JP7194034B2 - SUPPORT PIN AND SUBSTRATE PROCESSING MACHINE INCLUDING THE SAME - Google Patents

Description

This specification discloses a support pin for supporting a substrate from the back side of the substrate and a substrate processing machine including the same.

Japanese Unexamined Patent Application Publication No. 2002-200002 discloses a mounting apparatus that mounts electronic components on a substrate. The mounting apparatus includes a mounting table, support pins, and a mounting mechanism. A through-hole is formed in the support pin so as to extend through the inside thereof in the axial direction. When mounting an electronic component on a substrate, first, the support pins are transported and placed on the mounting surface of the mounting table by the mounting mechanism. Next, the substrate is transported above the support pins. Then, the mounting table moves toward the substrate until the upper ends of the support pins abut the substrate. Thereby, the back surface of the substrate is supported by the support pins.

JP-A-11-195899

When the support pins are carried onto the mounting surface of the mounting table, compressed air is supplied to the through holes of the support pins. As a result, the compressed air that has passed through the through holes blows out from the support pins toward the mounting surface of the mounting table. Therefore, if foreign matter such as dust exists on the mounting surface, the foreign matter is blown away from the region of the mounting surface where the support pins are mounted. As a result, it is possible to prevent the support pins from being placed in an inclined state with respect to the placement surface due to foreign matter.

In the support pin described above, the compressed air is blown vertically toward the mounting surface of the mounting table. Therefore, the direction in which the foreign matter is blown away changes depending on the relative positional relationship between the support pin (specifically, the outlet of the through hole) and the foreign matter. For this reason, there is a possibility that another problem may occur depending on the direction in which the foreign matter is blown away.

This specification discloses a technique for controlling the direction in which a foreign object is blown away.

The support pins disclosed in this specification are mounted on the mounting surface of the mounting table when processing the substrate, and support the substrate from the back surface side of the substrate. The support pin includes a main body having a first surface in contact with the mounting surface of the mounting table and a second surface in contact with the rear surface of the substrate, and the main body includes the first surface to the second surface. and a through hole through which gas passes is formed. The through hole has a first portion extending from a first intermediate position between the first surface and the second surface to the first surface, and a first portion connected to the first portion and extending from the first portion. a second portion extending from the first intermediate position to the second surface, wherein the first portion is slanted with respect to an orthogonal direction orthogonal to the first surface.

In this configuration, when compressed air is supplied to the through holes of the support pins, the compressed air blows out from the through holes toward the mounting surface in the orthogonal direction and the oblique direction. Therefore, compared to the case where compressed air blows out in a direction perpendicular to the mounting surface, it becomes easier to blow off foreign matter on the mounting surface in a specific direction.

It is a figure which shows schematic structure of the substrate processing machine of an Example. FIG. 2 is a cross-sectional view taken along line II-II of FIG. 1; It is a perspective view of the mounting member of the example. It is a perspective view of the support pin of an Example. It is the figure which looked at the support pin of an Example from the upper surface. It is a sectional view of a support pin of an example. FIG. 4 is a cross-sectional view of the support pin of the embodiment attached to the carrying device;

The main features of the embodiments described below are listed. It should be noted that the technical elements described below are independent technical elements, and exhibit technical usefulness alone or in various combinations, and are limited to the combinations described in the claims as filed. not a thing

(Feature 1)
The through hole may further include a third portion connected to one of the first portion and the second portion and penetrating from the connection position to the first surface. With this configuration, when compressed air is supplied to the through holes of the support pins, the compressed air is divided from the second portion into the first portion and the third portion, and blows off from the first surface toward the placement surface. Therefore, the compressed air can be blown out over a wide range of the mounting surface.

(Feature 2)
The main body has a side surface defined by a peripheral edge of the first surface and a peripheral edge of the second surface, and the support pin protrudes from the side surface for mounting the support pin on the mounting surface. It may further include a projection gripped by the mounting member that allows the mounting member to move. In this configuration, when the support pin is carried by the mounting member, the projecting portion projecting from the side surface of the main body is held by the mounting member. Therefore, the support pin can be stably held by the mounting member.

