TWI780930B - Carrier-based semiconductor inspection apparatus and semiconductor classification inspection system thereof - Google Patents

Abstract

The present invention provides a carrier-based semiconductor inspection apparatus, which is used for inspecting a plurality of chips disposed on a chip carrier. The apparatus comprises a vacuum suction device, an image capture device, and an image analysis device. The vacuum suction device is located above the chip carrier for sucking the plurality of chips on the chip carrier, and moves the plurality of chips to a detection area. The image capturing device is located in the detection area for photographing the plurality of chips adsorbed on the vacuum suction device to obtain images of the plurality of chips. The image analysis device receives and analyzes the images of the plurality of chips to generate a detection result. Wherein, the suction range of the vacuum suction device is suitable for the size of the chip carrier, so as to suck all the plurality of chips on the chip carrier.

Description

Carrier-based semiconductor inspection equipment and its semiconductor classification inspection system

The invention provides a semiconductor testing device and its semiconductor classification and detection system, especially a semiconductor detection device based on a carrier disc and its semiconductor classification and detection system.

Automatic Optical Inspection (AOI) is a common representative method in industrial processes. The main method is to use a camera to capture the surface state of the object to be tested, and then use computer image processing technology to detect foreign objects or abnormal patterns, etc. Defects, thanks to the non-contact inspection, can be used to check semi-finished products during the production line. Based on the advantages of automatic optical identification system detection, it has been widely used in the visual inspection of circuit board assembly production lines in the electronics industry and replaced the previous manual visual inspection (Visual Inspection).

For a chip with a double-sided circuit, the quality of the chip will be affected by factors such as the cutting tool, the cutting method, and the material of the wafer film on the back and front of the chip after dicing. Defects such as contamination particles on the back will affect the production yield of the product. Therefore, it is necessary to inspect multiple sides of each wafer to ensure the quality of the product, and to give feedback on the quality status of wafer manufacturing in the production line, so as to facilitate the control of wafer quality and the adjustment of the manufacturing process.

The main object of the present invention is to provide a carrier-based semiconductor inspection equipment for inspecting a plurality of wafers on a wafer carrier. The semiconductor inspection equipment includes a vacuum adsorption device, an image capture device, and an image analysis device. The vacuum suction device is located above the wafer carrier, absorbs the plurality of wafers on the wafer carrier, and moves the plurality of wafers to the top of a detection area. The image capturing device is located in the detection area, and photographs the plurality of wafers adsorbed on the vacuum adsorption device to obtain images of the plurality of wafers. The image analysis device receives and analyzes the images of the plurality of wafers to generate a detection result. Wherein the suction range of the vacuum suction device is suitable for the size of the wafer carrier, so as to absorb all the plurality of wafers on the wafer carrier.

Another object of the present invention is to provide a carrier-based semiconductor inspection device for inspecting a plurality of wafers on a wafer carrier. The semiconductor inspection equipment includes a conveying device, a front inspection image capture device, a vacuum adsorption device, a back inspection image capture device, and an image analysis device. The conveying device is used for carrying and moving the wafer carrier along a detection path. The positive inspection image capture device is located above the conveying device, and photographs the plurality of wafers on the wafer carrier in a positive inspection detection area, so as to obtain front images of the plurality of wafers. The vacuum adsorption device is located above the conveying device, absorbs the plurality of wafers on the wafer carrier, and moves the plurality of wafers to above a back inspection detection area. The back inspection image capturing device is located in the back inspection detection area, and photographs the plurality of wafers adsorbed on the vacuum adsorption device to obtain back images of the plurality of wafers. The image analysis device receives and analyzes the front and back images of the plurality of wafers to generate a detection result. Wherein the suction range of the vacuum suction device is suitable for the size of the wafer carrier, so as to absorb all the plurality of wafers on the wafer carrier.

Another object of the present invention is to provide a carrier-based semiconductor classification and inspection system, which includes a conveying device, a front inspection image capture device, a vacuum adsorption device, a back inspection image capture device, and an image analysis device, and a wafer sorting device. The conveying device is used for carrying and moving the wafer carrier along a detection path. The positive inspection image capture device is located above the conveying device, and photographs the plurality of wafers on the wafer carrier in a positive inspection detection area, so as to obtain front images of the plurality of wafers. The vacuum adsorption device is located above the conveying device, absorbs the plurality of wafers on the wafer carrier, and moves the plurality of wafers to above a back inspection detection area. The back inspection image capturing device is located in the back inspection detection area, and photographs the plurality of wafers adsorbed on the vacuum adsorption device to obtain back images of the plurality of wafers. The image analysis device receives and analyzes the front and back images of the plurality of wafers to generate a detection result. The wafer sorting device is connected to the image analysis device to obtain the detection result, and sort the plurality of wafers on the wafer carrier according to the detection result. Wherein the suction range of the vacuum suction device is suitable for the size of the wafer carrier, so as to absorb all the plurality of wafers on the wafer carrier.

