JP2003275688A - Component inspection method, component feeder and component inspection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component inspection method capable of eliminating the blocking of chip components to stably perform the visual examination of the chip components without damaging the chip components, and an apparatus therefor. <P>SOLUTION: An inspection component sent linearly by a straight feeder 6 is taken in a non-vibration trough 7 and successively sucked and, held on the undersurface of a rotary disc 13 rotated around a vertical axis or an inclined axis inclined from the vertical axis by a predetermined angle to be rotated. When the inspection component stands by on the non-vibration trough 7, the surface of the inspection component is photographed by downwardly arranged cameras 9 and 10 and, at the point of time when the inspection component sucked to the rotary disc 13 to be intermittently rotated is stopped in a moment, the back surface of the inspection component can be photographed by the upwardly arranged cameras 18 and 19. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component inspection method, a component transfer device, and a component inspection device for visually inspecting minute components such as chip components.

[0002]

2. Description of the Related Art Conventionally, electronic parts have been mounted in high density in electronic equipment in the fields of information communication and digital AV (audiovisual), and miniaturization of chip parts such as resistors, capacitors and inductors has been advanced. There is.

Since this type of chip component is mass-produced, there is a demand for an inspection device capable of performing a visual inspection at high speed in accordance with the production pace.

In such a visual inspection, usually, a linear feeder is used to convey the chip parts in a line, and each surface of the chip parts is photographed using a CCD camera.
High-speed image processing is performed to select good products and defective products.

Further, when photographing, the photographing is mainly performed on the upper surface, the lower surface and both side surfaces of the chip component.

In the component inspection apparatus described in Japanese Patent Laid-Open No. 2000-028578, a vertical index serving as a sorting device, that is, a disk-shaped rotating body having a large number of chip component storage holes on its circumference and rotating around a horizontal axis. 12 is provided, and when the chip components are sucked and taken into the vertical index 12, each surface of the flying chip components is photographed by four CCD cameras 10.

Each CCD camera 10 is arranged between the linear feeder and the vertical index 12 in a direction orthogonal to the flight path of the chip parts.
The D camera 10 must avoid interference with the vertical index 12, and the vertical index 12 and the CCD camera 1
If 0 is separated, the distance between the linear feeder and the vertical index 12 is inevitably increased.

Therefore, a suction device 8 having a suction nozzle 7 is provided to connect the linear feeder and the vertical index 12, and the chip component is guided to the vertical index 12 by a suction force.

[0009]

However, in the structure in which the chip component is sucked through the suction device 8 described above,
The chip component may be blocked in the suction nozzle due to the dimensional accuracy of the suction nozzle 7 or the dimensional error of the chip component.

Further, in order to suck the chip components at the distant position through the suction nozzle 7, it is necessary to increase the suction force to some extent. Then, when the chip components are sucked into the chip component accommodating holes of the vertical index 12, Impact may be applied to the chip component, which may damage the product.

Further, when the suction nozzle 7 is long, the suction speed tends to vary, and when the flying chip component is photographed by the CCD camera, a positional deviation occurs in the flying direction. In such a case, the positional deviation must be corrected in the image processing, which hinders high-speed image processing.

The present invention has been made in consideration of the above-mentioned problems in the conventional component inspection apparatus, and it is possible to eliminate blockage of chip components and to perform a visual inspection stably without damaging a product. A component inspection method, a component transfer device, and a component inspection device capable of performing

[0013]

SUMMARY OF THE INVENTION A parts inspection method according to the present invention is a rotation for intermittently rotating an inspection part sent through a conveying path about a vertical axis or an inclined axis inclined by a predetermined angle from the vertical axis. Suction and rotate the lower surface of the board one by one, and when the inspection part is on standby on the transport path, the front side surface of the inspection part is photographed by the camera placed downward, and the lower surface of the turntable is sucked and rotated. The gist is to photograph the back side of the inspection part by the camera arranged upward when the inspection part stops during the rotation.

According to the present invention, the front side surface of the inspection part is photographed while the inspection part is stopped waiting for it to be adsorbed to the rotating disk, and the back side is adsorbed to the rotating disk and intermittently. The picture is taken between the spinning rotations. Since the inspection parts are imaged while being supported on the transport path and adsorbed on the rotating disk, stable imaging is possible.

