JP2002178287A - Electronic part mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic part mounting device capable of realizing highly precise mounting of an electronic part on a board by adsorbing the electronic part having fine irregularities on its upper surface certainly and at stable suction attitude. SOLUTION: An suction pad 22 is provided on a head end part, a projected part 40 to project downward on the outside in the X-Y axial direction of an opening part outer peripheral edge 22c of the suction pad is included, a position in the Z axial direction of a projected end 40b of the projected part 40 is in a flexible area in the Z axial direction of the opening part outer peripheral edge 22a of the suction pad 22, it makes contact with the sucked electronic part 24 on the projected end 40b, and an electronic part suction nozzle 12 with a pad on which an suction guide 32 to hold the electronic part 24 at a constant suction attitude is provided is furnished on the electronic part mounting device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an electronic component mounting apparatus.

[0002]

2. Description of the Related Art Conventionally, an electronic component mounting apparatus has a central axis θ for mounting an electronic component supplied by an electronic component supply device such as a tape feeder at a predetermined position on a substrate.
An electronic component suction nozzle whose axis is arranged in the vertical Z-axis direction and capable of vacuum-sucking electronic components; and the electronic component suction nozzle is movable in the X-axis direction and the Y-axis direction orthogonal to the Z axis. A head unit rotatably supporting the θ axis, an XY drive unit supporting the head unit so as to be movable in an XY axis direction orthogonal to the Z axis, and an image recognition device. .

The image recognition device is provided between the electronic component supply device and the substrate to detect an error of suction of the electronic component with respect to the electronic component suction nozzle (error with respect to a normal suction attitude in design). The electronic component is mounted at a predetermined position on the board while correcting the detected suction error.

The electronic component suction nozzle is generally a nozzle slider having a cylindrical body, a nozzle holder which supports the nozzle slider slidably within a predetermined range in the axial direction, and biases the nozzle slider in a tip direction. And a buffer spring, wherein the electronic component is vacuum-sucked by negative pressure supplied from the upper end while the lower end of the nozzle slider is in contact with the upper surface of the electronic component.

However, when the electronic component has fine undulations on the upper surface, such as a transformer 90 having a coil as shown in FIG. 5, the tip of the nozzle slider may come into close contact with the upper surface of the electronic component. In some cases, the negative pressure leaks and the electronic component cannot be vacuum-sucked.

In order to vacuum-suction such an electronic component having fine undulations on its upper surface, for example, as shown in FIG. 6, a pad provided with an elastic suction pad 100 made of rubber, resin or the like at its lower end is provided. An electronic component suction nozzle 102 is known.

The suction pad 100 has an opening 100a which is fitted to the lower end portion 104a of the nozzle slider 104 near the upper end and expands downward near the lower end thereof.

The outer peripheral edge 100b of the opening of the suction pad 100
Abuts on the fine undulations on the upper surface of the electronic component 90 and follows the shape of the undulation and is elastically deformed.
0 can be in close contact with the upper surface.

Further, when a negative pressure is supplied into the opening of the suction pad 100, the outer peripheral edge 100a of the opening is pressed against the upper surface of the electronic component 90 at atmospheric pressure so that the outer peripheral edge 100a is securely brought into close contact with the upper surface of the electronic component 90. Have been.

[0010] In recent years, there has been a tendency to mount electronic components with higher precision in order to make electronic components more precise, etc., and it has been required to detect an adsorption error and improve the accuracy of correction by an image recognition device. It has been demanded.

[0011]

However, the suction pad 1
Since 00 is an elastic body such as rubber or resin, when the electronic component 106 is sucked by the pad-attached electronic component suction nozzle 102 and the electronic component 106 is conveyed to above the image recognition device 108 to detect a suction error, There is a problem that the electronic component 106 vibrates while elastically deforming the suction pad 100 and the suction posture is not determined, and a highly accurate suction error cannot be detected.

On the other hand, by increasing the rigidity of the suction pad, the vibration of the electronic component sucked by the pad-attached electronic component suction nozzle can be restricted to stabilize the suction posture. Has poor followability with respect to fine undulations on the upper surface of the electronic component, so that the negative pressure leaks due to insufficient close contact with the upper surface of the electronic component, the suction force decreases, and the electronic component cannot be reliably attracted. There's a problem.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and it is an object of the present invention to reliably and stably adsorb an electronic component having fine undulations on its upper surface and to attach the electronic component onto a substrate. It is an object of the present invention to provide an electronic component mounting apparatus capable of realizing high precision mounting of electronic components.

[0014]

According to the present invention, as in claim 1, the θ axis as the center axis is arranged in the vertical Z-axis direction, and a suction pad is provided at a lower end portion. The electronic component can be vacuum-sucked by the negative pressure supplied from the upper end while the outer peripheral edge of the opening is brought into close contact with the electronic component, and can be moved in the X-axis direction and the Y-axis direction orthogonal to the Z-axis. An electronic component mounting apparatus comprising a pad-attached electronic component suction nozzle rotatable about the θ axis, wherein the picked-up electronic component is mounted on a substrate. A protruding portion that protrudes downward on the outside of the direction, the position of the protruding end of the protruding portion in the Z-axis direction is within the flexible range in the Z-axis direction of the outer peripheral edge of the opening of the suction pad, Abuts on the electronic component to be sucked at the protruding end According to another aspect of the present invention, there is provided an electronic component mounting apparatus provided with a suction guide for holding the electronic component in a fixed suction position.

The position of the protruding end in the Z-axis direction may be a normal position in the Z-axis direction of the outer peripheral edge of the opening of the suction pad when the electronic component is not suctioned, or a position closer to the upper end than the normal position in the Z-axis direction. It may be within the range.

Further, the projecting portion of the suction guide may include three claw-like portions projecting downward.

According to the present invention, an electronic component having fine undulations on its upper surface can be reliably and stably adsorbed in a suction posture and mounted on a substrate with high accuracy.

[0018]

Embodiments of the present invention will be described below in detail with reference to the drawings.

The electronic component mounting apparatus 10 according to the embodiment of the present invention is characterized by the structure of the pad-attached electronic component suction nozzle 12 shown in FIGS.

An outline of the overall structure of the electronic component mounting apparatus 10 is as follows. The electronic component mounting apparatus 10 includes a cylindrical slide shaft 14 in the Z-axis direction in which the central axis is a vertical θ axis, and the slide shaft 14. , Which is movable in the Z-axis direction and is rotatable about the θ-axis, and XY orthogonal to the Z-axis.
An XY drive unit 18 that supports an axially movable unit, and a CCD
And an image recognition device 20 including a camera.

The pad-attached electronic component suction nozzle 12 is arranged in the Z-axis direction, is detachably supported near the lower end of the slide shaft 14, and has a center axis of θ.
Coincides with the axis. The pad-attached electronic component suction nozzle 12 can vacuum-suck an electronic component 24 at a suction pad 22 provided at a lower end portion by a negative pressure supplied through the slide shaft 14. 28 is movable.

Hereinafter, the structure of the electronic component suction nozzle 12 will be described. Since the structure of the other parts of the electronic component mounting apparatus 10 is the same as that of the related art, the description is omitted.

The electronic component suction nozzle 12 includes a cylindrical nozzle slider 30 extending in the Z-axis direction and the suction pad 22 supported near a lower end of the nozzle slider 30.
Similarly, a suction guide 32 supported near the lower end of the nozzle slider 30, a nozzle holder 34 for supporting the nozzle slider 30 slidably in the axial direction, and a buffer spring for urging the nozzle slider 30 downward. 36 and a pin 38.

The nozzle slider 30 has a stepped shaft shape near the lower end, which is thinner than the other portion, and has a stepped shape near the lower end. The lower middle portion 30a has a lower upper end portion 30b and a lower lower end portion 30c. It is thinner than it is.

On the side surface near the upper end of the nozzle slider 30, the long hole 30d in the Z-axis direction is formed.

The suction pad 22 is an elastic body made of rubber.
The nozzle slider 30 is fitted in the lower middle portion 30a and the lower upper portion 30b of the nozzle slider 30 by its own binding force in the upper stepped hole 22a.

A suction cup-shaped opening 22b is formed near the lower end of the suction pad 22 so as to open downward and open.
The lowermost opening outer peripheral edge 22c is designed to be easily bent particularly in the Z-axis direction.

The opening 22b and the stepped hole 22a
Is formed with a vent hole 22d.

The suction guide 32 is connected to the suction pad 2.
A projection 40 protruding downward outside the opening outer peripheral edge 22c in the XY axis direction, and a ring-shaped upper end fitting portion 32a formed integrally with the projection 40. The nozzle slider 30 is fitted into the upper end portion 30b of the lower end of the nozzle slider 30 at a center hole of the upper end fitting portion 32a, and is fixed with an adhesive.

The projecting portions 40 project downward, respectively.
Three claw-shaped portions 40 installed at substantially equal angular positions around the θ axis
a. Note that these claw-shaped portions 40
The distance a from the θ axis is substantially the same.

The positions of the protruding ends 40b of the claw-shaped portions 40a in the Z-axis direction correspond to the outer peripheral edges 2 of the opening of the suction pad 22.
The position 2a is substantially the same as the normal position in the Z-axis direction when the electronic component is not sucked.

The nozzle holder 34 is cylindrical and has a central hole 3
At 4a, the nozzle slider 30 is loosely fitted to the outer peripheral portion, and is detachably supported by the lower end of the slide shaft 14 at its upper end portion 34b formed in a nipple shape.

A screw hole 3 penetrating from the outer peripheral surface to the center hole is provided substantially at the center of the nozzle holder 34 in the Z-axis direction.
4c is formed, and the pin 38 is screwed into the screw hole 34c.

The pin 38 has a cylindrical pin portion 38a projecting from the center of one end surface in the axial direction of the male screw portion, and is loosely fitted in the long hole 30d of the nozzle slider 30 at the pin portion 38a.

Thus, the nozzle slider 30 is slidable with respect to the nozzle holder 34 within a certain range in the Z direction, and is not rotatable around the θ axis.

The cushioning spring 36 is a compression coil spring disposed so as to surround the nozzle slider 30 and contacts the lower end of the nozzle holder 34 at the upper end and the upper end of the suction guide 32 at the lower end. It is mounted in a state where it is compressed more than its length, and urges the nozzle slider 30 downward.

Next, the operation of the electronic component mounting apparatus 10 according to this embodiment when mounting electronic components will be described.

In the electronic component supply device 26, when the electronic component 24 is vacuum-sucked, the head unit 16 and the XY drive unit 18 are driven to cause the electronic component suction nozzle 12 with the pad to supply the electronic component. After being moved above the electronic component 24 on the device 26, it is lowered, and the suction pad 22 and the suction guide 32 are brought into contact with the upper surface of the electronic component 24 while the suction pad 22 is moved through the slide shaft 14. A negative pressure is supplied to the opening 22c to vacuum-suction the electronic component 24.

Since the suction pad 22 is an elastic body made of rubber, the outer peripheral edge 22c of the opening portion is elastically deformed following the fine undulation on the upper surface of the electronic component 24,
It is in close contact with the upper surface of the electronic component 24.

Further, when a negative pressure is supplied into the opening 22b of the suction pad 22, the outer peripheral edge 22 of the opening is formed.
c is pressed against the upper surface of the electronic component 24 under the atmospheric pressure, and further strongly adheres to the upper surface of the electronic component 24.

Thus, the electronic component 24 having fine undulations on the upper surface can be reliably sucked.

At this time, the suction pad 22 and the suction guide 32, together with the nozzle slider 30, retract against the urging force of the buffer spring 36, and absorb mounting errors and the like of the electronic component supply device 26. , The electronic component 2
4 is not damaged.

After the electronic component 24 has been vacuum-sucked, the head 16 is driven to drive the electronic-device-adsorbing nozzle 12 with the pad.
Is raised, the electronic component 24 is also raised together with the electronic component suction nozzle 12.

The electronic component 24, the suction pad 22, and the suction guide 32 are urged by the buffer spring 36 together with the nozzle slider 30 to protrude, and are held at the lower limit position.

Since the suction pad 22 is an elastic body made of rubber, the suction pad 22 is capable of upwardly sucking the sucked electronic component 24 while flexing itself, but the upper end of the electronic component 24 has a protrusion 40 of the suction guide 32. Therefore, the electronic component 24 is held in a fixed suction posture with respect to the pad-attached electronic component suction nozzle 12.

The protruding portion 40 has three claw-shaped portions 40a installed at substantially equal angular positions around the θ axis, and supports the electronic component 24 at three places. Is held in a fixed suction posture with respect to the pad-attached electronic component suction nozzle 12 in a mechanically static state, and is stabilized.

Further, the protruding portion 40 is provided on the suction pad 2.
2 is disposed outside the outer peripheral edge 22c of the opening in the XY axis direction. The distance between the claw-shaped portions 40a, that is, the electronic component 2
4, the distance between the support points becomes longer, and
Is stable.

Next, in order to detect a suction error of the electronic component 24 with respect to the pad-attached electronic component suction nozzle 12 (error with respect to a normal suction posture in design), the XY drive section 18 is driven to drive the electronic component 24. The electronic component 24 is moved to a position above the image recognition device 20.

Even during this movement, since the electronic component 24 is supported by the suction guide 32,
Although the electronic component 24 is a rubber elastic body,
Does not vibrate while flexing the suction pad 22,
The suction attitude is kept constant.

Thus, the image recognition device 20 can accurately detect the suction error.

Next, the head part 16 and the XY drive part 18 are driven to move the electronic component 24 above a predetermined mounting position of the board 28 while correcting the detected suction error. Then, the electronic component 24 is lowered to contact the electronic component 24 on the substrate 28.

Since the suction error has been accurately detected, the electronic component 24 reliably comes into contact with a predetermined mounting position on the substrate 28 by accurate correction.

At this time, since the suction pad 22 and the suction guide 32 are retracted together with the nozzle slider 30 to absorb a manufacturing error in the Z-axis direction of the substrate, the electronic component 24 is not damaged. Substrate 28
Abut on top.

Next, the electronic component suction nozzle with pad 1
When the supply of the negative pressure to the pad 2 is stopped and a slight positive pressure is supplied to drive the head unit 16 to raise the electronic component suction nozzle 12 with the pad, the electronic component suction nozzle 12 with the pad The electronic component 24 is released and placed on the substrate 28. Thereafter, the electronic component mounting operation is repeated in the same manner.

In the example of the present embodiment, the position of the protruding end 40b of the protruding portion 40 in the Z direction is determined by the Z axis direction of the opening outer peripheral edge 22c of the suction pad 22 when the electronic component is not suctioned. Although the position is substantially the same as the normal position, the present invention is not limited to this, and the position of the protruding end 40b in the Z-axis direction is the outer peripheral edge 2 of the opening.
What is necessary is just to be in the range of flexibility in the Z direction of 2c.

Here, the flexible range means a range in which the outer peripheral edge 22c of the opening of the suction pad 22 can be bent by supplying a negative pressure to the opening 22b as described below.

For example, the position of the protruding end 40b in the Z-axis direction is within the flexible range of the opening outer peripheral edge 22a in the Z-direction and is higher than the normal position in the Z-axis direction (the base of the nozzle holder 34). When the electronic component 24 is sucked by the electronic component supply device 26 when the suction pad 22 and the suction guide 32 are lowered from above the electronic component 24, the suction is performed first. The pad 22 contacts the upper surface of the electronic component 24, and the suction guide 32 further descends while bending the suction pad 22, and contacts the upper surface of the electronic component 24.

When a negative pressure is supplied into the opening of the suction pad 22 in this state, the electronic component 24 is urged upward by the suction force, and the suction force is applied against the repelling force of the bent suction pad 22. The suction posture is stabilized by contacting the guide 32.

On the other hand, when the position of the protruding end 40b in the Z-axis direction is within the flexible range of the opening outer peripheral edge 22c in the Z-axis direction and below the normal position in the Z-axis direction, In the electronic component supply device 26, the electronic component 2
4, when the suction pad 22 and the suction guide 32 are lowered from above the electronic component 24,
First, the suction guide 32 comes into contact with the upper surface of the electronic component 24, and the suction pad is held at a position slightly above the electronic component 24.

In this state, the opening 2 of the suction pad 22 is
When a negative pressure is supplied to the inside of the electronic component 2b, the vicinity of the outer peripheral edge 22c of the opening of the suction pad 22 abuts on and adheres to the upper surface of the electronic component 24 while bending downward due to atmospheric pressure from above.

As a result, the electronic component 24 is sucked by the suction pad 22, and is supported by the suction guide 32 from above while being urged upward by the suction force.
Suction posture is stabilized.

That is, if the position of the protruding end 40b in the Z-axis direction is within the flexible range in the Z-axis direction of the opening outer peripheral edge 22c, the position can be either above or below the normal position in the Z-axis direction. Even if the electronic component 24 is located, the electronic component 24 is sucked by the suction pad 22 and is supported in contact with the suction guide 32 to stabilize the suction posture.

In order to ensure that the suction pad 22 is in close contact with the upper surface of the electronic component 24, the projecting end 4
0b in the Z direction is the Z of the opening outer peripheral edge 22c.
It is desirable to be at the normal position in the direction or higher than the normal position in the Z direction.

In the embodiment of the present invention, the projecting portion 40 of the suction guide 32 has three claw-shaped portions 40a.
However, the present invention is not limited to this. When the unevenness of the fine undulations on the upper surface of the electronic component to be attracted is relatively small, the protrusion composed of four or more claws is provided. It may be a part, and further, for example, a continuous protruding part such as a cylindrical shape.

Furthermore, in the example of the present embodiment, the three claw-shaped portions 40a are installed at substantially equal angular positions around the θ axis, but the present invention is not limited to this. The claw-shaped portion 40a may be installed at a non-equiangular position about the θ axis as long as the electronic component sucked by the suction pad 22 can be held in a fixed posture.

Similarly, the claw-shaped members 40a may be arranged so that the distance between the claw-shaped portions 40a and the θ axis is different within a range in which the suction posture can be kept constant.

Further, the protrusion 40 of the suction guide 32
A material having a high coefficient of friction such as rubber may be attached to the protruding end 40b. By doing so, the effect of preventing the sucked electronic component from being displaced in the XY axis direction with respect to the protruding end 40b can be enhanced.

[0068]

According to the present invention, an electronic component having fine undulations on its upper surface can be reliably and stably sucked in a suction posture, and the electronic component can be mounted on a substrate with high accuracy. The excellent effect is brought about.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a main structure of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is an enlarged sectional view showing a structure of a pad-attached electronic component suction nozzle in the electronic component mounting apparatus.

FIG. 3 is a sectional view showing the structure around the suction pad in FIG. 2 in a further enlarged manner;

FIG. 4 is a perspective view showing a further enlarged structure around a suction pad in FIG. 2;

FIG. 5 is a perspective view showing the shape of a transformer (electronic component).

FIG. 6 is a sectional view showing a structure of a conventional electronic component suction nozzle with pad.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Electronic component mounting apparatus 12, 102 ... Electronic component suction nozzle with a pad 22, 100 ... Suction pad 22c ... Opening outer peripheral edge 32 ... Suction guide 40 ... Projection part 40a ... Claw-shaped part 40b ... Projection end

Claims (3)

[Claims] 1. A θ axis, which is a central axis, is disposed in a vertical Z-axis direction, a suction pad is provided at a lower end portion, and an outer peripheral edge of an opening portion of the suction pad is brought into close contact with an electronic component from an upper end side. An electronic component suction nozzle with a pad capable of vacuum suction of the electronic component by the supplied negative pressure, movable in the Z-axis and the X-axis direction and the Y-axis direction orthogonal thereto, and rotatable around the θ-axis. An electronic component mounting apparatus for mounting the sucked electronic component on a substrate, comprising: a protruding portion that protrudes downward outside the outer peripheral edge of the opening of the suction pad in the XY axis direction. The position of the protruding end of the protruding portion in the Z-axis direction is within the flexible range in the Z-axis direction of the outer peripheral edge of the opening of the suction pad, and abuts on the electronic component to be suctioned at the protruding end. Keeping electronic components in a fixed suction position Electronic component mounting apparatus characterized by destination guide is provided. 2. The Z-axis normal position of the protruding end in the Z-axis direction at the outer peripheral edge of the opening of the suction pad when the electronic component is not suctioned. An electronic component mounting device, wherein the electronic component mounting device is set within a range closer to the upper end portion. 3. An electronic component mounting apparatus according to claim 1, wherein said projecting portion of said suction guide comprises three claw portions projecting downward.