Therefore, the present invention can absorb multiple wafers at one time, and directly detect the backsides of multiple wafers at the same time through the image detection device, which solves the problem that the detection equipment in the past had to individually grasp the wafers on the carrier plate for back inspection, resulting in low detection efficiency. missing.

The detailed description and technical contents of the present invention are described as follows with respect to the accompanying drawings. Furthermore, for the convenience of explanation, the proportions of the drawings in the present invention are not necessarily drawn according to the actual scale, but are exaggerated. These drawings and their proportions are not intended to limit the scope of the present invention. The "one side" mentioned in the present invention can specifically be on the upper side, the lower side, the left side, the right side, the front side, the rear side of the object, or arbitrarily set at any position near the object, or directly Or indirectly connected to the object, etc., are not limited in the present invention.

The following describes a specific embodiment of the disc-based semiconductor inspection device of the present invention. Please refer to FIG. 1 , which is a schematic view of the appearance of the first embodiment of the present invention.

It is understandable that the actions of each device and equipment in the present invention can be coordinated by background equipment and individual processors, controllers, or computers of each device and equipment. The communication methods between these devices and equipment are not part of this The intended limited scope of the invention will not be repeated in the present invention. The aforementioned processor or controller can be connected or coupled to the storage device and execute the corresponding program through the storage device, and control the operation of the device and equipment according to the program. These processors, controllers, and computers may be or include, for example, a central processing unit (Central Processing Unit, CPU), or other programmable general-purpose or special-purpose microprocessors (Microprocessor), digital signal processors ( Digital Signal Processor, DSP), programmable controller, application specific integrated circuit (Application Specific Integrated Circuits, ASIC), programmable logic device (Programmable Logic Device, PLD), programmable logic controller (Programmable Logic Controller, PLC), or other similar devices or combinations of these devices, etc., are not limited in the present invention.

The present embodiment discloses a carrier-based semiconductor inspection device 100 for inspecting a plurality of chips CH on a wafer carrier 120 . The semiconductor inspection equipment 100 includes an equipment platform 110, at least one wafer carrier 120 provided on the equipment platform 110, a vacuum suction device 130 located above the wafer carrier 120, an image capture device 140 located in the inspection area IA, and connected to The image analysis device 150 of the image capture device 140 .

The equipment platform 110 is used to place the wafer carrier 120. The equipment platform 110 can be, for example, a fixed table, a conveyor belt, a jig, a linear carrier or any other device, which is not limited in the present invention.

The wafer carrier 120 is used to carry a plurality of wafers CH. A plurality of disposing slots 121 (as shown in FIG. 2 ) are disposed on the wafer carrier 120 for respectively disposing the wafers CH. The vacuum suction device 130 is located above the wafer carrier 120 , absorbs the plurality of wafers CH on the wafer carrier 120 , and moves the plurality of wafers CH to the inspection area IA. In one embodiment, the suction range of the vacuum suction device 130 is suitable for the size of the wafer carrier 120 , so as to adsorb all the plurality of chips CH on the wafer carrier 120 .

The image capture device 140 is located in the inspection area IA, and is used to capture images of the plurality of chips CH adsorbed on the vacuum adsorption device 130 . In one embodiment, the image capturing device 140 may be, for example, a line scan camera (Line Scan Camera) or an area scan camera (Area Scan Camera), which is not limited in the present invention. The position of the image capture device 140 configuration can be on any side of the platform 110; in one embodiment, the lens of the image capture device 140 is to shoot the wafer at an angle perpendicular to the surface of the wafer CH; in another embodiment Herein, the image capture device 140 may be configured to capture images of the chip CH obliquely, which is not limited in the present invention.

The image analysis device 150 is connected to the image capture device 140 for receiving and analyzing images of a plurality of chips CH to generate detection results. Specifically, the image analysis device 150 obtains the wafer image captured by the image capture device 140, marks possible defects in the wafer image, and classifies the wafers based on the defect or the type of defect, such as good product, defective product, and defective product. types etc. The image analysis device 150 may include, for example, a processor and a storage device configured with the processor. The processor accesses the program of the storage device to execute the image processing program, thereby automatically analyzing the defects of the image; the image processing program may be, for example, but not limited to There is no limitation in the present invention on machine learning network (Machine Learning), deep learning network (Deep Learning), or any other traditional image processing algorithms.

