JP2002178287A - Electronic part mounting device - Google Patents
Electronic part mounting deviceInfo
- Publication number
- JP2002178287A JP2002178287A JP2000382510A JP2000382510A JP2002178287A JP 2002178287 A JP2002178287 A JP 2002178287A JP 2000382510 A JP2000382510 A JP 2000382510A JP 2000382510 A JP2000382510 A JP 2000382510A JP 2002178287 A JP2002178287 A JP 2002178287A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- suction
- pad
- axis direction
- axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manipulator (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、電子部品搭載装置
に関する。The present invention relates to an electronic component mounting apparatus.
【0002】[0002]
【従来の技術】従来、電子部品搭載装置はテープフィー
ダ等の電子部品供給装置により供給される電子部品を基
板上の所定の位置に搭載するために、中心軸線であるθ
軸が鉛直のZ軸方向に配置され、電子部品を真空吸着可
能である電子部品吸着ノズルと、この電子部品吸着ノズ
ルを前記Z軸及びこれと直交するX軸方向及びY軸方向
に移動自在、前記θ軸廻りに回転自在に支持するヘッド
部と、このヘッド部を前記Z軸と直交するX−Y軸方向
移動自在に支持するX−Y駆動ユニットと、画像認識装
置とを有している。2. Description of the Related Art Conventionally, an electronic component mounting apparatus has a central axis θ for mounting an electronic component supplied by an electronic component supply device such as a tape feeder at a predetermined position on a substrate.
An electronic component suction nozzle whose axis is arranged in the vertical Z-axis direction and capable of vacuum-sucking electronic components; and the electronic component suction nozzle is movable in the X-axis direction and the Y-axis direction orthogonal to the Z axis. A head unit rotatably supporting the θ axis, an XY drive unit supporting the head unit so as to be movable in an XY axis direction orthogonal to the Z axis, and an image recognition device. .
【0003】画像認識装置は電子部品供給装置と基板と
の間において、電子部品吸着ノズルに対する電子部品の
吸着誤差(設計上の正規の吸着姿勢に対する誤差)を検
出するために備えられている。この検出された吸着誤差
を補正しつつ電子部品は基板上の所定の位置に搭載され
る。The image recognition device is provided between the electronic component supply device and the substrate to detect an error of suction of the electronic component with respect to the electronic component suction nozzle (error with respect to a normal suction attitude in design). The electronic component is mounted at a predetermined position on the board while correcting the detected suction error.
【0004】電子部品吸着ノズルは、一般的に、筒状体
のノズルスライダと、このノズルスライダを軸線方向の
一定範囲で摺動自在に支持するノズルホルダと、ノズル
スライダを先端方向に付勢する緩衝ばねと、を有して構
成され、ノズルスライダ下端部を電子部品上面に当接さ
せつつ上端部側から供給される負圧により、電子部品を
真空吸着するようにされている。The electronic component suction nozzle is generally a nozzle slider having a cylindrical body, a nozzle holder which supports the nozzle slider slidably within a predetermined range in the axial direction, and biases the nozzle slider in a tip direction. And a buffer spring, wherein the electronic component is vacuum-sucked by negative pressure supplied from the upper end while the lower end of the nozzle slider is in contact with the upper surface of the electronic component.
【0005】しかし、電子部品が例えば図5に示される
コイルを備えるトランス90等のように、上面に微細な
起伏を有している場合、ノズルスライダ先端部と電子部
品上面とが密着することができずに負圧が漏れて電子部
品を真空吸着することができないことがある。However, when the electronic component has fine undulations on the upper surface, such as a transformer 90 having a coil as shown in FIG. 5, the tip of the nozzle slider may come into close contact with the upper surface of the electronic component. In some cases, the negative pressure leaks and the electronic component cannot be vacuum-sucked.
【0006】このような上面に微細な起伏を有する電子
部品を真空吸着するために、例えば図6に示されるよう
な、下端部にゴム、樹脂等の弾性体吸着パッド100が
設けられたパッド付電子部品吸着ノズル102が知られ
ている。In order to vacuum-suction such an electronic component having fine undulations on its upper surface, for example, as shown in FIG. 6, a pad provided with an elastic suction pad 100 made of rubber, resin or the like at its lower end is provided. An electronic component suction nozzle 102 is known.
【0007】吸着パッド100は、上端近傍においてノ
ズルスライダ104の下端部104aに嵌着し、自身の
下端近傍に下向きに拡開する開口部100aを有してい
る。The suction pad 100 has an opening 100a which is fitted to the lower end portion 104a of the nozzle slider 104 near the upper end and expands downward near the lower end thereof.
【0008】吸着パッド100の開口部外周縁100b
は電子部品90上面の微細な起伏に当接して、該起伏の
形状に追従して弾性変形することにより、該電子部品9
0上面に密着可能とされている。The outer peripheral edge 100b of the opening of the suction pad 100
Abuts on the fine undulations on the upper surface of the electronic component 90 and follows the shape of the undulation and is elastically deformed.
0 can be in close contact with the upper surface.
【0009】更に、吸着パッド100の開口部内に負圧
が供給されることにより、開口部外周縁100aは大気
圧で電子部品90上面に押付けられ、該電子部品90上
面に確実に密着するようにされている。Further, when a negative pressure is supplied into the opening of the suction pad 100, the outer peripheral edge 100a of the opening is pressed against the upper surface of the electronic component 90 at atmospheric pressure so that the outer peripheral edge 100a is securely brought into close contact with the upper surface of the electronic component 90. Have been.
【0010】ここで、近年、電子部品の精密化等のた
め、より高精度な電子部品の搭載が要求される傾向にあ
り、画像認識装置による吸着誤差の検出、及びその補正
の精度の向上が求められている。[0010] In recent years, there has been a tendency to mount electronic components with higher precision in order to make electronic components more precise, etc., and it has been required to detect an adsorption error and improve the accuracy of correction by an image recognition device. It has been demanded.
