JPH0371697A - Inspecting device for circuit board - Google Patents

Inspecting device for circuit board

Info

Publication number
JPH0371697A
JPH0371697A JP1207508A JP20750889A JPH0371697A JP H0371697 A JPH0371697 A JP H0371697A JP 1207508 A JP1207508 A JP 1207508A JP 20750889 A JP20750889 A JP 20750889A JP H0371697 A JPH0371697 A JP H0371697A
Authority
JP
Japan
Prior art keywords
circuit board
board
support plate
support
compressed air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1207508A
Other languages
Japanese (ja)
Inventor
Tomoyasu Watanabe
渡辺 智康
Masato Hayashida
真人 林田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP1207508A priority Critical patent/JPH0371697A/en
Publication of JPH0371697A publication Critical patent/JPH0371697A/en
Pending legal-status Critical Current

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  • Supply And Installment Of Electrical Components (AREA)

Abstract

PURPOSE:To protect in advance a circuit board to be tested next against damage by a method wherein a cleaning means which cleans a support board by blowing compressed air is provided near the support board. CONSTITUTION:Compressed air is made to blow on the board placing face of a support board 8 where a circuit board is placed for cleaning at each test. Therefore, even if a chip component 5 or the like is left on the board placing face of the support plate, it is blown off before a following board 4 to be tested is placed on the board placing face of the support board 6 to clean the board placing face. By this setup, a circuit board 4 to be tested next can be prevented from being damaged by a chip component 5 or the like.

Description

【発明の詳細な説明】 [産業上の利用分野コ この発明は、回路基板をコンタクトピンにより電気的に
検査する回路基板検査装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a circuit board testing device for electrically testing a circuit board using contact pins.

[発明の概要] この発明は、回路基板を載置保持するサポート板と、回
路基板を検査する複数本のコンタクトピンを有する回路
基板検査装置において、上記サポート板の近傍に、例え
ば次に検査する回路基板の検査前にサポート板に圧縮エ
アを吹き付けてサポート板を清掃する清掃手段を設けた
ことにより、 回路基板の検査時にサポート板に落ちたチップ部品等を
圧縮エアにて吹き飛ばしてサポート板を常に清掃するこ
とができ、上記サポート板に載置保持されて検査される
次の回路基板の損傷等を未然に防ぐことができるように
したものである。
[Summary of the Invention] The present invention provides a circuit board inspection device having a support plate for mounting and holding a circuit board, and a plurality of contact pins for inspecting the circuit board, in which a circuit board is provided near the support plate, for example, to be inspected next. By installing a cleaning means that blows compressed air onto the support board to clean the support board before inspecting the circuit board, it is possible to clean the support board by blowing away chip parts, etc. that have fallen onto the support board during circuit board inspection. This allows for constant cleaning and prevents damage to the next circuit board that will be placed and held on the support plate for inspection.

[従来の技術] 例えば、回路基板を電気的に検査する回路基板検査装置
が知られている。これを、第2,3図によって具体的に
説明すると、第2図中1は回路基板検査装置の装置本体
であり、ピン治具支持部1aと、このピン治具支持部1
aより垂直に起立した垂直部1bと、この垂直部1bの
上部に設けられたシリンダ支持部1cとから構成されて
いる。
[Prior Art] For example, a circuit board inspection device that electrically inspects a circuit board is known. To explain this in detail with reference to FIGS. 2 and 3, 1 in FIG. 2 is the main body of the circuit board inspection device, which includes a pin jig support portion 1a and a pin jig support portion 1a.
It is composed of a vertical portion 1b standing vertically from the vertical portion a, and a cylinder support portion 1c provided above the vertical portion 1b.

この装置本体1のビン治具支持部l極上には、■CTビ
ン治具等の一部を威すビンボード2を取り付けである。
A bin board 2 is attached to the uppermost part of the bin jig support l of the main body 1 of the apparatus.

このビンボード2には、回路基板4を電気的に検査する
複数本のコンタクトピン3を上下移動自在に突設しであ
ると共に、この各コンタクトピン3を貫通させたサポー
ト板6を各支持部材6aを介して取り付けである。
A plurality of contact pins 3 for electrically testing the circuit board 4 are provided on the bin board 2 so as to be movable up and down, and a support plate 6 through which each of the contact pins 3 passes is attached to each support member 6a. It is installed via.