For one specific embodiment of the wafer carrier 120 , please refer to FIG. 2 , which is a schematic diagram of the appearance of the wafer carrier in the present invention. In this embodiment, the chip CH is rectangular, and the groove 121 corresponding to the configuration of the chip CH is designed as a rectangular groove body due to the shape of the chip CH; It can be square, circular, irregular or any other shape, and the shape of the groove 121 is not within the scope of the present invention. The size of the inner circumference of the opening of the groove 121 may be larger or slightly larger than the outer circumference of the chip CH, so as to accommodate the error when the chip CH is transferred.

For one specific embodiment of the vacuum adsorption device 130 , please refer to FIG. 3 , which is a schematic cross-sectional view of the vacuum adsorption device in the present invention. In this embodiment, the vacuum suction device 130 includes a vacuum suction unit 131 , a negative pressure provider 132 connected to the vacuum suction unit 131 , and a moving device 133 connected to the vacuum suction unit 131 . Negative pressure provider 132 provides negative pressure to generate suction force, vacuum adsorption unit 131 is connected to negative pressure provider 132, to adsorb a plurality of wafers CH, moving device 133 is connected to vacuum adsorption unit 131, to move vacuum adsorption unit 131; The suction range of the vacuum suction unit 131 is suitable for the size of the wafer carrier 120 , so as to adsorb all the plurality of wafers CH on the wafer carrier 120 .

Specifically, a vacuum adsorption chamber VC is provided inside the vacuum adsorption unit 131, and a negative pressure connection hole NH connected to the vacuum adsorption chamber VC is provided on the wall of the vacuum adsorption unit 131 for connecting to the negative pressure provider 132. to provide negative pressure. The surface of the vacuum adsorption unit 131 is covered with a plurality of capillary pores PR connected to the vacuum adsorption chamber VC to form an adsorption surface 134 . The "adsorption range is suitable for the wafer carrier 120" mentioned in the present invention means that the adsorption range of the vacuum adsorption unit 131 is greater than, slightly greater than or equal to the plane size occupied by all grooves on the wafer carrier 120, so as to ensure All chip CH can be adsorbed at one time.

In one embodiment, the mobile device 133 operates according to the control signal provided by the background equipment (not shown in the figure). The mobile device 133 can be, for example but not limited to, an XYZ linear stage, or a multi-axis robotic arm. In the present invention is not restricted. In one embodiment, the vacuum unit 131 can be, for example, a vacuum platform, a contact vacuum cup, a non-contact vacuum cup, or other similar devices, which are not limited in the present invention. In one embodiment, the negative pressure provider 132 may be, for example, a vacuum pump, a blower, a Bernoulli vacuum generator or other similar devices, which are not limited in the present invention.

Referring again to "Fig. 1", the mobile device 133 moves the vacuum adsorption unit 131 to the wafer carrier 120 by receiving the control signal from the computer or the server to absorb a plurality of wafers CH on the wafer carrier 120 at one time, due to the vacuum The surface of the adsorption unit 131 is covered with capillary pores PR. Under the condition that precise alignment is not required, all chips CH can be adsorbed on the adsorption surface 134 of the vacuum adsorption unit 131 at one time, and the chips CH can be moved to The inspection area IA is used to shoot and acquire images of the wafer CH, and the images are sent to the image analysis device 150 for marking and classification.

The following describes another specific embodiment of the disc-based semiconductor testing equipment of the present invention. Please refer to FIG. 4 , which is a schematic diagram of the appearance of the second embodiment of the semiconductor testing equipment of the present invention.

The present embodiment discloses a carrier-based semiconductor inspection device 200 for inspecting a plurality of chips CH on a wafer carrier 220 . The semiconductor inspection equipment 200 includes a conveying device 210, at least one wafer carrier 220 provided on the conveying device 210, a positive inspection image capture device 230 located above the conveying device 210, and a vacuum suction device located above the forward inspection area FIA of the conveying device 210. The device 240 , the back inspection image capture device 250 located in the back inspection detection area BIA, and the image analysis device 260 connected to the front inspection image capture device 230 and the back inspection image capture device 250 .

The conveying device 210 is used to carry and move the wafer carrier 220 along a detection path. The conveying device 210 may be, for example but not limited to, a PVC conveyor belt, a PU conveyor belt, a polyethylene conveyor belt, a plastic chain plate conveyor belt, or a modular net conveyor Belts, polypropylene conveyor belts, nylon conveyor belts, Teflon conveyor belts, or stainless steel conveyor belts are not limited in the present invention.

The wafer carrier 220 is used to carry a plurality of wafers CH. The detailed structure of the wafer carrier 220 can be referred to the previous embodiment, and will not be repeated here.