The component transporting apparatus of the present invention comprises a straight feeder for vibrating and linearly transferring inspection components, a vibration-free trough arranged in front of the straight feeder and an inspection on the vibration-free trough. Suction means for individually sucking the components and moving them to the standby position, and a turntable disposed in proximity to and above the vibration-free trough and intermittently rotating about the vertical axis or an inclined axis inclined by a predetermined angle from the vertical axis. When,
The gist of the present invention is to include a suction portion arranged on the outer peripheral portion of the rotating disk to adsorb the inspection component at the standby position to the lower surface of the outer peripheral portion.

According to the present invention, since the rotary disk is rotated around the vertical axis or the tilt axis and the inspection parts are sucked onto the lower surface of the rotary disk, the parts are provided in the space above and below the rotary disk. An inspection camera can be arranged. As a result, unlike the conventional configuration, there is no need to arrange a camera between the straight feeder and the vertical index, so a suction nozzle that connects the straight feeder and the vertical index is not required, and high suction force is not required. The inspection component can be moved to the standby position of the vibration-free trough. As a result, the inspection part can be transported without damage.

In the above component transporting apparatus, if the suction portion is provided with a concave portion capable of holding the inspection component in a positioned state, the inspection component can be stably retained during rotation.

The component inspection apparatus of the present invention comprises a component transfer apparatus having the above-mentioned structure, an upper camera arranged downward above the vibration-free trough to photograph the front side surface of the inspection component, and arranged upward below the turntable for inspection. A lower camera that shoots the back side of the part, an image processing unit that determines the quality of the product based on the image information taken by each camera, and the inspection part as a good product and a defective product based on the determination result of this image processing unit. The gist is that it is provided with a distribution unit that distributes to.

According to the present invention, when the inspection part is moved to the stand-by position of the vibration-free trough without being damaged and waits until it is adsorbed to the rotary disk, the inspection part table is displayed. The side surface is photographed, and the back side is photographed between the rotations of being adsorbed on the turntable and rotating intermittently. As a result, the inspection component is photographed in a stable state, so that the inspection accuracy can be improved.

In the above-mentioned component inspection apparatus, if a straight feeder and a vibration-free trough are provided with V-shaped grooves, and an adsorbing portion of the rotary disk is provided with an inverted V-shaped groove corresponding to the V-shaped groove, an inspection part composed of a hexahedron. Is slid along the V-shaped groove so that the upper surface and one side surface of the tilted inspection component face two upper cameras, and the inverted V-shaped groove causes the inclined inspection component to incline. The lower surface and the other side surface of the can be opposed to the two lower cameras. Thereby, four surfaces of the inspection part can be photographed.

In addition, the rotary disk that rotates around an inclined axis inclined by a predetermined angle from the vertical axis is formed in an inverted truncated cone shape, and a component suction portion is provided on the outer peripheral surface of the rotary disk. Further arranging a camera for photographing the end surface of the inspection component in at least one of the vertical direction in the movement path of the component makes it possible to photograph each of the six surfaces of the inspection component.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below based on the embodiments shown in the drawings.

FIG. 1 shows a rectangular chip resistor 1 as a specific example of the inspection component applied to the component inspection method of the present invention.

This rectangular chip resistor (hereinafter referred to as a chip component) 1 has an upper surface 1a, a lower surface 1b, one side surface 1c,
It is a hexahedron having the other side surface 1d, the front surface 1e and the rear surface 1f, and is composed of, for example, a minute component having a long side of 3.2 mm, a short side of 1.6 mm and a height of 0.8 mm. 1 g is formed.

FIG. 2 shows the overall structure of a component inspection device for inspecting the chip component 1.

In the figure, chip parts 1 are temporarily stored in a cylindrical hopper 2 and supplied to a parts feeder 3. Specifically, a fixed amount is supplied to the bowl 4 supported by the vibrator 3a.

A track that rises in a spiral shape is formed on the upper surface of the bowl 4 along its peripheral wall, and this track is slightly inclined toward the outer peripheral side. Therefore, when the vibrator 3a supporting the bowl 4 is vibrated,
The chip part 1 on the bowl 4 goes around the track,
During that time, the amount transferred is adjusted and the posture is adjusted.

