JPS58209134A - Monitor device for primary test - Google Patents

Abstract

PURPOSE:To monitor the surface of a wafer accurately during an IC test by forming an opening to one part of a probe card and fixing one tip of an optical- fiber cable. CONSTITUTION:The probe card 4 is bored 10 where separate from a probe 5, and the surface of the wafer 2 is monitored by the optical-fiber cable 11. Accordingly, irradiating beams do not strike to an IC chip to be tested, and the surface of the wafer can be monitored at all times while continuing the test. For example, a chip to which measurement is completed is moved under the opening 10, a contact position between the probe and a pad is brought to an adequate one on measurement, and the surface of the wafer can be monitored during the next chip measurement from an indentation by the probe remaining on the pad. The incorporation of a fiber cable for illumination into the optical- fiber cable 11 is effective, and only an observing section can be lit up. A video device is coupled with another tip of the cable, and the surface of the wafer can be monitored precisely.

Description

DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a monitor device for primary testing, and particularly to a monitoring device for testing an integrated circuit device formed on a wafer by contacting a probe with a pad of the integrated circuit device. The present invention relates to a monitor device provided for observing integrated circuit devices on a wafer in an apparatus for performing #.

(21 Background of Technology) Regarding the actual process of integrated circuit devices, the so-called primary test, in which the integrated circuit device is tested while it is formed on a wafer, is used to detect various defects in the manufacturing process of integrated circuit devices at an early stage. This is one of the most important tasks for discovery.In such primary testing, a glove is placed on the top of the integrated circuit device on the wafer in order to test the operation of the integrated circuit device formed on the wafer. The integrated circuit device is connected to an external circuit by contacting the integrated circuit device with If the positional relationship with the pad of the circuit device is misaligned, the probe may damage other circuit parts of the integrated circuit device. If the positional relationship between the pad and the pad deviates from the beginning (-), all subsequent integrated circuit devices may be misaligned, and in the worst case, an accident may occur in which all subsequent integrated circuit devices are damaged. Therefore, when conducting the first test, it is necessary to be able to accurately observe the positional relationship between the rope and the pad.

(3) Conventional technology and problems The first prisoner represents a conventional primary test device.

In the figure, l is a stage, 2 is a wafer mounted on stage 1, 3 is a mounting base, 4 is a glove card,
5 is a probe. Reference numeral 6 denotes a main body of the test device, which contains a test electronic circuit, etc., and the test electronic circuit is connected to the probe through a connection lead 7 VC. 8
is a microscope, and 9 is an eyepiece of the microscope 8.

In the apparatus shown in FIG. 1, when conducting the first test, the stage 1 is raised, the glove 5 is brought into contact with the pad of the circuit device formed on the wafer 2, and the test apparatus itself is removed. The test circuit is tested by the test electronic circuit built into the wafer 6. In this case, when the test of one integrated circuit device on the wafer 2 is completed, the stage 1 is moved by a predetermined pitch and the next one is moved. Testing of the integrated circuit devices will be performed.In this way, the integrated circuit devices on the wafer 2 will be tested one after another. When performing all such trials, probe 5
Conventionally, in order to check whether or not the wafer is in accurate contact with the dead surface of the integrated circuit device, the wafer surface is illuminated by an illumination device (not shown) built into the microscope 8, and in this state, the entire wafer surface is By observing and checking the contact position of the glove, etc.

However, with the conventional device 6 shown in Fig. 1, when performing H detection on the surface of the b wafer in, for example, an MO8 type integrated circuit, it was necessary to stop the operation test of the integrated circuit device. Since MO8 type integrated circuit devices and the like operate with extremely small currents, illumination generates an emission current due to the collision of photoelectrons, making it difficult to accurately inspect integrated circuit devices. This happens because it becomes impossible to do so.

That is, in the conventional type, there is a disadvantage that monitoring such as observation of the wafer is impossible during operation tests of the integrated circuit device. Furthermore, in the conventional type, much of the field of view is obstructed by the friend glove, which is used for monitoring with the glove placed over the pad of the integrated circuit device, making it impossible to perform accurate monitoring. there were.