The forward inspection image capturing device 230 is located above the conveying device 210 , and is used to capture a plurality of chips CH on the wafer carrier 220 in a forward inspection inspection area FIA, so as to obtain front images of the plurality of chips CH. In one embodiment, the orthographic image capturing device 230 may be, for example, a line scan camera (Line Scan Camera) or an area scan camera (Area Scan Camera), which is not limited in the present invention. The position of the upright inspection image capture device 230 can be disposed on any side of the conveying device 210; in one embodiment, the lens of the upright inspection image capture device 230 shoots the wafer at an angle perpendicular to the surface of the wafer CH; In another embodiment, the positive inspection image capture device 230 may be configured to capture images of the wafer CH obliquely, which is not limited in the present invention.

The vacuum suction device 240 is located above the conveying device 210 , suctions a plurality of wafers CH on the wafer carrier 220 , and moves the plurality of wafers CH above a back inspection area BIA. In one embodiment, the suction range of the vacuum suction device 240 is suitable for the size of the wafer carrier 220 , so as to adsorb all the plurality of chips CH on the wafer carrier 220 .

The BIA image capturing device 250 is located in the BIA inspection area BIA, and is used to capture images of the plurality of chips CH adsorbed on the vacuum suction device 240 . In one embodiment, the back inspection image capture device 250 may be, for example, a line scan camera or an area scan camera, which is not limited in the present invention. The position of the back inspection image capture device 250 configuration can be on any side of the conveying device 210; in one embodiment, the lens of the back inspection image capture device 250 is to shoot the wafer at an angle perpendicular to the surface of the wafer CH; In another embodiment, the back inspection image capture device 250 may be configured to capture images of the chip CH obliquely, which is not limited in the present invention.

The image analysis device 260 is connected to the front inspection image capture device 230 and the back inspection image capture device 250 for receiving and analyzing images of a plurality of chips CH to generate inspection results. Specifically, the image analysis device 260 obtains the wafer image captured by the front inspection image capture device 230 and the back inspection image capture device 250, and marks possible defects from the wafer image and classifies the wafer CH based on the defect or the type of defect. Classify, such as good products, defective products, types of defects, etc.

The conveying device 210 moves the wafer carrier 220 to the positive inspection detection area FIA through the control signal received by the computer or the server, and first captures the front image of the chip CH on the wafer carrier 220 through the positive inspection image capture device 230; The conveying device 210 moves the wafer carrier 220 near the vacuum suction device 240, absorbs a plurality of wafers CH on the wafer carrier 220 at one time through the vacuum suction device 240, and moves to the backside inspection area BIA to photograph the backside of all the plurality of wafers CH images, and send the front and back images to the image analysis device 260 for marking and classification.

The following describes a specific embodiment of the semiconductor classification and detection system of the present invention. In this embodiment, the semiconductor detection equipment 100 and the semiconductor detection equipment 200 based on the carrier plate in the previous embodiment are applied to the semiconductor classification in this embodiment. On the inspection system 300 , an assembly line is designed according to the carrier-based semiconductor inspection equipment 100 and the semiconductor inspection equipment 200 , so as to achieve high-efficiency inspection results. Regarding the semiconductor sorting and testing system 300, please refer to "FIG. 5", which is a top view of the semiconductor sorting and testing system in the present invention.

This embodiment discloses a semiconductor classification inspection system 300, which mainly includes a material collection platform 310, a transfer device 320, a conveying device 330, a positive inspection image capture device 340, a wafer alignment camera 350, a vacuum adsorption device 360, and a back inspection image capture device. A fetching device 370 , an image analysis device 380 , a wafer sorting device 390 , a plurality of wafer carriers 400 , and defective wafer carriers 410 .

The collecting platform 310 is used for placing the wafer carrier 400 . The transfer device 320 is used to transfer the wafer tray 400 on the collection platform 310 to the transfer device 330 . The conveying device 330 is used for carrying the wafer carrier 400 and moving the wafer carrier 400 along a detection path PA1. The forward inspection image capture device 340 is located above the conveying device 330 , and shoots a plurality of chips CH on the wafer carrier 400 in a forward inspection inspection area FIA to obtain front images of the plurality of chips CH. The wafer alignment camera 350 photographs the plurality of wafers CH on the wafer carrier 400 for aligning the plurality of wafers CH on the wafer carrier 400 . The vacuum adsorption device 360 is located above the conveying device 330, absorbs a plurality of wafers CH on the wafer carrier 400, and moves the plurality of wafers CH to above a back inspection detection area BIA, and the adsorption range of the vacuum adsorption device 360 is suitable for the wafer carrier 400 is used to absorb all the plurality of wafers CH on the wafer carrier 400 . The back inspection image capturing device 370 is located in the back inspection area BIA, and photographs the plurality of chips CH adsorbed on the vacuum suction device 360 to obtain back images of the plurality of chips CH. The image analysis device 380 receives and analyzes front images and back images of a plurality of chips CH to generate a detection result. The wafer sorting device 390 is connected to the image analysis device 380 to obtain detection results, and sorts a plurality of wafers CH on the wafer carrier 400 according to the detection results.

