JP2002283265A - Electronic part sucking nozzle and electronic part mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic part sucking nozzle for surely mounting a chip type part of the microscopic size as an object, and an electronic part mounting device attached with this sucking nozzle. SOLUTION: This sucking nozzle 10 of an electronic part P vacuum-sucks the chip type electronic part P having an upper surface of an almost partial cylindrical curved surface to a lower end part. A side cross-sectional shape of an optional position formed in the lower end part of a sucking part 12 provided with a sucking hole 12a for sucking the electronic part P by abutting to the electronic part P, and orthogonal to the specific one direction in parallel to the nozzle axis of an abutting opening part 12b opening the sucking hole 12a, and abutting to an upper surface of the electronic part P, is set in an almost circular arc shape of copying after a curved surface shape of the upper surface A of the electronic part P. Thus, the chip type electronic part P can be stably held without causing positional dislocation and a sucking error.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component suction nozzle for sucking an electronic component, and an electronic component mounting apparatus equipped with the suction nozzle.

[0002]

2. Description of the Related Art As a handling method such as transfer of electronic parts, a method using vacuum suction is widely used.
In this method, a suction nozzle provided with a suction hole is brought into contact with an electronic component, and the electronic component is suctioned by utilizing a negative pressure generated by vacuum suction of the suction hole. Since the suction nozzle used here is used in direct contact with the electronic component, various types are used according to the shape and size of the target electronic component.

In recent years, with the miniaturization of electronic devices, the size of electronic components has been miniaturized, and microchips having side dimensions of less than 1 mm have been used for rectangular chip-type components. ing. As a suction nozzle for such a small chip, a small-diameter nozzle whose lower end is smaller than a side dimension is used so that the upper surface of the chip-type component can be suctioned.

[0004]

However, when the above-mentioned microchip is held by vacuum suction, there are the following problems. This will be described below with reference to the drawings.
FIG. 4A is a perspective view of a microchip, and FIG. 4B is an explanatory diagram of a state in which a microchip is sucked and held by a conventional suction nozzle. As shown in FIG. 4A, the upper surface A of the chip component P having a small size is not necessarily a flat surface, but often has a convex curved surface. When the chip-shaped component P having such a convex curved surface is sucked by the small-diameter nozzle B, the lower end of the small-diameter nozzle B does not contact the upper surface A with good adhesion. For this reason, when vacuum suction is performed from the suction hole C, a vacuum leak occurs and a suction error occurs, or a slip occurs between the suction nozzle B and the upper surface A of the chip-type component P, and stable suction holding cannot be performed.
There were inconveniences such as a shift in the mounting position.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component suction nozzle capable of reliably mounting a chip-type component having a small size, and an electronic component mounting apparatus equipped with the suction nozzle.

[0006]

According to a first aspect of the present invention, the suction nozzle for an electronic component is mounted on a mounting head of an electronic component mounting apparatus, and the upper surface thereof is substantially partially removed by vacuum suction from a suction hole communicating with the mounting head. A suction nozzle of an electronic component that vacuum-adsorbs a chip-shaped electronic component having a cylindrical curved surface at a lower end portion, wherein the main body portion is mounted on the mounting head and provided with the suction hole, and is in contact with the electronic component. A suction portion provided with a suction hole for sucking the electronic component; and a contact opening formed at a lower end portion of the suction portion, the suction hole being opened and contacting the upper surface of the electronic component. The side cross-sectional shape of the opening at an arbitrary position parallel to the nozzle axis and orthogonal to the specific direction is a substantially arc shape following the curved shape of the upper surface of the electronic component.

According to a second aspect of the present invention, there is provided an electronic component mounting apparatus for holding a chip-type electronic component by vacuum suction and mounting the chip type electronic component on a substrate. A nozzle, a mounting head to which the suction nozzle is mounted, a moving unit for moving the mounting head between a supply unit of an electronic component and the substrate, and a vacuum suction unit for performing vacuum suction from the suction nozzle via the mounting head Wherein the suction nozzle is a suction nozzle for an electronic component according to claim 1.

According to the present invention, the contact opening formed at the lower end of the suction portion and in contact with the upper surface of the electronic component has a side cross-sectional shape at an arbitrary position parallel to the nozzle axis and orthogonal to one specific direction. The chip-shaped electronic component can be stably held by being formed in a substantially arc shape following the curved shape of the upper surface of the component.

[0009]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to one embodiment of the present invention, FIG. 2 is a partial cross-sectional view of a mounting head of the electronic component mounting apparatus according to one embodiment of the present invention, and FIG. It is a fragmentary sectional view of the suction nozzle of the electronic component of the form.

First, an electronic component mounting apparatus in which an electronic component suction nozzle is used will be described with reference to FIG. Figure 1
, Two Y-axis tables 2 are provided at both ends of the base 1.
A and 2B are arranged side by side, and an X-axis table 3 is installed on the Y-axis tables 2A and 2B. A moving block 4 is mounted on the X-axis table 3, and the moving block 4 includes a camera 5 and a mounting head 6. A suction nozzle 10 for the electronic component P is mounted on the mounting head 6.

The moving block 4 includes Y-axis tables 2A and 2B.
Then, the electronic component is moved in the horizontal direction by the X-axis table 3 and the electronic components are vacuum-adsorbed and picked up by the mounting head 6 from the tape feeder 8 provided in the supply unit 7, and the substrate 9 is picked up.
Mount on top. The camera 5 recognizes the recognition mark on the substrate 9, and based on the recognition result, corrects the position of the moving block 4 when the electronic component is mounted. The Y-axis tables 2A and 2B and the X-axis table 3 are moving means for moving the mounting head 6 between the electronic component supply unit 7 and the substrate 9.