【0011】[0011]
【発明が解決しようとする課題】しかし、吸着パッド1
00はゴム、樹脂等の弾性体であるため、パッド付電子
部品吸着ノズル102で電子部品106を吸着し、該電
子部品106を画像認識装置108の上方まで搬送して
吸着誤差を検出する際、該電子部品106が吸着パッド
100を弾性変形させつつ振動して吸着姿勢が定まら
ず、高精度な吸着誤差の検出ができないという問題があ
った。However, the suction pad 1
Since 00 is an elastic body such as rubber or resin, when the electronic component 106 is sucked by the pad-attached electronic component suction nozzle 102 and the electronic component 106 is conveyed to above the image recognition device 108 to detect a suction error, There is a problem that the electronic component 106 vibrates while elastically deforming the suction pad 100 and the suction posture is not determined, and a highly accurate suction error cannot be detected.
【0012】これに対して、吸着パッドの剛性を高める
ことにより、パッド付電子部品吸着ノズルに吸着される
電子部品の振動を制限して吸着姿勢を安定させることが
できるが、剛性の高い吸着パッドは電子部品上面の微細
な起伏に対する追従性が悪いため、該電子部品上面との
不十分な密着により負圧が漏れて、吸引力が低下し、該
電子部品を確実に吸着することができないという問題が
ある。On the other hand, by increasing the rigidity of the suction pad, the vibration of the electronic component sucked by the pad-attached electronic component suction nozzle can be restricted to stabilize the suction posture. Has poor followability with respect to fine undulations on the upper surface of the electronic component, so that the negative pressure leaks due to insufficient close contact with the upper surface of the electronic component, the suction force decreases, and the electronic component cannot be reliably attracted. There's a problem.
【0013】本発明は、以上のような問題点に鑑みてな
されたものであり、上面に微細な起伏を有する電子部品
を確実、且つ、安定した吸着姿勢で吸着し、基板上への
電子部品の高精度な搭載を実現することができる電子部
品搭載装置を供給することを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and it is an object of the present invention to reliably and stably adsorb an electronic component having fine undulations on its upper surface and to attach the electronic component onto a substrate. It is an object of the present invention to provide an electronic component mounting apparatus capable of realizing high precision mounting of electronic components.
【0014】[0014]
【課題を解決するための手段】本発明は、請求項1のよ
うに、中心軸線であるθ軸が鉛直のZ軸方向に配置さ
れ、下端部に吸着パッドが設けられて、該吸着パッドの
開口部外周縁を電子部品に密着させつつ上端部側から供
給される負圧により電子部品を真空吸着可能であり、前
記Z軸及びこれと直交するX軸方向及びY軸方向に移動
自在、前記θ軸廻りに回転自在のパッド付電子部品吸着
ノズルを備えてなり、前記吸着した電子部品を基板上に
搭載する電子部品搭載装置において、前記吸着パッドの
開口部外周縁よりも前記X−Y軸方向の外側で下向きに
突出する突出部を含んでなり、該突出部の突出端の前記
Z軸方向の位置が前記吸着パッドの開口部外周縁の前記
Z軸方向の可撓範囲内とされ、吸着される電子部品に前
記突出端において当接して、該電子部品を一定の吸着姿
勢に保持する吸着ガイドが設けられたことを特徴とする
電子部品搭載装置により、上記目的を達成するものであ
る。According to the present invention, as in claim 1, the θ axis as the center axis is arranged in the vertical Z-axis direction, and a suction pad is provided at a lower end portion. The electronic component can be vacuum-sucked by the negative pressure supplied from the upper end while the outer peripheral edge of the opening is brought into close contact with the electronic component, and can be moved in the X-axis direction and the Y-axis direction orthogonal to the Z-axis. An electronic component mounting apparatus comprising a pad-attached electronic component suction nozzle rotatable about the θ axis, wherein the picked-up electronic component is mounted on a substrate. A protruding portion that protrudes downward on the outside of the direction, the position of the protruding end of the protruding portion in the Z-axis direction is within the flexible range in the Z-axis direction of the outer peripheral edge of the opening of the suction pad, Abuts on the electronic component to be sucked at the protruding end According to another aspect of the present invention, there is provided an electronic component mounting apparatus provided with a suction guide for holding the electronic component in a fixed suction position.
【0015】又、前記突出端のZ軸方向の位置を、電子
部品非吸着時における前記吸着パッドの開口部外周縁の
Z軸方向常態位置又は該Z軸方向常態位置よりも前記上
端部側の範囲内としてもよい。The position of the protruding end in the Z-axis direction may be a normal position in the Z-axis direction of the outer peripheral edge of the opening of the suction pad when the electronic component is not suctioned, or a position closer to the upper end than the normal position in the Z-axis direction. It may be within the range.
【0016】更に、前記吸着ガイドの前記突出部は各々
下向きに突出する3つの爪状部からなるようにしてもよ
い。Further, the projecting portion of the suction guide may include three claw-like portions projecting downward.
【0017】本発明によれば、上面に微細な起伏を有す
る電子部品を確実、且つ、安定した吸着姿勢で吸着して
高い精度で基板上に搭載することができる。According to the present invention, an electronic component having fine undulations on its upper surface can be reliably and stably adsorbed in a suction posture and mounted on a substrate with high accuracy.
【0018】[0018]
【発明の実施の形態】以下、本発明の実施の形態の例を
図面を参照して詳細に説明する。Embodiments of the present invention will be described below in detail with reference to the drawings.
【0019】本発明の実施の形態の例に係る電子部品搭
載装置10は、図1〜図4に示されるパッド付電子部品
吸着ノズル12の構造に特徴を有している。The electronic component mounting apparatus 10 according to the embodiment of the present invention is characterized by the structure of the pad-attached electronic component suction nozzle 12 shown in FIGS.
【0020】該電子部品搭載装置10の全体構造につい
て概説すると、該電子部品搭載装置10は、中心軸線で
あるθ軸が鉛直のZ軸方向の筒状体のスライドシャフト
14と、このスライドシャフト14をZ軸方向移動自
在、且つ、前記θ軸廻りに回転自在に支持するヘッド部
16と、このヘッド部16を前記Z軸と直交するX−Y
軸方向移動自在に支持するX−Y駆動部18と、CCD
カメラを含んでなる画像認識装置20とを有している。An outline of the overall structure of the electronic component mounting apparatus 10 is as follows. The electronic component mounting apparatus 10 includes a cylindrical slide shaft 14 in the Z-axis direction in which the central axis is a vertical θ axis, and the slide shaft 14. , Which is movable in the Z-axis direction and is rotatable about the θ-axis, and XY orthogonal to the Z-axis.