In this embodiment, the wafer alignment camera 350 is disposed on the conveying device 330 . The wafer alignment camera 350 is used to take images of the wafer carrier 400, confirm the displacement of the wafer carrier 400 based on the correct position, and transmit the displacement to the vacuum adsorption device 360 (such as an axis control card) or to control the vacuum adsorption device 360 mobile background equipment (such as PLC). After the vacuum adsorption device 360 receives the displacement, it estimates the position of the wafer carrier 400 (or the chip CH on it) according to the displacement, and moves the vacuum adsorption unit of the vacuum adsorption device 360 to the wafer carrier 400 by a control signal, once Susceptibly absorb all the plurality of chips CH on the wafer carrier 400, and move the chip CH to the back inspection detection area BIA, so as to shoot and obtain the back image of the chip CH through the back inspection image capture device 370, and when shooting the chip CH After the backside imaging, the wafer CH is placed on the wafer carrier 400 to complete the reset.

The image analysis device 380 is connected to the front inspection image capture device 340 and the back inspection image capture device 370 , and outputs a detection result according to the front image and the back image of the chip CH. The detection results can be, for example, defect marks, good products, defective products, types of defects, etc., which are not limited in the present invention.

The wafer sorting device 390 is connected to the image analysis device 380 and sorts the plurality of wafers CH on the wafer carrier 400 according to the detection results. In one embodiment, the wafer sorting equipment 390 includes a chuck carrier platform 391, an empty tray platform 392, a good product distribution platform 393, a defective product distribution platform 394, a material distribution platform 395, and a set on the empty tray platform 392. Wafer alignment camera 350A, and wafer alignment camera 350B installed on good product sorting station 393 . The chuck stage 391 is used to move the detected plurality of wafers CH and the wafer carrier 400 (such as the wafer carrier 400A in FIG. (For example, the wafer carrier 400B of FIG. 6-2 ) moves to the good product distribution station 393, thereby generating a parallel assembly line; Defective products in a wafer CH are moved to a defective wafer carrier 410 on the defective product distribution platform 394; The distributing stage 395 moves the good wafers on the empty tray platform 392 to the wafer trays (such as the wafer tray 400B) on the good product sorting station 393 to complete the second classification.

The wafer alignment camera 350A is used to capture the image of the wafer carrier on the empty tray platform 392, confirm the displacement of the wafer carrier based on the correct position, and transmit the displacement to the distribution carrier 395 (such as an axis control card) or for Background equipment (such as PLC) that controls the movement of the distribution carrier 395. After receiving the displacement, the distributing carrier 395 estimates the positions of good wafers and defective products on the wafer carrier according to the displacement, and moves the distributing carrier 395 to pick up or absorb the empty disc platform 392 wafers by the control signal. The good wafers on the disk move to the vacancy of the good product distributing station 393 on the wafer carrier, and pick up or absorb the defective products on the empty disc 392 wafer carrier and move to the defective wafer carrier 410 of the defective product distributing station 394 .

The wafer alignment camera 350B is used to take images of the wafer carrier on the good product distribution platform 393, confirm the displacement of the wafer carrier based on the correct position, and transmit the displacement to the distribution carrier 395 (such as an axis control card) or use To control the background equipment (such as PLC) that the distribution carrier 395 moves. After receiving the displacement, the material distributing platform 395 estimates the position of the defective product on the wafer carrier of the good product material distributing platform 393 according to the displacement, and moves the material distributing platform 395 to pick up or absorb the good product material distributing platform 393 through the control signal The defective wafers on the wafer carrier tray are moved to the defective wafer carrier tray 410 of the defective product sorting station 394 .

Through the above configuration, the final output of the empty tray platform 392 will be empty trays, the output of the good product sorting station 393 will be wafer trays loaded with good wafers, and the output of the defective product sorting station 394 will be loaded with defective products. wafer carrier.

