JPH0228344A - Semiconductor inspection apparatus - Google Patents

Abstract

PURPOSE:To enable accurate automatic alignment at an observing position without affecting measurement with a microscope by installing the microscope at the measurement position of a device under test and equipping an optical automatic detector capable of accurately moving. CONSTITUTION:A microscope 15 is installed at the measurement position of a device 7 under test. An optical automatic detector 3, having a camera 4 and a light source 5 and capable of accurately moving, to automatically detect a pattern on the device 7 under test is equipped. The setting table 13 of the device 7 under test is moved to correct in accordance with detected data and the stylus of a probe card 12 to be contacted is automatically set at a high speed. This enables accurate alignment of the device 7 under test at an observing position without affecting the field of the view of the microscope 15 installed at the measurement position in alignment.

Description

[Detailed description of the invention] λ5 standing 1 blood (Industrial application field) The present invention relates to a semiconductor inspection device.

(Prior Art) Positioning in an inspection apparatus for semiconductor devices (devices under test) such as circuit boards is performed by first pre-aligning a wafer and then transporting it to a measurement position using an arm or the like while maintaining that state, although not particularly shown in the drawings.

Only the first wafer is precisely aligned by visual observation using a microscope placed above the measurement position, and the second and subsequent wafers that are similarly pre-aligned are placed in an optical position other than the measurement position. It is customary to automatically align and measure using a sensor (CCCD, etc.).

In addition, recently, the device under test is transported to the measurement position using a tape carrier, and the tape is automatically transported using the sprocket holes on the tape as a guide based on positioning data from a microscope, and then inspection and measurement are performed. Semiconductor inspection equipment is also used. Such tape carriers are also often used during bonding, allowing assembly line operations. As a positioning mechanism in this type of tape carrier conveyance device, there is a positioning mechanism utilizing sprocket holes of the tape carrier, such as in Japanese Patent Laid-Open No. 61-78584. For example, as shown in FIG. 3, the feed claw 40 is driven by a drive mechanism (not shown) to
It moves along the path indicated by the GH arrow, and sends the frame 41 (tape carrier) forward by a certain pitch. Next, the positioning pin 42 rises from this state and fits into the sprocket hole 43 of the frame 41 for positioning.

(Problem to be solved by the invention) However, as described above, if the wafer is first pre-aligned and then transported to the measurement position, it takes time if the moving distance is long, and furthermore, the positioning accuracy decreases. . In particular, recently there has been a problem in that inspection equipment for large substrates and the like must increase its total throughput and positioning accuracy.

In addition, in the above-mentioned positioning mechanism of tape carrier type semiconductor inspection equipment, the positioning accuracy of the sprocket hole has an error of 10μ due to the material etc. There is a problem in that it is not possible to perform probing for. Moreover, since positioning is performed mechanically by inserting the positioning pin 42 and the sprocket hole 43, abnormal force is applied to the tape carrier, causing warping and distortion of the carrier.
There was a risk of not only disrupting positioning accuracy but also damaging the device.

The present invention was invented in view of the above-mentioned problems.

without affecting measurements under the microscope?
Performs high-precision automatic positioning using the lIM fixed position.

Moreover, it is an object of the present invention to provide a semiconductor inspection device that does not place any burden on the device even in a tape carrier type.

Seventh Configuration (Means for Solving the Problems) In order to solve the above-mentioned problems, the present invention provides a semiconductor inspection apparatus in which a microscope is disposed at the measurement position of a device under test. Equipped with an optical automatic detection mechanism with a light source.

By automatically detecting the pattern on the device under test at the measurement position, based on the detected data, for example, by correcting and driving the setting table of the device under test in the X and Y directions, the contact probe card It is configured to automatically perform needle alignment at high speed. In this case, the optical automatic detection mechanism is preferably movable in the X and Y directions.

(Function) According to the present invention, a pattern such as a pad pattern or a target pattern on a tape carrier is automatically detected by an optical automatic detection mechanism having a camera and light source that can be moved with high precision, and based on this data, a pattern such as a pad pattern or a target pattern is automatically detected. The position of the device to be measured in the X and Y directions is automatically determined. Since optical means are used, the detection accuracy is extremely high, and since the tape carrier can be placed on a high-precision stage, the tape carrier or the device under test will not be damaged and the positioning accuracy will be high. It doesn't fall. Furthermore, since the pattern for needle alignment is directly detected at the measurement position, the Ct error due to the material of the tape does not affect the measuring position. In addition, since the optical automatic detection mechanism is movable, the field of view of the microscope is not obstructed at the measurement position, and initial needle alignment can be performed smoothly.