また、上記装置本体1のシリンダ支持部1cの下部には
、一対のエアシリンダ7.7の各ロッド7aを介して支
持枠8を取り付けである。この支持枠8の下面には、上
記ビンボード2側のサポート板6との間で回路基板4を
載置保持するサポート板9を取り付けである。
Further, a support frame 8 is attached to the lower part of the cylinder support portion 1c of the apparatus main body 1 via each rod 7a of a pair of air cylinders 7.7. A support plate 9 for mounting and holding the circuit board 4 between it and the support plate 6 on the bin board 2 side is attached to the lower surface of the support frame 8.

そして、装置本体1のビン治具支持部1aに設けられた
スタートボタン1dを押すと、上記一対のエアシリンダ
7.7が下がり、上記上、下一対のサポート板6,9間
に回路基板4が載置保持されて各フンタクトビン3を介
して所定の検査を開始するようになっている。また、検
査後に、」二記ビン治具支持部1aに設けられた停止ボ
タン1eを押すと、エアシリンダ7のロッド7aの上が
ってサポート板9がビンボード2側のサポート板6から
離れて回路基板4の検査が終了し、回路基板4を装置本
体1から取り出すことができるようになっている。
Then, when the start button 1d provided on the bottle jig support portion 1a of the main body 1 is pressed, the pair of air cylinders 7.7 are lowered, and the circuit board 4 is placed between the upper and lower pair of support plates 6, 9. is placed and held so that a predetermined inspection can be started via each inspection bin 3. Furthermore, after the inspection, when the stop button 1e provided on the bin jig support part 1a is pressed, the rod 7a of the air cylinder 7 is raised, the support plate 9 is separated from the support plate 6 on the bin board 2 side, and the circuit board is removed. 4 has been completed, and the circuit board 4 can now be taken out from the device main body 1.

[発明が解決しようとする課題] しかしながら、上記従来の回路基板検査装置では、一対
のサポート板6,9間に回路基板4を載置保持して複数
のコンタクトピン3により所定の検査中に、回路基板4
が載っているサポート板6の上面(以下基板載置面と称
す)にチップ部品5等が落ちることがあり、このままの
状態で、次に検査する回路基板4を上記サポート板6の
基板載置面に載せて検査すると、第3図に示すように、
サポート板6の基板載置面と回路基板4間にチップ部品
5が挾まって次の回路基板4の下面等に傷が付き易い欠
点があった。
[Problems to be Solved by the Invention] However, in the conventional circuit board inspection apparatus described above, the circuit board 4 is placed and held between the pair of support plates 6 and 9, and during a predetermined inspection using the plurality of contact pins 3, circuit board 4
Chip components 5, etc. may fall onto the upper surface of the support plate 6 (hereinafter referred to as the board placement surface) on which the circuit board 4 is placed. When inspected by placing it on a surface, as shown in Figure 3,
There is a drawback that the chip component 5 is sandwiched between the substrate mounting surface of the support plate 6 and the circuit board 4, and the lower surface of the next circuit board 4 is easily damaged.

そこで、この発明は、回路基板の検査終了後毎に回路基
板を載せるサポート板を圧縮エアで清掃して回路基板の
損傷等を未然に防止することができる回路基板検査装置
を提供するものである。
Therefore, the present invention provides a circuit board inspection device that can prevent damage to the circuit board by cleaning the support plate on which the circuit board is placed with compressed air every time the circuit board is inspected. .

[課題を解決するための手段] 回路基板を載置保持するサポート板と、回路基板を検査
する複数本のコンタクトピンを有する回路基板検査装置
において、上記サポート板の近傍に、回路基板の検査前
に該サポート板に圧縮エアを吹き付けて清掃する清掃手
段を設けである。
[Means for Solving the Problems] In a circuit board inspection device having a support plate for mounting and holding a circuit board, and a plurality of contact pins for inspecting the circuit board, there is provided a circuit board inspection device near the support plate before inspecting the circuit board. A cleaning means is provided for cleaning the support plate by blowing compressed air thereon.

[作用コ 検査終了後に回路基板を載置するサポート板を圧縮エア
にて清掃するようにしたので、検査時等にチップ部品等
が落ちていても、次に検査する回路基板を上記サポート
板に載せる前に上記チップ部品等を吹き飛ばして清掃す
ることができ、回路基板を傷付けることがない。
[Effects] After the inspection is completed, the support plate on which the circuit board is placed is cleaned with compressed air, so even if chip parts, etc. have fallen during the inspection, the next circuit board to be inspected can be placed on the support plate. The chip parts and the like can be blown off and cleaned before being placed on the board, and the circuit board will not be damaged.

