JPH0682897U - Template for chip circuit component placement - Google Patents

Abstract

(57) [Summary] (Correction) [Purpose] Chip-shaped circuit parts can be stored in the storage recess in a normal state of falling down without standing up. [Construction] In the template 6, a guide case 61 is arranged corresponding to a position where the chip-shaped circuit component a is mounted on a circuit board, and a storage recess 62 for housing the chip-shaped circuit component a is formed therein. . The bottom surface of the storage recess 62 is a sloped surface 64 that lowers toward the center thereof, and the portion of the through hole 63 that serves as an air passage is located at the lowest position of the sloped surface 64, and the groove 65 is formed therein. Has been formed.
The inclination angle θ of the inclined surface 64 is larger than the angle x formed by the diagonal of the smallest surface of the cube-shaped chip-shaped circuit component a to be housed and the side in the lengthwise direction, and the width of the groove 65 is equal to the chip-shaped circuit component a. Is smaller than the thickness dimension t.

Description

[Detailed description of the device]

The present invention relates to a device for mounting a chip-shaped circuit component housed in a container at a predetermined position on a circuit board, and a chip having a storage recess for storing the chip-shaped circuit component in a predetermined positional relationship. Circuit component arrangement template.

[0002]

[Prior art]

 Conventionally, when a chip-shaped circuit component is mounted at a predetermined position on a circuit board, it has been performed by the following method using an automatic mounting device. That is, the chip-shaped circuit components stored in bulk in a plurality of containers are taken out one by one into the guide tube of the distributor, and sent to the storage containers formed at the predetermined positions of the template through the guide tubes. , To collect there. The position of this storage container is determined according to the position where each chip-shaped circuit component is mounted on the circuit board. The chip-shaped circuit component is moved to and mounted on the circuit board by the component moving means having the set nozzle arranged on the lower surface of the application head. As a result, each of the chip-shaped circuit components is mounted at a predetermined position on the circuit board.

It should be noted that an adhesive is applied in advance to the position where the chip-shaped circuit component is to be mounted on the circuit board, and the mounted circuit component is temporarily fixed with this adhesive and is soldered. . In such a chip-shaped circuit component mounting device, a conventional chip-shaped circuit component placement template for temporarily storing and arranging the chip-shaped circuit component corresponding to the mounting position of the chip-shaped circuit component on the circuit board. Is as shown in FIG.

That is, a storage container 61 ′ for storing this chip-shaped circuit component is arranged at a predetermined position on the base board 60 of the template 6, and the chip-shaped circuit component a is placed inside this storage container 61 ′. A recess for accommodating is formed. Further, the bottom surface of this recess is provided with a through hole 63 through which the bottom surface of the base board 60 extends. This through hole 63 sucks air through the guide tube of the distributor when the chip-shaped circuit component a is sent from the container to the inside of the storage container 61 ′ through the distributor, with the lower surface side of the base board 60 as negative pressure. The chip-shaped circuit component a is forcibly conveyed by the flow of the sucked air.

When the chip-shaped circuit component a is received in the container 61 ′ of the template 6 under the distributor, the template 6 moves below the suction head 8. Then, as shown in FIG. 5, the suction head 8 descends, and as indicated by a chain double-dashed line at the tip of the set nozzle 81 projecting from the lower surface of the suction head 8 corresponding to the arrangement of the storage container 61 ′. After the chip-shaped circuit component a is adsorbed, the suction head 8 rises. After that, the template 6 returns to below the distributor, and then the suction head 8 descends to mount the chip-shaped circuit component on the circuit board therebelow.

The conventional storage container 61 ′ has a flat bottom surface or a slight inclination from one to the other. Such a storage container 61 'on the template 6 is used for arranging a chip-shaped circuit component a having a prismatic shape with a substantially square end surface or a chip-shaped circuit component having a cylindrical shape as shown in FIG.

[0007]

[Problems that the device is trying to solve]

 In the conventional storage container 61 'on the template 6, the chip-shaped circuit component a falls down in the storage container 61' due to suction of air from the through holes 63, and is normally stored as shown in FIG. It In this state, the suction head 8 can reliably adsorb the chip-shaped circuit component a.