In one embodiment, the conveying device 330, the empty tray platform 392, the good product distribution platform 393, and the defective product distribution platform 394 can be a conveyor belt, which is driven forward by a motor or a servo motor with a linkage mechanism. The conveyor belt is for example It can be but not limited to PVC conveyor belt, PU conveyor belt, polyethylene conveyor belt, plastic chain plate conveyor belt, modular mesh conveyor belt, polypropylene conveyor belt, nylon conveyor belt, Teflon conveyor belt, or stainless steel conveyor belt etc., are not limited in the present invention. In one embodiment, the chuck stage and the material distribution stage may be XYZ linear stages, multi-axis robotic arms, etc., which are not limited in the present invention.

For the design of the overall assembly line of the semiconductor classification and detection system 300, please refer to "Figure 6-1" to "Figure 6-11", which are working diagrams (1) to (11) of the semiconductor classification and detection system pipeline in the present invention .

Referring to FIG. 6-1 , wafers to be inspected are disposed on the wafer carriers in the wafer carrier stacking area P1 . The empty disk stacking area P11 has empty disks disposed thereon. When the equipment is started, the first wafer carrier 400A is distributed from the wafer carrier stacking area P1 to the positive inspection position P2 (positive inspection detection area) of the conveying device. The empty tray stacking area P11 allocates the first defective wafer carrier tray 410 (empty tray) to the position P12 of the defective product distributing station 394 . The above-mentioned trays are moved from the wafer tray stacking area P1 to the positive inspection position P2, or from the empty tray stacking area P11 to the defective product sorting station 394, which can be placed manually or by using a transfer device (Fig. not shown), this part is not limited in the present invention.

Referring to “ FIG. 6-1 ” and “ FIG. 6-2 ”, after the wafer carrier 400A moves to the inspection position P2 , the inspection image capture device 240 captures the front image of the chip CH on the wafer carrier 400A. Subsequently, the wafer tray 400A moves to the position P3 of the transfer device 330 . At the same time, the wafer carrier stacking area P1 assigns the second wafer carrier 400B to the inspection position P2. Wherein, in the embodiment where the image capture device 340 for inspection is an area scanning camera, the conveying device 330 can stop when the wafer carrier 400A is moved to the bottom of the gantry of the image capture device 340 for inspection, so that the image capture device for inspection 340 captures an image of the wafer carrier 400A; in an embodiment where the inspection image capture device 340 is a line scan camera, the wafer carrier 400A can move to the position P3 at a constant speed.

Next, please refer to "FIG. 6-3", the wafer alignment camera 350 takes pictures of the wafer carrier 400A for visual alignment using the image captured by the wafer alignment camera 350; at the same time, the wafer carrier 400B moves Go to the positive inspection position P2, and perform frontal detection through the positive inspection image capture device 340 .

Next, please refer to "Figure 6-4", the vacuum suction device 360 moves the vacuum suction unit from the back inspection position P4 (back inspection detection area) to the position P3, and descends to the height of the wafer carrier 400A to absorb the wafer carrier 120A All the plurality of wafers CH on the top and rise to the previously preset height. Subsequently, the vacuum suction device 360 moves the vacuum suction unit to the back inspection position P4, and the back inspection image capture device 370 below shoots and acquires the back image of the wafer CH; at the same time, the wafer carrier 400B is still undergoing front inspection. After the back inspection and photographing are completed, the wafer CH is placed on the wafer carrier 400A to complete the reset; at the same time, the wafer carrier 400B is still undergoing front inspection.

Next, referring to "FIG. 6-5", the chuck carrier 391 is moved from the position P5 of the empty platform 392 to the position P3 of the conveying device 330, and the wafer carrier 400A is transferred from the position P3 of the conveying device 330 to the empty platform. 392 on the position P5; at the same time, the transport device 330 transports the wafer carrier 400B located at the position P2 to the position P3; the wafer carrier stacking area P1 distributes the third wafer carrier (not shown) to the first transport device 330 At the position P2 of , since the actions of the subsequent third and fourth discs are performed in the same order as above, no further description will be given.

Next, referring to “ FIG. 6-6 ”, the empty disk platform 392 moves the wafer carrier 400A from the position P5 of the empty disk platform 392 to the position P6 of the empty disk platform 392 .

Next, referring to "Fig. 6-7", the distributing carrier 395 is moved to the position P6 of the empty tray platform 392, and the position of the wafer is confirmed by the wafer alignment camera 350A, and the defective product on the wafer carrier tray 400A at the position P6 is moved to the position P6. The defective wafer carrier tray 410 on the position P12 of the product sorting platform 394.

Next, referring to "Figure 6-8", the chuck carrier 391 moves from the position P5 of the empty platform 392 to the position P3 of the conveying device 330, and transfers the wafer carrier 400B from the position P3 of the conveying device 330 to the good product distribution On platform 393 at position P8.

