CN218517954U

CN218517954U - LED wafer laser cutting fixing device

Info

Publication number: CN218517954U
Application number: CN202222298416.9U
Authority: CN
Inventors: 蒋习锋; 王伟; 李秋明; 吴遥峰
Original assignee: Jinan GWeike Science & Technology Co ltd
Current assignee: Jinan Jinweike Laser Technology Co ltd
Priority date: 2022-08-30
Filing date: 2022-08-30
Publication date: 2023-02-24
Anticipated expiration: 2032-08-30

Abstract

The utility model relates to a LED wafer technical field especially relates to LED wafer laser cutting fixing device, including fixed suction cup, be equipped with the diaphragm mechanism that is convenient for go on fixing when cutting LED wafer on the fixed suction cup, diaphragm mechanism includes circular bottom plate and spacing arc, circular bottom plate is located fixed suction cup's below, fixed mounting has the spliced pole between fixed suction cup and the circular bottom plate, spacing arc is located circular bottom plate's top and is located fixed suction cup's lateral wall, circular bottom plate's upper end fixed mounting has rectangular convex block, rectangular convex block's upper end fixed mounting has magnetic path one, rectangular convex block adsorbs mutually with the lower extreme of spacing arc. The utility model discloses a set up magnetic path two and magnetic path one and cooperateed, the user to the centre gripping of LED wafer with dismantle convenient and fast more, when taking LED wafer, only need press down spacing arc reset can, the practicality is higher.

Description

LED wafer laser cutting fixing device

Technical Field

The utility model relates to a LED wafer technical field especially relates to LED wafer laser cutting fixing device.

Background

The structure principles of adsorbing the LED fixed disk of the wafer cutting machine commonly used in the LED wafer cutting industry at present are approximately the same, and the LED fixed disk is mainly based on the fact that an LED sucker is used as an air flow closed space, and then a vacuumizing device is used for generating negative pressure in the closed space, so that the adsorption and fixation effects are achieved.

The conventional fixing device has the following defects that in the conventional LED wafer fixing, the LED wafer is generally fixed by only adopting a sucker for adsorption, but when some actions of high-speed rotation are performed for cutting, the sucker drives the LED wafer to rotate, the LED wafer is likely to be deviated by centrifugal force to influence the effect of laser cutting, and the conventional fixing device is troublesome in operation, complex in disassembly process and inconvenient to use.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model provides a LED wafer laser cutting fixing device.

In order to solve the technical problem, the utility model provides a following technical scheme: LED wafer laser cutting fixing device, including fixed suction cup, be equipped with the diaphragm mechanism that is convenient for go on fixing when cutting LED wafer on the fixed suction cup, diaphragm mechanism includes circular bottom plate and spacing arc, circular bottom plate is located fixed suction cup's below, fixed mounting has the spliced pole between fixed suction cup and the circular bottom plate, spacing arc is located the top of circular bottom plate and is located fixed suction cup's lateral wall, the upper end fixed mounting of circular bottom plate has rectangular convex block, rectangular convex block's upper end fixed mounting has magnetic path one, rectangular convex block adsorbs with the lower extreme of spacing arc mutually, circular bottom plate's circumference tip fixed mounting has the C shaped plate, the lower tip fixed mounting of C shaped plate has magnetic path two, fixed mounting has reset spring two between spacing arc and the circular bottom plate, just the inside wall fixed mounting that is located reset spring two between spacing arc and the circular bottom plate has the telescopic link.

As a preferred technical scheme of the utility model, the lateral end of spacing arc runs through and has seted up the spout, the inside wall fixed mounting of spacing arc has the arc rubber pad.

As a preferred technical scheme of the utility model, the inside wall slidable mounting of spout has the arc dog, the side tip of arc dog is the arc, fixed mounting has reset spring one between arc dog and the spout, just the inside wall fixed mounting who is located reset spring one between arc dog and the spout has miniature telescopic link.

Compared with the prior art, the utility model discloses the beneficial effect that can reach is:

1. this device cooperatees through having set up spacing arc and arc dog, and when carrying out some high-speed rotatory cutting actions, spacing arc carries out spacing fixed to the LED wafer, avoids the skew to take place for the LED wafer, guarantees the cutting effect to it is fixed to carry out the centre gripping to the LED wafer through arc dog is supplementary, and the centre gripping is more stable.