Next, the suction nozzle 10 of the electronic component P mounted on the mounting head 6 will be described with reference to FIG. The suction nozzle 10 is used for sucking and holding a chip-type electronic component (see an electronic component P shown in FIG. 3B) whose upper surface is a curved surface having a substantially partial cylindrical shape.
The suction nozzle 10 includes a main body 11 and a shaft-shaped suction portion 12 extending downward from the main body 11. Main body 11
Is formed in a tapered portion 11a having a conical shape. The suction nozzle 10 is detachably mounted on the mounting head 6 by inserting the tapered portion 11a into a mounting portion 6a provided on the mounting head 6.

A suction hole 11b is formed inside the tapered portion 11a. When the tapered portion 11a is mounted on the mounting portion 6a, the suction hole 11b is connected to the vacuum suction means 14 connected via the mounting portion 6a. Communicate. The suction hole 11b communicates with a suction hole 12a provided to penetrate to the lower end inside the suction portion 12. Attach suction nozzle 10 to mounting head 6
By driving the vacuum suction means 14 in the state of being attached to the, vacuum suction is performed from the suction holes 12a.

The suction portion 12 has a lower portion tapered and narrowed to a small diameter, and a lower end portion is a contact opening portion 12b in which a suction hole 12a is opened to contact the electronic component P.
By driving the vacuum suction means 14 with the contact opening 12b in contact with the upper surface of the electronic component P, the electronic component P
Is held by the suction nozzle 10. The lower surface of the circular flange 13 provided above the suction unit 12 is a reflecting plate that reflects illumination light emitted from a light source when the electronic component is recognized. To illuminate from above.

Next, referring to FIG. 3, the detailed shape of the contact opening 12b formed at the lower end of the suction section 12 will be described. As shown in FIG. 3A, the side cross-sectional shape at any position parallel to the nozzle axis (straight line a) of the contact opening 12b and orthogonal to one specific direction (perpendicular to the paper surface) is the curvature R. It has an arc shape. The detailed shape such as the curvature of the arc is determined according to the curved shape of the upper surface of the electronic component P to be suctioned. This curved surface shape may be an approximate arc shape (substantially arc shape) slightly deviating from the strict arc shape.

Therefore, the specific one direction is determined by the electronic component P
Of the electronic component P in accordance with the side direction of the electronic component P.
3B, the contact opening 12b follows the curved shape of the upper surface A of the electronic component P as shown in FIG.
Thus, there is no problem such that only the top of the convex upper surface such as the partial cylindrical shape contacts the contact opening 12b to cause a positional shift or an unstable posture during suction. Therefore, it is possible to prevent a displacement and a suction error which occur when the conventional suction nozzle is used, and to perform a reliable mounting.

[0017]

According to the present invention, the side cross-sectional shape at any position parallel to the nozzle axis of the contact opening formed at the lower end portion of the suction portion and in contact with the upper surface of the electronic component and orthogonal to the specific one direction, Since it has a substantially arc shape following the curved shape of the upper surface of the electronic component, it is possible to stably hold the chip-type electronic component, to prevent displacement and suction error, and to secure stable mounting. .

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a partial sectional view of a mounting head of the electronic component mounting apparatus according to one embodiment of the present invention;

FIG. 3 is a partial sectional view of a suction nozzle of the electronic component according to the embodiment of the present invention;

FIG. 4A is a perspective view of a microchip, and FIG. 4B is an explanatory view of a state in which a microchip is suction-held by a conventional suction nozzle.

[Explanation of symbols]

 Reference Signs List 6 Mounting head 10 Suction nozzle 11 Main body 11b Suction hole 12 Suction unit 12a Suction hole 12b Contact opening P Electronic component

Continued on the front page F term (reference) 3C007 AS08 CY03 DS01 FS01 FT08 FT10 MT04 NS08 NS17 5E313 AA03 AA11 CC03 EE24 FF24 FF28

Claims (2)

[Claims] 1. A chip type electronic component having an upper surface having a substantially cylindrical shape is vacuumed to a lower end by vacuum suction through a suction hole which is mounted on a mounting head of an electronic component mounting apparatus and communicates with the mounting head. A suction nozzle of an electronic component to be sucked, wherein the main body portion is mounted on the mounting head and provided with the suction hole, and a suction portion provided with a suction hole for contacting the electronic component and sucking the electronic component; A contact opening formed at a lower end portion of the suction portion, wherein the suction hole is open and is in contact with an upper surface of the electronic component; and an arbitrary position parallel to the nozzle axis of the contact opening and orthogonal to a specific direction. The suction nozzle of an electronic component according to claim 1, wherein the side cross-sectional shape is substantially arc-shaped following the curved shape of the upper surface of the electronic component. 2. An electronic component mounting apparatus for mounting a chip-type electronic component on a substrate while holding the electronic component by vacuum suction, comprising: a suction nozzle that abuts on an upper surface of the electronic component and vacuum-adsorbs; A mounting head, a moving unit for moving the mounting head between the electronic component supply unit and the substrate, and a vacuum suction unit for performing vacuum suction from a suction nozzle via the mounting head, wherein the suction nozzle includes: Claim 1
An electronic component mounting apparatus characterized in that the electronic component mounting nozzle is a suction nozzle for the electronic component described in the above.