(Feature 3)
The mounting member has an engaging portion that engages with the projection, and the projection is arranged such that the orientation of the first portion of the through hole with respect to the mounting member is a preset orientation. It may be engaged with the engaging portion. In this configuration, the orientation of the support pin with respect to the mounting member is fixed by the engagement between the projecting portion of the support pin and the engaging portion of the mounting member. That is, the orientation of the through holes of the support pins with respect to the mounting member becomes constant. Therefore, by adjusting the posture (direction) of the mounting member, the direction of the gas blown out from the support pins can be adjusted.

(Feature 4)
A substrate processing machine includes a mounting table, a plurality of support pins according to feature 3, and engaging portions that engage with the protrusions of the support pins, and the support pins are mounted on the mounting surface of the mounting table. and a substrate processing section for processing a substrate supported by the support pins placed on the mounting surface, wherein a first support pin out of the plurality of support pins corresponds to the mounting surface. When the second support pin among the plurality of support pins is placed on the second region of the placement surface after being placed on the first region of the placement member, the first support pin is placed on the second region of the placement surface When placed on the first region, the first support pin in the through hole of the first support pin is in a state in which the protrusion of the first support pin is engaged with the engagement portion of the mounting member. A direction of one portion may extend in a direction avoiding the second region of the mounting surface. In this configuration, when the first support pins are placed on the first region of the placement surface, when compressed air is supplied from the through holes of the first support pins, the compressed air is supplied to the second region of the placement surface. Blow out in a direction that avoids the area. Therefore, when a foreign substance exists in the first region on the mounting surface, the foreign substance is easily blown away in a direction to avoid the second region of the mounting surface. As a result, it is possible to prevent a foreign object from being caught between the second support pin and the second region of the mounting surface.

(Example)
A substrate processing machine 10 of an embodiment will be described with reference to FIGS. 1 to 7. FIG. The substrate processing machine 10 processes substrates 2 . Specifically, the substrate processing machine 10 mounts the electronic component 4 on the substrate 2 . The substrate processing machine 10 includes a feeder support 12, a substrate positioning device 20, a first disposal box 34, a container 36, a second disposal box 38, a moving device 40, an imaging device 48, and a transport device 50. , a plurality of support pins 90 , a booster 118 , and a controller 120 .

As shown in FIG. 2, the feeder support 12 has a plurality of slots, and the feeders 14 are detachably attached to each of the slots. 2, only one feeder 14 is labeled. Feeder support 12 supports feeder 14 . A feeder 14 feeds out a tape material 16 holding the electronic component 4 .

The substrate positioning device 20 positions the substrate 2 at the working position. Further, the substrate positioning device 20 loads and unloads the substrate 2 . As shown in FIG. 1, the substrate positioning device 20 includes a pair of conveyors 22, a pair of clamp pieces 24, a mounting table 26, and an elevating device . A pair of conveyors 22 extends in the X direction. When the pair of conveyors 22 are driven, the substrate 2 moves in the X direction.

Each of the pair of clamp pieces 24 is arranged above each of the pair of conveyors 22 . The pair of clamping pieces 24 suppress movement of the substrate 2 in the positive direction of the Z direction. The mounting table 26 is arranged below the pair of conveyors 22 and the pair of clamp pieces 24 . A plurality of support pins 90 are mounted on the mounting surface 26 a of the mounting table 26 . The mounting table 26 is moved vertically by driving the lifting device 28 . The mounting surface 26 a of the mounting table 26 has an area larger than that of the substrate 2 , and spare support pins 90 can be mounted within a range that does not overlap with the substrate 2 .

As shown in FIG. 2, a first disposal box 34 and a container 36 are arranged between the feeder support 12 and the substrate positioning device 20 . The first disposal box 34 is arranged side by side with the container 36 in the X direction. The first disposal box 34 stores defective electronic components 4 and the like. The container 36 accommodates the adsorption member 30 that adsorbs the electronic component 4 .

The second disposal box 38 is arranged side by side with the mounting table 26 in the X direction, and the mounting table 26 is arranged between the second disposal boxes 38 . Foreign matter such as dust and scraps is discarded in the second discard box 38 .