However, depending on the chip-shaped circuit component a, for example, like the storage container 61 ′ shown on the left side of FIG. 6, the chip-shaped circuit component a sticks to the side wall of the storage container 61 ′ and stands up. There is a case where the chip-shaped circuit component a stands on it so as to block the through hole 63, like a storage container 61 ′ shown on the right side of FIG. In particular, in the case of a flat chip-shaped circuit component a, which is a cube but whose thickness is thinner than its length and width, the chip-shaped circuit component a is attached to the side wall of the storage container 61 ′ as in the former case. Often stands. Then, the suction head 8 cannot normally adsorb and hold the chip-shaped circuit component a, which causes a mounting error of the chip-shaped circuit component a on the circuit board.

The present invention solves the conventional problems described above, and the chip-shaped circuit component can be stored in a normal posture, that is, in the state where the chip-shaped circuit component is laid down, without standing up in the storage recess. It is intended to provide a template for placement.

[0010]

[Means for Solving the Problems]

 That is, in order to achieve the above-mentioned object, the present invention provides a chip-shaped circuit component placement template having a storage recess 62 for storing the chip-shaped circuit component a, in which the bottom of the storage recess 62 is lowered toward the center in the width direction. A chip-shaped circuit component placement template is provided which has such a sloped surface 64 and a groove 65 is formed at the lowest position of the sloped surface 64.

In this case, the inclination angle θ of the inclined surface 64 is preferably larger than the angle x formed by the diagonal line of the smallest surface of the cubic chip-shaped circuit component a to be housed and the side in the width direction. The width δ of the groove 65 is preferably narrower than the thickness t of the cube-shaped chip-shaped circuit component a to be stored.

The groove 65 has an inclined surface 65b between the bottom surface 65a and the inclined surface 64. The angle φ formed by the bottom surface 65a of the groove 65 and the inclined surface 65b is the inclination angle of the inclined surface 64 being θ. Then, it is preferable that φ = 90 ° −θ. Further, the through hole 63 serving as an air passage is preferably opened at the position of the groove 65, and the bottom surface of the storage recess 62 is inclined along the longitudinal direction so that the through hole 63 side becomes lower. Is desirable.

[0013]

In the chip-shaped circuit component placement template according to the present invention, since the bottom surface of the storage recess 62 for storing the chip-shaped circuit component a is a sloped surface 64 that is lowered toward the center thereof, When the chip-shaped circuit component a accommodated in the accommodating concave portion 62 stands, the chip-shaped circuit component a is inclined due to the slope of the sloped surface 64 and becomes unstable. Therefore, the chip-shaped circuit component a falls down.

In particular, when the inclination angle θ of the inclined surface 64 is set to be larger than the angle x formed by the diagonal line of the smallest surface of the cubic chip-shaped circuit component a to be housed and the side in the width direction, the normal chip-shaped circuit is formed. The center of gravity G at the intersection of the three-dimensional diagonal lines of the component a is always displaced on the plane from the contact surface with the distribution surface 64 of the chip-shaped circuit component a. Therefore, the chip-shaped circuit component a easily falls down due to some vibration or the like.

When the portion of the through hole 63 that serves as an air passage is located at the lowest position of the sloped surface 64 and the groove 65 is formed therein, the chip-shaped circuit component a 1 stored in the storage recess 62 is Even when standing on the through hole 63, the chip-shaped circuit component a becomes extremely unstable. Therefore, the chip-shaped circuit component a does not stand up so as to block the through hole 63. In many cases, the chip-shaped circuit component a lying on the sloped surface 64 slides down along the sloped surface 64 to a position where one end of the chipped circuit component a hits the lowest groove 65 of the sloped surface 64. In this case, by making the width of the groove 65 narrower than the thickness t of the chip-shaped circuit component a, the entire chip-shaped circuit component a is not fitted into the groove 65.