[実施例コ 以下、この発明の一実施例を図面と共に詳述する。尚、
従来の構成と同一部分には同一符号を付してその詳細な
説明は省略する。
[Example 1] Hereinafter, an example of the present invention will be described in detail with reference to the drawings. still,
Components that are the same as those in the conventional configuration are designated by the same reference numerals, and detailed description thereof will be omitted.

第1図において、1は回路基板検査装置の装置本体であ
り、ピン治具支持部1aと垂直部1bとシリンダ支持部
1cとで構成しである点、このピン治具支持部la上に
複数本のコンタクトピン3を突設したビンボード2及び
サポート板6を設けである点、上記シリンダ支持部1c
に一対のエアシリンダ7.7等を介してサポート板9を
設けである点は、従来の構成と同様である。
In FIG. 1, reference numeral 1 designates the main body of the circuit board inspection apparatus, which is composed of a pin jig support part 1a, a vertical part 1b, and a cylinder support part 1c. The above-mentioned cylinder support part 1c is provided with a bin board 2 and a support plate 6 on which book contact pins 3 are protruded.
The structure is similar to the conventional structure in that a support plate 9 is provided via a pair of air cylinders 7, 7, etc.

ここで、上記装置本体1の垂直部1bの両側には、回路
基板4の検査前にビンボード2側のサポート板6上に圧
縮エアAを吹き付けて該サポート板6の上面(以下基板
載置面と称す)を清掃する清掃手段10を設けである。
Here, before inspecting the circuit board 4, compressed air A is blown onto the support plate 6 on the bin board 2 side on both sides of the vertical part 1b of the apparatus main body 1, so that the upper surface (hereinafter referred to as the board mounting surface) of the support plate 6 is sprayed. A cleaning means 10 is provided for cleaning.

この清掃手段10は、装置本体1の垂直部1bの両側に
取付けられた支柱11.IIの所定位置にそれぞれ固定
され、基端部が各電磁バルブを介してコンプレッサ等か
ら成る圧縮エア源(いずれも図示しない)に接続された
一対のエア供給管12.12と、この一対のエア供給管
12.12の先端部に接続され、」二記すポート板6の
基板載置面に上記圧縮エア源からノ圧縮エアAを噴射す
る各一対のノズル13,13と、一方の上記支柱11の
側面11aに突設され、シリンダ支持部1c側のサポー
ト板9を支持する支持枠8の上支持板部8aの一端が上
昇する際に当接離反することにより上記各電磁バルブを
開閉して各一対のノズル13.13より圧縮エアAを噴
射させたり、噴射を停止させる上、下一対のリミットス
イッチ14.15とで構成されている。即ち、回路基板
4の検査後にサポート板6の基板載置面より回路基板4
を取り除き、一対のエアシリンダ7.7によりサポート
板9が所定ストローク上昇すると、上支持板部8aが下
方のリミットスイッチ15に触れて上記各電磁バルブが
開き、各一対のノズル13.13より圧縮エアAを上記
サポート板6の基板載置面に吹き付けるようになってい
ると共に、上記サポート板9が更に上昇して上方のリミ
ットスイッチ14に触れると上記各電磁バルブが閉じて
各一対のノズル13,13からの圧縮エアAの噴射が停
止されるようになっている。なお、上、下一対のリミッ
トスイッチ14.15はサポート板9が上昇する時にの
み作動し、該サポート板9が下降する時には作動しない
ようになっている。
This cleaning means 10 consists of columns 11. mounted on both sides of the vertical portion 1b of the main body 1 of the apparatus. A pair of air supply pipes 12.12 are each fixed at a predetermined position of II, and the proximal ends are connected to a compressed air source (none of which is shown) consisting of a compressor or the like via each electromagnetic valve, and this pair of air supply pipes 12. A pair of nozzles 13, 13 connected to the tips of the supply pipes 12 and 12 and injecting compressed air A from the compressed air source onto the substrate mounting surface of the port plate 6, and one of the support columns 11. When one end of the upper support plate portion 8a of the support frame 8 that protrudes from the side surface 11a of the support frame 8 and supports the support plate 9 on the cylinder support portion 1c side rises, it comes into contact with and separates from the upper support plate portion 8a, thereby opening and closing each of the electromagnetic valves. It is comprised of a pair of upper and lower limit switches 14.15 for injecting and stopping the compressed air A from each pair of nozzles 13.13. That is, after the circuit board 4 is inspected, the circuit board 4 is removed from the board mounting surface of the support plate 6.
is removed, and when the support plate 9 is moved up by a predetermined stroke by the pair of air cylinders 7.7, the upper support plate portion 8a touches the lower limit switch 15, opening each of the electromagnetic valves, and compressing from each pair of nozzles 13.13. Air A is blown onto the substrate mounting surface of the support plate 6, and when the support plate 9 further rises and touches the upper limit switch 14, each of the electromagnetic valves closes and each pair of nozzles 13 The injection of compressed air A from , 13 is stopped. The pair of upper and lower limit switches 14, 15 operate only when the support plate 9 is raised, and are not operated when the support plate 9 is lowered.