The moving device 40 includes a moving base 42 , rails 44 and a head 46 . The rail 44 extends horizontally in the Y direction. The moving base 42 is movable along the rails 44 in the Y direction. A rail (not shown) extending in the X direction is formed on the moving base 42 . The head 46 is movable in the X direction along the rail. The head 46 can move up and down in the vertical direction (that is, the Z direction). Head 46 rotates carrier 50 about the Z direction.

An imaging device 48 and a transport device 50 are attached to the head 46 . As the moving base 42 and head 46 move, the imaging device 48 and transport device 50 move in the X and Y directions. As the head 46 moves up and down, the imaging device 48 and transport device 50 move in the Z direction. The imaging device 48 images the surface 2 a of the substrate 2 , the adsorption member 30 and the support pins 90 . For the imaging device 48, for example, a mark camera that captures an image of an identification mark attached to the surface 2a of the substrate 2 or the adsorption member 30 is used.

The carrying device 50 includes a holder 52 and a mounting member 70 . A holder 52 is attached to the head 46 . The adsorption member 30 and the mounting member 70 are detachably attached to the holder 52 . As shown in FIG. 7, the holder 52 includes a main body 54, a fixing member 56, a shaft 58, and a spring member 60. As shown in FIG. The main body 54, the fixing member 56 and the shaft 58 are made of resin material. The main body 54 has a cylindrical shape. A groove 54 a is formed in the inner peripheral surface of the main body 54 . The groove 54 a is recessed outward from the inner peripheral surface of the main body 54 . The groove 54a extends upward from the lower end of the main body 54. As shown in FIG. A fixing member 56 is attached to the inner peripheral surface of the main body 54 . A fixing member 56 is arranged at the upper end of the main body 54 . The fixing member 56 has a through hole penetrating vertically. A shaft 58 is inserted through the through hole of the fixing member 56 . The shaft 58 can slide vertically through the through hole of the fixing member 56 . The shaft 58 has a cylindrical shape. The shaft 58 is inserted through the inner space of the coiled spring member 60 . An upper end of the spring member 60 is connected to the fixed member 56 . A lower end of the spring member 60 is connected to the shaft 58 . A spring member 60 biases the shaft 58 downward.

Next, the mounting member 70 will be described with reference to FIGS. 3 and 7. FIG. The mounting member 70 is made of a resin material. As shown in FIG. 3 , the mounting member 70 includes a main body 72 , a sliding portion 84 and a positioning portion 86 . The body 72 includes an annular portion 74 , a first body 76 and a second body 78 . The annular portion 74 has an annular shape. An identification mark 74 a for identifying the type of the mounting member 70 is attached to the annular portion 74 . A first main body 76 is connected to the upper end of the annular portion 74 . A second main body 78 is connected to the lower end of the annular portion 74 . The annular portion 74 is arranged between a first body 76 and a second body 78 . The first body 76 and the second body 78 have a cylindrical shape. The diameter of the outer peripheral surface of the first body 76 is slightly smaller than the diameter of the inner peripheral surface of the main body 54 of the holder 52 . The first body 76 is inserted through the body 54 of the holder 52 .

A positioning portion 86 protrudes outward from the outer peripheral surface of the first main body 76 . As shown in FIG. 7, when the first main body 76 is inserted into the main body 54 of the holder 52, the positioning portion 86 moves within the main body 54 and is then fixed in the groove 54a. The mounting member 70 is thereby attached to the holder 52 . Also, the position of the mounting member 70 with respect to the holder 52 is determined.

A sliding portion 84 is inserted through the first main body 76 . The sliding portion 84 slides vertically along the inner peripheral surface of the first main body 76 . The sliding portion 84 has a cylindrical shape.

As shown in FIG. 3 , three engaging portions 80 are formed on the inner peripheral surface of the second main body 78 . The engaging portion 80 penetrates from the inner peripheral surface to the outer peripheral surface of the second main body 78 . The engaging portion 80 includes a first engaging portion 80a, a second engaging portion 80b, and a third engaging portion 80c. The first engaging portion 80a extends upward from the lower end of the second main body 78 . The second engaging portion 80b is connected to the upper portion of the first engaging portion 80a and extends in the circumferential direction of the second body 78. As shown in FIG. A third engaging portion 80c is connected to the end of the second engaging portion 80b opposite to the end to which the first engaging portion 80a is connected. The third engaging portion 80c extends downward. The third engaging portion 80c does not extend to the lower end of the second main body 78. As shown in FIG.

