JPH0742133U - Collet for semiconductor pellet adsorption - Google Patents

Abstract

(57) [Summary] [Purpose] It is possible to immediately respond to product type changes, and to prevent the pellets from being damaged or damaged during high-speed bonding. [Structure] The suction plate B is made of rubber, and a suction surface 9 provided at one end thereof is horizontal, and a flat surface b orthogonal to the axial direction is provided at the other end. On the other hand, a mounting member 2 having a receiving surface a formed of a plane orthogonal to the axial direction is provided at the tip of the tubular body C. Then, the suction plate B is fitted and fixed to the mounting member 2 while the flat surface b of the suction plate B is in contact with the receiving surface a of the mounting member 2 and by utilizing the elasticity of rubber.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a pellet suction collet in a semiconductor pellet bonding apparatus.

[0002]

[Prior art]

 In order to manufacture a semiconductor device, it is first necessary to attach and fix a pellet at a predetermined position on the lead frame. The device is called a semiconductor pellet bonding device. There are two types of this device, a rotary type and a reciprocating type.

Now, an example thereof will be described based on the rotary type shown in FIG. 2. Two collets D, D formed by tubular bodies C, C ′ provided with a suction plate B for adsorbing the pellet A at the lower end. ′ Is attached to the holding arms E and E ′, both holding arms E and E ′ are fixed to the actuating tube F that rotates and moves up and down, and pellets A are stored in the lead frame G before being transferred to a predetermined position. A large number of pellets A that are neatly stored in a container H are held by a suction disk B of a collet D and transferred to a positioning device I. The pellets A positioned here are sucked by a suction disk B of the other collet D'by a lead frame. The lead frame G is moved to a predetermined position on the guide base j and attached and fixed.

The conventional collet D used in the above-mentioned semiconductor pellet bonding apparatus has a structure as shown in FIG. That is, in the case shown in (a), a metal suction board B having a truncated cone-shaped through hole is fitted and fixed to the tip of the tubular body C.

[0005] In addition, (b) fixes the suction cup B made of metal having a small diameter at the outer circumference of the tip of the tubular body C and having a small diameter at the tip.

In addition, in C, the diameter of the outer circumference of the tip of the tubular body C is reduced, and a cylindrical suction cup B made of synthetic resin is fitted and fixed to this.

[0007]

[Problems to be solved by the device]

 By the way, recently, the pellet bonding apparatus has been operated at a high speed in order to increase its productivity.

Due to this high speed operation, the vertical movement of the suction cup is also accelerated.

By the way, since the suction plate is made of metal or synthetic resin as described above, the suction surface is relatively hard. Therefore, it is difficult for the suction surface of the suction disk to adhere to the suction surface of the pellet, and it is necessary to perform suction and suction instantaneously, resulting in a suction error. Moreover, due to the acceleration, a slight vibration is transmitted to the suction plates B and B through the holding arms E and E'and the tubes C and C ', and when the suction surface of the suction plate B contacts the suction surface of the pellet, The very serious problem of scratching the pellets and eventually damaging the pellets occurs.

According to experiments, the occurrence rate of scratches was metal nozzle 50/1000 to 100/1000 (5% to 10%) and resin nozzle 5/1000 to 10/1000 (0.5% to 1%). .

Therefore, in the case of the resin nozzle, the rate of occurrence of scratches is low, but when the number of scraps of pellets exceeds 3000, the scraps are attached to the tip and the scrapes start to stick to the pellet. As a result, it is necessary to replace it with 10 million pieces, and there is a problem that the manufacturing cost is high.

An object of the present invention is to provide a pellet suction collet in a semiconductor pellet bonding apparatus, which can eliminate the above-mentioned conventional problems and can sufficiently cope with high-speed operation.

[0013]

According to the present invention, there is provided a suction tube having an axial passage and one end of which is connected to a vacuum source, and a suction surface which is held at the other end of the tube and has a suction surface at one end. In the collet for adsorbing semiconductor pellets, the adsorption disc is made of rubber, and the adsorption surface provided at one end of the adsorption plate is a horizontal plane, and the other end is provided with a plane orthogonal to the axial direction. The tip of the tube is provided with an attachment part having a receiving surface consisting of a flat surface orthogonal to the axial direction, and the elasticity of rubber is used while the flat surface of the suction plate contacts the receiving surface of the mounting part. Then, the suction plate is fitted and fixed to the mounting portion.

[0014]

【Example】

 The structure of the present invention will be described in detail with reference to the embodiment shown in FIG. 1. The tip of the tubular body C is formed into a truncated cone shape, and the metal mounting member 2 is fitted into the passage 1 thereof and the screw 3 is used. Fix. The mounting member 2 has an upper portion 3'fitted into the passage 1, a lower portion 4 having a diameter substantially equal to the tip diameter of the tubular body C, a tip 5 having a truncated cone shape, and a central portion connected to the passage 1. A communication passage 6 is provided to pass through.

