the suction member 71 is moved to its original height by the elastic force of the support member 73 when the suction opening 71b is detached from the placement surface 41 to some extent as shown in FIG. Return to. This is because the suction opening 71b is disengaged from the placement surface 41, thereby reducing the force with which the suction member 71 is sucked by the suction force.

  Thereafter, when the suction member 71 moves to the retracted position shown in FIG. 2, the driving of the X-axis moving device 72 is stopped, the opening / closing valve 76 is closed, and the cleaning of the precursor stage 4 is completed.

  When the cleaning is completed, the pickup operation of the semiconductor chip T by the suction nozzle 3 is resumed. Thereafter, every time the semiconductor chip T is picked up three times, cleaning of the precursor stage 4 is executed.

  According to the first embodiment of the present invention described above, the edge 71e of the suction opening 71b located on the rear side in the moving direction of the suction member 71 is brought into contact with the mounting surface 41 of the precursor stage 4. In this state, the precisor stage 4 is cleaned by the suction member 71. Therefore, the foreign matter g adhering to the mounting surface 41 is sucked and removed by the suction force applied to the suction opening 71b of the suction member 71, and the adhesive foreign matter g or the like is not attracted by the suction force. Even if it is attached to the mounting surface 41 with such an adhesive force that it cannot be removed, the foreign matter is detected by the edge 71e of the suction opening 71b that is in contact with the mounting surface 41 and is located on the rear side in the transport direction. g is cut off and reliably removed. In addition, since the removed foreign matter g is sucked and removed by the suction force, it can be prevented that the removed foreign matter g is scattered. For this reason, the mounting surface 41 of the precursor stage 4 is inclined so as to cause breakage such as cracking or chipping in the semiconductor chip T, or to cause a detection position shift at the time of position detection on the precursor stage 4. It is possible to prevent the foreign matter g that may be generated from remaining attached. As a result, the quality of the substrate S on which the semiconductor chip T is mounted can be improved.

  In addition, when the suction member 71 is in contact with the placement surface 41, the angle formed by the side wall of the suction opening 71b connected to the edge 71e of the suction opening 71b with respect to the placement surface 41 is an acute angle. . Thereby, compared with the case where the side wall of the suction opening 71b is perpendicular to the placement surface 41, the foreign matter g adhering to the placement surface 41 can be easily removed. Therefore, the foreign matter g adhering to the mounting surface 41 can be reliably removed.

  In addition, a portion of the suction surface 71 a of the suction member 71 that is in contact with the mounting surface 41 is formed on the inclined surface 71 c so as to be in surface contact with the mounting surface 41. Therefore, when abutting with the same abutting force, it is possible to reduce the load acting on the unit area as compared with the case where only the edge 71e of the suction opening 71b is in line contact. As a result, it is possible to prevent the mounting surface 41 from being damaged by the contact of the suction member 71, and even when the mounting surface 41 is coated, damage to the coating can be reduced. it can.

  Further, the surface of the inclined surface 71 c of the suction member 71 is processed more smoothly than the surface of the mounting surface 41. This also makes it possible to reduce damage to the mounting surface 41 when the suction member 71 moves while the inclined surface 71c contacts the mounting surface 41.

Further, the suction member 71 is adjusted by adjusting the facing distance d between the suction surface 71a of the suction member 71 and the mounting surface 41, the magnitude of the suction force acting on the suction opening 71b, and the rigidity of the support member 73. The contact force to the mounting surface 41 is adjusted. By doing so, the suction member 71 can be brought into contact with the placement surface 41 with a contact force as weak as possible. Also by this, the damage which the contact of the suction member 71 gives to the mounting surface 41 can be reduced.
[Second Embodiment]
Next, a second embodiment will be described with reference to the drawings.

  FIGS. 4A and 4B are a plan view and a side view showing the configuration of the precursor stage provided in the die bonder according to the second embodiment.

  In the second embodiment, only parts different from the first embodiment will be described, and description of parts common to the first embodiment will be omitted.