(Example) Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows an embodiment in which the present invention is applied to a tape carrier type semiconductor inspection device, and FIG. 1(a) shows the measurement position 1.
A schematic diagram of the main parts showing the positioning state at 1A, (b) is a partial plan view showing the optical automatic detection mechanism slid to position B, and (c) is shown in (a) FIG. 2 is an enlarged explanatory diagram of an optical automatic detection mechanism.

In this embodiment, an optical automatic detection mechanism 3 having a camera 4 and a light source 5 is provided on a head plate 2a of a test head 2 of a semiconductor inspection device 1 (not shown in its entirety), and the optical automatic detection mechanism 3 is connected to a tape carrier. The device to be measured 6 is placed at a horizontal position in the transport direction of the device 7 to be measured.

This optical automatic detection mechanism 3 directs a light beam parallel to the device to be measured 7 from a light source 5 such as a halogen lamp toward the device to be measured 7 which is conveyed by a tape carrier 6 and stopped at a measurement position A. -14 to condensing lens 16
lens 1 through mirrors 9, 10 and prism 8.
1 to irradiate the device under test 7. Then, after converting the reflected light that has illuminated a pattern such as a pad pattern or a target pattern on the device under test 7 into parallel light using a lens 11, an image of the pad pattern or target pattern is transmitted to a camera 4 through a prism 8 and a half mirror 9. to form an image. By correcting and driving the X and Y stages 13 based on the pattern position data captured by the camera 4, the device under test 7 is aligned in the X and Y directions, and the needle tip 12a of the probe card 12 and the target device are aligned. The pads of the measuring device 7 can be aligned accurately and automatically. Note that the optical automatic detection mechanism 3 needs to have a structure that does not interfere with the measuring line arranged around the probe card 12, but in the case of this mechanism, the illumination beam 3 is converted into a light beam by the condensing lens 11. and U6 can be set to several mφ. Furthermore, as will be explained next, it has the feature that it can be easily slid and driven due to its structure.

However, the mechanism of the present invention is not limited to what is shown in the drawings, and other structures may also be used.

Furthermore, the optical automatic detection mechanism 3 in this embodiment is configured to be able to slide and move by a drive mechanism (not shown) while maintaining the horizontal position of the tape carrier 6 in the conveying direction of the device under test 7. . This is the measurement position A
After positioning the needle 12 of the probe card to the first device to be measured 7 using the microscope 15
This is to avoid affecting the needle alignment using the microscope, by moving the optical automatic detection mechanism 3 so that its end comes to position B in the figure, for example, when aligning the pointer a. At that time, the device under test 7 and the needle 12a of the probe card can be sufficiently seen in the field of view of the microscope, as shown in FIG. 1(b).

Further, the shutter mechanism 14 of the optical automatic detection bag M3 is configured to open during positioning and close during measurement. However, if an LED light source or the like is used as the light source 5,
Considering its durability, the shutter mechanism 14 is excluded, and the LE
A method of opening and closing the D drive may also be used.

Note that 17 in the figure indicates a ring insert of a probe card in a semiconductor testing device, which is not shown in its entirety.

The specific positioning in the above embodiment is as follows: First, the tape carrier 6 is stopped so that the device under test 7 is at position A in the figure, and an image of a pattern such as a pad pattern or a target pattern of the device under test 7 at position A is imaged. is photographed by the camera 4 of the optical automatic detection mechanism 3, and then the measurement position is automatically aligned in the X and Y directions based on the photographed data, and the specific pattern of the device under test 7 is set at the position A. Ru. Next, the optical automatic detection device 3 is retracted to position B, and the needle 12a of the reprobe card and the pad of the device under test 7 are manually aligned using the microscope 15. The correction amounts of the X and Y stages 13 at this time are stored in the controller section of the inspection apparatus 1. Then, the optical automatic detection device 3 is set to the position A again, and blobbing is started. In this case, by automatically detecting the specific pattern of the device under test 7 by the above operation for each device under test 7, and adding the correction amounts of x and Y,
Automatically adjusts the needle. In this way, accurate positioning of each device under test 7 on the tape is possible. What is very important here is that the optical automatic detection device 3 is slid, and in implementation, the structure must ensure repeatable positional accuracy at that time.