The end of the track is connected to the trough 6 of the straight feeder 5, and when the vibrator 5a of the straight feeder 5 vibrates, the chip components 1 move in the direction of arrow A in a line on the trough 6. .

A V groove 6a (see FIG. 3) is formed in the trough 6 in the longitudinal direction, and the chip component 1 has the V groove 6a.
Move along a. At this time, by tilting the attitude of the chip component 1, two surfaces (front surface) of the upper surface 1a and the one side surface 1c are exposed and can be made to face a first CCD camera 9 and a second CCD camera 10 described later, respectively. .

FIG. 4 is an enlarged view of portion B in FIG.

In the figure, at the tip of the trough 6, a vibration-free trough 7 as a conveying path is arranged side by side with a gap. This vibration-free trough 7 has the same V as the trough 6.
A groove is formed, and at the end of the V groove, a chip component suction portion 8 having a suction port 8a as a suction means is provided.

The suction port 8a is for individually separating the chip portions 1 transferred to the non-vibration trough 7 by suction, and the diameter of the suction port 8a is the end surface 1e of the chip component 1. It is formed smaller than the area (see FIG. 1). Therefore, when the chip component 1 is sucked from the suction port 8a, the sucked chip component 1 comes into contact with the peripheral portion 8b of the suction port 8a and stops. This peripheral portion 8b
Functions as a stopper that stops the chip component 1 at the standby position. In the figure, 8c is a suction hose communicating with the suction port 8a, and the other side of this suction hose is connected to a switching valve and a vacuum pump (not shown).

Above the vibration-free trough 7, the first CCD camera 9 and the second CCD camera 1 are used as upper cameras.
0s are arranged in a V shape.

The first CCD camera 9 is on the extension line of the axis S ₁ orthogonal to the upper surface 1a of the chip component 1, and the second CCD camera 10 is on the extension line of the axis S ₂ orthogonal to one side surface 1c of the chip component 1. It is located in.

When the chip component 1 on the vibration-free trough 7 is sucked from the suction port 8a, the sucked chip component 1
And a next chip component 1 (between W ₄ and W _{5 in the} figure) has a gap. A light emitting portion 11a and a light receiving portion 11b of a photocoupler (hereinafter referred to as a passage sensor) 11 are arranged to face each other at a position where this gap is formed, and a signal is output when the light blocking object disappears.

Further, above the vibration-free trough 7, the outer peripheral portion 13b of the turntable 13 which rotates around the vertical axis passes.

As shown in FIG. 2, the turntable 13 is fixed to an output shaft 16a of a stepping motor 16 (see FIG. 4) via a bearing 14 and a coupling 15.

FIG. 5 (a) is an enlarged front view of the rotary disk 13 and FIG. 5 (b) is a bottom view thereof.

The turntable 13 includes a disc portion 13a and a skirt portion 1 extending downward from the outer peripheral portion of the disc portion 13a.
3b, and component suction portions 13c composed of inverted V-shaped grooves (recesses) are formed on the lower surface of this skirt portion 13b at equal intervals (40 equal portions in this embodiment).

Each component suction portion 13c is provided with a suction hole 13d, and this suction hole 13d is connected to a switching valve (not shown) and a vacuum pump through a suction passage 13e.

Therefore, each time the component suction portion 13c reaches the chip component 1 waiting on the vibration-free trough 7,
The chip component 1 is sucked into the component suction portion 13c through the suction hole 13d.
Adsorb to. The sucked chip component 1 is accommodated in the inverted V-shaped groove and has an inclined posture, and rotates in the direction of arrow C.

The rotating chip part 1 exposes the lower surface 1b and the other side surface 1d of two surfaces (back side surface) and is arranged in an inverted V shape as a third CCD camera 1 as a lower camera.
8 and the fourth CCD camera 19 (see FIG. 2), respectively.

Further, when the suction position on the turntable 13 rotating in the direction of arrow C in FIG.
A distribution device (distribution unit) 20 is arranged around 5 °.

The distribution device 20 is composed of a transparent resin block formed in a fan shape when viewed from above, and an arcuate groove 20a is formed on the upper surface thereof. The skirt portion 13b of the turntable 13 has a play and passes through the concave groove 20a.