At the tip 5 of the mounting member 2, a mounting hole 7 is formed by cutting the peripheral surface of the communication passage 6, and the suction board B is fitted and fixed. The suction plate B is formed with a small diameter that can be fitted into the mounting hole 7, the tip 8 protruding outward is frustoconical, and the suction surface 9 provided at one end of the suction plate B is the semiconductor pellet which is held this time. It has a diameter smaller than A and is formed in a horizontal plane, and a through hole 10 communicating with the communication passage 6 is provided in the center. The suction cup B is made of natural rubber or synthetic rubber (hereinafter, both are referred to as rubber). The hardness is preferably 40 ° to 70 ° in terms of rubber hardness. If the rubber hardness is 40 ° or less, it is too soft to be put to practical use, and if it is 70 ° or more, it is too hard, and the pellets are damaged as in the synthetic resin product. Therefore, it is preferably used in the range of 40 ° to 70 °.

The mounting hole 7 has a receiving surface a formed of a plane orthogonal to the axial direction of the mounting member 2, that is, the axial direction of the tubular body C as shown in the drawing. The suction board B is fitted and fixed in the mounting hole 7 by utilizing its elasticity, and in this fixed state, a plane b orthogonal to the axial direction provided at the other end of the suction board B is located in the mounting hole 7. It is brought into contact with the receiving surface a.

Reference numeral 11 in the drawing is a conduit communicating with the passage 1, communicating with the vacuum source 13 via the valve 12, and adsorbing the pellet A onto the adsorption surface 9.

According to the above-described embodiment, since the suction surface 9 of the suction disk 8 has a small diameter, even small pellets can be sucked.

Further, since the suction disk B is made of rubber, even if it collides with the pellet at high speed, it does not give a large impact to the pellet, and there is no fear of scratching or damaging the pellet. According to the experiment, the scratch occurrence rate was 0/1000 to 1/1000.

Further, even if the tip of the pellet is scraped off, it has elasticity, so there is no risk of damaging the pellet.

Further, since the suction plate B is made of rubber and the suction surface 9 thereof is formed in a horizontal plane, the suction plate B is in close contact with the suction surface of the pellet, and the occurrence of suction error can be prevented. In addition, there is no misalignment from suction to pellet bonding, and accurate bonding is possible.

Further, since the suction cups B are fitted and fixed to the tubular body C by utilizing the elasticity of rubber, when a large number of suction cups B having different areas of the suction surface 9 are prepared, different types of pellets can be used. In this case, it is only necessary to remove the suction cup B that has been used up to now and fit and fix another suction cup B, so that replacement work can be performed in a short time.

Further, when the semiconductor pellet is sucked or bonded, the suction plate B receives an axial force through the pellet, but the suction plate B is fitted and fixed in the mounting hole 7. In the above, since the flat surface b provided at the other end of the suction plate B is brought into contact with the receiving surface a of the mounting hole 7, this force is received by both surfaces. Therefore, even when it is repeatedly used, the position of the suction plate B can be prevented from being displaced in the axial direction with respect to the tubular body C, and the semiconductor pellets can be reliably held by the suction plate B.

[0024]

[Effect of device]

 As described in the above embodiments, the semiconductor pellet adsorption collet according to the present invention has the following effects. Even during high-speed bonding, there is no risk of scratching or damaging the pellet. Accidental bonding of pellets can be prevented and accurate bonding can be performed. Can immediately respond to product changes. It is possible to securely hold the suction disk with respect to the tubular body.

[Brief description of drawings]

FIG. 1 is a sectional view showing only a main part of an embodiment of a pellet suction collet according to the present invention.

FIG. 2 is a perspective view showing an example of a semiconductor pellet bonding apparatus.

FIG. 3 is a cross-sectional view showing a main part of a conventionally used pellet suction collet.

[Explanation of symbols]

 A Pellet B Suction board D Collet G Lead frame H Pellet storage container I Positioning device j Lead frame guide base a Receiving surface b Plane 1 Passage 2 Mounting member 6 Communication passage 7 Mounting hole 9 Suction surface 10 Through hole

Claims (1)

[Scope of utility model registration request] 1. Adsorption of semiconductor pellets, comprising: a tube having an axial passage and one end of which is connected to a vacuum source; and a suction plate which is held at the other end of the tube and has a suction surface at one end. In the collet, the suction plate is made of rubber, the suction surface provided at one end thereof is a horizontal surface, and the flat surface orthogonal to the axial direction is provided at the other end, while the tip end of the tubular body is axially oriented. An attachment portion having a receiving surface formed of a flat surface orthogonal to the suction plate is provided, and the suction plate is attached to the mounting portion using the elasticity of rubber while the flat surface of the suction plate is in contact with the receiving surface of the mounting portion. A collet for adsorbing semiconductor pellets, which is fitted and fixed.