When the slope 65b is formed between the bottom surface 65a of the groove 65 and the sloped surface 64, and the angle φ formed by the bottom surface 65a of the groove 65 and the sloped surface 65b is set to 90 ° −θ, the sloped surface 65b is a chip-shaped circuit component a. Then, the position of the chip-shaped electronic component a after storage is stable. Further, by forming a through hole 63 that serves as an air passage in the groove 65, when the air is drawn from the through hole 63 to the lower side of the storage recess 62, the chip-shaped circuit component a is drawn into the groove 65. Can form a stream of. Therefore, the chip-shaped circuit component a can be more surely laid down. Similarly, by tilting the bottom surface of the storage recess 62 so that the through hole 63 side becomes lower, the chip-shaped electronic component a can be more reliably collapsed.

[0017]

【Example】

 Next, embodiments of the present invention will be specifically described with reference to the drawings. FIG. 4 shows an overview of the entire mounting device for chip-shaped circuit components using the template 6 of the present invention. That is, a plurality of containers 1 in which chip-shaped circuit components are stored in a bulk shape are arranged, and a delivery section 11 which is an escapement is connected to the containers 1 via a tube 10. Further, the distributor 2 is arranged below the sending unit 11.

The distributor 2 has an upper frame 23 fixed below the delivery part 11 and a lower frame 22 arranged in parallel thereunder, and the upper frame 23 and the lower frame 23 are provided. The frame 22 has four columns connected to each other at their four corners. Between the upper frame 23 and the lower frame 22, flexible guide tubes 21, 21 ... Which guide and convey the chip-shaped circuit component are arranged.

Below the lower frame 22, the template 6 placed on the template frame 65 is inserted and fixed. This template 6 has a storage container 61 having a storage recess 62 on a base board 60 in accordance with the mounting position of a chip-shaped circuit component on a circuit board. Then, when the template 6 is inserted directly below the distributor 2, the lower end of the guide tube 21 connected to the lower frame 22 is placed above each storage recess 62 of the storage container 61 on the template 6. To position.

At this time, the vacuum case 4 is placed under the template 6, and the lower surface side of the storage container 61 on the template 6 is maintained at a negative pressure. Therefore, air is drawn from the guide tube 21 through the through hole formed at the bottom of the storage recess 62 to the back surface side of the storage container 61 on the template 6, and an air flow is formed. Here, the chip-shaped circuit component a sent from each container 1 side is sent through the guide tube 21 of the distributor 2 by the gravity and the flow of the air, and the storage container 61 on the template 6 is sent. It is stored in the storage recess 62 of the. In these drawings, reference numeral 63 is a through hole which serves as an air passage for sucking air toward the vacuum case 4 side and sending the chip-shaped circuit component a through the guide tube 21 to the storage recess 62.

The template 6 placed on the template frame 65 is moved by a slide mechanism 66 between a position directly below the distributor 2 and a position directly below the suction head 8. As a result, immediately below the distributor 2, the chip-shaped circuit components are received in the respective predetermined storage recesses 62 of the storage container 61 on the ten plate 6, and then the template 6 is moved to below the suction head 8. Then, the chip-shaped circuit components received in the storage recess 62 are adsorbed by the set nozzles of the suction head 8, respectively. After that, the template 6 is withdrawn from under the suction head 8, and then the circuit board 9 conveyed by the conveyor 7 is inserted under the head 8. Then, the suction head 8 mounts the chip-shaped circuit component sucked on the tip of the set nozzle 81 on the circuit board 9.

An accommodating container 61 according to the embodiment of the present invention used in such a mounting device for a chip-shaped circuit component, and a chip-shaped circuit component a accommodated in the accommodating recess 62 and arranged at a predetermined position. Is shown in FIG. As shown in FIG. 1A, the storage container 61 is arranged at a predetermined position on the base board 60 of the template 6, and the storage container 61 stores the chip-shaped circuit component a therein. A recess 62 is formed. In FIG. 1A, the storage container 61 on the left side represents the side surface that is cross-sectioned at the substantially central portion thereof, and the storage container 61 on the right side represents the front surface whose cross-section is centered.

As is clear from this cross-sectional view, the bottom surface of the storage recess 62 in the storage container 61 is a sloped surface 64 that gradually lowers from both sides toward the center. , 64 intersect with each other to form a concave groove 65 at the deepest position. A through hole 63 extending to the bottom surface of the base board 60 is opened in the groove 64, and the bottom surface of the storage recess 62 is inclined along the longitudinal direction so that the through hole 63 side becomes lower.

As shown in FIG. 1B, the chip-shaped circuit component a stored in the storage recess 62 in the storage container 61 has a flat cubic shape with a thickness t smaller than the width w. However, the length and width of the storage recess 62 are respectively larger than the length l and the width w of the chip-shaped circuit component a. The width δ of the groove 65 provided on the bottom surface of the storage recess 62 is smaller than the thickness t of the chip-shaped circuit component a. The inclination angle θ of the sloped surfaces 64 on both sides is an angle x formed by the diagonal line of the smallest surface of the chip-shaped circuit component a and the side in the width direction, that is, x = tan-1 (t / in FIG. 1B). w) is set larger. Further, the groove 65 has an inclined surface 65b between the bottom surface 65a and the inclined surface 64, and the angle φ formed by the bottom surface 65a of the groove 65 and the inclined surface 65b is when the inclination angle of the inclined surface 64 is θ. , 90. There is a relation of −θ.

FIG. 1C shows a state in which the end surface of the chip-shaped circuit component a rides on the sloped surface 64. In this state, the width w direction of the chip-shaped circuit component a is the sloped surface 64. Along the slope. In this case, as described above, since the inclination angle of the inclined surface 64 is set to be larger than the angle x of the chip-shaped circuit component a, the center of gravity G near the intersection of the three-dimensional diagonal lines of the chip-shaped circuit component a is , At a position that is offset in plan view from the end face of the chip-shaped circuit component a mounted on the sloped surface 64. For this reason, the chip-shaped circuit component a falls down in the direction indicated by the arrow in FIG.

However, if the slope of the sloped surface 64 is too large, it becomes difficult to adsorb the chip-shaped circuit component a lying along the sloped surface 64 to the tip of the set nozzle. l = 1.6 mm, w = 0. According to the result of the experiment with the chip-shaped circuit component a of 8 mm, t = 0.4 mm, and x = 27 °, when the inclination angle θ of the inclined surface 64 becomes 40 ° or more, the suction miss of the chip-shaped circuit component a occurs. I found it easier. Therefore, in this case, good results were obtained when θ = 27 to 40 °.

When the chip-shaped circuit component a is sent, from the guide tube 21 (see FIG. 4) that conveys the component a, through the through hole 63 opened at the bottom of the storage recess 62, the storage container 61 on the template 6 is provided. Air is drawn into the back surface side of the to form a flow of air. The chip-shaped circuit component a is sent through the guide tube 21 of the distributor 2 due to its gravity and the flow of the air, and is stored in the storage recess 62 of the storage container 61 on the template 6.

FIG. 2A shows a state in which the end surface of the chip-shaped circuit component a rides on the sloped surface 64 and the thickness t 1 direction thereof is oriented along the slope of the sloped surface 64. . It is obvious that the chip-shaped circuit component a in this state is more likely to fall than the chip-shaped circuit component a in the state shown in FIG. 1 (c). In many cases, as shown in FIG. 2B, the chip-shaped circuit component a after it has fallen is stable in a state where both ends are placed on both slope surfaces 64, 64 across the groove 65, but due to vibration, In some cases, the state shown in FIG.

Further, FIG. 3 (a) shows a state in which the chip-shaped circuit component a has the widest surface on one of the sloped surfaces, which is a state in which the chip-shaped circuit component a is laid down from the beginning or a state in which it is laid down from the standing state. The state is shown. In this case, as shown in FIG. 3B, the chip-shaped circuit component a slides down along the sloped surface 64 due to vibrations and the like, and one end surface of the chip-shaped circuit component a stabilizes in contact with the edge of the groove 65. Here, since the width δ of the groove 65 is set smaller than the thickness t of the chip-shaped circuit component a, the chip-shaped circuit component a must not be completely fitted in the groove 65. The angle φ formed by the slope of the groove 65 between the bottom surface and the sloped surface 64 is 90. Since there is a relationship of −θ, the side surface of the chip-shaped circuit component a comes into contact with the slope of the groove and the storage position is stable.

In the above embodiment, the storage recess 62 for storing the chip-shaped circuit component a is formed inside the storage container 61 mounted on the base board 60. However, for example, the surface of the base board 60 is carved. It is obvious that the same operation and effect can be obtained even if the storage recess 62 is directly provided on the storage recess 62. Further, the chip-shaped circuit component housed in the housing recess 62 is not limited to the flat cubic shape, but the same action and effect can be obtained with a chip-shaped circuit component having a prismatic shape or a cylindrical shape.

[0031]

[Effect of device]

 As described above, according to the present invention, it is possible to provide a storage container in which a chip-shaped circuit component does not stand up in the storage recess and the chip-shaped circuit component can be stored in the storage recess when it is lying down. . As a result, it is possible to prevent the chip-shaped circuit component from being picked up by the chip-shaped circuit component mounting device and to ensure stable operation.

[Brief description of drawings]

FIG. 1 is a vertical sectional side view of a main portion of a chip-shaped circuit component storage container according to an embodiment of the present invention, showing an example of chip-shaped circuit components stored in the storage recess and a chip-shaped circuit component immediately after being stored in the storage recess FIG. 7 is a vertical sectional side view of a main part of a storage container showing movement.

FIG. 2 is a vertical cross-sectional side view of a main part of the storage container showing the movement of the chip-shaped circuit component stored in the storage recess of the storage container according to the embodiment of the present invention.

FIG. 3 is a vertical sectional side view of a main part of the storage container showing the movement of the chip-shaped circuit component stored in the storage recess of the storage container according to the embodiment of the present invention.

FIG. 4 is a schematic perspective view showing an outline of a chip-shaped circuit component mounting device in which a storage container according to an embodiment of the present invention is used.

FIG. 5 is a vertical cross-sectional side view of a main portion of a storage container for a chip-shaped circuit component mounting device according to a conventional example and a suction head descending above the storage container.

FIG. 6 is a vertical cross-sectional side view of a main part of a storage container in which a chip-shaped circuit component is erected and stored in a storage recess of the storage container on the template according to the conventional example.

[Explanation of symbols]

 6 Templates 61 Storage Containers on Templates 62 Storage Recesses 63 Through Holes 64 Gradient Surfaces 65 Grooves 65a Groove Bottoms 65b Slopes Between Groove Bottoms and Gradients a Chip Circuit Parts

Claims (6)

[Reference number] 0050284-01 [Claims for utility model registration] 1. A chip-shaped circuit component placement template having a storage recess (62) for storing the chip-shaped circuit component (a), wherein the bottom surface of the storage recess (62) is lowered toward the center in the width direction. And a groove (65) formed at the lowest position of the sloped surface (64). 2. The sloped surface (6) according to claim 1,
The inclination angle (θ) of 4) is larger than the angle (x) formed by the diagonal line of the smallest surface of the cube-shaped chip-shaped circuit component (a) to be housed and the side in the width direction. Template for component placement. 3. The method according to claim 1 or 2, wherein the width (δ) of the groove (65) is narrower than the thickness dimension (t) of the cubic chip-shaped circuit component (a) to be stored. A template for arranging chip-shaped circuit components. 4. The groove (65) according to claim 1, wherein the groove (65) has a bottom surface (65a) and a sloped surface (64).
There is a slope (65b) between the grooves, and the angle (φ) formed by the bottom surface (65a) of the groove (65) and the slope (65b) is φ when the inclination angle of the slope (64) is θ. = 90 ° -θ, a chip-shaped circuit component placement template. 5. The chip-shaped circuit component placement template according to any one of claims 1 to 4, wherein a through hole (63) serving as an air passage is formed in the groove (65). 6. The storage recess (62) according to any one of claims 1 to 5, wherein the bottom surface of the storage recess (62) is a through hole (63) along the longitudinal direction.
A chip-shaped circuit component placement template, which is inclined so that its side is lowered.