The first discharge port 20b, the second discharge port 20c, and the third discharge port 20d are arranged in the groove 20a in the rotational direction.
Is provided.

The first discharge port 20b discharges the good chip component 1, the second discharge port 20c discharges the inspection error chip component 1, and the third discharge port 20d discharges the defective chip component 1. This is for discharging and when the chip component 1 remains in the turntable 13.

In the figure, E is toward the first outlet 20b, F is toward the second outlet 20c, and G is the third outlet 2.
The air blown toward 0d is shown, and the end surface 1e of the chip component 1 is blown with air having a pressure higher than the suction force for sucking the chip component 1 in the component suction portion 13c.
The chip component 1 is dropped into each discharge port. FIG. 7 is a block diagram showing a configuration for controlling the component inspection apparatus.

The chip component 1 transferred from the linear feeder 6 to the vibration-free trough 7 is sucked from the suction port 8a and stopped at the peripheral portion 8b of the suction port 8a.

At this time, a gap is generated between the next chip components 1 that have continuously moved on the vibration-free trough 7, and the passage sensor 11 outputs a signal.

The passage monitoring unit 30a uses the signal as a trigger and supplies it to the rotation control unit 16b. The rotation control unit 16b controls the stepping motor 16 to rotate the turntable 13 by one chip component housing hole.

When the rotation of the turntable 13 is stopped, the CCD camera control section 30b first outputs a photographing command to the first CCD camera 9 and the second CCD camera 10. In addition,
At this time, at the same time, the lighting device including the light emitting diode is caused to emit light. Thereby, the upper surface 1 of the chip component 1
a and one side surface 1c are photographed.

The photographed image information is stored in the image memory 30c together with the attraction section address information of the rotary disk 13. In addition, in this embodiment, since each suction part 13c divided into 40 equal parts is specified, No. Addresses 1 to 40 are given to each suction portion 13c.

Next, when the next chip component 1 moves within the suction range of the suction port 8a, the next chip component 1 moves to the suction port 8a.
It is sucked from a and stops at the peripheral portion 8b of the suction port 8a.
The subsequent process is the same as the process described above.

By repeating this process,
The top surface 1a and one end surface 1c of the chip part 1 are photographed.

The third CCD camera 18 and the fourth CCD camera 19 are on standby at a position where the turntable 13 is rotated by about 90 °, and the CCD camera control unit 30b outputs a photographing command to the cameras 18 and 19. To do. Thereby,
This time, the back surface 1b and the other side surface 1d of the chip component 1 are photographed.

The photographed image information is stored in the image memory 30c together with the suction part address information of the rotary disk 13. In the image memory 30c, the top image and the one side surface image of the chip part 1 photographed previously are stored in the suction part address. It is stored with information. Therefore, the back surface image and the other side surface image of the chip component 1 of this time are stored in the storage area of the suction portion address information that is the same as the previously stored suction portion address information.
As a result, the image information on the four surfaces of the inspection component 1 is completed.

It should be noted that the reference position of the turntable 13 can be recognized by a sensor (not shown), and the address of the suction portion 13c photographed by the CCD camera should count the number of suction portions 13c rotated from the reference position. Can be specified by.

When the four surfaces (upper surface, lower surface, both side surfaces) of the chip component 1 are photographed, the image information is sent to the quality determination section 30d.

The quality determination section 30d determines the image information P _{1 to} P _1.
4 is compared with the image information of the four surfaces of the non-defective chip component 1 stored in advance in the standard image memory 30e to determine whether the external appearance of the chip component 1 is good or bad, and the determination result is stored in the reference memory 30f. Remember.

In the table in the reference memory 30f, the address information No. indicating the address of the suction portion 13c of the rotary disk 13 is stored. 1 to
40 is set in advance and the determination results are sequentially stored in correspondence with the address information.

The distribution device 20 includes the discharge ports 20b to 20d.
The address information of the suction component 13c of the rotary disc 13 which is instantaneously stopped at is counted, and the reference memory 30f is referred every time the rotary disc 13 is instantaneously stopped, and the discharge is performed according to the inspection result stored in the reference memory 30f. Take action.

Specifically, when the non-defective chip component 1 reaches the first discharge port 20b, the solenoid valve 21b is opened, and the pressurized air from the compressor (not shown) is passed from the nozzle 22b to the inner peripheral end surface of the chip component 1. It is sprayed and collected in the collection box 23b.