FIG. 2 is a schematic diagram of main parts showing another embodiment of the present invention, which has almost the same structure as the above embodiment, but differs in positioning means. That is, in this example, first, position C in the figure (located on the way to measurement position A)
, an image of the pad pattern or target pattern on the device under test 7 is captured on the camera 4, and then based on the data, the tape carrier 6 (of course the device under test 7) is moved on the conveyance path, and based on the captured data, Position the tape carrier 6 at measurement position A'.
is stopped and the device under test 7 is probed. Taking pictures with camera 4 at a position during transportation in this way is as follows:
This is to avoid obstructing the field of view of the microscope 15, and the automatic optical detection mechanism 3 for this purpose does not require a slide mechanism. However, it is necessary to increase the precision of the stage 13 for driving the stroke from the C position to the A position, and the structure of the tape carrier 6 does not allow the stage 13 to accurately drive a long stroke while holding the tape. There must be.

Next, the effects of each of the above embodiments will be explained.

According to the first embodiment, the optical automatic detection mechanism 3 includes the camera 4 and the light source 5 that can move the pattern such as the pad pattern or target pattern of the device under test 7 on the tape carrier at the measurement position A with high precision. Based on this data, the XY direction positioning of the device under test 7 at the measurement position is automatically performed. Since optical means are used, the detection accuracy is extremely high, and since the tape carrier 6 can be placed on a high-precision stage, the tape carrier 6 or the device under test 7 will not be damaged. There is no drop in positioning accuracy. In addition, since the pattern for needle alignment is directly detected at the 8111 fixed position, positional errors due to the material of the tape do not affect the pattern. In addition, since the optical automatic detection mechanism 3 is movable, the field of view of the microscope 15 is not obstructed at the measurement position, and initial needle alignment can be performed smoothly.

In the second embodiment, since the optical automatic detection mechanism 3 is set at the retracted position C without moving, the field of view of the microscope 15 at the measurement position A is not obstructed, and other effects are not affected. This is almost the same as the first embodiment described above.

”-In each of the embodiments described above, the present invention is applied to a tape carrier type semiconductor inspection device, but it goes without saying that the present invention can also be implemented in a semiconductor inspection device such as a wafer properr. It can be applied to all of the above.

As is clear from the above description, the present invention provides a semiconductor inspection apparatus in which a microscope is disposed at a measurement position of a device under test.

The optical automatic detection mechanism enables extremely high precision positioning of the device to be measured at the measurement position, and is fully compatible with micro pads for multiple pins. Furthermore, during positioning, the field of view of the microscope disposed at the measurement position is not affected at all, so positioning can be performed smoothly. Furthermore, the present invention has the advantage that it is possible to automatically and accurately position devices to be measured in accordance with manufacturing equipment and inspection equipment in the assembly process of wafers, semiconductor substrates, and semiconductors that require positioning of each device.

[Brief explanation of the drawing]

FIG. 1 shows an embodiment in which the positioning mechanism of the present invention is used in a tape carrier type semiconductor inspection device.
a) is a schematic diagram of main parts showing the positioning state at measurement position A;
Figure (b) is a partial plan view showing the state in which the optical automatic detection mechanism has been slid to position B, and Figure (c) is Figure (a).
2 is an enlarged explanatory view of the optical automatic detection mechanism shown in FIG. 2, a schematic view of the main part showing another embodiment of the present invention, and FIG. FIG. 3 is a schematic perspective view of the mechanism. 1... Semiconductor inspection equipment 2 3... Optical automatic detection mechanism 4... Camera 6... Tape carrier 8... Prism 11.16... Condensing lens 15. ... Microscope B, C ... Retreat position a ... Head plate 5 ... Light source 7 ... Device under test 9.10 ... Mirror 13 ... X, Y stage A...Measurement position Figure 1 (a) Figure 1 (b) Figure 1 (C) Figure 2 Figure 3

Claims (2)

[Claims] (1) Semiconductor inspection equipment with a microscope installed at the measurement position of the device under test, equipped with an optical automatic detection mechanism with a highly precisely movable camera and light source, A semiconductor inspection device configured to automatically detect a pattern and automatically perform needle alignment of a contacting probe card at high speed based on the detected data. (2) The semiconductor inspection apparatus according to claim 1, wherein the optical automatic detection mechanism is movable in the X and Y directions.