(4) Purpose of the Invention The purpose of the present invention is to:
The monitor device tI/C2 for primary testing of integrated circuit devices, etc. is based on the concept of using a fiber cable to partially cover the wafer surface, even during test measurements of integrated circuit devices, etc. Monitoring - The goal is to do what is right.

15) Structure and object of the invention According to the present invention, for example, while sequentially moving the wafers of integrated circuit devices, the globe f; In an inspection device that performs a first test of the integrated circuit device, a part of the blow 1 card is provided with an opening for the waist,
This is achieved by providing a primary test monitor device characterized in that one end of an optical fiber cable is fixed to the opening so that the wafer surface can be observed through the optical fiber cable.

(6) Examples of the invention Embodiment 1r of the present invention will be described below with reference to the drawings.

FIG. 2 shows a primary test monitor device according to an uninvented example V. In FIG. 2, the portion tlPI- of FIG. The device for the second cause is different from the device shown in FIG. The point is that the entire surface of the wafer 2 can be observed through the cable. Also, at the other end of the # original fiber cable 11 (1
A video device 12 comprising a television camera device and a monitor television camera is coupled. Or (・;
The fiber cable 11 is a bundle of fiber cables for illumination and light reception. They can also be combined.

In the apparatus shown in FIG. 2, an opening 10 is provided in the glove card 4 at a position different from the glove 5, and the wafer surface can be monitored through the opening by the original fiber cable 11VC, so that the integrated circuit under test can be monitored. Since the chip is not exposed to illumination light, it is possible to constantly monitor the integrated circuit chip while testing and measuring it. P.I.
For example, move the IC chip after the test @ measurement to the bottom of the opening 10, and check whether the contact position of the glove and the non-rad is accurate in the case of test J song 11. A glove indentation or the like formed on the rad allows for monitoring during the subsequent trial measurement of the integrated circuit chip. As for the illumination #3 on the wafer surface, as described above, by inserting the illumination fiber cable into the original fiber cable 11 and by doing so, it is possible to effectively illuminate only the entire observation portion of the wafer surface. Furthermore, accurate and clear monitoring can be performed by connecting the other end 6 of the original fiber cable 11 to the above-mentioned imaging device and observing the wafer surface on a monitor television.

(7) Effects of the Invention As described above, according to the present invention, it is possible to observe the wafer surface by preventing the illumination light from hitting the Heiguchi chip during test measurement, and by blocking the view with the lid probe. Therefore, it becomes possible to accurately monitor the wafer surface at all times even during testing and measurement of integrated circuit chips, which improves the manufacturing yield of integrated circuit devices and the like.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram showing a conventional primary test monitor device, and FIG. 2 is a schematic side view showing the configuration of a primary test monitor device according to an embodiment of the present invention. It is. ■...Stage, 2...Wafer, 3...Mounting stand, 4...Glove card, 5...Glove, 6...
- Test device main body, 7... Connection lead, 8... Microscope, 9... Eyepiece, 10... Aperture, 11... Original fiber cable, 12... Image device. Patent Applicant: Fujitsu Limited Patent Application Agent: Patent Attorneys: Akira Minori, Patent Attorney, Kazuyuki Nishidate, Patent Attorney: 1) Yukio, Patent Attorney: Akira Yamaguchi

Claims (1)

[Claims] L. Since the parts of the integrated circuit device are sequentially moved, 7
In a calibration device that performs a first test of the integrated circuit device by contacting a probe provided on the probe card with the pad of the integrated circuit device on the probe card, a part of the probe card is provided with an aperture for observation. one end of the optical fiber cable is fixed in the opening, and the optical fiber cable is connected through the original fiber cable.
A monitor device for the primary test that allows the surface to be observed as an fj image. 2. The primary device according to claim 1, characterized in that the other end of the source fiber cable is connected to a video device comprising a television camera 2 and a monitor television. Test monitor device. ``A. An illumination light source is coupled to the other end of the part of the original fiber cable, and the wafer surface can be illuminated by the illumination light source.Claim 1. Or the monitor device for the primary test described in Section 2.