The chip component 1 having the inspection error is the second discharge port 2
When it reaches 0c, the electromagnetic valve 21c is opened, and pressurized air is blown from the nozzle 22c to the chip component 1 in the same manner as described above, and the chip component 1 is recovered in the recovery box 23c.

The defective chip part 1 has the third discharge port 20d.
When it reaches, the solenoid valve 21d is opened, and the compressed air is blown from the nozzle 22d to the chip part 1 in the same manner as described above to collect the compressed air in the recovery box 23d.

If the chip component 1 remains in the rotary disk 13 and all of the chip component 1 in the rotary disk 13 needs to be discharged, the chip component 1 is discharged from the third discharge port 20d.

FIG. 8 shows that the suction distance of the chip component 1 is 5 to 20.
It is a graph which investigated the degree of impact which acts on chip part 1 when it changes to mm.

In the graph, the suction distance exceeds at least 15 mm because the chip component is sucked through the suction nozzle in the conventional configuration. Therefore, the degree of impact exceeds 10 MV. On the other hand, the configuration of the present invention does not require a suction nozzle, only slightly suctions the chip component 1 to move it to the standby position, and the suction distance can be suppressed to 5 mm or less. Therefore, it is possible to reduce the impact degree to 2 MV or less, which is ⅕ of the conventional level.

Further, as shown in FIG. 9, in the component inspection apparatus of the present invention, the continuous supply capacity can be increased from 20,000 to 100,000, and the component inspection processing efficiency can be greatly improved.

In the conventional structure in which the chip component is sucked through the suction nozzle, since the suction distance is long, the suction acceleration is large, so that the chip component hitting the stopper may bounce back and cross the passage sensor. The sensor detection was abnormal.

On the other hand, in this embodiment, since the suction nozzle of the conventional structure is eliminated and the suction distance is shortened to eliminate the rebound of the chip component, the sensor detection abnormality does not occur and the continuous supply capability can be improved. Became.

Further, FIG. 10 shows a configuration in which the turntable 50 is rotated about an inclination axis RA inclined by a predetermined angle θ ° (45 ° in this embodiment) from the vertical axis (vertical axis) VA. .

The turntable 50 is formed in the shape of an inverted truncated cone, and the chip component suction portion 50 having a V-shaped groove on the outer peripheral surface thereof.
a is formed. In addition, this chip component suction unit 50
a is formed in parallel with the chip component passage 7a on the vibration-free trough 7.

In this structure, the fifth CCD camera 51 is arranged below the first axis S ₃ orthogonal to the end surface 1e of the chip component 1, and the sixth CCD camera 51 is arranged above the second axis S ₄ which also passes through the end surface 1f. A CCD camera 52 is arranged.

When the turntable 50 is tilted and rotated in this manner, both end surfaces of the chip component 1 sucked by the chip component suction portion 50a can be vertically oriented during the rotation.

That is, in this embodiment in which the chip component 1 is directly attracted to the lower surface of the turntable 50, since there are no obstacles near the outer periphery of the turntable 50, CCDs for photographing both end surfaces of the chip component 1 are provided. If the camera is arranged so as to sandwich the turntable 50 from above and below, each of the six parts of the chip component 1
It becomes possible to take a picture of the surface.

FIG. 11 shows the external appearance of a parts inspection apparatus equipped with the rotating disk 50.

In the figure, the same components as those in FIG. 2 are designated by the same reference numerals and the description thereof will be omitted.

In FIG. 11, reference numeral 9 and 10 denote the rotary disk 5.
A first CCD camera and a second CCD camera arranged in a V shape above 0, and photographs the upper surface 1a and one side surface 1c of the chip part 1. 18 and 19 are turntables 50
Third CCD camera and fourth CCD arranged below
The camera is a lower surface 1b of the chip part 1 and the other side surface 1
Take a picture of d.

Reference numerals 51 and 52 are fifth Cs arranged substantially opposite to each other in the longitudinal direction of the chip component 1 adsorbed on the turntable 50.
A CD camera and a sixth CCD camera, which are adapted to photograph one end face 1e and the other end face 1f of the chip part 1.