The three engaging portions 80 are spaced apart from each other in the circumferential direction of the second body 78 . The three engaging portions 80 are arranged at regular intervals in the circumferential direction of the second main body 78 . In the circumferential direction of the second body 78, adjacent engagement portions 80 are separated by an angle of 120 degrees.

Next, the support pin 90 will be described with reference to FIGS. 4 to 7. FIG. The support pin 90 is made of a resin material. As shown in FIG. 4, the support pin 90 comprises a body 92 and protrusions 110, 112, 114 (protrusion 110 is shown in FIG. 5). The body 92 extends vertically. Body 92 has a cylindrical shape. Body 92 has a top surface 92a, a bottom surface 92b, and side surfaces 92c. A side surface 92c is defined by the periphery of the upper surface 92a and the periphery of the lower surface 92b. The diameter of the side surface 92c of the body 92 increases from the upper surface 92a toward the lower surface 92b. The diameter of the side surface 92 c at the upper end of the main body 92 is slightly smaller than the diameter of the inner peripheral surface of the second main body 78 of the mounting member 70 .

As shown in FIG. 6, the main body 92 has a through hole 100 formed therein. The through hole 100 penetrates from the lower surface 92b of the main body 92 toward the upper surface 92a. Through hole 100 includes first portion 102 , second portion 104 and third portion 106 . The first portion 102 extends from the lower surface 92b to an intermediate position 100a and then bends to extend to an intermediate position 100c. The first portion 102 is connected to the second portion 104 at an intermediate location 100c. The first portion 102 is inclined with respect to the central axis AX of the support pin 90 . The central axis AX is orthogonal to the upper surface 92a and the lower surface 92b. The second portion 104 extends from the intermediate position 100c to the upper surface 92a. The second portion 104 is parallel to the central axis AX. The third portion 106 is connected to the first portion 102 at connection location 100b. The connection position 100b is located between the intermediate positions 100a, 100c. Third portion 106 extends from connection location 100b to lower surface 92b. The third portion 106 is inclined with respect to the central axis AX. Note that, in a modified example, the third portion 106 may be connected to the second portion 104 .

As shown in FIG. 5, the protrusions 110, 112, 114 protrude outward from the side surface 92c of the main body 92. As shown in FIG. Protrusions 110 , 112 , 114 are located on top of body 92 . The protrusions 110, 112, 114 are spaced apart from each other in the circumferential direction of the side surface 92c. The three projections 110, 112, 114 are arranged at regular intervals in the circumferential direction of the side surface 92c. In the circumferential direction of the side surface 92c, the spacing between the protrusions 110, 112, the spacing between the protrusions 112, 114, and the spacing between the protrusions 110, 114 are each 120 degrees. The length of protrusion 110 (ie, the distance from the proximal end to the distal end connected to side surface 92 c ) is equal to the length of protrusion 112 . The length of protrusion 114 is shorter than the length of protrusions 110 and 112 . Even if the support pin 90 is rotated by a predetermined angle larger than 0 degree and smaller than 360 degrees with respect to the central axis AX, the projections 110, 112, and 114 when the support pin 90 is viewed from the upper surface 92a are not rotated. It does not overlap with the previous protrusions 110, 112, 114.

Next, the booster 118 will be described with reference to FIG. The booster 118 includes a motor and a pump (not shown). When the pump is driven by the motor, the air is pressurized. The pressurized air (hereinafter referred to as compressed air) is supplied to the holder 52 . In FIG. 1, a connecting pipe connecting the booster 118 and the holder 52 is indicated by a dashed line.

Next, the control device 120 will be explained. Controller 120 is connected to feeder 14 , substrate positioning device 20 , moving device 40 , imaging device 48 and booster device 118 . Controller 120 controls feeder 14 , substrate positioning device 20 , moving device 40 , imaging device 48 and booster device 118 .