  The second embodiment is different from the first embodiment in the configuration of the mounting surface 41 of the precursor stage 4.

  As shown in FIG. 4, an annular convex portion 42 is formed on the mounting surface 41 of the precursor stage 4. The convex portion 42 is formed on the placement surface 41 in a region between the placement region 41 a of the semiconductor chip T and the outer peripheral edge of the placement surface 41. The convex portion 42 is formed at a predetermined height h. The predetermined height h causes the semiconductor chip T to be broken such as a crack or a chip, or to be inclined so as to cause a detection position shift when detecting the position on the precursor stage 4. The height is smaller than the height of the foreign matter g having a large size. For example, if the height of the foreign matter g is 30 μm, the height of the convex portion 42 is set to a height of less than 30 μm.

  The operation of the second embodiment will be described.

  FIG. 5 is a diagram illustrating a cleaning operation of the die bonder 1 according to the second embodiment.

  Similar to the first embodiment, when the pickup of a preset number, that is, three semiconductor chips T is completed, the control device 8 causes the suction nozzle 3 to move the third semiconductor chip T to the precursor stage 4. The suction nozzle 3 is stopped when it is moved onto the wafer ring 22 and then moved onto the wafer ring 22.

  Moreover, the control apparatus 8 is. After mounting the third semiconductor chip T mounted on the precursor stage 4 on the mounting portion m of the substrate S, the mounting tool 6 is put on standby above the mounting position.

  If the operation of the suction nozzle 3 is stopped, the control device 8 drives the X-axis moving device 72 of the cleaning device 7 to start cleaning the suction member 71 located at the retracted position as shown in FIG. Move to position. Then, the opening / closing valve 76 is opened to apply a suction force to the suction opening 71 b of the suction member 71.

  When a suction force is applied to the suction opening 71b, as shown in FIG. 5B, the support member 73 is bent and deformed by the suction force, and the inclined surface 71c of the suction member 71 is a convex portion of the precursor stage 4. 42 abuts.

  In this state, the X-axis moving device 72 is driven to move the suction member 71 toward the retracted position. During this movement, the foreign matter g adhering to the mounting surface 41 is removed by suction by the suction force acting on the suction opening 71b.

  Even if the foreign matter g is attached to the mounting surface 41 with such a strength that it cannot be removed by the suction force, the height of the foreign matter g is higher than the height h of the convex portion 42. If there is, as shown in FIG. 5 (C), it abuts against the edge 71e of the suction opening 71b and is removed and removed. At this time, even if the foreign matter g is not completely removed, the height of the foreign matter g is cut to a height equal to or lower than the height h of the convex portion 42 by cutting away the edge 71e of the suction opening 71b. ing. Accordingly, the height of the foreign matter g causes the semiconductor chip T to be broken, such as cracks or chips, or to cause a tilt that causes a detection position shift when detecting the position on the precursor stage 4. The height can be lower than such a height.

  Thereafter, as shown in FIG. 5D, the suction member 71 is restored to its original height by the elastic force of the support member 73 when the suction opening 71b is detached from the placement surface 41 to some extent. Then return to the retracted position. When the suction member 71 returns to the retracted position, the opening / closing valve 76 is closed, and the cleaning of the precursor stage 4 is completed.

  According to such 2nd Embodiment, the effect similar to 1st Embodiment mentioned above can be acquired.

  Further, according to this embodiment, since the convex portion 42 is formed on the placement surface 41 of the precursor stage 4, it is possible to prevent the suction member 71 from coming into contact with the chip placement region 41a during cleaning, and the suction member The chip placement area 41 a is not damaged by the contact of 71. Therefore, even if the chip placement region 41a is provided with a coating or the like that prevents the adhesion of the foreign matter g, the coating member can be reliably prevented from being damaged or peeled off by the suction member 71.

  As mentioned above, although embodiment of this invention was described, these embodiment is an illustration and does not intend limiting the range of invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

  For example, in the above-described embodiment, the suction member 71 is configured to abut and separate from the placement surface 41 of the precursor stage 4 using the elastic deformation of the support member 73. Alternatively, the suction member 71 may be elastically supported by the support member 73 so that the suction member 71 can be moved in the vertical direction using an elastic member such as a spring.