以上実施例の回路基板検査装置によれば、一対のサポー
ト板6,9間に回路基板4を挾むように載置保持して複
数のコンタクトピン3を介して所定の電気的検査をする
時に、回路基板4が載っているサポート板6の基板載置
面に従来の第3図に示すようにチップ部品5や異物等が
落ちることがある。しかしながら、上記回路基板4の検
査終了後に、一対のエアシリンダ7.7を介してサポー
ト板9を上昇させ、サポート板6の基板載置面より回路
基板4を取り除き、更にサポート板9が上昇して、上支
持板部8aの一端が下方のリミットスイッチ15に触れ
ると、上記各電磁バルブが開いて各一対のノズル13.
13より圧縮エアAが上記サポート板6の基板載置面の
チップ部品5や異物等を吹き飛ばす。この後、上記サポ
ート板9が更に上昇して上方のリミットスイッチ14に
触れると上記各電磁バルブが閉じて圧縮エアAの噴射が
停止され、次に検査する回路基板4のセット準備が終了
する。
According to the circuit board inspection apparatus of the above embodiment, when carrying out a predetermined electrical inspection via the plurality of contact pins 3 with the circuit board 4 placed and held between the pair of support plates 6 and 9, the circuit As shown in FIG. 3, chip components 5, foreign objects, etc. may fall on the board mounting surface of the support plate 6 on which the board 4 is mounted, as shown in FIG. However, after the inspection of the circuit board 4 is completed, the support plate 9 is raised via a pair of air cylinders 7.7, the circuit board 4 is removed from the board mounting surface of the support plate 6, and the support plate 9 is further raised. When one end of the upper support plate portion 8a touches the lower limit switch 15, each of the electromagnetic valves opens and each pair of nozzles 13.
13, compressed air A blows off the chip parts 5, foreign matter, etc. on the substrate mounting surface of the support plate 6. Thereafter, when the support plate 9 further rises and touches the upper limit switch 14, each of the electromagnetic valves is closed and the injection of the compressed air A is stopped, completing the preparation for setting the circuit board 4 to be inspected next.

このように、■回の検査毎に回路基板4を載置するサポ
ート板6の基板載置面に圧縮エアAを一定時間吹き付け
て清掃するようにしたので、検査時等にチップ部品5等
が上記サポート板6の基板載置面に落ちていても、次に
検査する回路基板4を上記サポート板6の基板載置面に
載せる前に吹き飛ばして清掃することができ、検査時に
次の回路基板4のチップ部品5等による損傷を、未然に
防止することができる。
In this way, compressed air A is sprayed on the board mounting surface of the support plate 6 on which the circuit board 4 is mounted for a certain period of time to clean it after each inspection. Even if it falls onto the board mounting surface of the support plate 6, it can be blown away and cleaned before the next circuit board 4 to be inspected is placed on the board mounting surface of the support board 6, and the next circuit board can be cleaned during inspection. Damage caused by the chip components 5, etc. of No. 4 can be prevented.

尚、前記実施例によれば、一対のりミットスイノチを用
いて圧縮エアの供給をオン、オフする各電磁バルブの開
閉を行うようにしたが、これに限られず、サポート板の
基板載置面に回路基板の位置を検出する光センサを設け
、この先センサの基板位置の検出信号により上記基板載
置面から回路基板を取り除いた時に各電磁バルブを動作
させる遅延回路等を介してサポート板の基板載置面を一
定時間エア清掃するように制御しても良い。
In addition, according to the above embodiment, each solenoid valve that turns on and off the supply of compressed air is opened and closed using a pair of glue mitts, but the circuit is not limited to this. An optical sensor is provided to detect the position of the board, and the circuit board is placed on the support plate via a delay circuit that operates each electromagnetic valve when the circuit board is removed from the board mounting surface based on the sensor's board position detection signal. The surface may be controlled to be air-cleaned for a certain period of time.