Next, the substrate processing operation of the substrate processing machine 10 will be described. A substrate processing operation includes a gripping operation, a placing operation, a supporting operation, and a processing operation. First, the gripping operation will be described. In the gripping operation, the mounting member 70 is attached to the holder 52 in advance. First, the control device 120 moves the moving base 42 and then moves the head 46 above the mounting surface 26 a of the mounting table 26 . Next, the control device 120 operates the imaging device 48 . As a result, an image of the support pin 90 viewed from the upper surface 92a is captured. Next, controller 120 rotates holder 52 based on the position of projection 114 with respect to central axis AX of support pin 90 .

Next, controller 120 lowers holder 52 . Thereby, the upper portion of the support pin 90 is inserted into the mounting member 70 . At this time, each of the projecting portions 110 , 112 , 114 of the support pin 90 moves each of the first engaging portions 80 a of the engaging portion 80 . Further, when the support pin 90 is inserted deep into the engaging portion 80 of the mounting member 70 , the support pin 90 comes into contact with the sliding portion 84 , and then the sliding portion 84 contacts the inner peripheral surface of the first main body 76 . axially. As a result, the shaft 58 axially slides on the inner peripheral surface of the main body 54 and the spring member 60 contracts. Controller 120 then rotates holder 52 . Thereby, each of the projections 110, 112, 114 moves each of the second engaging portions 80b. Controller 120 then raises holder 52 . As a result, the biasing force of the spring member 60 acts on the shaft 58, causing the shaft 58 to slide downward and the sliding portion 84 to slide downward. Therefore, each of the projecting portions 110, 112, 114 moves to the lower end of each third engaging portion 80c. As a result, the projecting portions 110 , 112 , 114 are engaged with the engaging portion 80 . Thereby, the support pin 90 is gripped by the mounting member 70 . At this time, in order to rotate the holder 52 based on the position of the projecting portion 114 and engage the projecting portions 110, 112, 114 with the predetermined engaging portions 80, the orientation of the support pin 90 with respect to the mounting member 70 is changed. That is, the orientations of the first portion 102 and the third portion 106 of the through hole 100 with respect to the mounting member 70 are set in advance.

Next, the placement operation will be described. When the support pins 90 are gripped by the mounting member 70, the control device 120 first moves the moving base 42, and then moves the head 46 to the first region 26b of the mounting surface 26a of the mounting table 26 (that is, the substrate). 2). Next, controller 120 lowers holder 52 . As a result, the support pin 90 descends toward the first region 26b of the placement surface 26a.

Further, the control device 120 drives the pressure increasing device 118 at the same time as the holder 52 is lowered. Compressed air is thereby supplied to the holder 52 . Compressed air is supplied from the holder 52 to the through holes 100 of the support pins 90 via the mounting member 70 . Compressed air passes through the second portion 104 and the first portion 102 of the through hole 100 and blows out from the lower surface 92b of the main body 92 toward the mounting surface 26a. Also, the compressed air flows from the connection position 100b of the first portion 102 to the third portion 106 and blows out from the lower surface 92b of the main body 92 toward the mounting surface 26a. The direction of the blown compressed air is inclined with respect to the central axis AX. As a result, when foreign matter such as dust or debris exists in the first region 26b of the placement surface 26a, the foreign matter is blown away in the direction in which the compressed air blows. The direction in which the compressed air is blown out is the direction in which the third portion 106 of the through hole 100 extends from the intermediate position 100a in the first portion 102 of the through hole 100 toward the lower surface 92b of the main body 92 .

In addition, the directions in which the compressed air is blown are the second region 26c (that is, another position that supports the substrate 2), the third region 26d (that is, another position that supports the substrate 2), and the fourth region 26c of the mounting surface 26a. It extends in a direction that avoids the region 26e (that is, another position that supports the substrate 2). Also, the direction in which the compressed air blows out extends in the direction toward the second disposal box 38 . For this reason, foreign matter located near the first area 26b avoids the second area 26c, the third area 26d, and the fourth area 26e of the mounting surface 26a toward the second disposal box 38 (see FIG. 2). (in the direction of the arrow shown in ).

Next, when holder 52 descends to a predetermined position, controller 120 rotates holder 52 and then raises holder 52 . As a result, the projecting portions 110, 112, and 114 of the support pin 90 are disengaged from the engaging portions 80 of the mounting member 70, and the support pin 90 is mounted on the first region 26b of the mounting surface 26a. Further, when the holder 52 descends to a predetermined position, the control device 120 stops driving the booster device 118 . As a result, the supply of compressed air to the holder 52 is stopped, and the blowout of the compressed air from the support pins 90 is stopped.

Next, the control device 120 repeats the same placement operation. As a result, another support pin 90 is mounted on each of the second region 26c, the third region 26d, and the fourth region 26e of the mounting surface 26a. When foreign matter exists in the second region 26c, the third region 26d and the fourth region 26e, the foreign matter is blown away from the second region 26c, the third region 26d and the fourth region 26e. In this case, the support pin 90 is placed so that the foreign matter is blown away avoiding the area where the other support pin 90 is placed. For example, when the support pins 90 are placed in the order of the second region 26c, the third region 26d, and the fourth region 26e, when the support pins 90 are placed in the second region 26c, the third region 26d and the fourth region 26d are placed. The support pin 90 is placed on the fourth area 26e so that the foreign matter is not blown away. When the support pin 90 is placed on the third area 26d, the support pin 90 is placed on the fourth area 26e so that the foreign matter is not blown off. be placed.

Next, the supporting operation will be explained. When a plurality of support pins 90 (four support pins 90 in this embodiment) are mounted on the mounting surface 26 a of the mounting table 26 , the controller 120 first drives the pair of conveyors 22 . Thereby, the substrate 2 is transported to the working position. Next, the control device 120 drives the lifting device 28 . As a result, the mounting table 26 moves upward. The multiple support pins 90 approach the back surface 2 b of the substrate 2 , and the top surfaces 92 a of the multiple support pins 90 abut the back surface 2 b of the substrate 2 . After that, the substrate 2 moves upward and comes into contact with the pair of clamp pieces 24 . As a result, the substrate 2 is supported by the plurality of support pins 90 from the rear surface 2b side. The substrate 2 is fixed in the working position.

Next, processing operations will be described. The operation after the adsorption member 30 is attached to the holder 52 will be described below. First, the controller 120 moves the moving base 42 and then moves the head 46 above the feeder 14 . Next, controller 120 lowers holder 52 . As a result, the electronic component 4 is attracted to the attraction member 30 . Controller 120 then raises head 46 . The controller 120 then moves the moving base 42 and then moves the head 46 above the substrate 2 . Next, controller 120 lowers holder 52 . Thereby, the electronic component 4 is mounted on the board 2 . That is, the substrate 2 is processed. The position where the electronic component 4 is to be mounted on the board 2 can be accurately calculated by capturing an image of the identification mark provided on the surface 2a of the board 2 by the imaging device 48. FIG.

(effect)
As described above, the first portion 102 of the through hole 100 of the support pin 90 is inclined in a predetermined direction with respect to the central axis AX. Therefore, the compressed air is blown out in a specific direction inclined with respect to the central axis AX of the first portion 102 . As a result, when foreign matter exists on the mounting surface 26a of the mounting table 26, the foreign matter can be blown away in a specific direction that is inclined with respect to the central axis AX.

Moreover, the through hole 100 further includes a third portion 106 . Therefore, compressed air can be blown out of the third portion 106 in addition to the first portion 102 . As a result, the compressed air can be blown out over a wide range of the mounting surface 26a.

In addition, the support pin 90 includes protrusions 110 , 112 , and 114 that protrude outward from the side surface 92 c of the main body 92 . In the mounting operation, the support pins 90 are gripped by the mounting member 70 by engaging the protrusions 110 , 112 , 114 with the specific engaging portions 80 of the mounting member 70 . Therefore, the support pin 90 can be stably held by the mounting member 70 .

Also, the length of the protrusion 114 is shorter than the length of the protrusions 110 and 112 . Therefore, when the projecting portions 110, 112, 114 are engaged with the engaging portion 80, the orientation of the support pin 90 with respect to the mounting member 70 becomes a preset orientation. As a result, the projections 110 , 112 , 114 and the engaging portion 80 can make the orientation of the support pin 90 placed on the placement surface 26 a constant.

(correspondence relationship)
The upper surface 92a of the main body 92 corresponds to the "second surface", the lower surface 92b of the main body 92 corresponds to the "first surface", the adsorption member 30 corresponds to the "substrate processing section", and the intermediate position 100c It corresponds to the "first intermediate position".

Although specific examples of the present invention have been described in detail above, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.

(1) In the above embodiments, the substrate processing machine 10 is a device that mounts the electronic components 4 on the substrate 2 . However, the substrate processing machine 10 may be a screen printer that applies an adhesive paste to the substrate 2 .

(2) In the above embodiment, the controller 120 may drive the booster 118 only when a foreign object exists on the mounting surface 26a of the mounting table 26 during the mounting operation. In this case, the control device 120 drives the imaging device 48 before lowering the holder 52 . After that, the control device 120 determines whether or not there is a foreign object based on the image of the mounting surface 26a captured by the image capturing device 48 .

(3) In the above embodiments, the body 92 of the support pin 90 is made from one piece. However, the main body 92 may be split at a position corresponding to the intermediate position 100c of the through-hole 100, ie, the dashed position shown in FIG. In this case, the partial body on the side where the first portion 102 and the third portion 106 of the through hole 100 are formed is replaced with another partial body having a different configuration of the through hole 100, so that the air blows out from the support pin 90. Compressed air direction can be adjusted.

(4) In the above embodiment, the upper surface 92a of the main body 92 of the support pin 90 may be provided with a positioning mark. In this case, the orientation of the support pin 90 with respect to the mounting member 70 may be adjusted based on the positioning mark imaged by the imaging device 48 .

In addition, the technical elements described in this specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technique illustrated in this specification or drawings can simultaneously achieve a plurality of purposes, and achieving one of them has technical utility in itself.

2: Substrate 4 : Electronic component 10 : Substrate processing machine 12 : Feeder support 20 : Substrate positioning device 26 : Mounting table 26a : Mounting surface 30 : Adsorption member 38 : Second disposal box 40 : Moving device 48 : Imaging device 50 : Carrying device 52 : Holder 70 : Mounting member 80 : Engagement portion 90 : Support pin 92 : Main body 92a : Upper surface 92b : Lower surface 92c : Side surface 100 : Through holes 100a and 100c : Intermediate position 100b : Connection position 102 : First Portion 104: Second portion 106: Third portion 110, 112, 114: Protruding portion 118: Boosting device 120: Control device AX: Central axis

Claims (5)

A support pin that is mounted on a mounting surface of a mounting table when processing a substrate and supports the substrate from the back surface side of the substrate,
a main body having a first surface in contact with the mounting surface of the mounting table and a second surface in contact with the back surface of the substrate;
The main body is formed with a through hole penetrating from the first surface toward the second surface and through which gas passes,
The through hole has a first portion extending from a first intermediate position between the first surface and the second surface to the first surface, and a first portion connected to the first portion and extending from the first portion. a second portion extending from the first intermediate position to the second surface;
The support pin, wherein the first portion is inclined with respect to an orthogonal direction orthogonal to the first surface. The support pin according to claim 1,
The support pin, wherein the through hole further includes a third portion connected to one of the first portion and the second portion and penetrating from the connection position to the first surface. The support pin according to claim 1 or 2,
the body has a side surface defined by a perimeter of the first surface and a perimeter of the second surface;
A support pin, further comprising a projection that protrudes from the side surface and is gripped by a mounting member that mounts the support pin on the mounting surface. A support pin according to claim 3,
The mounting member includes an engaging portion that engages with the projecting portion,
The support pin, wherein the projecting portion engages with the engaging portion so that the first portion of the through hole is oriented in a preset direction with respect to the mounting member. a mounting table;
a plurality of support pins according to claim 4;
a mounting member including an engaging portion that engages with the projecting portion of the support pin, and for mounting the support pin on the mounting surface of the mounting table;
a substrate processing unit that processes a substrate supported by the support pins placed on the placement surface;
After the first support pin among the plurality of support pins is placed on the first region of the placement surface, the second support pin among the plurality of support pins is placed on the second region of the placement surface. , when the first support pin is placed in the first region by the placement member, the projection of the first support pin engages the engaging portion of the placement member. The substrate processing machine, wherein the orientation of the first portion of the through hole of the first support pin in the folded state extends in a direction avoiding the second region of the mounting surface.

Images