Next, referring to “FIG. 6-9 ”, the good product distributing station 393 moves the wafer carrier 400B from the position P8 of the good product distributing station 393 to the position P9 of the good product distributing station 393 .

Next, referring to "Figure 6-10", the distributing carrier 395 moves to the position P9 of the good product distributing station 393, and the position of the wafer is confirmed by the wafer alignment camera 350B, and the defective product on the wafer carrier 400B at position P9 is moved to the defective product. The defective wafer carrier tray 410 on the position P12 of the product sorting platform 394.

Next, referring to "Fig. 6-11", the distributing carrier 395 moves to the position P6 of the empty disc platform 392, and moves the good wafers on the wafer carrier 400A at the position P6 to the wafer carrier 400B at the position P9 of the good product distributing platform 393 In order to complete the classification of good products and defective products, finally transfer the wafer tray 400A at position P6 (finally an empty tray) to the empty tray stacking area at position P7, and transfer the wafer tray 400B at position P9 (finally set a good product) ) to the good product stacking area at position P10, and the empty tray 410 at position P12 (defective products are finally set) to the defective product stacking area at position P13.

In summary, the present invention can absorb multiple wafers at one time, and directly detect the backs of multiple wafers at the same time through the image detection device. Inefficient absence.

The present invention has been described in detail above, but the above description is only one of the preferred embodiments of the present invention, and should not limit the scope of the present invention with this, that is, all equivalents made according to the patent scope of the present invention Changes and modifications should still fall within the scope of the patent coverage of the present invention.

100: Semiconductor testing equipment 110:Equipment platform 120: Wafer carrier 121: Setting slot 130: vacuum adsorption device 131: vacuum adsorption unit 132: Negative pressure provider 133:Mobile device 134: adsorption surface 140: image capture device 150: Image analysis device IA: detection area CH: chip VC: Vacuum adsorption chamber NH: Negative pressure connection hole PR: Capillary 200: Semiconductor testing equipment 210: Conveyor 220: Wafer carrier 230: Orthographic image capture device 240: vacuum adsorption device 250: back inspection image capture device 260: Image analysis device FIA: positive inspection detection area BIA: back inspection detection area 300:Semiconductor classification detection system 310: aggregate platform 320: transfer device 330: Conveyor 340: Orthogonal image capture device 350: Wafer Alignment Camera 350A: Wafer Alignment Camera 350B: Wafer Alignment Camera 360: vacuum adsorption device 370: back inspection image capture device 380: Image analysis device 390: Wafer Sorting Equipment 391:Chuck carrier 392: Empty platform 393: Good product distribution platform 394: Deficient product sorting platform 395: Distributing carrier 400: wafer tray 410: Deficient wafer tray PA1: detection path P1~P13: position

FIG. 1 is a schematic view of the appearance of the first embodiment of the semiconductor testing equipment of the present invention.

Fig. 2 is a schematic view of the appearance of the wafer carrier in the present invention.

Fig. 3 is a schematic cross-sectional view of the vacuum adsorption device of the present invention.

Fig. 4 is a schematic diagram of the appearance of the second embodiment of the semiconductor testing equipment of the present invention.

Fig. 5 is a top view of the semiconductor classification and detection system in the present invention.

Fig. 6-1 to Fig. 6-11 are working diagrams (1) to (11) of the assembly line of the semiconductor classification and detection system in the present invention.

100: Semiconductor testing equipment

110:Equipment platform

120: Wafer carrier

130: vacuum adsorption device

131: vacuum adsorption unit

133:Mobile device

134: adsorption surface

140: image capture device

150: Image analysis device

IA: detection area

CH: chip

Claims (12)

