JPS63204153A - Probe - Google Patents

Abstract

PURPOSE:To provide a probe which facilitates adjustment of a needle while enabling miniaturization of the apparatus as a whole, by performing a needle adjustment and alignment at the same location. CONSTITUTION:In the alignment, the focus of an ITV camera 11 is switched over to the wafer 1 side with a proper interval kept between a wafer 1 and a probe needle 4 and after an automatic focus adjustment by a Z-way fine adjustment of a measuring stage 2, a normal alignment regulation of a wafer is performed using an output signal of the ITV camera 11. After the wafer alignment regulation, the focus of the ITV camera 11 is switched over to the side of the probe needle 4 and lifting the wafer 1, a pad of the wafer 1 is positioned with the tip of the probe needle 4 using an output signal of the ITV camera 11. This facilitates the needle adjustment monitoring with a monitor section 13 without moving the wafer after the alignment.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a probe device for inspecting the electrical characteristics of chips formed on a wafer, and particularly relates to a probe device for inspecting the electrical characteristics of chips formed on a wafer, and particularly relates to a probe device for testing the electrical characteristics of chips formed on a wafer. This invention relates to a probe device that performs bonding and wafer alignment at the same location.

[Prior Art] =1- In general, a probe device moves the wafer 1 in the X and Y directions within the probing area 100 as shown in FIG. The electrical characteristics of the chip are measured by contacting the probe needle of the pad 10a. Prior to this measurement, the wafer 1 transported from the transport section 101 is placed on the alignment stage 102 so that the chip arrangement and the XY axes match. It is adjusted to 0 so that

The alignment stage 102 is generally provided at a position close to the probing area 100, for example in front, and automatically performs θ adjustment using a laser scanning method or a pattern recognition method using a TV camera.

[Problems to be Solved by the Invention] However, in such conventional probe devices, the operator must be skilled in the operation, as the tip pad and the probe needle are aligned while looking at the microscope. It was a heavy burden on people. Furthermore, since the alignment station is provided separately from the blobbing area, the overall size of the device increases, and after alignment,
Because needle alignment was performed after moving the wafer to the center of the blobbing area, precision in movement was also required.

This invention solves these conventional problems and allows needle setting and alignment to be performed at the same location.
It is an object of the present invention to provide a probe device that allows easy needle alignment and miniaturization of the entire device.

[Means for Solving the Problems] In order to achieve the above object, the probe device of the present invention is provided with an alignment imaging section above the probe card portion of the probe device, and an imaging section for alignment under the probe card section. It is equipped with an illumination means for illuminating the object to be measured, and the imaging unit images a fixed position on the wafer when aligning the wafer, and images the tip of the probe needle when aligning the wafer and the probe needle. It is characterized by

[Function] The above-mentioned alignment mechanism, implant imaging section, and illumination means substantially constitute an alignment mechanism, and by providing these in the blow pink area, alignment can be performed at the same location as the needle alignment location, Moreover, by switching the focal length of the camera of the image pickup section, the same camera can be used for both alignment 1 and needle alignment, and button alignment can be easily performed through a part of the monitor connected to the camera.

[Example code] Next, embodiments of the present invention will be described based on the drawings.

In FIG. 1, a semiconductor wafer 1, which is an object to be measured, is placed on a measurement stage 2, and can be moved in the XYZ directions within the blobbing area. A probe card 5 equipped with a probe needle 4 is attached to a hend plate 3 (probe card portion 3') located approximately at the center of the blobbing area. Above this probe card section is an alignment optical system 1.
1 and an Ii''V camera 12 as an imaging unit.The alignment optical system 11 is a known lens used in the alignment member 1-, and the optical system of a microscope conventionally installed above the probe card 5 can be used. You can also do it.

When a microscope optical system is used as the alignment optical system 11, the ITV camera 12 is directly attached to the microscope. The JTV camera 12 can change its focal length to either the probe needle 4 or the wafer 1 on the measurement stage 2, and the captured image is displayed on a monitor part 13. Further, an optical fiber 7 is embedded in the head plate 3 as an illumination means for illuminating the wafer 1.

One end of the optical fiber 7 is connected to a light source 8, and an illumination lens 9 is attached to one end on the illumination side. A plurality of optical fibers 7 are provided as necessary. The illumination lens 9 is installed so that light is irradiated almost parallel to the surface of the wafer 1.

In the above configuration, first, during alignment, the wafer 1 and probe needle 4 are spaced at an appropriate distance (usually 1.5 to 4 mm).
Switch the focus of the ego camera 11 to the wafer 1 side while maintaining the wafer position (approximately This is done using the output signal.

Wafer alignment adjustment is performed, for example, as follows. The output signal of the reference signal such as the scribe line of the ITV camera 11 is binarized and then temporarily stored in the memory. This stored signal and a standard signal stored in advance are read and compared. Through this comparison, the ``9'' amount is detected, and the wafer alignment is automatically adjusted by moving the wafer mounting table of the measurement stage 2 relatively by the amount of deviation so that this amount of deviation becomes zero. complete.

After completing the wafer alignment adjustment, the ITV camera 11
The focus is switched to the probe needle 4 side, and without raising the wafer 1, the pad of the wafer 1 and the tip of the probe needle 4 are aligned using the output signal of the ITV camera 11. For example, the tip of the probe needle 4 is imaged with an ITV camera 11, the output signal of this camera 11 is binarized, and compared with a pre-stored electrode pad arrangement signal to calculate the "deviation amount". The wafer 1 and the probe needles 4 are moved relative to each other so as to compensate for the amount of deviation, and adjustments are made so that each probe needle 4 contacts each electrode pad. Such adjustment allows accurate alignment of all chips within the wafer 1.

Note that in this embodiment, the end of the optical fiber 7 serving as the illumination means is arranged on the side of the wafer 1;
The illumination means is not limited to this embodiment; for example, as shown in FIG. 2, the end of the optical fiber 7 and the lens 9 may be embedded in the probe card 5 to illuminate the wafer 1 from above.

[Effects of the Invention] As is clear from the above explanation, according to the present invention, alignment can be performed in the blobbing area, so needle alignment for blow pink can be performed without moving the wafer after alignment. Moreover, there is no need to provide a separate space for alignment, and the entire device can be made smaller. Furthermore, since the focus of the ITV camera for alignment is switchable and used for alignment with the probe needle, it is possible to easily align the wire while monitoring on a part of the monitor.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing one embodiment of the probe device of the present invention, FIG. 2 is a diagram showing another embodiment of FIG. 1, FIG. 3 is a diagram showing a conventional probe device, and FIG. 4 is a diagram showing a wafer FIG. ■...Wafer 2...Measurement stage 3...Head plate 3'...Probe card section 4...Probe needle 5...Probe card 7...Optical fiber 8...Light source 9...Illumination lens 11...Alignment optical system 12 ... fTV camera 13 ... Part of the monitor Agent Patent attorney Moritani-O Figure 2 Figure 3 Figure 4

Claims (1)

[Claims] an alignment imaging section facing and above the probe card section of the probe device, and an illumination means for illuminating the object to be measured under the probe card,
The probe apparatus is characterized in that the imaging section images a fixed position on the wafer when aligning the wafer, and images the tip of the probe needle when aligning the wafer and the probe needle.