JPH0719198Y2 - Chip-shaped electronic component mounting device template - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a template in which an accommodating recess for receiving the chip-shaped electronic component is arranged in an apparatus for mounting the chip-shaped electronic component on a substrate.

[Prior Art] Conventionally, when a chip-shaped electronic component is mounted at a predetermined position on a circuit board, it has been performed as follows using an automatic mounting device. That is, the chip-shaped electronic components stored in bulk in a plurality of containers are taken out one by one into a plurality of guide tubes arranged in a distributor, and are respectively stored in storage recesses formed at predetermined positions of the template. Send and receive there. The storage recess is arranged in accordance with the position where each chip-shaped electronic component is mounted on the circuit board. Then, by the component moving means having the suction unit, the chip-shaped electronic component stored in the storage recess is moved and mounted on the circuit board while holding the relative position when stored. As a result, each of the chip-shaped electronic components is mounted at a predetermined position on the circuit board.

An adhesive is applied in advance to the position where the chip-shaped electronic component is to be mounted on the circuit board, and the mounted electronic component is soldered while the electronic component is temporarily fixed.

The chip-shaped electronic component is conveyed by the distributor through a flexible guide tube. In this case, in the conventional apparatus, a suction hole is opened at the bottom of the storage recess of the template, and the template By maintaining a negative pressure on the back side, a flow of air that escapes from the guide tube to the back side of the template via the storage recess is formed, and this air flow forces the chip-shaped electronic components from the guide tube to the storage recess. Is being done. As a result, the chip-shaped electronic component a is reliably received in the storage recess, and the chip-shaped electronic component a is surely laid down in the storage recess.

[Problems to be solved by the invention] After the chip-shaped electronic component is received in the storage recess of the template, the template is pulled out from under the distributor and moved to the suction head side. Is released and returned to atmospheric pressure. At this time, since the pressure on the lower surface side of the template is temporarily higher than that on the upper surface side, air flows into the storage recess from the suction hole at the bottom of the storage recess. Therefore, the chip-shaped electronic component housed in the storage recess and lying down may stand up in the storage recess due to the wind blowing from the bottom of the storage recess.

In this way, if the chip-shaped electronic component stands up in the storage recess of the template, the suction head cannot securely suck it. Even if it can be sucked, it cannot be correctly mounted on the circuit board. .

SUMMARY OF THE INVENTION An object of the present invention is to provide a chip-shaped electronic component distribution device capable of reliably receiving a chip-shaped electronic component in the storage recess of a template in a lying posture.

[Means for Solving the Problems] That is, in order to achieve the above-mentioned object, the present invention accommodates the chip-shaped electronic component a on a substrate at a position corresponding to the position where the chip-shaped electronic component a is to be received. 61, 61
Is disposed on the base board 60, and the storage recesses 61, 61
In the template, a suction hole 63 for sucking the chip-shaped electronic component a is formed in the bottom of the base board 60, and an air vent hole 64 formed in a portion of the base board 60 where the storage recesses 61, 61 ... When the lower surface side of the board 60 has a negative pressure, the air vent hole 64 is closed, and when the negative pressure is released, the air vent hole 64
To provide a template for a chip-shaped electronic component mounting device, which has a shielding member 65 for opening 64.

[Operation] In the template for mounting the chip-shaped electronic component according to the present invention, the air vent hole 64 formed in the base board 60 is provided.
And the shielding member 65 that opens the air vent hole 64 when the negative pressure on the lower surface side of the base board 60 is released, the negative pressure state on the rear surface side of the template 6 is released, and the atmospheric pressure on the rear surface side is changed to the upper surface. When the height of the base board 60 is higher than that of the base board 60, air escapes from the lower surface side of the base board 60 to the upper surface side through the air vent hole 64. This makes it possible to minimize the air that escapes from the lower surface side to the upper surface side of the base board 60 through the suction holes 63 at the bottom of the storage recess 61 that stores the chip-shaped electronic component a. Therefore, the chip-shaped electronic component a that has been received and fallen in the storage recess 61 does not stand up and the tilted posture is maintained.

Then, the shielding member 65 closes the air vent hole 64 when the lower surface side of the base board 60 is maintained at a negative pressure, so that air leakage at this time is prevented. Therefore, the lower surface side of the base board 60 can be surely applied with a negative pressure to surely convey the chip-shaped electronic component a to the storage recess 61, receive it, and lay it down.

[Embodiment] Next, an embodiment of the present invention will be specifically described with reference to the drawings.