In the present invention, a vertical index or a vertical axis is used instead of the conventional structure in which a vertical index serving as a turntable is rotated about a horizontal axis, and chip parts are sucked into a large number of chip part accommodating holes formed in the index. Rotating the turntable 50 around the tilt axis having a predetermined angle from
Since the chip component 1 is directly sucked onto the lower surface of the turntable 50, there is an advantage that an empty space can be secured in the vicinity of the turntable 50 as compared with the conventional configuration.

By using this empty space,
The number of CCD cameras is not limited to four, and more can be arranged. Therefore, it is possible to flexibly cope with the need to photograph each of the six surfaces of the chip component 1 without increasing the size of the device. Also, as long as space allows
It is also possible to add cameras and sensors (lasers, X-rays, etc.).

Furthermore, if the diameter of the turntable 50 is increased, it is possible to arrange six or more CCD cameras. For example, when the inspection information is insufficient for one surface of the chip component 1 with one camera, two or more cameras are arranged on that surface and different angles and types of illumination are applied. By performing the photographing in this manner, it becomes possible to inspect the defective defect of the chip component 1 in more detail.

[0083]

As is apparent from the above description,
According to the first aspect of the present invention, the front surface of the inspection component is photographed while the inspection component is stopped waiting for the adsorption to the rotating disc, and the rear surface is intermittently adsorbed to the rotating disc. It is photographed in the interval of rotation that rotates. As a result, the inspection parts are photographed while being supported by the transport path and being adsorbed on the rotating disk, which enables stable photography.

According to the second aspect of the present invention, since the rotary disk is rotated about the vertical axis or the tilt axis and the inspection parts are adsorbed on the lower surface of the rotary disk, the space above and below the rotary disk. A camera for inspecting parts can be placed in the space. As a result, unlike the conventional configuration, there is no need to arrange a camera between the straight feeder and the vertical index, so a suction nozzle that connects the straight feeder and the vertical index is not required, and high suction force is not required. The inspection component can be moved to the standby position of the vibration-free trough. As a result, the inspection part can be transported without damage.

According to the third aspect of the present invention, the inspection component can be held in the suction holding portion in a stable posture.

According to the fourth aspect of the present invention, by using the above-described component transfer device in which the turntable rotates about the vertical axis, the inspection component is moved to the standby position of the vibration-free trough without being damaged and rotated. The front side of the inspection part can be photographed while the inspection part is stopped waiting for it to be adsorbed to the board, and the back side can be taken between the rotations that are adsorbed to the rotating board and intermittently rotate. . As a result, the inspection part can be photographed in a stable state, and the inspection accuracy can be improved.

According to the fifth aspect of the present invention, in the above component inspection apparatus, the straight feeder and the vibration-free trough are provided with V-shaped grooves, and the suction portion of the rotary disk is provided with the inverted V-shaped grooves corresponding to the V-shaped grooves. Since the hexahedron inspection component is slid along the V-shaped groove, the upper surface and one side surface of the inclined inspection component are opposed to the two upper cameras, and the inverted V-shaped groove is formed. By sucking, the lower surface and the other side surface of the inclined inspection component can be opposed to the two lower cameras. Therefore, 4 of the inspection parts
The surface can be photographed. Further, the component inspection device can be made compact.

According to the sixth aspect of the present invention, the turntable which rotates about the tilt axis tilted by a predetermined angle from the vertical axis is formed in the shape of an inverted truncated cone, and the component suction portion is provided on the outer peripheral surface thereof. Since the camera for photographing the end face of the inspection component is further arranged in at least one of the up and down directions in the movement path of the inspection component sucked by the suction portion, each of the six faces of the inspection component can be photographed.

[Brief description of drawings]

FIG. 1 is a perspective view of a chip component applied to a component inspection method of the present invention.

FIG. 2 is an overall configuration diagram of a component inspection device according to the present invention.

FIG. 3 is an explanatory diagram showing a posture of a chip component moving on a straight feeder.

FIG. 4 is a perspective view of a main part for explaining an operation of adsorbing a chip component on a turntable.

FIG. 5A is a front view showing the configuration of a rotary disk, and FIG. 5B is a bottom view.

6 is an enlarged view of part D in FIG.