An XY drive unit 18 that supports an axially movable unit, and a CCD
And an image recognition device 20 including a camera.
【0021】前記パッド付電子部品吸着ノズル12は前
記Z軸方向に配置されると共に、前記スライドシャフト
14下端近傍に着脱自在に支持され、中心軸線が前記θ
軸と一致している。又、前記パッド付電子部品吸着ノズ
ル12は、該スライドシャフト14を介して供給される
負圧により下端部に設けられた吸着パッド22において
電子部品24を真空吸着可能、電子部品供給装置26と
基板28との間で移動自在とされている。The pad-attached electronic component suction nozzle 12 is arranged in the Z-axis direction, is detachably supported near the lower end of the slide shaft 14, and has a center axis of θ.
Coincides with the axis. The pad-attached electronic component suction nozzle 12 can vacuum-suck an electronic component 24 at a suction pad 22 provided at a lower end portion by a negative pressure supplied through the slide shaft 14. 28 is movable.
【0022】以下、該電子部品吸着ノズル12の構造に
ついて説明する。なお、電子部品搭載装置10の他の部
分の構造については従来と同様であるので説明を省略す
る。Hereinafter, the structure of the electronic component suction nozzle 12 will be described. Since the structure of the other parts of the electronic component mounting apparatus 10 is the same as that of the related art, the description is omitted.
【0023】前記電子部品吸着ノズル12は、前記Z軸
方向の筒状体のノズルスライダ30と、このノズルスラ
イダ30の下端近傍に支持される前記吸着パッド22
と、同様に前記ノズルスライダ30の下端近傍に支持さ
れる吸着ガイド32と、前記ノズルスライダ30を軸線
方向摺動自在に支持するノズルホルダ34と、前記ノズ
ルスライダ30を下向きに付勢する緩衝ばね36と、ピ
ン38とを有して構成されている。The electronic component suction nozzle 12 includes a cylindrical nozzle slider 30 extending in the Z-axis direction and the suction pad 22 supported near a lower end of the nozzle slider 30.
Similarly, a suction guide 32 supported near the lower end of the nozzle slider 30, a nozzle holder 34 for supporting the nozzle slider 30 slidably in the axial direction, and a buffer spring for urging the nozzle slider 30 downward. 36 and a pin 38.
【0024】前記ノズルスライダ30は下端近傍が他部
よりも細い段付軸形状で、該下端近傍は更に3段階の段
付形状とされ、下端中段部30aが下端上段部30b及
び下端下段部30cよりも細くされている。The nozzle slider 30 has a stepped shaft shape near the lower end, which is thinner than the other portion, and has a stepped shape near the lower end. The lower middle portion 30a has a lower upper end portion 30b and a lower lower end portion 30c. It is thinner than it is.
【0025】又、前記ノズルスライダ30の上端近傍の
側面には、前記Z軸方向の長孔30dが形成されてい
る。On the side surface near the upper end of the nozzle slider 30, the long hole 30d in the Z-axis direction is formed.
【0026】前記吸着パッド22はゴム製の弾性体で、
上端側の段付孔22aにおいて自身の緊縛力により前記
ノズルスライダ30の前記下端中段部30a及び前記下
端上段部30bに嵌着している。The suction pad 22 is an elastic body made of rubber.
The nozzle slider 30 is fitted in the lower middle portion 30a and the lower upper portion 30b of the nozzle slider 30 by its own binding force in the upper stepped hole 22a.
【0027】前記吸着パッド22の下端近傍には下向き
に拡開して開口する吸盤状の開口部22bが形成され、
最下端の開口部外周縁22cが特に前記Z軸方向に容易
に撓むようにされている。A suction cup-shaped opening 22b is formed near the lower end of the suction pad 22 so as to open downward and open.
The lowermost opening outer peripheral edge 22c is designed to be easily bent particularly in the Z-axis direction.
【0028】又、前記開口部22bと前記段付孔22a
との間には通気孔22dが形成されている。The opening 22b and the stepped hole 22a
Is formed with a vent hole 22d.
【0029】前記吸着ガイド32は、前記吸着パッド2
2の前記開口部外周縁22cよりも前記X−Y軸方向外
側で下向きに突出する突出部40と、この突出部40と
一体に形成されたリング状の上端嵌着部32aとからな
り、該上端嵌着部32aの中心孔において前記ノズルス
ライダ30の前記下端上段部30bに嵌着し、接着剤で
固定されている。The suction guide 32 is connected to the suction pad 2.
A projection 40 protruding downward outside the opening outer peripheral edge 22c in the XY axis direction, and a ring-shaped upper end fitting portion 32a formed integrally with the projection 40. The nozzle slider 30 is fitted into the upper end portion 30b of the lower end of the nozzle slider 30 at a center hole of the upper end fitting portion 32a, and is fixed with an adhesive.
【0030】前記突出部40は、各々下向きに突出し、
θ軸廻りの略等角度位置に設置された3つの爪状部40
aからなる構成とされている。なお、これら爪状部40
aの前記θ軸からの離間距離は略同一とされている。The projecting portions 40 project downward, respectively.
Three claw-shaped portions 40 installed at substantially equal angular positions around the θ axis
a. Note that these claw-shaped portions 40
The distance a from the θ axis is substantially the same.
【0031】これら爪状部40aの突出端40bの前記
Z軸方向の位置は前記吸着パッド22の開口部外周縁2
2aの電子部品非吸着時における前記Z軸方向常態位置
と略同一位置とされている。The positions of the protruding ends 40b of the claw-shaped portions 40a in the Z-axis direction correspond to the outer peripheral edges 2 of the opening of the suction pad 22.
The position 2a is substantially the same as the normal position in the Z-axis direction when the electronic component is not sucked.
