JPH0216748A - Inspection device for semiconductor integrated circuit characteristic - Google Patents

Abstract

PURPOSE:To inspect correctly characteristics of a device which involve optical characteristic problems to be solved by removing scraps of silicon which are produced with the dotting of an inker by using a vacuum aspirator. CONSTITUTION:When characteristics of a semiconductor integrated circuit 3 are inspected according to the state of a wafer, accepting and delivery of signals are performed by bringing input/output pins 2 of a probe card 1 into contact with the circuit 3 through the pins 2. When the characteristics of the circuit 3 are inspected, this device makes an inker dotting device 4 and a vacuum aspirator 5 take backward positions which do not interfere with operations of the circuit 3. As a result of characteristic examinations, if the circuit 3 is found to be a defective pellet, this device allows the the dotting device 4 to approach to a dotting position of the inker and perform dotting of the inker after making the suction port 6 of the aspirator 5 approach to the dotting position; besides, enables the aspirator to suck in scraps 7 of silicon which are produced with the dotting of the inker. Characteristics of the device which involve optical problems to be solved are thus correctly inspected.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for testing the characteristics of semiconductor integrated circuits in a wafer state.

[Conventional technology]

Conventionally, in equipment that inspects the characteristics of semiconductor integrated circuits in the wafer state, in order to distinguish between good pellets and defective pellets, an inca dotting device using a needle or laser beam is used to physically mark defective pellets. was wearing.

[Problem to be solved by the invention]

The conventional semiconductor integrated circuit characteristic testing equipment described above tests the characteristics of each pellet one by one, and if it is defective, performs an ink dot, and then moves on to the characteristic test of the next pellet. There is a risk that the silicone debris generated from time to time may scatter to the surrounding pellets.

This silicon dust has no effect on devices such as memory devices where electrical characteristics are a problem, but CO
D In devices where optical characteristics are a problem, such as solid-state imaging devices, there is a drawback that good pellets become defective due to this silicon debris.

An object of the present invention is to provide a semiconductor integrated circuit characteristic testing device that solves the above problems.

[Differences between the invention and the prior art]

In contrast to the conventional semiconductor integrated circuit characteristic testing apparatus described above, the present invention quickly sucks up silicon debris generated when inking a defective pellet with ink in order to distinguish between good pellets and defective pellets, and prevents it from scattering to surrounding pellets. The difference is that it prevents.

[Means to solve the problem]

In order to achieve the above object, the present invention provides an apparatus for inspecting the characteristics of semiconductor integrated circuits in a wafer state, which includes an input dotting device for physically marking defective pellets in order to distinguish between defective pellets and non-defective pellets; This device is equipped with a vacuum suction device that sucks up silicone debris generated during dotting.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

(Example 1) FIG. 1 is a plan view showing Embodiment 1 of the present invention.

In the figure, 1 is a probe card, and 2 is an input/output pin of the probe card 1. The input/output pin 2 of the probe card 1 is brought into electrical contact with a semiconductor integrated circuit 3 in a wafer state, and the The characteristics of the semiconductor integrated circuit 3 are measured by transmitting and receiving signals.

The device of the present invention includes an in-force dotting device 4 that physically marks defective pellets to distinguish between good pellets and defective pellets, and a vacuum suction device 5 that sucks up silicone debris generated during inca-dotting. The suction port 6 of the vacuum suction device 5 is installed near the point where the input force is hit by the input force point device 4.

In the embodiment, when testing the characteristics of a semiconductor integrated circuit in a wafer state, the input/output pins 2 of the probe card 1 are brought into contact with the semiconductor integrated circuit 3 as shown in FIG. 2(a). Send and receive signals via. When testing the characteristics of a semiconductor integrated circuit, the input dotting device 4 and the vacuum suction device 5 are moved back to a position where they do not get in the way. As a result of the characteristic test, if the semiconductor integrated circuit 3 is found to be a defective pellet, the input dot device 4 is moved closer to the input dot point position as shown in FIG. 6 is brought close to perform an in-force hit point, and the vacuum suction device 5 sucks up silicone debris 7 generated at that time.

(Example 2) FIG. 3 is a sectional view showing a second embodiment of the present invention.

In this embodiment, in order to efficiently suck up silicone debris generated when performing an impact point, a compressed gas jetting device 8 is used that jets dry gas compressed to approximately 2 kg/aa to the location where the impact impact is performed. is installed. Like the suction port 6 of the vacuum suction device 5, the spout 9 of the compressed gas jet device 8 is located at a position where it does not interfere with the inspection when testing the characteristics of the semiconductor integrated circuit 3, and when the input force is applied, the Get close to where you will be hit.

In this embodiment, by blowing out compressed gas, the scattering of silicon debris 7 to surrounding pellets can be suppressed, so there is an advantage that silicon debris 7 can be removed more effectively.

〔Effect of the invention〕

As explained above, the present invention is an apparatus for inspecting the characteristics of semiconductor integrated circuits in a wafer state. This method has the advantage that it is possible to accurately test the characteristics of devices whose optical characteristics are of concern, such as in the following.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing Embodiment 1 of the present invention, FIG. 2(a)
, (b) is a cross-sectional view explaining the present invention in detail, and FIG. 3 is a cross-sectional view showing Example 2 of the present invention. 1... Probe card 2... Input/output pin 3.
・・・Semiconductor integrated circuit in wafer state

Claims (1)

[Claims] (1) In equipment that inspects the characteristics of semiconductor integrated circuits in wafer state, there is an inca dotting device that physically marks defective pellets to distinguish between defective pellets and non-defective pellets, and an inca dotting device that sucks up silicon debris generated during inca dotting. 1. A semiconductor integrated circuit characteristic testing device comprising a vacuum suction device.