A carrier-based semiconductor testing equipment for testing a plurality of wafers on a wafer carrier, including: A vacuum suction device, located above the wafer carrier, adsorbs the plurality of wafers on the wafer carrier, and moves the plurality of wafers to above a detection area; an image capturing device, located in the detection area, photographing the plurality of wafers adsorbed on the vacuum adsorption device to obtain images of the plurality of wafers; and An image analysis device receives and analyzes the images of the plurality of wafers to generate a detection result; Wherein the suction range of the vacuum suction device is suitable for the size of the wafer carrier, so as to absorb all the plurality of wafers on the wafer carrier. The semiconductor testing equipment as claimed in item 1, wherein the vacuum adsorption device includes: A negative pressure provider, which provides negative pressure to generate adsorption force; a vacuum adsorption unit, connected to the negative pressure provider, to adsorb the plurality of wafers; and a moving device, connected to the vacuum adsorption unit, to move the vacuum adsorption unit; Wherein the suction range of the vacuum suction unit is suitable for the size of the wafer carrier, so as to absorb all the plurality of wafers on the wafer carrier. The semiconductor testing equipment as described in claim 1 further includes: a good product distributing station, used to place the plurality of wafers and the wafer carrier after inspection; and A chuck carrier is used to move the inspected plurality of wafers and the wafer carrier to the good product distributing station. The semiconductor testing equipment as described in claim 3, which further includes: a defective product sorting station, used to place the defective products in the plurality of wafers; and A distributing platform is used for moving defective products in the plurality of wafers from the inspected plurality of wafers and the wafer carrier to a defective wafer carrier on the defective product sorting station. A carrier-based semiconductor testing equipment for testing a plurality of wafers on a wafer carrier, including: a conveying device for carrying and moving the wafer carrier along an inspection path; A positive inspection image capture device, located above the conveying device, photographs the plurality of wafers on the wafer carrier in a positive inspection detection area, so as to obtain front images of the plurality of wafers; a vacuum adsorption device, located above the conveying device, adsorbs the plurality of wafers on the wafer carrier, and moves the plurality of wafers to above a back inspection detection area; a back inspection image capturing device, located in the back inspection detection area, photographing the plurality of wafers adsorbed on the vacuum adsorption device, so as to obtain back images of the plurality of wafers; and an image analysis device, receiving and analyzing the front images and back images of the plurality of wafers to generate a detection result; Wherein the suction range of the vacuum suction device is suitable for the size of the wafer carrier, so as to absorb all the plurality of wafers on the wafer carrier. The semiconductor testing equipment as described in claim 5, wherein the vacuum adsorption device includes: A negative pressure provider, which provides negative pressure to generate adsorption force; a vacuum adsorption unit, connected to the negative pressure provider, to adsorb the plurality of wafers; and a moving device, connected to the vacuum adsorption unit, to move the vacuum adsorption unit; Wherein the suction range of the vacuum suction unit is suitable for the size of the wafer carrier, so as to absorb all the plurality of wafers on the wafer carrier. The semiconductor testing equipment as described in claim 5, further comprising: a good product distributing station, used to place the plurality of wafers and the wafer carrier after inspection; and A chuck carrier is used to move the inspected plurality of wafers and the wafer carrier to the good product distributing station. The semiconductor testing equipment as described in claim item 5, which further includes: a defective product sorting station, used to place the defective products in the plurality of wafers; and A distributing platform is used for moving defective products in the plurality of wafers from the inspected plurality of wafers and the wafer carrier to a defective wafer carrier on the defective product sorting station. A semiconductor classification and detection system based on carrier discs, including: a conveying device for carrying and moving the wafer carrier along an inspection path; A positive inspection image capture device, located above the conveying device, photographs a plurality of wafers on the wafer carrier in a positive inspection detection area, so as to obtain front images of the plurality of wafers; a vacuum adsorption device, located above the conveying device, adsorbs the plurality of wafers on the wafer carrier, and moves the plurality of wafers to above a back inspection detection area; a back inspection image capture device, located in the back inspection detection area, photographing the plurality of wafers adsorbed on the vacuum adsorption device, so as to obtain back images of the plurality of wafers; an image analysis device, receiving and analyzing the front and back images of the plurality of wafers to generate a detection result; and A wafer sorting device, connected to the image analysis device, to obtain the detection result, and sort the plurality of wafers on the wafer carrier according to the detection result; Wherein the suction range of the vacuum suction device is suitable for the size of the wafer carrier, so as to absorb all the plurality of wafers on the wafer carrier. The semiconductor sorting and testing system as described in claim 9, wherein the conveying device is provided with a wafer alignment camera for photographing the plurality of wafers on the wafer carrier for aligning the plurality of wafers on the wafer carrier . The semiconductor classification and detection system as claimed in item 9, wherein the vacuum adsorption device includes: A negative pressure provider, which provides negative pressure to generate adsorption force; a vacuum adsorption unit, connected to the negative pressure provider, to adsorb the plurality of wafers; and a moving device, connected to the vacuum adsorption unit, to move the vacuum adsorption unit; Wherein the suction range of the vacuum suction unit is suitable for the size of the wafer carrier, so as to absorb all the plurality of wafers on the wafer carrier. The semiconductor sorting detection system as described in claim 9, wherein the wafer sorting equipment includes: A good product distributing station, used to place the plurality of wafers and the wafer carrier after inspection; A defective product sorting station, used to place defective products in the plurality of wafers; An empty tray platform for placing the tested empty trays; A chuck carrier, used to move the plurality of wafers and the wafer carrier after inspection to the good product distribution station; A distributing platform is used for moving defective products in the plurality of wafers from the inspected plurality of wafers and the wafer carrier to a defective wafer carrier on the defective product sorting station.

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