FIG. 7 is a block diagram for explaining control of the component inspection apparatus according to the present invention.

FIG. 8 is a graph comparing the degree of impact acting on the chip component of the present invention and the conventional chip component.

FIG. 9 is a graph comparing the continuous supply capabilities of the component inspection apparatus according to the present invention and that of the conventional configuration.

FIG. 10 is a side view showing another embodiment of the present invention, which has a partial cutout and shows a structure for rotating a turntable around an inclination axis.

FIG. 11 is a view corresponding to FIG. 2 showing a camera arrangement of a component inspection device for photographing 6 surfaces of chip components.

[Explanation of symbols]

1 chip parts 2 Cylindrical hopper 3 vibrators 4 bowls 5 straight feeder 6 troughs 7 Vibration-free trough 8 Chip parts suction block 8a Suction port 9 First CCD camera 10 Second CCD camera 11 Passage sensor 11a light emitting unit 11b Light receiving part 13 turntable 13c Parts suction part 13d suction hole 16 stepping motor 16b Rotation control unit 18 Third CCD camera 19 Fourth CCD camera 20 Sorting device 30 Image processing unit

Continued front page    F term (reference) 2F065 AA51 CC25 DD06 DD16 FF04                       GG07 JJ05 JJ26 MM03 MM04                       QQ24 QQ31 QQ38 TT02 TT03                 2G051 AA01 AA90 AB20 AC21 CA04                       CA07 DA01 DA08 DA13 EA12                       EA14                 3F072 AA14 GB07 GB10 GC04 GE01                       GE09 GF01 GG06 GG19 KC01                       KC07 KC14 KE11 KE13 KE18                 3F079 AD06 BA06 BA09 BA13 CA23                       CA41 CB30 CB33 CB35 CC03                       DA04 DA06 DA15

Claims (6)

[Claims] 1. An inspection component sent through a conveying path is sequentially attracted and rotated on a lower surface of a turntable which is intermittently rotated around a vertical axis or an inclined axis inclined by a predetermined angle from the vertical axis, When the inspection part is waiting on the transport path, the front side of the inspection part is photographed by the camera placed downward,
A method of inspecting a component, wherein a backside surface of the inspection component is photographed by a camera arranged upward when the inspection component that is attracted to the lower surface of the turntable and rotates stops between rotations. 2. A straight feeder that applies vibration to an inspection component and linearly transfers it, a non-vibration trough arranged in front of the straight feeder and an inspection component on the non-vibration trough, which are individually sucked. And a suction means for moving to a standby position, a rotating disk disposed close to and above the vibration-free trough, and rotating intermittently around the vertical axis or an inclined axis inclined by a predetermined angle from the vertical axis, A component transfer device, comprising: a suction portion arranged on the outer peripheral portion and sucking an inspection component at a standby position on a lower surface of the outer peripheral portion. 3. The component transfer device according to claim 2, wherein the suction portion is provided with a concave portion capable of holding the inspection component in a positioned state. 4. The component transfer device according to claim 2, an upper camera arranged downward above the vibration-free trough for photographing the front side surface of the inspection component, and an inspection component disposed upward below the turntable. The lower side camera that captures the back side of the product, the image processing unit that determines the quality of the product based on the image information captured by each camera, and the inspection result is determined to be a good product or a defective product. A parts inspection apparatus comprising: a distribution unit for distributing. 5. A V-shaped groove is provided in the straight feeder and the vibration-free trough, and the V-shaped groove is provided in the suction portion of the rotary disk.
By providing an inverted V-shaped groove corresponding to the V-shaped groove and sliding the hexahedron inspection part along the V-shaped groove, the upper surface and one side surface of the inclined inspection part face two upper cameras. The component inspection apparatus according to claim 4, wherein the lower surface and the other side surface of the inclined inspection component are opposed to the two lower cameras by adsorbing to the inverted V-shaped groove. 6. The rotary disk, which rotates about an inclined axis inclined by a predetermined angle from the vertical axis, is formed in an inverted truncated cone shape, and a component suction portion is provided on the outer peripheral surface thereof, and is sucked by the component suction portion. 6. The component inspection apparatus according to claim 5, further comprising a camera for taking an image of an end surface of the inspection component in at least one of the up and down directions in the movement path of the inspection component.