2. This device cooperatees through having set up magnetic path two and magnetic path one, and the user is to the centre gripping of LED wafer with dismantle convenient and fast more, when taking LED wafer, only need press down spacing arc reset can, the practicality is higher.

Drawings

FIG. 1 is a schematic view of the fixing chuck of the present invention;

fig. 2 is a schematic structural view of the circular bottom plate of the present invention;

fig. 3 is a schematic structural view of the limiting arc plate of the present invention;

fig. 4 is a schematic structural view of the arc-shaped stop of the present invention.

Wherein: 1. fixing the sucker; 11. connecting columns; 2. a circular base plate; 21. a rectangular bump; 22. a first magnetic block; 23. a C-shaped plate; 24. a second magnetic block; 3. a limiting arc plate; 31. a chute; 32. an arc-shaped rubber pad; 33. an arc-shaped stop block; 34. a first return spring; 35. a miniature telescopic rod; 36. a second return spring; 37. a telescopic rod.

Detailed Description

In order to make the technical means, creation features, achievement objects and functions of the present invention easy to understand, the present invention will be further explained with reference to the following embodiments, however, the following embodiments are only preferred embodiments of the present invention, and not all embodiments are included. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative work belong to the protection scope of the present invention. The experimental procedures in the following examples were carried out in a conventional manner unless otherwise specified, and materials, reagents and the like used in the following examples were commercially available unless otherwise specified.

As shown in fig. 1, fig. 2, fig. 3 and fig. 4, the LED wafer laser cutting fixing device includes a fixed suction cup 1, a transverse plate mechanism is disposed on the fixed suction cup 1 and is convenient for fixing the LED wafer during cutting, the transverse plate mechanism includes a circular base plate 2 and a limiting arc plate 3, the circular base plate 2 is located below the fixed suction cup 1, a connecting column 11 is fixedly mounted between the fixed suction cup 1 and the circular base plate 2, a user needs to fix the LED wafer before the LED wafer is subjected to laser, the user can press the LED wafer to be fixedly mounted on the fixed suction cup 1, and the fixed suction cup 1 can generate suction force to fix the LED wafer;

the limiting arc plate 3 is located above the circular bottom plate 2 and located on the outer side wall of the fixed sucker 1, a rectangular convex block 21 is fixedly installed at the upper end portion of the circular bottom plate 2, a first magnetic block 22 is fixedly installed at the upper end portion of the rectangular convex block 21, the rectangular convex block 21 is adsorbed with the lower end portion of the limiting arc plate 3, a C-shaped plate 23 is fixedly installed at the circumferential end portion of the circular bottom plate 2, a second magnetic block 24 is fixedly installed at the lower end portion of the C-shaped plate 23, a second reset spring 36 is fixedly installed between the limiting arc plate 3 and the circular bottom plate 2, an expansion link 37 is fixedly installed between the limiting arc plate 3 and the circular bottom plate 2 and located on the inner side wall of the second reset spring 36, a sliding groove 31 penetrates through the side end portion of the limiting arc plate 3, after the fixed sucker 1 adsorbs the LED wafer, the limiting arc plate 3 can lift the limiting arc plate 3 to move upwards, the limiting arc plate 3 moves upwards to be away from the upper end portion of the first magnetic block 22, at the moment, the first magnetic block 22 is no longer adsorbed with the limiting arc plate 3, at this moment, the second reset spring 36 no longer receives resistance force to push the limiting arc plate 3 to move upwards, and the limiting arc plate 3 can move upwards, and contact with the magnetic block 24 when the limiting arc plate 3;

inside wall fixed mounting of spacing arc 3 has arc rubber pad 32, the inside wall slidable mounting of spout 31 has arc dog 33, the side tip of arc dog 33 is the arc, fixed mounting has reset spring 34 between arc dog 33 and the spout 31, and the inside wall fixed mounting who is located reset spring 34 between arc dog 33 and the spout 31 has miniature telescopic link 35, arc dog 33 no longer receives stopping of 1 lateral wall of fixed suction cup this moment, reset spring 34 no longer receives the resistance promptly, reset spring 34 can promote arc dog 33 looks spout 31 and move outward, when the limit is resetd in the rebound of reset spring 34, arc dog 33 stop motion, arc dog 33 is supplementary to carry out the centre gripping fixedly to the LED wafer.

The working principle is as follows:

before the LED wafer is subjected to laser, a user needs to fix the LED wafer, the user can press and fixedly install the LED wafer on the fixed sucker 1, the fixed sucker 1 can generate suction force to fix the LED wafer, after the LED wafer is adsorbed by the fixed sucker 1, the user can lift the limiting arc plate 3 to move upwards, the limiting arc plate 3 moves upwards to leave the upper end part of the first magnetic block 22, the first magnetic block 22 is not adsorbed with the limiting arc plate 3 any more, the second reset spring 36 is not subjected to resistance force any more to push the limiting arc plate 3 to move upwards, when the limiting arc plate 3 moves upwards to contact with the unique love of the second magnetic block 24, the limiting arc plate 3 is adsorbed with the second magnetic block 24, the arc stop block 33 is not stopped by the outer side wall of the fixed sucker 1 any more, namely the first reset spring 34 is not subjected to resistance force any more, the first reset spring 34 can push the arc stop block 33 to move outwards through the sliding groove 31, when the first reset spring 34 rebounds to reset to the limit, the arc-shaped stop block 33 stops moving, the arc-shaped stop block 33 assists in clamping and fixing the LED wafer, in the existing LED wafer fixing, the LED wafer is generally only adsorbed and fixed by the fixed sucker 1, but when some actions of high-speed rotation are performed for cutting, the fixed sucker 1 drives the LED wafer to rotate, the LED wafer is very likely to be deviated by centrifugal force, and the laser cutting effect is influenced, some existing fixing devices are troublesome to operate, complex in dismounting process and inconvenient to use, the device is matched with the arc-shaped stop block 33 through the arrangement of the limiting arc-shaped plate 3, when some high-speed rotation cutting actions are performed, the limiting arc-shaped plate 3 carries out limiting and fixing on the LED wafer, the LED wafer is prevented from deviating, the cutting effect is guaranteed, and the LED wafer is clamped and fixed by the assistance of the arc-shaped stop block 33, the centre gripping is more stable, and this device cooperatees through having set up magnetic path two 24 and magnetic path one 22, and the user is to the centre gripping of LED wafer with dismantle convenient and fast more, when taking LED wafer, only need press down spacing arc 3 reset can, the practicality is higher.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited thereto, and various changes can be made without departing from the gist of the present invention within the scope of knowledge possessed by those skilled in the art.

Claims

The laser cutting fixing device for the LED wafer comprises a fixing sucker (1), and is characterized in that a transverse plate mechanism convenient for fixing the LED wafer during cutting is arranged on the fixing sucker (1);

the diaphragm mechanism comprises a circular bottom plate (2) and a limiting arc-shaped plate (3), the circular bottom plate (2) is located below the fixed sucker (1), a connecting column (11) is fixedly mounted between the fixed sucker (1) and the circular bottom plate (2), and the limiting arc-shaped plate (3) is located above the circular bottom plate (2) and located on the outer side wall of the fixed sucker (1).
2. The LED wafer laser cutting fixing device as claimed in claim 1, wherein a rectangular bump (21) is fixedly mounted at an upper end of the circular base plate (2), a first magnetic block (22) is fixedly mounted at an upper end of the rectangular bump (21), and the rectangular bump (21) is attracted to a lower end of the limiting arc plate (3).
3. The LED wafer laser cutting fixing device as claimed in claim 2, wherein a C-shaped plate (23) is fixedly mounted at the circumferential end of the circular base plate (2), and a second magnetic block (24) is fixedly mounted at the lower end of the C-shaped plate (23).
4. The LED wafer laser cutting fixing device as claimed in claim 3, wherein a second return spring (36) is fixedly installed between the limiting arc plate (3) and the circular bottom plate (2), and an expansion link (37) is fixedly installed between the limiting arc plate (3) and the circular bottom plate (2) and on the inner side wall of the second return spring (36).
5. The laser cutting and fixing device for LED wafers as claimed in claim 4, wherein the side end of the limiting arc-shaped plate (3) is provided with a sliding groove (31) in a penetrating manner, and an arc-shaped rubber pad (32) is fixedly mounted on the inner side wall of the limiting arc-shaped plate (3).
6. The laser cutting and fixing device for the LED wafer as claimed in claim 5, wherein an arc-shaped stopper (33) is slidably mounted on the inner side wall of the sliding groove (31), the side end portion of the arc-shaped stopper (33) is arc-shaped, a first return spring (34) is fixedly mounted between the arc-shaped stopper (33) and the sliding groove (31), and a micro telescopic rod (35) is fixedly mounted between the arc-shaped stopper (33) and the sliding groove (31) and on the inner side wall of the first return spring (34).