  Further, although the example in which the suction member 71 is brought into contact with the placement surface 41 of the precursor stage 4 in an inclined state has been described, the invention is not limited to this, and the suction member 71 may be brought into contact without being inclined. . In this case, if the suction surface 71 a of the suction member 71 is a flat surface, it is conceivable that the suction opening 71 b is blocked by contact with the placement surface 41. In such a case, for example, a protrusion along the edge 71e is provided on the suction surface 71a adjacent to the edge 71e located on the opposite side to the support member 73 in the suction opening 71b, and is mounted on the suction surface 71a. A gap may be formed between the mounting surface 41 and the mounting surface 41.

  Further, the example has been described in which when the suction force is applied to the suction opening 71b of the suction member 71, the suction member 71 comes into contact with the placement surface 41 of the precursor stage 4. However, the present invention is not limited to this. The suction member 71 is not necessarily in contact with the placement surface 41. For example, they may be separated via a minute gap. Note that the separation distance at this time may be set to be equal to or smaller than the height h of the convex portion 42 in the second embodiment.

  In addition, the intermediate stage is described as a precursor stage in which the orientation of the semiconductor chip T is rotated in accordance with the mounting direction with respect to the substrate S. However, the present invention is not limited to this. The present invention can be applied to any stage that is located on the path from the wafer W to the position where it is picked up from the wafer W and mounted on the substrate S.

  In addition, although a die bonder has been exemplified as a semiconductor chip mounting apparatus, the present invention is not limited to this, and the present invention can be applied to any mounting apparatus using a precursor stage such as a flip chip bonder or an inner lead bonder. It is.

1 Die bonder (semiconductor chip mounting equipment)
2 Wafer table (supply section)
3 Suction nozzle (pickup tool)
4 Precise stage (intermediate stage)
41 Mounting surface 42 Convex part 5 Conveying device 6 Mounting tool 7 Cleaning device 71 Suction member 71a Suction surface 71b Suction opening (suction part)
71c Inclined surface 72 X-axis moving device 73 Support member 74 Suction pipe 75 Suction pump 76 On-off valve 8 Control device T Semiconductor chip g Foreign matter

Claims (5)

After mounting the semiconductor chip taken out from the supply unit by the pickup tool on the intermediate stage, the semiconductor chip placed on the intermediate stage is taken out with a mounting tool, and mounted on the substrate in the semiconductor chip mounting apparatus,
The intermediate stage is provided so as to be movable along a mounting surface on which the semiconductor chip is mounted, and has a suction portion on a surface facing the mounting surface. An apparatus for mounting a semiconductor chip, comprising: a cleaning device for cleaning the mounting surface, comprising a suction member that is movable in a direction of narrowing a facing interval between the mounting surface and the surface. The cleaning device has a support member that supports the suction member and is capable of elastic deformation,
2. The semiconductor chip mounting apparatus according to claim 1, wherein the support member moves in a direction of narrowing a facing distance from the mounting surface by elastic deformation of the support member. The support member is formed in a rod shape, supports the suction member at one end thereof,
The suction member has an abutting portion that abuts on the placement surface by elastic deformation of the support member,
3. The semiconductor chip mounting apparatus according to claim 2, wherein the contact portion is formed on a flat surface parallel to the mounting surface when contacting the mounting surface. The mounting surface is provided with a chip mounting area on which the semiconductor chip is mounted and an annular convex portion provided outside the chip mounting area so as to surround the chip mounting area. Consisting of
The semiconductor chip mounting apparatus according to claim 1, wherein the suction member contacts the convex portion by a suction force applied to the suction portion.   The height of the convex portion with respect to the mounting surface is formed to be lower than the height of a foreign substance that adheres to the mounting surface and causes damage to the semiconductor chip. 5. The semiconductor chip mounting apparatus according to any one of 4 above.

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