FIG. 3 shows an outline of the entire mounting device for a chip-shaped electronic component to which the present invention is applied. That is, a plurality of containers 1 in which chip-shaped electronic components are stored in bulk are arranged,
A delivery section 11 which is an escapement is connected to this through a tube 10 (see FIG. 2). Further, the distributor 2 is arranged below the sending unit 11.

As shown in FIG. 2, this distributor 2
It has a fixed frame 23 fixed below the delivery section 11, and a movable frame 22 arranged in parallel therebelow and on which the template 6 is removably attached, the fixed frame 23 and the movable frame. 22 is connected to each other at four corners by four linear members 31, 31 ... Having the same flexibility.

As shown in FIG. 2 and FIG. 3, a vibrator 24 that gives vibration to the movable frame 22 is connected, so that the movable frame 22 is horizontally vibrated. Vibration is orthogonal to each other 2
It is desirable that each direction is given independently.

Further, a flexible guide tube 2 that guides and conveys the chip-shaped electronic component between the fixed frame 23 and the movable frame 22.
1, 21 ... are piped. These guide tubes 21, 21 ...
Is laid so as to connect the component discharge port of the delivery section 11 and the through holes 25 (see FIG. 1) formed at the respective positions of the movable frame 22. The through-hole 25 is formed at the position where the chip-shaped electronic component is to be mounted on the wiring board, and the position of the through-hole 25 corresponds to the storage recess 61 of the template 6.

As shown in FIGS. 1 and 2, the movable frame 22
A template 6 provided with a storage recess 61 in accordance with the mounting position of the chip-shaped electronic component on the circuit board is inserted and fixed underneath. This state is shown in FIG. 2, and at this time, as shown in FIG. 1, the through hole 25 of the movable frame 22 communicating with the lower end of the front guide tube 21 is located above each storage recess 61 of the template 6. It is arranged.

As shown in FIG. 1, in the illustrated template 6, a container-shaped member having an upper opening is fixed on a base board 60, and a storage recess 61 is formed therein. Then, a suction hole 63 is opened at the bottom of the storage recess 61. In addition,
The storage recess 61 can also be formed by directly providing a recess in the base board 60 without using the above-mentioned container.

In addition, an air vent hole 64 is opened in the base board 60 so as to avoid the position of the storage recess 61. In the illustrated embodiment, a shielding member 65 that prevents light from vertically escaping from the air vent hole 64 is attached to the air vent hole 64. The shielding member 65 has an appropriate elasticity, and as will be described later, when the lower surface side of the template 6 is maintained at a negative pressure by the vacuum case 4, as shown by a chain double-dashed line in FIG. The air vent hole 64 is closed by the back pressure generated by the negative pressure. On the other hand, when the negative pressure on the lower surface side of the template 6 is released, the template 6 is restored by its own elasticity and the air vent hole 64 is opened. Therefore, only when it is necessary to bleed air from the lower surface side of the template 6 to the upper surface side of the template 6 through the air bleeding hole 64, the air bleed hole is formed.
When opening 64 and making the lower surface side of the template 6 negative pressure, the air vent hole 64 is closed. The air vents 64 and the shielding members 65 are distributed evenly on the base board 60 and arranged in appropriate numbers.

As shown in FIG. 2, when the template 6 is inserted under the pattern base 3, the vacuum case 4 is put under the template 6 to guide the container 1 from the guide tube 21, the storage recess 61 and the decompression chamber 41 ( A flow of air sucked from the intake duct 5 is formed via the air passage (see FIG. 1).

As shown in FIG. 3, a component transfer means for moving and mounting the chip-shaped electronic components stored in the storage recess 61 of the template 6 onto the circuit board 9 is provided. Is usually connected via a duct 81 to a suction pump (not shown), and a suction unit 8 of the type that sucks and holds electronic components from the storage recess 61 is used. For example, on the lower surface of the suction unit 8, the template 6
Suction heads (not shown) are provided so as to correspond to the positions of the upper storage recesses 61, 61, ...

The circuit board 9 is carried by a carrying means such as the conveyor 7, is positioned immediately below the suction unit 8, is stopped, and is then sent.

A light source 10 and a light receiver 12 are vertically opposed between the distributor 2 and the conveyor 7 with a position where the template 6 passes being interposed therebetween. This is because the light from the light source 10 arranged under the template 6 is received by the light receiver 12 on the template 6 through the suction hole 63 formed in the bottom of the storage recess 61 of the template 6. , Storage recess
This is for detecting that the chip-shaped electronic component a is not stored in 61.