【0032】前記ノズルホルダ34は筒状体で中心孔3
4aにおいて前記ノズルスライダ30の外周部に遊嵌
し、ニップル状に形成された自身の上端部34bにおい
て前記スライドシャフト14下端に着脱自在に支持され
ている。The nozzle holder 34 is cylindrical and has a central hole 3
At 4a, the nozzle slider 30 is loosely fitted to the outer peripheral portion, and is detachably supported by the lower end of the slide shaft 14 at its upper end portion 34b formed in a nipple shape.
【0033】又、前記ノズルホルダ34の前記Z軸方向
略中央位置には外周面から中心孔まで貫通するねじ孔3
4cが形成され、このねじ孔34cには前記ピン38が
螺合している。A screw hole 3 penetrating from the outer peripheral surface to the center hole is provided substantially at the center of the nozzle holder 34 in the Z-axis direction.
4c is formed, and the pin 38 is screwed into the screw hole 34c.
【0034】該ピン38はおねじ部の軸線方向一端面中
央から円柱状のピン部38aが突出した形状で、このピ
ン部38aにおいて前記ノズルスライダ30の前記長孔
30dに遊嵌している。The pin 38 has a cylindrical pin portion 38a projecting from the center of one end surface in the axial direction of the male screw portion, and is loosely fitted in the long hole 30d of the nozzle slider 30 at the pin portion 38a.
【0035】これにより前記ノズルスライダ30は前記
ノズルホルダ34に対してZ方向の一定範囲で摺動自
在、且つ、前記θ軸廻りに回転不能とされている。Thus, the nozzle slider 30 is slidable with respect to the nozzle holder 34 within a certain range in the Z direction, and is not rotatable around the θ axis.
【0036】前記緩衝ばね36は、前記ノズルスライダ
30を取り巻くように配置された圧縮コイルばねで上端
において前記ノズルホルダ34の下端に当接し、下端に
おいて前記吸着ガイド32の上端に当接すると共に、自
然長よりも圧縮された状態で装架されて、前記ノズルス
ライダ30を下向きに付勢している。The cushioning spring 36 is a compression coil spring disposed so as to surround the nozzle slider 30 and contacts the lower end of the nozzle holder 34 at the upper end and the upper end of the suction guide 32 at the lower end. It is mounted in a state where it is compressed more than its length, and urges the nozzle slider 30 downward.
【0037】次に、本実施の形態の例に係る電子部品搭
載装置10の電子部品搭載時における作用について説明
する。Next, the operation of the electronic component mounting apparatus 10 according to this embodiment when mounting electronic components will be described.
【0038】前記電子部品供給装置26において、電子
部品24を真空吸着するときは、前記ヘッド部16及び
前記X−Y駆動部18を駆動して前記パッド付電子部品
吸着ノズル12を前記電子部品供給装置26上の前記電
子部品24の上方に移動させた後、下降させ、前記吸着
パッド22及び前記吸着ガイド32を電子部品24上面
に当接させつつ、前記スライドシャフト14を介して前
記吸着パッド22の開口部22cへ負圧を供給して該電
子部品24を真空吸着する。In the electronic component supply device 26, when the electronic component 24 is vacuum-sucked, the head unit 16 and the XY drive unit 18 are driven to cause the electronic component suction nozzle 12 with the pad to supply the electronic component. After being moved above the electronic component 24 on the device 26, it is lowered, and the suction pad 22 and the suction guide 32 are brought into contact with the upper surface of the electronic component 24 while the suction pad 22 is moved through the slide shaft 14. A negative pressure is supplied to the opening 22c to vacuum-suction the electronic component 24.
【0039】前記吸着パッド22がゴム製の弾性体とさ
れているので、前記開口部外周縁22cが前記電子部品
24の上面の微細な起伏の形状に追従して弾性変形し、
該電子部品24の上面に密着する。Since the suction pad 22 is an elastic body made of rubber, the outer peripheral edge 22c of the opening portion is elastically deformed following the fine undulation on the upper surface of the electronic component 24,
It is in close contact with the upper surface of the electronic component 24.
【0040】更に、該吸着パッド22の開口部22b内
に負圧が供給されることにより、前記開口部外周縁22
cは大気圧で前記電子部品24の上面に押付けられ、該
電子部品24の上面に更に強く密着する。Further, when a negative pressure is supplied into the opening 22b of the suction pad 22, the outer peripheral edge 22 of the opening is formed.
c is pressed against the upper surface of the electronic component 24 under the atmospheric pressure, and further strongly adheres to the upper surface of the electronic component 24.
【0041】これにより上面に微細な起伏を有する前記
電子部品24を確実に吸着することができる。Thus, the electronic component 24 having fine undulations on the upper surface can be reliably sucked.
【0042】この際、前記吸着パッド22及び前記吸着
ガイド32は、前記ノズルスライダ30と共に前記緩衝
ばね36の付勢力に抗して引込みつつ、前記電子部品供
給装置26の取付誤差等を吸収するので、該電子部品2
4が破損することはない。At this time, the suction pad 22 and the suction guide 32, together with the nozzle slider 30, retract against the urging force of the buffer spring 36, and absorb mounting errors and the like of the electronic component supply device 26. , The electronic component 2
4 is not damaged.
【0043】該電子部品24を真空吸着後、前記ヘッド
部16を駆動して前記パッド付電子部品吸着ノズル12
を上昇させると、前記電子部品24も前記電子部品吸着
ノズル12と共に上昇する。After the electronic component 24 has been vacuum-sucked, the head 16 is driven to drive the electronic-device-adsorbing nozzle 12 with the pad.
Is raised, the electronic component 24 is also raised together with the electronic component suction nozzle 12.
【0044】前記電子部品24、前記吸着パッド22及
び前記吸着ガイド32は、前記ノズルスライダ30と共
に前記緩衝ばね36に付勢されて突出し、下限位置に保
持される。The electronic component 24, the suction pad 22, and the suction guide 32 are urged by the buffer spring 36 together with the nozzle slider 30 to protrude, and are held at the lower limit position.
【0045】前記吸着パッド22はゴム製の弾性体であ
るので、自身が撓みつつ吸着した電子部品24を上向き
に吸引可能であるが、該電子部品24の上端は前記吸着
ガイド32の突出部40に当接しているので、該電子部
品24は前記パッド付電子部品吸着ノズル12に対して
一定の吸着姿勢に保持される。Since the suction pad 22 is an elastic body made of rubber, the suction pad 22 is capable of upwardly sucking the sucked electronic component 24 while flexing itself, but the upper end of the electronic component 24 has a protrusion 40 of the suction guide 32. Therefore, the electronic component 24 is held in a fixed suction posture with respect to the pad-attached electronic component suction nozzle 12.
【0046】又、前記突出部40はθ軸廻りの略等角度
位置に設置された3つの爪状部40aからなる構成とさ
れ、前記電子部品24を3ヶ所で支持するので、該電子
部品24は力学的静定状態で前記パッド付電子部品吸着
ノズル12に対して一定の吸着姿勢に保持され、安定す
る。The protruding portion 40 has three claw-shaped portions 40a installed at substantially equal angular positions around the θ axis, and supports the electronic component 24 at three places. Is held in a fixed suction posture with respect to the pad-attached electronic component suction nozzle 12 in a mechanically static state, and is stabilized.
【0047】更に、前記突出部40は前記吸着パッド2
2の前記開口部外周縁22cよりも前記X−Y軸方向外
側に配置されているので、該開口部外周縁22cよりも
前記X−Y軸方向内側に配置される場合に対して3つの
前記爪状部40a同士の離間距離、即ち前記電子部品2
4の支持点間距離が長くなり、それだけ該電子部品24
の吸着姿勢は安定する。Further, the protruding portion 40 is provided on the suction pad 2.
2 is disposed outside the outer peripheral edge 22c of the opening in the XY axis direction. The distance between the claw-shaped portions 40a, that is, the electronic component 2
4, the distance between the support points becomes longer, and
Is stable.
【0048】次に、該電子部品24の前記パッド付電子
部品吸着ノズル12に対する吸着誤差(設計上の正規の
吸着姿勢に対する誤差)を検出するため、前記X−Y駆
動部18を駆動して該電子部品24を前記画像認識装置
20の上方まで移動させる。Next, in order to detect a suction error of the electronic component 24 with respect to the pad-attached electronic component suction nozzle 12 (error with respect to a normal suction posture in design), the XY drive section 18 is driven to drive the electronic component 24. The electronic component 24 is moved to a position above the image recognition device 20.
【0049】この移動中も、前記電子部品24が前記吸
着ガイド32に支持されているので、前記吸着パッド2
2がゴム製の弾性体であるにも拘らず、該電子部品24
が該吸着パッド22を撓ませつつ振動することがなく、
吸着姿勢は一定に保持される。Even during this movement, since the electronic component 24 is supported by the suction guide 32,
Although the electronic component 24 is a rubber elastic body,
Does not vibrate while flexing the suction pad 22,
The suction attitude is kept constant.
【0050】これにより、前記画像認識装置20は、正
確に吸着誤差を検出することができる。Thus, the image recognition device 20 can accurately detect the suction error.
【0051】次に、前記ヘッド部16及び前記X−Y駆
動部18を駆動して、検出した吸着誤差を補正しつつ前
記電子部品24を前記基板28の所定の搭載位置上方ま
で移動させた後、下降させて該電子部品24を前記基板
28上に当接させる。Next, the head part 16 and the XY drive part 18 are driven to move the electronic component 24 above a predetermined mounting position of the board 28 while correcting the detected suction error. Then, the electronic component 24 is lowered to contact the electronic component 24 on the substrate 28.
【0052】吸着誤差が正確に検出されているので、前
記電子部品24は正確な補正により前記基板28上の所
定の搭載位置に確実に当接する。Since the suction error has been accurately detected, the electronic component 24 reliably comes into contact with a predetermined mounting position on the substrate 28 by accurate correction.
【0053】又この際、前記吸着パッド22及び前記吸
着ガイド32が前記ノズルスライダ30と共に引込むこ
とにより基盤の前記Z軸方向の製造誤差等を吸収するの
で、前記電子部品24は破損することなく前記基板28
上に当接する。At this time, since the suction pad 22 and the suction guide 32 are retracted together with the nozzle slider 30 to absorb a manufacturing error in the Z-axis direction of the substrate, the electronic component 24 is not damaged. Substrate 28
Abut on top.
【0054】次に、前記パッド付電子部品吸着ノズル1
2への負圧の供給を停止すると共に若干の正圧を供給
し、前記ヘッド部16を駆動して前記パッド付電子部品
吸着ノズル12を上昇させると、該パッド付電子部品吸
着ノズル12から前記電子部品24は解放されて、前記
基板28上に載置される。以後同様に電子部品搭載作業
を繰り返す。Next, the electronic component suction nozzle with pad 1
When the supply of the negative pressure to the pad 2 is stopped and a slight positive pressure is supplied to drive the head unit 16 to raise the electronic component suction nozzle 12 with the pad, the electronic component suction nozzle 12 with the pad The electronic component 24 is released and placed on the substrate 28. Thereafter, the electronic component mounting operation is repeated in the same manner.
【0055】なお、本実施の形態の例において、前記突
出部40の前記突出端40bのZ方向の位置は、前記吸
着パッド22の開口部外周縁22cの電子部品非吸着時
における前記Z軸方向常態位置と略同一位置とされてい
るが、本発明はこれに限定されるものではなく、前記突
出端40bの前記Z軸方向の位置は前記開口部外周縁2
2cのZ方向の可撓範囲内であればよい。In the example of the present embodiment, the position of the protruding end 40b of the protruding portion 40 in the Z direction is determined by the Z axis direction of the opening outer peripheral edge 22c of the suction pad 22 when the electronic component is not suctioned. Although the position is substantially the same as the normal position, the present invention is not limited to this, and the position of the protruding end 40b in the Z-axis direction is the outer peripheral edge 2 of the opening.
What is necessary is just to be in the range of flexibility in the Z direction of 2c.
【0056】ここで可撓範囲とは、以下に説明するよう
に前記吸着パッド22の開口部外周縁22cが前記開口
部22bへの負圧の供給により撓み得る範囲をいうもの
である。Here, the flexible range means a range in which the outer peripheral edge 22c of the opening of the suction pad 22 can be bent by supplying a negative pressure to the opening 22b as described below.
【0057】例えば、前記突出端40bの前記Z軸方向
の位置が前記開口部外周縁22aのZ方向の可撓範囲
内、且つ、前記Z軸方向常態位置よりも上方(前記ノズ
ルホルダ34の基端部34b側)に位置する場合、前記
電子部品供給装置26において電子部品24を吸着する
ときに、前記吸着パッド22及び前記吸着ガイド32を
該電子部品24の上方から下降させると、まず前記吸着
パッド22が該電子部品24の上面に当接し、該吸着パ
ッド22を撓ませつつ前記吸着ガイド32が更に下降し
て、該電子部品24の上面に当接する。For example, the position of the protruding end 40b in the Z-axis direction is within the flexible range of the opening outer peripheral edge 22a in the Z-direction and is higher than the normal position in the Z-axis direction (the base of the nozzle holder 34). When the electronic component 24 is sucked by the electronic component supply device 26 when the suction pad 22 and the suction guide 32 are lowered from above the electronic component 24, the suction is performed first. The pad 22 contacts the upper surface of the electronic component 24, and the suction guide 32 further descends while bending the suction pad 22, and contacts the upper surface of the electronic component 24.
【0058】この状態で前記吸着パッド22の開口部内
に負圧を供給すると、前記電子部品24は吸引力により
上方に付勢され、撓んだ前記吸着パッド22の反発力に
抗して前記吸着ガイド32に当接し、吸着姿勢が安定す
る。When a negative pressure is supplied into the opening of the suction pad 22 in this state, the electronic component 24 is urged upward by the suction force, and the suction force is applied against the repelling force of the bent suction pad 22. The suction posture is stabilized by contacting the guide 32.
【0059】一方、前記突出端40bの前記Z軸方向の
位置が前記開口部外周縁22cの前記Z軸方向の可撓範
囲内、且つ、前記Z軸方向常態位置よりも下方に位置す
る場合、前記電子部品供給装置26において電子部品2
4を吸着するときに、前記吸着パッド22及び前記吸着
ガイド32を該電子部品24の上方から下降させると、
まず前記吸着ガイド32が該電子部品24の上面に当接
し、前記吸着パッドは該電子部品24から上方に若干離
間した位置に保持される。On the other hand, when the position of the protruding end 40b in the Z-axis direction is within the flexible range of the opening outer peripheral edge 22c in the Z-axis direction and below the normal position in the Z-axis direction, In the electronic component supply device 26, the electronic component 2
4, when the suction pad 22 and the suction guide 32 are lowered from above the electronic component 24,
First, the suction guide 32 comes into contact with the upper surface of the electronic component 24, and the suction pad is held at a position slightly above the electronic component 24.
【0060】この状態で前記吸着パッド22の開口部2
2b内に負圧を供給すると、該吸着パッド22の開口部
外周縁22c近傍は上方からの大気圧により下方に撓み
つつ前記電子部品24の上面に当接、密着する。In this state, the opening 2 of the suction pad 22 is
When a negative pressure is supplied to the inside of the electronic component 2b, the vicinity of the outer peripheral edge 22c of the opening of the suction pad 22 abuts on and adheres to the upper surface of the electronic component 24 while bending downward due to atmospheric pressure from above.
【0061】これにより前記電子部品24は該吸着パッ
ド22に吸着されると共に、吸引力により上向きに付勢
されつつ上方から前記吸着ガイド32に当接支持され、
吸着姿勢が安定する。As a result, the electronic component 24 is sucked by the suction pad 22, and is supported by the suction guide 32 from above while being urged upward by the suction force.
Suction posture is stabilized.
【0062】即ち、前記突出端40bの前記Z軸方向の
位置が前記開口部外周縁22cの前記Z軸方向の可撓範
囲内であれば、前記Z軸方向常態位置の上方及び下方の
いずれに位置していても、電子部品24は前記吸着パッ
ド22に吸着されると共に前記吸着ガイド32に当接支
持されて吸着姿勢が安定する。That is, if the position of the protruding end 40b in the Z-axis direction is within the flexible range in the Z-axis direction of the opening outer peripheral edge 22c, the position can be either above or below the normal position in the Z-axis direction. Even if the electronic component 24 is located, the electronic component 24 is sucked by the suction pad 22 and is supported in contact with the suction guide 32 to stabilize the suction posture.
【0063】なお、前記吸着パッド22を前記電子部品
24の上面に確実に密着させるためには、前記突出端4
0bのZ方向の位置が前記開口部外周縁22cの前記Z
方向常態位置、又は該Z方向常態位置よりも上方とされ
ていることが望ましい。In order to ensure that the suction pad 22 is in close contact with the upper surface of the electronic component 24, the projecting end 4
0b in the Z direction is the Z of the opening outer peripheral edge 22c.
It is desirable to be at the normal position in the direction or higher than the normal position in the Z direction.
【0064】又、本実施の形態の例において、前記吸着
ガイド32の前記突出部40は3つの前記爪状部40a
からなる構成とされているが、本発明はこれに限定され
るものではなく、吸着する電子部品の上面の微細な起伏
のばらつきが比較的小さい場合には4つ以上の爪状部か
らなる突出部としてもよく、更に、例えば円筒状等の連
続した突出部としてもよい。In the embodiment of the present invention, the projecting portion 40 of the suction guide 32 has three claw-shaped portions 40a.
However, the present invention is not limited to this. When the unevenness of the fine undulations on the upper surface of the electronic component to be attracted is relatively small, the protrusion composed of four or more claws is provided. It may be a part, and further, for example, a continuous protruding part such as a cylindrical shape.
【0065】更に又、本実施の形態の例において、3つ
の前記爪状部40aは前記θ軸廻りの略等角度位置に設
置されているが、本発明はこれに限定されるものではな
く、前記吸着パッド22に吸着される電子部品の吸着姿
勢を一定に保持することができる範囲内で、前記爪状部
40aを前記θ軸廻りの非等角度位置に設置してもよ
い。Furthermore, in the example of the present embodiment, the three claw-shaped portions 40a are installed at substantially equal angular positions around the θ axis, but the present invention is not limited to this. The claw-shaped portion 40a may be installed at a non-equiangular position about the θ axis as long as the electronic component sucked by the suction pad 22 can be held in a fixed posture.
【0066】同様に、吸着姿勢を一定に保持することが
できる範囲内で、前記爪状部40aの前記θ軸からの離
間距離が各々異なるように該爪状部材40aを配置して
もよい。Similarly, the claw-shaped members 40a may be arranged so that the distance between the claw-shaped portions 40a and the θ axis is different within a range in which the suction posture can be kept constant.
【0067】又、前記吸着ガイド32の前記突出部40
の前記突出端40bに、例えばゴムのような摩擦係数の
高い材料を取付けてもよい。このようにすることで吸着
した電子部品が該突出端40bに対して前記X−Y軸方
向に位置ずれすることを防止する効果を高めることがで
きる。Further, the protrusion 40 of the suction guide 32
A material having a high coefficient of friction such as rubber may be attached to the protruding end 40b. By doing so, the effect of preventing the sucked electronic component from being displaced in the XY axis direction with respect to the protruding end 40b can be enhanced.
【0068】[0068]
【発明の効果】本発明によれば、上面に微細な起伏を有
する電子部品を確実、且つ、安定した吸着姿勢で吸着す
ることが可能となり、基板上への電子部品の高精度な搭
載が実現されるという優れた効果がもたらされる。According to the present invention, an electronic component having fine undulations on its upper surface can be reliably and stably sucked in a suction posture, and the electronic component can be mounted on a substrate with high accuracy. The excellent effect is brought about.
【図1】本発明の実施の形態の例に係る電子部品搭載装
置の要部構造を示す斜視図FIG. 1 is a perspective view showing a main structure of an electronic component mounting apparatus according to an embodiment of the present invention.
【図2】同電子部品搭載装置におけるパッド付電子部品
吸着ノズルの構造を拡大して示す断面図FIG. 2 is an enlarged sectional view showing a structure of a pad-attached electronic component suction nozzle in the electronic component mounting apparatus.
【図3】図2における吸着パッド周辺の構造を更に拡大
して示す断面図FIG. 3 is a sectional view showing the structure around the suction pad in FIG. 2 in a further enlarged manner;
【図4】図2における吸着パッド周辺の構造を更に拡大
して示す斜視図FIG. 4 is a perspective view showing a further enlarged structure around a suction pad in FIG. 2;
【図5】トランス(電子部品)の形状を示す斜視図FIG. 5 is a perspective view showing the shape of a transformer (electronic component).
【図6】従来のパッド付電子部品吸着ノズルの構造を示
す断面図FIG. 6 is a sectional view showing a structure of a conventional electronic component suction nozzle with pad.
10…電子部品搭載装置 12、102…パッド付電子部品吸着ノズル 22、100…吸着パッド 22c…開口部外周縁 32…吸着ガイド 40…突出部 40a…爪状部 40b…突出端 DESCRIPTION OF SYMBOLS 10 ... Electronic component mounting apparatus 12, 102 ... Electronic component suction nozzle with a pad 22, 100 ... Suction pad 22c ... Opening outer peripheral edge 32 ... Suction guide 40 ... Projection part 40a ... Claw-shaped part 40b ... Projection end
Claims (3)
置され、下端部に吸着パッドが設けられて、該吸着パッ
ドの開口部外周縁を電子部品に密着させつつ上端部側か
ら供給される負圧により電子部品を真空吸着可能であ
り、前記Z軸及びこれと直交するX軸方向及びY軸方向
に移動自在、前記θ軸廻りに回転自在のパッド付電子部
品吸着ノズルを備えてなり、前記吸着した電子部品を基
板上に搭載する電子部品搭載装置において、 前記吸着パッドの開口部外周縁よりも前記X−Y軸方向
の外側で下向きに突出する突出部を含んでなり、該突出
部の突出端の前記Z軸方向の位置が前記吸着パッドの開
口部外周縁の前記Z軸方向の可撓範囲内とされ、吸着さ
れる電子部品に前記突出端において当接して、該電子部
品を一定の吸着姿勢に保持する吸着ガイドが設けられた
ことを特徴とする電子部品搭載装置。1. A θ axis, which is a central axis, is disposed in a vertical Z-axis direction, a suction pad is provided at a lower end portion, and an outer peripheral edge of an opening portion of the suction pad is brought into close contact with an electronic component from an upper end side. An electronic component suction nozzle with a pad capable of vacuum suction of the electronic component by the supplied negative pressure, movable in the Z-axis and the X-axis direction and the Y-axis direction orthogonal thereto, and rotatable around the θ-axis. An electronic component mounting apparatus for mounting the sucked electronic component on a substrate, comprising: a protruding portion that protrudes downward outside the outer peripheral edge of the opening of the suction pad in the XY axis direction. The position of the protruding end of the protruding portion in the Z-axis direction is within the flexible range in the Z-axis direction of the outer peripheral edge of the opening of the suction pad, and abuts on the electronic component to be suctioned at the protruding end. Keeping electronic components in a fixed suction position Electronic component mounting apparatus characterized by destination guide is provided.
方向の位置が、電子部品非吸着時における前記吸着パッ
ドの開口部外周縁の前記Z軸方向常態位置又は該Z軸方
向常態位置よりも前記上端部側の範囲内とされたことを
特徴とする電子部品搭載装置。2. The Z-axis normal position of the protruding end in the Z-axis direction at the outer peripheral edge of the opening of the suction pad when the electronic component is not suctioned. An electronic component mounting device, wherein the electronic component mounting device is set within a range closer to the upper end portion.
の前記突出部は各々下向きに突出する3つの爪状部から
なることを特徴とする電子部品搭載装置。3. An electronic component mounting apparatus according to claim 1, wherein said projecting portion of said suction guide comprises three claw portions projecting downward.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000382510A JP2002178287A (en) | 2000-12-15 | 2000-12-15 | Electronic part mounting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000382510A JP2002178287A (en) | 2000-12-15 | 2000-12-15 | Electronic part mounting device |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2002178287A true JP2002178287A (en) | 2002-06-25 |
Family
ID=18850317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000382510A Pending JP2002178287A (en) | 2000-12-15 | 2000-12-15 | Electronic part mounting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2002178287A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101571672B1 (en) * | 2014-05-30 | 2015-11-27 | (주)세진디지털통신 | suction nozzle having attaching body with a number of bumpy shapes |
WO2017090243A1 (en) * | 2015-11-27 | 2017-06-01 | 川崎重工業株式会社 | Component-mounting robot system |
JP2018164818A (en) * | 2015-06-29 | 2018-10-25 | 株式会社湯山製作所 | Medicine dispenser |
DE102023120168A1 (en) | 2022-09-16 | 2024-03-21 | Fuji Corporation | Suction nozzle and component assembly device |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6352987A (en) * | 1986-08-25 | 1988-03-07 | キヤノン株式会社 | General-purpose lens hand |
JPS63159899U (en) * | 1987-04-08 | 1988-10-19 | ||
JPS6434190U (en) * | 1987-08-26 | 1989-03-02 | ||
JPH01132388U (en) * | 1988-03-02 | 1989-09-08 | ||
JPH01276800A (en) * | 1988-04-28 | 1989-11-07 | Matsushita Electric Ind Co Ltd | Electronic component mount device |
JPH0425100A (en) * | 1990-05-16 | 1992-01-28 | Nec Kyushu Ltd | Suction pad |
JPH0523987A (en) * | 1991-07-18 | 1993-02-02 | Rohm Co Ltd | Electronic parts suction collet unit |
JPH0538694A (en) * | 1991-08-05 | 1993-02-19 | Advantest Corp | Ic suction device |
JPH0724560U (en) * | 1992-08-21 | 1995-05-09 | ティーディーケイ株式会社 | Work suction tool |
JPH09270599A (en) * | 1996-03-29 | 1997-10-14 | Toshiba Corp | Collet |
-
2000
- 2000-12-15 JP JP2000382510A patent/JP2002178287A/en active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6352987A (en) * | 1986-08-25 | 1988-03-07 | キヤノン株式会社 | General-purpose lens hand |
JPS63159899U (en) * | 1987-04-08 | 1988-10-19 | ||
JPS6434190U (en) * | 1987-08-26 | 1989-03-02 | ||
JPH01132388U (en) * | 1988-03-02 | 1989-09-08 | ||
JPH01276800A (en) * | 1988-04-28 | 1989-11-07 | Matsushita Electric Ind Co Ltd | Electronic component mount device |
JPH0425100A (en) * | 1990-05-16 | 1992-01-28 | Nec Kyushu Ltd | Suction pad |
JPH0523987A (en) * | 1991-07-18 | 1993-02-02 | Rohm Co Ltd | Electronic parts suction collet unit |
JPH0538694A (en) * | 1991-08-05 | 1993-02-19 | Advantest Corp | Ic suction device |
JPH0724560U (en) * | 1992-08-21 | 1995-05-09 | ティーディーケイ株式会社 | Work suction tool |
JPH09270599A (en) * | 1996-03-29 | 1997-10-14 | Toshiba Corp | Collet |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101571672B1 (en) * | 2014-05-30 | 2015-11-27 | (주)세진디지털통신 | suction nozzle having attaching body with a number of bumpy shapes |
JP2018164818A (en) * | 2015-06-29 | 2018-10-25 | 株式会社湯山製作所 | Medicine dispenser |
WO2017090243A1 (en) * | 2015-11-27 | 2017-06-01 | 川崎重工業株式会社 | Component-mounting robot system |
JP2017098501A (en) * | 2015-11-27 | 2017-06-01 | 川崎重工業株式会社 | Component mounting robot system |
CN108293324A (en) * | 2015-11-27 | 2018-07-17 | 川崎重工业株式会社 | Component mount robot system |
US10716251B2 (en) | 2015-11-27 | 2020-07-14 | Kawasaki Jukogyo Kabushiki Kaisha | Component mounting robot system |
CN108293324B (en) * | 2015-11-27 | 2020-12-15 | 川崎重工业株式会社 | Component mounting robot system |
DE102023120168A1 (en) | 2022-09-16 | 2024-03-21 | Fuji Corporation | Suction nozzle and component assembly device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9829802B2 (en) | Conveying hand and lithography apparatus | |
JP6472812B2 (en) | Suction nozzle | |
JP4559970B2 (en) | Manufacturing method of component mounting head and suction nozzle | |
JP2010050418A (en) | Method of controlling electronic component mounting equipment | |
JPH09178809A (en) | Ic handler | |
CN109421191B (en) | Suction hand, conveyance mechanism and method, molding apparatus and method | |
JP2002178287A (en) | Electronic part mounting device | |
JP2007027408A (en) | Suction nozzle mechanism for electronic component | |
JP4399863B2 (en) | Holding device | |
JP3654206B2 (en) | Suction nozzle and electronic component mounting device for micro electronic components | |
JP2000301421A (en) | Device and method for sucking part in electronic part mounting machine | |
JP3408638B2 (en) | Electronic component transfer equipment | |
JP3977904B2 (en) | Electronic component mounting machine component suction head | |
JP3823719B2 (en) | Electronic component mounting apparatus and electronic component mounting method | |
JPH0878884A (en) | Electronic parts vacuum-clamping nozzle | |
CN213368485U (en) | Adsorption equipment and row's piece machine of fingerprint module | |
JP2002283265A (en) | Electronic part sucking nozzle and electronic part mounting device | |
JP2024043062A (en) | Suction nozzle and component mounting machine | |
JP5104378B2 (en) | Component handling device and component mounting device | |
JP2001093918A (en) | Chip suction body for bonding device | |
JP2002164699A (en) | Electronic component mounter | |
JPH06244597A (en) | Parts mounting equipment | |
JP3945453B2 (en) | Nozzle for attracting micro-fragile irregular shaped chips and assembly mounting equipment using the same | |
CN117425327A (en) | Component mounting apparatus and component mounting method | |
JP3076116B2 (en) | Electronic component mounting method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20071211 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090703 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090707 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20091110 |