[発明の効果] 以上のように、この発明によれば、サポート板の近傍に
、圧縮エアを吹き付けてサポート板を清掃する清掃手段
を設けたので、回路基板の検査後にサポート板に落ちた
チップ部品等を圧縮エアにて吹き飛ばし、て清掃するこ
とができ、次に検査する回路基板の損傷等を未然に防止
することができる。
[Effects of the Invention] As described above, according to the present invention, since the cleaning means for cleaning the support plate by blowing compressed air is provided near the support plate, chips that have fallen on the support plate after inspection of the circuit board are removed. Parts and the like can be blown away and cleaned with compressed air, and damage to the circuit board to be inspected next can be prevented.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の一実施例を示す回路基板検査装置の
概略構成図、第2図は従来例の回路基板検査装置の概略
構成図、第3図は同要部の拡大説明図である。 3・・・コンタクトピン、4・・・回路基板、6.9・
・・サポート板、10・・・清掃手段、A・・・圧縮エ
ア。 手続補正書輔発) 平成 2年2月2 日 事件の表示 平成1年特許願第207508号 理人〒104 東京都中央区明石町1番29号 液済会ビル 補正の対象 6、補正の内容 (1)明細書中第3頁第12行目の「スタートボタン1
dを押すと、」とあるのを「スタートボタン1dと1e
を同時に押すと、」と訂正する。 (2)明細書中第3頁第16行目〜第18行目の「始す
るよう、になっている。また、検査後に、・・・・・・
エアシリンダ7のロッド7aの上がっ」とあるのを「始
するようになっている。また、検査後は自動的に、エア
シリンダ7のロッド7aの上がっ」と補正する。
FIG. 1 is a schematic configuration diagram of a circuit board inspection device showing an embodiment of the present invention, FIG. 2 is a schematic configuration diagram of a conventional circuit board inspection device, and FIG. 3 is an enlarged explanatory diagram of the main parts. . 3... Contact pin, 4... Circuit board, 6.9.
...Support plate, 10...Cleaning means, A...Compressed air. February 2, 1990 Display of the incident 1999 Patent Application No. 207508 Lijisaikai Building, 1-29 Akashi-cho, Chuo-ku, Tokyo 104 Subject of amendment 6, Contents of amendment (1) “Start button 1” on page 3, line 12 of the specification
``When you press d,'' changes to ``Start buttons 1d and 1e.
"If you press both at the same time," corrected. (2) In the specification, on page 3, lines 16 to 18, it says ``Start.'' Also, after the inspection...
The phrase "the rod 7a of the air cylinder 7 is raised" is corrected to "the rod 7a of the air cylinder 7 is raised".

Claims (1)

【特許請求の範囲】[Claims] (1) 回路基板を載置保持するサポート板と、回路基
板を検査する複数本のコンタクトピンを有する回路基板
検査装置において、 上記サポート板の近傍に、該サポート板に圧縮エアを吹
き付けて清掃する清掃手段を設けたことを特徴とする回
路基板検査装置。
(1) In a circuit board inspection device having a support plate for mounting and holding a circuit board and a plurality of contact pins for inspecting the circuit board, compressed air is sprayed onto the support plate in the vicinity of the support plate to clean it. A circuit board inspection device characterized by being provided with a cleaning means.
JP1207508A 1989-08-10 1989-08-10 Inspecting device for circuit board Pending JPH0371697A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1207508A JPH0371697A (en) 1989-08-10 1989-08-10 Inspecting device for circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1207508A JPH0371697A (en) 1989-08-10 1989-08-10 Inspecting device for circuit board

Publications (1)

Publication Number Publication Date
JPH0371697A true JPH0371697A (en) 1991-03-27

Family

ID=16540884

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1207508A Pending JPH0371697A (en) 1989-08-10 1989-08-10 Inspecting device for circuit board

Country Status (1)

Country Link
JP (1) JPH0371697A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63265241A (en) * 1987-04-23 1988-11-01 Fuji Photo Film Co Ltd Processing of silver halide photographic sensitive material
JP2020126966A (en) * 2019-02-06 2020-08-20 株式会社Fuji Support pin and substrate processing machine including the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63265241A (en) * 1987-04-23 1988-11-01 Fuji Photo Film Co Ltd Processing of silver halide photographic sensitive material
JP2020126966A (en) * 2019-02-06 2020-08-20 株式会社Fuji Support pin and substrate processing machine including the same

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