Explaining the mounting operation of electronic parts by this device,
First, the template 6 is inserted under the pattern base 3, and in this state, the chip-shaped electronic components discharged from the container 1 are released by the delivery section 11, and one is provided in each of the guide tubes 21, 21 ... Of the distributor 2. Are sent out one by one. The chip-shaped electronic components thus sent to the guide tubes 21, 21 ... Are forcedly conveyed downward by the air sucked from the vacuum case 4 side, and are received in the storage recess 61 of the template 6 as shown in FIG. It At this time, the vibrator 24 vibrates the movable frame 22. Due to this vibration and the flow of the air, the chip-shaped electronic component received in the storage recess 61 of the template 6 is stored in the storage recess 61.
It is defeated in 61 and arranged in a predetermined posture.

Then, when the suction by the vacuum case 4 is released, the air on the upper and lower surfaces of the template 6 flows through the air vent holes 64 formed in the template 6, and both sides quickly return to atmospheric pressure. After that, the template 6 is pulled out from under the movable frame 22, and as shown in FIG.
Between the light source 10 and the light receiver 12, the presence or absence of a so-called defective item due to the transmission of light through the suction hole 63 at the bottom of the storage recess 61 of the template 6 is inspected. At this time, by providing the shielding member 65 in the air vent hole 64, as shown by the arrow in FIG. 1, the flow of air is not obstructed, but the light that travels straight is blocked, which does not hinder the inspection. .

After that, the template 6 moves directly below the suction unit 8. Then, the suction unit 8 is placed on the template 6, and the suction head is inserted into each of the storage recesses 61 to suck and hold the chip-shaped electronic components therein. The suction unit 8 rises, and the chip-shaped electronic component sucked and held by the suction unit 8 is pulled up from the storage recess 61 of the template 6. At the same time, the template 6 retreats from under the suction unit 8 and returns to under the distributor 2. Then, the suction unit 8 moves down and moves onto the stopped circuit board 9, and the chip-shaped electronic component sucked and held is brought into contact with the circuit board 9 to release the suction state.

An adhesive is previously applied to each position on the circuit board 9 on which the chip-shaped electronic component is to be mounted, and the chip-shaped electronic component is bonded by the adhesive when the suction state of the suction head is released. Mounting on the circuit board is completed. After that, the circuit board 9 is sent to the next step by the conveyor 7, and the chip-shaped electronic components are soldered to the electrodes formed on the circuit board 9.

[Effects of the Invention] As described above, according to the present invention, when the negative pressure state on the lower surface side of the template 6 is released, air is released from the lower surface side of the template 6 to the upper surface side, so that the storage recess 61 is stored. It is possible to store the chip-shaped electronic component a in the storage recess in a correct posture without the stored chip-shaped electronic component a rising. Further, when the lower pressure side of the template 6 is set to a negative pressure, it is possible to surely set the negative pressure. Therefore, also in this respect, the chip-shaped electronic component a can be reliably conveyed to the storage recess 61, received, and tilted. it can.

[Brief description of drawings]

FIG. 1 is a vertical sectional side view of essential parts of a template according to an embodiment of the present invention, FIG. 2 is a side view of essential parts showing a chip-shaped electronic component mounting apparatus, and FIG. 3 is the same chip-shaped electronic component mounting apparatus. It is a schematic perspective view showing. 1 ... Container, 2 ... Distributor, 6 ... Template, 11 ... Delivery unit, 21 ... Guide tube, 60 ... Base board, 61 ... Template storage recess, 63 ... Suction bottom of storage recess Hole, 64 ... Air vent hole, 65 ... Shielding member, a ... Chip-shaped electronic component

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Yutaka Nagai Yutaka Nagai 6-16-20 Ueno Taito-ku, Tokyo Within Taiyo Denki Co., Ltd. (56) Reference JP-A 1-278098 (JP, A) 62-151030 (JP, U)

Claims (1)

[Scope of utility model registration request] 1. A storage recess (61) for receiving the chip-shaped electronic component (a) on a base board (60) at a position where the chip-shaped electronic component (a) is to be mounted on a substrate.
(61) is formed, and a template is provided with a suction hole (63) for sucking the chip-shaped electronic component a at the bottom of the storage recesses (61), (61). The air vent hole (64) opened in a portion where the storage recesses (61), (61) ... Are not arranged, and the air vent hole (64) is closed when the lower surface side of the base board (60) is under negative pressure, Shielding member (65) that opens the air vent hole (64) when the pressure is released
A template for a chip-shaped electronic component mounting device, comprising: