JPH0878884A - Electronic component suction nozzle - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide an electronic component suction nozzle that can perform soldering between an electronic component lead and a pad of a printed circuit board with high precision and does not require backup at the time of mounting. In an electronic component suction nozzle for sucking and holding an electronic component to be mounted on a printed circuit board, a supporting portion 20 is provided.
A suction unit 30 for sucking the electronic component, a support mechanism 23 provided at the tip of the support unit 20 for swingably supporting the suction unit 30, and elasticity for elastically holding the suction unit 30 on the support unit 20. And a member 54.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is to be incorporated in a mount head of a semiconductor mounting apparatus in which electronic components such as a tape carrier package (hereinafter referred to as "TCP") are mounted on a printed circuit board. The present invention relates to an electronic component suction nozzle for sucking and holding an electronic component.

[0002]

2. Description of the Related Art Conventionally, in a mount head of an outer lead bonding apparatus which is a semiconductor mounting apparatus, T
Electronic component suction nozzles are used to suck and hold electronic components such as CPs. At this time, by keeping the lower surface of the electronic component suction nozzle and the mounting surface of the printed board parallel to each other, the leads of the TCP are accurately joined to the pads of the printed board. Therefore, it is necessary to adjust the angle of the lower surface of the suction nozzle with high accuracy.

[0003]

The conventional electronic component suction nozzle as described above has the following problems.
That is, unless the TCP is held in parallel with the mounting surface of the printed circuit board by the suction nozzle with high accuracy, the pad portion of the printed circuit board and some of the leads of the TCP do not contact the pad of the printed circuit board and the solder There was a risk of causing defects. Further, in order to uniformly contact all the leads of the electronic component with the pads of the printed circuit board with such a mount head, it is necessary to press the TCP with high pressure until the printed circuit board is deformed. At this time, backup is required on the back side of the printed circuit board to be mounted,
No other electronic component can be mounted on the back surface of the printed circuit board to which the backup contacts. Therefore, there is a problem in that product design is restricted. Further, even if the angle of the suction nozzle is adjusted with high accuracy, the printed circuit board is warped, and there is a problem that it cannot be dealt with when the inclination of each mounting surface is different.

Therefore, an object of the present invention is to provide an electronic component suction nozzle capable of highly accurately soldering a lead of an electronic component and a pad of a printed circuit board and requiring no backup at the time of mounting. I am trying.

[0005]

In order to solve the above problems and to achieve the object, the present invention provides an electronic component suction nozzle for sucking and holding an electronic component to be mounted on a printed circuit board, the supporting portion and the electronic component. A suction unit that sucks a component, a support mechanism that is provided at the tip of the support unit and that swingably supports the suction unit, and an elastic member that elastically holds the suction unit on the support unit are provided. I did it.

Further, the support mechanism includes a protrusion and a collar portion provided at the tip of the support portion, and a recessed portion provided on the support portion side of the suction portion and into which the protrusion portion and the collar portion are inserted. A concave portion provided on the bottom surface of the concave portion for swingably engaging the protruding portion; and a concave portion side wall projecting from the flange portion to the supporting portion side and engaging with the flange portion via the elastic member. It is preferable to provide a mating engaging portion. Further, it is preferable that the elastic member is an O-ring.

[0007]

As a result of taking the above-mentioned means, the following effects occur. That is, when the electronic component attracted to the suction nozzle and the printed circuit board are not held in parallel with each other, when the suction nozzle is brought close to the printed circuit board, a force is applied from the part of the electronic component that first contacts the printed circuit board. Upon receipt, the suction part swings in a direction such that the electronic component and the printed circuit board are parallel to each other. Therefore, it is possible to uniformly contact all the leads of the electronic component with the pads of the printed board without applying a high pressure. In addition, since the support mechanism that serves as the swing center of the suction part is provided at the tip of the support part, the misalignment between each lead of the electronic component and the pad of the printed circuit board before and after contact due to the swing of the suction part Can be minimized. It should be noted that the elastic member can keep the suction portion in a constant posture when the electronic component and the printed circuit board are not in contact with each other.

[0008]

1 (a) and 1 (b) are views showing an electronic component suction nozzle incorporated in a mount head of an outer lead bonding apparatus according to an embodiment of the present invention.
(A) is a vertical cross-sectional view taken along the line AA in (b) and seen from the arrow direction, and (b) is a bottom view. 1 in FIG.
Reference numeral 0 is a mount head body configured to be slidable in the vertical direction in the figure, 20 is a support portion fixed to the tip of the mount head body 10, and 30 is a suction portion for sucking an electronic component supported at the tip of the support portion 20. Shows.

The support portion 20 includes a hollow cylindrical support portion body 21 fixed to the mount head body 10 and a collar portion 22 inserted into an opening of the support portion body 21 opposite to the head body 10. I have it. The collar portion 22 is a suction portion 3 described later.
It is arranged in the second opening 33 of 0. Support body 2
The outer diameter of 1 is the hole 5 at the center of the upper lid 50 of the suction part 30 described later.
2 is smaller than the inner diameter of the engaging portion 53 provided at the upper end in the figure by a predetermined dimension. The outer diameter of the collar portion 22 is larger than the inner diameter of the engaging portion 53 of the upper lid 50 by a predetermined dimension and smaller than the inner diameter of the hole portion 52 of the upper lid 50 by a predetermined dimension. A protrusion 23, which is a conical support mechanism, is provided at the center of the collar 22 on the opposite side of the support body 21, and the periphery of the protrusion 23 communicates with the internal space 21 a of the support body 21. An intake passage 24 is provided. On the other hand, the internal space 21a of the support portion main body 21 is connected to the intake device 11 via an intake portion 21b provided outside the support portion main body 21.

The suction part 30 is provided with a square plate-shaped suction part body 31 which is arranged below the support part 20 in the figure. A first opening 32 having a square shape, which is slightly smaller than the suction unit body 31, is provided in the lower center portion of the suction unit body 31 in the drawing, and the collar of the support unit body 21 described above is provided in the upper center portion of the drawing. A second opening 33 is provided as a recess having an inner diameter larger than the outer diameter of the portion 22 by a predetermined dimension. The first opening 32 and the second opening 33 are in communication with each other inside the suction part body 31. Each corner portion 31a to 31 of the suction portion main body 31
Claws 34a to 34d protruding downward from the lower surface of the support body 21 in the drawing are provided on the outer side of d.

A member 40 having a substantially square plate shape is fitted and joined in the first opening 32. Member 40 is at each corner 40
a to 40d are cut at 45 °, and the suction part main body 31
Together with the inner surface of the first opening 32 of the suction holes 41a to 41d.
Are formed. A recess 42 is provided in the center of the upper surface in the figure. A conical recess 42a is formed in the center of the recess 42.
Is formed, and the inclination angle of the recess 42a is less than the inclination angle of the protrusion 23 of the support body 21 described above. The tip of the protrusion 23 is in contact with the center of the recess 42a, and the protrusion 23 can swing within a predetermined angle range with the center of the recess 42a as a pivot. Further, intake grooves 43a to 43d are formed between the recess 42 and the corners 40a to 40d, respectively, and the lower surface of the member 40 in the figure is slightly recessed except for the corners 40a to 40d. Are formed.

A cylindrical upper lid 50 is fixed to the upper surface of the intake portion main body 31 in the figure by screws 51a and 51b.
A hole 52 having the same diameter as the second opening 33 of the intake body 31 is provided in the center of the upper lid 50, and the outer diameter of the support body 21 of the support 20 is larger than the outer diameter of the support body 21 on the upper surface side in the drawing. Is also provided with an engaging portion 53 having an inner diameter larger by a predetermined dimension and smaller than an outer diameter of the collar portion 22 of the support body 21 by a predetermined dimension. Further, an O-ring 54 made of heat-resistant rubber which is an elastic member is arranged between the lower surface of the engaging portion 53 and the upper surface of the collar portion 22.

In the mount head thus constructed, the electronic component TCP is mounted as shown in FIGS. 2 (a) and 2 (b). In the figure, 60 is TC
P is shown, 61 is a main body, 62 is a lead (62a,
Only 62b is shown), and 70 is a printed circuit board.
The suction device 11 of the outer lead bonding apparatus is operated to adsorb the TCP 60 in the TCP supply section (not shown). At this time, the intake air is the intake portion 21 of the support body 21.
b, internal space 21a, intake passage 24, recess 42, intake groove 4
3a to 43d and T through intake holes 41a to 41d
It acts on the upper surface of the body 61 of the CP 60 in the figure. For this reason,
The body 61 of the TCP 60 is adsorbed on the lower surface of the adsorbing portion body 31 of the adsorbing portion 30. The attitude of the TCP 60 before the contact with the printed circuit board 70 is kept constant by the restoring force of the O-ring 54. Further, the intake air is prevented from leaking through the gap between the support body 21 and the suction body 31.

The positions of the TCP 60 and the printed circuit board 70 are recognized by an optical system (not shown). Then, based on the result of the recognition, the TCP 60 adsorbed on the lower surface of the adsorbing part body 31 of the adsorbing part 30 is positioned above the printed circuit board 70 by a predetermined position. Next, as shown in FIG. 2A, the mount head body 10 is slid downward in the drawing.
If the TCP 60 is held parallel to the printed circuit board 70, all the leads 62 of the TCP 60 will be in good contact with a predetermined pad provided on the printed circuit board 70 by directly contacting the TCP 60 with the printed circuit board 70. To do.

On the other hand, when the TCP 60 is not held parallel to the printed circuit board 70, the lead 62a at the left end in the figure first contacts the printed circuit board 70. When the downward sliding movement of the mount head body 10 continues as it is, the lead 62a bends, and the elasticity of the lead 62a itself exerts an upward force in the drawing. For this reason, a rotational moment in the clockwise direction acts on the suction portion 30 around the recess 42a in FIG.

Further, when the mount head main body 10 is slid downward, the suction portion 30 swings clockwise around the recess 42a as a swing center, and the suction portions 30 and T.
The CP 60 and the printed circuit board 70 are copied. Adsorption part 30
When the printed circuit board 70 and the printed circuit board 70 are substantially parallel to each other, as shown in FIG.
As shown in FIG. 5, the lead 62b at the right end of the TCP 60 in the figure contacts the printed circuit board 70.

Further, when the mount head body 10 is slid downward, the leads 62a of the TCP 60,
When the amount of deflection of 62b becomes substantially the same, the suction part 30 and the printed circuit board 70 become parallel, and all the leads 62 of the TCP 60 uniformly contact the pads of the printed circuit board 70.

As described above, according to this embodiment, even if the TCP 60 comes into contact with the printed circuit board 70 while being tilted, the TC
Since P60 swings, all the leads come into contact with the printed circuit board almost at the same time without applying high pressure. Further, since the recess 42a is used as the swing center, the amount of horizontal movement of the lead 62 of the TCP 60 due to the swing can be suppressed to a minimum, so that highly accurate soldering connection with the lead 62 of the TCP 60 can be realized.

The present invention is not limited to the above embodiment. That is, although the electronic component suction nozzle is applied to the outer lead bonding apparatus in the above embodiment, it may be applied to another bonding apparatus. Of course, various modifications can be made without departing from the scope of the present invention.

[0020]

According to the present invention, when the electronic component and the printed circuit board are not held in parallel with each other, a force is applied from the portion of the electronic component that first contacts the printed circuit board,
The suction part swings in a direction such that the electronic component and the printed circuit board are parallel to each other. Therefore, even if the electronic component suction head and the printed circuit board are not held in parallel with each other, or even if the printed circuit board is bent, all the leads of the electronic component and the pads of the printed circuit board can be made uniform with low pressure. Can be contacted. Therefore, a backup, which is used when all the leads are brought into contact with each other by high pressure, becomes unnecessary, and the degree of freedom in product design can be increased. Furthermore, since the suction part is supported by the tip of the support part, the center of swing is closer to the electronic component, and it is possible to minimize the misalignment of the leads of the electronic component due to the swing, and highly accurate soldering connection. Is possible.

[Brief description of drawings]

FIG. 1 is a diagram showing an electronic component suction nozzle incorporated in a mount head according to an embodiment of the present invention, FIG.
Is a vertical cross-sectional view taken along the line AA in (b) and seen from the arrow direction, and (b) is a bottom view.

FIG. 2 is an explanatory view showing an operation of mounting a TCP on a printed circuit board by using the electronic component suction nozzle in the embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Mount head main body 11 ... Intake device 20 ... Support part 21 ... Support part main body 22 ... Collar part 23 ... Projection part 24 ... Intake passage 30 ... Adsorption part 31 ... Adsorption part main body 32 ... First opening part 33 ... Second opening Parts 34a to 34d ...
Claw 40 ... Member 40a-40d ...
Corners 41a to 41d ... Adsorption holes 42 ... Recesses 42a ... Recesses 43a to 43d ...
Intake groove 44 ... Recess 50 ... Upper lid 51a, 51b ... Screw 52 ... Hole 53 ... Engagement 54 ... O-ring 60 ... TCP 70 ... Printed circuit board

Claims (3)

[Claims] 1. An electronic component suction nozzle for sucking and holding an electronic component for mounting on a printed circuit board, a support portion, a suction portion for sucking the electronic component, and a suction portion provided at a tip portion of the support portion. An electronic component suction nozzle, comprising: a support mechanism that swingably supports the portion, and an elastic member that elastically holds the suction portion on the support portion. 2. The supporting mechanism includes a protrusion and a collar portion provided at the tip of the supporting portion, and a recessed portion provided on the support portion side of the suction portion and into which the protrusion and the collar portion are inserted. ,
A concave portion provided on the bottom surface of the concave portion for swingably engaging the projection portion and a concave portion side wall projecting from the flange portion to the support portion side and engaging with the flange portion via the elastic member. An electronic component suction nozzle, comprising: 3. The electronic component suction nozzle according to claim 2, wherein the elastic member is an O-ring.